Coil assembly

Abstract

The present invention provides a coil component, which includes: a main body, including a coil and an encapsulant encapsulating the coil; and an external electrode, which is arranged on the outer surface of the main body, wherein the core center portion of the coil is filled with the encapsulant, the coil includes a plurality of coil patterns connected to each other through vias, the plurality of coil patterns have a stacking structure in which the plurality of coil patterns are stacked along one direction, and the external electrodes include a first external electrode, a second external electrode and a third external electrode arranged to be spaced apart from each other.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2018-0058708 filed on May 24, 2018 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a coil assembly, and more particularly, to a multi-terminal power inductor. Background Art

[0003] Recently, the demand for power inductors suitable for high current and having high efficiency, high performance, small size and small thickness has increased. In addition, the demand for special power inductors has also increased. Among such power inductors, a multi-terminal power inductor that can simultaneously realize multiple inductances in a single chip is required. Summary of the invention

[0004] An aspect of the present disclosure may provide a coil component that may simultaneously implement a plurality of inductors in a single sheet.

[0005] According to one aspect of the present disclosure, a coil component may include: a main body, including a coil and an encapsulant encapsulating the coil; and an external electrode, arranged on an outer surface of the main body, wherein a core central portion of the coil is filled with the encapsulant, the coil includes a plurality of coil patterns electrically connected to each other through vias, the plurality of coil patterns having a stacking structure in which the plurality of coil patterns are stacked along one direction, and the external electrodes include a first external electrode, a second external electrode, and a third external electrode arranged to be spaced apart from each other.

[0006] The plurality of coil patterns may include a first coil pattern directly connected to the first external electrode, a second coil pattern directly connected to the second external electrode, and a third coil pattern directly connected to the third external electrode.

[0007] At least one coil pattern among the first to third coil patterns includes a plurality of sub-coil patterns and has a stack structure in which the plurality of sub-coil patterns are connected to each other through the via holes.

[0008] Both ends of at least one of the multiple sub-coil patterns may be connected to the via hole, or one end of the at least one sub-coil pattern may be connected to the via hole, and the other end of the at least one sub-coil pattern may be connected to one of the first to third external electrodes.

[0009] The body may further include a supporting member contacting the plurality of coil patterns.

[0010] The support member may include a through hole, and the through hole may coincide with a core center portion of the coil.

[0011] The external electrode may further include a dummy electrode which is not directly connected to any of the plurality of coil patterns.

[0012] The dummy electrode may be disposed symmetrically to one of the first to third external electrodes.

[0013] A thin film layer including a via hole may be disposed between the coil patterns adjacent to each other.

[0014] The thin film layer may be an insulating film.

[0015] The thickness of the thin film layer may be smaller than the thickness of the supporting member.

[0016] At least one coil pattern among the plurality of coil patterns may include at least one line width variation portion in which a line width of the at least one coil pattern varies along a winding direction.

[0017] The body may have first and second end surfaces opposite to each other in a length direction, first and second side surfaces opposite to each other in a width direction, and upper and lower surfaces opposite to each other in a thickness direction.

[0018] The one direction along which the plurality of coil patterns are stacked may be a thickness direction of the body.

[0019] The first external electrode and the second external electrode may be disposed on the first end surface and the second end surface, respectively.

[0020] The plurality of coil patterns may further include a fourth coil pattern, and the external electrode may further include a fourth external electrode connected to the fourth coil pattern.

[0021] The fourth coil pattern may include a plurality of sub-coil patterns.

[0022] According to another aspect of the present disclosure, a coil component may include: a main body, including a coil and an encapsulant encapsulating the coil; and three or more external electrodes arranged on the outer surface of the main body, wherein the core central portion of the coil is filled with the encapsulant, the coil includes three or more coil patterns, the three or more coil patterns are stacked in one direction and electrically connected to each other through vias, and each of the three or more coil patterns has a lead-out portion, which is directly connected to a corresponding external electrode among the three or more external electrodes.

[0023] At least one middle coil pattern among the three or more coil patterns may have a stack structure in which a plurality of sub-coil patterns are connected to each other through the via hole.

