Dust-proof structure, microphone packaging structure, and electronic device

Abstract

The present invention discloses a dustproof structure, a microphone packaging structure and an electronic device, comprising: a grid structure; a support portion, the support portion comprising a connecting portion and a carrier fixed to the connecting portion, the connecting portion is arranged around the grid structure, a first through hole is formed in the middle of the carrier, and the grid structure covers one end of the first through hole; a stress concentration portion, the stress concentration portion is formed on the inner side of the support portion, and the stress concentration portion is used to concentrate the stress of the support portion. One technical effect of the present invention is that by providing the stress concentration portion, the stress on the grid structure when the dustproof structure is deformed is reduced, thereby avoiding the generation of messy wrinkles on the grid structure.

Description

Technical Field

[0001] The present invention relates to the field of acoustic and electrical technology, and more specifically, to a dustproof structure, a microphone packaging structure and an electronic device. Background Art

[0002] The microphone is provided with a dustproof structure, which is a device that can prevent foreign objects such as powder and particles from entering and causing the microphone to produce erroneous reactions, and can allow sound waves to pass through.

[0003] The dustproof structure is composed of different materials, and different materials have different thermal expansion coefficients. During the installation process of the dustproof structure, the dustproof structure will warp during heat treatment. Relatively speaking, the deformation of the carrier is large during the warping of the dustproof structure, and the deformation of the membrane is small. This causes the stress generated after the deformation to squeeze the membrane, resulting in messy wrinkles in the grid structure on the membrane.

[0004] Therefore, a new technical solution is needed to solve the above problems. Summary of the invention

[0005] An object of the present invention is to provide a new technical solution for a dustproof structure, a microphone packaging structure and an electronic device.

[0006] According to a first aspect of the present invention, there is provided a dustproof structure, comprising:

[0007] Grid structure;

[0008] A support portion, the support portion comprising a connecting portion and a carrier fixed to the connecting portion, the connecting portion is arranged around the grid structure, a first through hole is formed in the middle of the carrier, and the grid structure covers one end of the first through hole;

[0009] A stress concentrating portion is formed inside the supporting portion and is used to concentrate stress on the supporting portion.

[0010] Optionally, the stress concentration portion is formed on the inner side of the connecting portion, and the stress concentration portion surrounds the grid structure.

[0011] Optionally, the stress concentration portion includes a first extension portion extending inwardly from the connection portion, and a plurality of second through holes are provided on the first extension portion, and the plurality of second through holes are distributed along the circumference of the first extension portion.

[0012] Optionally, an opening ratio of the second through hole is less than or equal to an opening ratio of the grid structure.

[0013] Optionally, the second through hole includes a rectangular hole or an arc-shaped hole.

[0014] Optionally, the stress concentration portion includes a first extension portion extending inward from the connecting portion, a plurality of incisions are cut on the first extension portion, a neck connected to the first extension portion is formed between two ends of each of the incisions, the incision faces the grid structure, and the neck faces the supporting portion; the plurality of incisions are distributed along the circumference of the first extension portion.

[0015] Optionally, the stress concentration portion is formed on the inner side of the carrier, and the stress concentration portion is coaxially arranged with the first through hole.

[0016] Optionally, the stress concentration portion includes a second extension portion extending inwardly from the carrier, the second extension portion includes a plurality of protrusions, and the plurality of protrusions are distributed along a circumference of the second extension portion.

[0017] Optionally, along a cross section perpendicular to the axial direction of the first through hole, the protrusion includes a rectangular protrusion with a rectangular edge shape or an arc-shaped protrusion with an arc-shaped edge shape.

[0018] Optionally, the stress concentration portion includes a second extension portion extending inward from the carrier, the second extension portion includes a plurality of arcuate walls; both ends of the arcuate walls are connected to the carrier and the middle is hollow; the plurality of arcuate walls are distributed along the circumference of the second extension portion, and the arcuate walls are arc-shaped along a cross-section perpendicular to the axial direction of the first through hole.

[0019] Optionally, the stress concentration portion is formed on the inner side of the connecting portion and the carrier;

[0020] The stress concentration portion on the inner side of the connecting portion is arranged around the grid structure, and the stress concentration portion on the inner side of the carrier is arranged coaxially with the first through hole.

