A device for removing surface metal and photoresist

Abstract

The present invention provides a surface metal and photoresist removal device, comprising a substrate, a cavity, an eccentric chuck, a rotary drive device, a first swing device and a second swing device; the cavity is fixedly mounted on the substrate; the rotary drive device is arranged in the cavity; the eccentric chuck is mounted on the rotary drive device, the rotary drive device rotates to drive the eccentric chuck to rotate, and the wafer is eccentrically arranged on the eccentric chuck. The present invention is cleverly designed, and uses a mechanochemical method to remove the metal and photoresist on the surface of the wafer at one time, which greatly reduces labor costs, and greatly improves product yield and work efficiency.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, and in particular to a surface metal and photoresist removal device. Background Art

[0002] In the field of semiconductor technology, in order to obtain suitable metal wires or metal nodes, a metal layer needs to be grown on the surface of the wafer. No matter what method is used, the metal layer will cover the entire wafer. At this time, it is necessary to remove the useless metal and photoresist, leaving only the useful wires. The existing method is to manually stick a blue film on the surface of the wafer, use the blue film to tear off the metal layer, and then remove the photoresist by soaking in chemicals. After removing the metal layer and photoresist, a spin dryer is required to spin dry the wafer. Therefore, it consumes manpower, the workload is very huge, the work efficiency is greatly reduced, and the product yield cannot be guaranteed. Summary of the invention

[0003] Technical issues to be solved

[0004] The problem to be solved by the present invention is to provide a surface metal and photoresist removal device to overcome the defects in the prior art that metal and photoresist are removed manually, the workload is very huge, and the work efficiency is greatly reduced.

[0005] Technical Solution

[0006] In order to solve the technical problem, the present invention provides a surface metal and photoresist removal device, including a substrate, a cavity, an eccentric chuck, a rotary drive device, a first swing device and a second swing device; the cavity is fixedly mounted on the substrate; the rotary drive device is arranged in the cavity; the eccentric chuck is mounted on the rotary drive device, and the rotation of the rotary drive device drives the eccentric chuck to rotate, and the wafer is eccentrically arranged on the eccentric chuck; the first swing device and the second swing device are arranged on both sides of the substrate, the first swing device includes a normal pressure nozzle for spraying liquid to the wafer, and the second swing device includes a high pressure nozzle for spraying liquid to the wafer; a feed port is also arranged on one side of the cavity.

[0007] Preferably, the first swinging device also includes a normal pressure arm, a first connecting block, a first waterproof cap, a first connecting shaft, a first reducer, a first driving motor, a column and a base plate; one end of the normal pressure arm is fixed to the normal pressure nozzle, and the other end is fixed to the first connecting block; the upper end of the first connecting shaft passes through the first waterproof cap and is fixed to the first connecting block, and the lower end is fixed to the first reducer; the first waterproof cap is arranged in the cavity and at the upper end of the first connecting shaft; the first driving motor is installed at the lower end of the first reducer, and the rotation of the rotating shaft of the first driving motor drives the first reducer and the first connecting shaft to swing; the upper ends of several of the columns are fixed to the first reducer, and the lower ends are fixed to the base plate; the base plate is fixedly installed to the substrate; the normal pressure nozzle is connected to the first liquid inlet port at the bottom of the cavity through a pipeline.

[0008] Preferably, the second swinging device also includes a high-pressure arm, a second connecting block, a second waterproof cap, a second connecting shaft, a second reducer and a second driving motor; one end of the high-pressure arm is fixed to the high-pressure nozzle, and the other end is fixed to the second connecting block; the upper end of the second connecting shaft passes through the second waterproof cap and is fixed to the second connecting block, and the lower end is fixed to the second reducer; the second waterproof cap is arranged in the cavity and at the upper end of the second connecting shaft; the second driving motor is installed at the lower end of the second reducer, and the rotation of the rotating shaft of the second driving motor drives the first reducer and the second connecting shaft to swing; the high-pressure nozzle is connected to the second liquid inlet port at the bottom of the cavity through a pipeline.

[0009] Preferably, the second swinging device also includes an up and down displacement distance adjusting device, which is used to adjust the up and down height of the high-voltage arm, and the up and down displacement distance adjusting device includes a U-shaped block, a connecting seat, a slider, an electric actuator and a bracket; one end of the U-shaped block is fixed to the second reducer, and the other end is fixed to the connecting seat; one end of the slider is fixed to the connecting seat, and the other end is connected to the electric actuator for up and down sliding; the other side of the electric actuator is fixed to the bracket, and the lower end of the bracket is fixedly mounted to the base plate.

