A cleaning device

Abstract

The present invention relates to the technical field of silicon wafer grinding and cleaning, and discloses a cleaning device, which includes a frame, two first cleaning mechanisms and a second cleaning mechanism. The two first cleaning mechanisms are arranged on the frame at intervals and slidably, and the first cleaning mechanism can move relative to the frame along a horizontal first direction. The first cleaning mechanism includes a first driving component and a first cleaning head, and the first driving component can drive the first cleaning head to clean the silicon wafer; the second cleaning mechanism is slidably arranged on the frame and is located between the two first cleaning mechanisms. The second cleaning mechanism can move relative to the frame along the horizontal first direction. The second cleaning mechanism includes a second driving component and a second cleaning head, and the second cleaning mechanism can drive the second cleaning head to clean the suction cup. This cleaning device can clean the silicon wafer to ensure the cleanliness of the silicon wafer, clean the suction cup, ensure the cleanliness of the suction cup, and can effectively avoid the influence of the dust adhered to the suction cup on the grinding accuracy of the next silicon wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer grinding and cleaning, and particularly relates to a cleaning device. Background Art

[0002] With the development of electronic science and technology, the usage of silicon wafers is increasing, and the application fields are also expanding. During the processing of silicon wafers, they need to be ground. Generally, a manipulator (the main ways for the manipulator to grasp silicon wafers are vacuum adsorption and clamping) is used to take out the silicon wafers from the wafer cassette, move them to the grinding disk, fix them by vacuum adsorption, and then grind them.

[0003] To improve the grinding efficiency, generally two ceramic suction cups and two grinding components are equipped on the grinding equipment. The two ceramic suction cups simultaneously adsorb and fix two silicon wafers, and the two grinding components simultaneously grind the two silicon wafers.

[0004] After grinding, to ensure the cleanliness of the silicon wafers, the silicon wafers need to be cleaned. At the same time, to ensure the next grinding accuracy, the ceramic suction disks also need to be cleaned to avoid the dust adhered to the ceramic suction disks affecting the placement accuracy of the silicon wafers in the next time.

[0005] Therefore, there is an urgent need for a cleaning device to solve the above technical problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a cleaning device that can clean silicon wafers and suction cups to ensure the cleanliness of the silicon wafers and suction cups.

[0007] To achieve this purpose, the present invention adopts the following technical solutions:

[0008] Provide a cleaning device, including:

[0009] A frame,

[0010] Two first cleaning mechanisms, which are arranged on the frame at intervals and slidably, the first cleaning mechanism can move along a horizontal first direction relative to the frame, the first cleaning mechanism includes a first driving component and a first cleaning head, and the first driving component can drive the first cleaning head to clean the silicon wafers;

[0011] A second cleaning mechanism, which is slidably arranged on the frame and is located between the two first cleaning mechanisms, the second cleaning mechanism can move along the horizontal first direction relative to the frame, the second cleaning mechanism includes a second driving component and a second cleaning head, and the second cleaning mechanism can drive the second cleaning head to clean the suction cups.

[0012] As a preferred solution of the cleaning device, the first driving component includes a first mounting bracket and a first driving member. The first driving member is disposed on the first mounting bracket. The first cleaning head is rotatably disposed on the first mounting bracket. The output end of the first driving member is in transmission connection with the first cleaning head. The first driving member can drive the first cleaning head to operate for cleaning the silicon wafer.

[0013] As a preferred solution of the cleaning device, the first driving component further includes a first synchronous pulley, a third synchronous pulley, a first connecting shaft and a first synchronous belt;

[0014] The first synchronous pulley is disposed at the output end of the first driving member. The first connecting shaft is disposed on the first cleaning head. The first connecting shaft is rotatably connected to the first mounting bracket through a bearing. The third synchronous pulley is disposed on the first connecting shaft. The first synchronous pulley and the third synchronous pulley are in transmission connection through the first synchronous belt.

[0015] As a preferred solution of the cleaning device, the first driving component further includes a first tensioning pulley. The first tensioning pulley is rotatably disposed on the first mounting bracket. The first tensioning pulley presses against the first synchronous belt.