[0024] At least one middle coil pattern among the three or more coil patterns may include a portion having a line width different from a line width of an uppermost coil pattern or a lowermost coil pattern among the three or more coil patterns. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0026] Figure 1 is a schematic perspective view showing a coil component according to an exemplary embodiment in the present disclosure;

[0027] Figure 2 It is shown Figure 1 An exploded perspective view of a coil;

[0028] FIG. 3A to FIG. 3D yes Figure 1 A plan view of each coil pattern when viewed from the top;

[0029] Figure 4 It is shown Figure 2 An exploded perspective view of a modified example of ;

[0030] Figure 5 It shows that according to Figure 1 A schematic perspective view of a coil assembly according to a modified example of ;

[0031] Figure 6 It is shown Figure 5 An exploded perspective view of a coil;

[0032] FIG. 7A to FIG. 7D yes Figure 5 A plan view of each coil pattern when viewed from the top;

[0033] Figure 8 It shows that according to Figure 1 A schematic perspective view of a coil assembly according to another modified example of ;

[0034] Fig. 9 It is shown Figure 8 An exploded perspective view of a coil;

[0035] FIG. 10A to FIG. 10C yes Figure 8 A plan view of each coil pattern when viewed from the top;

[0036] Fig.11 It shows that according to Figure 1A schematic perspective view of a coil assembly according to another modified example of ;

[0037] Fig.12 It is shown Fig.11 an exploded perspective view of the coil; and

[0038] FIG. 13A to FIG. 13F yes Fig.11 A plan view of each coil pattern when viewed from the top. DETAILED DESCRIPTION

[0039] Hereinafter, a coil component according to an exemplary embodiment of the present disclosure will be described. However, the present disclosure is not necessarily limited thereto.

[0040] Figure 1 is a schematic perspective view showing a coil component according to an exemplary embodiment in the present disclosure,

[0041] Figure 2 It is shown Figure 1 An exploded perspective view of the coil, and FIG. 3A to FIG. 3D yes Figure 1 A plan view of each coil pattern when viewed from the top.

[0042] Reference Figures 1 to 3D , a coil component 100 according to an exemplary embodiment in the present disclosure may include a body 1 and first to third external electrodes 21 to 23 disposed on an outer surface of the body and disposed to be spaced apart from each other.

[0043] The main body 1 may form the appearance of the coil component 100, and may have an upper surface and a lower surface opposite to each other in the thickness direction T, a first end surface and a second end surface opposite to each other in the length direction L, and a first side surface and a second side surface opposite to each other in the width direction W, so as to generally have a hexahedral shape.

[0044] The body 1 may include an encapsulant 12. The encapsulant 12 may be any material having magnetic properties, for example, a ferrite or a metal-based soft magnetic material. The ferrite may include any known ferrite, such as Mn-Zn-based ferrite, Ni-Zn-based ferrite, Ni-Zn-Cu-based ferrite, Mn-Mg-based ferrite, Ba-based ferrite, Li-based ferrite, etc. The metal-based soft magnetic material may be an alloy containing one or more selected from the group consisting of Fe, Si, Cr, Al and Ni. For example, the metal-based soft magnetic material may include Fe-Si-B-Cr-based amorphous metal particles, but is not limited thereto. The metal-based soft magnetic material may have a particle diameter of 0.1 μm (or greater) to 20 μm (or less), and may be included in a polymer such as epoxy resin, polyimide, etc. in the form of being dispersed on the polymer.

[0045] The body 1 may include a coil 11, and the encapsulant 12 may encapsulate the coil 11. The coil 11 may have a spiral shape and may have a spiral shape along one direction (eg, Figure 1 As shown in FIG. 1 , a structure in which a plurality of coil patterns are stacked along a thickness direction. The plurality of coil patterns may be electrically connected to each other through vias.

[0046] The plurality of coil patterns may include a first coil pattern 111 directly connected to the first external electrode 21 , a second coil pattern 112 directly connected to the second external electrode 22 , and a third coil pattern 113 directly connected to the third external electrode 23 .

[0047] Reference Figure 1 , a dummy electrode 24 arranged to face the third external electrode 23 connected to the third coil pattern 113 may be included in the coil component 100. The dummy electrode 24 may be an electrode that is not directly connected to the coil pattern, and therefore, when the coil component is used, the dummy electrode 24 is not used as an input terminal or an output terminal. The dummy electrode 24 may be selectively used, and in some cases, the third external electrode 23 may extend from the first side surface to the second side surface without forming a dummy electrode. The dummy electrode 24 may be selectively introduced to balance the appearance of the coil component and stably install the coil component. Therefore, although the dummy electrode 24 may be provided on the outer surface of the body 1, the dummy electrode 24 may not be directly connected to the coil pattern or other external electrodes.

