Display device

Abstract

A display device is provided. The display device includes: a display panel; a printed circuit board connected to the display panel; an elastic element disposed between the display panel and the printed circuit board; a first conductor disposed between the elastic element and the printed circuit board; and a second conductor disposed between the elastic element and the display panel and forming a capacitor with the first conductor, wherein the printed circuit board includes a first pad connected to the first conductor.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2018-0087749, filed with the Korean Intellectual Property Office (KIPO) on Jul. 27, 2018, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present invention relates to a display device, and more particularly, to a display device including a force sensor. Background Art

[0003] Display devices may include liquid crystal display ("LCD") devices, organic light emitting diode ("OLED") display devices, plasma display panels ("PDP") devices, electrophoretic display devices, and the like.

[0004] These display devices may include a force sensor for sensing pressure when touching the screen and a touch sensor for sensing an input when touching the screen.

[0005] The force sensor may be disposed on the rear surface of the display panel or on one surface of a printed circuit board ("PCB") disposed on the rear surface of the display panel. The force sensor and the PCB may be connected to each other using a separate flexible printed circuit board ("FPCB"). A signal for driving the force sensor or a signal output from the force sensor is transmitted from the PCB through the FPCB or through the FPCB to the PCB.

[0006] However, such a force sensor may have an unstable connection with the PCB and may have a complex structure. Summary of the Invention

[0007] According to an exemplary embodiment of the present invention, a display device includes: a display panel; a printed circuit board connected to the display panel; an elastic member disposed between the display panel and the printed circuit board; a first conductor disposed between the elastic member and the printed circuit board; and a second conductor disposed between the elastic member and the display panel and forming a capacitance with the first conductor. The printed circuit board includes a first pad connected to the first conductor.

[0008] The printed circuit board may include a cover layer having an opening corresponding to the first pad. The first conductor may be connected to the first pad through the opening.

[0009] The first conductor may include a plurality of conductors separated from each other.

[0010] The first conductor may be a conductive tape.

[0011] The conductive tape may include an adhesive layer, a conductive layer, and an insulating layer.

[0012] The first conductor may include a conductive paste.

[0013] The first pad may be in contact with the first conductor.

[0014] The first pad may be superimposed on the first conductor in a plan view.

[0015] The first pad may be connected to a sensor controller configured to measure a change in capacitance.

[0016] The printed circuit board may include a second pad connected to the second conductor and applied with a ground voltage.

[0017] The printed circuit board may include a cover layer having an opening corresponding to the second pad.

[0018] The display device may further include a conductive strip or a conductive sponge in contact with the second pad and the second conductor.

[0019] The second conductor may include a sheet superimposed on the entire surface of the display area of the display panel.

[0020] The second conductor may include a heat radiation sheet.

[0021] The printed circuit board may include a shielding layer superimposed on the first conductor in a plan view.

[0022] The display device may further include a bracket configured to support the display panel and the printed circuit board.

[0023] According to an exemplary embodiment of the present invention, a display device includes: a display panel; a printed circuit board connected to the display panel; an elastic element disposed between the display panel and the printed circuit board; and a first conductor disposed between the elastic element and the display panel. The printed circuit board includes a second conductor that forms a capacitance with the first conductor.

[0024] The second conductor may be connected to a sensor controller configured to measure a change in capacitance.

[0025] The printed circuit board may include a plurality of wiring layers separated from each other by an insulating layer. The second conductor may be disposed at a first wiring layer closest to the display panel among the plurality of wiring layers.

[0026] The printed circuit board may include a shielding layer disposed at a second wiring layer adjacent to the first wiring layer and superimposed on the second conductor in a plan view.

[0027] The printed circuit board may include a first pad connected to the first conductor and applied with a ground voltage.

[0028] The printed circuit board may include a cover layer having an opening corresponding to the first pad.

[0029] The display device may further include a conductive tape or a conductive sponge that contacts the first pad and the first conductor.

[0030] The first conductor may include a sheet that overlaps the entire surface of the display area of the display panel.

[0031] The first conductor may include a heat radiation sheet.

[0032] The display device may further include a bracket configured to support the display panel and the printed circuit board.

[0033] According to an exemplary embodiment of the present invention, a display device includes: a display panel; a printed circuit board connected to the display panel; a sensing electrode disposed adjacent to the printed circuit board; a conductive sheet disposed adjacent to the display panel; and an elastic element disposed between the sensing electrode and the conductive sheet, wherein the printed circuit board includes a pad connected to the sensing electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other features of the present invention will become more apparent by referring to the exemplary embodiments of the present invention described in detail with reference to the drawings, in which:

[0035] Figure 1 is a perspective view showing a display device according to an exemplary embodiment of the present invention;

[0036] Figure 2 is a view showing Figure 1 an exploded perspective view of the display device shown in;

[0037] Figure 3 is a plan view showing the rear surface of a display panel according to an exemplary embodiment of the present invention;

[0038] Figure 4A is a cross-sectional view taken along line I-I' of Figure 2 ;

[0039] Figure 4B is a view of an enlarged printed circuit board (“PCB”) according to an exemplary embodiment of the present invention;

[0040] Figure 5 is a block diagram showing a force sensor according to an exemplary embodiment of the present invention;

[0041] Figure 6 is a plan view showing the outermost wiring layer of a PCB according to an exemplary embodiment of the present invention;

[0042] Figure 7 is a plan view showing a sensing electrode disposed on a PCB according to an exemplary embodiment of the present invention;

[0043] Figure 8 and Figure 9is a cross-sectional view taken along line I-I' according to an exemplary embodiment of the present invention; Figure 6 of the cross-sectional view taken along line I-I';

[0044] Figure 10 is a plan view showing the outermost wiring layer of a PCB according to an exemplary embodiment of the present invention;

[0045] Figure 11 is a plan view showing the lower wiring layer of a PCB according to an exemplary embodiment of the present invention; and

[0046] Figure 12 is a cross-sectional view taken along line I-I' according to an exemplary embodiment of the present invention; Figure 10 of the cross-sectional view taken along line I-I'. DETAILED DESCRIPTION

[0047] Now, exemplary embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings. However, the present invention may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein.

[0048] In the drawings, for clarity and convenience of description of the thicknesses of multiple layers and regions, the thicknesses of the multiple layers and regions may be shown in an enlarged manner. When a layer, region, or plate is referred to as being "on" another layer, region, or plate, the layer, region, or plate may be directly on the other layer, region, or plate, or there may be an intermediate layer, region, or plate therebetween. In the drawings, like reference numerals may denote like elements.

[0049] Throughout the specification, when an element is referred to as being "connected" to another element, the element may be "directly connected" to the other element, or "electrically connected" to the other element, and one or more intermediate elements may be provided therebetween.