[0016] As a preferred solution of the cleaning device, the first cleaning mechanism further includes a first translation mechanism and a first lifting mechanism. The first lifting mechanism is slidably disposed on the frame;

[0017] The first translation mechanism is disposed at the output end of the first lifting mechanism. The first lifting mechanism can drive the first translation mechanism to move in the vertical direction. The first mounting bracket is disposed at the output end of the first translation mechanism. The first translation mechanism can drive the first mounting bracket to move in the horizontal second direction.

[0018] As a preferred solution of the cleaning device, the second driving component includes a second mounting bracket and a second driving member. The second driving member is disposed on the second mounting bracket. The second cleaning head is rotatably disposed on the second mounting bracket. The output end of the second driving member is in transmission connection with the second cleaning head. The second driving member can drive the second cleaning head to operate for cleaning the suction cup.

[0019] As a preferred solution of the cleaning device, the second driving component further includes a second synchronous pulley, a fourth synchronous pulley, a second connecting shaft and a second synchronous belt;

[0020] The output end of the second driving member is provided with the second synchronous wheel, the second cleaning head is provided with the second connecting shaft, the second connecting shaft is rotatably connected to the second mounting bracket through a bearing, the second connecting shaft is provided with a fourth synchronous wheel, and the second synchronous wheel and the fourth synchronous wheel are connected through the second synchronous belt transmission.

[0021] As a preferred solution of the cleaning device, the second driving assembly further includes a second tensioning wheel, which is rotatably disposed on the second mounting frame and presses against the second synchronous belt.

[0022] As a preferred solution of the cleaning device, the second cleaning mechanism further includes a second translation mechanism and a second lifting mechanism, and the second lifting mechanism is slidably arranged on the frame;

[0023] The second translation mechanism is arranged at the output end of the second lifting mechanism, driving the second lifting mechanism to drive the second translation mechanism to move along the vertical direction. The second mounting bracket is arranged at the output end of the second translation mechanism, and the second translation mechanism can drive the second mounting bracket to move along the horizontal second direction.

[0024] As a preferred solution of the cleaning device, the horizontal first direction and the horizontal second direction are arranged perpendicular to each other.

[0025] Beneficial effects of the present invention:

[0026] The first cleaning mechanism cleans the silicon wafer. After the silicon wafer is cleaned, the second cleaning mechanism cleans the suction cup. This cleaning mechanism cleans the silicon wafer to ensure its cleanliness. Cleaning the suction cup ensures cleanliness and effectively prevents dust adhering to the suction cup from affecting the grinding accuracy of the next silicon wafer. The second cleaning mechanism is located between the two first cleaning mechanisms and can clean both suction cups by moving left and right. With the two first cleaning mechanisms, while the silicon wafer on the first suction cup is being ground, the silicon wafer and suction cup on the second suction cup are cleaned. While the silicon wafer on the left suction cup is being ground, the silicon wafer and suction cup on the right suction cup are cleaned. When the left silicon wafer is finished and needs cleaning, the right silicon wafer begins grinding. The two suction cups ensure that one is grinding a silicon wafer at any time, increasing the operating time of the grinding mechanism and enhancing the effective grinding time of the grinding mechanism. Furthermore, the cleaning mechanism has a simple structure, is easy to operate, and has high cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the structure of the first cleaning mechanism provided by the present invention. Figure 1 ;

[0028] Figure 2It is a schematic diagram of the structure of the first cleaning mechanism provided by the present invention Figure 2 ;

[0029] Figure 3 It is a partial structural schematic diagram of the first cleaning mechanism provided by the present invention;

[0030] Figure 4 It is a partial cross-sectional view of the first cleaning mechanism provided by the present invention;

[0031] Figure 5 It is a schematic diagram of the structure of the second cleaning mechanism provided by the present invention Figure 1 ;

[0032] Figure 6 It is a schematic diagram of the structure of the second cleaning mechanism provided by the present invention Figure 2 ;

[0033] Figure 7 It is a partial structural schematic diagram of the second cleaning mechanism provided by the present invention;

[0034] Figure 8 It is a partial cross-sectional view of the second cleaning mechanism provided by the present invention.

