Packaging structure and electronic device

Abstract

The present application discloses a packaging structure, in which the heat of the second component can be directly transferred to the second substrate because the second component is connected to the second substrate. In addition, each second heat sink is connected to at least one second connecting column, and each second heat sink is connected to a second component, that is, at least part of the second component is connected to the second connecting column through the second heat sink, so that the heat of at least part of the second component can also be transferred to the second connecting column through the second heat sink, and then transferred to the second substrate or other structures connected to the second connecting column through the second connecting column, thereby transferring the heat of the second component and increasing the heat conduction path of the second component. In the present application, there are multiple heat transfer paths for the components in the packaging structure. When the components generate heat during operation, the heat can be transferred out in a timely manner through multiple paths to improve the heat transfer efficiency of the packaging structure and enhance the heat dissipation effect of the packaging structure.

Description

Technical Field

[0001] The present application relates to the field of packaging technology, and in particular to a packaging structure and an electronic device including the packaging structure. Background Art

[0002] With the trend of miniaturization and multifunctionality of terminal products, 3D packaging stacking technology has become one of the most important and effective means to increase circuit density. Through 3D packaging stacking technology, more and more passive devices, active devices and other components are integrated together, making the heat dissipation of components in the 3D packaging stacking structure an increasingly prominent and urgent problem to be solved, so as to avoid the heat concentration of components in the 3D packaging stacking structure affecting the normal operation of the components in the packaging structure or causing damage to the components in the packaging structure. Summary of the invention

[0003] The present application provides a packaging structure with good heat dissipation effect, and an electronic device including the packaging structure.

[0004] In a first aspect, the present application provides a packaging structure, which includes a first packaging body and a second packaging body stacked on the first packaging body.

[0005] The first packaging body includes a first substrate and a first packaging layer packaged on the first substrate; a plurality of external pins are formed on the side of the first substrate facing away from the first packaging layer, and the external pins are used to connect the external structure of the packaging structure; the first packaging layer includes a first packaging material layer and one or more first components and a plurality of first connecting columns embedded in the first packaging material layer; each of the first components is electrically connected to the first substrate; one end of each of the first connecting columns is connected to the first substrate, and the other end extends to the surface of the first packaging material layer facing away from the first substrate; the first connecting column is formed of a thermally conductive material.

[0006] The second packaging body includes a second substrate and a second packaging layer packaged on the second substrate; the second packaging layer includes a second packaging material layer and one or more second components, multiple second connecting pillars and one or more second heat sinks embedded in the second packaging material layer; each of the second components is connected to the second substrate; one end of each of the second connecting pillars is connected to the second substrate, and the other end extends to the surface of the second packaging material layer away from the second substrate; each of the second heat sinks is connected to at least one of the second connecting pillars, and each of the second heat sinks is connected to one or more of the second components; the second connecting pillars and the second heat sink are formed of thermally conductive materials; the second substrate or the second connecting pillars are connected to the first connecting pillars.

[0007] In the present application, since each of the second components is connected to the second substrate, the heat of the second components can be directly transferred to the second substrate. In addition, each of the second heat sinks is connected to at least one of the second connecting pillars, and each of the second heat sinks is connected to one of the second components. That is, at least part of the second components can be connected to the second connecting pillars through the second heat sink. Since the second connecting pillar is connected to the second substrate, and the second substrate or the second connecting pillar is connected to the first connecting pillar, the heat generated by the second component can be sequentially transferred to the second substrate through the second heat sink and the second connecting pillar, or sequentially transferred to the first substrate through the second heat sink, the second connecting pillar and the first connecting pillar, thereby increasing the heat transfer path of the second component and accelerating the heat dissipation of the second component. In some embodiments, a plurality of external pins are formed on the first substrate, and the external structure of the packaging structure is connected through the external pins, so that the heat transferred to the first substrate can be transferred to the external structure of the packaging structure through the external pins to achieve heat dissipation of the packaging structure. For the present application, since the paths of the second components are increased, the heat of the second components in the packaging structure can be quickly transferred to the first substrate, thereby accelerating the heat dissipation efficiency of the packaging structure. In the present application, compared with the method in which the heat of the second component can only be transferred to the first substrate in sequence through the second substrate, the second connecting column, and the first connecting column, the method in the present application in which the heat of the second component is transferred to the first substrate is greatly increased, thereby accelerating the heat dissipation in the packaging structure. In addition, since the second heat dissipation block, the first connecting column, and the second connecting column are arranged in the packaging structure, the heat in the packaging structure can be transferred through the second heat dissipation block, the first connecting column, and the second connecting column, so that the heat can be quickly exchanged between the first packaging body and the second packaging body, avoiding heat accumulation in the first packaging body or the second packaging body, thereby avoiding damage to the components in the packaging structure caused by heat accumulation.

[0008] In some embodiments, the heat in the packaging structure can also be transferred out through the side of the second substrate. In this embodiment, since there are many ways for the heat of the second component to be transferred to the second substrate, that is, it can be directly transferred to the second substrate, and it can also be transferred to the second substrate in sequence through the second heat sink and the second connecting column, the heat in the packaging structure can be transferred to the outside of the packaging structure more quickly, and the heat dissipation efficiency of the packaging structure can be accelerated, so that the packaging structure can have a good heat dissipation effect, thereby avoiding excessive heat in the three-dimensional packaging stacking structure and affecting the normal operation of the components in the packaging structure or causing damage to the components in the packaging structure.

[0009] In some embodiments, the first package body includes one or more first heat dissipation blocks, each of which is connected to at least one of the first connecting columns, and each of which is connected to one or more of the first components; the first heat dissipation blocks are formed of thermally conductive material.

[0010] Since the first component is connected to the first substrate, the heat of the first component can be directly transferred to the first substrate and transmitted through the first substrate. In addition, the first component is connected to the first connecting column through the first heat sink, and the first connecting column is connected to the first substrate, so that the heat of the first component can also be transferred to the first connecting column through the first heat sink, and then transferred to the first substrate through the first connecting column, and transmitted through the first substrate. That is, in this embodiment, the first component in the first packaging layer has more heat conduction pathways, which can quickly transfer the heat generated by the operation of the first component, further improving the heat dissipation efficiency of the packaging structure. In addition, due to the increase in heat conduction pathways in the packaging structure, the heat between the first packaging body and the second packaging body can also be quickly transferred, avoiding the heat from being concentrated at a certain position in the packaging structure, thereby avoiding damage to components caused by heat concentration.

[0011] In some embodiments, each of the first heat sinks is located on a side of the first component away from the first substrate, and each of the first connecting pillars is close to an edge of the first package relative to the first component; or each of the second heat sinks is located on a side of the second component away from the second substrate, and the second connecting pillar is close to an edge of the second package relative to the second component. In some embodiments, each of the first heat sinks is located on a side of the first component away from the first substrate, and each of the first connecting pillars is close to an edge of the first package relative to the first component; and each of the second heat sinks is located on a side of the second component away from the second substrate, and the second connecting pillar is close to an edge of the second package relative to the second component.

[0012] In the embodiment of the present application, the first connecting column is close to the edge of the first package body relative to the first component, and the first heat dissipation block is connected to the first connecting column to form a frame structure that covers the first component away from the first substrate. The frame structure can enhance the internal strength of the package structure to prevent the package structure from being damaged by external forces. When the first connecting column or the second connecting column is grounded, the frame structure can form a Faraday electromagnetic shielding body, which can well isolate the electromagnetic interference between the first component in the package structure and other structures in the package structure, as well as the electromagnetic interference of the external environment of the package structure to the first component in the package structure. The second connecting column is close to the edge of the second package body relative to the second component, and the second heat dissipation block is connected to the second connecting column to form a frame structure that covers the second component away from the second substrate. The frame structure can enhance the internal strength of the package structure to prevent the package structure from being damaged by external forces. When the first connecting column or the second connecting column is grounded, the frame structure forms a Faraday electromagnetic shielding body, which can effectively isolate the electromagnetic interference between the second component in the packaging structure and other structures in the packaging structure, as well as the electromagnetic interference of the external environment of the packaging structure on the second component in the packaging structure.

[0013] In some embodiments, at least one of the first connecting column or the second connecting column is grounded, all of the first heat sinks are connected as a whole and electrically connected to the grounded first connecting column or the grounded second connecting column, and all of the second heat sinks are connected as a whole and electrically connected to the grounded first connecting column or the grounded second connecting column.

[0014] In the embodiment of the present application, since at least one of the first connecting column or the second connecting column is grounded, the first heat sink block connected as a whole can be electrically connected to the grounded first connecting column or the grounded second connecting column, so that the first heat sink block connected as a whole is grounded. In addition, the second heat sink block connected as a whole can be electrically connected to the grounded first connecting column or the grounded second connecting column, so that the second heat sink block connected as a whole is grounded, so that the frame structure formed by the second heat sink block and the second connecting column and the frame structure formed by the first heat sink block and the first connecting column can both form a Faraday electromagnetic shielding body, which can well isolate the electromagnetic interference between the first component and the second component in the packaging structure, as well as the electromagnetic interference of the external environment of the packaging structure on the components in the packaging structure.

[0015] In some embodiments, the first component, the first heat sink, and the first connecting column are all multiple, the multiple first heat sinks are spaced apart, different first heat sinks are connected to different first components and first connecting columns, and different first heat sinks are used to transmit different signals; or the second component, the second heat sink, and the second connecting column are all multiple, the multiple second heat sinks are spaced apart, different second heat sinks are connected to different second components and second connecting columns, and different second heat sinks are used to transmit different signals. In some embodiments, the first component, the first heat sink, and the first connecting column are all multiple, the multiple first heat sinks are spaced apart, different first heat sinks are connected to different first components and first connecting columns, and different first heat sinks are used to transmit different signals; and the second component, the second heat sink, and the second connecting column are all multiple, the multiple second heat sinks are spaced apart, different second heat sinks are connected to different second components and second connecting columns, and different second heat sinks are used to transmit different signals.

[0016] In the embodiment of the present application, different first heat sinks are connected to different first components and first connecting columns, and different first heat sinks are used to transmit different signals; different second heat sinks are connected to different second components and second connecting columns, and different second heat sinks are used to transmit different signals, that is, in some embodiments, the first heat sink and the second heat sink can not only play the role of heat transmission, but also play the role of signal transmission, thereby increasing the signal transmission path within the packaging structure.

[0017] In some embodiments, an external pin is disposed on a side of the second package body facing away from the first package body, and the external pin is used to be electrically connected to an external structure of the package structure.

[0018] In the embodiment of the present application, since the surface of the first substrate facing away from the first packaging layer is provided with external pins, and the surface of the second substrate facing away from the second packaging layer is provided with external pins, the signal can be transmitted through the first substrate side and can also be transmitted through the second substrate. Compared with the method of only setting external pins on one side (such as the first substrate), the number of external pins is increased, thereby increasing the density of the lead-out signals in the entire packaging structure, increasing the number of components in the packaging structure, and improving the number of integrated components in the packaging structure, which is convenient for realizing the miniaturization of electronic devices and the improvement of functional diversification. In addition, compared with the method of only setting external pins on one side, the components in the packaging structure can be connected not only to the external pins on the first substrate, but also to the external pins on the second substrate, thereby increasing the flexibility of the components and wiring settings in the packaging structure and simplifying the packaging structure design.

[0019] In some embodiments, the second packaging layer is located on the side of the second substrate facing the first packaging layer, and the first connecting column is connected to the second connecting column; the packaging structure also includes a connecting layer, which is connected between the first packaging layer and the second packaging layer, and connects the first connecting column and the second connecting column.

[0020] In some embodiments, the connection layer may be solder or conductive glue.

[0021] The first package body and the second package body are fixedly connected together through the connection layer, which makes it easier to disassemble the first package body and the second package body than to directly package the first package body and the second package body into one body through the packaging layer. In some cases, when a package structure of another structure is needed, a new package structure can be obtained by simply changing the type of the second package body connected to the first package body (or changing the first package body connected to the second package body), so that a new package structure can be obtained quickly and conveniently, and the first package body or the second package body can be recycled to avoid waste of resources.

[0022] In some embodiments, the connection layer includes a plurality of sub-connection blocks arranged at intervals, the first connecting pillars and the second connecting pillars are both multiple, at least some of the first connecting pillars and at least some of the second connecting pillars are arranged opposite to each other, the sub-connection blocks are connected between the first connecting pillars and the second connecting pillars opposite to each other, and the sub-connection blocks are formed of thermally conductive and electrically conductive materials.

[0023] In some embodiments, when the connection layer is solder, the plurality of sub-connection blocks may be a plurality of solder joints arranged at intervals; when the connection layer is conductive glue, the plurality of sub-connection blocks may be a plurality of glue drops arranged at intervals.

[0024] In this embodiment, the sub-connection blocks arranged at intervals are used to achieve fixed connection and electrical connection between the first package body and the second package body, so that it is simpler to replace the first package body or the second package body when the package structure needs to be replaced. In addition, the use of materials for the connection layer can be reduced, reducing production costs. It is understandable that in some embodiments, the material of the connection layer can also be filled between the first package body and the second package body, that is, the sub-connection blocks of the connection layer are connected as a whole, to achieve a more stable connection effect, and to avoid the gap between the first package body and the second package body, thereby enhancing the strength of the package structure in the thickness direction.

[0025] In some embodiments, the surface of the second heat sink facing away from the second substrate exposes the second packaging layer, the surface of the first heat sink facing away from the first substrate exposes the first packaging layer, and the connecting layer further includes a heat conductive block connected between the surface of the first heat sink exposing the first packaging layer and the surface of the second heat sink exposing the second packaging layer.

