Layered device and method of manufacturing the same

Abstract

A layered device includes: a substrate, a first conductive layer on and in contact with the substrate, a second patterned conductive layer in contact with the first conductive layer, a third conductive layer, a fourth conductive layer electrically insulated from the first conductive layer, the second patterned conductive layer, and the third conductive layer, and an operationally active layer between the first conductive layer and the fourth conductive layer. The second patterned conductive layer is thicker than the operationally active layer, and a top portion of the second patterned conductive layer extends across the operationally active layer so as to have electrical contact with the third conductive layer.

Description

Technical Field

[0001] The invention relates to a layered device and a method for manufacturing the same.

[0002] background

[0003] Thin film photovoltaics (PV), organic PV (OPV) and organic light emitting diodes (OLED) are manufactured using various roll-to-roll (R2R) compatible printing and coating technologies. These structures are usually printed in stripe form. However, the use of transparent or translucent materials limits the ability to align the printed layers in register. In addition, the rheological properties of some interlayer materials are completely different from the specifications determined by mechanical printing methods (i.e. gravure printing, flexographic printing, screen printing, offset printing, pad printing, inkjet printing, aerosol printing or the like), and obtaining sufficient dimensional accuracy is challenging. Efforts have been made to produce registration marks for custom-shaped (arbitrary) structures with OPV that can be detected by a registration camera. However, this is not a satisfactory approach.

[0004] Therefore, there is a need to improve the structure and the method of manufacturing the structure.

[0005] Brief Description

[0006] The present invention seeks improvements in devices. According to one aspect of the present invention, a layered device as claimed in claim 1 is provided.

[0007] According to another aspect of the present invention, a method of manufacturing the layered device of claim 10 is provided.

[0008] The present invention provides several advantages. Fabrication of patterned structures using fully covered thin film layers and thicker printed busbar electrodes for operative contact helps resolve alignment issues associated with prior art without degrading the electrical performance and visual appearance of the device. Materials that are invisible to the registration camera can be used.

[0009] List of Figures

[0010] Exemplary embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which:

[0011] Figure 1A An example of a layered device viewed from the side is illustrated;

[0012] Figure 1B An example of a layered device viewed from above is illustrated;

[0013] Figure 2A An example of multiple layered devices on a substrate coupled to a common circuit is illustrated;

[0014] Figure 2B illustrates an example of multiple layered devices on a substrate coupled to different circuits; and

[0015] Figure 3 An example of a flow chart of a manufacturing method is illustrated. DETAILED DESCRIPTION

[0016] The following embodiments are merely examples. Although the specification may refer to "one / an" embodiment in multiple places, this does not necessarily mean that each such reference is to the same embodiment, or that the feature only applies to a single embodiment. Individual features of different embodiments may also be combined to provide other embodiments. In addition, the words "comprise" and "include" should be understood as not limiting the described embodiments to consist of the features already mentioned, and the embodiments may include features / structures not explicitly mentioned.

[0017] It should be noted that although the drawings show different embodiments, they are simplified diagrams showing some structural and / or functional entities. The connections shown in the drawings may refer to logical connections or physical connections. It is obvious to those skilled in the art that the device may include other functions and structures beyond those described in the drawings and text. It should be understood that the details of some functions or structures are irrelevant to the actual invention. Therefore, no detailed discussion is required in this article.

[0018] The use of coating methods limits the ability of directly patterning arbitrary, customized shaped two-dimensional (2D) features, which is considered to be a key factor for successful commercialization, especially for OPVs that have been recently recognized by many commercial participants. In fact, customization is the key advantage of using printing over coating, so unrestricted design of any 2D shape is possible, thereby providing real design freedom. However, transparent / translucent materials are difficult to align with the printed layer. The rheological properties of some materials are different from the specifications determined by mechanical printing methods (such as gravure printing, flexographic printing, screen printing, offset printing, pad printing, inkjet printing, aerosol spray printing or the like), thereby causing changes in dimensional accuracy. In the present application, a patterned layer can, for example, refer to a patterned transfer of a material directly forming a patterned layer on a surface, or first transferred to a surface in a non-patterned form and patterned separately by etching or similar methods. The non-patterned layer then covers the entire layer formed thereon with the non-patterned layer.

