Laser module and laser component

Abstract

An embodiment of the present invention provides a laser module and a laser component. The module includes at least two laser chip modules. Each laser chip module includes: at least one laser chip, at least two conductive substrates, and an insulating substrate. The positive and negative surfaces of the laser chip are respectively bonded to the same ends of different conductive substrates. The other ends of different conductive substrates in the laser chip module are commonly bonded to the same insulating substrate, and the insulating substrates between adjacent laser chip modules are independent of each other. Based on the laser module and the laser component provided by the embodiment of the present invention, the stress generated during the packaging process can be significantly reduced, thereby effectively reducing the stress borne by the light-emitting surface of the laser chip and effectively reducing the possibility of cracks in the laser chip.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor lasers, and particularly to a laser module and a laser component. Background Art

[0002] Due to the small bar pitch, high output power and energy density, the conduction-cooled semiconductor laser stack array product has great application advantages. The general structure is that the chips and the conductive substrates are packaged into an array structure, and this array structure and the heat sink are packaged into a semiconductor laser module through an insulating substrate.

[0003] Currently, the main way to connect the insulating substrate to the heat sink and the semiconductor laser array structure is the independent insulating substrate structure, that is, the positions of the insulating substrate and the conductive substrates in the array structure correspond one by one. During the packaging process, the temperature change causes the heat sink to generate a large deformation, which acts on the insulating substrate. The gap between the insulating substrate and the conductive substrate causes a large tensile stress on the light-emitting surface of the chip, and the risk of crack is relatively high. Summary of the Invention

[0004] In view of this, one of the main purposes of the embodiments of the present invention is to provide a laser module and a laser component. By designing a new structure of the laser chip module, multiple conductive substrates in the same module are bonded to the same insulating substrate, the insulating substrates between different modules are independent of each other, and a stress relief area is designed between the insulating substrates of different modules. In this way, the stress generated during the packaging process is greatly reduced, and thus the stress borne by the light-emitting surface of the laser chip is effectively reduced, and the possibility of the laser chip generating cracks is effectively reduced.

[0005] The technical solution of the present invention is realized as follows:

[0006] The embodiments of the present invention provide a laser module, which includes at least two laser chip modules. Each laser chip module includes: at least one laser chip, at least two conductive substrates, and an insulating substrate. The positive and negative surfaces of the laser chip are respectively bonded to the same ends of different conductive substrates; the other ends of different conductive substrates in the laser chip module are commonly bonded to the insulating substrate, and the insulating substrates between adjacent laser chip modules are independent of each other.

[0007] In the above solution, a stress relief area for relieving stress is provided between the insulating substrates of adjacent laser chip modules.

[0008] In the above solution, in the laser chip modules located at both ends of the module: the outer edge of the insulating substrate in at least one end laser chip module is aligned with the outer edge of the conductive substrate; and / or, at least one end laser chip module further includes: an auxiliary substrate for relieving the stress of the end laser chip module.

[0009] In the above solution, when the laser chip module at at least one end further includes an auxiliary substrate for releasing the stress of the end laser chip module, one end of the auxiliary substrate is aligned with the outer edge of the conductive substrate of the end laser chip module, and a stress release area for releasing stress is provided between the other end and the insulating substrate of the end laser chip module.

[0010] In the above solution, a filling body for releasing stress is provided in the stress release area.

[0011] In the above solution, the filling body includes: rubber, or fiber, or plastic, or polymer adhesive, or metal material.

[0012] In the above solution, the stress release area is a gap.

[0013] In the above solution, in the stacking direction of at least two laser chip modules, both side boundaries of the stress release area are located within the area corresponding to the thickness of the conductive substrate.

[0014] An embodiment of the present invention further provides a laser component, which includes the above-mentioned module and a heat sink for dissipating heat from the module, and the insulating substrates corresponding to the laser chip modules of the laser module are respectively bonded to the heat sink.