[0010] Preferably, the rotary drive device includes a third drive motor, a first column, a motor seat, a flange, a third waterproof cap, a wafer table, a sealing cover and an expansion sleeve; the third drive motor is fixedly mounted at the lower end of the motor seat; the upper ends of several of the first columns are fixed to the motor seat, and the lower ends are fixedly mounted to the substrate; the flange is fixedly mounted above the motor seat; the third waterproof cap is fixedly mounted above the flange; the rotating shaft of the third drive motor is fixed to the wafer table through the expansion sleeve, and the rotation of the rotating shaft drives the wafer table to rotate; the sealing cover is fixedly mounted at the center position of the upper end of the wafer table.

[0011] Preferably, the eccentric chuck is fixedly mounted above the wafer table via a second column.

[0012] Preferably, the outer wall of the flange is provided with a plurality of back spray nozzles, and the back spray nozzle 9 is fixedly mounted to the flange via a connecting plate.

[0013] Preferably, a port sealing device is also provided at the feed port, and the port sealing device includes a third column, a first support plate, a slide cylinder, a second support plate, a water receiving plate, a sealing plate, a door frame and a door frame fixing plate; the upper end of the third column is fixed to the first support plate, and the lower end is fixed to the base plate; the lower end of the slide cylinder is fixed to the third column, and the upper end of the piston rod of the slide cylinder is fixed to the second support plate; the water receiving plate is fixedly installed above the second support plate; the sealing plate is fixedly installed on one side of the second support plate, and the sealing plate is arranged in the door frame and slides up and down along the door frame; the door frame fixing plate is fixedly installed together with the door frame and the cavity.

[0014] Preferably, a fixing ring is fixedly mounted on one side of the sealing plate, the fixing ring is fixed to a sleeve, and the sleeve covers the rotary drive device.

[0015] Preferably, a drain outlet is provided at the bottom of the cavity, and an exhaust outlet is provided at one side of the cavity.

[0016] The beneficial effects are as follows: the surface metal and photoresist removal device of the present invention is cleverly designed and uses a mechanochemical method to remove the metal and photoresist on the wafer surface at one time, thereby greatly reducing labor costs and greatly improving product yield and work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a surface metal and photoresist removal device of the present invention;

[0018] Figure 2 This is a schematic diagram of the internal structure of a surface metal and photoresist removal device of the present invention;

[0019] Figure 3 is an exploded view of the first swing device;

[0020] Figure 4 This is a schematic diagram of the internal structure of a surface metal and photoresist removal device of the present invention;

[0021] Figure 5 is an exploded view of the second swing device;

[0022] Figure 6 is a structural schematic diagram of a rotary drive device;

[0023] Figure 7 is a half-section view of the rotary drive device;

[0024] Figure 8 Exploded view of the port sealing device. DETAILED DESCRIPTION

[0025] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0026] like Figure 1 to Figure 2 As shown, a surface metal and photoresist removal device of the present invention comprises a substrate 1, a cavity 2, an eccentric chuck 3, a rotation drive device 4, a first swing device 5 and a second swing device 6; the cavity 2 is fixedly mounted on the substrate 1 with screws; the rotation drive device 4 is arranged in the cavity 2; the eccentric chuck 3 is mounted on the rotation drive device 4, and the rotation of the rotation drive device 4 drives the eccentric chuck 3 to rotate, and the wafer is eccentrically arranged on the eccentric chuck 3; the first swing device 5 and the second swing device 6 are arranged on both sides of the substrate 1, the first swing device 5 includes a normal pressure nozzle 501 for spraying liquid to the wafer, and the second swing device 6 includes a high pressure nozzle 601 for spraying liquid to the wafer; a feed port 7 is also arranged on one side of the cavity 2.