[0048] At the same time, refer to Figures 2 to 3D , unlike the first coil pattern 111 and the second coil pattern 112 each formed as a single coil pattern, the third coil pattern 113 may include a plurality of sub-coil patterns 113a and 113b. In this case, since each of the first coil pattern 111 and the second coil pattern 112 is formed as a single coil pattern, one end of each of the first coil pattern 111 and the second coil pattern 112 may be formed using a lead-out portion for connecting to an external electrode, and the other end thereof may be connected to a via to connect to another coil pattern. On the other hand, in the third coil pattern 113 constructed in a stacked structure by including a plurality of sub-coil patterns stacked in a thickness direction, it is sufficient that only one end of at least one sub-coil pattern is directly connected to the third external electrode 23, and therefore, the other ends of the sub-coil pattern may be constructed to be connected to a via. Therefore, both ends of at least one of the sub-coil patterns may be connected to a via.

[0049] At the same time, if Figures 1 to 3D As shown, the respective coil patterns disposed at the upper and lower portions may be spaced apart from each other by the encapsulant 12 filled in the body 1, or may be spaced apart by a support member 131 having a substrate shape or a thin film layer 132 or 132' having a thin film shape (eg, Figure 4100 ′ shown in the coil component 100 ′ shown in FIG. 1 ), the support member 131 and the thin film layer 132 or 132 ′ may be in contact with the coil pattern.

[0050] Reference Figure 4 , the support member 131 may be disposed at the center of the stacked structure of the plurality of coil patterns, and is used to stably support the plurality of coil patterns. The support member 131 may be used not only to support the plurality of coil patterns, but also to allow the process to be performed more easily when the coil patterns are formed. Therefore, the support member 131 may have any thin plate shape with insulating properties, and may be, for example, any known copper clad laminate (CCL). The support member 131 may include a through hole H formed at the center thereof, and the interior of the through hole may be filled with an encapsulant 12. Since the interior of the through hole H constitutes the core center portion of the coil 11 (i.e., coincides with the core center portion of the coil 11), the core center portion may be filled with an encapsulant 12 having magnetic properties, so that the magnetic permeability of the coil assembly 100' may be increased. In addition, the support member 131 may include a via hole spaced apart from the through hole H, and the via hole may be filled with a conductive material to constitute a via.

[0051] In addition to the support member 131, each of the thin film layers 132 and 132' disposed between the coil patterns adjacent to each other may be an insulating film (e.g., ABF (Ajinomoto build-up film)) having a thickness less than that of the support member 131. Similar to the support member 131, the thin film layer may also include vias, and the coil patterns disposed on the upper and lower surfaces of the thin film layer 132 or the thin film layer 132', respectively, may be connected to each other. The coil pattern may be easily formed using the thin film layer 132 or 132', and the thin film layer 132 or 132' may have a thickness of about 10 μm, so that miniaturization of the coil component may be achieved.

[0052] The coil component may be a three-terminal coil component, and a plurality of inductances may be realized by only one coil component. For example, the inductance C1 of the coil component in the case where the first external electrode (connected to the first coil pattern) is used as an input terminal and the second external electrode (connected to the second coil pattern) is used as an output terminal is greater than the inductance C2 of the coil component in the case where the first external electrode (connected to the first coil pattern) is used as an input terminal and the third external electrode (connected to the third coil pattern) is used as an output terminal, and thus at least two inductances may be realized.

[0053] Figure 5 It shows that according to Figure 1 Schematic perspective view of a coil component 200 according to a modified example. Figure 6 It is shown Figure 5 An exploded perspective view of the coil. FIG. 7A to FIG. 7D yes Figure 5 A plan view of each coil pattern when viewed from the top.

[0054] Figures 5 to 7D The coil component 200 shown in FIG. 1 may be similar to the coil component 200 in terms of the position of the lead-out portion and the position of the external electrode connected to the lead-out portion. Figures 1 to 3D For convenience of explanation, the repeated description between the coil component 100 and the coil component 200 will be omitted.

[0055] In the coil component 200, the lead-out portion of the first coil pattern 2111 and the lead-out portion of the second coil pattern 2112 may be led out to the same outer surface of the body. Figure 5 , the lead-out portion of the first coil pattern 2111 and the lead-out portion of the second coil pattern 2112 may be led out to a first side surface of the outer surface of the body, but is not limited thereto.

[0056] The first external electrode 2210 connected to the first coil pattern 2111 and the second external electrode 2220 connected to the second coil pattern 2112 may be disposed to be spaced apart from each other on the first side surface and may extend to one or more of the upper and lower surfaces of the body.

[0057] The third coil pattern 2113 including a plurality of sub coil patterns 2113 a and 2113 b may be interposed between the first coil pattern 2111 and the second coil pattern 2112 .

[0058] The third external electrode 2230 directly connected to the third coil pattern 2113 may be disposed on a second side surface opposite to the first side surface, and may be connected to a lead-out portion of the third coil pattern 2113 led out to the second side surface.