[0021] Optionally, an elastic telescopic structure is provided on the grid structure, and the elastic telescopic structure can be telescoped along the plane where the grid structure is located.

[0022] Optionally, the elastic coefficient of the elastic telescopic structure is anisotropic.

[0023] Optionally, the opening ratios of various locations of the grid structure are different.

[0024] Optionally, the material of the grid structure and the connecting part includes metallic glass.

[0025] Optionally, the material of the carrier includes epoxy resin.

[0026] According to a second aspect of the present invention, there is provided a microphone packaging structure, comprising any one of the dustproof structures described above, wherein the dustproof structure is fixed on the sound hole of the microphone packaging structure;

[0027] Alternatively, the dustproof structure covers the MEMS chip in the microphone packaging structure.

[0028] According to a third aspect of the present invention, there is provided an electronic device comprising the above-mentioned microphone packaging structure.

[0029] According to an embodiment of the present disclosure, by providing a stress concentration portion, the stress on the grid structure when the dustproof structure is deformed is reduced, thereby avoiding the generation of messy wrinkles on the grid structure.

[0030] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0032] Figure 1 It is a structural schematic diagram of an embodiment of the present disclosure in which a stress concentration portion is arranged inside a support portion.

[0033] Figure 2 It is a schematic structural diagram of a cross section of an embodiment of the present disclosure in which a stress concentration portion is provided inside a connection portion.

[0034] Figure 3 It is a schematic structural diagram of a stress concentration portion of an embodiment of the present disclosure, in which a rectangular hole is arranged on the first extension portion.

[0035] Figure 4 It is a schematic structural diagram of a stress concentration portion of an embodiment of the present disclosure in which an arc-shaped hole is arranged on the first extension portion.

[0036] Figure 5 It is a structural schematic diagram of a stress concentration portion of an embodiment of the present disclosure in which a cutout is provided on the first extension portion.

[0037] Figure 6 It is a schematic structural diagram of a cross section of a stress concentration portion provided on the inner side of a carrier according to an embodiment of the present disclosure.

[0038] Figure 7 It is a schematic structural diagram of an embodiment of the present disclosure in which the stress concentration portion is a rectangular protrusion arranged on the second extension portion.

[0039] Figure 8 It is a schematic structural diagram of a stress concentration portion of an embodiment of the present disclosure being an arc-shaped protrusion provided on the second extension portion.

[0040] Fig. 9 It is a schematic structural diagram of a stress concentration portion of an embodiment of the present disclosure in which an arc-shaped wall is arranged on the second extension portion.

[0041] Fig.10 It is a schematic structural diagram of a cross section of an embodiment of the present disclosure in which a stress concentration portion is provided on the inner side of a connection portion and the inner side of a carrier.

[0042] Fig.11 It is a schematic diagram of a dustproof structure provided inside a sound hole on a substrate of a microphone packaging structure according to an embodiment of the present disclosure.

[0043] Fig.12 It is a schematic diagram of a dustproof structure provided at a MEMS chip on a microphone packaging structure substrate according to an embodiment of the present disclosure.

[0044] In the figure, 11 is a connecting part, 12 is a grid structure, 2 is a carrier layer, 3 is a stress concentration part, 31 is a first extension part, 311 is a rectangular hole, 312 is an arc-shaped hole, 313 is a cutout, 32 is a second extension part, 321 is a rectangular protrusion, 322 is an arc-shaped protrusion, 323 is an arc-shaped wall, 4 is an acoustic hole, and 5 is a MEMS chip. DETAILED DESCRIPTION

[0045] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0046] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0047] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0048] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0049] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0050] According to one embodiment of the present disclosure, a dustproof structure is provided, such as Figure 1As shown, the dustproof structure includes: a grid structure 12; a supporting portion, the supporting portion includes a connecting portion 11 and a carrier 2 fixed to the connecting portion 11, the connecting portion 11 is arranged around the grid structure 12, a first through hole is formed in the middle of the carrier 2, and the grid structure 12 covers one end of the first through hole; the connecting portion 11 and the grid structure 12 form a membrane body of the dustproof structure.

