Light emitting device and method for manufacturing the same

Abstract

A light-emitting device and a method for manufacturing the same. The light-emitting device (100) comprises: a support (1), a light-emitting element (10) arranged on the support (1), a wavelength conversion component (20) arranged on the light-emitting element (10) and larger than the light-emitting element (10) in a plan view, and a light-reflecting component (40) separated from the wavelength conversion component (20) and the side surface of the light-emitting element (10) and arranged on the support (1), wherein the wavelength conversion component (20) comprises a wavelength conversion portion (24) arranged on the upper surface of the light-emitting element (10), and a light-transmitting portion (26) provided around the wavelength conversion portion (24), and a light-transmitting component (30) is provided between the side surface of the light-emitting element (10) and the light-reflecting component (40) and is in contact with the side surface of the light-emitting element (10) and a part of the light-transmitting portion (26) of the wavelength conversion component (20).

Description

Technical Field

[0001] The present invention relates to a light emitting device and a method for manufacturing the same. Background Art

[0002] A light-emitting device that can obtain mixed light by combining a light-emitting element and a phosphor is used in applications such as lighting and liquid crystal backlight.

[0003] For example, Patent Document 1 has disclosed a light emitting device having a light emitting element that emits blue light and a phosphor that emits yellow light.

[0004] In the above-mentioned light emitting device, chromaticity varies depending on the light distribution angle, that is, chromaticity non-uniformity may occur. In order to suppress this chromaticity non-uniformity, the light emitting device of Patent Document 1 further mixes a light scattering material into the phosphor layer containing the phosphor.

[0005] By providing the member for scattering as described above, more uniform light scattering can be achieved, so that non-uniformity in light distribution and chromaticity can be expected to be suppressed.

[0006] Refer to (Japan) Patent Publication No. 2018-49875.

[0007] However, when the above-mentioned scattering member is provided, light is lost not only due to scattering but also due to absorption, etc., resulting in a reduction in the luminous flux of the light emitting device. Therefore, it is desired to realize a light source that does not reduce the luminous flux and improves the chromaticity unevenness. Summary of the invention

[0008] An object of the present invention is to provide a light emitting device which improves chromaticity unevenness and also suppresses a decrease in luminous flux.

[0009] A light-emitting device according to one embodiment of the present invention comprises: a support body; a light-emitting element, which is arranged on the support body; a wavelength conversion component, which is arranged above the light-emitting element and is larger than the light-emitting element in a plan view; a light-reflecting component, which is separated from the wavelength conversion component and the side surface of the light-emitting element and is arranged on the support body, and the wavelength conversion component comprises: a wavelength conversion portion, which is arranged on the upper surface of the light-emitting element; a light-transmitting portion, which is arranged around the wavelength conversion portion, and a light-transmitting component is provided between the side surface of the light-emitting element and the light-reflecting component, and is connected to the side surface of the light-emitting element and a part of the light-transmitting portion of the wavelength conversion component.

[0010] A method for manufacturing a light-emitting device according to one embodiment of the present invention is a method for manufacturing a light-emitting device having a support body, a light-emitting element arranged on the support body, a wavelength conversion component arranged on the light-emitting element and larger than the light-emitting element when viewed from above, and a light-reflecting component arranged on the support body, comprising: a step of preparing a wavelength conversion component having a wavelength conversion portion containing a phosphor and a light-transmitting portion arranged around the wavelength conversion portion; a step of arranging the wavelength conversion component on the light-emitting element arranged on the support body; a step of arranging a light-transmitting component on the support body in a manner covering the side surfaces of the light-emitting element and a portion of the light-transmitting portion; and a step of arranging a light-reflecting component on the support body in a manner covering the wavelength conversion component and the side surfaces of the light-transmitting component.

[0011] One embodiment of the present invention can provide a light-emitting device that improves chromaticity non-uniformity and suppresses a decrease in luminous flux. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective view showing a light emitting device according to a first embodiment of the present invention.

[0013] Figure 2 It is a plan view showing the light emitting device according to the first embodiment of the present invention.

[0014] Figure 3 Yes means Figure 2 A top perspective view of a light emitting device.

[0015] Figure 4 yes Figure 1 Exploded three-dimensional diagram.

