Microscopic laser system for chip and substrate alignment and fine leveling

Abstract

The present invention discloses a microscopic laser system for chip and substrate alignment and fine leveling, which solves the problem of how to combine laser precision positioning with a microscopic optical system to achieve bonding precision positioning. The present invention realizes chip and substrate alignment by having coaxial light emitted by a microscopic imaging camera with a coaxial light source respectively reflected by a chip target reflector and a substrate target reflector, and then returning to the microscopic imaging camera for imaging; using the same optical path system through a dual-path laser to form three positioning laser points on three target reflectors on the chip respectively, thereby obtaining the accurate position of the horizontal plane where the chip is located; using the same optical path system through a dual-path laser to form three positioning laser points on three target reflectors on the substrate respectively, thereby obtaining the accurate position of the horizontal plane where the substrate is located, thereby completing the accurate adjustment of the parallelism of the two planes.

Description

Technical Field

[0001] The invention relates to a large-scale integrated circuit device manufacturing equipment, in particular to a microscopic laser system for aligning and finely leveling a chip and a substrate in a bonding process equipment for flip-chip mounting. Background Art

[0002] The chip flip-chip welding equipment is mainly used for the flip-chip welding process of large-scale integrated circuit device manufacturing, completing the direct interconnection and bonding of the chip and the substrate, so that the package has more superior high-frequency, low-latency, and low-crosstalk circuit characteristics, which can effectively improve the reliability of the assembly and interconnection of circuits, components or systems; the flip-chip welding equipment mainly consists of three parts: the first part is a readout circuit substrate placement table set on a marble reference platform, and the readout circuit substrate placement table can be adjusted in the X direction, in the Y direction, and in the θ-axis rotation adjustment perpendicular to the plane formed by the X and Y directions; the second part is a Z-axis lifting arm mechanism set just above the marble reference platform, and a pitch and yaw platform is set at the lower end of the Z-axis lifting arm mechanism, and a chip suction cup is set on the pitch and yaw platform. The main function of the Z-axis lifting arm mechanism is to realize the chip and substrate by pressing down Bonding, before bonding, the chip suction cup and the substrate suction cup are leveled by adjusting the pitch and yaw; the third part is the optical system, which is arranged between the readout circuit substrate placement table and the Z-axis lifting arm mechanism. The optical system is mainly responsible for whether the chip and the substrate are aligned in place, and the parallelism detection of the chip and the substrate bonding; the bonded readout circuit substrate is placed on the XYθ positioning platform, and the bonded chip is adsorbed on the pitch and yaw platforms. By adjusting the position of the XYθ positioning platform, the bonded chip and the readout circuit substrate are aligned in place. By adjusting the pitch and yaw platforms, the readout circuit substrate and the bonded chip meet the bonding parallelism requirements. When the alignment and parallelism are adjusted, the Z-axis lifting arm is pressed down to press and bond the bonded chip and the readout circuit substrate together, thereby completing the chip flip-chip bonding process.

[0003] The existing bonding process equipment is provided with an optical system, in which a microscope system and a laser system are respectively provided; the parallelism between the adsorption suction cup of the bonded chip and the suction cup on which the readout circuit substrate is placed is measured by the laser system in the optical system, and according to the parallelism measurement result of the two suction cups, the pitch and yaw platforms are adjusted to make the parallelism of the two suction cups meet the designed bonding parallelism requirement; then, the pre-bonded chip is adsorbed onto the chip adsorption suction cup, the readout circuit substrate is placed on the readout circuit substrate suction cup with a reflecting mirror, and the microscope system is started to compare the chip adsorbed on the chip adsorption suction cup with the readout circuit substrate adsorbed on the substrate suction cup. After the alignment is completed, the Z-axis lifting arm is pressed down to bond the chip and the readout circuit substrate together by crimping; the existing optical system only completes the parallelism detection and adjustment of the chip adsorption suction cup and the readout circuit substrate suction cup, but does not measure and adjust the parallelism of the bonded chip and the readout circuit substrate. When the chip is bonded to the substrate, the parallelism between the two bonding bodies cannot be guaranteed to meet the design requirements, which directly affects the working performance of the circuit board after the bonding is completed; in addition, the laser system and the microscope system in the optical system of the existing equipment are respectively and independently arranged, and there is a defect that the optical system occupies a large space.

[0004] The on-site operation steps are: the readout circuit substrate is placed on the XYθ positioning platform below, and the bonded chip is adsorbed on the pitch and yaw platform above, and the chip and the substrate are first accurately aligned; then, the readout circuit substrate is made parallel to the bonded chip by controlling the pitch and yaw platform, and finally, the Z-axis lifting arm presses down the pitch and yaw platform to press and bond the bonded chip and the readout circuit substrate together, thereby completing the flip-chip bonding process of the chip; the existing leveling method is to adjust the parallelism of the two suction cups in an adaptive manner, that is, the chip suction cup is pressed down onto the substrate suction cup in advance for leveling setting, and the parallelism adjustment of the two suction cups is completed according to the memory of the leveling setting. This leveling method that relies solely on memory support often causes the bonding of devices when the parallelism of the two suction cups does not meet the design requirements, resulting in low quality of bonded products and high scrap rate.