[0051] The stress concentration portion 3 is formed inside the support portion, and the stress concentration portion 3 is used to concentrate the stress of the support portion.

[0052] In this embodiment, the grid structure 12 enables the dustproof structure to have a dustproof effect, and allows sound waves to pass through without affecting the sound transmission. For example, the grid structure 12 can be provided with holes in a circular, square or other shape.

[0053] The support part is used to support and fix the dustproof structure at a set position. The support part includes a connecting part 11 and a carrier 2 , the carrier 2 is used to connect with the set position, and the connecting part 11 is used to connect the grid structure 12 to the carrier 2 .

[0054] A stress concentration portion 3 is formed on the inner side of the support portion, and the stress concentration portion 3 is arranged around the grid structure 12. Figure 1 , the stress concentration portion 3 is arranged around the axis of the grid structure 12 .

[0055] The stress concentration portion 3 is used to concentrate the stress of the support portion, for example, during the process of manufacturing or installing the dustproof structure. The dustproof structure will be deformed by the heat treatment process or other factors during the above process, and stress will be generated in the support portion. For example, the heat treatment process will cause the support portion to warp, and the stress generated by the warping deformation will be transmitted to the grid structure 12, causing the grid structure 12 to produce messy wrinkles. After the stress concentration portion 3 is provided, the stress concentration portion 3 concentrates the stress of the support portion, reducing the stress on the grid structure 12. In addition, the concentrated stress causes the generated wrinkles to be concentrated on the stress concentration portion and have a regular shape and uniform distribution. In this way, the generation of wrinkles on the grid structure 12 can be controlled, the structure of the grid structure 12 can be protected from damage, and the yield and reliability of the dustproof structure can be improved.

[0056] For example, Figure 2 As shown, a stress concentration portion 3 may be formed on the inner side of the connection portion 11 , and the stress concentration portion 3 surrounds the grid structure 12 .

[0057] The stress concentration part 3 is arranged inside the connection part 11 of the support part, so that the connection part 11, the stress concentration part 3 and the grid structure 12 are connected in sequence. In this way, wrinkles on the grid structure 12 can be controlled by the film body, the structure of the grid structure 12 is protected from damage, and the yield and reliability of the dustproof structure are improved.

[0058] In an example, Figure 3 As shown in FIG. 4 , the stress concentration portion 3 includes a first extension portion 31 extending inward from the connection portion 11 , and a plurality of second through holes are provided on the first extension portion 31 , and the plurality of second through holes are distributed along the circumference of the first extension portion 31 .

[0059] In this example, the stress concentration portion 3 includes a first extension portion 31 and a plurality of second through holes provided on the first extension portion 31. In this way, the generated stress can be concentrated at the position of the second through holes, causing the position of the second through holes to deform and form wrinkles. The stress on the grid structure 12 is reduced, and the grid structure 12 is prevented from generating disorderly wrinkles due to the stress.

[0060] For example, the second through hole includes a rectangular hole 311 or an arc-shaped hole 312 .

[0061] like Figure 3 As shown, the second through hole is a rectangular hole 311. A plurality of rectangular holes 311 are provided on the first extension portion 31, so that stress can be concentrated at the positions of the plurality of rectangular holes 311, thereby avoiding the formation of wrinkles on the grid structure 12 due to stress.

[0062] For example, a portion of the single second through hole may be disposed on the connecting portion 11, and another portion may be disposed on the first extending portion 31. Such a structure can reduce the alignment error of the film body and the carrier 2 when connected together, optimize the structure of the dustproof structure, and avoid structural misalignment between the carrier 2 and the film body caused by stress.

[0063] like Figure 4 As shown, the second through hole is an arc hole 312. The arc holes 312 are distributed along the circumference of the first extension portion 31, so that the stress can be concentrated on the arc holes 312, avoiding the stress from forming wrinkles on the grid structure 12. The arc holes 312 are evenly distributed along the circumference of the first extension portion 31, so that the generated wrinkles are also evenly distributed along the circumference, effectively controlling the shape structure of the generated wrinkles.