[0016] Figure 5 Observed from below Figure 1 Exploded three-dimensional diagram.

[0017] Figure 6 yes Figure 1 A cross-sectional view of the light-emitting device taken along line VI-VI.

[0018] Figure 7 It is schematically represented in Figure 6 A cross-sectional view of the direction of light travel.

[0019] Figure 8 This is a photograph showing the light-emitting state of the light-emitting device of the comparative example.

[0020] Fig. 9 This is a photograph showing the light-emitting state of the light-emitting device according to the first embodiment.

[0021] Fig.10 It is a top view showing a light emitting device of a modified example.

[0022] Fig.11 It is a top view of a light emitting device showing another modified example.

[0023] Fig.12 It is an exploded perspective view showing a light emitting device according to a second embodiment.

[0024] Fig.13 Yes Fig.12 An exploded perspective view of the light emitting device after further decomposition.

[0025] Fig.14 It is a cross-sectional view showing a light emitting device according to a second embodiment.

[0026] Fig.15 It is a cross-sectional view showing a light emitting device according to a third embodiment.

[0027] Fig.16 This is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the first embodiment.

[0028] Fig.17 This is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the first embodiment.

[0029] Fig.18 This is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the first embodiment.

[0030] Fig.19 This is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the first embodiment.

[0031] Fig. 20 This is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the first embodiment.

[0032] Fig.21 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the third embodiment.

[0033] Fig. 22 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the third embodiment.

[0034] Fig.23 It is a perspective view showing a state where holes are formed in a light-transmitting resin sheet.

[0035] Fig.24 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the third embodiment.

[0036] Fig.25 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the third embodiment.

[0037] Fig.26It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the third embodiment.

[0038] Fig. 27 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the third embodiment.

[0039] Fig.28 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the third embodiment.

[0040] Fig.29 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the third embodiment.

[0041] Fig.30 It is a plan view showing a light emitting device according to a third embodiment.

[0042] Fig.31 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the fourth embodiment.

[0043] Fig.32 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the fourth embodiment.

[0044] Fig.33 This is a perspective view showing a state where grooves are formed in a resin sheet containing a fluorescent substance.

[0045] Fig.34 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the fourth embodiment.

[0046] Fig.35 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the fourth embodiment.

[0047] Fig.36 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the fourth embodiment.

[0048] Fig.37 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the fourth embodiment.

[0049] Fig.38 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the fourth embodiment.

[0050] Fig.39 It is a cross-sectional view showing one step of the manufacturing process of the light emitting device according to the fourth embodiment.

[0051] Fig.40 It is a plan view showing a light emitting device according to a fourth embodiment.

[0052] Description of Reference Numerals

[0053] 100, 100′, 100″, 200, 300, 400 light emitting device;

[0054] 1 support body;

[0055] 2. Conductive parts;

[0056] 10, 10′ light emitting element;

[0057] 11 a first surface of the light emitting element;

[0058] 12 a second surface of the light emitting element;

[0059] 20 wavelength conversion components;

[0060] 21 a first surface of the wavelength conversion component;

[0061] 21b a peripheral region of the first surface of the wavelength conversion component;

[0062] 22 a second surface of the wavelength conversion component;

[0063] 24, 24′ wavelength conversion portion;

[0064] 24b, 24c resin containing phosphor;

[0065] 24d a resin sheet containing a phosphor;

[0066] 24e phosphor block;

[0067] 24f support body;

[0068] 26 light-transmitting part;

[0069] 26b, 26d light-transmitting member;

[0070] 26c recess;

[0071] 26e foramina;

[0072] 26f groove;

[0073] 27, 27b, 27c monolithic block;

[0074] 30 light-transmitting parts;

[0075] 31 inclined surface;

[0076] 32 joint parts;

[0077] 40, 40B light reflecting component;

[0078] 50 sealing parts;

[0079] 51 lens unit;

[0080] 52 flange portion. DETAILED DESCRIPTION

[0081] As the invention may be understood more fully by reference to the foregoing detailed description when considered in conjunction with the accompanying drawings, a more complete understanding of the invention and many of its attendant advantages will be more readily obtained.

[0082] Hereinafter, embodiments will be described with reference to the accompanying drawings, wherein like reference numerals (symbols) designate corresponding or identical elements throughout the various drawings.