[0005] Before bonding, the chip and substrate must be aligned and adjusted to ensure that the pre-bonding positions on the chip and substrate overlap so that the chips can be accurately flip-chip bonded together. Since the existing technology only adjusts the parallelism of the chip suction cup and the substrate suction cup, the parallelism of the chip and substrate themselves is not adjusted, and there is no precise positioning and leveling to the positioning points on the chip and the positioning points on the substrate, how to combine laser precision positioning with the microscopic optical system can reduce the space occupied by the optical system and achieve precise positioning of bonding. This is a practical problem that needs to be solved on site. Summary of the invention

[0006] The invention provides a microscopic laser system for aligning and finely leveling a chip and a substrate, solving the technical problem of how to combine laser fine positioning with a microscopic optical system to achieve bonding fine positioning.

[0007] The present invention solves the above technical problems through the following technical solutions:

[0008] A bonding process equipment for flip-chip mounting, comprising a marble reference platform, a Y-direction moving guide rail mounting base is arranged on the marble reference platform, a Y-direction moving platform guide rail of a positioning platform is installed on the Y-direction moving guide rail mounting base, a Y-direction moving slider of the positioning platform is arranged on the Y-direction moving platform guide rail of the positioning platform, an X-direction moving guide rail of the positioning platform is arranged on the top surface of the Y-direction moving slider of the positioning platform, an X-direction moving slider of the positioning platform is arranged on the X-direction moving guide rail of the positioning platform, the X-direction moving slider of the positioning platform is movably arranged on the X-direction moving guide rail of the positioning platform through the bottom surface of the rear end, an air-floating support pad is arranged on the bottom surface of the front end of the X-direction moving slider of the positioning platform, the air-floating support pad is movably arranged on the top surface of the marble reference platform, a θ rotating platform and a rotating driving motor are respectively arranged on the top surface of the X-direction moving slider of the positioning platform, and a rotating driving motor is arranged on the top surface of the θ rotating platform. A readout circuit substrate placing table is arranged on the surface, a substrate suction cup with a reflecting mirror is arranged on the readout circuit substrate placing table, a readout circuit substrate is placed on the substrate suction cup with a reflecting mirror, and substrate parallelism adjustment marking points are arranged on the readout circuit substrate; a Z-direction lifting arm is arranged directly above the θ rotating platform, a pitch and yaw adjustment motor and a pitch and yaw adjustment platform are respectively arranged at the bottom end of the Z-direction lifting arm, a chip adsorption table is fixedly arranged on the lower bottom surface of the pitch and yaw adjustment platform, a chip suction cup with a reflecting mirror is adsorbed on the lower bottom surface of the chip adsorption table, a chip is adsorbed on the lower bottom surface of the chip suction cup with a reflecting mirror, and chip parallelism adjustment marking points are arranged on the lower bottom surface of the chip; an XY direction moving platform of the optical system is movably arranged between the readout circuit substrate placing table and the Z-direction lifting arm, and an optical system operation box is suspended on the XY direction moving platform of the optical system.

[0009] A collimated light path for leveling a chip adsorption suction cup and a readout circuit substrate suction cup is provided in the optical system operation box, and the collimated light path is composed of a red LED point light source, a blue LED point light source, a semi-transparent and semi-reflective mirror, a collimating objective lens, a reflector, a target image generation board, a filter, a substrate suction cup with a reflective mirror surface, a chip suction cup with a reflective mirror surface and a collimated imaging camera. The icon generated by the light of the red LED point light source irradiating the target image generation board is generated after being reflected by the chip suction cup with the reflective mirror surface, and a chip suction cup position state image A is generated in the collimated imaging camera. The icon generated by the light of the blue LED point light source irradiating the target image generation board is generated after being reflected by the substrate suction cup with the reflective mirror surface, and a substrate suction cup position state image B is generated in the collimated imaging camera.

[0010] A bonding method for flip-chip mounting, characterized by the following steps: a microscopic optical path for aligning a chip with a substrate is arranged in an optical system operating box, the microscopic optical path is composed of a semi-transparent and semi-reflective mirror, a collimating objective lens, a reflector, a focusing objective lens, a pentagonal prism and a microscopic imaging camera with a light source; light from the microscopic imaging camera with a light source is irradiated onto a reflective surface at a marking point on the chip, and the reflected light forms an image C of the chip marking point in the microscopic imaging camera; at the same time, light from the microscopic imaging camera with a light source is irradiated onto a reflective surface at a marking point on the substrate, and the reflected light forms an image D of the substrate marking point in the microscopic imaging camera; if the chip marking point image C does not overlap with the substrate marking point image D, the readout circuit substrate placement table is adjusted until the chip marking point image C overlaps with the substrate marking point image D, thereby completing the alignment of the chip with the readout circuit substrate.