[0064] In one example, the opening ratio of the second through hole is less than or equal to the opening ratio of the grid structure 12 .

[0065] In this example, in addition to the function of concentrating stress, the second through hole arranged on the stress concentration portion 3 also has the dust-proof function of the grid structure 12 by setting the opening ratio of the second through hole to be less than or equal to the opening ratio of the grid structure 12.

[0066] In one embodiment, Figure 5As shown, the stress concentration portion 3 includes a first extension portion 31 extending inward from the connection portion 11, and a plurality of cuts 313 are cut on the first extension portion 31. A neck connected to the first extension portion 31 is formed between the two ends of each cut 313. The cut 313 faces the grid structure 12, and the neck faces the support portion; the plurality of cuts 313 are distributed along the circumference of the first extension portion 31.

[0067] In this embodiment, a plurality of cutouts 313 are cut on the first extension portion 31 to form the stress concentration portion 3. In this way, the stress is concentrated at the positions of the plurality of cutouts 313, thereby preventing the stress from causing disorderly wrinkles in the grid structure 12.

[0068] For example, a part of the single cutout can be arranged on the connecting portion 11, and another part can be arranged on the first extending portion 31. Such a structure can reduce the alignment error of the film body and the carrier 2 connected together, optimize the structure of the dustproof structure, and avoid structural misalignment between the carrier 2 and the film body caused by stress.

[0069] In one embodiment, Figure 6 As shown, a stress concentration portion 3 is formed on the inner side of the carrier 2 , and the stress concentration portion 3 is coaxially arranged with the first through hole.

[0070] The stress concentration portion 3 is formed on the carrier 2, and the stress can be controlled by the carrier 2 to concentrate the stress on the stress concentration portion 3. The controlled wrinkles are formed on the stress concentration portion 3 to avoid the formation of disorderly wrinkles on the grid structure 12.

[0071] For example, Figure 7 As shown in FIG. 8 , the stress concentration portion 3 includes a second extension portion 32 extending inwardly from the carrier 2 , and the second extension portion 32 includes a plurality of protrusions distributed along the circumference of the second extension portion 32 .

[0072] By forming a plurality of protrusions on the inner side of the carrier 2, stress is concentrated on the plurality of protrusions, and the plurality of protrusions are the second extension portions 32. The stress acts on the protrusions, which reduces the stress on the grid structure 12 and avoids the generation of messy wrinkles on the grid structure 12.

[0073] For example, along a cross section perpendicular to the axial direction of the first through hole, the protrusion includes a rectangular protrusion 321 with a rectangular edge shape or an arc-shaped protrusion 322 with an arc-shaped edge shape.

[0074] like Figure 7 As shown, a plurality of rectangular protrusions 321 are formed on the inner side of the carrier 2, so that stress can be concentrated on the plurality of rectangular protrusions 321. The stress on the grid structure 12 is reduced, and messy wrinkles on the grid structure 12 are avoided.

[0075] like Figure 8As shown, a plurality of arc-shaped protrusions 322 are formed on the inner side of the carrier 2, so that the stress can be concentrated on the plurality of arc-shaped protrusions 322. The stress on the grid structure 12 is reduced, and the generation of messy wrinkles on the grid structure 12 is avoided.

[0076] In one embodiment, Fig. 9 As shown, the stress concentration portion 3 includes a second extension portion 32 extending inward from the carrier 2, and the second extension portion 32 includes a plurality of arcuate walls 323; both ends of the arcuate walls 323 are connected to the carrier 2 and the middle is hollow; the plurality of arcuate walls 323 are distributed along the circumference of the second extension portion 32, and the arcuate walls 323 are arc-shaped along a cross section perpendicular to the axial direction of the first through hole.

[0077] In this embodiment, the arc-shaped wall 323 formed on the inner side of the carrier 2 can concentrate stress on each arc-shaped wall 323. The stress is concentrated on each arc-shaped wall 323 along the circumferential direction. In this way, the stress on the grid structure 12 can be reduced, and the wrinkles are evenly distributed along the circumferential direction, avoiding the appearance of messy wrinkles on the grid structure 12. The yield rate and reliability of the dustproof structure are improved.