[0083] A light-emitting device according to one embodiment of the present invention comprises: a support, a light-emitting element arranged on the support, a wavelength conversion component arranged on the light-emitting element and larger than the light-emitting element when viewed from above, and a light-reflecting component separated from the wavelength conversion component and the side surface of the light-emitting element and arranged on the support. In addition, the wavelength conversion component comprises: a wavelength conversion portion arranged on the upper surface of the light-emitting element, and a light-transmitting portion arranged around the wavelength conversion portion, and a light-transmitting component is provided between the side surface of the light-emitting element and the light-reflecting component, and is in contact with the side surface of the light-emitting element and a part of the light-transmitting portion of the wavelength conversion component.

[0084] According to the above-mentioned mode, a gap is formed connecting the side surface of the light emitting element and the side surface of the wavelength conversion part, and a light-transmitting member and a light-transmitting part of the wavelength conversion member are deliberately arranged in the gap, so that the light of the light emitting element directly passes through without being converted in wavelength by the wavelength conversion part, thereby reducing the chromatic unevenness generated at the periphery of the wavelength conversion part, which is a conventional problem. Since this method does not use scattering to suppress chromatic unevenness in principle, it is also possible to avoid a reduction in luminous flux. As a result, the reduction in luminous flux does not occur, and the chromatic unevenness can be improved.

[0085] In the light-emitting device of one embodiment of the present invention, the light-transmitting component preferably includes a light-transmitting bonding component provided between the light-emitting element and the wavelength conversion component, and a portion of the light-transmitting bonding component extends and contacts a portion of the light-transmitting portion at a corner formed by a side surface of the light-emitting element and a main surface of the wavelength conversion component on the light-emitting element side. Since the light-transmitting component and the bonding component can be used as both, the number of components can be reduced.

[0086] In another embodiment of the light emitting device, the cross-sectional shape of the extended light-transmitting bonding member can be an inverted triangle extending in the direction of the light-transmitting portion. The inverted triangle forms an inclined surface, thereby reflecting light from the light emitting element.

[0087] In another embodiment of the light emitting device, a sealing member is further provided on the upper surface of the wavelength conversion member, the sealing member including a lens portion which is circular in plan view and semispherical in cross section, and a flange portion extending on the outer peripheral side of the lens portion.

[0088] In another embodiment of the light emitting device, the wavelength conversion unit may be cylindrical, thereby improving chromaticity non-uniformity.

[0089] In addition, in the light emitting device of another embodiment, the light transmitting portion is provided around and on an upper surface of the wavelength converting portion, and the upper surface of the wavelength converting member can be constituted by the light transmitting portion.

[0090] In addition, in the light emitting device of another embodiment, the upper surface of the wavelength conversion member may be constituted by the wavelength conversion portion and the light-transmitting portion surrounding it.

[0091] In the manufacturing method of the light-emitting device of the embodiment, the manufacturing method of the light-emitting device having a support body, a light-emitting element arranged on the support body, a wavelength conversion component arranged on the light-emitting element and larger than the light-emitting element when viewed from above, and a light-reflecting component arranged on the support body, includes: a process of preparing a wavelength conversion component having a wavelength conversion portion containing a phosphor and a light-transmitting portion arranged around the wavelength conversion portion; a process of arranging the wavelength conversion component on the light-emitting element arranged on the support body; a process of arranging a light-transmitting component on the support body in a manner covering the side surface of the light-emitting element and a part of the light-transmitting portion; and a process of arranging a light-reflecting component on the support body in a manner covering the wavelength conversion component and the side surface of the light-transmitting component.

[0092] In addition, in the manufacturing method of the light-emitting device of other embodiments, the process of forming a bonding component for bonding the wavelength conversion component to the light-emitting element may be included, by extending a portion of the light-transmitting adhesive between the wavelength conversion component and the light-emitting element arranged on the support body in a manner that covers the side surface of the light-emitting element and a portion of the light-transmitting portion. By combining the process of bonding the wavelength conversion component to the light-emitting element and the process of arranging the light-transmitting component, the number of processes in the manufacturing process of the light-emitting device can be reduced.

