Electronic product assembly mechanism

By designing an electronic product assembly mechanism including frame, circulation mechanism, labeling, light guide column and hot melt mechanism, the problem of low manual or tool assembly efficiency in the prior art is solved, fully automated electronic product assembly is realized, and the improvement of Processing efficiency and production stability.

CN108466054BActive Publication Date: 2025-01-03XIAMEN INTRETECH +1
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Patent Information

Application Number
CN201810525586.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2018-05-28
Publication Date
2025-01-03
Estimated Expiration
2038-05-28

AI Technical Summary

Technical Problem

The assembly of existing electronic products mainly relies on manual or tooling, resulting in low production capacity and unstable, making it difficult to achieve efficient automated assembly.

Method used

An electronic product assembly mechanism is designed, including a frame, a circulation mechanism, a labeling mechanism, a light guide column mechanism and a hot melt mechanism. The transmission parts of the circulation mechanism pass through the labeling, a light guide column and a hot melt mechanism in turn to realize fully automatic bubbles. Cotton patching, light guide column installation and hot melt processing.

Benefits of technology

It improves the processing efficiency of electronic products, realizes a fully automated assembly process, and improves production stability and production capacity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides an electronic product assembly mechanism, which relates to the field of mechanical processing. The electronic product assembly mechanism includes a frame, a circulation mechanism, a labeling mechanism, a light guide column mechanism and a hot melt mechanism. The circulation mechanism is arranged on the frame, and the labeling mechanism, the light guide column mechanism and the hot melt mechanism are sequentially arranged around the circulation mechanism; the circulation mechanism is used to transmit the first component and the second component to pass through the labeling mechanism, the light guide column mechanism and the hot melt mechanism in sequence; the labeling mechanism is used to paste foam on the first component; the light guide column mechanism is used to install the light guide column on the first component; the hot melt mechanism is used to hot melt the first component and the second component. In the present invention, the labeling mechanism, the light guide column mechanism and the hot melt mechanism process the first component or the second component in sequence, and finally process them into electronic products. The processing is carried out in a fully automatic manner, which improves the processing efficiency of electronic products.
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Description

Technical Field

[0001] The invention relates to the field of mechanical processing, and in particular to an electronic product assembly mechanism. Background Art

[0002] Most factories assemble electronic products manually or with the help of tooling, which results in low and unstable production capacity. Summary of the invention

[0003] The object of the present invention is to provide an electronic product assembly mechanism, which can improve the processing efficiency of electronic products.

[0004] The present invention provides a technical solution:

[0005] An electronic product assembly mechanism, the electronic product comprises a first component and a second component, the electronic product assembly mechanism comprises a frame, a circulation mechanism, a labeling mechanism, a light guide column mechanism and a hot melt mechanism, the circulation mechanism is arranged on the frame, the labeling mechanism, the light guide column mechanism and the hot melt mechanism are sequentially arranged around the circulation mechanism;

[0006] The circulation mechanism is used to convey the first component and the second component to sequentially pass through the labeling mechanism, the light guide mechanism, the patch mechanism and the hot melt mechanism;

[0007] The labeling mechanism is used to stick foam to the first component;

[0008] The light guide mechanism is used to install a light guide on the first component;

[0009] The hot melt mechanism is used for hot melting the first component and the second component.

[0010] Furthermore, in a preferred embodiment of the present invention, the labeling mechanism includes a labeling mechanism and a label pressing mechanism, and both the labeling mechanism and the label pressing mechanism are connected to the frame;

[0011] The bidding mechanism is used to bid the foam;

[0012] The label pressing mechanism is used to press the foam onto the first component.

[0013] Further, in a preferred embodiment of the present invention, the bid issuing mechanism comprises a main panel, a coiling assembly, a tensioning assembly and a bid issuing assembly, and the coiling assembly, the tensioning assembly and the bid issuing assembly are sequentially arranged on the main panel;

[0014] The coil assembly is used to fix the tape, wherein the foam is attached to the tape;

[0015] The tensioning assembly is used to tension the belt material;

[0016] The label removing assembly is used to tear off the foam on the belt when the belt rotates relative to the tensioning assembly.

