Power semiconductor modules and vehicles

Abstract

A power semiconductor module comprises a cooling device and a power semiconductor device installed in the cooling device, the cooling device comprising: a top plate having a lower surface; a shell portion, the shell portion comprising a refrigerant circulation portion and an outer edge portion surrounding the refrigerant circulation portion, the refrigerant circulation portion is arranged on the lower surface side of the top plate, and the shell portion is arranged to be directly or indirectly in close contact with the lower surface of the top plate at the outer edge portion; and cooling fins, the cooling fins are arranged in the refrigerant circulation portion, the top plate and the shell portion are arranged so that the top plate and the outer edge portion overlap, and have a fastening portion, the fastening portion is used to fasten the top plate and the shell portion to an external device, the power semiconductor device has a circuit substrate and a terminal shell, the fastening portion protrudes outward more than the outer periphery of the top plate, and the terminal shell has: a shell body, the shell body is arranged around the circuit substrate; and a reinforcing portion, the reinforcing portion extends on the upper surface side of the fastening portion.

Description

Technical Field

[0001] The invention relates to a power semiconductor module and a vehicle. Background Art

[0002] Conventionally, there is known a structure in which a cooling device is provided in a semiconductor module including a semiconductor element such as a power semiconductor chip (for example, refer to Patent Documents 1 to 5).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2017-17195

[0004] Patent Document 2: Japanese Patent Application Publication No. 2014-179563

[0005] Patent Document 3: Japanese Patent Laid-Open No. 7-176642

[0006] Patent Document 4: WO2013 / 157467

[0007] Patent Document 5: Japanese Patent Application Publication No. 2017-183421

[0008] When the temperature of the cooling device changes due to a change in ambient temperature or heat generation of the semiconductor device, stress acts on a fastening portion that fastens the cooling device to an external device or the like. Summary of the invention

[0009] In order to solve the above technical problems, in a first aspect of the present invention, a power semiconductor module is provided, comprising a cooling device and a power semiconductor device installed in the cooling device. The cooling device may also include: a top plate having a lower surface; a shell portion, the shell portion including a refrigerant flow portion and an outer edge portion surrounding the refrigerant flow portion, the refrigerant flow portion being arranged on the lower surface side of the top plate, and being arranged to be directly or indirectly in close contact with the lower surface of the top plate at the outer edge portion; and cooling fins, the cooling fins being arranged on the refrigerant flow portion. The top plate and the shell portion may also be arranged so that the top plate overlaps with the outer edge portion, and have a fastening portion, the fastening portion being used to fasten the top plate and the shell portion to an external device. The power semiconductor device may also include a circuit substrate and a terminal housing. The fastening portion may also protrude further outward than the outer periphery of the top plate. The terminal housing may also include: a shell body, the shell body being arranged around the circuit substrate; and a reinforcing portion, the reinforcing portion extending on the upper surface side of the fastening portion.

[0010] The top plate may also have two sets of sides and four corners that are opposite when viewed from above. The fastening portion may also be arranged to protrude outward from the outer periphery of the top plate at at least one corner. The shell portion may also be provided with an opening that connects the refrigerant circulation portion to the outside. The opening may also be arranged in a manner opposite to the corner of the top plate where the fastening portion is provided.

[0011] The height of the reinforcing part may also be below the height of the shell body. The reinforcing part and the fastening part may also be fixed together by an adhesive. The reinforcing part may also protrude further outward than the outer periphery of the shell body.

[0012] The reinforcing portion may also include: a planar portion, the planar portion being arranged around the through hole penetrating vertically; and a cylindrical portion, the cylindrical portion surrounding the planar portion and being thicker than the planar portion in the vertical direction. The reinforcing portion may also be connected to the shell body through a smooth curved surface whose height gradually decreases from the shell body. The reinforcing portion may also be connected to the shell body through a smooth curved surface whose width gradually narrows from the shell body.

[0013] Alternatively, the thickness of the shell part at a position opposite to the center of the lower surface of the top plate may be the same as the thickness at the fastening portion. Alternatively, the top plate and the shell part may have the same thickness at the fastening portion. Alternatively, a reinforcing member may be further provided at the fastening portion, the reinforcing member being provided between the top plate and the outer edge portion.

[0014] According to a second aspect of the present invention, a vehicle is provided, including the power semiconductor module.

[0015] In addition, the above invention summary does not list all the essential features of the present invention. In addition, the combination of the above feature groups can also become an invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 1 is a schematic cross-sectional view showing an example of a power semiconductor module 100 according to an embodiment of the present invention.

[0017] Figure 2A It is a diagram showing an example of the shape of the top plate 20 when viewed from above (xy plane).

[0018] Figure 2B This is a diagram for explaining the protruding direction of the fastening portion 81 .

[0019] Figure 3 It is a diagram showing an example of the shape of the casing 40 when viewed from above (xy plane).

[0020] Figure 4 It is a diagram showing an example of the shape of the power semiconductor device 70 when viewed from above (xy plane).

[0021] Figure 5 It is an exploded perspective view of the power semiconductor module 100 .

[0022] Figure 6 It is a partially enlarged perspective view of an example of the reinforcement portion 171 - 1 .

[0023] Figure 7It is a partially enlarged perspective view of a comparative example.

[0024] Figure 8 FIG. 1 is a partially enlarged perspective view of another example of the reinforcing portion 181 .

[0025] Fig. 9 1 is a schematic cross-sectional view showing another example of the power semiconductor module 102 .

[0026] Fig.10 It is a diagram showing an example of the shape of the reinforcement member 30 when viewed from above (xy plane).

[0027] Fig.11 This is a diagram showing an overview of a vehicle 200 according to an embodiment of the present invention.

[0028] Fig.12 1 is a main circuit diagram of a power semiconductor module 100 according to an embodiment of the present invention.