[0093] In addition, in the manufacturing method of the light emitting device of other embodiments, the step of preparing the wavelength conversion component may include: preparing a light-transmitting component having a recessed portion; and filling the recessed portion with a material containing a phosphor to form a wavelength conversion component having a wavelength conversion portion containing the phosphor and a light-transmitting portion disposed around the wavelength conversion portion. Thus, a wavelength conversion component having a light-transmitting portion and a wavelength conversion portion can be easily formed.

[0094] In addition, in other embodiments of the manufacturing method of the light-emitting device, the process of preparing the translucent component is a process of preparing a translucent component having a plurality of recesses formed therein, the process of preparing the wavelength conversion component is a process of forming a plurality of wavelength conversion components by singulating the translucent component in a manner including a wavelength conversion portion containing the phosphor and the translucent portion, and the process of forming the bonding component is a process of respectively bonding the plurality of wavelength conversion components to a plurality of light-emitting elements arranged on the support body.

[0095] In addition, in other embodiments of the manufacturing method of the light-emitting device, the process of preparing the wavelength conversion component includes: a process of preparing a translucent component; a process of forming a hole portion in the translucent component; a process of filling the hole portion with a material containing a phosphor to form a wavelength conversion component having a wavelength conversion portion containing the phosphor and a translucent portion arranged around the wavelength conversion portion.

[0096] In addition, in other embodiments of the manufacturing method of the light-emitting device, the process of preparing the wavelength conversion component includes: the process of preparing a resin plate containing a phosphor; the process of forming a groove in the resin plate containing the phosphor; and the process of disposing a translucent resin material in the groove to form a wavelength conversion component having a wavelength conversion portion containing the phosphor and a translucent portion arranged around the wavelength conversion portion.

[0097] Below, based on the accompanying drawings, the embodiments and examples of the present invention are described. However, the embodiments and examples shown below are only examples for making the technical idea of ​​the present invention concrete, and the present invention is not limited thereto. In addition, the size and positional relationship of the components shown in each figure may be exaggerated for the purpose of clearly explaining. In addition, in the following description, the same name and symbol represent the same or the same nature of the components, and the detailed description is appropriately omitted. In addition, the parts of the same symbols represented in multiple figures represent the same or equivalent parts or components. In addition, the elements constituting the embodiments and examples of the present invention can be a mode in which the same components constitute multiple elements and one component is used as multiple elements, or vice versa, the functions of a component can be shared by multiple components. In addition, the contents described in a part of the embodiments and embodiments can sometimes also be used in other embodiments, embodiments, etc. In addition, in the following description, although the terms indicating the specified direction and position (for example, "up", "down", "right", "left", and other terms including the above terms) are used as needed, the use of the above terms is to facilitate the understanding of the invention with reference to the accompanying drawings, and the meaning of the above terms is not used to limit the technical scope of the present invention. In addition, the term “comprising” as used in this specification refers to a member that is provided as another component, and also includes any member in an assembly that is configured as an integral component.

[0098] [First embodiment]

[0099] Figure 1 to Figure 7 1 shows a light emitting device 100 according to a first embodiment of the present invention. Figure 1 A perspective view showing a light emitting device 100 according to a first embodiment of the present invention, Figure 2 A top view of a light emitting device 100 according to a first real-time mode of the present invention is shown, Figure 3 express Figure 2 A top perspective view of the light emitting device 100 , Figure 4 express Figure 1 Exploded stereogram of Figure 5 Indicates viewing from below Figure 1 Exploded stereogram of Figure 6 express Figure 2 A cross-sectional view of the light emitting device 100 taken along line VI-VI, Figure 7 Indicated in Figure 6The light emitting device 100 shown in the above figure comprises: a support 1, a light emitting element 10 arranged on the support 1, a wavelength conversion component 20 arranged on the upper surface of the light emitting element 10, and a light reflecting component 40 separated from the wavelength conversion component 20 and the side of the light emitting element 10 and arranged on the support 1. A sealing component 50 is provided on the upper surface of the wavelength conversion component 20. The sealing component 50 comprises: a lens portion 51 which is circular in plan view and semispherical in cross section, and a flange portion 52 extending on the outer peripheral side of the lens portion 51. Figure 1 to Figure 3 As shown, the lens portion 51 is circular in plan view. Figures 4 to 6 As shown in FIG. 1 , the cross section is semispherical. In addition, the flange portion 52 is extended on the outer peripheral side of the lens portion 51 .