[0050] Taking into account the measurements discussed and the errors associated with measuring a particular quantity (e.g., limitations of the measurement system), as used herein, "about" or "substantially" may include the stated value and represent within an acceptable deviation range of a particular value as determined by a person of ordinary skill in the art. For example, "about" may represent within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0051] Herein, it is assumed that the display device is an organic light emitting diode ("OLED") display device, but the exemplary embodiments of the present invention are not limited thereto, and the display device according to the exemplary embodiments of the present invention may be a liquid crystal display ("LCD") device or a plasma display device.

[0052] Hereinafter, reference will be made to Figures 1 to 12 to describe the exemplary embodiments of the present invention.

[0053] The display device according to an exemplary embodiment of the present invention may include, for example, a smart phone, a tablet personal computer (“PC”), a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a personal digital assistant (“PDA”), a portable multimedia player (“PMP”), an MP3 player, a mobile medical device, a camera, or a wearable device. According to an exemplary embodiment of the present invention, the wearable device may be accessory type (e.g., a watch, a ring, a bracelet, an ankle bracelet, a necklace, a pair of glasses, contact lenses, or a head-mounted device (“HMD”)), textile or clothing attached type (e.g., an electronic clothing), body attached type (e.g., a skin pad or a tattoo), or bio-implantable type (e.g., an implantable circuit).

[0054] In an exemplary embodiment of the present invention, the display device may be one of the various devices described above or a combination thereof. The display device according to an exemplary embodiment of the present invention may be a flexible display device. Here, the display device according to an exemplary embodiment of the present invention is not limited to the above devices, but may include new display devices according to technological progress.

[0055] Hereinafter, a display device according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings. As used herein, the term “user” may refer to a person who uses the display device or a device that uses the display device (e.g., an artificial intelligence (“AI”) display device).

[0056] Figure 1 is a perspective view showing a display device according to an exemplary embodiment of the present invention, Figure 2 is showing Figure 1 an exploded perspective view of the display device shown in

[0057] Referring to Figure 1 and Figure 2 , a display device 10 according to an exemplary embodiment of the present invention includes a case 20, a main circuit board 30, a bracket 40, a display panel 100, a polarizing film 50, and a cover window 60. According to an exemplary embodiment of the present invention, the display device 10 may not include Figure 1 and Figure 2 some components shown in Figure 1 and Figure 2 or may further include components not shown in

[0058] The cover window 60 can transmit the light generated by the display panel 100. In addition, on the cover window 60, a user can perform a touch action (including a force touch) by contacting the cover window 60 with a part of their body (or a stylus). In addition, the cover window 60 has fluidity such that a force touch (e.g., touch pressure) can be transmitted to the force sensor 300 described below. The cover window 60 can include a bendable flexible material, such as tempered glass, reinforced plastic, or polymer material. According to an exemplary embodiment of the present invention, the cover window 60 can be referred to as a glass window.

[0059] The display panel 100, a printed circuit board (“PCB”) 200 (see Figure 3 ), and the force sensor 300 (see Figure 3 are disposed below the cover window 60, for example, between the cover window 60 and the bracket 40 described below. In addition, the display panel 100 can be electrically connected to the main circuit board 30 through the PCB 200 and output content (e.g., text, image, video, icon, widget, or symbol). In addition, the force sensor 300 can be electrically connected to the main circuit board 30 through the PCB 200, receive a touch pressure (e.g., a force touch) from the user, and output information corresponding to the touch pressure to the main circuit board 30.

[0060] The force sensor 300 includes a first conductor, a second conductor that forms a capacitance with the first conductor, and an elastic element disposed between the first conductor and the second conductor. For example, referring to Figure 4A , the first conductor can be a sensing electrode 330 disposed on or in the PCB 200. The second conductor can be a conductive sheet 310 attached to the rear surface of the display panel 100. Hereinafter, the first conductor can be referred to as the sensing electrode 330, and the second conductor can be referred to as the conductive sheet 310. The display panel 100, the PCB 200, and the force sensor 300 will be described below with reference to Figure 3 , Figure 4A , Figure 4B and Figure 5 .

[0061] According to an exemplary embodiment of the present invention, the display panel 100 can include a liquid crystal display (“LCD”) panel, a light emitting diode (“LED”) display panel, an organic light emitting diode (“OLED”) display panel, a microelectromechanical system (“MEMS”) display panel, or an electronic paper display panel. The display panel 100 can be flexible.

[0062] The PCB 200 may have a wiring structure configured to electrically connect the main circuit board 30 to the force sensor 300 and the display panel 100. The PCB 200 may be a flexible printed circuit board (“FPCB”) or a rigid PCB. In addition, the sensor controller 380 for controlling the force sensor 300 may be formed as an integrated circuit (“IC”) chip and mounted on the PCB 200 or the main circuit board 30.

[0063] The bracket 40 supports the display panel 100, the PCB 200, and the force sensor 300. Accordingly, the elastic element 320 of the force sensor 300 may contract due to the touch pressure applied to the cover window 60. The bracket 40 includes, for example, a magnesium alloy and may be disposed on the main circuit board 30. According to an exemplary embodiment of the present invention, a through hole may be provided at the bracket 40, and a part of the PCB 200 may pass through the through hole. In addition, according to an exemplary embodiment of the present invention, an expansion gap may be provided at the bracket 40 to accommodate the expansion of the battery due to aging. According to an exemplary embodiment of the present invention, the through hole may be referred to by various terms such as a via hole, an opening, or an opening portion.

[0064] The main circuit board 30 may be disposed under the bracket 40 and may be electrically connected to the PCB 200 and the display panel 100 through a connector or wiring. The main circuit board 30 may be, for example, a rigid PCB. According to an exemplary embodiment of the present invention, various electronic components, elements, printed circuits, etc. of the display device 10 may be mounted or arranged on the main circuit board 30. The main circuit board 30 may be referred to as a main board, a printed board assembly (“PBA”), or simply a PCB.

[0065] A processor, a communication module, various interfaces, a power management module, etc. may be mounted on the main circuit board 30 in the form of IC chips. In addition, the sensor controller 380 for controlling the force sensor 300 may be formed as an IC chip and mounted at the main circuit board 30. For example, the sensor controller 380 may be a part of the above-described processor.

[0066] The case 20 may be disposed under the main circuit board 30 to support the bracket 40 and accommodate each component of the display device 10. For example, the case 20 may form the interior and / or exterior appearance of the display device 10. The case 20 may also be referred to as a rear case, a rear plate, etc. The case 20 may include an area not exposed to the outside of the display device 10 and an area exposed to the outside of the display device 10. For example, the area not exposed to the outside of the display device 10 may include a plastic injection material, and the area exposed to the outside of the display device 10 may include metal. The exposed area including a metal material at the side surface of the display device 10 may be referred to as a metal bezel. According to an exemplary embodiment of the present invention, at least a part of the metal bezel may be used as an antenna radiator for transmitting and receiving signals of a specified frequency.

