Heat dissipation structure of power devices

Abstract

The present invention discloses a heat dissipation structure for power devices, comprising a circuit board on which the power devices are mounted, an insulating bracket fixed to the circuit board, and a heat sink fixed to the insulating bracket. The circuit board is provided with through holes, and the insulating bracket has a row of auxiliary columns positioned in the through holes in the middle. The auxiliary columns are provided with slots on the side facing the circuit board on which the power devices are mounted, for accommodating the power devices in a collapsed manner. The auxiliary columns have through holes in the middle. After the power devices are inserted into the slots, the heat sink is placed above the insulating bracket, abutting against the surface of the power devices, and fixed to the insulating bracket with screws through the through holes. The present invention has the advantages of easy installation and foolproof assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of power electronics, and in particular to a heat dissipation structure of a power device which is easy to install and fool-proof to assemble. Background Art

[0002] The output power of power devices (such as IGBTs) used in various motor controllers is also constantly increasing, which puts higher requirements on the heat dissipation, voltage resistance, installation and other issues of power devices. In the existing technology, most of them use the form of a pressure strip to press one or two or even more power devices (such as IGBTs) onto the radiator. The metal bottom of the power device and the radiator are generally padded with insulating thermal conductive paper to meet the voltage resistance requirements. The pressure strip is generally made of insulating plastic material through mold pressing. It has a complex structure and high production cost. If too much force is used when fixing with screws, it is easy to cause the pressure strip to break, affecting the press-fitting effect. On the other hand, due to the low assembly technology of the component surface processing accuracy, some power devices cannot fully contact the radiator after installation, which will affect the heat dissipation effect and thus affect the product function. Summary of the Invention

[0003] The present invention aims to provide a heat dissipation structure for power devices which is easy to install and foolproof to assemble.

[0004] The present invention is achieved through the following technical measures: a heat dissipation structure for a power device, comprising a circuit board on which the power device is mounted, an insulating bracket fixed on the circuit board, and a radiator fixed on the insulating bracket, wherein the circuit board is provided with a through hole, and a row of auxiliary columns are arranged in the through hole in the middle of the insulating bracket, and a card slot for lying down and accommodating the power device is provided on the side of the auxiliary column facing the circuit board on which the power device is mounted, and the auxiliary column has a through hole in the middle. After the power device is inserted into the card slot, the radiator is placed above the insulating bracket, against the surface of the power device, and fixed to the insulating bracket through the through hole with screws.

[0005] As a preferred embodiment, a sensor space for accommodating a sensor on a circuit board is provided on a side or corner of the insulating bracket, and the sensor is placed in the sensor space so as to be tightly against the heat sink.

[0006] As a preferred embodiment, at least one pair of upper edges of the insulating bracket extend outwards to form a waterproof edge.

[0007] As a preferred embodiment, the insulating bracket is a plastic bracket.

[0008] As a preferred embodiment, a fixing column capable of being embedded in the center hole of the power device is provided in the middle of the slot.

[0009] As a preferred embodiment, an inverted hook is extended from the middle of the sensor space.

[0010] As a preferred embodiment, two slots for lying down and accommodating the power devices are symmetrically provided on a side of the auxiliary column facing the circuit board on which the power devices are mounted.

[0011] The present invention adds an insulating bracket and fixes the insulating bracket to the circuit board. The back of the auxiliary column of the insulating bracket is exposed through the through hole of the circuit board. After the power device is inserted into the slot, the heat sink is pressed against the insulating bracket so that the surface of the power device and the heat sink are abutted. The heat sink is fixed to the insulating bracket through the through hole with screws. This structure ensures that the surface of the power device on each auxiliary column can be fully attached to the heat sink surface even if there are slight differences in the thickness of the power device or the surface of the heat sink is not very flat. The present invention can ensure sufficient contact between the power device and the heat sink even if the product processing precision is not high and the assembly skills are not high, effectively achieving the effect of anti-assembly and improving the performance of the crystal. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 Schematic diagram of the structure of the insulating bracket according to an embodiment of the present invention.

[0013] Figure 2 This is a structural schematic diagram of an insulating bracket installed on a circuit board according to an embodiment of the present invention.

[0014] Figure 3 for Figure 2 A partial enlarged view in .

[0015] Figure 4 This is a schematic diagram of the structure of the embodiment of the present invention after installation. DETAILED DESCRIPTION

[0016] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings.

[0017] A heat dissipation structure of a power device, reference Figures 1 to 4 , including a circuit board 200 on which a power device 201 is mounted, an insulating bracket 100 fixed on the circuit board 200, and a heat sink 300 fixed on the insulating bracket 100, wherein the circuit board 100 is provided with a through hole, and a row of auxiliary columns 102 are arranged in the middle of the insulating bracket 100 in the through hole, and a card slot 103 for lying down and accommodating the power device 201 is provided on the side of the auxiliary column 102 facing the circuit board 200 on which the power device 201 is mounted, and the auxiliary column 102 has a through hole 101 in the middle. After the power device 201 is inserted into the card slot 103, the heat sink 300 is placed above the insulating bracket 100 and abuts against the surface of the power device 201, and the heat sink 300 is fixed to the insulating bracket 100 with screws through the through hole 101.