[0100] like Figure 3 As shown in FIG. 1 , the wavelength conversion member 20 is formed larger than the light emitting element 10 in a plan view. Figure 6 As shown in the cross-sectional view of , the wavelength conversion component 20 includes: a wavelength conversion portion 24 disposed on the upper surface of the light emitting element 10, and a light-transmitting portion 26 provided around the wavelength conversion portion 24. In addition, a light-transmitting component 30 is provided between the side surface of the light emitting element 10 and the light-reflecting component 40, and is in contact with the side surface of the light emitting element 10 and a portion of the light-transmitting portion 26 of the wavelength conversion component 20.

[0101] With the above structure, a gap is formed connecting the side of the light emitting element 10 and the side of the wavelength conversion part 24, and the light-transmitting member 30 and the light-transmitting part 26 of the wavelength conversion part 20 are deliberately arranged in the gap, so that the light of the light emitting element 10 directly passes through without being converted in wavelength by the wavelength conversion part 24, so that the chromatic unevenness generated at the periphery of the wavelength conversion part 24, which is a conventional problem, can be reduced. In principle, this method does not use scattering to suppress chromatic unevenness, so it is also possible to avoid a decrease in luminous flux. As a result, the decrease in luminous flux does not occur, and the chromatic unevenness can be improved.

[0102] (Light-transmitting member 30)

[0103] The light-transmitting component 30 may include a light-transmitting bonding component 32 disposed between the light-emitting element 10 and the wavelength conversion component 20. The light-transmitting bonding component 32 may be an adhesive material for bonding the light-emitting element 10 to the wavelength conversion component 20. The light-transmitting bonding component 32 may also extend partly to a corner formed by a side surface of the light-emitting element 10 and a main surface of the wavelength conversion component 20 on the light-emitting element 10 side. Figure 6 As shown, the cross-sectional shape of the extended light-transmitting bonding member 32 may be an inverted triangle extending in the direction of the light-transmitting portion 26 .

[0104] In addition, Figure 4 , Figure 5 Although the components are shown as exploded perspective views for convenience, they are not necessarily limited to the combination of disassembled parts, and may be formed by hardening a pre-softened material according to the manufacturing method. That is, the components do not need to be able to be disassembled into each of the illustrated parts.

[0105] (Uneven light distribution and color)

[0106] Generally, when an attempt is made to increase the luminous flux of a light-emitting device, the unevenness of the light distribution chromaticity tends to worsen. For example, a blue LED is used as a light-emitting element, and a plate containing a YAG phosphor that emits yellow light when excited by blue light is used as a wavelength conversion component. A plate containing a YAG phosphor with a larger area than the blue LED is placed on the upper surface of the blue LED. In addition, the side of the plate containing the YAG phosphor is covered by a light reflecting component. With this structure, the blue light emitted by the blue LED and the yellow light converted by the wavelength conversion component can be mixed to emit a white mixed light. In the above structure, when the luminous flux of the blue LED is increased, a phenomenon occurs in which the yellow color is more visible as it approaches the periphery compared to the center of the wavelength conversion component, i.e., the so-called yellow ring. The reason for this is the difference in optical path length. Near the center of the wavelength conversion component, the blue light component is relatively increased because the optical path length is shorter. On the other hand, near the periphery of the wavelength conversion component, the optical path length increases, and the yellow light component is relatively increased. The more the output of the light-emitting element is increased, i.e., the larger the luminous flux, the more obvious the above-mentioned unevenness of the light distribution chromaticity is. Although it is possible to suppress uneven light distribution and chromaticity when the luminous flux is reduced, since the output is reduced, conventionally, adjustments have been made with the consideration of a trade-off.

[0107] In contrast, in the light emitting device 100 of the present embodiment, light leakage from the light emitting element 10 is intentionally caused at the periphery of the wavelength conversion member 20, thereby suppressing the wavelength conversion light (in the example of the drawing, the yellow light component) performed by the wavelength conversion member 20 due to the difference in optical path length, thereby avoiding a situation where chromaticity non-uniformity is noticeable even when the luminous flux is increased. Specifically, Figure 7 As shown, on the side of the light emitting element 10, there is a path for the light emitted by the light emitting element 10 to be emitted to the outside through the light-transmitting portion 26, rather than passing through the wavelength conversion portion 24 within the wavelength conversion component 20. As a result, the component of the light that has not undergone wavelength conversion at the outer edge of the wavelength conversion portion 24 is relatively increased, thereby reducing the chromaticity unevenness generated in the structure of the comparative example.