[0026] In the embodiment of the present application, the heat conduction block is connected between the first heat dissipation block and the second heat dissipation block, and is used to realize heat transfer between the second heat dissipation block and the second package body, improve the heat transfer speed between the first package body and the second package body, and improve the heat distribution efficiency in the package structure. In addition, a heat conduction block is provided between the surface of the first heat dissipation block exposed to the first package material layer and the surface of the second heat dissipation block exposed to the second package material layer, that is, a heat conduction block is added between the first package body and the second package body, so that the connection and fixing strength between the first package body and the second package body can be further improved.

[0027] In some embodiments, the surface of the second heat sink facing away from the second substrate exposes the second packaging layer, the surface of the first heat sink facing away from the first substrate exposes the first packaging layer, the surface of the first heat sink exposing the first packaging layer is in contact with the surface of the second heat sink exposing the second packaging layer, and the first heat sink and the second heat sink form an integral structure.

[0028] In the embodiment of the present application, the surface of the first connecting column exposed from the first packaging material layer contacts the surface of the second connecting column exposed from the second packaging material layer, and is fixed by the intermolecular force between the first connecting column and the second connecting column, so that the first heat sink and the second heat sink form an integral structure.

[0029] In some embodiments, the second packaging body also includes a third packaging layer, which is encapsulated on a side of the second substrate facing away from the second packaging layer. The third packaging layer includes a third packaging material layer and one or more third components embedded in the third packaging material layer, and each of the third components is connected to the second substrate.

[0030] In the embodiment of the present application, the third packaging layer is packaged on the side of the second substrate facing away from the second packaging layer, that is, packaging layers are provided on two opposite sides of the second substrate, thereby increasing the number of components stacked in the thickness direction of the packaging structure, reducing the occupied area of ​​the packaging structure applied to the electronic device and increasing the number of components in the packaging structure, thereby facilitating the miniaturization and multifunctionality of the electronic device.

[0031] In some embodiments, the third packaging layer also includes a plurality of third connecting columns embedded in the third packaging material layer and one or more third heat sinks; one end of each of the third connecting columns is connected to the second substrate, and the other end extends to the surface of the third packaging material layer away from the second substrate, each of the third heat sinks is connected to at least one of the third connecting columns, and each of the third heat sinks is connected to one or more of the third components.

[0032] In the embodiment of the present application, part of the heat generated by the third component can be directly transferred to the second substrate, and part of the heat can be transferred to the second substrate in turn through the third heat sink and the third connecting column, thereby increasing the heat transfer path of the third component, so that the heat generated by the operation of the third component can be transferred to other positions of the packaging structure more quickly to avoid heat concentration. In addition, the heat generated by the second substrate can be transferred to the first substrate in turn through the second connecting column and the first connecting column, and transmitted to the outside of the packaging structure through the external pins of the first substrate, thereby achieving heat dissipation. It can be understood that the heat generated by the second component in the second packaging layer and the first component in the first packaging layer can also be transferred to the third packaging layer to achieve uniform heat distribution in the packaging structure, avoid heat accumulation at a certain position in the packaging structure, and avoid damage to the packaging structure caused by heat accumulation.

[0033] In some embodiments, the second substrate includes a routing layer and an insulating layer covering the side of the routing layer facing away from the second packaging layer, and the second component is electrically connected to the routing layer; a portion of the insulating layer is hollowed out to expose a portion of the routing layer; a side of the second substrate facing away from the second packaging layer is covered with a thermal conductive adhesive layer, the thermal conductive adhesive layer is in contact with the exposed portion of the routing layer, and the thermal conductive adhesive layer is used to transfer heat.

[0034] In the embodiment of the present application, since the thermally conductive adhesive layer contacts the wiring layer of the second substrate through the hollowed-out position of the insulating layer, the heat transmitted to the second substrate can be quickly discharged through the thermally conductive adhesive layer, thereby enhancing the heat dissipation effect of the packaging structure. In some embodiments, a release film is provided on the side of the thermally conductive adhesive layer facing away from the second packaging layer. When the packaging structure is fixed to other structures of the electronic device, the release film can be directly torn off to paste the thermally conductive adhesive layer on the other structure, which is simple and convenient to operate.

[0035] In some embodiments, the first component comprises a front-mounted chip, a metal sheet is laminated on the surface of the front-mounted chip facing away from the first substrate, and the first heat sink is connected to the metal sheet; or the second component comprises a front-mounted chip, a metal sheet is laminated on the surface of the front-mounted chip facing away from the second substrate, and the second heat sink is connected to the metal sheet. In some embodiments, the first component comprises a front-mounted chip, a metal sheet is laminated on the surface of the front-mounted chip facing away from the first substrate, and the first heat sink is connected to the metal sheet; and the second component comprises a front-mounted chip, a metal sheet is laminated on the surface of the front-mounted chip facing away from the second substrate, and the second heat sink is connected to the metal sheet.

[0036] The surface of the upright chip (i.e., the chip connected to the substrate in an upright manner) in the first package body facing away from the first substrate is laminated with a metal sheet, and the first heat sink is connected to the metal sheet, thereby avoiding damage to the upright chip when the first packaging material layer is laser-opened and the first heat sink is formed. Similarly, the surface of the upright chip (i.e., the chip connected to the substrate in an upright manner) in the second package body facing away from the second substrate is laminated with a metal sheet, and the second heat sink is connected to the metal sheet, thereby avoiding damage to the upright chip when the second packaging material layer is laser-opened and the second heat sink is formed.

[0037] In some embodiments, the metal sheet may be formed of the same material as the first heat sink and the second heat sink, so that the metal sheet can form an integrated structure with the first heat sink and the second heat sink, avoiding an increase in contact interface, thereby enhancing the thermal conductivity effect.

[0038] In some embodiments, there are a plurality of first components in the first substrate, and at least two of the plurality of first components are stacked in the thickness direction of the first package; or there are a plurality of second components in the second substrate, and at least two of the plurality of second components are stacked in the thickness direction of the second package. In some embodiments, there are a plurality of first components in the first substrate, and at least two of the plurality of first components are stacked in the thickness direction of the first package; and there are a plurality of second components in the second substrate, and at least two of the plurality of second components are stacked in the thickness direction of the second package.

[0039] In the embodiment of the present application, by stacking some of the first components in the first packaging layer in the thickness direction of the packaging structure, the components are stacked in the thickness direction of the packaging structure, thereby increasing the density of the components in the packaging structure. When the same number of first components are packaged in the first packaging layer, since some of the first components are stacked in the thickness direction of the packaging structure, compared with a packaging structure in which all the first components are directly connected to the first substrate, the size of the first substrate can be reduced, and the occupied area of ​​the packaging structure can be reduced.

[0040] In a second aspect, the present application further provides an electronic device, the electronic device comprising a functional module and the packaging structure, wherein the functional module is electrically connected to the packaging structure. Since the packaging structure has a good heat dissipation effect, damage caused by heat concentration in the packaging structure is avoided, so that the packaging structure can have a long service life, thereby ensuring the service life of the electronic device.

[0041] In some embodiments, the electronic device includes a mainboard, the packaging structure and the functional module are fixed on the mainboard and electrically connected to the mainboard; the first substrate of the packaging structure is close to the mainboard relative to the first packaging layer, and is electrically connected to the mainboard through the external pins.

[0042] In the embodiment of the present application, the packaging structure is connected to each functional module through the circuit of the mainboard, so as to realize the electrical connection between the packaging structure and each functional module arranged on the mainboard. In addition, since the packaging structure and some or all functional modules are electrically connected through the mainboard, the heat generated by the packaging structure can be at least partially transmitted through the mainboard to the functional modules connected to or in contact with the mainboard or other structures of the electronic device, thereby avoiding the accumulation of heat in the packaging structure, which may cause the packaging structure to be overheated and damaged.

[0043] In some embodiments, the electronic device includes a middle frame, which is arranged opposite to the main board, and the packaging structure is located between the middle frame and the main board and connects the middle frame and the main board; the second packaging body of the packaging structure is connected to the middle frame on a side facing away from the first substrate, and the middle frame is used for heat dissipation.

[0044] In the embodiment of the present application, the packaging structure is disposed between the mainboard and the middle frame and contacts the mainboard and the middle frame, so that part of the heat generated by the packaging structure is transferred to the mainboard and part is transferred to the middle frame for dissipation. In some embodiments, the packaging structure is fixedly connected to the mainboard and the middle frame to maintain the stability of the packaging structure in the electronic device.

[0045] In some embodiments, the electronic device is a mobile phone, and the functional modules include one or more of an antenna module, a sensor module, an audio module, a camera module, a connector module, and a power module. The packaging structure is electrically connected to each functional module, so that the antenna module, the audio module, the sensor module, and the camera module 500 are controlled by components in the packaging structure to operate, so that the electronic device can realize various functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the present application or the background technology, the drawings required for use in the present application or the background technology will be described below.

[0047] Figure 1 A schematic diagram of the structure of an electronic device according to an embodiment of the present application;

[0048] Figure 2 for Figure 1 A schematic cross-sectional view of a partial structure of the electronic device shown;

[0049] Figure 3 A schematic diagram of a cross-sectional structure of a packaging structure according to an embodiment of the present application;

[0050] Figure 4 for Figure 3 A perspective view of a first package body of the package structure of the illustrated embodiment;

[0051] Figure 5 A perspective view of a first package body of a package structure according to some other embodiments of the present application;

[0052] Figure 6 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0053] Figure 7 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0054] Figure 8 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0055] Fig. 9 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0056] Fig.10 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0057] Fig.11 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0058] Fig.12 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0059] Fig.13 for Fig.12 A partial cross-sectional schematic diagram of the packaging structure of the illustrated embodiment disposed in an electronic device;

[0060] Fig.14 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0061] Fig.15 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0062] Fig.16 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0063] Fig.17 A schematic cross-sectional view of a packaging structure according to another embodiment of the present application;

[0064] Fig.18 for Figure 3 A flow chart of the preparation process of the packaging structure of the illustrated embodiment;

[0065] Figures 19a to 19k for Fig.18 Schematic diagram of the cross-sectional structure of the packaging structure in each step. DETAILED DESCRIPTION

[0066] The technical solutions in some embodiments of the present application will be described below in conjunction with the drawings in some embodiments of the present application.

[0067] It should be noted that “A and / or B” mentioned in this application includes three situations: “A” or “B” or “A and B”.

[0068] The present application relates to a packaging structure, a packaging method and an electronic device including the packaging structure. The electronic device may be an electronic product such as a mobile phone, a tablet computer, a wearable watch, a router, etc. Among them, the packaging structure may integrate components such as active devices and / or passive devices in one package. Among them, the active devices may be components such as various chips, and the passive devices may be components such as capacitors, inductors, resistors, etc. In an embodiment of the present application, the packaging structure is electrically connected to the functional module of the electronic device, so that the functional module of the electronic device is controlled to work through the coordinated work of the active components and passive components inside the packaging structure.

[0069] For example, see Figure 1 , Figure 11 is a schematic diagram of the structure of an electronic device 1000 according to an embodiment of the present application. The electronic device includes a packaging structure 100 and at least one functional module electrically connected to the packaging structure 100. The packaging structure 100 contains components that can control the operation of each functional module, so that the components packaged in the packaging structure 100 can control the operation of each functional module to realize various functions of the electronic device. The components in the packaging structure 100 include active devices such as processors and memories, and passive devices such as capacitors, inductors, and resistors.

[0070] In this embodiment, the electronic device 1000 is a mobile phone. The functional modules of the mobile phone include an antenna module 200, an audio module 300, a sensor module 400, a camera module 500, a connector module 600, and a power module 700, etc., so as to realize various functions of the mobile phone through the functional modules in the mobile phone. In some embodiments, the packaging structure 100 encapsulates an antenna module processing chip, an audio module processing chip, a sensor module processing chip, and a camera module processing chip. Therefore, the packaging structure 100 is electrically connected to the antenna module 200, the audio module 300, the sensor module 400, and the camera module 500, so that the antenna module 200, the audio module 300, the sensor module 400, and the camera module 500 are controlled by the components in the packaging structure 100 to work, so that the electronic device 1000 realizes various functions. It is understandable that when the electronic device 1000 is other equipment, the electronic device 1000 can include other types of functional modules, and other types of components are correspondingly encapsulated in the packaging structure 100 to electrically connect each functional module with the packaging structure 100, thereby realizing the various functions of the electronic device 1000.

[0071] In the embodiment of the present application, the number of components packaged in the packaging structure 100 can be increased or decreased as needed. For example, in some embodiments, a power module processing chip and a connector module processing chip can be added to the packaging structure 100, and the packaging structure 100 is electrically connected to the connector module 600 and the power module 700, thereby expanding the function of the packaging structure 100.

[0072] See also Figure 2 , Figure 2Shown is a schematic cross-sectional view of a partial structure of an electronic device 1000 in some embodiments of the present application. In some embodiments, the electronic device 1000 may further include a mainboard 800, and the packaging structure 100 and some or all of the functional modules are disposed on the mainboard 800. In some embodiments, the mainboard 800 is a printed circuit board (PCB), and the packaging structure 100 is connected to each functional module through the circuit of the mainboard 800, so as to realize the electrical connection between the packaging structure 100 and each functional module disposed on the mainboard 800. In addition, since the packaging structure 100 and some or all of the functional modules are electrically connected through the mainboard 800, at least part of the heat generated by the packaging structure 100 can be transmitted through the mainboard 800 to the functional modules connected to or in contact with the mainboard 800 or other structures of the electronic device 1000, thereby avoiding heat accumulation in the packaging structure 100, which causes the packaging structure 100 to be overheated and damaged. For example, Figure 2 The illustrated embodiment shows a situation where the packaging structure 100 and the connector module 600 are arranged on a mainboard 800. When the packaging structure 100 generates a large amount of heat and the connector module 600 generates a low amount of heat, the heat of the packaging structure 100 can be transferred to the position of the connector module 600 through the mainboard 800, thereby preventing heat from accumulating at the position of the packaging structure 100 and causing the packaging structure 100 to overheat and be damaged.