[0011] A collimated optical path structure for adjusting the parallelism between a chip suction cup and a substrate suction cup comprises an optical system operating box, a chip suction cup with a reflecting mirror surface and a substrate suction cup with a reflecting mirror surface, a red LED point light source is arranged in the optical system operating box, a first semi-transparent and semi-reflective reflecting mirror is arranged on the right side of the red LED point light source, a first collimating objective lens is arranged on the right side of the first semi-transparent and semi-reflective reflecting mirror, a target image generating plate is arranged on the right side of the first collimating objective lens, a first reflecting mirror which is at an angle of 45° to a horizontal plane is arranged on the right side of the target image generating plate, a second semi-transparent and semi-reflective reflecting mirror is arranged directly below the first reflecting mirror, a second reflecting mirror which is at an angle of 135° to a horizontal plane is arranged on the right side of the second semi-transparent and semi-reflective reflecting mirror, a first filter is arranged directly above the second reflecting mirror, and a first filter is arranged on the first A chip suction cup with a reflective mirror is arranged directly above the filter, a third reflector is arranged at an angle of 135° to the horizontal plane on the left side of the second semi-transparent and semi-reflective reflector, a fourth reflector is arranged at an angle of 135° to the horizontal plane directly below the third reflector, a second collimating objective lens is arranged on the left side of the fourth reflector, and a collimating imaging camera is arranged on the left side of the second collimating objective lens; a blue LED point light source is arranged directly below the first semi-transparent and semi-reflective reflector, a fifth reflector is arranged at an angle of 45° to the horizontal plane directly below the second semi-transparent and semi-reflective reflector, a sixth reflector is arranged at an angle of 45° to the horizontal plane on the right side of the fifth reflector, a second filter is arranged directly below the sixth reflector, and a substrate suction cup with a reflective mirror is arranged directly below the second filter.

[0012] In the collimated imaging camera, a target generated image A is generated after the target image is reflected by the chip suction cup with a reflective mirror surface, and a target generated image B is generated after the target image is reflected by the substrate suction cup with a reflective mirror surface.

[0013] A method for adjusting the parallelism between a chip chuck and a substrate chuck using a collimated light path, characterized by the following steps:

[0014] The red light emitted by the red LED point light source is sequentially transmitted through the first semi-transparent and semi-reflective mirror and the first collimating objective lens, and a target image red light is formed on the target image generation plate. The formed target image red light is sequentially reflected by the first reflector, the second semi-transparent and semi-reflective reflector, and the second reflector, and filtered by the first filter, and then irradiated onto the reflective mirror surface of the chip sucker with a reflective mirror surface. After reflection by the reflective mirror surface, it is sequentially filtered by the first filter, reflected by the second reflector, transmitted by the second semi-transparent and semi-reflective mirror, reflected by the third reflector, reflected by the fourth reflector, and transmitted by the second collimating objective lens, and then a target image is generated in the collimating imaging camera, and a target generation image A after reflection by the chip sucker with a reflective mirror surface is generated;

[0015] The blue light emitted by the blue LED point light source is reflected by the first semi-transparent and semi-reflective mirror and transmitted by the first collimating objective lens in sequence, and then a target image blue light is formed on the target image generation plate. The formed target image blue light is reflected by the first reflector in sequence, transmitted by the second semi-transparent and semi-reflective mirror, reflected by the fifth reflector, and reflected by the sixth reflector in sequence, and filtered by the second filter, and then irradiated onto the reflective mirror surface of the substrate suction cup with a reflective mirror surface, and then reflected by the reflective mirror surface of the substrate suction cup, and then filtered by the second filter, reflected by the sixth reflector, reflected by the fifth reflector, reflected by the second semi-transparent and semi-reflective mirror, reflected by the third reflector, reflected by the fourth reflector, and transmitted by the second collimating objective lens in sequence, and then a target image is generated in the collimating imaging camera, and a target generation image B after reflection by the substrate suction cup with a reflective mirror surface is generated;

[0016] If the target generated image A and the target generated image B do not overlap, adjust the pitch and yaw adjustment platform to change the posture of the chip suction cup with a reflective mirror, until the target generated image A after the target image is reflected by the chip suction cup with a reflective mirror and the target generated image B after the target image is reflected by the substrate suction cup with a reflective mirror overlap, thus completing the adjustment operation of the parallelism of the chip suction cup and the substrate suction cup.