[0108] Here, Figure 8 The simulation results showing the non-uniformity of the light distribution chromaticity of the light emitting device 800 of the comparative example are shown. Fig. 9 2 shows the simulation results of the light distribution chromaticity non-uniformity of the light emitting device 100 according to the first embodiment. Figure 8As shown in FIG. 8 , in the light emitting device 800 of the comparative example, it can be confirmed that the yellow component is enhanced in the periphery and the chromaticity is uneven. Fig. 9 As shown, it can be confirmed that in the light emitting device 100 of the first embodiment, the chromaticity unevenness in the periphery is suppressed.

[0109] In addition, as described above, the wavelength conversion part 24 is larger than the light emitting element 10 in a plan view, and the light emitting element 10 and the wavelength conversion part 24 are bonded in a state where they overlap, so that the light emitting element 10 is not exposed. In other words, by preventing the light emitting element 10 from being exposed from the wavelength conversion part 24 in a plan view, it is avoided that the light emitted by the light emitting element 10 is directly emitted without being reflected, and the chromaticity unevenness caused by the above-mentioned direct emission of light is suppressed. That is, the light emitted by the light emitting element 10 is not directly output to the outside, but is as follows Figure 7 In principle, the indirect light reflected by the light reflecting member 40 is emitted, thereby avoiding the occurrence of chromatic unevenness such as visually observing blue light around the wavelength conversion unit 24. However, in the case where the chromatic unevenness is obvious due to the output of the light emitting element and the thickness of the wavelength conversion unit, the wavelength conversion unit may be configured to be smaller than the light emitting element in a plan view, so that the light from the light emitting element is directly emitted to the outside. The above example is shown as a light emitting device 100' as a modified example. Fig.10 In this case, it is not necessary to form a light-transmitting member that allows the light from the light-emitting element 10' to be emitted through a path other than the wavelength conversion portion 24'. Fig.10 In the present invention, the same reference numerals are used for the same components as those in the first embodiment, and detailed description thereof is omitted.

[0110] (Supporting body 1)

[0111] The support 1 is a component for mounting the light emitting element 10 and the sealing component 50 etc. on the upper surface. The support 1 has an insulating base material and a conductive component 2 such as a wiring pattern for mounting the light emitting element 10 on the surface of the base material. Examples of the insulating base material constituting the support 1 include ceramics, resins (including resins containing a reinforcing agent such as glass epoxy resin) and the like. Examples of ceramic substrates include alumina and aluminum nitride and the like. Examples of resins include thermosetting resins such as epoxy resins, silicone resins, BT resins, and polyimide resins, and thermoplastic resins such as polyphthalamide resins and nylon resins. In addition, the base material may be a single-layer structure or a laminated structure. Figure 6In the examples of , aluminum nitride is laminated. Generally, since aluminum nitride has higher heat dissipation than resin, the heat dissipation of the light-emitting device can be improved by using aluminum nitride in the base material. In addition, the base material may also contain colorants, fillers, reinforcing agents, etc. that are well known in the field. In particular, the colorant is preferably a material with good reflectivity, preferably white materials such as titanium dioxide and zinc oxide. As fillers, silicon dioxide, aluminum oxide, etc. can be exemplified. As reinforcing agents, glass, calcium silicate, potassium titanate, etc. can be exemplified.

[0112] Furthermore, conductive members 2 are formed on the upper and lower surfaces of the support 1 as required. The conductive members 2 form wiring patterns, and the light emitting elements 10 are mounted on the wiring patterns. Figure 6 In the example of FIG. 1 , a pair of conductive members 2 are provided on the back side of the support 1. The electrodes formed on the light emitting element 10 are connected to the conductive members 2 of the support 1 via connection members such as bumps by flip chip connection or the like. Figure 6 In the examples of FIG. 1 and FIG. 2 , the light emitting element 10 is flip-chip mounted on the support 1 . However, the present invention is not limited to this structure, and the light emitting element 10 may be mounted by wire bonding, for example.