[0017] Further, in a preferred embodiment of the present invention, the coil assembly includes a first coil and a second coil, and the first coil and the second coil are both connected to the main panel;

[0018] The first coil is used to fix the strip of material with the foam attached;

[0019] The second coil is used to fix the strip without the foam.

[0020] Furthermore, in a preferred embodiment of the present invention, the label issuing mechanism further includes a fixing component, which is connected to the main panel and is disposed between the coiling component and the label issuing component, and is used to selectively fix or release the strip.

[0021] Further, in a preferred embodiment of the present invention, the hot melt mechanism includes a base, a hot melt component and a cooling component, and the hot melt component is arranged on the base;

[0022] The hot melt assembly is used for hot melting the first component and the second component to form the electronic product;

[0023] The cooling component is connected to the hot melt component and is used to cool the hot melt component so that the electronic product and the hot melt component can be quickly separated.

[0024] Further, in a preferred embodiment of the present invention, the hot melt assembly includes a plurality of hot melt components, and the plurality of hot melt components are sequentially arranged on the base;

[0025] The hot melt component includes a hot melt head and a fixing block, the fixing block is connected to the base, the hot melt head is connected to the fixing block, and the hot melt head is used to hot melt the first component and the second component to form the electronic product.

[0026] Further, in a preferred embodiment of the present invention, the light guide column mechanism comprises a mounting plate, a first driving member and a mounting member, the mounting plate is connected to the frame, and the first driving member is arranged on the mounting plate;

[0027] The first driving member is used to drive the mounting member to move relative to the mounting plate;

[0028] The mounting member is used for mounting the light guide column.

[0029] Furthermore, in a preferred embodiment of the present invention, the electronic product assembly mechanism further includes a material unloading mechanism, the material unloading mechanism is disposed on the frame, and the material unloading mechanism is used to unload the electronic product.

[0030] Further, in a preferred embodiment of the present invention, the unloading mechanism comprises a support member, a second driving member and an unloading member, the support member is connected to the frame, and the second driving member is connected to the frame;

[0031] The second driving member is connected to the blanking member and is used to drive the blanking member to move in a direction perpendicular to the extension direction of the frame;

[0032] The unloading piece is used to receive the electronic product and transport the electronic product away from the rack.

[0033] The beneficial effects of the electronic product assembly mechanism provided by the present invention are: in the present invention, the electronic product assembly mechanism includes a frame, a circulation mechanism, a labeling mechanism, a light guide column mechanism and a hot melt mechanism, the circulation mechanism is arranged on the frame, the labeling mechanism, the light guide column mechanism and the hot melt mechanism are sequentially arranged around the circulation mechanism; the circulation mechanism is used to convey the first component and the second component through the labeling mechanism, the light guide column mechanism and the hot melt mechanism in sequence; the labeling mechanism is used to stick foam to the first component; the light guide column mechanism is used to install the light guide column on the first component; the hot melt mechanism is used to hot melt the first component and the second component.

[0034] In the present invention, the first component and the second component are placed on the circulation mechanism at the same time, the labeling mechanism first pastes foam on the first component, then the light guide column is installed on the first component, and finally the hot melt mechanism hot melts the first component and the second component together to form an electronic product. In the present invention, the labeling mechanism, the light guide column mechanism and the hot melt mechanism process the first component or the second component in turn, and finally process it into an electronic product, which is processed in a fully automatic manner, thereby improving the processing efficiency of the electronic product. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 A schematic diagram of the structure of an electronic product assembly mechanism provided by an embodiment of the present invention.

[0037] Figure 2 A structural schematic diagram of a labeling mechanism of an electronic product assembly mechanism provided by an embodiment of the present invention.

[0038] Figure 3 A schematic structural diagram of a fixing component of a labeling mechanism of a labeling mechanism of an electronic product assembly mechanism provided by an embodiment of the present invention.

[0039] Figure 4 A schematic structural diagram of a light guide column mechanism of an electronic product assembly mechanism provided by an embodiment of the present invention.

[0040] Figure 5 A schematic structural diagram of a hot melt mechanism of an electronic product assembly mechanism provided in an embodiment of the present invention.