[0029] (Explanation of symbols)

[0030] 10 cooling device; 11 outer side; 13 inner side; 16 upper surface; 19 corner; 20 top plate; 22 upper surface; 24 lower surface; 26 short side; 28 long side; 29 corner; 30 reinforcing member; 34 inner side; 36 outer side; 40 housing; 42 opening; 62 frame; 63 side wall; 64 bottom plate; 70 power semiconductor device; 72 terminal housing; 74 sealing portion; 76 circuit substrate; 78 semiconductor chip; 79 through hole; 80 fastening portion; 81 fastening portion; 82 through hole; 83 fastening portion; 84 through hole; 85 fastening portion; 86 through hole; 88 periphery; 90 tube; 92 cavity (refrigerant circulation portion); 94 cooling fin; 95 vertex; 96 position; 100 power semiconductor module; 102 power semiconductor module; 170 housing body; 171 reinforcement portion; 173 through hole; 175 triangular prism portion; 176 cylindrical portion; 177 planar portion; 178 tubular portion; 179 corner portion; 180 connecting portion; 181 reinforcement portion; 185 hexagonal prism portion; 200 vehicle; 210 control device. DETAILED DESCRIPTION

[0031] Hereinafter, the present invention will be described by way of the embodiments of the invention, but the following embodiments are not intended to limit the invention involved in the claims. In addition, not all combinations of features described in the embodiments are essential to the solution means of the invention.

[0032] Figure 1It is a schematic cross-sectional view of an example of a power semiconductor module 100 according to an embodiment of the present invention. The power semiconductor module 100 includes a power semiconductor device 70 and a cooling device 10. The power semiconductor device 70 of this example is placed on the cooling device 10. In this specification, the surface of the cooling device 10 on which the power semiconductor device 70 is placed is set as the xy plane, and the surface perpendicular to the xy plane is set as the z-axis. In this specification, in the z-axis direction, the direction from the cooling device 10 toward the power semiconductor device 70 is called up, and the opposite direction is called down, but the up and down directions are not limited to the direction of gravity. In addition, in this specification, the upper surface of the surface of each component is called the upper surface, the lower surface is called the lower surface, and the surface between the upper surface and the lower surface is called the side surface.

[0033] The power semiconductor device 70 includes one or more semiconductor chips 78 such as power semiconductor chips. As an example, the semiconductor chip 78 includes a switching element provided on a semiconductor substrate such as silicon or silicon carbide. The switching element is, for example, a MOSFET or an insulated gate bipolar transistor (IGBT).

[0034] The power semiconductor device 70 has a circuit substrate 76 and a terminal housing 72. The circuit substrate 76 is, as an example, an insulating substrate having an upper surface and a lower surface, and is a substrate having a circuit pattern on the upper surface and a metal layer on the lower surface. The circuit pattern can also be formed by a metal layer. A semiconductor chip 78 is fixed to the circuit substrate 76 via solder or the like. The terminal housing 72 is formed of an insulating material such as resin. The terminal housing 72 has an internal space for accommodating the semiconductor chip 78, the circuit substrate 76, and wiring. The internal space of the terminal housing 72 is filled with a sealing portion 74, which seals the semiconductor chip 78, the circuit substrate 76, and wiring. The sealing portion 74 is an insulating member such as silicone or epoxy resin.

[0035] The terminal housing 72 has a housing body 170, a plurality of reinforcements 171 and a side portion 172. The housing body 170 is arranged around the circuit substrate 76. At least one of the plurality of reinforcements 171 extends outward from the connection portion 180 with the housing body 170. The plurality of reinforcements 171 will be described in detail below. The reinforcements 171, the side portions 172 and the housing body 170 are integrally formed of insulating materials such as resins such as polyphenylene sulfide (PPS). In addition to PPS, the resin used for the terminal housing 72 can also be selected from insulating resins such as polybutylene terephthalate (PBT), polybutyl acrylate (PBA), polyamide (PA), acrylonitrile (ABS), liquid crystal polymer (LCP), polyether ether copper (PEEK), polybutadiene-styrene (PBS), polyurethane, and silicon. The resin can also be a mixture of two or more resins. Fillers (such as glass fillers) for improving strength and / or functionality can also be included in the resin.

[0036] The cooling device 10 has a top plate 20 and a housing portion 40. The top plate 20 may be a plate-shaped metal plate having an upper surface 22 and a lower surface 24 parallel to the xy plane. As an example, the top plate 20 is formed of a metal containing aluminum. A power semiconductor device 70 is placed on the upper surface 22 of the top plate 20. On the top plate 20, the heat generated by the semiconductor chip 78 is mainly transferred via a circuit substrate 76. For example, a circuit substrate 76 and a thermally conductive member such as solder are arranged between the top plate 20 and the semiconductor chip 78. The circuit substrate 76 can be directly fixed to the upper surface 22 of the top plate 20 by solder or the like. At this time, the terminal housing 72 is arranged to surround the area of ​​the upper surface 22 of the top plate 20 where the circuit substrate 76 and the like are arranged. In other examples, the power semiconductor device 70 may also have a metal plate exposed to the lower surface of the terminal housing 72, and a circuit substrate 76 is fixed to the upper surface of the above-mentioned metal plate, and the above-mentioned metal plate is fixed to the upper surface 22 of the top plate 20.

[0037] The shell part 40 is configured to have a cavity 92 between the shell part 40 and the lower surface 24 of the top plate 20. The cavity 92 functions as a refrigerant circulation part for circulating refrigerant such as water supply. In addition, the shell part 40 is configured to be directly or indirectly in close contact with the lower surface 24 of the top plate 20 on the upper surface 16 of the frame part 62 as the outer edge part surrounding the cavity 92 in the xy plane. Thus, the cavity 92 is closed. In addition, indirect close contact refers to a state in which the lower surface 24 of the top plate 20 and the shell part 40 are in close contact with each other through a brazing member, a sealant, an adhesive or other member provided between the lower surface 24 of the top plate 20 and the shell part 40. Close contact refers to a state in which the refrigerant inside the cavity 92 does not leak from the above-mentioned close contact part. A cooling fin 94 is configured inside the cavity 92. The cooling fin 94 may also be connected to the lower surface 24 of the top plate 20. By passing the refrigerant near the cooling fin 94, the heat generated by the semiconductor chip 78 is transferred to the refrigerant. This makes it possible to cool the power semiconductor device 70 . The case portion 40 of this example includes a frame portion 62 , a bottom plate 64 , and a side wall 63 .

[0038] The frame 62 is configured to surround the cavity 92 in the xy plane. The upper surface 16 of the frame 62 is configured to be in close contact with the lower surface 24 of the top plate 20 directly or indirectly. In other words, the upper surface 16 of the frame 62 and the lower surface 24 of the top plate 20 are configured to close the cavity 92. A seal or other member may be provided between the upper surface 16 of the frame 62 and the lower surface 24 of the top plate 20.