[0027] like Figure 3 As shown, the first swing device 5 also includes a normal pressure arm 502, a first connecting block 503, a first waterproof cap 504, a first connecting shaft 505, a first reducer 506, a first driving motor 507, a fourth column 508 and a bottom plate 509; one end of the normal pressure arm 502 is fixed to the normal pressure nozzle 501 by screws, and the other end is fixed to the first connecting block 503 by screws; the upper end of the first connecting shaft 505 passes through the first waterproof cap 504 and is fixed to the first connecting block 503 by screws, and the lower end is fixed to the first reducer 506 by screws; the first waterproof cap 5 04 is arranged in the cavity 2 and is arranged at the upper end of the first connecting shaft 505; the first driving motor 507 is installed at the lower end of the first reducer 506 with screws, and the rotation of the rotating shaft of the first driving motor 507 drives the first reducer 506 and the first connecting shaft 505 to swing; the upper ends of the fourth columns 508 are fixed to the first reducer 506, and the lower ends are fixed to the bottom plate 509 with screws; the bottom plate 509 is fixedly installed with the substrate 1 with screws; the normal pressure nozzle 501 is connected to the first liquid inlet port 201 at the bottom of the cavity 2 through a pipeline.

[0028] like Figure 3As shown, the first swing device 5 further includes a first housing 510 and a first cover plate 511 . The first housing 510 and the first cover plate 511 are fixedly installed with screws to wrap the first driving motor 507 and the first reducer 506 .

[0029] like Figure 5 As shown, the second swing device 6 also includes a high-pressure arm 602, a second connecting block 603, a second waterproof cap 604, a second connecting shaft 605, a second reducer 606 and a second driving motor 607; one end of the high-pressure arm 602 is fixed to the high-pressure nozzle 601 with screws, and the other end is fixed to the second connecting block 603 with screws; the upper end of the second connecting shaft 605 passes through the second waterproof cap 604 and is fixed to the second connecting block 603 with screws, and the lower end is fixed to the second reducer 606 with screws; the second waterproof cap 604 is arranged in the cavity 2 and is arranged at the upper end of the second connecting shaft 605; the second driving motor 607 is installed at the lower end of the second reducer 606 with screws, and the rotation of the rotating shaft of the second driving motor 607 drives the first reducer 506 and the second connecting shaft 605 to swing; the high-pressure nozzle 601 is connected to the second liquid inlet port 202 at the bottom of the cavity 2 through a pipeline.

[0030] like Figure 5 As shown, the second swing device 6 also includes an up-and-down displacement distance adjustment device, which is used to adjust the up-and-down height of the high-voltage arm 602, and includes a U-shaped block 608, a connecting seat 609, a slider 610, an electric actuator 611 and a bracket 612; one end of the U-shaped block 608 is fixed to the second reducer 606 with screws, and the other end is fixed to the connecting seat 609 with screws; one end of the slider 610 is fixed to the connecting seat 609 with screws, and the other end is connected to the electric actuator 611 in an up-and-down sliding manner; the other side of the electric actuator 611 is fixed to the bracket 612 with screws, and the lower end of the bracket 612 is fixed to the substrate 1 with screws.

[0031] The electric actuator model is LEFS25RB-50B-R3CE18, brand is SMC.

[0032] like Figure 5 As shown, the second swing device 6 further includes a second housing 613 and a second cover plate 614 . The second housing 613 and the second cover plate 614 are fixedly installed with screws and wrap the second driving motor 607 , the second reducer 606 and the electric actuator 611 .

[0033] like Figure 6-7As shown, the rotation drive device 4 includes a third drive motor 401, a first column 402, a motor seat 403, a flange 404, a third waterproof cap 405, a wafer table 406, a sealing cover 407 and a sleeve 408; the third drive motor 401 is fixedly installed on the lower end of the motor seat 403 with screws; the upper ends of the first columns 402 are fixed to the motor seat 403 with screws, and the lower ends are fixedly installed to the substrate 1 with screws; the flange 404 is fixedly installed above the motor seat 403 with screws; the third waterproof cap 405 is fixedly installed above the flange 404 with screws; the rotating shaft 409 of the third drive motor 401 is fixed to the wafer table 406 through the sleeve 408, and the rotation of the rotating shaft 409 drives the wafer table 406 to rotate; the sealing cover 407 is fixedly installed at the center position of the upper end of the wafer table 406 with screws.

[0034] like Figure 6 As shown, the eccentric chuck 3 is fixedly mounted above the wafer support table 406 via a second column 8 with screws.

[0035] The rotation center of the eccentric chuck 3 is eccentric to the rotation center of the wafer by 0.2 mm.

[0036] like Figure 6 As shown, the outer wall of the flange 404 is provided with a plurality of back spray nozzles 9, and the back spray nozzles 9 are fixed to the flange 404 by screws through a connecting plate 10.

[0037] The four back spray nozzles 9 are connected to the third liquid inlet port 205 and the fourth liquid inlet port 206 through pipelines.