[0067] According to an exemplary embodiment of the present invention, the display device 10 may omit at least one of the above components, or may further include at least one other component. According to an exemplary embodiment of the present invention, the display device 10 may further include a touch sensing layer. The touch sensing layer may be laminated between the cover window 60 and the display panel 100, and may include a touch sensor capable of sensing contact or access of a touch object (e.g., a user's body part or an electronic pen). In addition, the touch sensing layer may be included in the display panel 100. In addition, the display device 10 may further include a battery capable of supplying power to the display device 10.

[0068] Hereinafter, the display panel 100, the PCB 200, and the force sensor 300 will be described in detail with reference to Figure 3 , Figure 4A , Figure 4B and Figure 5 .

[0069] Figure 3 is a plan view showing the rear surface of the display panel 100 according to an exemplary embodiment of the present invention, Figure 4A is a cross-sectional view taken along the line I-I' of Figure 2 , Figure 4B is a view of the enlarged PCB 200 according to an exemplary embodiment of the present invention, Figure 5 is a block diagram showing the force sensor 300 according to an exemplary embodiment of the present invention.

[0070] The display panel 100 is disposed under the cover window 60 and may display various contents. The display panel 100 may include a substrate, a plurality of pixels disposed on one surface of the substrate, and at least one wire electrically connected to the pixels. The substrate may include a flexible material such that at least a part thereof (e.g., the bent portion 110) may be bent in a direction toward the rear surface. The wire may include at least one gate line or at least one data line. According to an exemplary embodiment of the present invention, a plurality of gate lines and a plurality of data lines may be arranged in a matrix, and a plurality of pixels may be disposed adjacent to and electrically connected to points where the gate lines and the data lines cross each other.

[0071] Referring to Figure 4A , the display panel 100 includes a display area DA and a non-display area NDA around the display area DA.

[0072] The display area DA is an area on the screen for displaying an image. The planar shape of the display area DA may be a quadrilateral or a quadrilateral with rounded corners. The planar shape of the display area DA is not limited to a quadrilateral, but may have a circular shape, an elliptical shape, or various other shapes. The display area DA includes an effective area including a plurality of pixels.

[0073] A non-display area NDA is provided around a display area DA. The non-display area NDA may form an edge of the display device 10.

[0074] A driver for driving pixel circuits of the display area DA may be provided at the non-display area NDA. The driver may include a driving circuit 130 and driving wirings for transmitting driving signals.

[0075] According to an exemplary embodiment of the present invention, the driving circuit 130 may include a driver IC that provides driving signals and image signals to the display panel 100, or may include a timing controller (T-con) for controlling the timing of driving signals and image signals. The driver IC may include: a gate driver IC that sequentially selects gate signal lines of the display panel 100 and applies a scan signal (or a driving signal) to the gate signal lines of the display panel 100; and a data driver IC (or a source driver IC) that applies an image signal to data signal lines of the display panel 100. According to an exemplary embodiment of the present invention, when the gate driver IC selects a gate signal line and applies a scan signal to change a corresponding pixel to an active state, the data driver IC may apply an image signal to the corresponding pixel through the data signal line. The timing controller may control the transmission time of signals transmitted to the data driver IC and prevent a display time difference that may occur during the process of outputting signals to the display panel 100.

[0076] The display device 10 may include a polarizing film 50 provided on a display surface of the display panel 100. The polarizing film 50 may be attached to the display surface of the display panel 100 using an adhesive layer. The polarizing film 50 may cover the entire portion of the display area DA. In addition, the polarizing film 50 may extend outward from an outer edge of the display area DA to cover at least a part of the non-display area NDA.

[0077] According to an exemplary embodiment of the present invention, the display panel 100 may include flat portions 121 and 122 and a curved portion 110. The flat portions 121 and 122 may include an upper flat portion 121 and a lower flat portion 122 stacked on each other in the thickness direction (Z-axis direction), and the curved portion 110 may be disposed between the upper flat portion 121 and the lower flat portion 122. The curved portion 110 may be curved with respect to the upper flat portion 121 in a direction opposite to the display direction (e.g., in the case of a top-emission display, in a direction toward the lower surface). The curved portion 110 may be disposed on at least one side of the upper flat portion 121. Although the curved portion 110 is depicted as being adjacent to the lower edge of the upper flat portion 121, the present invention is not limited thereto. In an exemplary embodiment of the present invention, the curved portion 110 may be disposed on two or more edges of the upper flat portion 121, for example, on the lower edge and the upper edge of the upper flat portion 121. In an exemplary embodiment of the present invention, the position of the curved portion 110 may be adjacent to other edges of the upper flat portion 121 other than the lower edge, such as the left edge, the right edge, and the upper edge).

[0078] A part of the non-display area NDA and the display area DA may be disposed at the upper flat portion 121. Another part of the non-display area NDA may be disposed at the curved portion 110 and the lower flat portion 122. For example, if at least a part of the non-display area NDA is curved in a direction opposite to the display direction, the bezel of the display device 10 may be reduced.

[0079] Drive signal wirings for transmitting drive signals from the drive circuit 130 may be disposed in the non-display area NDA adjacent to the lower edge of the display area DA. As Figure 3 and Figure 4A shown, the drive circuit 130 may be directly mounted in the non-display area NDA of the lower flat portion 122 or the curved portion 110 and may be connected to the drive signal wirings. Alternatively, the PCB 200 to which the drive circuit 130 is mounted may be attached to the lower flat portion 122 or the curved portion 110 of the display panel 100 such that the drive circuit 130 and the drive signal wirings in the non-display area NDA may be electrically connected to each other.

[0080] The drive circuit 130 or the PCB 200 may be electrically connected to pads (or referred to as "lands") of the non-display area NDA by using an anisotropic conductive film or the like, and the drive signal wirings are exposed at the pads.

[0081] The bent protective layer can be provided at the bent portion 110. The bent protective layer can cover the bent portion 110 to protect the substrate and the bent drive signal wiring, and reduce the bending stress. The bent protective layer can be partially removed from the area of the drive circuit 130 and the PCB 200 where the lower flat portion 122 is installed, thereby exposing the drive signal wiring pads.

[0082] Referring to Figure 3 , the PCB 200 includes a drive wiring pad 220 connected to the lower flat portion 122 of the display panel 100 and a drive wiring pad 210 connected to the main circuit board 30. The PCB 200 can include: a horizontal portion 201 extending in a direction (X-axis direction) parallel to the edge of the lower flat portion 122; a vertical portion 202 extending in a direction (Y-axis direction) perpendicular to the horizontal portion 201; and a connecting portion 203 extending again in a direction (X-axis direction) perpendicular to the vertical portion 202. The drive wiring pad 220 connected to the display panel 100 is provided at one end of the horizontal portion 201, and the drive wiring pad 210 connected to the main circuit board 30 is provided at one end of the connecting portion 203. The other end of the horizontal portion 201 and the other end of the connecting portion 203 are connected to the vertical portion 202. The wiring connected to the drive wiring pad 220 connected to the display panel 100 and / or the wiring connected to the drive wiring pad 210 connected to the main circuit board 30 is provided at the horizontal portion 201, the vertical portion 202, and the connecting portion 203. As Figure 4B shown, these wirings can have a multilayer structure.