[0039] In this example, the top plate 20 and the shell portion 40 are brazed. As an example, the top plate 20 and the shell portion 40 are formed of metals of the same composition, and the brazing material is formed of a metal having a lower melting point than the top plate 20. A metal containing aluminum can also be used as the metal. As the metal containing aluminum, aluminum alloys such as Al-Mn alloys (3000 series aluminum alloys) and Al-Mg-Si alloys (6000 series aluminum alloys) can also be used. As the brazing material, aluminum alloys such as Al-Si alloys (4000 series aluminum alloys) can also be used. The aluminum alloy used in this example preferably has a resistance at room temperature in the range of 35 to 65 MPa. The resistance is the stress that produces a permanent deformation of 0.2% when unloaded.

[0040] The bottom plate 64 is configured to have a cavity 92 between the bottom plate 64 and the lower surface 24 of the top plate 20. In this example, the bottom plate 64 is provided with two or more openings 42, and the two or more openings 42 introduce the refrigerant into the cavity 92 or lead it out from the cavity 92. A pipe 90 for conveying the refrigerant is connected to the opening 42. The pipe 90 protrudes toward the side opposite to the cooling fin 94 (in this example, the negative side of the z axis) with respect to the bottom plate 64. The pipe 90 may also be a pipe joint (threaded pipe) for connecting an external cooling system to the cooling device 10.

[0041] The side wall 63 defines the cavity 92 by connecting the frame 62 and the bottom plate 64. The side wall 63 of this example connects the inner side surface 13 of the frame 62 and the periphery of the bottom plate 64. The inner side surface 13 of the frame 62 is the side facing the cavity 92. The periphery of the bottom plate 64 is the outer peripheral portion of the bottom plate 64 on the xy plane.

[0042] The top plate 20 and the housing 40 have a fastening portion 80 fastened to each other. The fastening portion 80 and the reinforcing portion 171 fasten the top plate 20, the housing 40 and the power semiconductor device 70 together. The fastening portion 80 and the reinforcing portion 171 can also be used to fix the power semiconductor module 100 to an external device.

[0043] As an example, the fastening portion 80 is a region where the top plate 20 and the housing portion 40 are directly or indirectly in close contact and overlapped in the z-axis direction, and is a region where the through hole 79 penetrating the top plate 20 and the housing portion 40 is formed. Figure 1 In FIG. 1 , the regions where the through holes 79 are formed in the top plate 20 and the case 40 are indicated by dotted lines. The fastening portion 80 of this example is provided on the frame portion 62 .

[0044] Figure 2A 1 is a diagram showing an example of the shape of the top plate 20 when viewed from above (xy plane). The top plate 20 has two sets of sides 26 and 28 that are opposite to each other when viewed from above. The top plate 20 of this example is a substantially rectangular shape having short sides 26 and long sides 28. The top plate 20 has four corners 29. In this specification, the direction in which the short sides 26 extend is the y-axis, and the direction in which the long sides 28 extend is the x-axis.

[0045] In addition, the outer perimeter 88 of the rectangle defined by the long side 28 and the short side 26 is set as the outer perimeter of the top plate 20. In other words, the shape of the outer perimeter 88 is a shape obtained by replacing the concave and convex shapes of the top plate 20 relative to the long side 28 and the short side 26 with the extension lines of the long side 28 and the short side 26. Figure 2A In FIG. 8 , the outer periphery 88 is indicated by a dotted line.

[0046] Corner 29 refers to the area near each vertex of the outer periphery 88 of top plate 20. As an example, Figure 2A As shown by the dotted lines in , four areas arranged at the corners of the outer periphery 88 of the top plate 20 are set as corners 29 among the 16 areas divided into four equal parts on the x-axis and the y-axis. In this example, the corner 29 arranged opposite to the opening 42 of the shell 40 is set as the first corner 29-1, and the other corners 29 are set as the second corner 29-2. The first corner 29-1 may include the entire area opposite to the opening 42, or only a part of it. Figure 2A In FIG. 4 , a region facing the opening 42 is indicated by a dotted line.

[0047] The top plate 20 is provided with Figure 1 One or more fastening parts 81 are shown as a part of the fastening part 80. Alternatively, at least one fastening part 81 may be provided at the corner part 29. In this example, the fastening part 81 is provided at all corner parts 29. In addition, the fastening part 81 may be provided at each long side 28, or may not be provided. The fastening part 81 may be provided at each short side 26, or may not be provided.

[0048] Each fastening portion 81 is provided on the outer periphery 88 of the top plate 20 so as to protrude toward the outer side of the outer periphery 88. The outer side in this example refers to a direction away from the center of the top plate 20 in the xy plane. Each fastening portion 81 has Figure 1 A portion of the through hole 79 shown is the through hole 82. The through hole 82 may be arranged outside the outer periphery 88, may be arranged inside the outer periphery 88, or may be arranged so as to overlap the outer periphery 88.

[0049] In this example, at the first fastening portion 81-1 of the first corner portion 29-1, the through hole 82 is entirely arranged at a position further outside than the outer periphery 88. At the second fastening portion 81-2 of the second corner portion 29-2 and the third fastening portion 81-3 of each side, the through hole 79 may be arranged inside the outer periphery 88 or arranged to overlap the outer periphery 88. The pipe 90 is connected to the opening portion 42. By arranging the through hole 82 of the first fastening portion 81-1 outside the outer periphery 88, it is possible to facilitate the work of connecting the pipe 90 and the work of fastening a screw or the like to the through hole 82 of the first fastening portion 81-1.

[0050] In addition, the length of the first fastening portion 81-1 protruding outward from the outer periphery 88 is preferably greater than the length of the other fastening portions 81 protruding outward from the outer periphery 88. Thus, the through hole 82 of the first fastening portion 81-1 can be arranged away from the opening 42. Figure 1 As described in , the reinforcing portion 171 is provided so as to overlap with the fastening portion 81 , and therefore, even if the protruding length of the first fastening portion 81 - 1 is increased, the strength can be maintained.

[0051] The first fastening portion 81-1 may also be arranged to protrude from the periphery 88 in a direction parallel to the long side 28 (i.e., the x-axis direction) in the xy plane. Here, the parallel direction may also include a specified error. For example, the long side 28 and the protruding direction of the first fastening portion 81-8 may also have an inclination within 20 degrees. The protruding direction of the fastening portion 81 may also be a direction that connects the vertex of the fastening portion 81 (the point farthest from the periphery 88) to the periphery 88 at the shortest distance. Figure 2A In FIG. 8 , the arrow indicates the direction in which a part of the fastening portion 81 protrudes. Thus, even if the protruding length of the first fastening portion 81 - 1 is increased, it is possible to suppress the top plate 20 from becoming larger in the y-axis direction.