[0035] In the figure:

[0036] 1. First cleaning mechanism; 11. First driving assembly; 11. First mounting bracket; 112. First driving member; 113. First synchronous pulley; 114. Third synchronous pulley; 115. First connecting shaft; 116. First synchronous belt; 117. First tensioning pulley;

[0037] 12. First cleaning head; 13. First translation mechanism; 131. Third servo motor; 132. First slide rail; 14. First lifting mechanism; 141. First servo motor; 142. Third slide rail; 15. Rodless cylinder;

[0038] 2. Second cleaning mechanism; 21. Second driving assembly; 211. Second mounting bracket; 212. Second driving member; 213. Second synchronous pulley; 214. Fourth synchronous pulley; 215. Second connecting shaft; 216. Second synchronous belt; 217. Second tensioning pulley;

[0039] 22. Second cleaning head; 23. Second translation mechanism; 231. Fourth servo motor; 232. Second slide rail;

[0040] 24. Second lifting mechanism; 241. Second servo motor; 242. Fourth slide rail; 251. Driving servo motor; 252. Second guide rail. Detailed implementation manners

[0041] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only a part rather than all of the embodiments of the present invention. Components of the embodiments of the present invention generally described and illustrated in the accompanying drawings here may be arranged and designed in a variety of different configurations.

[0042] Therefore, the detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0043] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings.

[0044] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "a plurality" means two or more.

[0045] In the description of the present invention, it should also be noted that unless otherwise clearly defined and limited, the terms "set" and "connect" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In the present invention, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0047] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0048] As Figure 1-8 shown, this embodiment discloses a cleaning device, which includes a frame, two first cleaning mechanisms 1 and a second cleaning mechanism 2.

[0049] The two first cleaning mechanisms 1 are arranged on the frame at intervals and slidably. The first cleaning mechanism 1 can move relative to the frame along a horizontal first direction. The first cleaning mechanism 1 includes a first driving component 11 and a first cleaning head 12. The first driving component 11 can drive the first cleaning head 12 to clean the silicon wafer. The second cleaning mechanism 2 is slidably arranged on the frame and is located between the two first cleaning mechanisms 1. The second cleaning mechanism 2 can move relative to the frame along the horizontal first direction. The second cleaning mechanism 2 includes a second driving component 21 and a second cleaning head 22. The second cleaning mechanism 2 can drive the second cleaning head 22 to clean the suction cup.

[0050] The first cleaning mechanism 1 cleans the silicon wafer. After the silicon wafer is cleaned, the second cleaning mechanism 2 can clean the suction cup. This cleaning device can clean the silicon wafer to ensure the cleanliness of the silicon wafer. By cleaning the suction cup, the cleanliness of the suction cup can be ensured, and it can effectively avoid the influence of dust adhered to the suction cup on the grinding accuracy of the next silicon wafer. The second cleaning mechanism 2 is arranged between the two first cleaning mechanisms 1 and can clean the two suction cups by moving left and right. For the two first cleaning mechanisms 1, while the silicon wafer on the left suction cup is being ground, the silicon wafer and the suction cup on the right suction cup are cleaned. When the silicon wafer on the left needs to be cleaned after grinding is completed, the silicon wafer on the right also starts to be ground; the two suction cups can ensure that one is grinding the silicon wafer at any time, improving the working time of the grinding device and increasing the effective grinding efficiency of the grinding device. Moreover, this cleaning device has a simple structure, is convenient to operate, and has a high cleaning efficiency.

[0051] The first cleaning head 12 includes a first frame and a first brush. The first brush is disposed on the first frame. The rotation of the first frame enables the first brush to clean the surface of the silicon wafer, removing the dust generated by grinding to complete the cleaning of the silicon wafer. Specifically, as Figure 3 and Figure 4 shown, the first driving assembly 11 includes a first mounting bracket 111 and a first driving member 112. The first driving member 112 is disposed on the first mounting bracket 111. The first cleaning head 12 is rotatably disposed on the first mounting bracket 111. The output end of the first driving member 112 is in transmission connection with the first cleaning head 12. The first driving member 112 can drive the first cleaning head 12 to rotate, so that the first brush of the first cleaning head 12 cleans the silicon wafer.