[0083] Referring to Figure 3 and Figure 4A , a force sensor 300 (e.g., a sensing electrode 330) is provided on the horizontal portion 201 of the PCB 200 (or provided in the horizontal portion 201 of the PCB 200, see Figure 12 ), and can be superimposed on the display area DA of the display panel 100 in a plan view. However, the present invention is not limited thereto, and the sensing electrode 330 can be provided on the vertical portion 202 of the PCB 200, or provided in the vertical portion 202 of the PCB 200, and can be superimposed on the non-display area NDA of the display panel 100 in a plan view.

[0084] Referring to Figure 4B , the PCB 200 includes a plurality of wiring layers 260, an insulating layer 270 between each of the wiring layers 260, and a covering layer 250 covering the outer portion of the PCB 200.

[0085] Referring to Figure 4A and Figure 4B, the wiring layer closest to the display panel 100 (hereinafter referred to as the "outermost wiring layer") includes driving wiring pads 210 and 220, a shielding layer 230, sensing electrode pads 240, 241, and 242 (see Figure 6 ), and sensing electrode connection wirings 243 and 244 (see Figure 6 ). The driving wiring pads 210 and 220 and the sensing electrode pads 240, 241, and 242 are not covered by the covering layer 250 but are exposed. The shielding layer 230 and the sensing electrode connection wirings 243 and 244 may be covered and insulated by the covering layer 250.

[0086] The driving wiring pads 210 and 220, the shielding layer 230, the sensing electrode pads 240, 241, and 242, and the sensing electrode connection wirings 243 and 244 can be formed by various methods such as a patterning process.

[0087] The outermost wiring layer (e.g., the driving wiring pads 210 and 220, the shielding layer 230, the sensing electrode pads 240, 241, and 242, and the sensing electrode connection wirings 243 and 244) and the wiring layer 260 located below it can be insulated by the insulating layer 270 provided therebetween.

[0088] The insulating layer 270 includes various insulating materials such as polyimide, polyester, epoxy glass, or prepreg. In an exemplary embodiment of the present invention, the insulating layer 270 can be formed in a square, rectangular, and various shapes according to the application of the insulating layer 270.

[0089] The PCB 200 may include a plurality of wiring layers 260 separated from each other by the insulating layer 270. The outermost wiring layer 210, 220, 230, 240, 241, 242, 243, and 244 or the wiring layer 260 located below the outermost wiring layer (hereinafter referred to as the "lower wiring layer 260") can be formed by a patterning process. The wiring provided at the lower wiring layer 260 can be connected to the wiring provided at another lower wiring layer 260 or the driving wiring pads 210 and 220 of the outermost wiring layer through contact holes in the insulating layer 270.

[0090] The signals for driving the force sensor 300 and the signals output from the force sensor 300 can be applied to the wirings of the outermost wiring layer 210, 220, 230, 240, 241, 242, 243, and 244. The lower wiring layer 260 can connect the display panel 100 and the main circuit board 30, and can apply, for example, signals for driving the display panel 100, data signals for enabling an image to be displayed on the display panel 100, driving signals and output signals of a touch sensing layer included in or provided on the display panel 100, and power.

[0091] In an exemplary embodiment of the present invention, in a patterning process, a photosensitive layer (e.g., a photosensitive dry film) is first coated on a copper foil layer. Next, the photosensitive dry film is exposed using an exposure device, and the exposed copper foil layer is developed with a developer, and then a predetermined pattern is formed by etching, thereby forming the patterns of the outermost wiring layers 210, 220, 230, 240, 241, 242, 243, and 244 and the lower wiring layer 260.

[0092] A cover layer 250 (e.g., a cover film) is formed on the outermost wiring layers 210, 220, 230, 240, 241, 242, 243, and 244. In an exemplary embodiment of the present invention, the cover layer 250 is formed on the front surfaces of the outermost wiring layers 210, 220, 230, 240, 241, 242, 243, and 244, and protects the circuit pattern from external influences and insulates the circuit pattern from the outside. However, the cover layer 250 is not provided on at least a part of the driving wiring pads 210 and 220 and the sensing electrode pads 240, 241, and 242 of the outermost wiring layer. In this case, the portions of the driving wiring pads 210 and 220 and the sensing electrode pads 240, 241, and 242 of the outermost wiring layer are exposed.

[0093] In an exemplary embodiment of the present invention, the cover layer 250 has openings for exposing at least a part of the driving wiring pads 210 and 220 and the sensing electrode pads 240, 241, and 242 of the outermost wiring layer. The cover layer 250 may be formed at a part of the peripheral area of the driving wiring pads 210 and 220 and the sensing electrode pads 240, 241, and 242, and may overlap with a part of the driving wiring pads 210 and 220 and the sensing electrode pads 240, 241, and 242.

[0094] The cover layer 250 may also be formed on the rear surface of the PCB 200, in other words, on the entire surface on the side of the outermost wiring layers 210, 220, 230, 240, 241, 242, 243, and 244 opposite to the front surfaces of the outermost wiring layers 210, 220, 230, 240, 241, 242, 243, and 244.

[0095] Thus, the cover layer 250 may be provided on the front surface of the PCB 200, and may expose at least a part of the driving wiring pads 210 and 220 and the sensing electrode pads 240, 241, and 242. Therefore, the PCB 200 may be electrically connected to the main circuit board 30 or the display panel 100 through the driving wiring pads 210 and 220, and may be electrically connected to the force sensor 300 (more specifically, the sensing electrode 330) through the sensing electrode pads 240, 241, and 242.

[0096] Refer again to Figure 4A, a force sensor 300 is disposed between the display panel 100 and the PCB 200.

[0097] For example, the conductive sheet 310 is attached under the upper flat portion 121 using an adhesive layer. The conductive sheet 310 may be attached to the entire surface of the display area DA or attached over the entire surface of the upper flat portion 121. The conductive sheet 310 may extend from the upper flat portion 121 to the boundary of the curved portion 110. The conductive sheet 310 may be grounded as described below.

[0098] Referring to Figure 4A , the conductive sheet 311 may also be attached under the lower flat portion 122 of the display panel 100 using an adhesive layer. The conductive sheet 311 under the lower flat portion 122 may extend from the lower flat portion 122 to the boundary of the curved portion 110.

[0099] The conductive sheets 310 and 311 may support the flat portions 121 and 122 of the display panel 100 and enable the curved portion 110 to maintain a smooth curve with a constant curvature.

[0100] In addition, the conductive sheets 310 and 311 may be used as heat radiation sheets or may include heat radiation sheets. For example, the conductive sheets 310 and 311 may include a graphite sheet containing graphite and / or a copper sheet containing copper. Optionally, the conductive sheets 310 and 311 may have a multi-layer structure in which a graphite sheet and / or a copper sheet are laminated. However, the inventive concept is not limited thereto, and the conductive sheets 310 and 311 may include metals having high electrical conductivity and high thermal conductivity, such as nickel, gold, and silver. For example, the conductive sheet 310 has a thermal conductivity in the range of about 100 W / mK to about 400 W / mK in the X-Y direction and a thermal conductivity in the range of about 1 W / mK to about 30 W / mK in the Z-axis direction.