[0017] A microscopic laser system for aligning and finely leveling a chip and a substrate comprises a microscopic imaging camera with a coaxial light source, a dual-path laser, a chip and a readout circuit substrate, wherein the microscopic imaging camera with the coaxial light source is arranged in an optical system operating box, a first focusing objective lens is arranged on the right side of the microscopic imaging camera with the coaxial light source, a third collimating objective lens is arranged on the right side of the first focusing objective lens, a third semi-transparent semi-reflecting mirror is arranged on the right side of the third collimating objective lens and forms an angle of 45° with the horizontal plane, and a fourth semi-transparent semi-reflecting mirror is arranged on the right side of the third semi-transparent semi-reflecting mirror and forms an angle of 135° with the horizontal plane. A transmitting mirror, a seventh reflecting mirror is arranged on the right side of the fourth semi-transparent and semi-reflecting transmitting mirror which forms an angle of 135° with the horizontal plane, a second focusing objective lens is arranged directly above the seventh reflecting mirror, a chip is arranged directly above the second focusing objective lens, a chip target reflecting mirror is arranged on the chip, an eighth reflecting mirror is arranged directly below the third semi-transparent and semi-reflecting reflecting mirror, a fifth semi-transparent and semi-reflecting transmitting mirror is arranged on the right side of the eighth reflecting mirror, a pentagonal prism is arranged on the right side of the fifth semi-transparent and semi-reflecting transmitting mirror, a third focusing objective lens is arranged below the pentagonal prism, and a readout circuit substrate is arranged directly below the third focusing objective lens.

[0018] A right-angle prism is arranged between the fourth semi-transmissive and semi-reflective mirror and the fifth semi-transmissive and semi-reflective mirror, and a dual-path laser is arranged on the right side of the right-angle prism.

[0019] An operating method of a microscopic laser system for aligning and finely leveling a chip and a substrate, characterized by the following steps:

[0020] By moving the optical system operation box suspended on the XY direction moving platform of the optical system, the reflector image C of the first chip target on the chip and the reflector image D of the first substrate target on the substrate are imaged in the microscopic imaging camera with a coaxial light source. The specific process is as follows:

[0021] The coaxial light source light in the microscopic imaging camera with a coaxial light source is focused by the first focusing objective lens and transmitted by the third collimating objective lens;

[0022] A portion of the light is sequentially transmitted through the third semi-transparent and semi-reflective mirror, the fourth semi-transparent and semi-reflective mirror, the seventh mirror, and the second focusing lens, and then irradiates the chip target mirror disposed on the chip. The light reflected from the chip target mirror is sequentially transmitted through the second focusing lens, the seventh mirror, the fourth semi-transparent and semi-reflective mirror, the third semi-transparent and semi-reflective mirror, the third collimating lens, and the first focusing lens, and then forms a mirror image C of the first chip target in a microscopic imaging camera with a coaxial light source.

[0023] Another part of the light is sequentially reflected by the third semi-transparent and semi-reflective mirror, reflected by the eighth reflective mirror, transmitted by the fifth semi-transparent and semi-reflective mirror, refracted by the penta-prism, and focused by the third focusing objective lens, and irradiates onto the substrate target reflector disposed on the readout circuit substrate. After being reflected by the substrate target reflector, the light is sequentially transmitted by the third focusing objective lens, refracted by the penta-prism, transmitted by the fifth semi-transparent and semi-reflective mirror, reflected by the eighth reflective mirror, reflected by the third semi-transparent and semi-reflective mirror, transmitted by the third collimating objective lens, and transmitted by the first focusing objective lens, and forms a reflector image D of the first substrate target in a microscopic imaging camera with a coaxial light source.

[0024] Turn on the dual-path laser, and the first laser light on the dual-path laser is reflected by the upper reflective surface of the right-angle prism, and then reflected by the fourth semi-transparent and semi-reflective mirror, the seventh reflective mirror, and the second focusing lens, and then irradiates the chip target reflector set on the chip to form a laser spot on the first chip target reflector image C on the chip;

[0025] The second laser beam on the dual-path laser is reflected by the lower reflective surface of the right-angle prism, and then sequentially reflected by the fifth semi-transparent and semi-reflective mirror, refracted by the pentagonal prism, and focused by the third focusing lens, and irradiated onto the substrate target reflector provided on the readout circuit substrate to form a laser spot on the first substrate target reflector image D;

[0026] Move the optical system operation box suspended on the optical system XY direction moving platform again, and repeat the steps from the first step to the fourth step to obtain the laser point on the second chip target reflector image E on the chip and the corresponding second substrate target reflector image F on the substrate;

[0027] Continue to move the optical system suspended on the XY direction moving platform of the optical system, and repeat the steps from the first step to the fourth step to obtain the laser point on the third chip target reflector image G on the chip and the corresponding third substrate target reflector image H on the substrate;

[0028] The laser points on the first chip target reflector image C, the laser points on the second chip target reflector image E and the laser points on the third chip target reflector image G are made into a plane to obtain a chip horizontal state plane; the laser points on the first substrate target reflector image D, the laser points on the second substrate target reflector image F and the laser points on the third substrate target reflector image H are made into a plane to obtain a substrate horizontal state plane;

[0029] Calculate the parallelism angle between the horizontal plane of the chip and the horizontal plane of the substrate. If the parallelism angle meets the design requirements, the fine leveling of the chip and the substrate is completed. If the parallelism angle is greater than the design requirements, adjust the pitch and yaw adjustment platform. After adjustment, repeat the first step to the seventh step until the parallelism angle meets the design requirements.