[0052] More specifically, the first driving assembly 11 further includes a first synchronous pulley 113, a third synchronous pulley 114, a first connecting shaft 115 and a first synchronous belt 116. The output end of the first driving member 112 is provided with the first synchronous pulley 113. The first frame of the first cleaning head 12 is provided with the first connecting shaft 115. The two ends of the first connecting shaft 115 are rotatably connected to the first mounting bracket 111 through bearings. The third synchronous pulley 114 is disposed on the first connecting shaft 115. The first synchronous pulley 113 and the third synchronous pulley 114 are in transmission connection through the first synchronous belt 116. Preferably, both the first synchronous pulley 113 and the third synchronous pulley 114 in this embodiment are toothed belt pulleys, and the first synchronous belt 116 is a toothed belt. Such a setting ensures that there is no slippage between the first synchronous pulley 113 and the first synchronous belt 116 and between the third synchronous pulley 114 and the first synchronous belt 116, guaranteeing the transmission efficiency. Optionally, the first driving assembly 11 further includes a first tensioning pulley 117. The first tensioning pulley 117 is rotatably disposed on the first mounting bracket 111. The first tensioning pulley 117 presses against the outer surface of the first synchronous belt 116. The setting of the first tensioning pulley 117 ensures that there is no slippage between the first synchronous pulley 113 and the first synchronous belt 116 and between the second synchronous pulley 213 and the first synchronous belt 116, guaranteeing the transmission efficiency. The first driving member 112 drives the first synchronous pulley 113 to rotate. The first synchronous pulley 113 drives the third synchronous pulley 114 to rotate through the first synchronous belt 116, and then drives the first connecting shaft 115 to rotate, so as to drive the first cleaning head 12 to rotate, so that the first brush of the first cleaning head 12 cleans the silicon wafer.

[0053] As Figure 1 and Figure 2As shown, the first cleaning mechanism 1 further includes a first translation mechanism 13 and a first lifting mechanism 14. The first lifting mechanism 14 is slidably arranged on the frame. The first translation mechanism 13 is arranged at the output end of the first lifting mechanism 14, and the first lifting mechanism 14 can drive the first translation mechanism 13 to move in the vertical direction. The first mounting bracket 111 is arranged at the output end of the first translation mechanism 13, and the first translation mechanism 13 can drive the first mounting bracket 111 to move in the horizontal second direction. The horizontal first direction and the horizontal second direction are perpendicularly arranged.

[0054] Specifically, a rodless cylinder 15 is arranged on the frame along the horizontal first direction, and the output end of the rodless cylinder 15 can move along the horizontal first direction. The first lifting mechanism 14 includes a first support frame, a first servo motor 141, a first lead screw and a first nut. The first support frame is arranged at the output end of the rodless cylinder 15. A first guide rail is arranged on the frame, and a first guide block slidably matched with the first guide rail is arranged on the first support frame. The rodless cylinder 15 can drive the first support frame to move along the first guide rail in the horizontal first direction. The first servo motor 141 is arranged on the first support frame, the first lead screw is rotatably arranged on the first support frame in the vertical direction, and the output shaft of the first servo motor 141 is in transmission connection with the first lead screw. Specifically, it can be in transmission connection through a coupling or a gear assembly. The first nut is screwed on the first lead screw.

[0055] The first translation mechanism 13 includes a third support frame, a third servo motor 131, a third lead screw and a third nut. The first nut is arranged on the third support frame. The first support frame is provided with a first slide rail 132 in the vertical direction, and a first slide block matched with the first slide rail 132 is arranged on the third support frame. The first servo motor 141 can drive the first lead screw to rotate, so as to drive the third support frame to move up and down along the first slide rail 132.