[0041] Figure 6 A structural schematic diagram of a material unloading mechanism of an electronic product assembly mechanism provided by an embodiment of the present invention.

[0042] Icons: 10-electronic product assembly mechanism; 100-frame; 200-circulation mechanism; 300-labeling mechanism; 310-labeling mechanism; 312-main panel; 314-roll assembly; 3142-first roll piece; 3144-second roll piece; 316-tensioning assembly; 3162-tensioning shaft; 318-labeling assembly; 319-fixing assembly; 3192-base plate; 3194-fixing part; 3196-block part; 320-label pressing mechanism; 400-light guide column mechanism; 410-mounting plate; 430-mounting part; 500-hot melt mechanism; 510-base; 520-hot melt assembly; 522-hot melt part; 524-hot melt head; 526-fixing block; 600-unloading mechanism; 610-support part; 620-second driving part; 630-unloading part. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0044] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0046] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the invention is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0047] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0048] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] Example

[0050] See also Figure 1 This embodiment provides an electronic product assembly mechanism 10. The electronic product assembly mechanism 10 provided in this embodiment can improve the processing efficiency of electronic products.

[0051] The electronic product assembly mechanism 10 provided in this embodiment is used to assemble electronic products. The electronic products include a first component and a second component. The first component and the second component are placed on the electronic product assembly mechanism 10 at the same time, the first component is assembled first, and finally the first component and the second component are heat-fused together to form the electronic product.

[0052] In this embodiment, the electronic product assembly mechanism 10 includes a frame 100, a circulation mechanism 200, a labeling mechanism 300, a light guide mechanism 400 and a hot melt mechanism 500. The circulation mechanism 200 is arranged on the frame 100, and the labeling mechanism 300, the light guide mechanism 400 and the hot melt mechanism 500 are sequentially arranged around the circulation mechanism 200.

[0053] The circulation mechanism 200 is used to convey the first component and the second component to sequentially pass through the labeling mechanism 300, the light guide mechanism 400 and the hot melt mechanism 500;

[0054] The labeling mechanism 300 is used to attach foam to the first component;

[0055] The light guide mechanism 400 is used to install the light guide on the first component;

[0056] The hot melt mechanism 500 is used for hot melting the first component and the second component.

[0057] In this embodiment, the first component and the second component are simultaneously placed on the circulation mechanism 200, the labeling mechanism 300 first pastes foam on the first component, then the light guide column is installed on the first component, and finally the hot melt mechanism 500 hot melts the first component and the second component together to form an electronic product. In this embodiment, the labeling mechanism 300, the light guide column mechanism 400 and the hot melt mechanism 500 process the first component or the second component in turn, and finally process it into an electronic product, which is processed in a fully automatic manner, thereby improving the processing efficiency of electronic products.

[0058] In this embodiment, the labeling mechanism 300 includes a labeling mechanism 310 and a label pressing mechanism 320, and both the labeling mechanism 310 and the label pressing mechanism 320 are connected to the frame 100;

[0059] The bid issuing mechanism 310 is used for issuing the bid of the foam;

[0060] The label pressing mechanism 320 is used to press the foam onto the first component.

[0061] In this embodiment, the labeling mechanism 310 first labels the foam, and then the label pressing mechanism 320 presses the foam onto the first component.

[0062] See also Figure 2 In this embodiment, the labeling mechanism 310 includes a main panel 312, a coil assembly 314, a tension assembly 316 and a labeling assembly 318, and the coil assembly 314, the tension assembly 316 and the labeling assembly 318 are sequentially arranged on the main panel 312;

[0063] The coil assembly 314 is used to fix the tape, wherein the foam is attached to the tape;

[0064] The tensioning assembly 316 is used to tension the belt material;

[0065] The label removing assembly 318 is used to tear off the foam on the belt when the belt rotates relative to the tensioning assembly 316.

[0066] In this embodiment, the coil assembly 314 is disposed at one end of the main panel 312 , the label assembly 318 is disposed at the other end of the main panel 312 , and the tensioning assembly 316 is disposed between the coil assembly 314 and the label assembly 318 .