[0030] The present invention realizes the alignment of the chip and the substrate by having the coaxial light emitted by a microscopic imaging camera with a coaxial light source respectively reflected by a chip target reflector and a substrate target reflector and then returned to the microscopic imaging camera for imaging; using the same optical path system to form three positioning laser points on the three target reflectors on the chip through a dual-path laser, thereby obtaining the accurate position of the horizontal plane where the chip is located; using the same optical path system to form three positioning laser points on the three target reflectors on the substrate through a dual-path laser, thereby obtaining the accurate position of the horizontal plane where the substrate is located; calculating the angle formed by the two planes, and finally obtaining the parallelism angle of the two planes; comparing the obtained parallelism angle with the design requirement index, thereby completing the accurate adjustment of the parallelism of the two planes. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the laser microscope two-in-one optical path structure of the present invention;

[0032] Figure 2 It is a schematic diagram of the microscopic optical path structure of the present invention;

[0033] Figure 3 It is a schematic diagram of the laser optical path structure of the present invention;

[0034] Figure 4 It is a structural diagram of a collimated optical path for adjusting the parallelism between a chip suction cup and a substrate suction cup of the present invention;

[0035] Figure 5 It is a schematic diagram of the overall structure of the bonding process equipment for chip flipping of the present invention;

[0036] Figure 6 It is a schematic structural diagram of the XYθ platform on the marble reference platform 21 of the present invention;

[0037] Figure 7 It is a structural schematic diagram of the optical system operating platform of the present invention;

[0038] Figure 8 It is a structural schematic diagram of the Z-direction lifting arm mechanism of the present invention. DETAILED DESCRIPTION

[0039] The present invention is described in detail below in conjunction with the accompanying drawings:

[0040] A bonding process equipment for flip-chip bonding, comprising a marble reference platform 21, a Y-direction moving guide rail mounting base 9 is arranged on the marble reference platform 21, a positioning platform Y-direction moving platform guide rail 8 is installed on the Y-direction moving guide rail mounting base 9, a positioning platform Y-direction moving slider 7 is arranged on the positioning platform Y-direction moving platform guide rail 8, a positioning platform X-direction moving guide rail 6 is arranged on the top surface of the positioning platform Y-direction moving slider 7, a positioning platform X-direction moving slider 22 is arranged on the positioning platform X-direction moving slider 6, the positioning platform X-direction moving slider 22 is movably arranged on the positioning platform X-direction moving guide rail 6 through the bottom surface of its rear side end, an air floating support pad 10 is arranged on the bottom surface of the front side end of the positioning platform X-direction moving slider 22, the air floating support pad 10 is movably arranged on the top surface of the marble reference platform 21, a θ rotating platform 3 and a rotating drive motor 11 are respectively arranged on the top surface of the positioning platform X-direction moving slider 22, and a A readout circuit substrate placement table 1 is provided on the readout circuit substrate placement table 1, a substrate suction cup 2 with a reflective mirror is provided, a readout circuit substrate 4 is placed on the substrate suction cup 2 with a reflective mirror, and a substrate parallelism adjustment mark point 5 is provided on the readout circuit substrate 4; a Z-direction lifting arm 17 is provided just above the θ rotating platform 3, a pitch and yaw adjustment motor 18 and a pitch and yaw adjustment platform 12 are provided at the bottom end of the Z-direction lifting arm 17, and a fixed plate 18 is provided on the lower bottom surface of the pitch and yaw adjustment platform 12. A chip adsorption platform 13 is fixedly arranged, a chip suction cup 14 with a reflecting mirror is adsorbed on the lower bottom surface of the chip adsorption platform 13, a chip 15 is adsorbed on the lower bottom surface of the chip suction cup 14 with a reflecting mirror, and a chip parallelism adjustment mark point 16 is arranged on the lower bottom surface of the chip 15; an XY direction moving platform 19 of the optical system is movably arranged between the readout circuit substrate placement platform 1 and the Z-direction lifting arm 17, and an optical system operation box 20 is suspended on the optical system XY direction moving platform 19.