[0056] The third servo motor 131 is arranged on the third support frame, the third lead screw is rotatably arranged on the third support frame, and the third nut is screwed on the third lead screw. A third slide rail 142 is arranged on the third support frame along the horizontal second direction, a third slide block slidably matched with the third slide rail 142 is arranged on the first mounting bracket 111, and the third nut is arranged on the first mounting bracket 111. The third servo motor 131 can drive the third lead screw to rotate, so as to drive the first mounting bracket 111 to move in the horizontal second direction.

[0057] The rodless cylinder 15 can drive the first support frame to move in the horizontal first direction; the first servo motor 141 can drive the third support frame to move up and down along the first slide rail 132; the third servo motor 131 can drive the first mounting bracket 111 to move in the horizontal second direction. The cooperation of the three can drive the first cleaning head 12 of the first cleaning mechanism 1 to move in any direction in space, so as to clean the silicon wafer and move it away after cleaning the silicon wafer for subsequent processing and cleaning.

[0058] As shown in Figure 7 and Figure 8 shown, the second cleaning head 22 includes a second frame, a carrier and a second brush. The second brush is disposed on the second frame. The second frame and the carrier are slidably connected through a sliding shaft, and a spring is disposed between them. The spring is sleeved on the sliding shaft. The rotation of the second frame can make the second brush clean the surface of the suction cup, and sweep away the dust generated by grinding, so as to complete the cleaning of the suction cup. The second driving assembly 21 includes a second mounting bracket 211 and a second driving member 212. The second driving member 212 is disposed on the second mounting bracket 211. The second cleaning head 22 is rotatably disposed on the second mounting bracket 211. The output end of the second driving member 212 is in transmission connection with the second cleaning head 22. The second driving member 212 can drive the second cleaning head 22 to operate to clean the suction cup.

[0059] More specifically, the second driving assembly 21 further includes a second synchronous pulley 213, a fourth synchronous pulley 214, a second connecting shaft 215 and a second synchronous belt 216. The output end of the second driving member 212 is provided with the second synchronous pulley 213. The carrier of the second cleaning head 22 is provided with the second connecting shaft 215. Both ends of the second connecting shaft 215 are rotatably connected to the second mounting bracket 211 through bearings. The second connecting shaft 215 is provided with the fourth synchronous pulley 214. The second synchronous pulley 213 and the fourth synchronous pulley 214 are in transmission connection through the second synchronous belt 216. Preferably, both the second synchronous pulley 213 and the fourth synchronous pulley 214 in this embodiment are toothed belt pulleys, and the second synchronous belt 216 is a toothed belt. Such a setting makes it impossible for the second synchronous pulley 213 and the second synchronous belt 216 and between the fourth synchronous pulley 214 and the second synchronous belt 216 to slip, ensuring the transmission efficiency. Optionally, the second driving assembly 21 further includes a second tension pulley 217. The second tension pulley 217 is rotatably disposed on the second mounting bracket 211. The second tension pulley 217 presses against the outer surface of the second synchronous belt 216. The setting of the second tension pulley 217 makes it impossible for the second synchronous pulley 213 and the second synchronous belt 216 and between the fourth synchronous pulley 214 and the second synchronous belt 216 to slip, ensuring the transmission efficiency. The first driving member 112 drives the first synchronous pulley 113 to rotate. The first synchronous pulley 113 drives the third synchronous pulley 114 to rotate through the first synchronous belt 116, and then drives the first connecting shaft 115 to rotate, so as to drive the first cleaning head 12 to rotate, so that the first brush of the first cleaning head 12 cleans the silicon wafer.

[0060] As shown in Figure 5 and Figure 6As shown, the second cleaning mechanism 2 further includes a second translation mechanism 23 and a second lifting mechanism 24. The second lifting mechanism 24 is slidably arranged on the frame. The second translation mechanism 23 is arranged at the output end of the second lifting mechanism 24, and the second lifting mechanism 24 can drive the second translation mechanism 23 to move in the vertical direction. The second mounting bracket 211 is arranged at the output end of the second translation mechanism 23, and the second translation mechanism 23 can drive the second mounting bracket 211 to move in the horizontal second direction.