[0059] The coil component 200 may further include a dummy electrode 2240 disposed on the second side surface on which the third external electrode 2230 is disposed. The dummy electrode 2240 may have the same shape as that of each of the first to third external electrodes 2210 to 2230, and may be formed in a symmetrical structure with the first to third external electrodes 2210 to 2230 to maintain the balance of the coil component 200 and enhance adhesion when the coil component 200 is installed. Figures 7A to 7D , it can be seen that the dummy electrode 2240 is not directly connected to any of the first to third coil patterns 2111 to 2113 .

[0060] Next, Figure 8 It shows that according to Figure 1 A schematic perspective view of a coil assembly 300 according to another modified example, Fig. 9 It is shown Figure 8 An exploded perspective view of the coil, and FIG. 10A to FIG. 10C yes Figure 8A plan view of each coil pattern when viewed from the top.

[0061] Reference Figures 8 to 10C , the coil component 300 may include only three coil patterns 3111, 3112 and 3113. The coil component 300 and Figure 1 The first coil component 100 of the present invention may be different in that the third coil pattern 3113 is configured as a single coil pattern similar to the first coil pattern 3111 and the second coil pattern 3112, and may include components substantially the same as those of the coil component 100. Specifically, the first coil pattern 3111, the second coil pattern 3112, the first external electrode 3210, the second external electrode 3220, the third external electrode 3230, the dummy electrode 3240, and the encapsulant 3212 of the coil component 300 have substantially the same structures as the corresponding components of the coil component 100, respectively.

[0062] Since the third coil pattern 3113 is directly connected to the third external electrode 3230 and is configured as a single coil pattern, the third coil pattern 3113 may not include a separate sub coil pattern.

[0063] The coil component 300 including only three coil patterns may realize a plurality of inductors including an inductor formed by the first coil pattern and the third coil pattern and an inductor formed by the first coil pattern to the third coil pattern.

[0064] Next, Fig.11 It shows that according to Figure 1 A schematic perspective view of a coil assembly 400 according to another modified example, Fig.12 It is shown Fig.11 An exploded perspective view of the coil, and FIG. 13A to FIG. 13F yes Fig.11 A plan view of each coil pattern when viewed from the top.

[0065] Reference Figures 11 to 13F The coil component 400 may include a first coil pattern 4111, a second coil pattern 4112, a third coil pattern 4113, and a fourth coil pattern 4114. Similar to the coil component 100, the first coil pattern 4111, the second coil pattern 4112, the third coil pattern 4113, and the fourth coil pattern 4114 of the coil component 400 may be encapsulated by an encapsulant 4212.

[0066] The third coil pattern 4113 and the fourth coil pattern 4114 may have a structure in which they are respectively stacked on the first coil pattern 4111 and the second coil pattern 4112. The third coil pattern 4113 may have a stacked structure including a first sub-coil pattern 4113a and a second sub-coil pattern 4113b, and the fourth coil pattern 4114 may have a stacked structure including a first sub-coil pattern 4114a and a second sub-coil pattern 4114b.

[0067] The first coil pattern 4111, the second coil pattern 4112, the third coil pattern 4113, and the fourth coil pattern 4114 may be directly connected to the first external electrode 4210, the second external electrode 4220, the third external electrode 4230, and the fourth external electrode 4240, respectively. In this case, since the fourth external electrode 4240 is directly connected to the fourth coil pattern 4114, the fourth external electrode 4240 may not be a dummy electrode and may be an external terminal that contributes to the formation of inductance. For example, when the second external electrode 4220 and the fourth external electrode 4240 are configured as an input terminal and an output terminal, respectively, an inductance formed by the second coil pattern 4112 and the first sub-coil pattern 4114a and the second sub-coil pattern 4114b of the fourth coil pattern may be realized.

[0068] The external electrodes may be appropriately arranged in consideration of the position to which the lead-out portion of the coil pattern is led, and as Fig.11 As shown, the first external electrode 4210 and the second external electrode 4220 may be respectively arranged on the first end surface and the second end surface, and between the first external electrode 4210 and the second external electrode 4220, the third external electrode 4230 and the fourth external electrode 4240 may be arranged to be opposite to each other in the width direction, so that the first external electrode 4210 and the second external electrode 4220 may be constructed to be symmetrical with each other and the third external electrode 4230 and the fourth external electrode 4240 may be constructed to be symmetrical with each other.

[0069] As described above, according to exemplary embodiments in the present disclosure, a coil component that can simultaneously implement a plurality of inductors in one sheet without difficulty in a process may be provided.