[0067] In this embodiment, the coiling component 314 rolls the tape onto the coiling component 314, and then tensions it through the tensioning component 316. When the tape is transferred to the labeling component 318, the labeling component 318 tears off the foam on the tape.

[0068] In this embodiment, the tensioning assembly 316 includes a plurality of tensioning shafts 3162 , and the plurality of tensioning shafts 3162 are sequentially arranged between the coil assembly 314 and the marking assembly 318 .

[0069] In this embodiment, the roll assembly 314 includes a first roll 3142 and a second roll 3144, and the first roll 3142 and the second roll 3144 are both connected to the main panel 312;

[0070] The first roll 3142 is used to fix the tape with foam attached;

[0071] The second roll 3144 is used to fix the foam-free tape.

[0072] See also Figure 3 In this embodiment, the labeling mechanism 310 further includes a fixing component 319, which is connected to the main panel 312 and is disposed between the coiling component 314 and the labeling component 318 for selectively fixing or releasing the tape.

[0073] In this embodiment, the fixing assembly 319 includes a base plate 3192, a fixing member 3194 and a shifting member 3196; the fixing member 3194 is connected to the base plate 3192, and the strip is disposed between the fixing member 3194 and the shifting member 3196;

[0074] The shifting block 3196 can selectively abut or disengage from the fixing member 3194 to fix the belt material or remove the belt material.

[0075] See also Figure 4 In this embodiment, the light guide column mechanism 400 includes a mounting plate 410, a first driving member and a mounting member 430, the mounting plate 410 is connected to the frame 100, and the first driving member is disposed on the mounting plate 410;

[0076] The first driving member is used to drive the mounting member 430 to move relative to the mounting plate 410;

[0077] The mounting member 430 is used to mount the light guide column.

[0078] In this embodiment, the first driving member drives the mounting member 430 to move relative to the mounting plate 410. When the mounting member 430 moves to one end of the mounting plate 410, the mounting member 430 picks up the light guide column and moves toward the other end of the mounting plate 410. When the mounting member 430 moves to the other end of the mounting plate 410, the light guide column is installed on the first component.

[0079] See also Figure 5 In this embodiment, the hot melt mechanism 500 includes a base 510, a hot melt assembly 520 and a cooling assembly, and the hot melt assembly 520 is disposed on the base 510;

[0080] The hot melt assembly 520 is used to hot melt the first component and the second component to form an electronic product;

[0081] The cooling component is connected to the hot melt component 520 and is used to cool the hot melt component 520 so that the electronic product and the hot melt component 520 can be quickly separated.

[0082] In this embodiment, the cooling component includes a plurality of capillaries, and the plurality of capillaries are attached to the hot melt component 520, which can quickly cool the hot melt component 520 and make the hot melt component 520 and the electronic product fall off quickly.

[0083] In this embodiment, the hot melt assembly 520 includes a plurality of hot melt components 522, and the plurality of hot melt components 522 are sequentially arranged on the base 510;

[0084] The hot melt component 522 includes a hot melt head 524 and a fixing block 526. The fixing block 526 is connected to the base 510. The hot melt head 524 is connected to the fixing block 526. The hot melt head 524 is used to hot melt the first component and the second component to form an electronic product.

[0085] See also Figure 6 In this embodiment, the electronic product assembly mechanism 10 further includes a material unloading mechanism 600 . The material unloading mechanism 600 is disposed on the frame 100 , and the material unloading mechanism 600 is used for unloading electronic products.

[0086] In this embodiment, the unloading mechanism 600 includes a support member 610, a second driving member 620 and a unloading member 630, the support member 610 is connected to the frame 100, and the second driving member 620 is connected to the frame 100;

[0087] The second driving member 620 is connected to the blanking member 630 and is used to drive the blanking member 630 to move in a direction perpendicular to the extension direction of the frame 100;

[0088] The unloading member 630 is used to receive the electronic products and transport the electronic products away from the rack 100 .

[0089] In this embodiment, there are multiple second driving members 620 , and the multiple second driving members 620 are connected in sequence, which can increase the blanking stroke of the blanking member 630 .