[0015] In the above solution, there is a shared conductive substrate between adjacent laser chip modules, and the surface of the other end of the shared conductive substrate is simultaneously bonded to the two insulating substrates of the adjacent laser chip modules.

[0016] The beneficial technical effects of the present invention are as follows:

[0017] During the packaging process of the device, the stress mainly acts on the conductive substrate. The design of the novel structural relationship among the laser chip, the conductive substrate and the insulating substrate of the present invention, as well as the design of the stress release area, reduce the stress during the entire packaging process, thereby reducing the stress borne by the laser chip during the packaging process, and effectively solving the problem that the laser chip in the existing solution generates cracks due to stress, resulting in reduced product reliability or even failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of Embodiment 1 of the laser module and the laser component of the present invention;

[0019] Figure 2 It is a schematic structural diagram of Embodiment 2 of the laser module and the laser component of the present invention;

[0020] Figure 3 It is a schematic structural diagram of Embodiment 3 of the laser module and the laser component of the present invention.

[0021] Description of reference numerals in the drawings: 1 is a laser chip, 11 is the positive electrode surface of the laser chip, 12 is the negative electrode surface of the laser chip, 2 is a conductive substrate, 2' is a shared conductive substrate, 3 is an insulating substrate, 4 is a stress relief area, 5 is an auxiliary substrate, d is the thickness area of the conductive substrate, a and b are laser chip modules at both ends respectively, c is the second laser chip module on the left, 31 is the insulating substrate corresponding to the laser chip module a, 32 is the insulating substrate corresponding to the laser chip module c, and 6 is a heat sink. Detailed implementation manners

[0022] The main implementation idea of the embodiment of the present invention is as follows: By bonding at least two conductive substrates in a laser chip module to the same insulating substrate, and the insulating substrates between adjacent laser chip modules are independent of each other, and a stress relief area is provided between adjacent insulating substrates (that is, the insulating substrate and the conductive substrate are arranged in a staggered manner), the stress generated during the packaging process can be effectively released, thereby effectively avoiding the damage to the laser chip caused by stress during packaging, and greatly improving the reliability and lifespan of the product.

[0023] The technical solution of the present invention will be further described in detail below with reference to the drawings and specific embodiments.

[0024] The embodiment of the present invention discloses a laser module, and the module includes at least two laser chip modules. Each laser chip module may include: at least one laser chip 1, at least two conductive substrates 2, and an insulating substrate 3. Among them, the positive electrode surface 11 and the negative electrode surface 12 of the laser chip 1 are respectively bonded to the same end of different conductive substrates 2, and the other ends of different conductive substrates 2 in the laser chip module are commonly bonded to the same insulating substrate 3. Specifically, the entire surface or a partial surface of the other ends of different conductive substrates 2 may be commonly bonded to the same insulating substrate 3.

[0025] As we can know from the above, the laser chip module is the smallest component unit of the laser module. The smallest component unit may include at least one laser chip and at least two conductive substrates inside, but includes one insulating substrate, which is the special design of the invention.

[0026] In the embodiment of the present invention, in combination with the description in the previous paragraph, for the conductive substrate, "one end" refers to the end where the laser chip is bonded, and "the other end" refers to the end where the insulating substrate is bonded.

[0027] "The entire surface or a partial surface of the other ends of different conductive substrates 2 are commonly bonded to the same insulating substrate 3" means that: in a laser chip module, taking two conductive substrates as an example, the entire surface or a partial surface of the other end of one conductive substrate and the entire surface or a partial surface of the other end of the other conductive substrate are commonly bonded to the same insulating substrate.

[0028] For example, partial surfaces at the other ends of these two conductive substrates are commonly bonded to the same insulating substrate (such as Figures 1 to 3 a laser chip module located in the middle), thus forming a structure in which the conductive substrates and the insulating substrate are arranged in a staggered manner: as Figure 2 , in the laser chip module a at the end, 2 conductive substrates are bonded to the insulating substrate 31, namely the conductive substrates 2 and 2'. Both the conductive substrates 2 and 2' are partially surface-bonded to the insulating substrate 31, while the other part of the surfaces of the conductive substrates 2 and 2' are bonded to the insulating substrate 32 of the adjacent laser chip module c, and so on.

