Aging test board
By using high-temperature resistant plastic materials and conductive metal strips, combined with threaded fasteners, the electrical safety hazards and solder loosening problems of existing aging test boards in high temperature environments are solved, and safety, reliability and durability at high temperatures are achieved.
Patent Information
- Application Number
- CN201911321270.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-12-20
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2039-12-20
AI Technical Summary
The existing aging test boards have electrical safety risks in high temperature and high voltage environments, and the solder is prone to soften at high temperatures, resulting in loose electrical connections.
The base and cover plate made of high-temperature resistant plastic material, combined with conductive connectors made of conductive metal strips, connect the test seat and conductive connectors through threaded fasteners, avoiding the use of PCB boards and traditional soldering processes.
It realizes safety and reliability in high-temperature environments, avoids loose electrical connections and safety hazards, and improves the high-temperature resistance of the aged test board.
Smart Images

Figure CN110865292B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of aging test, and in particular to an aging test board. Background Art
[0002] With the development of semiconductor device technology and special application areas, as well as the current harsh application environment, device manufacturers and downstream product users have increasingly higher requirements for device reliability (aging) test standards.
[0003] In the prior art, an aging test board is generally used to perform an aging test on semiconductor devices. However, the existing aging test board is generally made of a conventional PCB high-temperature circuit board, usually made of polyimide FR-4, and then the test socket is welded on the PCB board. There are a certain number of test sockets, and the electrical wiring is realized through the PCB circuit. The maximum temperature resistance of the material of the test socket and the PCB board is about 175°C, and the solder connecting the test socket and the PCB board (even high-temperature solder) softens at a high temperature of more than 200°C, causing the electrical connection to loosen and fall off easily. In addition to covering the PCB board with insulating protective paint, there are no other protective measures. Under high temperature and high voltage conditions, there are electrical safety hazards and electric shock accidents for operators. Summary of the invention
[0004] The purpose of the present invention is to provide an aging test board to solve the above technical problems.
[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is to provide an aging test board, comprising:
[0006] A base, wherein an upper surface of the base is provided with a receiving groove;
[0007] A plurality of test seats, arranged in the receiving groove, for performing aging test on the test piece;
[0008] A conductive connector, disposed in the receiving groove, for electrically connecting a plurality of the test sockets;
[0009] A cover plate, which is arranged on the upper surface of the base and is provided with through holes for partially extending some of the test seats;
[0010] Wherein, the base and the cover are made of high temperature resistant plastic material, and the conductive connecting piece is made of conductive metal strip.
[0011] In a specific embodiment, a plurality of the test sockets are arranged in rows and columns.
[0012] In a specific embodiment, the conductive connecting member includes:
[0013] A first conductive strip, used to connect the positive electrode or the negative electrode of each column of the test sockets;
[0014] A second conductive strip, used to connect the negative electrode or the positive electrode of each column of the test sockets;
[0015] a third conductive strip, used to connect a plurality of the first conductive strips;
[0016] a fourth conductive strip, used to connect a plurality of said second conductive strips;
[0017] One end of the third conductive strip is connected to the positive electrode or negative electrode of the external power supply through a first conductive wire; one end of the fourth conductive strip is connected to the negative electrode or positive electrode of the external power supply through a second conductive wire.
[0018] In a specific embodiment, the conductive connecting member further includes:
[0019] A fifth conductive strip, used to connect the signal ends of each column of the test sockets;
[0020] a sixth conductive strip, used to connect a plurality of the fifth conductive strips;
[0021] Wherein, one end of the sixth conductive strip is connected to an external data acquisition device via a signal line.
[0022] In a specific embodiment, the high temperature resistant plastic material is polyetheretherketone.
[0023] In a specific embodiment, the conductive metal strip is high-purity copper with gold-plated outer surface.
[0024] In a specific embodiment, the test socket and the conductive connector are connected by a threaded fastener.
[0025] In a specific embodiment, the base further includes a wire groove connected to the accommodating groove, and the wire groove is used to lead out the first wire, the second wire and the signal wire.
[0026] In a specific embodiment, outer surfaces of the first conductive line, the second conductive line, and the signal line are coated with a high temperature resistant composite material.