[0019] The new hierarchical structure 150 (an example of which is shown in Figure 1AThe active layer structure 110A includes an active layer structure 110A between the first conductive layer 102 and the fourth conductive layer 114. The active layer structure 110A includes at least an active layer 108. At least one intermediate layer 110 and the non-patterned non-conductive layer 106 of the active layer structure 110A are optional. The operational active layer structure 110A located between the first conductive layer 102 and the fourth conductive layer 114 includes at least one non-patterned layer, and at least one non-patterned layer in the active layer structure 110A is the non-patterned non-conductive layer 106, the active layer 108 or the intermediate layer 110. The thickness of the active layer structure 110A can generally be less than 1 μm.

[0020] The first conductive layer 102 is located on the substrate 100 to provide support and strength to the device 150. The second patterned conductive layer 104 (which may be thicker than any other layer alone and which is in electrical contact with the first conductive layer 102) extends across the active layer structure 110A and has electrical contact with the third conductive layer 112. It extends across the active layer structure 110A due to its thickness relative to the other layers.

[0021] The second patterned conductive layer 104 may be thicker than the one or more non-patterned layers of the operationally active layer structure 110A. That is, the one or more non-patterned layers are located on or above the second patterned conductive layer 104 layer, but because the second patterned conductive layer 104 is thicker, it extends across and also through the one or more non-patterned layers of the active layer structure 110A. The one or more patterned layers of the operationally active layer structure 110A are then considered to be patterned as follows: they are not located on or above the second patterned conductive layer 104, while the second patterned conductive layer 104 is beside or between portions of the patterned layers of the operationally active layer structure 110A.

[0022] The third conductive layer 112 may in turn be electrically insulated from the fourth conductive layer 114. In one embodiment, the third conductive layer 112 and the fourth conductive layer 114 may be in electrical contact with each other. Electrical contact may be considered at least substantially the same as galvanic contact, ie, the contact is conductive.

[0023] In more detail, the layered device 150 includes a substrate 100, and a first conductive layer 102 is located on and in contact with the substrate 100. In one embodiment, the first conductive layer 102 can be non-patterned, which requires an insulating layer (not shown in the figure) located between the first conductive layer 102 and the active layer structure 110A or the active layer 108. In one embodiment, the first conductive layer 102 can be patterned. The second patterned conductive layer 104 is in contact with the first conductive layer 102. The second patterned conductive layer 104 can also be referred to as a busbar. The third conductive layer 112 and the fourth conductive layer 114 are located on the opposite side of the layered device 150 relative to the substrate 100. The fourth conductive layer 114 is electrically insulated from the first conductive layer 102, the second patterned conductive layer 104, and the third conductive layer 112. The operational active layer structure 110A is located between the first conductive layer 102 and the fourth conductive layer 114.

[0024] The second patterned conductive layer 104 is thicker than the operationally active layer structure 110A. Therefore, the top portion 104A of the second patterned conductive layer 104 extends across the operationally active layer structure 110A so as to have electrical contact with the third conductive layer 112. Therefore, the top portion 104A of the second patterned conductive layer 104 may pass through or pierce the non-conductive layer 106 and the operationally active layer structure 110A.

[0025] The substrate 100 may be flexible. The substrate 100 may be transparent under visible light. Visible light is electromagnetic radiation having a wavelength range of about 390 nm to 700 nm. The substrate 100 may be thinner than about 1 mm. The material of the substrate 100 may be a polymer such as plastic or glass. For example, the material of the substrate 100 may include polyethylene terephthalate (PET) or flexible glass.

[0026] The first conductive layer 102 may at least partially cover the substrate 100. The material of the first conductive layer 102 may include indium tin oxide (ITO), fluorine-doped tin oxide (FTO), and / or doped zinc oxide, graphene, carbon nanotubes, nano-sized conductive ink (e.g., silver, copper), nano silver wires, PEDOT:PSS (poly (3,4-ethylenedioxythiophene) polystyrene sulfonate). At least one electrode or both electrodes are conductive and transparent under visible light.