[0101] In an exemplary embodiment of the present invention, the conductive sheet 310 may be such a single-layer or multi-layer composite sheet: having electrical conductivity, supporting the display panel 100, and serving as a heat radiation sheet to dissipate heat emitted from the display panel 100.

[0102] The sensing electrode 330 is attached to the upper surface of the PCB 200, more specifically, attached on the cover layer 250, and is attached and electrically connected to the sensing electrode pad 240 through an opening in the cover layer 250. However, the present invention is not limited thereto, as Figure 12 shown, the sensing electrodes 440 and 450 may be disposed in the PCB 200 and may be covered by the cover layer 250. At least a part or all of the sensing electrode 330 may be superimposed on the conductive sheet 310 in a plan view. The sensing electrode 330 may include at least two sensing electrodes 340 and 350 separated from each other.

[0103] The sensing electrode 330 may include a conductive material. The conductive material of the sensing electrode 330 may include a metal or an alloy thereof. The metal may include, for example, gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or platinum (Pt). In an exemplary embodiment of the present invention, the sensing electrode 330 may include a transparent conductive material. Examples of the transparent conductive material may include silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotubes, and graphene. The sensing electrode 330 may have a single-layer or multi-layer structure.

[0104] The elastic element 320 is disposed between the conductive sheet 310 and the sensing electrode 330. For example, one surface of the elastic element 320 may be in contact with the conductive sheet 310, and the other surface of the elastic element 320 may be in contact with the sensing electrode 330. In addition, the adhesive layers 321 and 322 may be respectively disposed between the elastic element 320 and the conductive sheet 310 and between the elastic element 320 and the sensing electrode 330. The elastic element 320 may be superimposed on the conductive sheet 310 and the sensing electrode 330 in a plan view. The elastic element 320 may have a shape corresponding to the shape of the sensing electrode 330 in a plan view.

[0105] However, the present invention is not limited thereto, and the elastic element 320 may not be superimposed on the conductive sheet 310 or the sensing electrode 330 in a plan view. For example, the elastic element 320 may be disposed outside the sensing electrode 330 in a plan view, between the conductive sheet 310 and the PCB 200. In addition, the elastic element 320 may not be superimposed on the PCB 200 in a plan view. The elastic element 320 may be disposed at any position where the distance between the conductive sheet 310 and the sensing electrode 330 can vary according to the pressure applied to the cover window 60. For example, the elastic element 320 may be the cover window 60, and air or any dielectric element may be positioned between the conductive sheet 310 and the sensing electrode 330.

[0106] The elastic element 320 can mitigate external impacts and can have an elastic force to perform such a function. For example, the elastic element 320 may be deformed due to the pressure applied from the outside, and may have an elastic force that causes the elastic element 320 to return to its initial state when the pressure from the outside is removed.

[0107] In addition, the elastic element 320 may have an insulating property to prevent an electrical short circuit between the conductive sheet 310 and the sensing electrode 330. The elastic element 320 may be provided as a porous polymer to have an elastic force. For example, the elastic element 320 may be provided in the form of a foam (such as a sponge).

[0108] For example, the elastic element 320 may include a thermoplastic elastomer, polystyrene, polyolefin, thermoplastic polyurethane elastomer, polyamide, synthetic rubber, polydimethylsiloxane, polybutadiene, polyisobutylene, poly(styrene-butadiene-styrene), polyurethane, polychloroprene, polyethylene, and silicone resin, and combinations thereof, but the present invention is not limited thereto.

[0109] Figure 5 is a block diagram showing the functions of the force sensor 300 according to an exemplary embodiment of the present invention.

[0110] As described above, the force sensor 300 may be electrically connected to the PCB 200 and disposed between the display panel 100 and the PCB 200. The force sensor 300 includes a first conductor (e.g., a conductive sheet 310), a second conductor (e.g., a sensing electrode 330), an elastic element 320 located between the conductive sheet 310 and the sensing electrode 330, and a sensor controller 380 electrically connected to the sensing electrode 330.

[0111] As described above, the sensing electrode 330 may include at least two sensing electrodes 340 and 350 separated from each other, and the sensor controller 380 may be electrically connected to each of the sensing electrodes 340 and 350.

[0112] The conductive sheet 310 and the sensing electrode 330 may function as a capacitor, and a capacitance may be formed between the conductive sheet 310 and the sensing electrode 330. The sensor controller 380 may detect the magnitude of the pressure applied to the cover window 60 based on the change in capacitance between the conductive sheet 310 and the sensing electrode 330. For example, the distance between the conductive sheet 310 and the sensing electrode 330 may be changed by the pressure applied to the cover window 60. Since the capacitance between the conductive sheet 310 and the sensing electrode 330 changes according to the distance between the conductive sheet 310 and the sensing electrode 330, the magnitude of the pressure applied to the cover window 60 may be detected based on the change in capacitance between the conductive sheet 310 and the sensing electrode 330.

[0113] For example, when no pressure is applied to the force sensor 300 or the cover window 60, a first capacitance may be formed between the conductive sheet 310 and the sensing electrode 330. When pressure is applied to the cover window 60 due to user touch or the like, the thickness of the elastic element 320 changes, and thus the distance between the conductive sheet 310 and the sensing electrode 330 changes. Therefore, the capacitance between the conductive sheet 310 and the sensing electrode 330 may be changed. For example, the first capacitance may be changed to a second capacitance by the applied pressure.

[0114] Therefore, as the external pressure increases, the capacitance between the conductive sheet 310 and the sensing electrode 330 may also increase. Therefore, the magnitude of the pressure and the like may be detected by the amount of change in capacitance generated in the force sensor 300.

[0115] The pressure applied to the force sensor 300 can be generated by a user's touch. However, the present invention is not limited thereto, and the pressure can be caused by various other factors.

[0116] The sensor controller 380 can detect the pressure applied to the force sensor 300 or the cover window 60 by sensing the change amount (ΔC) of the capacitance between the conductive sheet 310 and the sensing electrode 330.

[0117] To achieve this, the sensor controller 380 can be connected to the sensing electrode 330, and the conductive sheet 310 can be grounded. For example, the sensor controller 380 can detect the change amount (ΔC) of the capacitance by using the output signal of the sensing electrode 330.

[0118] There can be various methods for detecting the change amount (ΔC) of the capacitance. In addition, the sensor controller 380 can be connected to both the conductive sheet 310 and the sensing electrode 330 together to detect the change amount (ΔC) of the capacitance.