[0052] In addition, the second fastening portion 81-2 may also be provided to protrude in a direction different from that of the first fastening portion 81-1. Figure 2A In the example of , the second fastening portion 81-2 protrudes in a direction that is 45 degrees to the y-axis. The protruding length of the second fastening portion 81-2 is relatively small, so even if it protrudes in the above direction, the top plate 20 will not become larger to the same extent. In addition, the third fastening portion 81-3 protrudes from the outer periphery 88 in the y-axis direction. The length of the second fastening portion 81-2 protruding from the outer periphery 88 in the y-axis direction may be the same as the length of the third fastening portion 81-3 protruding from the outer periphery 88 in the y-axis direction. Figure 2A In the embodiment, the two first fastening parts 81-1 may be arranged symmetrically with respect to the center of the top plate 20 in the xy plane. Similarly, the two second fastening parts 81-2 may be arranged symmetrically with respect to the center of the top plate 20 in the xy plane.

[0053] Figure 2B 2 is a diagram for explaining the protruding direction of the fastening portion 81. Figure 2B In FIG. 8 , the vicinity of the fastening portion 81 - 1 and the fastening portion 81 - 2 are shown in an enlarged manner. Figure 2B , the through hole 82 of each fastening portion 81 is omitted. In this example, the point farthest from the outer periphery 88 on the xy plane in each fastening portion 81 is set as the vertex 95. As described above, the protruding direction of the fastening portion 81 is the direction connecting the vertex 95 and the outer periphery 88 at the shortest distance. However, in the case where there are multiple vertices 95 as in the fastening portion 81-2, the direction connecting the average position 96 of the multiple vertices 95 in the xy coordinate space and the outer periphery 88 at the shortest distance may be set as the protruding direction of the fastening portion 81. The average position 96 of the multiple vertices 95 is a position indicating the average of the coordinate values ​​of the multiple vertices 95 on the x-coordinate and the y-coordinate.

[0054] Figure 3 1 is a diagram showing an example of the shape of the shell portion 40 when viewed from above (xy plane). The outer shape of the shell portion 40 in this example on the xy plane is the same as the outer shape of the top plate 20. In this example, the outer shape of the frame portion 62 is equivalent to the outer shape of the shell portion 40. The frame portion 62 has an inner side surface 13 on one side of the cavity 92 and an outer side surface 11 on the opposite side to the inner side surface 13. Each side surface in this example is a surface that is substantially perpendicular to the xy plane. Figure 3 In the figure, the outer periphery 88 of the top plate 20 is shown in a manner overlapping the shape of the casing 40. In addition, the casing 40 also has a corner 29 on the xy plane similarly to the top plate 20.

[0055] The fastening portion 85 forming a part of the fastening portion 80 is provided at each corner 29 of the housing portion 40, similarly to the top plate 20. In addition, the fastening portion 85 may be provided at any side of the housing portion 40. The fastening portion 85 is provided so as to protrude from the frame portion 62 to the outer side of the outer periphery 88. In addition, the outer side refers to the direction away from the center of the cavity 92 in the xy plane.

[0056] In this example, the shape of each fastening portion 85 on the xy plane is the same as the shape of the opposite fastening portion 81. A through hole 86 is provided in each fastening portion 85. The through hole 86 is provided at the same Figure 2A The through holes 82 are shown at overlapping locations.

[0057] On the xy plane, the bottom plate 64 is arranged inside the frame 62. The bottom plate 64 has four corners 19. The corners 19 may be the same as the corners 29, and are four regions arranged at the corners among the 16 regions that can equally divide the outer periphery of the bottom plate 64 on the x-axis and the y-axis. The fastening portion 85 is provided at the outer periphery 88 of the top plate 20 so as to protrude toward the outside on the opposite side of the opening 42 and the corners 19 of the bottom plate 64.

[0058] An opening 42 for connecting the cavity 92 to the outside may be provided at any corner 19 of the bottom plate 64. In this example, the bottom plate 64 has openings 42 at two corners 19 symmetrically arranged with respect to the center point of the bottom plate 64 on the xy plane. Figure 2A as well as Figure 3 As shown, the corner portion 29 - 1 of the top plate 20 provided with the fastening portion 81 - 1 and the corner portion 19 - 1 of the bottom plate 64 provided with the opening portion 42 are arranged at opposing positions.

[0059] In this example, the relative positions on the x-axis and y-axis are used to set each corner 19 as the corner 19 on the positive side of the x-axis and the positive side of the y-axis (in Figure 3 In the example, the corner 19-1), the corner on the positive side of the x-axis and the negative side of the y-axis (in Figure 3 19-2 in the example), the corner on the negative side of the x-axis and the positive side of the y-axis (in Figure 3 In the example, it is the corner 19-2), the corner 19 on the negative side of the x-axis and the negative side of the y-axis (in Figure 3 Similarly, each corner 29 is set to the corner 29 on the positive side of the x-axis and the positive side of the y-axis (in Figure 2A In the example, it is the corner 29-1), the corner on the positive side of the x-axis and the negative side of the y-axis (in Figure 2A In the example, it is the corner 29-2), the corner on the negative side of the x-axis and the positive side of the y-axis (in Figure 2A In the example, it is the corner 29-2), the corner 29 on the negative side of the x-axis and the negative side of the y-axis (in Figure 3In the example of the embodiment, it is the corner 29-1). The two opposite corners in the bottom plate 64 and the top plate 20 refer to the corner 19 and the corner 29 corresponding to the relative positions of the x-axis and the y-axis. More specifically, the corner 19 on the positive side of the x-axis and the positive side of the y-axis is opposite to the corner 29 on the positive side of the x-axis and the positive side of the y-axis, the corner 19 on the positive side of the x-axis and the negative side of the y-axis is opposite to the corner 29 on the positive side of the x-axis and the negative side of the y-axis, the corner 19 on the negative side of the x-axis and the positive side of the y-axis is opposite to the corner 29 on the negative side of the x-axis and the positive side of the y-axis, and the corner 19 on the negative side of the x-axis and the negative side of the y-axis is opposite to the corner 29 on the negative side of the x-axis and the negative side of the y-axis.

[0060] Figure 4 is a diagram showing an example of the shape of the power semiconductor device 70 when viewed from above (xy plane), Figure 5 1 is an exploded perspective view of the power semiconductor module 100. Figure 5 In order to simplify the description, the power semiconductor device 70 , the top plate 20 , and the housing portion 40 are depicted in a state where they are disassembled from each other, and components such as the cooling fins 94 are omitted.