[0027] The non-conductive layer 106 is typically thin (thinner than 30 nm) and made of a transparent material (e.g., ZnO, doped ZnO, TiOx, or a polymer). This is why it is not visible to the registration camera used to align the layers to each other. If the first conductive layer 102 is transparent, an at least partially transparent grid structure can be used for the second conductive layer 104, which can be used with PEDOT:PSS. The substrate 100 with the first conductive layer 102 can be flexible and suitable for a roll-to-roll printing process.

[0028] The contact between the first conductive layer 102 and the second patterned conductive layer 104 is an electrical contact. The second patterned conductive layer 104 is located above the first conductive layer 102. The second patterned conductive layer 104 can penetrate the first conductive layer 102 and contact the substrate 100. If the first conductive layer 102 is patterned, the second patterned conductive layer 104 can be patterned differently from the first conductive layer 102. If the non-conductive layer 106 and / or some other layers between the first conductive layer 102 and the active layer structure 110A are insulating layers, the first conductive layer 102 can be non-patterned. Although the first conductive layer 102 can be non-patterned, the second patterned conductive layer 104 is patterned. For example, the second patterned conductive layer 104 can be made of silver paste. Typically, in a wet process, the material of the second patterned conductive layer 104 (which is liquid) is transferred to the substrate 100 with or without the first conductive layer 102. In this application, the liquid material of the second patterned conductive layer 104 is transferred to the substrate 100 or the first conductive layer 102 as printing. For example, the second patterned conductive layer 104 can be printed using gravure printing, flexographic printing and / or screen printing. Printing can form a thick layer that can extend through (all) other layers. Printing also produces a directly patterned conductive layer 104 that does not require further patterning. In this way, automatic camera registration can be used to align the layers with the first conductive layer 102 based on the second patterned conductive layer 104, which is not transparent and the second patterned conductive layer 104 is visible to the registration camera. The second conductive layer 104 may have a grid structure for transparency. In a similar manner, the fourth conductive layer 114A may have a grid structure for allowing light to pass through, and the fourth conductive layer 114B may be made of, for example, patterned PEDOT:PSS. The non-conductive layer 106 is then transparent or highly transparent for visibility. The first conductive layer 102 may be guided to a desired position together with the second patterned conductive layer 104, which is why both of them may need to be detectable by a registration camera.

[0029] As in Figure 1AAs can be seen in the device 150, for example, the third conductive layer 112 is above the second patterned conductive layer 104, which may be opaque. Thus, the third conductive layer 112 obstructs visual observation of the second patterned conductive layer 104 from above the device. This is why the device 150 looks neat to a person observing it.

[0030] In one embodiment, the maximum thickness of the second patterned conductive layer 104 may be, for example, in the range of about 0.1 μm to 20 μm. In one embodiment, the thickness of the non-patterned non-conductive layer 106 may be in the range of 1 nm to 100 nm. The thickness of the intermediate layer 110 may also be in the range of 1 nm to 100 nm. The material of the non-patterned non-conductive layer 106 may include zinc oxide (ZnO), doped ZnO, TiOx, SnO, and polymers such as low-conductive PEDOT:PSS (non-conductive PEDOT:PSS), PEIE (ethoxylated polyethyleneimine) or PEI (polyethyleneimine) or amino acids or their derivatives. In this case, the zinc oxide is undoped or very lightly doped to keep it electrically insulating. The non-patterned non-conductive layer 106 may have full coverage on the second conductive layer 102, which means that the non-patterned non-conductive layer 106 is not patterned and the non-patterned non-conductive layer 106 completely covers the first patterned conductive layer 102. Because the non-patterned non-conductive layer 106 is not patterned and has full coverage, its application does not require camera registration. The non-patterned non-conductive layer 106 can be manufactured by using a printing or coating method. For example, the non-patterned non-conductive layer 106 can be made by gravure printing, flexographic printing, screen printing, engraving, slot die coating, or the like.