[0119] The sensing electrode 330 includes a first sensing electrode 340 and a second sensing electrode 350 separated from each other, or includes a first sensing electrode 440 and a second sensing electrode 450 separated from each other. However, the present invention is not limited thereto, and the sensing electrode 330 can include three or more sensing electrodes 330 separated from each other, and the multiple separated sensing electrodes 330 can be arranged along the horizontal portion 201 of the PCB 200.

[0120] Each of the separated sensing electrodes 340, 350, 440, and 450 can have a pressure sensing area. The pressure sensing area can be an area where a user can input touch pressure, and can include not only an area overlapping with the sensing electrodes 340, 350, 440, and 450, but also its surrounding area. For example, referring to Figure 7 and Figure 10 , each pressure sensing area can include an area respectively overlapping with the sensing electrodes 340, 350, 440, and 450, and can also include a peripheral area not overlapping with the sensing electrodes 340, 350, 440, and 450.

[0121] Hereinafter, the force sensor according to an exemplary embodiment of the present invention will be described in detail with reference to Figures 6 to 9 is a plan view showing the outermost wiring layer of the PCB according to an exemplary embodiment of the present invention,

[0122] Figure 6 is a plan view showing the sensing electrodes provided on the PCB according to an exemplary embodiment of the present invention, Figure 7 is a plan view showing the sensing electrodes provided on the PCB according to an exemplary embodiment of the present invention, Figure 8 and Figure 9 is according to an exemplary embodiment of the present invention alongFigure 6 A cross-sectional view taken along line I-I'.

[0123] Descriptions of the display panel 100, the conductive sheet 310, the elastic elements 320, and the adhesive layers 321 and 322 have been given above, so they will not be described again; however, the sensing electrodes 330 and the PCB 200 will be mainly described below.

[0124] As described above, Figure 6 shows the outermost wiring layer of the PCB 200. More specifically, it shows the wiring layer facing away from the display panel 100 directly under the cover layer 250 of the PCB 200. Figure 7 shows the sensing electrodes 340 and 350 provided on the upper surface of the PCB 200 facing the display panel 100. More specifically, it shows the sensing electrodes 340 and 350 provided on the cover layer 250 of the PCB 200.

[0125] First, referring to Figure 7 , the first sensing electrode 340 and the second sensing electrode 350 are provided separately from each other along the horizontal portion 201 of the PCB 200. For example, the first sensing electrode 340 and the second sensing electrode 350 may be symmetric with respect to the center in the X-axis direction of the display area DA. Optionally, a third sensing electrode may also be provided. The first sensing electrode 340 may be provided at the center in the X-axis direction (e.g., Figure 7 the left-right direction in

[0126] of the display area DA), and the second sensing electrode 350 and the third sensing electrode may be symmetric with respect to the first sensing electrode 340.

[0127] Referring to Figure 7 , each of the first sensing electrode 340 and the second sensing electrode 350 overlaps the conductive sheet 310 in a plan view. Each of the first sensing electrode 340 and the second sensing electrode 350 may be electrically separated from each other and may have different amounts of capacitance change according to the position of the touch pressure input through the cover window 60. Therefore, the position of the touch can be estimated according to the capacitance change of each of the first sensing electrode 340 and the second sensing electrode 350.

[0127] Referring to Figure 7 , each of the first sensing electrode 340 and the second sensing electrode 350 has a substantially the same quadrilateral shape. However, the present invention is not limited thereto. Each of the first sensing electrode 340 and the second sensing electrode 350 may have any shape, such as circular, elliptical, and polygonal.

[0128] Referring to Figure 8 , each of the first sensing electrode 340 and the second sensing electrode 350 may be attached to the elastic element 320 using the adhesive layer 322.

[0129] Each of the first sensing electrode 340 and the second sensing electrode 350 is disposed on the upper surface of the PCB 200, and more specifically, on the cover layer 250. The cover layer 250 covers the upper surface of the PCB 200 and has openings exposing at least a part of the sensing electrode pads 241 and 242 and at least a part of the ground pad 245. The first sensing electrode 340 and the second sensing electrode 350 are electrically connected to the sensing electrode pads 241 and 242 through the openings of the cover layer 250, respectively. For example, the first sensing electrode 340 contacts the sensing electrode pad 241, and the second sensing electrode 350 contacts the sensing electrode pad 242.

[0130] Referring Figure 6 , the sensing electrode pads 241 and 242 are connected to the sensor controller 380 through the sensing electrode connection wirings 243 and 244, respectively. The sensing electrode connection wirings 243 and 244 may be connected to the driving wiring pads 210 and 220, respectively. For example, the first sensing electrode 340 and the second sensing electrode 350 may be electrically connected to the sensor controller 380 through the sensing electrode pads 241 and 242 and the sensing electrode connection wirings 243 and 244, respectively.

[0131] A shielding layer 230 that overlaps at least a part of the first sensing electrode 340 and the second sensing electrode 350 (e.g., the whole of the first sensing electrode 340 and the second sensing electrode 350) in a plan view may be disposed at the outermost wiring layer. The shielding layer 230 may be completely covered by the cover layer 250 and may be insulated from the first sensing electrode 340 and the second sensing electrode 350. In addition, the shielding layer 230 may be electrically insulated and separated from the sensing electrode pads 241 and 242 and the sensing electrode connection wirings 243 and 244. In addition, the shielding layer 230 may surround the sensing electrode pads 241 and 242 and / or the sensing electrode connection wirings 243 and 244.

[0132] The shielding layer 230 is disposed on the rear surface of the cover layer 250 and may have a shape that completely overlaps the first sensing electrode 340 and the second sensing electrode 350. The shielding layer 230 shields electromagnetic waves and noise signals generated from the circuits (e.g., the PCB 200 and the main circuit board 30) disposed below the first sensing electrode 340 and the second sensing electrode 350 so as not to affect the first sensing electrode 340 and the second sensing electrode 350. In addition, the shielding layer 230 prevents a parasitic capacitance from being formed between the first sensing electrode 340 and the second sensing electrode 350 and another wiring layer 260 of the PCB 200. The potential of the shielding layer 230 may always be maintained at the ground level. The shielding layer 230 may be connected to the ground pad 245. The ground pad 245 may always maintain its potential at the ground level.

[0133] As Figure 8As shown in the figure, the first sensing electrode 340 and the second sensing electrode 350 are formed on the PCB 200 and attached to the elastic element 320 using the adhesive layer 322. Here, a cover layer 250 having an opening is provided at the PCB 200. Accordingly, the display panel 100, the force sensor 300, and the PCB 200 can be attached to each other.

[0134] As Figure 8 shown in the figure, according to an exemplary embodiment of the present invention, the first sensing electrode 340 and the second sensing electrode 350 can be formed by applying or printing a conductive paste. The conductive paste is prepared by mixing a film-forming agent and metal powder. Examples of the film-forming agent may include: epoxy resins utilizing crosslinking properties; fluids such as linseed oil, soybean oil, lacquer, tung oil, and synthetic drying oils; natural resins such as shellac and copal; processed resins such as lime rosin; synthetic resins such as phenolic resins, urea resins, melamine resins, and vinyl resins; cellulose derivatives such as nitrocellulose and cellulose acetate; rubber derivatives such as synthetic rubber; polyvinyl alcohol; and solids such as casein dissolved in a solvent.