[0073] In some embodiments, the electronic device 1000 further includes a middle frame 900, the middle frame 900 is arranged opposite to the mainboard 800, and the packaging structure 100 is connected to the middle frame 900 and the mainboard 800. The middle frame 900 can be used for heat dissipation. The packaging structure 100 is arranged between the mainboard 800 and the middle frame 900 and contacts the mainboard 800 and the middle frame 900, so that part of the heat generated by the packaging structure 100 is transmitted to the mainboard 800, and part of it is transmitted to the middle frame 900 for dissipation. In some embodiments, the packaging structure 100 is fixedly connected to the mainboard 800 and the middle frame 900 to keep the packaging structure 100 stable in the electronic device 1000.

[0074] See also Figure 3 , Figure 3The figure shows a schematic diagram of the structure of a packaging structure 100 according to an embodiment of the present application. The packaging structure 100 includes a first packaging body 10 and a second packaging body 20 stacked on the first packaging body 10. A connecting layer 30 is provided between the first packaging body 10 and the second packaging body 20. The connecting layer 30 is made of an electrically conductive and thermally conductive material, that is, the connecting layer 30 can conduct electricity and conduct heat. The electrical connection between the first packaging body 10 and the second packaging body 20 is achieved through the connecting layer 30, so that the first packaging body 10 and the second packaging body 20 can communicate with each other. In addition, since the connecting layer 30 has a thermal conductive function, the heat between the first packaging body 10 and the second packaging body 20 can also be transferred to each other through the connecting layer 30, thereby avoiding heat accumulation on the first packaging body 10 or the second packaging body 20.

[0075] In this embodiment, the connection layer 30 may be solder or conductive adhesive, which has good thermal and electrical conductivity and can fix the first package body 10 and the second package body 20 together.

[0076] In the embodiment of the present application, the first package body 10 and the second package body 20 are fixedly connected together by the connection layer 30, which makes it easier to disassemble the first package body 10 and the second package body 20 than to directly package the first package body 10 and the second package body 20 as one body through the packaging layer. In some cases, when it is necessary to obtain a package structure 100 of another structure, a new package structure 100 can be obtained by simply changing the type of the second package body 20 connected to the first package body 10 (or replacing the first package body 10 connected to the second package body 20), so that a new package structure 100 can be obtained quickly and conveniently, and the first package body 10 or the second package body 20 can be recycled to avoid waste of resources. For example, in some embodiments, the first package body 10 encapsulates an antenna module processing chip and an audio module processing chip, and the second package body 20 encapsulates a sensor module processing chip and a camera module processing chip. When a packaging structure 100 that encapsulates an antenna module processing chip, an audio module processing chip, a power module processing chip, and a connector module processing chip is required, it is only necessary to replace the second packaging body 20 that encapsulates the power module processing chip and the connector module processing chip with the second packaging body 20 that encapsulates the sensor module processing chip and the camera module processing chip, so as to obtain the required packaging structure 100.

[0077] In some embodiments of the present application, the surface of the first package body 10 facing the second package body 20 has a plurality of first connection terminals 10a, and the surface of the second package body 20 facing the first package body 10 has a plurality of second connection terminals 20a, and the electrical connection between the first package body 10 and the second package body 20 is achieved by electrically connecting at least part of the first connection terminals 10a and at least part of the second connection terminals 20a. In some embodiments, at least part of the first connection terminals 10a and at least part of the second connection terminals 20a are arranged opposite to each other. In this embodiment, the connection layer 30 includes a plurality of spaced-apart sub-connection blocks 31, each of which is connected between the first connection terminal 10a and the second connection terminal 20a arranged opposite to each other, so as to achieve the electrical connection between the first package body 10 and the second package body 20. Among them, the orthographic projection of the second connection terminal 20a on the surface of the first package body 10 facing the second package body 20 at least partially overlaps with the first connection terminal 10a arranged opposite to it.

[0078] In the embodiment of the present application, when the connection layer 30 is solder, the multiple sub-connection blocks 31 can be multiple solder points arranged at intervals; when the connection layer 30 is conductive glue, the multiple sub-connection blocks 31 can be multiple glue drops arranged at intervals.

[0079] In this embodiment, the fixed connection and electrical connection between the first package body 10 and the second package body 20 are achieved by the sub-connection blocks 31 arranged at intervals, so that it is easier to replace the first package body 10 or the second package body 20 in the package structure 100. In addition, the use of materials of the connection layer 30 can be reduced, reducing production costs. It is understandable that in some embodiments, the material of the connection layer 30 can also be filled between the first package body 10 and the second package body 20, that is, the sub-connection blocks of the connection layer 30 are connected as a whole, achieving a more stable connection effect, and avoiding the gap between the first package body 10 and the second package body 20, thereby enhancing the strength of the package structure 100 in the thickness direction.

[0080] The first package body 10 includes a first substrate 11 and a first package layer 12 packaged on the first substrate 11. Among them, the first substrate 11 is a circuit board, including two relative insulating layers 111 and at least one wiring layer 112 arranged between the two insulating layers 111. When the wiring layer 112 is multi-layer, the first substrate 11 also includes a signal interconnection layer 113 arranged between two adjacent wiring layers 112. The signal interconnection layer 113 includes an insulating material layer 1131 and a connecting line 1132 passing through the insulating material layer 1131. The insulating material layer 1131 separates and insulates the two adjacent wiring layers 112, and the connecting line 1132 embedded in the insulating material layer 1131 connects the adjacent wiring layers 112, so that the multiple wiring layers 112 can communicate with each other. In this embodiment, the wiring layer 112 is two layers. It can be understood that the number of wiring layers 112 can be more layers.

[0081] In some embodiments, there is only one insulating layer 111. Specifically, the insulating layer 111 close to the first packaging layer 12 may not exist, and the first packaging layer 12 is directly packaged on the wiring layer 112 of the first substrate 11.

[0082] In this embodiment, a surface of the insulating layer 111 facing away from the wiring layer 112 is further provided with a welding pad connected to the wiring layer 112 , and the welding pad is used to achieve connection between components and other structures and the wiring layer 112 of the first substrate 11 .

[0083] An external pin 13 is provided on one side of the first substrate 11 facing away from the first packaging layer 12, and the external pin 13 is used to be electrically connected to the external structure of the packaging structure 100. The external structure of the packaging structure 100 is other structures, modules or components outside the packaging structure and electrically connected to the packaging structure. The external pin 13 is connected to the routing layer 112, so as to realize the electrical connection between the first substrate 11 and the external structure of the packaging structure 100 (such as the functional modules of the electronic device 1000), so that the structure in the packaging structure 100 that is electrically connected to the first substrate 11 is electrically connected to the external structure of the packaging structure 100.

[0084] When the package structure 100 is arranged on the main board 800, the first substrate 11 is connected to the main board 800 through the external pins 13. The signal generated by a certain working module electrically connected to the main board 800 is transmitted to the package structure 100 through the main board 800 and the external pins 13 in sequence; or, the signal processed in the package structure 100 is transmitted to the working module through the first substrate 11, the external pins 12, the main board 800 in sequence, thereby realizing the communication between the package structure 100 and the working module. In addition, part of the heat generated by the operation of the components in the package structure 100 can be transmitted to the main board 800 through the first substrate 11, and the heat generated by the operation of the components in the package structure 100 can be dissipated or transmitted to other structures or working modules in the electronic device 1000 through the main board 800, so as to avoid heat accumulation at the location of the package structure 100 and avoid damage to the package structure 100 caused by excessive heat.

[0085] The first packaging layer 12 includes a first packaging material layer 121 and one or more first components 122, a plurality of first connecting pillars 123 and one or more first heat sinks 124 embedded in the first packaging material layer 121. The first components 122 are components in the packaging structure 100, and can be active components such as chips, or passive components such as capacitors, inductors, and resistors. Each first component 122 is electrically connected to the first substrate 11. The first components 122 can be directly connected to the first substrate 11, or can be indirectly connected to the first substrate 11 through other structures.

[0086] In this embodiment, the first component 122 is disposed on the first substrate 11, and the pin 1211 of the first component 122 is connected to the pad of the first substrate 11, so as to realize the direct connection between the first component 122 and the first substrate 11. The first component 122 may be one or more. When there are multiple first components 122, since the multiple first components 122 are all disposed on the first substrate 11 and electrically connected to the first substrate 11, the first components 122 can communicate with each other through the wiring layer 112 of the first substrate 11. By designing the wiring of the wiring layer 112 of the first substrate 11, the first component 122 that is electrically connected to the first substrate 11 can be connected.

[0087] In the embodiment of the present application, the first component 122 can be electrically connected to the first substrate 11 by means of patch or bonding.

[0088] In some embodiments of the present application, when the first component 122 is a chip, the chip can be connected to the first substrate 11 by face-up or flip-up. Figure 3 In the illustrated embodiment, the first packaging layer 12 includes two first components 122, both of which are chips. One of the first components 122 is connected to the first substrate 11 in a flip-chip manner, that is, the pins of the first component 122 are located on the side of the first component 121 facing the first substrate 11, and the pins of the first component 122 are directly connected to the pads on the first substrate 11 to achieve electrical connection between the first component 122 and the first substrate 11. The other first component 122 is connected to the first substrate 11 in a face-up manner, that is, the pins of the first component 122 are located on the side of the first component 122 facing away from the first substrate 11, and the pins are bonded to the pads on the first substrate 11 through bonding wires 1221, thereby achieving electrical connection between the first component 122 and the first substrate 11.

[0089] In some embodiments, a metal sheet is stacked on the surface of the front-mounted chip (i.e., a chip connected to the substrate in a front-mounted manner) facing away from the first substrate 11, and the first heat sink 124 is connected to the metal sheet, thereby avoiding damage to the front-mounted chip when laser drilling and forming the first heat sink 124 on the first packaging material layer 121. The material forming the metal sheet can be the same as or different from the first heat sink 124. In this embodiment, the material forming the metal sheet is the same as the first heat sink 124 and forms an integral structure with the heat sink 124, thereby avoiding increasing the contact interface and enhancing the thermal conductivity effect.

[0090] One end of each first connection column 123 is connected to the first substrate 11, and the other end extends to the surface of the first packaging material layer 121 away from the first substrate 11 and is connected to the second package body 20. In this embodiment, the end surface of the first connection column 123 extending to the surface of the first packaging material layer 121 away from the first substrate 11 is the first connection terminal 10a of the first package body 10. Specifically, the first connection column 123 is fixed to the first substrate 11 by conductive glue or solder, and is electrically connected to the first substrate 11 by conductive glue or pads. In the embodiment of the present application, the first connection column 123 and the first heat sink 124 are both made of conductive and thermally conductive materials, that is, the first connection column 123 and the first heat sink 124 have a high thermal conductivity (thermal conductivity greater than 10W / m·K), can conduct heat, and the first connection column 123 and the first heat sink 124 can also conduct electricity. In some embodiments of the present application, the first connection column 123 and the first heat sink 124 are made of metal materials such as gold, silver, copper, and aluminum. The materials of the first connecting column 123 and the second heat sink block may be the same or different. In the present embodiment, the first connecting column 123 and the first heat sink block 124 are both formed of metal copper, and the first connecting column 123 and the first heat sink block 124 are formed as an integral structure. It is understandable that in some embodiments, the first connecting column 123 and / or the first heat sink block 124 may also be made of other non-metallic conductive materials, or in the following embodiments, the first connecting column 123 and / or the first heat sink block 124 may be a heat pipe, thereby achieving a better thermal conductivity effect.

[0091] Each first heat sink 124 is connected to at least one first connection column 123, and each first heat sink 124 is connected to one or more first components 122, so that at least part of the heat generated by the operation of the first components 122 can be transferred to the first connection column 123 through the first heat sink 124. In this embodiment, the number of first components 122 and first heat sink 124 is the same, both of which are two, and each first heat sink 124 corresponds to one first component 122 and is connected to the corresponding first component 122. It can be understood that in some embodiments, the number of first components 122 can be more than the number of first heat sinks 124, and only some of the first components 122 are connected to the first heat sink 124. For example, in some embodiments, there are some active devices and some passive devices among the plurality of first components 122. Since the active devices often generate more heat than the passive devices when they are working, only the active devices can be connected to the first heat sink 124 to enhance the heat dissipation effect of the active devices. Figure 3The arrow in the middle indicates the heat transfer path in the packaging structure 100. In this embodiment, since the first components 122 are all arranged on the first substrate 11 and directly connected to the first substrate 11, part of the heat of the first components 122 is directly transferred to the first substrate 11, and is transferred to the outside of the packaging structure 100 through the first substrate 11. In addition, the first substrate 11 is also connected to the first heat dissipation block 124, and part of the heat of the first components 122 can also be transferred to the first substrate 11 through the first heat dissipation block 124 via the first connecting column 123, and is transferred to the outside of the packaging structure 100 through the first substrate 11. In this embodiment, since the first substrate 11 is connected to the main board 800 through the external pins 13, the heat transferred to the first substrate 11 can be transferred to the main board 800. In this embodiment, each first component 122 has a corresponding first heat dissipation block 124 connected thereto, so that each first component 122 can dissipate heat through the first heat dissipation block 124. It is understandable that in some embodiments, only some of the first components 122 may be connected to the first heat sink 124, so that only some of the first components 122 can dissipate heat through the first heat sink 124. For example, when one first component 122 generates a large amount of heat and another first component 122 generates a small amount of heat, only one first heat sink 124 may be provided to connect to the first component 122 that generates a large amount of heat, thereby ensuring the heat dissipation effect and reducing the number of first heat sinks 124 to save costs.