[0038] like Figure 8 As shown, the feed port 7 is also provided with a port sealing device, which includes a third column 11, a first support plate 12, a slide cylinder 13, a second support plate 14, a water receiving platform 15, a sealing plate 16, a door frame 17 and a door frame fixing plate 18; the upper end of the third column 11 is fixed to the first support plate 12 with screws, and the lower end is fixed to the base plate 1 with screws; the lower end of the slide cylinder 13 is fixed to the third column 11 with screws, and the upper end of the piston rod of the slide cylinder 13 is fixed to the second support plate 14 with screws; the water receiving platform 15 is fixedly installed above the second support plate 14; the sealing plate 16 is fixedly installed on one side of the second support plate 14, and the sealing plate 16 is arranged in the door frame 17 and slides up and down along the door frame 17; the door frame fixing plate 18 is fixedly installed with the door frame 17 and the cavity 2 with screws. The function of the water receiving platform 15 is to prevent liquid from dripping when the wafer is taken out from the feed port.

[0039] like Figure 8As shown, a fixing ring 20 is fixedly installed on one side of the sealing plate 16 by screws, and the fixing ring 20 is fixed to the sleeve 19 by screws, and the sleeve 19 covers the rotary drive device 4.

[0040] like Figure 4 As shown, a drain port 203 is provided at the bottom of the cavity 2 , and an exhaust port 204 is provided at one side of the cavity 2 .

[0041] The cavity 2 includes a main shell 207 and an upper cover 208 , and the upper cover 208 is fixedly mounted on the main shell 207 .

[0042] The back spray nozzle 9, the normal pressure nozzle 501 and the high pressure nozzle 601 all spray MMP liquid to dissolve the photoresist on the surface of the wafer.

[0043] During operation, the wafer is first placed eccentrically on the eccentric chuck 3 through the feed port 7 by a robot, the sealing plate 16 seals the feed port 7, and then the normal pressure nozzle 501 and the high pressure nozzle 601 are started, and the motor drives the normal pressure arm 502 and the high pressure arm 602 to swing to spray the MMP liquid on the wafer, and then the third drive motor 401 drives the eccentric chuck 3 and the wafer to rotate, and after the surface metal and photoresist on the surface of the wafer are completely processed, the wafer is grabbed again by the robot and the process is completed.

[0044] In summary, the above-mentioned embodiments are not limitative embodiments of the present invention, and any modifications or equivalent variations made by those skilled in the art on the basis of the essential contents of the present invention are within the technical scope of the present invention.

Claims

1. A surface metal and photoresist removal device, characterized in that: It comprises a base plate (1), a cavity (2), an eccentric chuck (3), a rotation drive device (4), a first swing device (5) and a second swing device (6); The cavity (2) is fixedly mounted on the substrate (1); the rotary drive device (4) is arranged in the cavity (2); the eccentric chuck (3) is mounted on the rotary drive device (4); the rotary drive device (4) rotates to drive the eccentric chuck (3) to rotate, and the wafer is eccentrically arranged on the eccentric chuck (3); the first swing device (5) and the second swing device (6) are arranged on both sides of the substrate (1); the first swing device (5) includes a normal pressure nozzle (501) for spraying liquid on the wafer, and the second swing device (6) includes a high pressure nozzle (601) for spraying liquid on the wafer; a feed port (7) is also arranged on one side of the cavity (2); The rotary drive device (4) comprises a third drive motor (401), a first column (402), a motor seat (403), a flange (404), a third waterproof cap (405), a wafer support table (406), a sealing cover (407) and an expansion sleeve (408); the third drive motor (401) is fixedly mounted on the lower end of the motor seat (403); the upper ends of a plurality of the first columns (402) are fixedly mounted on the motor seat (403), and the lower ends are fixedly mounted on the base plate (1); The flange (404) is fixedly installed above the motor seat (403); the third waterproof cap (405) is fixedly installed above the flange (404); the rotating shaft (409) of the third driving motor (401) is fixed to the wafer support platform (406) through the expansion sleeve (408), and the rotating shaft (409) rotates to drive the wafer support platform (406) to rotate; the sealing cover (407) is fixedly installed at the center position of the upper end of the wafer support platform (406); The feed port (7) is also provided with a port sealing device, which comprises a third column (11), a first support plate (12), a slide cylinder (13), a second support plate (14), a water receiving plate (15), a sealing plate (16), a door frame (17) and a door frame fixing plate (18); the upper end of the third column (11) is fixed to the first support plate (12), and the lower end is fixed to the base plate (1); the lower end of the slide cylinder (13) is fixed to the third column (1 1) is fixed, the upper end of the piston rod of the slide cylinder (13) is fixed to the second support plate (14); the water receiving plate (15) is fixedly installed above the second support plate (14); the sealing plate (16) is fixedly installed on one side of the second support plate (14), and the sealing plate (16) is arranged in the door frame (17) and slides up and down along the door frame (17); the door frame fixing plate (18) is fixedly installed together with the door frame (17) and the cavity (2).