[0027] In a specific embodiment, the cover plate includes:
[0028] A first cover plate, which is disposed above the test seat and is used to fix the test seat, and a plurality of through holes are provided on the first cover plate;
[0029] The second cover plate is disposed above the first wire, the second wire and the signal wire, and is used to fix the first wire, the second wire and the signal wire.
[0030] The present invention is beneficial in that:
[0031] Different from the prior art, the technical solution of the present invention is applied, by setting a plurality of test sockets and conductive connectors connecting the plurality of test sockets in the receiving groove of the base, and using a cover plate to cover the base, so that the plurality of test sockets and the conductive connectors are fixed between the base and the cover plate, and parts of the plurality of test sockets extend from the through holes of the cover plate, which are used to carry and test the test pieces. Since the base and the cover plate are made of high-temperature resistant plastic materials, the conductive parts can be insulated from the external environment, ensuring the safety and reliability of use; the conductive connectors are made of conductive metal strips, which have low internal impurities and achieve excellent low impedance. The present invention can avoid the use of PCB boards and traditional soldering processes, so that the aging test board can be resistant to high temperatures and safe and reliable. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0033] Figure 1 It is a structural schematic diagram of the aging test board of the present invention;
[0034] Figure 2 It is a structural schematic diagram of the conductive connector and the test socket of the aging test board of the present invention. DETAILED DESCRIPTION
[0035] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.
[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0039] See also Figure 1-Figure 2 The aging test board embodiment of the present invention includes: a plurality of test seats 1, a conductive connector 2, a base 3 and a cover plate. A receiving groove 33 is provided on the upper surface of the base 3. A plurality of test seats 1 are arranged in the receiving groove 33 for performing an aging test on the test piece. The conductive connector 2 is arranged in the receiving groove 33 for electrically connecting a plurality of test seats 1. The cover plate is arranged on the upper surface of the base 3, and is provided with a through hole 51 for partially extending a plurality of test seats 1. The base 3 and the cover plate are made of high temperature resistant plastic material, and the conductive connector 2 is made of a conductive metal strip.
[0040] The technical solution of this embodiment is applied, by arranging a plurality of test seats 1 and conductive connectors 2 connecting the plurality of test seats 1 in the receiving groove 33 of the base 3, and using a cover plate to cover the base 3, so that the plurality of test seats 1 and the conductive connectors 2 are fixed between the base 3 and the cover plate, and parts of the plurality of test seats 1 extend from the through holes 51 of the cover plate, for carrying and testing the test pieces. Since the base 3 and the cover plate are made of high temperature resistant plastic material, the conductive parts can be insulated from the external environment, ensuring the safety and reliability of use; the conductive connectors 2 are made of conductive metal strips, with low internal impurities, achieving excellent low impedance. This embodiment can avoid the use of PCB boards and traditional soldering processes, so that the aging test board can be resistant to high temperatures and safe and reliable.
[0041] In this embodiment, a plurality of test sockets 1 are arranged in rows and columns. Preferably, the number of test sockets 1 in each row is the same, and the number of test sockets 1 in each column is the same. Specifically, five test sockets 1 are arranged in each row, and eight test sockets 1 are arranged in each column, but this is not limited thereto, and the number of test sockets 1 in each row and column can be determined according to the circumstances. By arranging the test sockets 1 in rows and columns, aging tests can be performed on multiple test pieces at one time, thereby improving the test efficiency.
[0042] Further, the conductive connector 2 includes a first conductive strip 21, a second conductive strip 22, a third conductive strip 23 and a fourth conductive strip 24. The first conductive strip 21 is used to connect the positive or negative pole of each column of the test socket 1. The second conductive strip 22 is used to connect the negative or positive pole of each column of the test socket 1. The third conductive strip 23 is used to connect a plurality of first conductive strips 21. The fourth conductive strip 24 is used to connect a plurality of second conductive strips 22. Specifically, the third conductive strip 23 is vertically connected to a plurality of first conductive strips 21, and one end of the third conductive strip 23 is connected to the positive or negative pole of the external power supply through a first wire; the fourth conductive strip 24 is vertically connected to a plurality of second conductive strips 22, and one end of the fourth conductive strip 24 is connected to the negative or positive pole of the external power supply through a second wire. By providing the first conductive strip 21, the second conductive strip 22, the third conductive strip 23 and the fourth conductive strip 24, a plurality of test sockets 1 can be connected in parallel, and when a single to-be-tested device is short-circuited, the test of other to-be-tested devices is not affected.