[0092] In the embodiment of the present application, since the first connection pillar 123 is connected to the first substrate 11, and the first heat sink 124 is connected to the first component 122 and the first connection pillar 123, part of the heat generated by the first component 122 can be transmitted to the first substrate 11 through the first heat sink 124 and the first connection pillar 123. Compared with the packaging structure without the first connection pillar 123 and the first heat sink 124, the packaging structure 100 of the embodiment of the present application can increase the transmission path of the heat generated by the first component 122 by adding the first heat sink 124 and the first connection pillar 123, thereby improving the heat dissipation capacity of the packaging structure 100.

[0093] It can be understood that in some embodiments, since the heat generated by the first component 122 is not high, or since the first component 122 is directly connected to the first substrate 10, most of the heat can be directly transmitted to the first substrate 10, and the heat dissipation efficiency is relatively high. Therefore, the first packaging layer 12 may also not have the first heat dissipation block 124.

[0094] In this embodiment, since the first connecting column 123 and the first heat sink 124 are both made of metal materials, they have higher strength than the first packaging material layer 121. In addition, in order to achieve a better thermal conductivity, the first connecting column 123 and the first heat sink 124 occupy a larger volume in the first packaging body 10. For example, in some embodiments of the present application, the diameter of the first connecting column 123 is greater than 200 μm to achieve a better thermal conductivity. Therefore, in this embodiment, the frame structure formed by embedding the first heat sink 124 and the first connecting column 123 in the first packaging material layer 121 can also enhance the strength of the first packaging body 10.

[0095] Since the first heat sink 124 and the first connection column 123 are both conductive, and the first connection column 123 is connected to the first substrate 11, in some embodiments, a signal can be input to the first connection column 123 through the first substrate 11, and the signal can be transmitted to the first component 122 through the first connection column 123 and the first heat sink 124; or, the signal generated by the first component 122 can be transmitted to the first substrate 11 through the first connection column 123 and the first heat sink 124, and communicate with the outside world through the first substrate 11. That is, the first connection column 123 and the first heat sink 124 can also play a role in signal transmission, increase the signal transmission path in the packaging structure 100, and realize signal redistribution and other functions. In this embodiment, the first substrate 11 is electrically connected to the external structure of the packaging structure 100 through the external pin 13, thereby realizing signal connectivity inside and outside the packaging structure 100.

[0096] It can be understood that, depending on the different signals input to the first connecting column 123 and the first heat sink 124, the structure formed by the connection of the first connecting column 123 and the first heat sink 124 plays different roles. For example, in some embodiments, the external pin 13 is electrically connected to the power module, that is, the first connecting column 123 inputs a power signal, so that the structure formed by the connection of the first connecting column 123 and the first heat sink 124 can be used as a power network of the packaging structure 100, and can be powered by the power network for each component connected to each heat sink in the first packaging layer 12. Alternatively, in some embodiments, the external pin 13 connected to the first connecting column 123 can be grounded, and the ground return in the packaging structure 100 can be from the first component 122 through the first heat sink 124, the first connecting column 123, the connecting line of the first substrate 11, and the external pin 13 to the ground, thereby forming a low-impedance ground network path, which can form a good Faraday electromagnetic shield.

[0097] When the structure formed by the first connection column 123 and the first heat sink 124 plays different roles, the structure formed by the first connection column 123 and the first heat sink 124 and the position in the package structure 100 can be different. In this embodiment, the first heat sink 124 is located on the side of the first component 122 away from the first substrate 11, the first connection column 123 is close to the edge of the first package body 10 relative to the first component 122, and the first heat sink 124 is connected with the first connection column 123 to form a frame structure that covers the side of the first component 122 away from the first substrate 11. The frame structure can enhance the strength of the inside of the package structure 100 and prevent the package structure 100 from being damaged by external forces. When the first connection column 123 is grounded through the external pin 13, and the frame structure forms a Faraday electromagnetic shield, it can well isolate the electromagnetic interference between the first component 122 in the package structure 100 and other structures in the package structure 100, as well as the electromagnetic interference of the external environment of the package structure 100 on the first component 122 in the package structure 100.

[0098] It is understandable that in some other embodiments of the present application, the first connecting pillars 123 may be partially located at the edge of the first package body 10 relative to the first component 122, and may also be partially located at any other position of the first substrate 11. For example, the first connecting pillars 123 may be located between adjacent first components 122 on the first substrate 11. By increasing the number of first connecting pillars 123 connected to the first substrate 11 in the package structure 100, the channels for heat transfer from the first component 122 to the first substrate 11 can be increased, thereby improving the heat extraction efficiency of the first component 122. In addition, the volume occupied by the first connecting pillars 123 in the first package layer 12 can be increased, thereby enhancing the strength of the package structure 100.

[0099] See also Figure 4 , Figure 4 for Figure 3 A perspective view of the first package body 10 of the package structure 100 of the embodiment shown. In this embodiment, the first heat sink 124 connected to each first component 122 is connected as a whole, and the first connecting pillars 123 are all connected to the first heat sink 124. In some cases, it can also be considered that Figure 4The embodiment shown has only one first heat sink 124, and all the first components 122 are connected to the same first heat sink 124. In other words, the first heat sink 124 and the first connecting pillars 123 of the first package 10 of this embodiment are connected to form an integrated frame. In this embodiment, the first heat sink 124 and the first connecting pillars 123 are connected to form an integrated frame. When at least one first connecting pillar 123 is grounded, the integrated frame formed by the first heat sink 124 and the first connecting pillars 123 forms a Faraday electromagnetic shielding body, which can well isolate the electromagnetic interference between the first component 122 in the package structure 100 and other structures in the package structure 100, as well as the electromagnetic interference of the external environment of the package structure 100 to the first component 122 in the package structure 100. In addition, since there is no need to reserve gaps between the first heat sinks 124, the volume occupied by the first heat sink 124 and the first connecting pillars 123 in the first package 10 can be larger, achieving better heat conduction effect and strength enhancement effect.

[0100] See also Figure 5 , Figure 5 The figure shows a perspective view of the first package body 10 of the package structure 100 of some other embodiments of the present application. In this embodiment, the first connecting column 123 and the first heat sink 124 can provide a signal for the first component, in order to ensure the directionality of signal transmission. The first heat sinks 124 connected to different first components 122 are arranged at intervals, and the first connecting columns 123 connected to different first heat sinks 124 are also arranged at intervals. In this embodiment, there are two first components 122, namely the first component 122a and the first component 122b. There are also two first heat sinks 124, namely the first heat sink 124a and the first heat sink 124b. Among them, the first heat sink 124a is connected to the first component 122a, and the first heat sink 124b is connected to the first component 122b. The first heat sink 124a and the first heat sink 124b are arranged at intervals. In some embodiments, the first connecting column 123 connected to the first heat sink 124a and the first connecting column 123 connected to the first heat sink 124a are connected to different external pins 13 through the routing layer 112 on the first substrate 11, different external pins 13 input different signals, and the first connecting column 123 connected to the first heat sink 124a inputs different signals and the first connecting column 123 connected to the first heat sink 124a inputs different signals, thereby inputting different signals for the first component 122a and the first component 122b, respectively.

[0101] Please review Figure 3In this embodiment, the structure of the second package body 20 is similar to that of the first package body 10, including a second substrate 21 and a second package layer 22 packaged on the second substrate 21. The second package layer 22 is located on the side of the second substrate 21 facing the first package layer 12.

[0102] The second substrate 21 is a circuit board, including two relative insulating layers 211 and at least one wiring layer 212 arranged between the two insulating layers 211. When the wiring layer 212 is multi-layer, the second substrate 21 also includes a signal interconnection layer 213 arranged between two adjacent wiring layers 212. The signal interconnection layer 213 includes an insulating material layer 2131 and a connecting line 2132 passing through the insulating material layer 2131. The insulating material layer 2131 separates and insulates the two adjacent wiring layers 212, and the connecting line 2132 embedded in the insulating material layer 2131 connects the adjacent wiring layers 212, so that the multiple wiring layers 212 can communicate with each other. In this embodiment, the wiring layer 212 is two layers. It can be understood that the number of wiring layers 212 can be more layers.

[0103] In some embodiments, the second substrate 21 may also include only one insulating layer. Specifically, the second substrate 21 has no insulating layer on the side facing the second packaging layer 22 , so that the second packaging layer 22 is directly packaged on the wiring layer 212 of the second substrate 21 .

[0104] In this embodiment, a surface of the insulating layer 211 facing away from the wiring layer 212 is further provided with a welding pad connected to the wiring layer 212 , and the welding pad is used to achieve connection between components and other structures and the wiring layer 212 of the second substrate 21 .

[0105] The second packaging layer 22 includes a second packaging material layer 221 and one or more second components 222, a plurality of second connecting pillars 223 and one or more second heat sinks 224 embedded in the second packaging material layer 221. The second components 222 can be active components such as chips, or passive components such as capacitors, inductors, and resistors. Each second component 222 is connected to the second substrate 21. The second components 222 can be directly connected to the second substrate, or can be indirectly connected to the second substrate 21 through other structures.

[0106] In some embodiments, the second component 222 may be a chip, and the chip may also be connected to the second substrate 21 in an upright or flip-up manner. A metal sheet is stacked on the surface of the upright chip (i.e., a chip connected to the substrate in an upright manner) facing away from the second substrate 12, and the second heat sink 224 is connected to the metal sheet, thereby avoiding damage to the upright chip when laser drilling and forming the second heat sink 224 on the second packaging material layer 221. The material forming the metal sheet may be the same as or different from that of the second heat sink 224. In this embodiment, the material forming the metal sheet is the same as that of the second heat sink 224 and is connected as an integral structure to avoid increasing the contact interface, thereby enhancing the thermal conductivity effect.

[0107] In this embodiment, the second component 222 is arranged on the second substrate 21, and the pin of the second component 222 is connected to the pad of the second substrate 21, so as to realize the direct connection between the second component 222 and the second substrate 21. The second component 222 can be one or more. When there are multiple second components 222, since the multiple second components 222 are all arranged on the second substrate 21 and connected to the pad of the second substrate 21, and the pad is connected to the wiring layer 212 of the second substrate 21, the multiple second components 222 can be electrically connected through the wiring layer 212 of the second substrate 21, and each second component 222 can communicate with each other through the wiring layer 212 of the second substrate 21. In the embodiment of the present application, the second component 222 can be electrically connected to the second substrate 21 by means of patch or bonding. In the embodiment of the present application, when the second component 222 is a chip, the chip can also be connected to the first substrate 11 by means of face-up or flip-up.

[0108] One end of each second connection pillar 223 is connected to the second substrate 21, and the other end extends to the surface of the second packaging material layer 221 away from the second substrate 21 and is connected to the second package body 20. In this embodiment, the end surface of the second connection pillar 223 extending to the surface of the second packaging material layer 221 away from the second substrate 21 is the second connection terminal 20a of the second package body 20.

[0109] The second connecting column 223 and the second heat sink 224 are both made of conductive and heat-conductive materials, that is, the second connecting column 223 and the second heat sink 224 have a high thermal conductivity (thermal conductivity greater than 10W / m·K), can conduct heat, and the second connecting column 223 and the second heat sink 224 can also conduct electricity. In some embodiments, the second connecting column 223 and the second heat sink 224 can be made of metal materials such as gold, silver, copper, and aluminum. The materials of the second connecting column 223 and the second heat sink 224 can be the same or different. In this embodiment, the second connecting column 223 and the second heat sink 224 are both formed of metal copper, and the second connecting column 223 and the second heat sink 224 are formed into an integral structure. In some embodiments, the second connecting column 223 and / or the second heat sink 224 can also be made of other non-metallic conductive materials, or in the following embodiments, the second connecting column 223 and / or the second heat sink 224 can be a heat pipe, so as to achieve a better thermal conductivity effect.

[0110] In this embodiment, at least part of the first connection terminal 10a is arranged opposite to at least part of the second connection terminal 20a, that is, at least part of the first connection pillar 123 is arranged opposite to at least part of the second connection pillar 223. The sub-connection block 31 is connected between the first connection terminal 10a and the second connection terminal 20a that are arranged opposite to each other, that is, the sub-connection block 31 is connected between the first connection pillar 123 and the second connection pillar 223 that are arranged opposite to each other. Among them, at least part of the first connection pillar 123 and at least part of the second connection pillar 223 are arranged opposite to each other, which means that at least part of the first connection pillar 123 and at least part of the second connection pillar 223 partially overlap or completely overlap in the orthographic projection of the first substrate 11 toward the surface of the first encapsulation layer 12. In this embodiment, the orthographic projections of the first connecting pillar 123 and the second connecting pillar 223 arranged opposite to each other on the surface of the first substrate 11 facing the first packaging layer 12 are completely overlapped, so that when the packaging structure 100 is subjected to pressure in the thickness direction, since the height directions of the first connecting pillar 123 and the second connecting pillar 223 are the same as the thickness direction of the packaging structure 100, and the first connecting pillar 123 and the second connecting pillar 223 correspond to the same position on the first substrate 11, a better support effect can be achieved, and damage caused by pressure in the thickness direction of the packaging structure 100 can be avoided. In addition, the heat transfer path from the first connecting pillar 123 to the second connecting pillar 223 is the shortest, thereby achieving efficient heat transfer.