[0031] In the present application, the non-conductive layer 106 refers to a layer that reduces or hinders the transfer of current. The non-conductive layer 106 reduces or hinders the flow of DC current. The non-conductive layer 106 reduces or hinders the transfer of current in the lateral direction (i.e., in the direction perpendicular to the normal of the non-conductive layer 106). The non-conductive layer 106 reduces or hinders the movement of charge carriers such as electrons and / or holes. Such non-conductivity means that the transfer of current is reduced or blocked. The non-conductive layer 106 can discharge static electricity in the device 150 and between the layers. In one embodiment, the non-conductive layer 106 can completely and continuously cover the active layer structure 110A. Additionally or alternatively, the active layer 108 can discharge static electricity in the device 150 and between the layers.

[0032] In one embodiment, the active layer structure 110A may include at least one intermediate layer 110, which may be patterned or non-patterned. The intermediate layer 110 may discharge static electricity in the device 150 and between the layers. The height variation at the top portion 104A of the second patterned conductive layer 104 may be greater than the maximum thickness of one of the at least one intermediate layer 110. The height variation at the top portion 104A of the second patterned conductive layer 104 may be greater than the thickness of the active layer 108, at least one intermediate layer 110, the non-patterned non-conductive layer 106 alone or any combination thereof. The height variation at the top portion 104A of the second patterned conductive layer 104 may be greater than the maximum thickness of the active layer 108. The height variation at the top portion 104A of the second patterned conductive layer 104 may be greater than the thickness of the non-patterned non-conductive layer 106. The height variation at the top portion 104A of the second patterned conductive layer 104 may be greater than the thickness of one intermediate layer 110. The height variation at the top portion 104A of the second patterned conductive layer 104 may be greater than the thickness of the at least one intermediate layer 110 , the non-patterned non-conductive layer 106 , and the active layer 108 together.

[0033] The static-discharging layer may extend in one dimension or in one-dimensional shapes (e.g., straight or curved narrow stripes) over the device or substrate 100. During manufacturing, for example, in a roll-to-roll process, the static-discharging layer may extend in one dimension over the substrate 100 in the machine direction. Discharging static electricity is also possible when the static-discharging layer is non-patterned. The static-discharging layer may be electrically connected to a conductive structure that is separated from the device or substrate 100 at the edge of the substrate 100. The conductive structure separated from the device or substrate 100 may be part of the environment.

[0034] Due to printing, the surface roughness of the second patterned conductive layer 104 may cause a height variation greater than the maximum thickness of one of the at least one intermediate layer 110. The two intermediate layers 110 may be arranged such that one intermediate layer 110 is located on one side of the active layer 108 and the other intermediate layer 110 is located on the other side of the active layer 108. That is, the active layer 108 may be sandwiched between the two intermediate layers 110 so as to have an active layer structure 110A. The intermediate layer 110 may be printed. The two intermediate layers 110 on opposite sides of the active layer structure 110A may have the same material or different materials.

[0035] The intermediate layer 110 may include a layer made of a metal oxide such as MoO3 (molybdenum oxide), V2O5 (vanadium oxide), WO3 (tungsten oxide), ZnO (zinc oxide), TiOx (titanium oxide), SnO (tin oxide), or fullerene, or a polymer such as a low-conductivity grade of PEDOT:PSS, polyethyleneimine (PEI), ethoxylated polyethyleneimine (PEIE), poly[(9,9-bis(3'-(N,N-dimethylamino)propyl)-2,7-fluorene)-alt-2,7-(9,9-dioctylfluorene)] (PFN), or an amino acid and its derivatives. The use of a material may depend on the selectivity for holes / electrons. For example, tungsten trioxide (WO3), MoO3, V2O5, or PEDOT:PSS may be used due to its selectivity for holes. On the other hand, ZnO, TiOx, fullerene, PEIE, PEI, or PFN may be used due to their selectivity for electrons. The non-patterned non-conductive layer 106 and the intermediate layer 110 may also include a combination of metal oxides and polymers / amino acids or derivatives thereof. The material of the intermediate layer 110 may be different on different sides of the active layer 108. However, at least one intermediate layer 110 is not necessary in all possible layered devices 150. Similarly, the non-conductive layer 106 is not necessary in all possible layered devices 150.