[0061] The shell body 170 of the power semiconductor device 70 of this example has four corners 179 corresponding to the four corners 29 of the top plate 20, and is in a roughly rectangular frame shape on the xy plane. Therefore, it can also be said that the outer periphery of the shell body 170 is roughly rectangular. Reinforcements 171-1 and 171-2 extending outward from the above-mentioned corners 179 are respectively provided at the corners 179 of the shell body 170. That is, these reinforcements 171-1 and 171-2 protrude outward from the outer periphery of the shell body 170. In addition, the outside refers to the direction away from the center of the power semiconductor device 70 in the xy plane.

[0062] More specifically, the reinforcement portion 171-1 of the corner portion 179-1 opposite to the corner portion 29-1 protrudes outward as a whole from the outer periphery of the housing body 170. On the other hand, a portion of the reinforcement portion 171-2 of the corner portion 179-2 opposite to the corner portion 29-2 protrudes outward from the outer periphery of the housing body 170, and the other portion is arranged on the inner side of the outer periphery of the housing body 170. Furthermore, two reinforcement portions 171-3 arranged inside the housing body 170 are provided on each of a pair of long sides of the substantially rectangular housing body 170.

[0063] The through hole 173 penetrating the reinforcing portion 171-1 overlaps with the through hole 82 of the fastening portion 81-1 of the top plate 20 when viewed from above. Similarly, the through hole 173 penetrating the reinforcing portion 171-2 overlaps with the through hole 82 of the fastening portion 81-2 of the top plate 20 when viewed from above, and the through hole 173 penetrating the reinforcing portion 171-3 overlaps with the through hole 82 of the fastening portion 81-3 of the top plate 20 when viewed from above.

[0064] The outer shape of the power semiconductor device 70 in this example on the xy plane is roughly similar to the outer shape of the top plate 20, and is slightly larger. In more detail, the outer periphery of the shell body 170 of the power semiconductor device 70 on the xy plane is roughly similar to the outer periphery 88 of the top plate 20, and is slightly larger. Moreover, the reinforcing parts 171 of the power semiconductor device 70 in this example are each arranged on the power semiconductor module 100 in a manner opposite to the fastening part 81 of the top plate 20. Each reinforcing part 171 and the fastening part 81 overlap when viewed from above, and the reinforcing part 171 covers the above-mentioned upper surface in a manner that is in contact with the entire upper surface of the fastening part 81. That is, the fastening part 81 of the top plate 20 is not exposed when viewed from above. The reinforcing parts 171 and the fastening parts 81 that are opposite to each other can also be fixed together by an adhesive.

[0065] Incidentally, the two reinforcing portions 171-1 of the power semiconductor device 70 extend on the upper surface side of the two fastening portions 81-1 of the top plate 20. Similarly, the two reinforcing portions 171-2 of the power semiconductor device 70 extend on the upper surface side of the two fastening portions 81-2 of the top plate 20, and the four reinforcing portions 171-3 of the power semiconductor device 70 extend on the upper surface side of the four fastening portions 81-3 of the top plate 20. Furthermore, corresponding to the situation that the fastening portion 81-1 of the top plate 20 extends further outward than the fastening portion 81-2, the reinforcing portion 171-1 extends further outward relative to the case body 170 than the reinforcing portion 171-2.

[0066] Here, as described above, the fastening portion 80 including the fastening portion 81 of the top plate 20 and the fastening portion 85 of the housing portion 40 is provided so as to protrude outward from the side wall 63 of the housing portion 40. Moreover, the fastening portions 81-1 and 81-2 of the fastening portion 81 are provided so as to protrude outward from the housing body 170 when viewed from above. That is, the front ends of the fastening portions 81-1 and 81-2 on the xy plane are cantilever beam structures that are not supported by other members of the power semiconductor module 100. Therefore, the fastening portions 81-1 and 81-2 are relatively easy to deform, but by providing the reinforcing portions 171-1 and 171-2, the strength of the fastening portion 80 can be increased.

[0067] On the other hand, the fastening portion 81-3 of the fastening portion 81 is located as a whole at a position further inside than the housing body 170 when viewed from above. Therefore, the reinforcing portion 171-3 opposite to the fastening portion 81-3 does not protrude further outward than the housing body 170. This can also be said that the housing body 170 itself extends on the upper surface side of the fastening portion 81-3 to reinforce the fastening portion 81-3.

[0068] As described above, by providing the reinforcing portion 171 on the upper surface of the fastening portion 80, the strength of the fastening portion 80 where stress is easily concentrated can be improved. In addition, by providing the reinforcing portion 171, the strength of the fastening portion 80 can be improved without increasing the thickness of the side wall 63 and the bottom plate 64. Since the thickness of the side wall 63 and the bottom plate 64 is not increased, the side wall 63 and the bottom plate 64 are more easily deformed with respect to stress. Therefore, even if, for example, the refrigerant inside the cavity 92, the cooling fin 94, etc. expand or contract according to temperature changes, the side wall 63 and the bottom plate 64 can be deformed to easily absorb the volume change. In addition, when the power semiconductor module 100 is connected to an external device through the tube 90 and the fastening member, even if force is applied to the housing portion 40 or even vibration is applied to the housing portion 40, the force will be absorbed by the side wall 63 and the bottom plate 64, and the cantilever beam structure of the fastening portion 80 is supported by the reinforcing portion 171. Therefore, the fastening portion 80 can be protected.

[0069] Figure 6 It is a partially enlarged stereoscopic view of an example of a reinforcing portion 171-1. The reinforcing portion 171-1 of this example is composed of a pair of triangular prism portions 175 extending toward the outside of the shell body 170 and a cylindrical portion 176 extending toward the outer side of these triangular prism portions 175. The pair of triangular prism portions 175 are arranged on one side of the shell body 170 in a manner that their vertices face each other when viewed from above. The triangular prism portions 175 can also be hollow and have a bottom surface. In addition, they can also be solid. The triangular prism portion 175 and the cylindrical portion 176 can also be arranged so that their respective side surfaces are parallel to the z-axis. Instead of the triangular prism portion 175, other columnar bodies such as polygonal prisms and cylinders can also be combined with the cylindrical portion 176.