[0043] Furthermore, the conductive connector 2 also includes a fifth conductive strip 25 and a sixth conductive strip 26. The fifth conductive strip 25 is arranged between two adjacent test sockets 1 in each column, and is used to connect the signal end of the test socket 1 in each column. The sixth conductive strip 26 is used to connect a plurality of fifth conductive strips 25. Specifically, the sixth conductive strip 26 and a plurality of fifth conductive strips 25 are vertically connected. One end of the sixth conductive strip 26 is connected to an external data acquisition device via a signal line. In the above embodiment, the signal end of each column of the test socket 1 is connected in series. In other embodiments, the signal end of each column of the test socket 1 can also be connected in parallel, in which case the fifth conductive strip 25 is a whole long strip, which is respectively connected to each column of the test socket 1.
[0044] In this embodiment, the high temperature resistant plastic material is polyetheretherketone, which has good high temperature resistance and electrical insulation, is relatively environmentally friendly and non-toxic, can be used for a long time in a high temperature environment, and does not release polluting gases.
[0045] In this embodiment, the conductive metal strip is high-purity copper with gold-plated outer surface. High-purity copper has low internal impurity content, excellent overall electrical performance, low internal electrical conductor impedance and reliable connection.
[0046] In this embodiment, the test socket 1 and the conductive connector 2 are connected by threaded fasteners (eg, screws), so that electrical connection reliability during low contact impedance and high temperature can be achieved.
[0047] In this embodiment, the base 3 further includes a wire groove 31 connected to the receiving groove 33, and the wire groove 31 is used to lead out the first wire, the second wire and the signal wire. Specifically, the wire groove 31 includes a first wire groove 311, a second wire groove 312, and a third wire groove 313. The first wire groove 311 is used to lead out the second wire connected to one end of the fourth conductive strip 24, the second wire groove 312 is used to lead out the signal wire connected to one end of the sixth conductive strip 26, and the third wire groove 313 is used to lead out the first wire connected to one end of the third conductive strip 23. By providing the wire groove 31, the wiring of the aging test board is more reliable, and no wire is exposed, so that it is safer to use.
[0048] Furthermore, the first wire groove 311, the second wire groove 312 and the third wire groove 313 each include an introduction section, an intermediate section and a lead-out section. One end of the introduction section is connected to the accommodating groove 33, and the other end is connected to one end of the intermediate section. The lead-out section is connected to the other end of the intermediate section. The intermediate section is roughly cylindrical and is provided with a winding post 32. The first wire, the second wire and the signal wire can be wound around the winding post 32 at least once before being led out to prevent the conductive connector 2 from being damaged when the first wire, the second wire and the signal wire are pulled. Among them, the three lead-out sections are arranged in parallel and spaced apart from each other to prevent the first wire, the second wire and the signal wire from being entangled.
[0049] In this embodiment, the cover plate includes a first cover plate 5 and a second cover plate 6. The first cover plate 5 is provided on the top of the test socket 1 to fix the test socket 1. The first cover plate 5 is provided with a plurality of through holes 51. The second cover plate 6 is provided on the top of the first wire, the second wire and the signal wire to fix the first wire, the second wire and the signal wire. By providing the first cover plate 5 and the second cover plate 6, the test socket 1 and the first wire, the second wire and the signal wire can be quickly repaired respectively, so that the two parts do not affect each other.
[0050] In this embodiment, a fixing frame 4 is further included for fixing the base 3. The fixing frame 4 includes a first fixing bar 41 and a second fixing bar 42. The first fixing bar 41 is arranged at the bottom of the base 3 along a first direction. The second fixing bar 42 is arranged at the bottom of the first fixing bar 41 along a second direction. The first direction and the second direction are perpendicular to each other. Specifically, the first fixing bar 41 is extended along the length direction of the base 3, and the second fixing bar 42 is extended along the width direction of the base 3.
[0051] Furthermore, a first mounting groove is provided at the bottom of the first fixing bar 41 along its length direction, and a first mounting block is slidably provided in the first mounting groove. The first screw passes through the cover plate, the base 3 and the first fixing bar 41 to connect with the first mounting block, so that the base 3 can move along the first direction to adjust the position. A second mounting groove is provided at the bottom of the second fixing bar 42 along its length direction, and a second mounting block is slidably provided in the second mounting groove. The second screw passes through the first fixing bar 41 and the second fixing bar 42 to connect with the second mounting block, so that the base 3 can move along the second direction to adjust the position. In this way, the applicability of the aging test board is improved.