[0036] In one embodiment, the intermediate layer 110 may have a lower conductivity than the patterned conductive layer 104. In one embodiment, the intermediate layer 110 may continuously and completely cover the active layer 108. That is, the intermediate layer 110 may be non-patterned.

[0037] In one embodiment, the second patterned conductive layer 104 may be printed to have a desired height variation at the top portion 104A. In one embodiment, the second patterned conductive layer 104 may be etched to have a desired height variation at the top portion 104A. In one embodiment, the second conductive layer 102 may be made by etching.

[0038] In one embodiment, the device includes a non-patterned non-conductive layer 106 between the first conductive layer 102 and the active layer 108. Then, the active layer structure 110A includes the non-patterned non-conductive layer 106. The non-conductive layer 106 can be an insulator or a thin layer of ZnO, TiOx, SnOx (tin oxide) or the like. The top portion 104A of the second patterned conductive layer 104 can penetrate the non-patterned non-conductive layer 106. In other words, the top portion 104A of the second patterned conductive layer 104 passes through or pierces the active layer 108 and the non-patterned non-conductive layer 106.

[0039] In one embodiment, the active layer 108 may include a layer made of, for example, poly(3-hexylthiophene):[6,6]-phenyl C61 butyrate methyl ester (P3HT:PCBM). The active layer 108 may be printed. The thickness of the active layer 108 may also be in the range of 50 nm to 500 nm. The printing method may be gravure printing. The device may be, for example, an organic solar cell, but is not limited thereto.

[0040] In one embodiment, the active layer 108 and / or the active layer structure 110A may have a lower conductivity than the second patterned conductive layer 104. In one embodiment, the active layer 108 may have full coverage on the lower intermediate layer 110, on the non-conductive layer 106, or on the first conductive layer 102. That is, the active layer 108 may continuously cover the entire area of ​​the first conductive layer 102, and thus the active layer 108 may be non-patterned. In another embodiment, the active layer 108 may be patterned. When forming the active layer 108 or the active layer structure 110A, camera alignment may or may not be used for layer alignment. The intermediate layer 110 may or may not have full coverage on the active layer 108. The active layer 108 and the intermediate layer 110 have a low conductivity that is between the conductivity of an electrical conductor and the conductivity of an electrical insulator.

[0041] In one embodiment, the fourth conductive layer 114 may include two conductive sublayers 114A, 114B. The conductive sublayer 114A may have a material similar to the first conductive layer 102 or the second conductive layer 104. At least one of the fourth conductive layer 114 and the first conductive layer 102 is transparent. If the first conductive layer 102 is not transparent, the fourth conductive layer 114 needs to be a transparent material or grid. For example, the material of the fourth conductive layer 114 may be indium tin oxide (ITO), fluorine-doped tin oxide (FTO), and / or doped zinc oxide, graphene, carbon nanotubes, silver nanotubes, nano-sized conductive inks (e.g., silver, copper), nano silver wires, PEDOT:PSS (poly (3,4-ethylenedioxythiophene) polystyrene sulfonate). In one embodiment, the fourth conductive layer 114 may be made of silver paste. In one embodiment, the fourth conductive layer 114 may be made by a rotary screen printing method or flexographic printing, which maintains good dimensional accuracy. When forming the fourth conductive layer 114, automatic camera registration may be used for layer alignment.

[0042] In one embodiment, the fourth conductive layer 114A can be made of, for example, silver paste or nano silver wire. In one embodiment, the fourth conductive layer 114A can be made by a rotary screen printing method or flexographic printing, which maintains good dimensional accuracy. When forming the fourth conductive layer 114A, automatic camera alignment can be used for layer alignment.