[0061] Specifically, a driving servo motor 251 is arranged on the frame along the horizontal first direction. The driving servo motor 251 can drive the second lifting mechanism 24 to move in the horizontal first direction. The second lifting mechanism 24 includes a second support frame, a second servo motor 241, a second lead screw and a second nut. A second guide rail 252 is arranged on the frame (the second guide rail 252 can be collinear with the first guide rail or just be arranged in parallel). A second guide block slidably matched with the second guide rail 252 is arranged on the second support frame. A driving lead screw is arranged on the output shaft of the driving servo motor 251, and a driving nut is arranged on the second support frame. The driving servo motor 251 drives the driving lead screw to rotate so as to drive the second support frame to move in the horizontal first direction on the second guide rail 252. The second servo motor 241 is arranged on the second support frame. The second lead screw is rotatably arranged on the second support frame in the vertical direction. The output shaft of the second servo motor 241 is in transmission connection with the second lead screw. Specifically, it can be in transmission connection through a coupling or a gear assembly. The second nut is screwed on the second lead screw.

[0062] The second translation mechanism 23 includes a fourth support frame, a fourth servo motor 231, a fourth lead screw and a fourth nut. The second nut is arranged on the fourth support frame. The second support frame is provided with a second slide rail 232 in the vertical direction. A second slider matched with the second slide rail 232 is arranged on the fourth support frame. The second servo motor 241 can drive the second lead screw to rotate so as to drive the fourth support frame to move up and down along the second slide rail 232.

[0063] The fourth servo motor 231 is arranged on the fourth support frame. The fourth lead screw is rotatably arranged on the fourth support frame. The fourth nut is screwed on the fourth lead screw. A fourth slide rail 242 is arranged on the fourth support frame along the horizontal second direction. A fourth slider slidably matched with the fourth slide rail 242 is arranged on the second mounting bracket 211. The fourth nut is arranged on the second mounting bracket 211. The fourth servo motor 231 can drive the fourth lead screw to rotate so as to drive the second mounting bracket 211 to move in the horizontal second direction.

[0064] The driving servo motor 251 can drive the second support frame to move along the horizontal first direction; the second servo motor 241 can drive the fourth support frame to move up and down along the second slide rail 232; the fourth servo motor 231 can drive the second mounting bracket 211 to move along the horizontal second direction. The cooperation of the three can drive the second cleaning head 22 of the second cleaning mechanism 2 to move in any direction in space to clean the suction cup and move it away after cleaning the suction cup for subsequent processing and cleaning.

[0065] After the manipulator finishes loading the left and right suction cups successively, the suction cup on the left finishes grinding first. After the grinding device is removed, the rodless cylinder 15 drives the first support frame to move along the horizontal first direction, the first servo motor 141 drives the third support frame to move along the first slide rail 132, and the third servo motor 131 drives the first mounting bracket 111 to move along the horizontal second direction. The cooperation of the three drives the first cleaning head 12 of the first cleaning mechanism 1 corresponding to the suction cup on the left to move above the silicon wafer on the suction cup on the left. Then the first driving member 112 drives the first synchronous wheel 113 to rotate, and the first synchronous wheel 113 drives the third synchronous wheel 114 to rotate through the first synchronous belt 116, thereby driving the first cleaning head 12 to rotate so that the first brush of the first cleaning head 12 cleans the silicon wafer on the suction cup on the left.

[0066] After the silicon wafer on the suction cup on the left is cleaned, the rodless cylinder 15, the first servo motor 141, and the third servo motor 131 cooperate to move the first cleaning head 12 corresponding to the suction cup on the left away to give way to the second cleaning mechanism 2. Then the manipulator vacuum-adsorbs the silicon wafer, de-vacuumizes the silicon wafer, and then moves the silicon wafer on the suction cup on the left away.

[0067] Then, the driving servo motor 251 drives the second support frame to move along the horizontal first direction, the second servo motor 241 drives the fourth support frame to move along the second slide rail 232, and the fourth servo motor 231 drives the second mounting bracket 211 to move along the horizontal second direction. The cooperation of the three drives the second cleaning head 22 of the second cleaning mechanism 2 to move above the suction cup on the left. Then the second driving member 212 drives the second synchronous wheel 213 to rotate, and the second synchronous wheel 213 drives the third synchronous wheel 214 to rotate through the second synchronous belt 216, thereby driving the second cleaning head 22 to rotate so that the second brush of the second cleaning head 22 cleans the suction cup on the left.