[0041] A collimated light path for leveling the chip adsorption chuck and the readout circuit substrate chuck is provided in the optical system operation box 20. The collimated light path is composed of a red LED point light source, a blue LED point light source, a semi-transparent and semi-reflective mirror, a collimated objective lens, a reflector, a target image generation board, a filter, a substrate chuck 2 with a reflective mirror, a chip chuck 14 with a reflective mirror, and a collimated imaging camera. The icon generated by the light of the red LED point light source irradiating the target image generation board is reflected by the chip chuck 14 with a reflective mirror. In the collimated imaging camera, a chip suction cup position state image A is generated. The icon generated by the target image generation board irradiated by the light of the blue LED point light source is reflected by the substrate suction cup 2 with a reflective mirror. In the collimated imaging camera, a substrate suction cup position state image B is generated. The present invention uses a collimated light path to respectively image the reflection of the same target image on the chip suction cup and the reflection of the substrate suction cup. By comparing whether the two images overlap, the pitch and yaw of the chip suction cup are adjusted to achieve parallelism of the two suction cups.

[0042] A bonding method for flip-chip bonding, characterized by the following steps: a microscopic optical path for aligning a chip with a substrate is arranged in an optical system operating box 20, the microscopic optical path being composed of a semi-transparent and semi-reflective mirror, a collimating objective lens, a reflector, a focusing objective lens, a pentagonal prism and a microscopic imaging camera with a light source; light from the microscopic imaging camera with a light source is irradiated onto a reflective surface at a marking point on the chip, and the reflected light forms an image C of the chip marking point in the microscopic imaging camera; at the same time, light from the microscopic imaging camera with a light source is irradiated onto a reflective surface at a marking point on the substrate, and the reflected light forms an image C of the chip marking point in the microscopic imaging camera. The chip marking point image D is imaged in the microscopic imaging camera by light. If the chip marking point image C does not overlap with the substrate marking point image D, the readout circuit substrate placement table 1 is adjusted until the chip marking point image C overlaps with the substrate marking point image D, thereby completing the alignment of the chip and the readout circuit substrate. The present invention combines the light source in the microscopic imaging camera, and illuminates the chip marking point and the substrate marking point with light emitted from the microscopic imaging camera, so that the two marking points are reflected and imaged in the microscopic imaging camera, and the accurate alignment of the chip and the substrate is achieved by adjusting the overlap of the reflected images of the two marking points.

[0043] A collimated optical path structure for adjusting the parallelism between a chip suction cup and a substrate suction cup, comprising an optical system operation box 20, a chip suction cup 14 with a reflective mirror surface, and a substrate suction cup 2 with a reflective mirror surface, wherein a red LED point light source 23 is arranged in the optical system operation box 20, a first semi-transparent semi-reflective mirror 24 is arranged on the right side of the red LED point light source 23, a first collimating objective lens 25 is arranged on the right side of the first semi-transparent semi-reflective mirror 24, a target image generating plate 26 is arranged on the right side of the first collimating objective lens 25, a first reflector 27 which is at an angle of 45° to a horizontal plane is arranged on the right side of the target image generating plate 26, a second semi-transparent semi-reflective mirror 28 is arranged directly below the first reflector 27, a second reflector 29 which is at an angle of 135° to a horizontal plane is arranged on the right side of the second semi-transparent semi-reflective mirror 28, a first filter 30 is arranged directly above the second reflector 29, and a first filter 30 is arranged on the first filter 29. A chip suction cup 14 with a reflective mirror surface is arranged directly above the optical sheet 30, a third reflector 31 with an angle of 135° to the horizontal plane is arranged on the left side of the second semi-transparent and semi-reflective reflector 28, a fourth reflector 32 with an angle of 135° to the horizontal plane is arranged directly below the third reflector 31, a second collimating objective lens 33 is arranged on the left side of the fourth reflector 32, and a collimating imaging camera 34 is arranged on the left side of the second collimating objective lens 33; a blue LED point light source 35 is arranged directly below the first semi-transparent and semi-reflective reflector 24, a fifth reflector 36 with an angle of 45° to the horizontal plane is arranged directly below the second semi-transparent and semi-reflective reflector 28, a sixth reflector 37 with an angle of 45° to the horizontal plane is arranged on the right side of the fifth reflector 36, a second filter 38 is arranged directly below the sixth reflector 37, and a substrate suction cup 2 with a reflective mirror surface is arranged directly below the second filter 38.

[0044] In the collimating imaging camera 34, a target generated image A is generated after the target image is reflected by the chip suction cup 14 with a reflective mirror, and a target generated image B is generated after the target image is reflected by the substrate suction cup 2 with a reflective mirror.

[0045] A method for adjusting the parallelism between a chip chuck and a substrate chuck using a collimated light path, characterized by the following steps:

[0046] The red light emitted by the red LED point light source 23 is sequentially transmitted through the first semi-transparent and semi-reflective mirror 24 and the first collimating objective lens 25, and a target image red light is formed on the target image generation plate 26. The formed target image red light is sequentially reflected by the first reflector 27, the second semi-transparent and semi-reflective mirror 28, and the second reflector 29, and filtered by the first filter 30, and then irradiated onto the reflective mirror surface of the chip suction cup 14 with a reflective mirror surface. After reflection by the reflective mirror surface, it is sequentially filtered by the first filter 30, reflected by the second reflector 29, transmitted by the second semi-transparent and semi-reflective mirror 28, reflected by the third reflector 31, reflected by the fourth reflector 32, and transmitted by the second collimating objective lens 33, and then a target image A is generated in the collimating imaging camera 34 after being reflected by the chip suction cup 14 with a reflective mirror surface.