[0113] (Light emitting element 10)

[0114] The light emitting element 10 has a mounting surface on which an electrode is formed, that is, a first surface 11 of the light emitting element ( Figure 6 , and a light-emitting surface located on the opposite side of the first surface 11 of the light-emitting element, that is, a second surface 12 of the light-emitting element (in Figure 6 The middle is the upper surface).

[0115] As the light emitting element 10, for example, a nitride-based semiconductor (In X Al Y Ga 1-X-Y A semiconductor light emitting element in which N, X and Y satisfy 0≤X, 0≤Y, X+Y≤1) can obtain a stable light emitting device that is efficient, has high linearity of output relative to input, and is resistant to mechanical shock.

[0116] In addition, Figure 4 , Figure 5 In the examples shown in FIG. 1 , the light emitting element 10 is rectangular in plan view. However, the shape of the light emitting element 10 of the present invention is not limited to this structure, and may be a polygonal shape such as a hexagon or an octagon, or a circle, an ellipse, etc., in addition to a square or a rectangle.

[0117] (Wavelength conversion component 20)

[0118] Figure 6The wavelength conversion component 20 shown in the figure includes a wavelength conversion part 24 and a light-transmitting part 26. The wavelength conversion component 20 is arranged on the upper surface of the light-emitting element 10, and converts the wavelength of the light emitted from the second surface 12 of the light-emitting element 10 into a different wavelength. For example, when the light-emitting element 10 emits blue light, the blue wavelength is converted into yellow, and white light is obtained by mixing the blue light and the yellow light. The wavelength conversion component 20 has a first surface 21 (at Figure 6 is the lower surface), and a second surface 22 on the opposite side of the first surface 21 ( Figure 6 The upper surface is the upper surface in the middle). The area of ​​the first surface 21 of the wavelength conversion component 20 is made larger than the second surface 12 of the light-emitting element. As a result, the second surface 12 of the light-emitting element, that is, the entire light-emitting surface of the light-emitting element 10, can be covered by the wavelength conversion component 20. In other words, since a part of the light-emitting surface of the light-emitting element 10 is not covered by the wavelength conversion component 20, the chromatic unevenness caused by the light (for example, blue light) emitted by the light-emitting element 10 not being mixed and emitted to the outside can be suppressed. Figure 3 In the example shown in the top perspective view of , a rectangular wavelength conversion member 20 which is slightly larger than the rectangular light emitting element 10 is used.

[0119] In the wavelength conversion member 20, a resin plate containing phosphor can be used as the wavelength conversion part 24. The phosphor can be evenly dispersed in the resin or dispersed in one direction. The phosphor is excited by the light emitted by the light emitting element 10 and emits fluorescence with a wavelength longer than that of the light emitted by the light emitting element 10.

[0120] However, the wavelength conversion component is not limited to this structure, and a glass plate with light transmittance and a wavelength conversion part containing a phosphor on one side may be used. The wavelength conversion part containing the phosphor preferably has a uniform thickness on the glass plate. For example, the phosphor is printed on the glass plate. In this way, the thickness of the phosphor is roughly uniform, the optical path length of the light passing through the phosphor is constant, and the generation of chromatic unevenness and yellow rings can be suppressed. In addition, it is not limited to printing, and a phosphor sheet that forms a sheet of the phosphor may be pasted on the glass plate. As the glass, for example, it can be selected from borosilicate glass and quartz glass.

[0121] The thickness of the wavelength conversion part containing the phosphor in the wavelength conversion part 20 is preferably 20 μm or more and 500 μm or less. When the thickness of the wavelength conversion part 20 is thicker than 500 μm, the heat dissipation tends to decrease. Although it is preferred that the wavelength conversion part 20 is as thin as possible from the perspective of heat dissipation, when it is thinner than 20 μm, the chromaticity range of the obtained light emission tends to decrease.

[0122] The wavelength conversion part containing the phosphor in the wavelength conversion member 20 may be a single layer or a multilayer. In the case where the wavelength conversion layer of the phosphor or the like is composed of multiple layers, it is preferred that the first wavelength conversion layer containing the red phosphor is located on the second surface 12 of the light emitting element 10, and the second wavelength conversion layer containing the yellow phosphor is located on the first wavelength conversion layer. In this way, the light output efficiency of the light emitting device can be improved.