[0018] This heat dissipation structure is achieved by adding an insulating bracket 100 and fixing the insulating bracket 100 to the circuit board 200. The back of the auxiliary column 102 of the insulating bracket 100 is exposed through the through hole of the circuit board 200. After the power device 201 is inserted into the slot 103, the heat sink 300 is pressed against the insulating bracket 100, so that the surface of the power device 201 is against the heat sink 300. The heat sink 300 is fixed to the insulating bracket 100 through the through hole 101 with screws. Even if there is a slight difference in the thickness of the power device 201 or the surface of the heat sink 300 is not very flat, the screws are used to ensure that the surface of the power device 201 on each auxiliary column 102 is fully attached to the surface of the heat sink 300. This heat dissipation structure can ensure sufficient contact between the power device 201 and the heat sink even when the product processing precision and assembly skills are not high. It effectively achieves the effect of fool-proofing the assembly and improves the performance of the crystal.

[0019] The heat dissipation structure of the power device of the present invention is as follows: Figures 1 to 3 On the basis of the previous technical solution, specifically, a sensor space 106 for accommodating the sensor 202 on the circuit board 100 is provided on the side or corner of the insulating bracket 100. The sensor 202 is placed in the sensor space 106 and can be tightly abutted against the radiator 300, ensuring sufficient contact between the sensor 202 and the radiator 300, thereby sampling the correct temperature data of the radiator 300 into the control unit for functional control.

[0020] The heat dissipation structure of the power device of the present invention is as follows: Figures 1 to 4 Based on the above technical solution, at least one pair of upper edges of the insulating bracket 100 extend outward to form a waterproof edge 105. The outward-extending double "7"-shaped waterproof edge 105, combined with the principle that flowing liquid flows to lower places under gravity and does not turn without external force, can effectively prevent water flowing from the radiator 300 from contacting the circuit board 100, thereby achieving effective waterproofing even without using a sealing ring.

[0021] The heat dissipation structure of the power device of the present invention is as follows: Figures 1 to 4 Specifically, based on the previous technical solution, the insulating bracket 100 is a plastic bracket.

[0022] The heat dissipation structure of the power device of the present invention is as follows: Figures 1 to 4 On the basis of the above technical solution, a fixing column 104 is provided in the middle of the slot 103 and can be embedded in the center hole of the power device 201, so that the power device 201 can be accurately positioned and firmly fixed.

[0023] The heat dissipation structure of the power device of the present invention is as follows: Figures 1 to 3Specifically, based on the previous technical solution, an inverted hook 107 is extended from the middle of the sensor space 106, so that the sensor 202 can be accurately positioned and firmly fixed.

[0024] The heat dissipation structure of the power device of the present invention is as follows: Figures 1 to 3 On the basis of the previous technical solution, specifically, two slots 103 for accommodating the power devices 201 are symmetrically provided on one side of the auxiliary column 102 facing the circuit board 200 on which the power devices 201 are installed, so that two power devices 201 can be fixed by one screw, reducing the workload of manual assembly.

[0025] The above is an explanation of the heat dissipation structure of the power device of the present invention to help understand the present invention, but the implementation of the present invention is not limited to the above embodiments. Any changes, modifications, substitutions, combinations, and simplifications made without departing from the principles of the present invention should be considered equivalent replacement methods and are included in the scope of protection of the present invention.

Claims

1. A heat dissipation structure for a power device, characterized in that: The invention comprises a circuit board on which a power device is mounted, an insulating bracket fixed to the circuit board, and a heat sink fixed to the insulating bracket. The circuit board is provided with a through hole. A row of auxiliary columns are arranged in the middle of the insulating bracket and are placed in the through hole. A side of the auxiliary columns facing the circuit board on which the power device is mounted is provided with a slot for lying down and accommodating the power device. A through hole is provided in the middle of the auxiliary columns. After the power device is inserted into the slot, the heat sink is placed above the insulating bracket, abutting against the surface of the power device, and fixed to the insulating bracket with screws through the through hole. A sensor space for accommodating a sensor on a circuit board is provided on a side or corner of the insulating bracket, and the sensor is placed in the sensor space so as to be closely against the radiator; At least one pair of upper edges of the insulating bracket extend outwards to form a waterproof edge; A side of the auxiliary column facing the circuit board on which the power device is mounted is symmetrically provided with a card slot for lying down and accommodating the power device.

2. The heat dissipation structure of a power device according to claim 1, characterized in that: The insulating bracket is a plastic bracket.

3. The heat dissipation structure of a power device according to claim 1, characterized in that: A fixing column capable of being embedded in the center hole of the power device is provided in the middle of the slot.

4. The heat dissipation structure of a power device according to claim 1, characterized in that: An inverted hook is extended from the middle of the sensor space.

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