[0070] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. A chip coil assembly, comprising: A main body, comprising a coil and an encapsulant encapsulating the coil; as well as an outer electrode, disposed on an outer surface of the body, wherein the core center of the coil is filled with the encapsulant, The coil includes a plurality of coil patterns electrically connected to each other through vias, The plurality of coil patterns have a stacked structure in which the plurality of coil patterns are stacked along one direction, The external electrodes include a first external electrode, a second external electrode, and a third external electrode disposed to be spaced apart from each other, and The plurality of coil patterns include a first coil pattern directly connected to the first external electrode, a second coil pattern directly connected to the second external electrode, and a third coil pattern disposed between the first coil pattern and the second coil pattern and directly connected to the third external electrode, The third coil pattern includes a first portion having a single turn and a second portion having a double turn, and the first portion and the second portion are symmetrical in overall shape.

2. The chip coil assembly according to claim 1, wherein: At least one coil pattern among the first to third coil patterns includes a plurality of sub-coil patterns and has a stack structure in which the plurality of sub-coil patterns are connected to each other through the via holes.

3. The chip coil assembly according to claim 2, wherein: Both ends of at least one of the multiple sub-coil patterns are connected to the via hole, or one end of the at least one sub-coil pattern is connected to the via hole, and the other end of the at least one sub-coil pattern is connected to one of the first to third external electrodes.

4. The chip coil assembly according to claim 1, wherein: The body further includes a supporting member contacting the plurality of coil patterns.

5. The chip coil assembly according to claim 4, wherein: The support member includes a through hole, and the through hole coincides with a core center portion of the coil.

6. The chip coil assembly according to claim 1, wherein: The external electrode further includes a dummy electrode that is not directly connected to any one of the plurality of coil patterns.

7. The chip coil assembly according to claim 6, wherein: The dummy electrode is disposed symmetrically to one of the first to third external electrodes.

8. The chip coil assembly according to claim 1, wherein: A thin film layer including a via hole is disposed between the coil patterns adjacent to each other.

9. The chip coil assembly according to claim 8, wherein: The thin film layer is an insulating film.

10. The chip coil assembly according to claim 8, wherein: The body further includes a support member contacting the plurality of coil patterns, and a thickness of the thin film layer is smaller than a thickness of the support member.

11. The chip coil assembly according to claim 1, wherein: At least one coil pattern among the plurality of coil patterns includes at least one line width variation portion in which a line width of the at least one coil pattern varies along a winding direction.

12. The chip coil assembly according to claim 1, wherein: The body has first and second end surfaces opposite to each other in a length direction of the body, first and second side surfaces opposite to each other in a width direction of the body, and upper and lower surfaces opposite to each other in a thickness direction of the body.

13. The chip coil assembly according to claim 12, wherein: The one direction along which the plurality of coil patterns are stacked is a thickness direction of the body.

14. The chip coil assembly according to claim 12, wherein: The first external electrode and the second external electrode are disposed on the first end surface and the second end surface, respectively.

15. The chip coil assembly according to claim 14, wherein: The third external electrode is disposed between the first external electrode and the second external electrode.

16. The chip coil assembly according to claim 1, wherein: The plurality of coil patterns further include a fourth coil pattern, and the external electrode further includes a fourth external electrode connected to the fourth coil pattern.

17. The chip coil assembly according to claim 16, wherein: The fourth coil pattern includes a plurality of sub-coil patterns.

18. A chip coil assembly, comprising: A main body, comprising a coil and an encapsulant encapsulating the coil; as well as three or more external electrodes, disposed on the outer surface of the body, wherein the core center of the coil is filled with the encapsulant, The coil includes three or more coil patterns that are stacked in one direction and electrically connected to each other through vias, and each of the three or more coil patterns has a lead-out portion directly connected to a corresponding external electrode among the three or more external electrodes, At least one middle coil pattern among the three or more coil patterns includes a first portion having a single turn and a second portion having a double turn, and the first portion and the second portion are symmetrical in overall shape.

19. The chip coil assembly according to claim 18, wherein: At least one middle coil pattern among the three or more coil patterns has a stack structure in which a plurality of sub-coil patterns are connected to each other through the via holes.

20. The chip coil assembly according to claim 18, wherein: At least one middle coil pattern among the three or more coil patterns includes a portion having a line width different from a line width of an uppermost coil pattern or a lowermost coil pattern among the three or more coil patterns.

21. The chip coil assembly according to claim 18, wherein: A line width of the first portion of at least one middle coil pattern among the three or more coil patterns is greater than a line width of an uppermost coil pattern or a lowermost coil pattern among the three or more coil patterns.

Images