[0135] Examples of the metal powder of the conductive paste may include gold, silver, platinum, palladium, and copper having high conductivity.

[0136] As Figure 9 shown in the figure, according to another exemplary embodiment of the present invention, each of the first sensing electrode 340 and the second sensing electrode 350 may include a conductive tape. The conductive tape includes adhesive layers 341 and 351, conductive layers 342 and 352, and insulating layers 343 and 353. The insulating layers 343 and 353 may be omitted. The adhesive layers 341 and 351 have conductivity and can physically / electrically connect the conductive layers 342 and 352 of the sensing electrodes 340 and 350 to the sensing electrode pads 241 and 242, respectively.

[0137] Each of the conductive layers 342 and 352 and the adhesive layers 341 and 351 of the conductive tape may include conductive fibers and a pressure-sensitive adhesive. Conductive fibers, aluminum, copper, nickel foil, etc. may be used as the base of the conductive layers 342 and 352, and one of the adhesive layers 341 and 351 may be provided on one surface of the conductive layers 342 and 352.

[0138] The conductive layers 342 and 352 including various composites (such as Ni, Cu, Cu + Ni, Cu + Ni + gold, Cu + Ni + other metals, Cu + Ni + resin, etc.) can be formed using an electroless plating method.

[0139] Referring to Figure 8 and Figure 9, conductors 370 and 375 are disposed between the conductive sheet 310 and the ground pad 245 to electrically connect the conductive sheet 310 and the ground pad 245. Conductors 370 and 375 include Figure 8 the conductive sponge 370 shown in Figure 9 and the conductive tape 375 shown in. However, the present invention is not limited thereto, and conductors 370 and 375 may include any conductive material that shrinks or changes its shape according to the deformation of the elastic element 320.

[0140] Referring to Figure 8 , one end of the conductive sponge 370 is attached to the conductive sheet 310, and the other end of the conductive sponge 370 is attached to the ground pad 245 exposed through the opening of the cover layer 250.

[0141] In a plan view, the conductive sponge 370 may have the shape of a column having a cross section of a circle, an ellipse, or a polygon such as a quadrilateral. The conductive sponge 370 may have a structure in which copper, nickel, silver, gold, etc. are plated on a foam having excellent resilience. A conductive adhesive layer is provided at one end and the other end of the conductive sponge 370, and one end and the other end of the conductive sponge 370 are respectively attached to the conductive sheet 310 and the ground pad 245. Accordingly, the conductive sponge 370 electrically connects the conductive sheet 310 and the ground pad 245 to each other.

[0142] Referring to Figure 9 , one end of the conductive tape 375 is attached to the conductive sheet 310, and the other end of the conductive tape 375 is attached to the ground pad 245 exposed through the opening of the cover layer 250. As described above regarding the conductive tapes 341, 342, 343, 351, 352, and 353 constituting the first sensing electrode 340 and the second sensing electrode 350, the conductive tape 375 may include an adhesive layer, a conductive layer, and an insulating layer. The insulating layer may be omitted. The adhesive layer has conductivity and may be attached to each of the conductive sheet 310 and the ground pad 245 to electrically connect the conductive sheet 310 and the ground pad 245 to each other.

[0143] Hereinafter, a force sensor according to an exemplary embodiment of the present invention will be described in detail with reference to Figures 10 to 12 .

[0144] Figure 10 is a plan view showing the outermost wiring layer of the PCB 200 according to an exemplary embodiment of the present invention, Figure 11 is a plan view showing the lower wiring layer of the PCB 200 according to an exemplary embodiment of the present invention, Figure 12 is a cross-sectional view taken along line I-I' according to an exemplary embodiment of the present invention. Figure 10

[0145] Descriptions of the display panel 100, the conductive sheet 310, the elastic element 320, and the adhesive layers 321 and 322 given above will be omitted hereinafter, and the sensing electrodes 330 and the PCB 200 will be mainly described.

[0146] Figure 10 The outermost wiring layer, which is the wiring layer closest to the display panel 100, is shown. More specifically, the sensing electrodes 440 and 450 and the sensing electrode connection wirings 443 and 444 directly disposed under the cover layer 250 of the PCB 200 are shown.

[0147] Figure 11 The shielding layer 430 at the wiring layer (hereinafter referred to as the "lower wiring layer") directly disposed under the outermost wiring layer of the PCB 200 is shown. However, the present invention is not limited thereto, and another wiring may be provided between the wiring layer provided with the shielding layer 430 and the outermost wiring layer.

[0148] First, referring to Figure 10 , the first sensing electrode 440 and the second sensing electrode 450 are arranged separately from each other along the horizontal portion 201 of the PCB 200. For example, the first sensing electrode 440 and the second sensing electrode 450 may be symmetric with respect to the center in the X-axis direction of the display area DA. Alternatively, a third sensing electrode may also be provided, and the first sensing electrode 440 may be disposed at the center in the X-axis direction (e.g., Figure 10 the left-right direction in

[0149] the display area DA), and the second sensing electrode 450 and the third sensing electrode may be symmetric with respect to the first sensing electrode 440.

[0150] Referring to Figure 10 , each of the first sensing electrode 440 and the second sensing electrode 450 has a substantially same quadrilateral shape. However, the present invention is not limited thereto, and each of the first sensing electrode 440 and the second sensing electrode 450 may have any shape, such as a circular shape, an oval shape, and a polygonal shape.

[0151] The first sensing electrode 440 and the second sensing electrode 450 are respectively connected to the sensor controller 380 through sensing electrode connection wirings 443 and 444 provided at the same outermost wiring layer. The sensing electrode connection wirings 443 and 444 can be respectively connected to the driving wiring pads 210 and 220. For example, the first sensing electrode 440 and the second sensing electrode 450 can be electrically connected to the sensor controller 380 through the sensing electrode connection wirings 443 and 444 respectively.

[0152] Referring to Figure 12 , an insulating layer 270 can be provided on the rear surfaces of the first sensing electrode 440 and the second sensing electrode 450 and the sensing electrode connection wirings 443 and 444 to electrically insulate them from the shielding layer 430 and another wiring layer 260.

[0153] A cover layer 250 is provided on the upper surfaces of the first sensing electrode 440 and the second sensing electrode 450 and the sensing electrode connection wirings 443 and 444. An adhesive layer 322 is provided between the cover layer 250 and the elastic element 320 so that the PCB 200 and the elastic element 320 can be attached to each other.