[0078] In one embodiment, Fig.10 As shown, stress concentration portions 3 are formed inside the connection portion 11 and the carrier 2 ; the stress concentration portion 3 inside the connection portion 11 is arranged around the grid structure 12 , and the stress concentration portion 3 inside the carrier 2 is arranged coaxially with the first through hole.

[0079] In this embodiment, stress is concentrated by the stress concentration part 3 provided inside the carrier 2 and the stress concentration part 3 provided inside the connecting part 11, and wrinkles are controlled to appear on the stress concentration part 3. The stress on the grid structure 12 is effectively reduced, and messy wrinkles on the grid structure 12 are avoided.

[0080] In one embodiment, an elastic telescopic structure is provided on the grid structure 12 , and the elastic telescopic structure can be extended and retracted along the plane where the grid structure 12 is located.

[0081] In this embodiment, the grid structure 12 has the ability to expand and contract along the plane by providing an elastic expansion structure. In this way, when stress occurs, the grid structure 12 can also eliminate the stress through the expansion and contraction of the elastic expansion structure, thereby avoiding wrinkles on the grid structure 12.

[0082] For example, the elastic telescopic structure can be a grid-like structure that can be elastically telescopic, so that it can satisfy the elastic telescopic capability and also have the same dustproof function as the grid structure 12 .

[0083] In one example, the elastic modulus of the elastic telescopic structure is anisotropic.

[0084] The elastic coefficient of the elastic telescopic structure is anisotropic, so that the elastic telescopic capacity of the elastic telescopic structure in different directions is different. For example, the elastic coefficient on the plane where the grid structure 12 is located enables the elastic structure to meet the set elastic capacity. It can effectively eliminate the wrinkles caused by stress on the grid structure 12 and protect the grid structure from being damaged.

[0085] In addition, the elastic expansion and contraction capability can improve the dustproof structure's ability to resist external forces, thereby enhancing the mechanical strength of the dustproof structure.

[0086] In one example, the opening ratios of various locations of the mesh structure 12 are different.

[0087] By controlling the opening ratio of each part of the grid structure 12, the mechanical strength of the grid structure 12 is improved. In this way, the grid structure 12 can be protected from being damaged when subjected to stress or external force, thereby improving the yield rate of the dustproof structure and the reliability of installation.

[0088] For example, the intensity at each location can be adjusted by controlling the opening ratio at each location of the grid structure 12 .

[0089] In one example, the material of the mesh structure 12 and the connecting portion 11 includes metallic glass.

[0090] Metallic glass has excellent mechanical strength, and adding a film made of metallic glass can improve the mechanical strength of the grid structure 12 and the connecting portion 11. It can also improve the yield rate of manufacturing dustproof structures and reduce the damage rate during installation.

[0091] In one example, the material of the carrier 2 includes epoxy resin.

[0092] Adding epoxy resin to manufacture the carrier 2 can reduce the thickness of the carrier 2 while satisfying the functions of the carrier 2 such as supporting the film body, etc. This can help to thin the dustproof structure.

[0093] According to one embodiment of the present invention, there is provided a microphone packaging structure, the microphone packaging structure comprising the above-mentioned dustproof structure, wherein the dustproof structure is fixed on the sound hole 4 of the microphone packaging structure;

[0094] Alternatively, the dustproof structure covers the MEMS chip 5 in the microphone packaging structure.

[0095] Generally, the microphone packaging structure includes a shell forming a receiving cavity and a substrate fixed to the shell. The sound hole 4 can be arranged on the substrate or on the shell.

[0096] In this embodiment, the dustproof structure may be fixed on the sound hole 4 from the outside of the microphone packaging structure, thereby protecting the components in the microphone packaging structure from the outside.

[0097] It can also be, Fig.11 As shown, the dustproof structure is fixed on the sound hole 4 from the inside of the microphone packaging structure, thereby protecting the components of the microphone packaging structure from the inside.

[0098] It can also be, Fig.12 As shown, the dustproof structure is fixed on the substrate to protect the sound hole 31 and the interior of the microphone packaging structure. The MEMS chip 5 is fixed to the dustproof structure.