[0029] Alternatively, taking the laser chip module at the end as an example, the outer edge of the outer conductive substrate is aligned with the edge of the insulating substrate in the corresponding laser chip module, that is, the entire surface at the other end of the outer conductive substrate and the partial surface of another conductive substrate in the same laser chip module are commonly bonded to the same insulating substrate, such as Figure 2 the laser chip module at the right end and Figure 3 the laser chip modules at both ends.

[0030] Figures 1 to 3 These are different embodiments of the laser module and components of the present invention respectively, and the following solutions are explained with reference to Figures 1 to 3 for illustration.

[0031] Specifically, as Figures 1 to 3 shown, at least two laser chip modules included in the laser module can be stacked horizontally to form an array, Figure 1 the arrow in

[0032] indicating the horizontal direction (the stacking direction of the laser chip modules). There can be a shared conductive substrate 2 (2') between adjacent laser chip modules, and for each laser chip module, the number of different conductive substrates bonded to the same insulating substrate is at least two.

[0033] In the following embodiments of the present invention, it is taken as an example that each laser chip module includes one laser chip 1 and two conductive substrates 2 (that is, 2 conductive substrates 2 are bonded to the same insulating substrate 3), but this does not constitute a specific limitation on the number of conductive substrates bonded to an insulating substrate and the number of laser chips included in each laser chip module.

[0034] Moreover, among the laser chip modules located at both ends of the module, at least one of them (i.e., the laser chip module at at least one end) further includes: an auxiliary substrate 5 for releasing the stress of the end laser chip module.

[0035] Figure 1 For the solution where the laser chip modules at both ends of the module both include the auxiliary substrate 5, Figure 2 For the solution where only one end of the laser chip modules at both ends of the module includes the auxiliary substrate 5.

[0036] Such as Figure 1 、 Figure 2 As shown, one end of the auxiliary substrate 5 is aligned with the outer edge of the conductive substrate 2 of the end laser chip module a, and a stress release region 4 for releasing stress is provided between the other end and the insulating substrate 31 of the end laser chip module a.

[0037] Specifically, the stress release region 4 can be a gap; in the embodiment of the present invention, in the stacking direction of at least two laser chip modules, both side boundaries of the stress release region are located within the region corresponding to the thickness of the conductive substrate, such as Figure 1 the thickness region d of the conductive substrate 2 shown.

[0038] Alternatively, a filler for releasing stress can also be provided in the stress release region, and the filler can be an insulating polymer material with a hardness lower than that of the insulating substrate, or a metal material that is insulated on the surface after surface anodization treatment and has a hardness lower than that of the insulating substrate.

[0039] Specifically, the filler includes but is not limited to: rubber, or fiber, or plastic, or polymer adhesive, or metal material, etc. The filler can be in contact with the adjacent insulating substrate. Similarly, a gap can also be left between the filler and the adjacent insulating substrate as the stress release region. In this case, the function and the relationship to be satisfied of the gap are basically the same as those of the gap mentioned above, and will not be elaborated here.

[0040] Furthermore, among the laser chip modules located at both ends of the module, the outer edge of the insulating substrate of at least one of them (the laser chip module at at least one end) is aligned with the outer edge of the conductive substrate. Specifically, such as Figure 2 the solution shown, the outer edge of the insulating substrate of the laser chip module at the other end without the auxiliary substrate 5 extends outward and is directly aligned with the outer edge of the conductive substrate 2; or, such as Figure 3 the solution shown, the outer edges of the insulating substrates of the laser chip modules located at both ends of the module are both aligned with the outer edge of the conductive substrate.