[0047] The blue light emitted by the blue LED point light source 35 is reflected by the first semi-transparent and semi-reflective mirror 24 and transmitted by the first collimating objective lens 25 in sequence, and then a target image blue light is formed on the target image generation plate 26. The formed target image blue light is reflected by the first reflector 27 in sequence, transmitted by the second semi-transparent and semi-reflective mirror 28, reflected by the fifth reflector 36, and reflected by the sixth reflector 37 in sequence, and filtered by the second filter 38, and then irradiated onto the reflective mirror surface of the substrate suction cup 2 with a reflective mirror surface. After being reflected by the reflective mirror surface of the substrate suction cup 2, it is filtered by the second filter 38, reflected by the sixth reflector 37, reflected by the fifth reflector 36, reflected by the second semi-transparent and semi-reflective mirror 28, reflected by the third reflector 31, reflected by the fourth reflector 32, and transmitted by the second collimating objective lens 33 in sequence, and then a target image B is generated in the collimating imaging camera 34 after being reflected by the substrate suction cup 2 with a reflective mirror surface.

[0048] If the target generated image A and the target generated image B do not overlap, adjust the pitch and yaw adjustment platform 12 and change the posture of the chip suction cup 14 with a reflective mirror until the target generated image A after the target image is reflected by the chip suction cup 14 with a reflective mirror overlaps with the target generated image B after the target image is reflected by the substrate suction cup 2 with a reflective mirror, thereby completing the adjustment operation of the parallelism of the chip suction cup and the substrate suction cup.

[0049] A microscopic laser system for aligning and finely leveling a chip and a substrate comprises a microscopic imaging camera 39 with a coaxial light source, a dual-path laser 51, a chip 15 and a readout circuit substrate 4, wherein the microscopic imaging camera 39 with a coaxial light source is arranged in an optical system operating box 20, a first focusing objective lens 40 is arranged on the right side of the microscopic imaging camera 39 with a coaxial light source, a third collimating objective lens 41 is arranged on the right side of the first focusing objective lens 40, a third semi-transparent semi-reflecting mirror 42 is arranged on the right side of the third collimating objective lens 41, and a fourth semi-transparent semi-reflecting mirror 42 is arranged on the right side of the third semi-transparent semi-reflecting mirror 42. 3. A seventh reflector 44 is arranged on the right side of a fourth semi-transparent and semi-reflective mirror 43 which forms an angle of 135° with the horizontal plane, a second focusing objective lens 45 is arranged directly above the seventh reflector 44, a chip 15 is arranged directly above the second focusing objective lens 45, a chip target reflector is arranged on the chip 15, an eighth reflector 46 is arranged directly below the third semi-transparent and semi-reflective mirror 42, a fifth semi-transparent and semi-reflective mirror 47 is arranged on the right side of the eighth reflector 46, a pentagonal prism 48 is arranged on the right side of the fifth semi-transparent and semi-reflective mirror 47, a third focusing objective lens 49 is arranged below the pentagonal prism, and a readout circuit substrate 4 is arranged directly below the third focusing objective lens 49.

[0050] A right-angle prism 50 is disposed between the fourth semi-transmissive mirror 43 and the fifth semi-transmissive mirror 47 , and a dual-path laser 51 is disposed on the right side of the right-angle prism 50 .

[0051] An operating method of a microscopic laser system for aligning and finely leveling a chip and a substrate, characterized by the following steps:

[0052] By moving the optical system operation box 20 suspended on the optical system XY direction moving platform 19, the reflector image C of the first chip target on the chip 15 and the reflector image D of the first substrate target on the substrate are imaged in the microscopic imaging camera 39 with a coaxial light source. The specific process is as follows:

[0053] After the coaxial light source light in the microscopic imaging camera 39 with a coaxial light source is focused by the first focusing lens 40 and transmitted by the third collimating lens 41;

[0054] A portion of the light is sequentially transmitted through the third semi-transparent and semi-reflective mirror 42, the fourth semi-transparent and semi-reflective mirror 43, the seventh mirror 44, and the second focusing lens 45, and then irradiates the chip target mirror disposed on the chip 15. The light reflected on the chip target mirror is sequentially transmitted through the second focusing lens 45, the seventh mirror 44, the fourth semi-transparent and semi-reflective mirror 43, the third semi-transparent and semi-reflective mirror 42, the third collimating lens 41, and the first focusing lens 40, and then forms a mirror image C of the first chip target in the microscope imaging camera 39 with a coaxial light source.