[0070] The cylindrical portion 176 includes a flat portion 177 disposed around the through hole 173 and a cylindrical portion 178 surrounding the flat portion 177. The cylindrical portion 178 is thicker than the flat portion 177 in the vertical direction. Figure 1 As shown in the cross-sectional view of , the thickness of the cylindrical portion 178 in the vertical direction excluding the side portion 172, that is, the height H2, is less than the total height H1 of the housing body 170 excluding the side portion 172. In addition, it can also be said that the cylindrical portion 176 is also hollow and partially has a bottom surface. Moreover, the height of the entire housing body 170, that is, the portion of the terminal housing 72 excluding the reinforcement portion 171, can also be aligned to H1 to improve the strength of the housing body 170. The through hole 173 and the cylindrical portion 178 can also be coaxially arranged.

[0071] By using these triangular prism parts 175 and cylindrical parts 176, the strength of the reinforcing part 171 itself can be improved through light and simple molding, and even the strength of the fastening part 80 can be improved. In addition, by setting the plane part 177 lower than the cylindrical part 175, the head of the screw used for fastening can be accommodated inside the cylindrical part 178, making the fastening part miniaturized.

[0072] (Example 1)

[0073] Will Figures 1 to 6 The illustrated portion of the reinforcing portion 171 - 1 and the fastening portion 80 - 1 of the power semiconductor module 100 is that of Example 1. In Example 1, the reinforcing portion 171 - 1 and the fastening portion 80 - 1 are in vertical contact, but are not fixed by an adhesive.

[0074] (Example 2)

[0075] Example 2 is an example in which the reinforcing portion 171 - 1 and the fastening portion 80 - 1 of the power semiconductor module 100 have the same structure as those of Example 1 and the reinforcing portion 171 - 1 and the fastening portion 80 - 1 are fixed by an adhesive. The adhesive is a Si-based adhesive.

[0076] (Comparative Example)

[0077] like Figure 7 As shown, Figures 1 to 6 The example in which the reinforcing portion 171 - 1 is not provided in the power semiconductor module 100 shown is a comparative example. That is, in the comparative example, the upper surface of the fastening portion 80 - 1 of the top plate 20 is exposed.

[0078] Thermal stress was simulated using Examples 1 and 2 and Comparative Examples. Specifically, in the TcP / C evaluation of the maximum load when all phases are heated simultaneously, the stress amplitude of the maximum stress generating part of the cooler with △T = 100°C was calculated by thermal stress simulation. In addition, A3003 was assumed as the material. As a result, the following results were obtained.

[0079] Example 1: 4.5 N / mm 2

[0080] Example 2: 3.7 N / mm 2

[0081] Comparative example: 5.8N / mm 2

[0082] Furthermore, the life span was predicted, and it was found that Example 2 could achieve a life span approximately four times that of the comparative example.

[0083] Figure 81 is a partially enlarged stereoscopic view of another example of a reinforcing portion 181. The reinforcing portion 181 of this example has a so-called honeycomb structure formed by connecting three hexagonal prism portions 185. A through hole 173 is provided in the plane portion 177 of the hexagonal prism portion 185 extending toward the outermost side. The remaining two hexagonal prism portions 185 may or may not have a bottom surface.

[0084] The reinforcing portion 181 is also similar to the reinforcing portion 171-1, and covers the entire upper surface of the fastening portion 81-1 of the top plate 20 in a manner of contacting the upper surface. The reinforcing portion 181 may also be fixed to the fastening portion 81-1 by an adhesive. By the way, when viewed from above, the reinforcing portion 181 does not have a shape similar to the fastening portion 81-1.

[0085] Furthermore, it is not limited to Figure 6 and Figure 8 The reinforcing part may also be composed of other polygonal prisms such as a quadrangular prism, a cylinder, or a combination thereof. Each columnar body in the reinforcing part may be hollow or solid, and in the case of being hollow, it may or may not have a bottom surface. The columnar body may also be configured so that its side surface is parallel to the z-axis.

[0086] Figure 6 The reinforcement portion 171-1 and Figure 8 The reinforcing portion 181 of the top plate 20 covers the entire upper surface in a manner that is in contact with the upper surface of the fastening portion 81-1 of the top plate 20. Figure 1 As shown, a side portion 172 extending downward is arranged on the outer side of the reinforcing portion 171-1, etc., and the side portion 172 covers the entire side of the fastening portion 81-1. Alternatively, the side portion 172 may only cover a portion of the side of the fastening portion 81-1. Moreover, the side portion 172 may also cover a portion or all of the side of the cooling device 10. In more detail, the side portion 172 may also cover a portion or all of the side end surface of the top plate 20 and a portion or all of the side end surface of the frame portion 62. Thereby, the electrical insulation between the busbar connected when the power semiconductor module is used, the cooling device 10, and the terminals of the capacitor arranged on the lower surface of the cooling device 10 can be improved. In addition, the side portion 172 may not be provided.

[0087] Furthermore, the reinforcing portion 171-1 etc. may cover a portion of the upper surface of the fastening portion 81-1 instead of covering the entire upper surface of the fastening portion 81-1. That is, a portion of the fastening portion 81-1 may be exposed when viewed from above. In this case, it is preferred that the reinforcing portion 171-1 etc. extend in a manner that covers at least the periphery of the through hole 82 when viewed from above.

[0088] In addition, the connection portion 180 between the reinforcement portion 171 and the housing body 170 is Figure 1The cross-sectional view of the reinforcing portion 171 is approximately at a right angle, but the connection method is not limited to this. For example, the connecting portion 180 may also have a smooth curved surface. Specifically, the reinforcing portion 171 may also be connected to the shell body 170 through a smooth curved surface whose height gradually decreases from the shell body 170. Moreover, the reinforcing portion 171 may also be connected to the shell body 170 through a smooth curved surface whose width gradually narrows from the shell body 170. The reinforcing portion 171 and the shell body 170 are connected by a smooth curve, which can avoid stress concentration on the connecting portion 180.

[0089] In addition, the top plate 20 and the housing 40 may have the same thickness at the fastening portion 80. The top plate 20 and the housing 40 may have the same thickness in a region other than the fastening portion 80.

[0090] In addition, the housing portion 40 may be a frame portion 62 and a side wall 63 that are integrally formed. The frame portion 62 and the side wall 63 may also be formed by forging a plate-shaped metal. In addition, the bottom plate 64 may be integrally formed with the side wall 63 or may be brazed to the side wall 63. The bottom plate 64, the frame portion 62, and the side wall 63 may have the same thickness. As an example, the thickness of the bottom plate 64 at a position relative to the center of the lower surface 24 of the top plate 20 may also be the same as the thickness of the frame portion 62 at the fastening portion 80. Since the various components have the same thickness, the cooling device 10 can be manufactured using the same metal rolled coil.