[0099] Alternatively, the dustproof structure may be fixed inside the microphone packaging structure and cover the MEMS chip 5. This can protect the MEMS chip 5. In this structure, the dustproof structure may be fixed on the substrate where the MEMS chip 5 is located to form a cover. Alternatively, the dustproof structure may be fixed on the substrate of the MEMS chip 5 to form a cover. All of the above structures can protect the MEMS chip 5.

[0100] The microphone packaging structure can effectively prevent the dustproof structure from being damaged by heat during the installation and use of the microphone, and can also protect the components in the microphone, for example, protecting the MEMS chip 5 from being contaminated by external dust and other pollutants.

[0101] According to one embodiment of the present invention, an electronic device is provided, comprising the above-mentioned microphone packaging structure.

[0102] The electronic device includes the microphone packaging structure and has all the advantages of the microphone packaging structure. For example, the electronic device can be an audio device, a mobile phone, a computer, and other products.

[0103] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A dustproof structure, characterized in that: include: Grid structure; A support portion, the support portion comprising a connecting portion and a carrier fixed to the connecting portion, the connecting portion is arranged around the grid structure, a first through hole is formed in the middle of the carrier, and the grid structure covers one end of the first through hole; A stress concentration portion, formed on the inner sides of the carrier and the connecting portion, the stress concentration portion is used to concentrate the stress of the supporting portion, the stress concentration portion on the inner side of the carrier is coaxially arranged with the first through hole, and the stress concentration portion on the inner side of the connecting portion is arranged around the grid structure; The stress concentration portion includes a second extension portion extending inwardly from the carrier, the second extension portion includes a plurality of protrusions or a plurality of arc-shaped walls, and the plurality of protrusions and the plurality of arc-shaped walls are distributed along the circumference of the second extension portion.

2. The dustproof structure according to claim 1, characterized in that: The stress concentration portion includes a first extension portion extending inwardly from the connection portion, and a plurality of second through holes are provided on the first extension portion. The plurality of second through holes are distributed along the circumference of the first extension portion.

3. The dustproof structure according to claim 2, characterized in that: An opening ratio of the second through hole is less than or equal to an opening ratio of the grid structure.

4. The dustproof structure according to claim 2, characterized in that: The second through hole includes a rectangular hole or an arc-shaped hole.

5. The dustproof structure according to claim 1, characterized in that: The stress concentration portion includes a first extension portion extending inwardly from the connecting portion, a plurality of incisions are cut on the first extension portion, a neck connected to the first extension portion is formed between the two ends of each incision, the incision faces the grid structure, and the neck faces the supporting portion; the plurality of incisions are distributed along the circumference of the first extension portion.

6. The dustproof structure according to claim 1, characterized in that: Along a cross section perpendicular to the axial direction of the first through hole, the protrusion includes a rectangular protrusion with a rectangular edge shape or an arc-shaped protrusion with an arc-shaped edge shape.

7. The dustproof structure according to claim 1, characterized in that: The two ends of the arc-shaped wall are connected to the carrier and the middle is hollow; the arc-shaped wall is arc-shaped along a section perpendicular to the axial direction of the first through hole.

8. The dustproof structure according to any one of claims 1 to 7, characterized in that: The grid structure is provided with an elastic telescopic structure, and the elastic telescopic structure can be telescoped along the plane where the grid structure is located.

9. The dustproof structure according to claim 8, characterized in that: The elastic coefficient of the elastic telescopic structure is anisotropic.

10. The dustproof structure according to any one of claims 1 to 7, characterized in that: The opening ratios of various locations of the grid structure are different.

11. The dustproof structure according to any one of claims 1 to 7, characterized in that: The materials of the grid structure and the connecting part include metallic glass.

12. The dustproof structure according to any one of claims 1 to 7, characterized in that: The material of the carrier includes epoxy resin.

13. A microphone packaging structure, characterized in that: The dustproof structure comprises the dustproof structure according to any one of claims 1 to 12, wherein the dustproof structure is fixed on the sound hole of the microphone packaging structure; Alternatively, the dustproof structure covers the MEMS chip in the microphone packaging structure.

14. An electronic device, characterized in that: Including the microphone packaging structure as described in claim 13.

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