[0041] An embodiment of the present invention further provides a laser component, which includes the above-mentioned laser module and a heat sink 6 for dissipating heat from the module. The insulating substrates 3 corresponding to the respective laser chip modules of the laser module are respectively bonded to the heat sink 6.

[0042] Preferably, in combination with the illustrated solutions, there is a shared conductive substrate (such as conductive substrate 2') between adjacent laser chip modules. The surface of the other end of the shared conductive substrate is simultaneously bonded to the two insulating substrates of the adjacent laser chip modules. Of course, in the solutions disclosed in the embodiments of the present invention, adjacent laser chip modules may not share a conductive substrate. In this case, different conductive substrates between adjacent laser chip modules can be electrically connected by contacting or other means. It should be noted that whether the conductive substrates between adjacent laser chip modules are shared or not, they are within the scope of the disclosure and protection of the present invention.

[0043] As Figure 2 shown, for the laser chip module a at the left end and the second laser chip module c from the left, the conductive substrate 2' is shared by these two laser chip modules. The surface of the other end of the shared conductive substrate 2' is simultaneously bonded to the insulating substrate 31 of the laser chip module a and the insulating substrate 32 of the laser chip module c. Other laser chip modules are similar to the above, and so on, and will not be described in detail here.

[0044] In the embodiments of the present invention, the material of the conductive substrate 2 includes but is not limited to: copper tungsten, or molybdenum copper, or copper, or particle-reinforced metal matrix composites, or diamond metal composites, etc.

[0045] The materials of the insulating substrate 3 and the auxiliary substrate 5 include but are not limited to: aluminum nitride, or aluminum oxide, or beryllium oxide, or silicon carbide, or diamond, etc.

[0046] The material of the heat sink 6 includes but is not limited to: copper, or a metal with a coolant channel, or a metal-ceramic composite structure.

[0047] As mentioned above, the above are only the preferred embodiments of the present invention and are not used to limit the protection scope of the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A laser module, characterized in that, The module includes at least two laser chip modules, wherein, each laser chip module includes: at least one laser chip, at least two conductive substrates, and an insulating substrate. The positive and negative faces of the laser chip are respectively bonded to the same ends of different conductive substrates; the other ends of different conductive substrates in the laser chip module are commonly bonded to the insulating substrate, and the insulating substrates between adjacent laser chip modules are independent of each other. A stress release area for stress relief is provided between the insulating substrates of adjacent laser chip modules; there is a shared conductive substrate between adjacent laser chip modules, and the surface of the other end of the shared conductive substrate is simultaneously bonded to the two insulating substrates of the adjacent laser chip modules.

2. The module according to claim 1, characterized in that Among the laser chip modules at both ends of the module: the outer edge of the insulating substrate in at least one end laser chip module is aligned with the outer edge of the conductive substrate; and / or, at least one end laser chip module further includes: an auxiliary substrate for stress relief of the end laser chip module.

3. The module according to claim 2, characterized in that, When at least one end laser chip module further includes an auxiliary substrate for stress relief of the end laser chip module, one end of the auxiliary substrate is aligned with the outer edge of the conductive substrate of the end laser chip module, and a stress release area for stress relief is provided between the other end and the insulating substrate of the end laser chip module.

4. The module according to claim 1 or 3, characterized in that A filler for stress relief is provided in the stress release area.

5. The module according to claim 4, wherein The filler includes: rubber, or fiber, or plastic, or polymer adhesive, or metal material.

6. The module according to claim 1 or 3, characterized in that, The stress release area is a gap.

7. The module according to claim 1, wherein In the stacking direction of at least two laser chip modules, both side boundaries of the stress release area are located within the area of the corresponding conductive substrate thickness.

8. A laser component, characterized in that, The assembly includes the module according to any one of claims 1 to 7, and a heat sink for dissipating heat from the module. The insulating substrates corresponding to the laser chip modules of the laser module are respectively bonded to the heat sink.

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