[0111] Each second heat sink 224 is connected to at least one second connection column 223, and each second heat sink 224 is connected to one or more second components 222, so that at least part of the heat of the second components 222 can be transferred to the second connection column 223 through the second heat sink 224. In this embodiment, the number of second components 222 is greater than the number of second heat sinks 224, and only part of the second components 222 are connected to the second heat sink 224. In this embodiment, the plurality of second components 222 include two active components and one passive component. Since the active component often generates more heat than the passive component when working, only the active component is connected to the second heat sink 224 to enhance the heat dissipation effect of the active component. It can be understood that in some embodiments, the number of second heat sinks 224 can be the same as the number of second components 222, and each second component 222 has a corresponding second heat sink 224 connected thereto, so as to export at least part of the heat of the second component 222 through the second heat sink 224.

[0112] In this embodiment, since the second components 222 are all arranged on the second substrate 21 and directly connected to the second substrate 21, part of the heat of the second components 222 can be directly transferred to the second substrate 21, and transferred to the outside of the packaging structure 100 through the second substrate 21. In addition, the second substrate 21 is also connected to the second heat dissipation block 224, and part of the heat of the second components 222 can also be transferred to the second substrate 21 through the second heat dissipation block 224 via the second connecting column 223, and transferred to the outside of the packaging structure 100 through the second substrate 21. In addition, part of the heat of the second components 222 can also be transferred to the first connecting column 123 through the second connecting column 223 through the connecting layer 30, and then transferred to the first substrate 11. It can be understood that in some embodiments, part of the heat generated by the first component 122 can also be transferred to the second substrate 21 through the first heat dissipation block 124, the first connecting column 123, the connecting layer 30, and the second connecting column 223 in sequence. In the present embodiment, there are three second components 222 in the second packaging layer 22, and two of the second components 222 are connected to the corresponding second heat sink 224. In the present embodiment, only some of the second components 222 are connected to the second heat sink 224, so that only the heat of some of the second components 222 can be partially dissipated through the second heat sink 224. For example, when one second component 222 generates a large amount of heat and another second component 222 generates a small amount of heat, only one second heat sink 224 can be provided to connect to the second component 222 with a large amount of heat, while ensuring the heat dissipation effect, reducing the number of second heat sinks 224, and saving costs. It can be understood that in some embodiments, each second component 222 is connected to a second heat sink 224, so that the heat of each second component 222 can be partially dissipated through the second heat sink 224, thereby improving the heat dissipation efficiency of the packaging structure 100.

[0113] In this embodiment, the first heat sink 124 is connected to the first connection column 123, the first connection column 123 is connected to the first substrate 11, the second heat sink 224 is connected to the second connection column 223, the second connection column 223 is connected to the second substrate 21, and the first connection column 123 is connected to the second connection column 223, so that the first heat sink 124, the first connection column 123, the second heat sink 224, the second connection column 223 and the first substrate 11, the second substrate 21 are connected to form a heat dissipation frame, which can increase the heat conduction path of the first component 122 and the second component 222. Compared with the packaging structure without the first heat sink 124 and the second heat sink 224, the heat of the second component 222 can only be transferred to the second substrate 21 first, and then transferred to the first substrate 11 through the second substrate 21, the heat dissipation efficiency of the packaging structure 100 of the embodiment of the present application is significantly improved. Furthermore, since the heat dissipation frame is formed in the first package body 10 and the second package body 20, the heat generated in the first package body 10 can be transferred to the second package body 20 through the heat dissipation frame, and the heat generated in the second package body 20 can be transferred to the first package body 10 through the heat dissipation frame, that is, the heat in the first package body 10 and the second package body 20 can be transferred to each other, thereby achieving heat distribution between the first package body 10 and the second package body 20, avoiding heat concentration at a certain position in the package structure 100, and avoiding damage to components in the package structure 100 due to temperature concentration.

[0114] It should be noted that in the embodiment of the present application, the first heat dissipation block 124, the first connecting column 123, the second heat dissipation block 224, the second connecting column 223 and the first substrate 11 and the second substrate 21 are connected to form a heat dissipation frame which can play other roles besides the heat conduction role, and the structure of the heat dissipation frame may be different depending on the different roles played.

[0115] In this embodiment, the heat dissipation frame plays a role in heat dissipation. Therefore, it is only necessary to keep the first heat dissipation block 124 connected to the first component 122 and the first connecting column 123, and the second heat dissipation block 224 connected to the second component 222 and the second connecting column 223. Among them, the first heat dissipation blocks 124 connected to different first components 122 can be separated or connected to each other; the second heat dissipation blocks 224 connected to different second components 222 can be separated or connected to each other. In this embodiment, the first heat sink 10 and Figure 4 The first package body 10 of the package structure shown in the figure is similar to the first heat sink 124 connected to the different first components 122 and connected as a whole; the second heat sink 20 is connected to the Figure 5 The first package body 10 of the package structure shown is similar, and the second heat sinks 224 connected to different second components 222 are arranged at intervals.

[0116] In the present embodiment, since the first heat dissipation block 124, the first connecting column 123, the second heat dissipation block 224, and the second connecting column 223 are all made of metal materials and have higher strength than the first packaging material layer 121 and the second packaging material layer 221, the heat dissipation frame formed by the first heat dissipation block 124, the first connecting column 123, the second heat dissipation block 224, and the second connecting column 223 can also serve as a supporting frame within the packaging structure 100, thereby improving the strength of the packaging structure 100 and preventing the packaging structure 100 from being damaged by external pressure.

[0117] In this embodiment, the second heat dissipation block 224 is located on the side of the second component 222 away from the second substrate 21, and the second connecting column 223 is close to the edge of the second package body 20 relative to the second component 222. The second heat dissipation block 224 is connected to the second connecting column 223 to form a frame structure covering the side of the second component 222 away from the second substrate 21. The frame structure can enhance the internal strength of the packaging structure 100 and prevent the packaging structure 100 from being damaged by external forces.

[0118] It is understandable that in some other embodiments of the present application, the second connecting pillars 223 may be partially located at the edge of the first package body 10 relative to the second component 222, and may also be partially located at any other position of the second substrate 21. For example, the second connecting pillars 223 may be located between adjacent second components 222 on the second substrate 21. By increasing the number of second connecting pillars 223 connected to the second substrate 21 in the package structure 100, the channels for heat transfer from the second component 222 to the second substrate 21 can be increased, thereby improving the heat extraction efficiency of the second component 222. In addition, the volume occupied by the second connecting pillars 223 in the second package layer 22 can be increased, thereby enhancing the strength of the package structure 100.

[0119] See also Figure 6 , Figure 6 FIG. 1 is a schematic diagram of a package structure 100 according to another embodiment of the present invention. In this embodiment, the structures of the first package body 10 and the second package body 20 are similar to Figure 4The structure of the first package body 10 shown is similar, that is, the second heat sinks 224 connected to different second components 222 are connected as a whole, that is, all the second heat sinks 224 are connected as a whole. Moreover, in this embodiment, the first connection column 123 connected to the first heat sink 124 is at least partially electrically connected to the second connection column 223 connected to the second heat sink 224, so that the first heat sink 124, the first connection column 123 and the second heat sink 224, the second connection column 223 are connected as a whole. When at least one of the first heat sink 124, the first connection column 123 and the second heat sink 224, the second connection column 223 connected as a whole is grounded, the first heat sink 124, the first connection column 123 and the second heat sink 224, the second connection column 223 can form a Faraday electromagnetic shield. Specifically, at least one first connection column 123 or at least one second connection column 223 is grounded, and the first heat sink 124 connected as one body can be electrically connected to the grounded first connection column 123 or the grounded second connection column 223, so that the first heat sink 124 connected as one body is grounded. In other words, the first heat sink 124 connected as one body can be directly connected to the grounded first connection column 123, so that the first heat sink 124 connected as one body can be grounded; or, the first heat sink 124 connected as one body can be connected to the grounded first connection column 123 through the connection layer 30, so that the first heat sink 124 connected as one body can be grounded. In addition, the second heat sink 124 connected as one body can be electrically connected to the grounded first connection column 123 or the grounded second connection column 223, so that the second heat sink 124 connected as one body is grounded. In other words, the second heat sink 124 connected as one piece can be directly connected to the grounded first connecting column 123, so that the second heat sink 224 connected as one piece can be grounded; or, the second heat sink 224 connected as one piece can be connected to the grounded first connecting column 123 through the connecting layer 30, so that the second heat sink 224 connected as one piece can be grounded. Figure 6The arrow in the middle shows a schematic diagram of the direction of the ground return generated by the functional system of the package structure 100 from the components to the power supply end. In this embodiment, at least two of the external pins 13 on the first substrate 11 are grounded, and the returned ground signal of the first component 122 can be transmitted to the grounded external pin 13 through the routing layer 112 of the first substrate 11 or transmitted to the grounded external pin 13 through the first heat sink 124 and the first grounding column 123. The returned ground signal of the second component 222 can be transmitted to the second connecting column 223 through the routing layer 112 of the second substrate 11 or the second heat sink 224, and then transmitted to the grounded external pin 13 through the second connecting column 223, the connecting portion 30, the first connecting column 123, and the routing layer 112 of the first substrate 11 in sequence, so that the first heat sink 124, the first connecting column 123 and the second heat sink 224, the second connecting column 223 are connected as a whole to form a low-impedance ground network path, which can form a good Faraday electromagnetic shielding body. Moreover, in the present embodiment, the first heat dissipation block 124 is located on the side of the first component 122 away from the first substrate 11, the first connecting column 123 is close to the edge of the first package body 10 relative to the first component 122, and the first heat dissipation block 124 is connected to the first connecting column 123 to form a frame structure covering the side of the first component 122 away from the first substrate 11; the second heat dissipation block 224 is located on the side of the second component 222 away from the second substrate 21, the second connecting column 223 is close to the edge of the second package body 20 relative to the second component 222, and the second heat dissipation block 224 is connected to the second connecting column 223 to form a frame structure covering the side of the second component 222 away from the second substrate 21. When the first connecting column 123 or the second connecting column 223 is grounded through the external pin 13, the frame structure forms a Faraday electromagnetic shielding body, which can effectively isolate the first component 122 in the packaging structure 100 from the second component 222 in the packaging structure 100, as well as the electromagnetic interference of the external environment of the packaging structure 100 on the second component 222 in the packaging structure 100.

[0120] See also Figure 7 , Figure 7 FIG. 1 is a schematic diagram of a package structure 100 according to another embodiment of the present invention. In this embodiment, the structures of the first package body 10 and the second package body 20 are similar to Figure 5The structure of the first package body 10 shown is similar, that is, there are multiple first components 122, first heat sinks 124, and first connecting pillars 123, multiple first heat sinks 124 are arranged at intervals, and different first heat sinks 124 connect different first components 122 and first connecting pillars 123. There are multiple second components 222, second heat sinks 224, and second connecting pillars 223, multiple second heat sinks 224 are arranged at intervals, and different independently arranged second heat sinks 224 connect different second components 222 and second connecting pillars 223. Figure 7 The arrow in the middle shows a schematic diagram of the direction of the ground return generated by the functional system of the packaging structure 100 returning from the components to the power supply end. In this embodiment, the external pin 13 connected to the first connecting column 123 on the first substrate 11 is electrically connected to the power module, that is, the power signal is input to the first connecting column 123, and the power signal input to the first connecting column 123 is transmitted to the first component 122 through the first heat sink 124 connected to the first connecting column 123, thereby supplying power to the first component 122, and is transmitted to the second component 222 through the second connecting column 223 connected to the first connecting column 123 and the second heat sink 224, so as to supply power to the second component 222. In other words, in this embodiment, in addition to serving as a heat dissipation and supporting frame, the heat dissipation frame can also serve as a power network to supply power to the first component 122 and the second component 222.

[0121] It is understandable that in some embodiments, the first heat sink 124 and the first connecting column 123 connected to different first components 122 can be connected to different external pins 13, and the second heat sink 224 and the second connecting column 223 connected to different second components 222 can be connected to different external pins 13. Different external pins 13 are connected to different external modules, so that different signals are provided to the components connected thereto through different first heat sinks 124 and different second heat sinks 224. For example, some external pins 13 are electrically connected to the antenna module 200 so that the first component 122 or the second component 222 connected to the external pin 13 communicates with the antenna module 200; some external pins 13 are electrically connected to the sensor module 400 so that the first component 122 or the second component 222 connected to the external pin 13 communicates with the sensor module 400. In the present embodiment, by arranging the first connecting column 123, the first heat dissipation block 124 and the second connecting column 223, the second heat dissipation block 224 in the packaging structure 100, and providing a signal to the first component 122 through the first connecting column 123, the first heat dissipation block 124, and providing a signal to the second component 222 through the second connecting column 223, the second heat dissipation block 224, the transmission path of the signal in the packaging structure 100 is increased, so that in addition to distributing the signal to different first components 122 or different second components 222 through the substrate, the signal can also be distributed to different first components 122 or different second components 222 through the first connecting column 123, the first heat dissipation block 124 and the second connecting column 223, the second heat dissipation block 224, that is, the signal redistribution in the packaging structure 100 can also be achieved through the first connecting column 123, the first heat dissipation block 124 and the second connecting column 223, the second heat dissipation block 224.