2. The surface metal and photoresist removal device according to claim 1, characterized in that: The first swing device (5) further comprises a normal pressure arm (502), a first connecting block (503), a first waterproof cap (504), a first connecting shaft (505), a first reducer (506), a first driving motor (507), a fourth column (508) and a bottom plate (509); one end of the normal pressure arm (502) is fixed to the normal pressure nozzle (501), and the other end is fixed to the first connecting block (503); the upper end of the first connecting shaft (505) passes through the first waterproof cap (504) and is fixed to the first connecting block (503), and the lower end is fixed to the first reducer (506); the first waterproof cap (504) ) is arranged in the cavity (2) and is arranged at the upper end of the first connecting shaft (505); the first driving motor (507) is installed at the lower end of the first reducer (506), and the rotation of the rotating shaft of the first driving motor (507) drives the first reducer (506) and the first connecting shaft (505) to swing; the upper ends of a plurality of fourth columns (508) are fixed to the first reducer (506), and the lower ends are fixed to the bottom plate (509); the bottom plate (509) is fixedly installed with the substrate (1); the normal pressure nozzle (501) is connected to the first liquid inlet port (201) at the bottom of the cavity (2) through a pipeline.

3. The surface metal and photoresist removal device according to claim 1, characterized in that: The second swing device (6) further comprises a high-pressure arm (602), a second connecting block (603), a second waterproof cap (604), a second connecting shaft (605), a second reducer (606) and a second driving motor (607); one end of the high-pressure arm (602) is fixed to the high-pressure nozzle (601), and the other end is fixed to the second connecting block (603); the upper end of the second connecting shaft (605) passes through the second waterproof cap (604) and is fixed to the second connecting block (603), and the lower end is fixed to the second reducer (606); the second waterproof cap (604) is arranged in the cavity (2) and is arranged at the upper end of the second connecting shaft (605); the second driving motor (607) is installed at the lower end of the second reducer (606), and the rotation of the rotating shaft of the second driving motor (607) drives the second reducer (606) and the second connecting shaft (605) to swing; the high-pressure nozzle (601) is connected to the second liquid inlet port (202) at the bottom of the cavity (2) through a pipeline.

4. The surface metal and photoresist removal device according to claim 3, characterized in that: The second swing device (6) also includes an up-and-down displacement distance adjustment device, which is used to adjust the up-and-down height of the high-voltage arm (602), and the up-and-down displacement distance adjustment device includes a U-shaped block (608), a connecting seat (609), a sliding block (610), an electric actuator (611) and a bracket (612); one end of the U-shaped block (608) is fixed to the second reducer (606), and the other end is fixed to the connecting seat (609); one end of the sliding block (610) is fixed to the connecting seat (609), and the other end is connected to the electric actuator (611) in an up-and-down sliding manner; the other side of the electric actuator (611) is fixed to the bracket (612), and the lower end of the bracket (612) is fixedly mounted to the base plate (1).

5. The surface metal and photoresist removal device according to claim 1, characterized in that: The eccentric chuck (3) is fixedly mounted above the wafer support platform (406) via a second column (8).

6. The surface metal and photoresist removal device according to claim 1, characterized in that: The outer wall of the flange (404) is provided with a plurality of back spray nozzles (9), and the back spray nozzles (9) are fixedly mounted on the flange (404) via a connecting plate (10).

7. The surface metal and photoresist removal device according to claim 6, characterized in that: A fixing ring (20) is also fixedly mounted on one side of the sealing plate (16), the fixing ring (20) being fixed to a sleeve (19), and the sleeve (19) sheathing the rotary drive device (4).

8. The surface metal and photoresist removal device according to any one of claims 1 to 7, characterized in that: The bottom of the cavity (2) is provided with a drainage port (203), and one side of the cavity (2) is provided with an exhaust port (204).

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