[0091] Fig. 9 1 is a schematic cross-sectional view showing another example of a power semiconductor module 102. Fig. 9 In Figures 1 to 8 The same components are denoted by the same reference numerals and their description is omitted. The power semiconductor module 102 has a reinforcing member 30 provided between the upper surface 16 of the frame portion 62 of the housing portion 40 and the lower surface 24 of the top plate 20. Figure 1 The power semiconductor modules 100 are different.

[0092] The reinforcement member 30 is disposed between the top plate 20 and the shell portion 40 of the fastening portion 80. The top plate 20 and the reinforcement member 30 and the reinforcement member 30 and the shell portion 40 are disposed in close contact with each other. In this example, these components are brazed together. In addition, the through hole 79 is provided to penetrate the reinforcement member 30 as well.

[0093] The reinforcement member 30 may also be provided on the xy plane from the region where the through hole 79 is provided to a position opposite to the side wall 63 of the housing portion 40. Thus, the frame portion 62 can be prevented from being deformed at the position opposite to the side wall 63, and stress can be prevented from being concentrated on the connection portion between the side wall 63 and the frame portion 62. Thus, the side wall 63 can be protected. The side wall 63 and the inner side surface 13 of the reinforcement member 30 may also be arranged to be coplanar.

[0094] Fig.10 1 is a diagram showing an example of the shape of the reinforcing member 30 when viewed from above (xy plane). Fig. 9 The outer shape of the reinforcement member 30 in the xy plane of this example is the same as that of the top plate 20. Fig.10 In the figure, the outer periphery 88 of the top plate 20 and the shape of the reinforcement member 30 are overlapped.

[0095] The reinforcement member 30 may also have the same shape as the frame portion 62 of the housing portion 40 in the xy plane. The reinforcement member 30 is disposed between the upper surface 16 of the frame portion 62 and the lower surface 24 of the top plate 20. The reinforcement member 30 has an inner side surface 34 on one side of the cavity 92 and an outer side surface 36 on the opposite side to the inner side surface 34. The inner side surface 34 of the reinforcement member 30 may also be disposed to be coplanar with the inner side surface 13 of the frame portion 62 of the housing portion 40. The outer side surface 36 of the reinforcement member 30 may also be disposed to be coplanar with the outer side surface 11 of the frame portion 62 of the housing portion 40.

[0096] In addition, the reinforcing member 30 also has a corner 29 on the xy plane like the top plate 20. At each corner 29 of the reinforcing member 30, a fastening portion 83 is provided like the top plate 20. In addition, a fastening portion 83 may be provided on either side of the reinforcing member 30. In this example, the shape of each fastening portion 83 on the xy plane is the same as the shape of the fastening portion 81 opposite thereto. A through hole 84 is provided at each fastening portion 83. The through hole 84 is provided at a position corresponding to the fastening portion 81. Figure 2A The through holes 82 are shown at overlapping locations.

[0097] By providing the reinforcement member 30 in addition to the reinforcement portion 171, the strength of the fastening portion 80 can be further improved. The reinforcement member 30 can also be formed of a material having a higher endurance than the top plate 20 and the shell portion 40. As an example of such a material, an aluminum alloy having an endurance of 50 MPa or more, preferably an aluminum alloy having an endurance of 50 to 65 MPa, can be cited. In this way, the strength of the fastening portion 80 can be further improved.

[0098] Fig.11 2 is a diagram showing an overview of a vehicle 200 according to an embodiment of the present invention. The vehicle 200 is a vehicle that generates at least a portion of its propulsion force using electricity. As an example, the vehicle 200 is an electric vehicle that generates all of its propulsion force using an electric drive device such as an electric motor, or a hybrid vehicle that uses both an electric drive device such as an electric motor and an internal combustion engine driven by fuel such as gasoline.

[0099] The vehicle 200 includes a control device 210 (external device) for controlling an electric drive device such as an electric motor. The control device 210 is provided with a power semiconductor module 100. The power semiconductor module 100 can also control the power supplied to the electric drive device. The power semiconductor module 100 can also be fixed to the control device 210 by a fastening member inserted into the fastening portion 80 or the like. The cooling device 10 of the power semiconductor module 100 can also supply refrigerant from the cooling system of the control device 210 connected to the opening 42 via the pipe 90. The power semiconductor module 102 can also be used instead of the power semiconductor module 100.

[0100] Fig.12 1 is a main circuit diagram of a power semiconductor module 100 according to an embodiment of the present invention. The power semiconductor module 100 may also be a part of a vehicle-mounted unit for driving a motor of a vehicle. The power semiconductor module 100 may also function as a three-phase AC inverter circuit having output terminals U, V, and W.

[0101] It is also possible that the semiconductor chips 78-1, 78-2 and 78-3 constitute the lower bridge arm of the power semiconductor module 100, and the plurality of semiconductor chips 78-4, 78-5, 78-6 constitute the upper bridge arm of the power semiconductor module 100. A group of semiconductor chips 78-1 and 78-4 can constitute a bridge branch. A group of semiconductor chips 78-2 and 78-5 and a group of semiconductor chips 78-3 and 78-6 can also constitute a bridge branch. In the semiconductor chip 78-1, the emitter can be electrically connected to the input terminal N1, and the collector can be electrically connected to the output terminal U. In the semiconductor chip 78-4, the emitter can be electrically connected to the output terminal U, and the collector can be electrically connected to the input terminal P1. Similarly, in the semiconductor chips 78-2 and 78-3, the emitter can be electrically connected to the input terminals N2 and N3, respectively, and the collector can be electrically connected to the output terminals V and W, respectively. In addition, in the semiconductor chips 78 - 5 and 78 - 6 , the emitters may be electrically connected to the output terminals V and W, respectively, and the collectors may be electrically connected to the input terminals P2 and P3, respectively.

[0102] Each semiconductor chip 78-1 to 78-6 can be alternately switched by a signal input to a control electrode pad of the semiconductor chip 78. In this example, each semiconductor chip 78 can generate heat when switched. The input terminals P1, P2, and P3 can be connected to the positive electrode of the external power supply, the input terminals N1, N2, and N3 can be connected to the negative electrode, and the output terminals U, V, and W can be connected to the load. The input terminals P1, P2, and P3 can be electrically connected to each other, and the other input terminals N1, N2, and N3 can also be electrically connected to each other.