[0055] Another part of the light is sequentially reflected by the third semi-transparent half-reflecting mirror 42, reflected by the eighth reflector 46, transmitted by the fifth semi-transparent half-reflecting mirror 47, refracted by the pentagonal prism 48, focused by the third focusing objective lens 49, and irradiated onto the substrate target reflector provided on the readout circuit substrate 4. After being reflected by the substrate target reflector, it is sequentially transmitted by the third focusing objective lens 49, refracted by the pentagonal prism 48, transmitted by the fifth semi-transparent half-reflecting mirror 47, reflected by the eighth reflector 46, reflected by the third semi-transparent half-reflecting mirror 42, transmitted by the third collimating objective lens 41, and transmitted by the first focusing objective lens 40, thereby forming a reflector image D of the first substrate target in the microscope imaging camera 39 with a coaxial light source.

[0056] The dual-path laser 51 is turned on. The first laser light of the dual-path laser 51 is reflected by the upper reflective surface of the right-angle prism 50, and then sequentially reflected by the fourth semi-transparent and semi-reflective mirror 43, the seventh reflective mirror 44, and the second focusing lens 45, and then irradiates the chip target reflector set on the chip 15 to form a laser spot on the first chip target reflector image C on the chip.

[0057] After being reflected by the lower reflective surface of the right-angle prism 50, the second laser light of the dual-path laser 51 is reflected by the fifth semi-transparent and semi-reflective mirror 47, refracted by the pentagonal prism 48, and focused by the third focusing lens 49, and irradiates the substrate target reflector provided on the readout circuit substrate 4 to form a laser spot on the first substrate target reflector image D;

[0058] Move the optical system operation box 20 suspended on the optical system XY direction moving platform 19 again, and repeat the steps from the first step to the fourth step to obtain the laser point on the second chip target reflector image E on the chip and the corresponding second substrate target reflector image F on the substrate;

[0059] Continue to move the optical system operation box 20 suspended on the optical system XY direction moving platform 19, and repeat the steps from the first step to the fourth step to obtain the laser point on the third chip target reflector image G on the chip and the corresponding third substrate target reflector image H on the substrate;

[0060] The laser points on the first chip target reflector image C, the laser points on the second chip target reflector image E and the laser points on the third chip target reflector image G are made into a plane to obtain a chip horizontal state plane; the laser points on the first substrate target reflector image D, the laser points on the second substrate target reflector image F and the laser points on the third substrate target reflector image H are made into a plane to obtain a substrate horizontal state plane;

[0061] Calculate the parallelism angle between the horizontal plane of the chip and the horizontal plane of the substrate. If the parallelism angle meets the design requirements, the fine leveling of the chip and the substrate is completed. If the parallelism angle is greater than the design requirements, adjust the pitch and yaw adjustment platform 12. After adjustment, repeat the first step to the seventh step until the parallelism angle meets the design requirements.

Claims

1. A microscopic laser system for aligning and finely leveling a chip and a substrate, comprising a microscopic imaging camera (39) with a coaxial light source, a dual-path laser (51), a chip (15) and a readout circuit substrate (4), characterized in that: A microscopic imaging camera (39) with a coaxial light source is arranged in an optical system operating box (20); a first focusing objective lens (40) is arranged on the right side of the microscopic imaging camera (39) with a coaxial light source; a third collimating objective lens (41) is arranged on the right side of the first focusing objective lens (40); a third semi-transparent semi-reflecting mirror (42) is arranged on the right side of the third collimating objective lens (41) and forms an angle of 45° with a horizontal plane; a fourth semi-transparent semi-reflecting mirror (43) is arranged on the right side of the third semi-transparent semi-reflecting mirror (42) and forms an angle of 135° with the horizontal plane; a seventh reflecting mirror (44) is arranged on the right side of the fourth semi-transparent semi-reflecting mirror (43) and forms an angle of 135° with the horizontal plane; and a seventh reflecting mirror (44) is arranged on the right side of the seventh reflecting mirror. A second focusing objective lens (45) is arranged directly above the reflector (44); a chip (15) is arranged directly above the second focusing objective lens (45); a chip target reflector is arranged on the chip (15); an eighth reflector (46) is arranged directly below the third semi-transparent and semi-reflective reflector (42); a fifth semi-transparent and semi-reflective reflector (47) is arranged on the right side of the eighth reflector (46); a pentagonal prism (48) is arranged on the right side of the fifth semi-transparent and semi-reflective reflector (47); a third focusing objective lens (49) is arranged below the pentagonal prism; and a readout circuit substrate (4) is arranged directly below the third focusing objective lens (49); and a substrate target reflector is arranged on the readout circuit substrate (4).

2. A microscopic laser system for chip and substrate alignment and fine leveling as claimed in claim 1, characterized in that: A right-angle prism (50) is arranged between the fourth semi-transparent and semi-reflective mirror (43) and the fifth semi-transparent and semi-reflective mirror (47), and a dual-path laser (51) is arranged on the right side of the right-angle prism (50).

Images