[0043] Figure 1BAn example of the second patterned conductive layer 104 viewed from above is illustrated. For simplicity, Figure 1B Only the substrate 100 and the second patterned conductive layer 104 are shown. It can be seen that the shape of the second patterned conductive layer 104 can have a free form or a free shape. The second patterned conductive layer 104 can have a stripe or a strip shape, and its thickness is greater than at least one layer of the layers of the layered structure. The second patterned conductive layer 104 may have at least one arc-shaped edge and / or at least one sharp edge with an acute angle. The width of the second patterned conductive layer 104 may be constant, or it may vary in the longitudinal direction. The second patterned conductive layer 104 may have branches or it may be branchless. In this way, the second patterned conductive layer 104 forms a three-dimensional structure. Additionally, there may be multiple second patterned conductive layers 104 ( Figure 1B Only one second patterned conductive layer 104 is shown).

[0044] Figure 2A and 2B An example is shown where there are more than one device 150, 150' on one substrate 100. The layered structure itself is similar to Figure 1A and 1B The same or similar in the. Different devices 150, 150' can have poles P(1)+, P(1)- and P(2)+, which form different contact electrode pairs P(1)+, P(1)- and P(2)+. The poles P(1)+, P(1)- and P(2)+ can be input or output of electrical signals. For example, the contact electrode P(1)- can be common and it can be coupled to ground. Figure 2A In the embodiment of the present invention, the poles P(1)+, P(1)- and P(2)+ are coupled to a circuit CIRCUIT 1 (circuit 1). In this case, both devices 150 and 150' operate in a similar manner. That is, both devices 150 and 150' input signals to CIRCUIT 1 or both receive signals from CIRCUIT 1. Note that the first conductive layer 102 is discontinuous between the poles P(1) and P(2). The discontinuity results in electrical isolation.

[0045] exist Figure 2B, poles P(1)+ and P(2)+ may be coupled to different circuits, CIRCUIT 1, CIRCUIT 2 (Circuit 2). In this case, both devices 150, 150' may operate in different ways. That is, device 150 may input a signal to CIRCUIT 1, and device 150' may then be inactive. Device 150' may input a signal to CIRCUIT 2, and device 150 may then be inactive. Device 150 may input a signal to CIRCUIT 1, and device 150' may input a signal to CIRCUIT 2. Alternatively, device 150 may receive a signal from CIRCUIT 1, and device 150' may then be inactive. Device 150' may receive a signal from CIRCUIT 2, and device 150 may then be inactive. Device 150 may receive a signal from CIRCUIT 1, and device 150' may then be inactive. Device 150 may receive a signal from CIRCUIT 2. Because the layered structure does not restrict the coupling between multiple structures, the structures illustrated in FIG. 1 can generally be coupled in series, in parallel, or in a backplane.

[0046] Fabrication of patterned structures for electronics / organic electronics (e.g., OPV, thin-film-PV, and OLED) with full coverage of thin film layers (S) with printed busbar electrodes enables true design freedom. The following are examples of components that can utilize layered structures:

[0047] - Organic / Polymer Light Emitting Diodes (OLED)

[0048] -Organic Solar Cells (Organic Photovoltaics) OSC / OPV

[0049] -Perovskite solar cells

[0050] - Solar concentrators or similar

[0051] -Dye-sensitized solar cells (DSSC, DSC and DYSC)

[0052] - Limited-mode thin-film-PV, which also includes other structures besides OPV, perovskite cells and DSSC

[0053] - Photodetector (= photodiode)

[0054] - Light emitting cells, such as organic / polymer LEC / LEEC.

[0055] Fabrication of custom-shaped 2D features with unrestricted design to any 2D shape using materials that are invisible to the registration camera and / or difficult to print in patterns with high dimensional accuracy. Application areas could be, for example, custom-shaped OPVs, custom-shaped thin-film PVs, custom-shaped perovskites, custom-shaped OLEDs, or the like.