[0122] See also Figure 8 , Figure 8 The schematic diagram of the packaging structure of other embodiments of the present application is shown. Figure 3The difference between the illustrated embodiments is that an external pin 23 is provided on one side of the second substrate 21 away from the second packaging layer 22, and the external pin 23 is used to electrically connect to the external structure of the packaging structure 100. The external pin 23 is connected to the wiring layer 212, so that the second substrate 21 can be electrically connected to the external structure of the packaging structure 100 (such as the functional modules of the electronic device 1000) through the external pin 23, so that the structure in the packaging structure 100 electrically connected to the second substrate 21 (such as the second component 222) is electrically connected to the external structure of the packaging structure 100. Since the second heat sink 224 and the second connecting column 223 are both conductive, and the second connecting column 223 is connected to the second substrate 21, in some embodiments, a signal can be input to the second connecting column 223 through the second substrate 21, and the signal can be transmitted to the second component 222 through the second connecting column 223 and the second heat sink 224. In this embodiment, the second connecting column 223 is connected to the external pin 23 of the second substrate 21 through the wiring layer 112 on the second substrate 21, the external pin 23 is connected to the external structure of the package structure 100, and the external structure of the package structure 100 communicates with the corresponding second component 222 through the external pin 23, the second substrate 21, the second connecting column 223, and the second heat sink 224 in sequence. Alternatively, the external structure of the package structure 100 is connected to the external pin 13 of the first substrate 11, and the external structure of the package structure 100 communicates with the corresponding second component 222 through the external pin 13, the first substrate 11, the first connecting column 123, the second connecting column 223, and the second heat sink 224 in sequence.

[0123] Since the second connecting column 223 is electrically connected to the first connecting column 123, the signal transmitted through the external pin 23 can also be transmitted to the first component 122 through the second connecting column 223, the first connecting column 123, and the first heat sink 124 in sequence, thereby realizing communication between the first component 122 and the external structure of the packaging structure 100.

[0124] In the embodiment of the present application, since the surface of the first substrate 11 away from the first packaging layer 12 is provided with external pins 13, and the surface of the second substrate 21 away from the second packaging layer 22 is provided with external pins 23, the signal can be transmitted through the first substrate 11 side and can also be transmitted through the second substrate 21. Compared with the method of only setting the external pins 13 on one side (such as the first substrate 11), the number of external pins 13 is increased, thereby increasing the density of the lead-out signal in the entire packaging structure 100, increasing the number of components in the packaging structure 100, and improving the number of components integrated in the packaging structure 100, which is convenient for realizing the miniaturization of the electronic device 1000 and the improvement of the functional diversification. In addition, compared with the method of only setting the external pins 13 on one side, the components in the packaging structure 100 can be connected not only to the external pins 13 on the first substrate 11, but also to the external pins 23 on the second substrate 21, thereby increasing the flexibility of the components and wiring settings in the packaging structure 100 and simplifying the design of the packaging structure 100.

[0125] See also Fig. 9 , Fig. 9 The structure diagram of another embodiment of the present application is shown. Figure 3 The difference between the embodiments shown is that in this embodiment, the first components 122 in the first packaging layer 12 are stacked in the thickness direction of the packaging structure 100, and the first heat sink 124 is in contact with the first component 122 farthest from the first substrate 11 in the stacked first components 122. The thickness direction of the packaging structure 100 refers to the direction perpendicular to the first substrate 11 toward the surface of the first packaging layer 12, that is, Fig. 9 Y direction shown in .

[0126] In this embodiment, there are three first components 122 encapsulated in the first encapsulation layer 12, and the three first components 122 are respectively a first component 122a, a first component 122b and a first component 122c. Among them, the first component 122a and the first component 122b are both arranged on the first substrate 11 and directly connected to the first substrate 11. The first component 122a and the first component 122b are stacked in the thickness direction of the encapsulation structure 100, that is, the first component 122c is stacked on the side of the first component 122a away from the first substrate 11. In addition, in this embodiment, the first component 122c is connected to the first substrate 11 through the connecting column 125 to realize the electrical connection between the first component 122c and the first substrate 11, and can transfer part of the heat generated by the first component 122c to the first substrate 11 through the connecting column 125. In this embodiment, the first heat sink 124 contacts the surface of the first component 122c facing away from the first substrate 11, and part of the heat generated by the first component 122c is transmitted to the first substrate 10 through the first heat sink 124 and the first connecting column 123, and then transmitted out.

[0127] In some embodiments, one end of the connecting column 125 facing away from the first component 122c is connected to the first component 122a, so as to achieve electrical connection between the first component 122c and the first component 122a, and enable part of the heat of the first component 122a to pass through the first component 122c and then be transferred to the first heat sink 124, or the heat generated by the first component 122c can be partially transferred to the first substrate 11 through the first component 122a.

[0128] It is understandable that the present application does not limit the number of first components 122 stacked in the first packaging layer 12 , and three, four or more first components 122 may be stacked according to actual needs.

[0129] In the embodiment of the present application, some of the first components 122 in the first packaging layer 12 are stacked in the thickness direction of the packaging structure 100, so that the components are stacked in the thickness direction of the packaging structure 100, thereby improving the density of the components in the packaging structure 100. When the same number of first components 122 are packaged in the first packaging layer 12, since some of the first components 122 are stacked in the thickness direction of the packaging structure 100, compared with the packaging structure 100 in which all the first components 122 are directly connected to the first substrate 11 (such as Figure 3 For the package structure 100 shown in the figure, the size of the first substrate 11 can be reduced, thereby reducing the occupied area of ​​the package structure 100.

[0130] It is understandable that in some other embodiments of the present application, the second components 222 can also be stacked in the thickness direction of the package structure 100, so as to further increase the density of the components in the package structure 100, and use the space in the thickness direction of the package structure 100 to reduce the occupied area of ​​the package structure 100. When the package structure 100 is applied to the electronic device 1000, due to its small occupied area, the size of the electronic device 1000 can be reduced, thereby realizing the miniaturization of the electronic device 1000. In addition, due to the increased density of the components in the package structure 100, compared with the Figure 3 For the package structure 100 shown, when the volume of the package structure 100 is the same, the number of components that can be packaged in the package structure 100 is greater, which can help to achieve the improvement of the functional diversity of the electronic device 1000.

[0131] See also Fig.10 , Fig.10 Schematic diagram of a packaging structure 100 of some other embodiments of the present application. Fig. 9 The difference between the illustrated embodiments is that a third substrate 126 is further provided in the first packaging layer 12, and the connecting pillars 124 are supported between the third substrate 126 and the first substrate 11, and electrically connect the first substrate 11 and the third substrate 126. The first component 122 can be provided on the surface of the third substrate 126 facing the first substrate 11 and / or the surface away from the first substrate 11, so as to make full use of the space in the thickness direction of the packaging structure 100. In addition, a plurality of (two or more) first components 122 can be provided on the third substrate 126, and the electrical connection between at least part of the first components 122 provided on the third substrate 126 is realized through the third substrate 126. In this embodiment, the first component 122c is supported on the surface of the first substrate 11 facing the first packaging layer 12 by the connecting pillars 125, and a space can be formed between the first component 122c and the first substrate 11 to provide the first component 122a, so as to make full use of the space in the thickness direction of the packaging structure 100 and improve the density of the components in the packaging structure 100.

[0132] In some embodiments, a third substrate 126 may also be disposed in the second packaging layer 22. The third substrate 126 is supported between the second substrate 21 and the third substrate 126 by the connecting column 125, and electrically connects the second substrate 21 and the third substrate 126. The second component 222 is disposed on the surface of the third substrate 126 facing the second substrate 21 and / or the surface away from the second substrate 21. In this embodiment, a plurality of second components 222 may be disposed on the third substrate 126, and the electrical connection between at least some of the second components 222 disposed on the third substrate 126 is realized through the third substrate 126. In this implementation, by disposing the third substrate 126 in the first packaging layer 12, the first component 122 can be disposed on both opposite sides of the third substrate 126. In addition, by disposing the third substrate 126 in the second packaging layer 22, the second component 222 can be disposed on both opposite sides of the third substrate 126, thereby fully utilizing the space in the thickness direction of the packaging structure 100 and improving the density of components in the packaging structure 100.

[0133] It is understandable that in some embodiments, the third substrate 126 may be provided only in the second packaging layer 22, and no third substrate 126 may be provided in the first packaging layer 12, that is, the second components 222 in the second packaging layer 22 are stacked in the thickness direction of the packaging structure 100, and the first components 122 in the first packaging layer 12 are all provided on the first substrate 11.

[0134] In some embodiments, one end of the connection column 124 is connected to the third substrate 126, and the other end can be connected to the first component 122 stacked with the third substrate 126 in the thickness direction and closest to the third substrate 126. Alternatively, one end of the connection column 125 is connected to the third substrate 126, and the other end can be connected to the first component 122 stacked with the third substrate 126 in the thickness direction and closest to the third substrate 126.

[0135] See also Fig.11 , Fig.11 Another packaging structure 100 of the present application is shown. Figure 3The difference of the package structure 100 of the illustrated embodiment is that the connection layer 30 further includes a heat conducting block 32. The heat conducting block 32 is located between the surface of the first heat dissipation block 124 that exposes the first package material layer 121 and the surface of the second heat dissipation block 224 that exposes the second package material layer 221. The heat conducting block 32 connects the first heat dissipation block 124 and the second heat dissipation block 224, and is used to realize heat transfer between the second heat dissipation block 224 and the second package body 20, improve the heat transmission speed between the first package body 10 and the second package body 20, and improve the heat distribution efficiency in the package structure 100. In addition, a heat conducting block 32 is provided between the surface of the first heat dissipation block 124 that exposes the first package material layer 121 and the surface of the second heat dissipation block 224 that exposes the second package material layer 221, that is, a heat conducting block 32 is added between the first package body 10 and the second package body 20, so as to further improve the connection and fixing strength between the first package body 10 and the second package body 20. Among them, the first heat conducting block 32 can be one or more blocks, and the multiple first heat conducting blocks 32 are arranged at intervals. The first heat conducting block 32 may be a heat conducting structure such as a soldering point or a heat conducting adhesive layer. In this embodiment, the first heat conducting block 32 is the same as the sub-connection block 31 and is a soldering point, thereby simplifying the manufacturing process.

[0136] See also Fig.12 , Fig.12 Another packaging structure 100 of the present application is shown. Figure 3 The difference between the illustrated embodiments is that the side of the second package body 20 facing away from the first package body 10 is covered with a thermally conductive adhesive layer 23, and the thermally conductive adhesive layer 23 is used to transfer heat. In this embodiment, the second substrate 21 of the second package body 20 is located on the side facing away from the second package layer 22 and away from the first package body 10, and the thermally conductive adhesive layer 23 is located on the surface of the second substrate 21 facing away from the second package layer 22. In addition, in this embodiment, the thermally conductive adhesive layer 23 covers the surface of the second substrate 21 facing away from the second package body 20. The thermally conductive adhesive layer 23 can be used to adhere the package structure 100 to the heat dissipation structure in the electronic device 1000, so as to fix the package structure 100 in the electronic device 1000, and enable heat to be transferred to the heat dissipation structure through the second substrate 21 and the thermally conductive adhesive layer 23, so as to enhance the heat dissipation efficiency of the package structure 100.

[0137] In this embodiment, part of the insulating layer 111 on the side of the second substrate 21 away from the second packaging layer 22 is hollowed out to expose part of the routing layer 112, and when the thermal conductive adhesive layer 23 covers the second substrate 21 away from the second packaging layer 22, the thermal conductive adhesive layer 22 can directly contact the exposed part of the routing layer 112. Since the thermal conductivity of the thermal conductive adhesive layer 23 is higher than that of the insulating layer 111, the heat generated by the components in the packaging structure 100 of this embodiment can be transferred out faster through the thermal conductive adhesive layer 23. It is understandable that in some embodiments of the present application, the insulating layer 111 on the side of the second substrate 21 away from the second packaging layer 22 can also be directly removed, and the thermal conductive adhesive layer 23 can be covered, so that the heat transmitted by the routing layer 112 can be transferred out as soon as possible. It should be noted that the thermal conductive adhesive layer 23 is formed of an insulating thermal conductive material.

[0138] In some embodiments, a release film 24 is provided on one side of the thermal conductive adhesive layer 23 away from the second packaging layer 22. When the packaging structure 100 is fixed on the middle frame 900, the release film 24 can be directly torn off to paste the thermal conductive adhesive layer 23 on the middle frame 900, which is easy to operate.

[0139] See also Fig.13 , Fig.13 Shown is the Fig.12 A partial cross-sectional schematic diagram of the package structure 100 of the illustrated embodiment when it is arranged in the electronic device 1000. In this embodiment, the electronic device 1000 includes a middle frame 900 and a main board 800, and the middle frame 900 is used to achieve heat dissipation of the electronic device 1000. The package structure 100 is arranged between the main board 800 and the middle frame 900. Among them, the first substrate 11 of the package structure 100 is connected to the main board 800 through the external pin 13, so that the package structure 100 is fixed and electrically connected to the first substrate 11. The thermal conductive adhesive layer 23 of the package structure 100 contacts the middle frame 900 to fix the package structure 100 to the middle frame 900. In this embodiment, the heat generated by the operation of the components in the package structure 100 can be transmitted to the first substrate 11, and transmitted to the main board 800 through the external pin 13, and the heat is dispersed to various positions of the main board 800 and various working modules connected to the main board 800 through the main board 800, so as to avoid the heat being concentrated at the position of the package structure 100 and causing damage. Furthermore, the heat generated by the components in the packaging structure 100 can be transferred to the second substrate 21 , and then transferred to the middle frame 900 through the thermal conductive adhesive layer 23 , and the heat is dissipated out of the electronic device 1000 through the middle frame 900 .

[0140] See also Fig.14 , Fig.14 FIG. 1 is a schematic diagram of a packaging structure 100 of another embodiment of the present application. Figure 3The difference of the illustrated embodiment is that the second package body 20 further includes a third package layer 25. The third package body 25 is packaged on a side of the second substrate 21 away from the second package layer 22. The third package layer 25 includes a third package material layer 251 and one or more third components 252 embedded in the third package material layer 251. Each third component 252 is electrically connected to the second substrate 21. In this embodiment, there are multiple third components 252 embedded in the third package material layer 251.