[0068] During the cleaning of the silicon wafer on the suction cup on the left and the suction cup on the left, the silicon wafer on the suction cup on the right is being ground; after the cleaning of the suction cup on the left is completed, the driving servo motor 251, the second servo motor 241, and the fourth servo motor 231 cooperate to move the second cleaning head 22 away to give way. The manipulator grabs the unground silicon wafer and places it on the suction cup on the left, and the grinding device on the left grinds the silicon wafer.

[0069] When the cleaning of the left suction cup is completed, the grinding of the silicon wafer on the right suction cup is completed. The grinding device on the right is removed to make way. The rodless cylinder 15 drives the first support frame to move along the horizontal first direction. The first servo motor 141 drives the third support frame to move along the first slide rail 132. The third servo motor 131 drives the first mounting frame 111 to move along the horizontal second direction. The three cooperate to drive the first cleaning head 12 of the first cleaning mechanism 1 corresponding to the right suction cup to move above the silicon wafer on the right suction cup. Then, the first driving member 112 drives the first synchronous pulley 113 to rotate. The first synchronous pulley 113 drives the third synchronous pulley 114 to rotate through the first synchronous belt 116, thereby driving the first cleaning head 12 to rotate, so that the first brush of the first cleaning head 12 cleans the silicon wafer on the right suction cup.

[0070] After the cleaning of the silicon wafer on the right suction cup is completed, the rodless cylinder 15, the first servo motor 141 and the third servo motor 131 cooperate to remove the first cleaning head 12 corresponding to the right suction cup to make way for the second cleaning mechanism 2. Then, the manipulator vacuum-adsorbs the silicon wafer. After the silicon wafer is de-vacuumed, the silicon wafer on the right suction cup is removed.

[0071] Then, the driving servo motor 251 drives the second support frame to move along the horizontal first direction. The second servo motor 241 drives the fourth support frame to move along the second slide rail 232. The fourth servo motor 231 drives the second mounting frame 211 to move along the horizontal second direction. The three cooperate to drive the second cleaning head 22 of the second cleaning mechanism 2 to move above the right suction cup. Then, the second driving member 212 drives the second synchronous pulley 213 to rotate. The second synchronous pulley 213 drives the third synchronous pulley 214 to rotate through the second synchronous belt 216, thereby driving the second cleaning head 22 to rotate, so that the second brush of the second cleaning head 22 cleans the right suction cup.

[0072] When the cleaning of the right suction cup is completed, the grinding of the silicon wafer on the left suction cup is basically completed. Then, the silicon wafer and the left suction cup on the left suction cup are cleaned. This process continues in turn.

[0073] The two suction cups can ensure that one of them is grinding the silicon wafer at any time, which improves the working time of the grinding device and increases the effective grinding efficiency of the grinding device. Moreover, the cleaning device has a simple structure, is easy to operate, and has high cleaning efficiency.

[0074] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, and are not intended to limit the embodiments of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A cleaning device, characterized in that, Including: A frame Two first cleaning mechanisms (1), which are spaced apart and slidably arranged on the frame. The first cleaning mechanism (1) can move along a horizontal first direction relative to the frame. The first cleaning mechanism (1) includes a first driving component (11) and a first cleaning head (12), and the first driving component (11) can drive the first cleaning head (12) to clean the silicon wafer. A second cleaning mechanism (2), which is slidably arranged on the frame and is located between the two first cleaning mechanisms (1). It can clean two suction cups by moving left and right. The second cleaning mechanism (2) can move along the horizontal first direction relative to the frame. The second cleaning mechanism (2) includes a second driving component (21) and a second cleaning head (22), and the second cleaning mechanism (2) can drive the second cleaning head (22) to clean the suction cup. While the silicon wafer on the left suction cup is being ground, the first cleaning mechanism (1) corresponding to the right suction cup cleans the silicon wafer on the right suction cup. After the cleaning is completed, the first cleaning mechanism (1) corresponding to the right suction cup is removed, and the silicon wafer is removed by a manipulator. Then the second cleaning mechanism (2) moves to the right suction cup to clean the suction cup. While the silicon wafer on the left needs to be cleaned after grinding, the silicon wafer on the right starts to be ground.