[0090] In summary, the electronic product assembly mechanism 10 provided in this embodiment, in this embodiment, the first component and the second component are placed on the circulation mechanism 200 at the same time, the labeling mechanism 300 first pastes foam to the first component, then the light guide column is installed on the first component, and finally the hot melt mechanism 500 hot melts the first component and the second component together to form an electronic product. In this embodiment, the labeling mechanism 300, the light guide column mechanism 400 and the hot melt mechanism 500 process the first component or the second component in turn, and finally process it into an electronic product, and the processing is carried out in a fully automatic manner, thereby improving the processing efficiency of the electronic product.

[0091] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic product assembly mechanism, the electronic product comprising a first component and a second component, characterized in that: The electronic product assembly mechanism comprises a frame, a circulation mechanism, a labeling mechanism, a light guide column mechanism and a hot melt mechanism, wherein the circulation mechanism is arranged on the frame, and the labeling mechanism, the light guide column mechanism and the hot melt mechanism are sequentially arranged around the circulation mechanism; The circulation mechanism is used to convey the first component and the second component to sequentially pass through the labeling mechanism, the light guide mechanism and the hot melt mechanism; The labeling mechanism is used to stick foam to the first component; The light guide mechanism is used to install a light guide on the first component; The hot melt mechanism is used for hot melting the first component and the second component; The hot melt mechanism comprises a base, a hot melt component and a cooling component, and the hot melt component is arranged on the base; The hot melt assembly is used for hot melting the first component and the second component to form the electronic product; The cooling component is connected to the hot melt component and is used to cool the hot melt component so that the electronic product and the hot melt component can be quickly separated; The labeling mechanism includes a labeling mechanism and a label pressing mechanism, and both the labeling mechanism and the label pressing mechanism are connected to the frame; The bidding mechanism is used to bid the foam; The label pressing mechanism is used to press the foam onto the first component; The bid issuing mechanism comprises a main panel, a coil assembly, a tension assembly and a bid issuing assembly, wherein the coil assembly, the tension assembly and the bid issuing assembly are sequentially arranged on the main panel; The coil assembly is used to fix the tape, wherein the foam is attached to the tape; The tensioning assembly is used to tension the belt material; The label removing assembly is used to tear off the foam on the belt when the belt rotates relative to the tensioning assembly; The coil assembly includes a first coil and a second coil, and the first coil and the second coil are both connected to the main panel; The first coil is used to fix the strip of material with the foam attached; The second coil is used to fix the strip without the foam; The label-discharging mechanism also includes a fixing component, which is connected to the main panel and is arranged between the coiling component and the label-discharging component, and is used to selectively fix or release the strip; the fixing component includes a base plate, a fixing part and a shifting block part, the fixing part is connected to the base plate, the strip is arranged between the fixing part and the shifting block part, and the shifting block part can selectively abut or disengage from the fixing part.

2. The electronic product assembly mechanism according to claim 1, characterized in that: The hot melt assembly includes a plurality of hot melt parts, and the plurality of hot melt parts are sequentially arranged on the base; The hot melt component includes a hot melt head and a fixing block, the fixing block is connected to the base, the hot melt head is connected to the fixing block, and the hot melt head is used to hot melt the first component and the second component to form the electronic product.

3. The electronic product assembly mechanism according to claim 1, characterized in that: The light guide column mechanism comprises a mounting plate, a first driving member and a mounting member, the mounting plate is connected to the frame, and the first driving member is arranged on the mounting plate; The first driving member is used to drive the mounting member to move relative to the mounting plate; The mounting member is used for mounting the light guide column.

4. The electronic product assembly mechanism according to claim 1, characterized in that: The electronic product assembly mechanism further comprises a material unloading mechanism, which is arranged on the frame and is used for unloading the electronic product.

5. The electronic product assembly mechanism according to claim 4, characterized in that: The unloading mechanism comprises a supporting member, a second driving member and an unloading member, wherein the supporting member is connected to the frame, and the second driving member is connected to the frame; The second driving member is connected to the blanking member and is used to drive the blanking member to move in a direction perpendicular to the extension direction of the frame; The unloading piece is used to receive the electronic product and transport the electronic product away from the rack.