[0141] In this embodiment, each third component 252 is disposed on the second substrate 21 and is directly connected to the second substrate 21, that is, the pins of the third component 252 are directly connected to the second substrate 21. It is understandable that in some embodiments of the present application, the third component 252 may also be indirectly connected to the second substrate 21 through a connecting column. Alternatively, in some embodiments, the third components 252 are stacked in the thickness direction of the package structure 100. Some of the stacked third components 252 are directly electrically connected to the second substrate 21, and other third components 252 are indirectly electrically connected to the second substrate 21 through the third components 252 directly connected to the second substrate 21, or are indirectly electrically connected to the second substrate 21 through a connecting column.

[0142] In the present embodiment, the third encapsulation layer 25 is encapsulated on the side of the second substrate 21 facing away from the second encapsulation layer 22, that is, encapsulation layers are provided on two opposite sides of the second substrate 21, thereby increasing the number of components stacked in the thickness direction of the encapsulation structure 100, reducing the occupied area of ​​the encapsulation structure 100 applied to the electronic device 1000, and increasing the number of components in the encapsulation structure 100, thereby facilitating the miniaturization and multifunctionality of the electronic device 1000.

[0143] See also Fig.15 , Fig.15 The figure shows a schematic diagram of the structure of a packaging structure 100 according to another embodiment of the present application. In this embodiment, the third packaging layer 25 also includes a plurality of third connecting pillars 253 and one or more third heat dissipation blocks 254, and all the third connecting pillars 253 and all the third heat dissipation blocks 254 are embedded in the third packaging material layer 251. One end of each third connecting pillar 253 is connected to the second substrate 21, and the other end extends to the surface of the third packaging layer 25 away from the second substrate 21, each third heat dissipation block 254 is connected to at least one third connecting pillar 253, and each third heat dissipation block 254 is connected to one or more third components 252, so that the third components 252 and the third connecting pillars 253 can be connected through the third heat dissipation blocks 254, and the heat of the third components 252 can be transferred to the third connecting pillars 253 through the third heat dissipation blocks 254.

[0144] In this embodiment, part of the heat generated by the third component 252 can be directly transferred to the second substrate 21, and part of the heat can be transferred to the second substrate 21 through the third heat sink 254 and the third connecting column 253 in sequence, thereby increasing the heat transfer path of the third component 252, so that the heat generated by the third component 252 can be transferred to other positions of the packaging structure 100 more quickly to avoid heat concentration. In addition, the heat generated by the second substrate 21 can be transferred to the first substrate 11 through the second connecting column 223 and the first connecting column 123 in sequence, and transferred to the outside of the packaging structure 100 through the external pins 13 of the first substrate 11, thereby achieving heat dissipation. It can be understood that in this embodiment, the heat generated by the second component 222 in the second packaging layer 22 and the first component 122 in the first packaging layer 12 can also be transferred to the third packaging layer 25 to achieve uniform heat in the packaging structure 100, avoid heat accumulation at a certain position in the packaging structure 100, and avoid damage to the packaging structure due to heat accumulation.

[0145] In some embodiments of the present application, the third heat dissipation block 254 exposes the third packaging material layer 251 on the surface facing away from the second substrate 21 to simplify the production process. In some embodiments, the third packaging layer 25 is covered with a thermal conductive adhesive layer 23 on the side facing away from the second substrate 21. Since the third connecting column 253 exposes the third packaging material layer 251 on the surface facing away from the third substrate 126, the third connecting column 253 can contact the thermal conductive adhesive layer 23 to transfer part of the heat in the packaging structure 100 to the thermal conductive adhesive layer 23 through the third connecting column 253. When the packaging structure 100 is arranged in the electronic device 1000, the thermal conductive adhesive layer 23 can fix the packaging structure 100 on the heat dissipation structure in the electronic device 1000, and enable the heat generated in the packaging structure 100 to be transferred to the heat dissipation structure in the electronic device 1000 through the thermal conductive adhesive layer 23.

[0146] In this embodiment, since the third heat dissipation block 254 exposes the third packaging material layer 251 on a side facing away from the second substrate 21, when the thermal conductive adhesive layer 23 covers the side of the third packaging layer 25 facing away from the second substrate 21, the third heat dissipation block 254 is in direct contact with the thermal conductive adhesive layer 23, so that the heat generated by the third component 252 can be transmitted to the thermal conductive adhesive layer 23 more quickly, and transmitted to the heat dissipation structure outside the packaging structure 100 through the thermal conductive adhesive layer 23, thereby improving the heat dissipation efficiency of the packaging structure 100.

[0147] See also Fig.16 , Fig.16 FIG. 1 is a schematic diagram of a packaging structure 100 of another embodiment of the present application. Figure 3The difference between the illustrated embodiments is that the surface of the first heat sink 124 facing away from the first substrate 11 exposes the first packaging material layer 121, the surface of the second heat sink 224 facing away from the second substrate 21 exposes the second packaging layer 22, the surface of the first heat sink 124 exposed to the first packaging layer 12 is in contact with the surface of the second heat sink 224 exposed to the second packaging layer 22, and the first heat sink 124 and the second heat sink 224 form an integral structure. In this embodiment, the first heat sink 124 and the second heat sink 224 form an integral structure means that the first heat sink 124 and the second heat sink 224 can achieve a fixed connection between the first package body 10 and the second package body 20 through intermolecular forces. Specifically, the surface of the first heat sink 124 exposed from the first packaging layer 12 is brought into contact with the surface of the second heat sink 224 exposed from the second packaging layer 22, and the contact interface is heated, pressurized, and the like, so that intermolecular forces are generated between the surface of the first heat sink 124 exposed from the first packaging layer 12 and the surface of the second heat sink 224 exposed from the second packaging layer 22, thereby forming an integral structure of the first heat sink 124 and the second heat sink 224. In this embodiment, the surface of the first connecting column 123 exposed from the first packaging material layer 121 is brought into contact with the surface of the second connecting column 223 exposed from the second packaging material layer 221, and the fixing is achieved by the intermolecular forces between the first connecting column 123 and the second connecting column 223.

[0148] In this embodiment, the materials forming the first connection pillar 123, the second connection pillar 223, the first heat sink 124, and the second heat sink 224 are all made of metal copper. In this embodiment, the first package body 10 and the second package body 20 are stacked, and the surface of the first heat sink 124 exposed to the first package layer 12 is in contact with the surface of the second heat sink 224 exposed to the second package layer 22, and the surface of the first connection pillar 123 exposed to the first package material layer 121 is in contact with the surface of the second connection pillar 223 exposed to the second package material layer 221, and then the package structure 100 is subjected to heating and pressurization and other treatments, so that the first heat sink 124 and the second heat sink 224 generate intermolecular forces of copper-copper bonding, thereby fixing the first package body 10 and the second package body 20 together by bonding. In addition, the intermolecular forces of copper-copper bonding are also generated between the first connection pillar 123 and the second connection pillar 223, so as to achieve fixation and electrical connection between the first connection pillar 123 and the second connection pillar 223.

[0149] In some embodiments, the surface of the first heat sink 124 facing away from the first substrate 123 will slightly protrude beyond the surface of the first packaging material layer 121 facing away from the first substrate 123, and the surface of the second heat sink 224 facing away from the second substrate 223 will slightly protrude beyond the surface of the second packaging material layer 221 facing away from the second substrate 223, so that when the packaging structure 100 is subjected to heating, pressurization and other treatments, the first packaging material layer 121 and the second packaging material layer 221 will not affect the close contact between the first heat sink 124 and the second heat sink 224, thereby avoiding affecting the intermolecular force between the first heat sink 124 and the second heat sink 224.

[0150] In this embodiment, since the first connection pillar 123, the second connection pillar 223, the first heat sink 124, and the second heat sink 224 are formed of the same material, and the first heat sink 124 is connected to the first connection pillar 123, and the second heat sink 224 is connected to the second connection pillar 223, the first connection pillar 123 may not be arranged opposite to the second connection pillar 223, but may correspond to the position of the first heat sink 124, that is, when the first package body 10 and the second package body 20 are stacked, the end of the first connection pillar 123 exposed from the first packaging material layer 121 contacts the second heat sink 224, so that the signal transmitted in the first connection pillar 123 can be transmitted to the second connection pillar 223 through the second heat sink 224. Alternatively, in some embodiments, when the first package body 10 and the second package body 20 are stacked, the end of the second connection pillar 223 exposed from the second packaging material layer 221 contacts the first heat sink 124, so that the signal transmitted in the first connection pillar 123 can be transmitted to the second connection pillar 223 through the first heat sink 124. When the first connecting column 123 contacts the second heat dissipation block 224, the first connecting column 123 and the second heat dissipation block 224 can also generate intermolecular force under certain conditions, so that the first package body 10 and the second package body 20 are fixed and electrically connected; or, when the second connecting column 223 contacts the first heat dissipation block 124, the second connecting column 223 and the first heat dissipation block 124 can also generate intermolecular force under certain conditions, so that the first package body 10 and the second package body 20 are fixed and electrically connected.

[0151] See also Fig.17 , Fig.17 Another packaging structure 100 of the present application is shown. Figure 3The difference between the illustrated embodiments is that the second substrate 21 is located on the side of the second packaging layer 22 facing the first substrate 11, and the first connecting column 123 is electrically connected to the second substrate 21. In this embodiment, a pad connected to the wiring layer 112 of the second substrate 21 is provided on the second substrate 21, and the surface of the first connecting column 123 exposed from the first packaging material layer 121 is connected to the pad on the second substrate 21 through the connecting layer 30, thereby realizing the electrical connection between the first connecting column 123 and the substrate. In this embodiment, the surface of the first connecting column 123 exposed from the first packaging material layer 121 is the first output terminal 10a of the first package body 10, and the pad on the second substrate 21 electrically connected to the first connecting column 123 is the second connecting terminal 20a.

[0152] In some embodiments, the side of the second packaging layer 22 facing away from the second substrate 21 is covered with a thermally conductive adhesive layer 23. In this embodiment, the second heat sink 224 faces away from the second substrate 21, exposing the second packaging material layer 221, and the second connecting pillar 223 faces away from the second substrate 21, exposing the second packaging material layer 221. When the thermally conductive adhesive layer 23 is covered on the second packaging layer 22, it can directly contact the second heat sink 224 and the second connecting pillar 223, so that the heat transferred from the second heat sink 224 and the heat transferred to the second connecting pillar 223 can be quickly dissipated through the thermally conductive adhesive layer 23, thereby improving the heat dissipation efficiency of the packaging structure 100.

[0153] The present application also provides a method for preparing the packaging structure 100. Fig.18 , Fig.18 Shown Figure 3 The preparation process flow chart of the package structure 100 of the embodiment shown in the figure. The method for forming the package structure 100 is to first form a first package body 10 and a second package body 20, and then connect the first package body 10 and the second package body 20 through a connecting layer 30 to achieve a fixed connection and electrical connection between the first package body 10 and the second package body 20. The method for forming the first package body 10 may include:

[0154] Step 110: See Fig.19a , the first connecting pillars 123 and the first components 122 are fixed on the first substrate 11. In some other embodiments of the present application, when the first components 122 in the first packaging layer 12 are stacked in the thickness direction, step 110 is to fix the first connecting pillars 123 and part of the first components 122 on the first substrate 11.

[0155] In this embodiment, the first connection pillar 123 may be fixed to the first substrate 11 by conductive adhesive bonding or soldering, so that the first connection pillar 123 is fixed and electrically connected to the first substrate 11. The first component 122 may be fixed to the first substrate 11 by patch bonding or bonding, so that the first component 122 is fixed and electrically connected to the first substrate 11.

[0156] In some embodiments, when the first component 122 is a chip, and the chip is fixed on the first substrate 11 in a positive manner, that is, the pins of the chip are located on the surface of the chip away from the first substrate 11, before the chip is fixed and electrically connected to the first substrate 11 through the bonding wires 1221, it is necessary to stick a metal sheet 125 on the surface of the chip away from the first substrate 11 by gluing or welding. In this embodiment, the material of the metal sheet 125 is the same as that of the first connecting column 123 and the first heat sink 124. It is understandable that in some embodiments, the material of the metal sheet 125 may also be different from that of the first connecting column 123 or the first heat sink 124.

[0157] Step 120: See Fig.19b The first packaging material layer 121 is packaged on the side of the first substrate 11 provided with the first connecting pillar 123 and the first component 122, so that the first connecting pillar 123 and the first component 122 are embedded in the first packaging material layer 121. The first packaging material layer 121 is a packaging material such as resin.

[0158] Step 130: See Fig.19c A groove is formed on the surface of the first packaging material layer 121 away from the first substrate 11 to expose the surface of the first connecting column 123 away from the first substrate 11 and the surface of the first component 122 away from the first substrate 11. When a metal sheet is provided on the surface of the first component 122 away from the first substrate 11, a groove is formed in the first packaging material layer 121 in step 130 to expose the metal sheet provided on the surface of the first component 122.

[0159] In this embodiment, the groove is formed by laser grooving, and the depth of the laser grooving can be controlled according to specific needs. When the chip is fixed in a positive manner, the active surface of the chip is away from the first substrate 11. When laser grooving, since the position of the grooving is located above the chip, in order to avoid the problem of damaging the chip due to insufficient control accuracy of the grooving depth, a metal sheet is formed on the side of the positive chip away from the first substrate 11, and the laser grooving is performed until the metal sheet 125 is exposed, thereby avoiding damage to the chip caused by the laser grooving. It can be understood that in some other embodiments of the present application, the groove can also be formed by molding or the like.