[0154] The cover layer 250 has an opening exposing at least a part of the ground pad 245. Referring to Figure 12 , a conductive band 375 is provided between the conductive sheet 310 and the ground pad 245 to electrically connect the conductive sheet 310 and the ground pad 245 to each other. The conductive band 375 can also be Figure 8 the conductive sponge 370 shown in

[0155] A shielding layer 430 that overlaps at least a part (e.g., all of the first sensing electrode 440 and the second sensing electrode 450) of the first sensing electrode 440 and the second sensing electrode 450 provided at the outermost wiring layer in a plan view can be provided at the lower wiring layer. The shielding layer 430 can be provided between two insulating layers 270 and can be separated and electrically insulated from the first sensing electrode 440 and the second sensing electrode 450, the sensing electrode connection wirings 443 and 444, and the wiring layer 260 located below the shielding layer 430.

[0156] The shielding layer 430 shields electromagnetic waves and noise signals generated from a circuit (e.g., the PCB 200 and the main circuit board 30) disposed under the first sensing electrode 440 and the second sensing electrode 450, and prevents a parasitic capacitance from being formed between the first sensing electrode 440 and the second sensing electrode 450 and another wiring layer 260 of the PCB 200. The potential of the shielding layer 430 can be always maintained at the ground level. The shielding layer 430 can be connected to the ground pad 245 through a contact hole at the insulating layer 270 between the lower wiring layer and the outermost wiring layer. The ground pad 245 can always maintain its potential at the ground level.

[0157] As Figure 12 shown, the cover layer 250 is disposed on the PCB 200, and the cover layer 250 is attached to the elastic element 320 using the adhesive layer 322. Accordingly, the display panel 100, the force sensor 300, and the PCB 200 can be attached to each other.

[0158] According to an exemplary embodiment of the present invention, the first sensing electrode 440 and the second sensing electrode 450, the sensing electrode connection wirings 443 and 444, the ground pad 245, and the shielding layer 430 can be formed in a patterning manner substantially the same as the patterning manner used for forming the wirings disposed at the other wiring layer 260. For example, a copper foil is formed on the insulating layer 270, and the shapes of the first sensing electrode 440 and the second sensing electrode 450, the sensing electrode connection wirings 443 and 444, the ground pad 245, and the shielding layer 430 can be formed by methods such as an additive method, a subtractive method, or a semi-additive method. In addition, as described above, the first sensing electrode 440 and the second sensing electrode 450, the sensing electrode connection wirings 443 and 444, the ground pad 245, and the shielding layer 430 can be formed by applying or printing a conductive paste.

[0159] As elaborated above, in a display device according to one or more exemplary embodiments of the present invention, by forming a sensing electrode of a force sensor on a PCB disposed on the rear surface of the display panel, and forming a sensing electrode pad and a sensing electrode connection wiring for connecting the sensing electrode and a sensor controller at the outermost wiring layer of the PCB, or by forming a sensing electrode of a force sensor and a sensing electrode connection wiring for connecting the sensing electrode to a sensor controller at the outermost wiring layer of a PCB disposed on the rear surface of the display panel, a separate FPCB for connecting the force sensor and the PCB can be omitted, and the force sensor and the PCB can be connected more stably.

[0160] According to an exemplary embodiment of the present invention, a conductive sheet (e.g., a heat radiation sheet) attached to the rear surface of the display panel serves as a conductor of the force sensor, and a change amount of a capacitance between the conductive sheet and a sensing electrode disposed on the PCB can be measured. Accordingly, the structure of the force sensor can be simplified.

[0161] Although the present invention has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the claims.

Claims

1. A display device, the display device comprising: A display panel; A printed circuit board connected to the display panel; An elastic element disposed between the display panel and the printed circuit board; A first conductor disposed between the elastic element and the display panel; And A second conductor disposed between the elastic element and the printed circuit board and forming a capacitor with the first conductor, Wherein the printed circuit board includes a first pad connected to the second conductor, Wherein the printed circuit board further includes a cover layer having an opening corresponding to the first pad, and the second conductor is connected to the first pad through the opening, and Wherein the display panel includes a first flat portion including a display area, a second flat portion vertically stacked with the first flat portion, and a curved portion between the first flat portion and the second flat portion, and the printed circuit board is directly connected to the second flat portion.

2. The display device according to claim 1, wherein The first pad is in contact with the second conductor.

3. The display device according to claim 1, wherein The first pad is superimposed on the second conductor in a plan view.

4. The display device according to claim 1, wherein, The printed circuit board further includes a shielding layer superimposed on the second conductor in a plan view.

5. A display device, the display device comprising: A display panel; A printed circuit board connected to the display panel; An elastic element disposed between the display panel and the printed circuit board; And A first conductor disposed between the elastic element and the display panel, Wherein the printed circuit board includes a second conductor forming a capacitor with the first conductor, Wherein the printed circuit board includes a plurality of wiring layers separated from each other by an insulating layer, Wherein the second conductor is disposed at a first wiring layer closest to the display panel among the plurality of wiring layers, and Wherein the display panel includes a first flat portion including a display area, a second flat portion vertically stacked with the first flat portion, and a curved portion between the first flat portion and the second flat portion, and the printed circuit board is directly connected to the second flat portion.

6. The display device according to claim 5, wherein, The printed circuit board includes a shielding layer disposed at a second wiring layer adjacent to the first wiring layer and superimposed on the second conductor in a plan view.

7. The display device according to claim 1 or 5, wherein The second conductor includes a plurality of conductors separated from each other.

8. The display device according to claim 1 or 5, wherein, The second conductor is a conductive strip.

9. The display device according to claim 8, wherein, The conductive strip includes an adhesive layer, a conductive layer, and an insulating layer.

10. The display device according to claim 1 or 5, wherein The second conductor includes conductive paste.

11. The display device according to claim 1 or 5, wherein, The second conductor is connected to a sensor controller configured to measure a change in the capacitance.

12. The display device according to claim 1 or 5, wherein, The printed circuit board further includes a second pad connected to the first conductor and to which a ground voltage is applied.

13. The display device according to claim 12, wherein, The printed circuit board further includes a cover layer having an opening corresponding to the second pad.

14. The display device according to claim 13, the display device further comprising a conductive strip or a conductive sponge in contact with the second pad and the first conductor.

15. The display device according to claim 1 or 5, wherein, The first conductor includes a sheet superimposed on the entire surface of the display area of the display panel.

16. The display device according to claim 15, wherein, The sheet of the first conductor includes a heat radiation sheet.

17. The display device according to claim 1 or 5, wherein the display device further comprises a bracket configured to support the display panel and the printed circuit board.

18. A display device, comprising: a display panel; a printed circuit board connected to the display panel; a sensing electrode disposed adjacent to the printed circuit board; a conductive sheet disposed adjacent to the display panel; and an elastic element disposed between the sensing electrode and the conductive sheet, wherein the printed circuit board includes a pad connected to the sensing electrode, wherein the printed circuit board further includes a cover layer having an opening corresponding to the pad, and the sensing electrode is connected to the pad through the opening, and wherein the display panel includes a first flat portion including a display area, a second flat portion vertically stacked with the first flat portion, and a curved portion between the first flat portion and the second flat portion, and the printed circuit board is directly connected to the second flat portion.

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