[0056] Figure 3 3 is a flow chart of the measurement method. In step 300, the first patterned conductive layer 102 is formed in a manner that contacts the layered structure 150 of the substrate 100. In step 302, the second patterned conductive layer 104 is formed on the first patterned conductive layer 102 and contacts the first patterned conductive layer 102. In step 304, an active layer structure 110A is formed on the first conductive layer 102 and the second patterned conductive layer 104 and contacts the first conductive layer 102, and the second patterned conductive layer 104 is thicker than the operational active layer structure 110A so as to extend across the operational active layer structure 110A.

[0057] The method allows the use of materials that are i) invisible to the registration camera, ii) difficult to print with a high dimensional accuracy pattern, and iii) discharge static electricity through at least one conductive layer. This means that custom-shaped 2D features with unrestricted design to any 2D shape are possible, which can provide real design freedom. Additionally, the use of this processing method can be traced back to the custom features that can protect these processing stages. That is, the product can be visually distinguished from prior art products.

[0058] It is obvious to a person skilled in the art that, as technology advances, the inventive concept can be implemented in various ways.The invention and its embodiments are not limited to the example embodiments described above but may vary within the scope of the claims.

Claims

1. A layering device, comprising: substrate, a first conductive layer on and in contact with the substrate, a second patterned conductive layer in contact with the first conductive layer, wherein the second patterned conductive layer is thicker than any other layer alone and is in electrical contact with the first conductive layer, The third conductive layer, A fourth conductive layer electrically insulated from the first conductive layer, the second patterned conductive layer and the third conductive layer, characterized in that: an operatively active layer structure between the first conductive layer and the fourth conductive layer comprising at least one unpatterned layer; and The second patterned conductive layer is configured to extend across the operational active layer structure and pass through and penetrate the at least one non-patterned layer of the operational active layer structure based on the height variation, thickness and roughness of the second patterned conductive layer so as to have electrical contact with the third conductive layer, wherein the height variation and thickness are achieved by a wet process and in a bottom-up manner, and the thickness is thicker than the operational active layer structure.

2. The device according to claim 1, characterized in that The operational active layer structure includes a non-patterned non-conductive layer and / or at least one intermediate layer, and the height variation at the top portion of the second patterned conductive layer is configured to be greater than the maximum thickness of at least one of the at least one intermediate layer, the active layer and / or the at least one non-patterned non-conductive layer.

3. The device according to claim 2, characterized in that The maximum thickness of the second patterned conductive layer is configured to be in the range of 0.1 μm to 20 μm, and the maximum thickness of the non-patterned non-conductive layer is configured to be in the range of 1 nm to 200 nm.

4. The device according to claim 2, characterized in that The intermediate layer of the operationally active layer structure (110A) is configured to have a lower conductivity than the patterned conductive layer.

5. The device according to claim 1, characterized in that The second patterned conductive layer is printed or etched to have a desired height variation at a top portion.

6. The device according to claim 1, characterized in that The second patterned conductive layer is configured to penetrate each of the non-patterned layers.

7. The device according to claim 1, characterized in that The active layer is configured to have a lower conductivity than the second patterned conductive layer.

8. The device according to claim 1, characterized in that The fourth conductive layer is configured to include at least one conductive sublayer.

9. The device according to claim 1, characterized in that The second patterned conductive layer is thicker than the operationally active layer structure, and a top portion of the second patterned conductive layer is configured to extend across the operationally active layer structure.

10. A method for manufacturing a layered device, the method comprising: forming a first conductive layer in contact with the layered structure of the substrate; forming a second patterned conductive layer by printing the second patterned conductive layer on the first conductive layer and in contact with the first conductive layer; An operational active layer structure is formed on the first conductive layer and contacts the first conductive layer. Based on the height variation, thickness and roughness of the second patterned conductive layer, the second patterned conductive layer extends across the operational active layer structure and passes through and penetrates at least one non-patterned layer of the operational active layer structure so as to have electrical contact with the third conductive layer. The height variation and thickness are achieved by a wet process and in a bottom-up manner, and the thickness is thicker than the operational active layer structure.

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