[0103] In the power semiconductor module 100, the plurality of semiconductor chips 78-1 to 78-6 may be RC-IGBT (reverse conducting IGBT) semiconductor chips, respectively. In the RC-IGBT semiconductor chip, the IGBT and the freewheeling diode (FWD: Free Wheeling Diode) may be formed as one body, and the IGBT and the FWD may be connected in anti-parallel. The plurality of semiconductor chips 78-1 to 78-6 may include a combination of transistors and diodes such as MOSFET (metal-oxide semiconductor field effect transistor) and IGBT, respectively. The chip substrate of the transistor and the diode may be a silicon substrate, a silicon carbide substrate or a gallium nitride substrate. In addition, the main circuit of the power semiconductor module 102 may also be the same as the main circuit of the power semiconductor module 100.

[0104] Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is obvious to those skilled in the art that various changes or improvements can be added to the above embodiments. The mode in which such changes or improvements are added can also be included in the technical scope of the present invention, which can be clearly understood from the description of the claims.

[0105] It should be noted that the execution order of each process such as actions, sequences, steps and stages in the devices, systems, programs and methods shown in the claims, specifications and drawings is not specifically and explicitly indicated as "before", "before", etc., and that they can be implemented in any order as long as the output of the previous process is not used in the subsequent process. Even if the action flow in the claims, specifications and drawings is described using "first", "next", etc. for the sake of convenience, it does not mean that it must be implemented in this order.

Claims

1. A power semiconductor module, comprising a cooling device and a power semiconductor device installed in the cooling device, characterized in that: The cooling device comprises: a top plate having a lower surface; a shell portion, the shell portion including a refrigerant flow portion and an outer edge portion surrounding the refrigerant flow portion, the refrigerant flow portion being arranged on the lower surface side of the top plate, the shell portion being arranged to be in close contact with the lower surface of the top plate directly or indirectly at the outer edge portion; and cooling fins, the cooling fins being arranged on the refrigerant flow portion, The top plate and the housing portion are arranged so that the top plate overlaps the outer edge portion, and have a fastening portion for fastening the top plate and the housing portion to an external device. The power semiconductor device comprises a circuit substrate and a terminal housing. The fastening portion protrudes outward further than the outer circumference of the top plate, The terminal housing includes: a housing body, the housing body being arranged around the circuit substrate; and a reinforcing portion, the reinforcing portion extending on the upper surface side of the fastening portion. The reinforcing portion has a side surface portion covering a side surface of the fastening portion.

2. The power semiconductor module according to claim 1, characterized in that When viewed from above, the top plate has a set of long sides, a set of short sides and four corners. The fastening portion comprises: a first fastening portion having a through hole that is entirely disposed outside an outer periphery of the top plate, the first fastening portion protruding in a direction parallel to the long side of the top plate; and The second fastening portion has a through hole arranged inside the outer periphery of the top plate or arranged overlapping with the outer periphery of the top plate, and the second fastening portion protrudes in a direction not parallel to the long side of the top plate.

3. The power semiconductor module according to claim 1, characterized in that The top plate has two sets of sides and four corners that are opposite to each other when viewed from above. The fastening portion is arranged to protrude outward from the outer periphery of the top plate at at least one of the corners. The shell portion is provided with an opening portion, and the opening portion connects the refrigerant flow portion and the outside. The opening portion is arranged to face the corner portion of the top plate where the fastening portion is provided.

4. The power semiconductor module according to claim 3, characterized in that: The opening of the casing is provided so as to penetrate the bottom surface of the casing in the up-down direction.

5. A power semiconductor module, comprising a cooling device and a power semiconductor device installed in the cooling device, characterized in that: The cooling device comprises: a top plate having a lower surface; a shell portion, the shell portion comprising a refrigerant flow portion, an outer edge portion surrounding the refrigerant flow portion, a bottom plate having the refrigerant flow portion between the bottom plate and the lower surface of the top plate, and a side wall connecting the outer edge portion to the bottom plate, the shell portion being arranged to be in close contact with the lower surface of the top plate directly or indirectly at the outer edge portion; and cooling fins, the cooling fins being arranged on the refrigerant flow portion, The top plate and the housing portion are arranged so that the top plate overlaps the outer edge portion, and have a fastening portion for fastening the top plate and the housing portion to an external device. The power semiconductor device comprises a circuit substrate and a terminal housing. The shell part is provided with an opening on the bottom plate for connecting the refrigerant flow part to the outside. The fastening portion protrudes outward further than the outer circumference of the top plate, The terminal housing includes: a housing body disposed around the circuit substrate; and a reinforcing portion extending on an upper surface side of the fastening portion.

6. The power semiconductor module according to claim 5, characterized in that The fastening portion is provided on the outer periphery of the top plate to protrude toward the outside on the side opposite to the bottom plate and the opening.

7. The power semiconductor module according to any one of claims 1 to 6, characterized in that: The height of the reinforcement portion is lower than the height of the housing body.

8. The power semiconductor module according to any one of claims 1 to 6, characterized in that: The reinforcing portion and the fastening portion are fixed by an adhesive.

9. The power semiconductor module according to any one of claims 1 to 6, characterized in that: The reinforcement portion protrudes outward from the outer circumference of the housing body.

10. The power semiconductor module according to any one of claims 1 to 6, characterized in that: The reinforcing portion includes a planar portion disposed around a through hole penetrating vertically, and a cylindrical portion surrounding the planar portion and being thicker than the planar portion in a vertical direction.

11. The power semiconductor module according to any one of claims 1 to 6, characterized in that: The reinforcement portion is connected to the housing body via a smooth curved surface whose height gradually decreases from the housing body.

12. The power semiconductor module according to any one of claims 1 to 6, characterized in that: The reinforcement portion is connected to the housing body through a smooth curved surface whose width gradually narrows from the housing body.

13. The power semiconductor module according to any one of claims 1 to 6, characterized in that: The thickness of the case portion at a position opposite to the center of the lower surface of the top plate is the same as its thickness at the fastening portion.

14. The power semiconductor module according to any one of claims 1 to 6, characterized in that: At the fastening portion, the top plate and the housing portion have the same thickness.

15. The power semiconductor module according to any one of claims 1 to 6, characterized in that: A reinforcement member is further provided at the fastening portion, and the reinforcement member is provided between the top plate and the outer edge portion.

16. A vehicle, characterized in that: A power semiconductor module comprising any one of claims 1 to 15.

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