[0160] Step 140: See Fig.19dA metal layer 126 is formed on a side of the first packaging material layer 121 away from the first surface. The metal layer 126 covers the surface of the first packaging material layer 121 away from the first substrate 11 and fills the groove formed in step 130 .

[0161] Step 150: See Fig.19e , the metal layer 126 is thinned to a suitable thickness, and a first heat sink 124 connecting the first component 122 and the first connecting column 123 is obtained. In this embodiment, the surface of the thinned metal layer 126 away from the first substrate 11 is a plane, so as to facilitate the processing in subsequent steps. It is understood that in some embodiments, step 150 may be absent.

[0162] The method of forming the second package body 20 is similar to the method of forming the first package body 10, including:

[0163] Step 210: Please refer to Fig.19f , the second connecting pillars 223 and the second components 222 are fixed on the second substrate 21. In some other embodiments of the present application, when the second components 222 in the first packaging layer 12 are stacked in the thickness direction, step 110 is to fix the second connecting pillars 223 and part of the second components 222 on the second substrate 21.

[0164] In this embodiment, the second connection pillar 223 can be fixed on the second substrate 21 by conductive adhesive bonding or soldering, so that the second connection pillar 223 is fixed and electrically connected to the second substrate 21. The second component 222 can be fixed on the second substrate 21 by patch or bonding, so that the second component 222 is fixed and electrically connected to the second substrate 21.

[0165] In some embodiments, when the second component 222 is a chip, and the chip is fixed on the second substrate 21 in a positive manner, that is, the pins of the chip are located on the surface of the chip away from the second substrate 21, before the chip is fixed and electrically connected to the second substrate 21 through the bonding wires 1221, it is necessary to stick a metal sheet 225 on the surface of the chip away from the second substrate 21 by gluing or welding. In this embodiment, the material of the metal sheet 225 is the same as that of the second connecting column 223 and the second heat sink 224. It is understandable that in some embodiments, the material of the metal sheet 225 may also be different from that of the second connecting column 223 or the second heat sink 224.

[0166] Step 220: Please refer to Figure 19gThe second substrate 21 is provided with a second connection column 223 and a second component 222 on one side thereof, and the second packaging material layer 221 is packaged so that the second connection column 223 and the second component 222 are embedded in the second packaging material layer 221. The second packaging material layer 221 is a packaging material such as resin.

[0167] Step 230: Please refer to Figure 19h A groove is formed on the surface of the second packaging material layer 221 away from the second substrate 21 to expose the surface of the second connecting column 223 away from the second substrate 21 and the surface of the second component 222 away from the second substrate 21. When a metal sheet 225 is provided on the surface of the second component 222 away from the second substrate 21, a groove is formed in the second packaging material layer 221 in step 230 to expose the metal sheet 225 provided on the surface of the second component 222.

[0168] In this embodiment, the groove is formed by laser grooving, and the depth of the laser grooving can be controlled according to specific needs. When the chip is fixed in a positive manner, the active surface of the chip is away from the second substrate 21. When laser grooving, since the position of the grooving is located above the chip, in order to avoid the problem of damaging the chip due to insufficient control accuracy of the grooving depth, a metal sheet is formed on the side of the positive chip away from the second substrate 21, and the laser grooving is performed until the metal sheet 225 is exposed, thereby avoiding damage to the chip caused by the laser grooving. It can be understood that in some other embodiments of the present application, the groove can also be formed by molding and the like.

[0169] Step 240: Please refer to Fig.19i A metal layer 226 is formed on a side of the second packaging material layer 221 away from the first surface. The metal layer 226 covers the surface of the second packaging material layer 221 away from the second substrate 21 and fills the groove formed in step 130 .

[0170] Step 250: See Fig.19j , the metal layer 226 is thinned to a suitable thickness, and a second heat sink 224 connecting the second component 222 and the second connecting column 223 is obtained. In this embodiment, the surface of the thinned metal layer 226 away from the second substrate 21 is a plane, so as to facilitate the processing in subsequent steps. It can be understood that in some embodiments, step 150 may be omitted.

[0171] It is understandable that, in some embodiments, when the second package body 20 further includes a third package layer 25 , the third package layer 25 is formed by repeating steps 210 to 250 on a side of the second substrate 21 away from the second component 222 .

[0172] Finally, the first package body 10 is fixedly connected to the second package body 20. In some embodiments, the first package body 10 is fixedly connected to the second package body 20 includes:

[0173] Step 310: Please refer to Figure 19k The first package body 10 and the second package body 20 are fixedly connected through the connection layer 30, and the electrical connection between the first package body 10 and the second package body 20 is achieved.

[0174] In some embodiments, the connection layer 30 includes a sub-connection block 31 , which may be formed of solder or conductive adhesive, that is, the first package body 10 and the second package body 20 are fixedly connected and electrically connected by welding or dispensing.

[0175] In some embodiments, step 310 can be replaced by laminating the first packaging material layer 211 of the first packaging body 10 with the second packaging material layer 221 of the second packaging body 20, and heating and pressurizing the first packaging body 10 and the second packaging body 20 to form an intermolecular force between the first heat sink 124 of the first packaging body 10 and the second heat sink 224 of the second packaging body 20, thereby achieving fixed connection and electrical connection between the first packaging body 10 and the second packaging body 20.

[0176] In the present application, the heat generated by the first component 122 can be partially directly transferred to the first substrate 11, and partially transferred to the first substrate 11 through the first heat sink 124 and the first connecting column 123 connected to the first component 122. In addition, the heat generated by the second component 222 can also be partially directly transferred to the second substrate 22, and partially transferred to the second substrate 21 through the second heat sink 224 and the second connecting column 223 connected to the second component 222. It can be seen from the heat transfer paths of the first component and the second component that there are multiple heat transfer paths for the first component and the second component in the present application. When the first component or the second component is working and generating heat, the heat can be transferred out in time through multiple paths to improve the heat transfer efficiency of the packaging structure and enhance the heat dissipation effect of the packaging structure, so as to avoid excessive heat in the three-dimensional packaging stacking structure, which affects the normal operation of the components in the packaging structure or damages the components in the packaging structure. In addition, in the embodiment of the present application, the first connecting column 123 and the second connecting column 223 are connected, so that the first package body 10 and the second package body 20 are electrically connected. Furthermore, the heat generated by the components in the first package 10 or the second package 20 can be transferred between the first package 10 and the second package 20, thereby preventing heat from accumulating in the first package 10 or the second package 20 and avoiding damage caused by heat accumulation in the packaging structure 100.

[0177] The above is a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A packaging structure, characterized in that: comprising a first package body and a second package body stacked on the first package body; The first package body comprises a first substrate and a first package layer packaged on the first substrate; a plurality of external pins are formed on a side of the first substrate away from the first package layer, and the external pins are used to connect the external structure of the package structure; the first package layer comprises a first package material layer and one or more first components and a plurality of first connecting pillars embedded in the first package material layer; each of the first components is electrically connected to the first substrate; one end of each of the first connecting pillars is connected to the first substrate, and the other end extends to the surface of the first package material layer away from the first substrate; the first connecting pillars are formed of a thermal conductive material; The second package body includes a second substrate and a second package layer packaged on the second substrate; the second package layer includes a second package material layer and one or more second components, a plurality of second connecting pillars and one or more second heat sinks embedded in the second package material layer; each of the second components is connected to the second substrate; One end of each second connecting column is connected to the second substrate, and the other end extends to the surface of the second packaging material layer facing away from the second substrate; each second heat sink is connected to at least one second connecting column, and each second heat sink is connected to one or more second components; the second connecting column and the second heat sink are formed of thermally conductive material; the second substrate or the second connecting column is connected to the first connecting column.

2. The packaging structure according to claim 1, characterized in that: The first package body includes one or more first heat dissipation blocks, each of which is connected to at least one of the first connecting pillars, and each of which is connected to one or more of the first components; the first heat dissipation blocks are formed of thermally conductive materials.

3. The packaging structure according to claim 2, characterized in that: Each of the first heat dissipation blocks is located on a side of the first component away from the first substrate, and each of the first connecting pillars is close to an edge of the first package body relative to the first component; or Each of the second heat dissipation blocks is located on a side of the second component away from the second substrate, and the second connecting column is close to an edge of the second package body relative to the second component.

4. The packaging structure according to claim 3, characterized in that: At least one of the first connecting column or the second connecting column is grounded, all of the first heat dissipation blocks are connected as a whole and are electrically connected to the grounded first connecting column or the grounded second connecting column, and all of the second heat dissipation blocks are connected as a whole and are electrically connected to the grounded first connecting column or the grounded second connecting column.

5. The packaging structure according to claim 2, characterized in that: There are a plurality of the first components, the first heat sink block, and the first connecting column, the plurality of the first heat sink blocks are arranged at intervals, different first heat sink blocks are connected to different first components and first connecting columns, and different first heat sink blocks are used to transmit different signals; or There are multiple second components, second heat sinks and second connecting pillars. The multiple second heat sinks are arranged at intervals. Different second heat sinks are connected to different second components and second connecting pillars. Different second heat sinks are used to transmit different signals.

6. The packaging structure according to claim 1, characterized in that: An external pin is provided on a side of the second package body facing away from the first package body, and the external pin is used to be electrically connected to an external structure of the package structure.

7. The packaging structure according to any one of claims 2 to 5, characterized in that: The second encapsulation layer is located on a side of the second substrate facing the first encapsulation layer, and the first connecting pillar is connected to the second connecting pillar; The packaging structure further includes a connection layer, wherein the connection layer is connected between the first packaging layer and the second packaging layer and connects the first connection column and the second connection column.

8. The packaging structure according to claim 7, characterized in that: The connection layer includes a plurality of sub-connection blocks arranged at intervals, and there are a plurality of the first connection pillars and the second connection pillars. At least some of the first connection pillars and at least some of the second connection pillars are arranged opposite to each other. The sub-connection blocks are connected between the first connection pillars and the second connection pillars opposite to each other, and the sub-connection blocks are formed of thermally conductive and electrically conductive materials.

9. The packaging structure according to claim 8, characterized in that: The surface of the second heat sink facing away from the second substrate exposes the second packaging layer, and the surface of the first heat sink facing away from the first substrate exposes the first packaging layer. The connecting layer also includes a heat conductive block connected between the surface of the first heat sink exposing the first packaging layer and the surface of the second heat sink exposing the second packaging layer.

10. The packaging structure according to any one of claims 2 to 5, characterized in that: The surface of the second heat sink facing away from the second substrate exposes the second packaging layer, and the surface of the first heat sink facing away from the first substrate exposes the first packaging layer. The surface of the first heat sink exposing the first packaging layer is in contact with the surface of the second heat sink exposing the second packaging layer, and the first heat sink and the second heat sink form an integral structure.

11. The packaging structure according to claim 7, characterized in that: The second packaging body also includes a third packaging layer, which is packaged on a side of the second substrate facing away from the second packaging layer. The third packaging layer includes a third packaging material layer and one or more third components embedded in the third packaging material layer, and each of the third components is connected to the second substrate.

12. The packaging structure according to claim 11, characterized in that: The third packaging layer also includes a plurality of third connecting columns embedded in the third packaging material layer and one or more third heat dissipation blocks; one end of each of the third connecting columns is connected to the second substrate, and the other end extends to the surface of the third packaging material layer away from the second substrate, each of the third heat dissipation blocks is connected to at least one of the third connecting columns, and each of the third heat dissipation blocks is connected to one or more of the third components.

13. The packaging structure according to claim 7, characterized in that: The second substrate comprises a wiring layer and an insulating layer covering a side of the wiring layer away from the second packaging layer, and the second component is electrically connected to the wiring layer; a portion of the insulating layer is hollowed out to expose a portion of the wiring layer; A side of the second substrate facing away from the second packaging layer is covered with a thermal conductive adhesive layer, the thermal conductive adhesive layer is in contact with the exposed portion of the wiring layer, and the thermal conductive adhesive layer is used to transfer heat.

14. The packaging structure according to claim 13, characterized in that: A release film is provided on a side of the thermal conductive adhesive layer facing away from the second packaging layer.

15. The packaging structure according to claim 2, characterized in that: The first component comprises a front-mounted chip, a surface of the front-mounted chip facing away from the first substrate is laminated with a metal sheet, and the first heat sink is connected to the metal sheet; or The second component comprises a front-mounted chip, a surface of the front-mounted chip facing away from the second substrate is stacked with a metal sheet, and the second heat sink is connected to the metal sheet.

16. The packaging structure according to claim 1, characterized in that: There are a plurality of first components in the first substrate, and at least two of the plurality of first components are stacked in a thickness direction of the first package; or There are a plurality of the second components in the second substrate, and at least two of the plurality of the second components are stacked in a thickness direction of the second package.

17. An electronic device, characterized in that: The electronic device comprises a functional module and a packaging structure as claimed in any one of claims 1 to 16, and the functional module is electrically connected to the packaging structure.

18. The electronic device as claimed in claim 17, wherein: The electronic device includes a mainboard, the packaging structure and the functional module are fixed on the mainboard and electrically connected to the mainboard; the first substrate of the packaging structure is close to the mainboard relative to the first packaging layer, and is electrically connected to the mainboard through the external pins.

19. The electronic device as claimed in claim 18, characterized in that: The electronic device includes a middle frame, which is arranged opposite to the main board. The packaging structure is located between the middle frame and the main board and connects the middle frame and the main board. The second packaging body of the packaging structure is connected to the middle frame at a side facing away from the first substrate, and the middle frame is used for heat dissipation.

20. The electronic device according to any one of claims 17 to 19, characterized in that: The electronic device is a mobile phone, and the functional module includes one or more of an antenna module, a sensor module, an audio module, a camera module, a connector module, and a power module.

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