[0052] In this embodiment, the outer surfaces of the first conductive line, the second conductive line and the signal line are coated with a high temperature resistant composite material, and the composite material can withstand a high temperature of more than 200 degrees Celsius.
[0053] In this embodiment, the device under test may be a semiconductor device.
[0054] The testing process of the aging test board of the present invention is as follows: the test pieces are uniformly inserted into the test socket 1. The first wire and the second wire are connected to the power supply, and the signal line is connected to the data acquisition device. The aging test board is placed in a high and low temperature aging box, the ambient temperature is set to 250 degrees Celsius, and an aging test is performed for a cycle of more than 1000 hours, and each test can last for 6 cycles. In the high temperature state test, the working state of the test piece is monitored by the first wire, the second wire, and the signal line to find and judge the failed product.
[0055] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.
Claims
1. An aging test board, characterized in that: include: A base, wherein an upper surface of the base is provided with a receiving groove; A plurality of test seats, arranged in the receiving groove, for performing aging test on the test piece; A conductive connector, disposed in the receiving groove, for electrically connecting a plurality of the test sockets; A cover plate, which is arranged on the upper surface of the base and is provided with through holes for partially extending some of the test seats; Wherein, the base and the cover are made of high temperature resistant plastic material, and the conductive connecting piece is made of conductive metal strip; A plurality of the test seats are arranged in rows and columns; The conductive connecting member comprises: A first conductive strip, used to connect the positive electrode or the negative electrode of each column of the test sockets; A second conductive strip, used to connect the negative electrode or the positive electrode of each column of the test sockets; a third conductive strip, used to connect a plurality of the first conductive strips; a fourth conductive strip, used to connect a plurality of said second conductive strips; Wherein, one end of the third conductive strip is connected to the positive electrode or negative electrode of the external power supply through the first conductive wire; one end of the fourth conductive strip is connected to the negative electrode or positive electrode of the external power supply through the second conductive wire; The conductive connector also includes: A fifth conductive strip, used to connect the signal ends of each column of the test sockets; a sixth conductive strip, used to connect a plurality of the fifth conductive strips; Wherein, one end of the sixth conductive strip is connected to an external data acquisition device via a signal line; The base further comprises a wire groove connected to the receiving groove, and the wire groove is used to lead out the first wire, the second wire and the signal wire; The wire slot includes a first wire slot, a second wire slot, and a third wire slot, wherein the first wire slot is used to lead out a second wire connected to one end of the fourth conductive strip, the second wire slot is used to lead out a signal line connected to one end of the sixth conductive strip, and the third wire slot is used to lead out a first wire connected to one end of the third conductive strip; The first wire trough, the second wire trough and the third wire trough each include an introduction section, a middle section and a lead-out section; one end of the introduction section is connected to the accommodating groove, and the other end is connected to one end of the middle section; the lead-out section is connected to the other end of the middle section; the middle section is cylindrical and is provided with a winding post, the first wire, the second wire and the signal wire are wound around the winding post at least once before being led out, and the three lead-out sections are arranged parallel to each other and spaced apart.
2. The aging test board according to claim 1, characterized in that: The high temperature resistant plastic material is polyetheretherketone.
3. The aging test board according to claim 1, characterized in that: The conductive metal strip is high-purity copper with gold-plated outer surface.
4. The aging test board according to claim 1, characterized in that: The test socket and the conductive connector are connected by threaded fasteners.
5. The aging test board according to claim 1, characterized in that: The outer surfaces of the first conductive line, the second conductive line and the signal line are coated with a high temperature resistant composite material.
6. The aging test board according to claim 1, characterized in that: The cover plate comprises: A first cover plate, which is disposed above the test seat and is used to fix the test seat, and a plurality of through holes are provided on the first cover plate; The second cover plate is disposed above the first wire, the second wire and the signal wire, and is used to fix the first wire, the second wire and the signal wire.
Citation Information
Patent Citations
Aging test fixture
CN106338700A
6 wire high power plug-in type element aging testing socket
CN201112804Y
Aging test board
CN211402620U