2. The cleaning device according to claim 1, wherein, The first driving component (11) includes a first mounting frame (111) and a first driving member (112). The first driving member (112) is arranged on the first mounting frame (111). The first cleaning head (12) is rotatably arranged on the first mounting frame (111). The output end of the first driving member (112) is in transmission connection with the first cleaning head (12), and the first driving member (112) can drive the first cleaning head (12) to operate to clean the silicon wafer.

3. The cleaning device according to claim 2, characterized in that, The first driving component (11) further includes a first synchronous pulley (113), a third synchronous pulley (114), a first connecting shaft (115) and a first synchronous belt (116); The output end of the first driving member (112) is provided with the first synchronous pulley (113). The first cleaning head (12) is provided with the first connecting shaft (115). The first connecting shaft (115) is rotatably connected to the first mounting frame (111) through a bearing. The first connecting shaft (115) is provided with the third synchronous pulley (114). The first synchronous pulley (113) and the third synchronous pulley (114) are in transmission connection through the first synchronous belt (116).

4. The cleaning device according to claim 3, characterized in that The first driving component (11) further includes a first tensioning pulley (117). The first tensioning pulley (117) is rotatably arranged on the first mounting frame (111), and the first tensioning pulley (117) presses against the first synchronous belt (116).

5. The cleaning device according to claim 2, wherein The first cleaning mechanism (1) further includes a first translation mechanism (13) and a first lifting mechanism (14). The first lifting mechanism (14) is slidably arranged on the frame; The first translation mechanism (13) is arranged at the output end of the first lifting mechanism (14), and the first lifting mechanism (14) can drive the first translation mechanism (13) to move in the vertical direction. The first mounting bracket (111) is arranged at the output end of the first translation mechanism (13), and the first translation mechanism (13) can drive the first mounting bracket (111) to move in the horizontal second direction.

6. The cleaning device according to claim 1, wherein The second driving component (21) includes a second mounting bracket (211) and a second driving member (212). The second driving member (212) is arranged on the second mounting bracket (211). The second cleaning head (22) is rotatably arranged on the second mounting bracket (211). The output end of the second driving member (212) is in transmission connection with the second cleaning head (22), and the second driving member (212) can drive the second cleaning head (22) to operate for cleaning the suction cup.

7. The cleaning device according to claim 6, wherein The second driving component (21) further includes a second synchronous pulley (213), a fourth synchronous pulley (214), a second connecting shaft (215) and a second synchronous belt (216); The output end of the second driving member (212) is provided with the second synchronous pulley (213). The second connecting shaft (215) is arranged on the second cleaning head (22). The second connecting shaft (215) is rotatably connected to the second mounting bracket (211) through a bearing. The fourth synchronous pulley (214) is arranged on the second connecting shaft (215). The second synchronous pulley (213) and the fourth synchronous pulley (214) are in transmission connection through the second synchronous belt (216).

8. The cleaning device according to claim 7, characterized in that, The second driving component (21) further includes a second tension pulley (217). The second tension pulley (217) is rotatably arranged on the second mounting bracket (211), and the second tension pulley (217) presses against the second synchronous belt (216).

9. The cleaning device according to claim 6, wherein, The second cleaning mechanism (2) further includes a second translation mechanism (23) and a second lifting mechanism (24). The second lifting mechanism (24) is slidably arranged on the frame; The second translation mechanism (23) is arranged at the output end of the second lifting mechanism (24), and the second lifting mechanism (24) can drive the second translation mechanism (23) to move in the vertical direction. The second mounting bracket (211) is arranged at the output end of the second translation mechanism (23), and the second translation mechanism (23) can drive the second mounting bracket (211) to move in the horizontal second direction.

10. The cleaning device according to claim 9, characterized in that, The horizontal first direction and the horizontal second direction are arranged perpendicular to each other.

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