[0123] (Phosphor)

[0124] The phosphor can be a phosphor that can be excited by light from the light emitting element 10. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, there can be exemplified cerium-activated yttrium / aluminum / garnet-based phosphors, cerium-activated lutetium / aluminum / garnet-based phosphors, europium-activated silicate-based phosphors, β-sialon phosphors, nitride-based phosphors, manganese-activated fluoride-based phosphors, sulfide-based phosphors, quantum dot phosphors, etc. By combining the above-mentioned phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (e.g., white-based light emitting devices) can be manufactured.

[0125] (Jointing member 32)

[0126] The joining component 32 is disposed between the light emitting element 10 and the wavelength conversion component 20, and is a component for joining the light emitting element and the wavelength conversion component. The joining component 32 can be made of a resin having light transmittance. In particular, the joining component 32 makes the transmittance of light from the light emitting element 10 higher than that of the light reflecting component 40. In addition, the joining component 32 can be made of a resin capable of joining the first surface 21 of the wavelength conversion component 20 to the second surface 12 of the light emitting element, such as a dimethyl resin, a phenyl resin, a diphenyl resin, etc.

[0127] (Inclined surface 31)

[0128] In addition, a portion of the unhardened bonding member 32 overflows from the bonding interface between the first surface 21 of the wavelength conversion member 20 and the second surface 12 of the light-emitting element to the side surface of the light-emitting element 10. That is, the bonding member 32 is formed continuously from the bonding interface between the first surface 21 of the wavelength conversion member 20 and the second surface 12 of the light-emitting element and the side surface of the light-emitting element 10, and extends from the peripheral area 21b of the first surface 21 of the wavelength conversion member 20 to the first surface 11 of the light-emitting element, as shown in FIG. Figure 6 As shown in the cross-sectional view of FIG. 1 , an inclined surface 31 is formed between the first surface 21 of the wavelength conversion component 20 and the first surface 11 of the light emitting element.

[0129] Here, the peripheral region 21b of the first surface 21 of the wavelength conversion member 20 refers to the surrounding portion within the first surface 21 of the wavelength conversion member 20 that is opposite to the second surface 12 of the light-emitting element. Since the wavelength conversion member 20 is formed to be larger than the light-emitting element 10, a peripheral region 21b that does not overlap with the second surface 12 of the light-emitting element in a plan view is formed at the periphery of the first surface 21 of the wavelength conversion member 20. As a result, for example, in the manufacturing process of the light-emitting device, when the light-emitting element 10 and the wavelength conversion member 20 are bonded by the unhardened bonding member 32, the unhardened bonding member 32 overflowing from the bonding interface between the first surface 21 of the wavelength conversion member 20 and the second surface 12 of the light-emitting element is pushed toward the peripheral region 21b of the first surface 21 of the wavelength conversion member 20, and then descends along the side surface of the light-emitting element 10, forming an inclined surface 31 that is inclined from the first surface 21 of the wavelength conversion member 20 to the first surface 11 of the light-emitting element.

[0130] (Light reflecting member 40)

[0131] The light reflecting member 40 is a member for covering the joint member 32 and the wavelength conversion member 20. Among the resin materials constituting the light reflecting member 40, it is suitable to use a light-transmitting resin such as silicone resin, dimethyl silicone resin, phenyl silicone resin, epoxy resin, phenolic resin, etc. In addition, the light reflecting member 40 is preferably a light-reflecting resin that can improve the reflectivity because it effectively reflects the light emitted by the light emitting element 10. For example, the light-transmitting resin can use a resin in which a light-reflecting substance is dispersed. As the light-reflecting substance, titanium dioxide, silicon dioxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, and mullite are suitable. Although the light-reflecting substance can be used in a granular, fibrous, thin plate, etc., it is particularly preferred because the fibrous light-reflecting substance can also be expected to reduce the thermal expansion coefficient of the light reflecting member. The light reflecting member 40 has a reflectivity of 70% or more relative to the light from the light emitting element 10. As a result, the light reaching the light reflecting member 40 is reflected toward the second surface 22 of the wavelength conversion member 20, thereby improving the light output efficiency of the light emitting device.

[0132] The light reflecting component 40 is preferably connected to the side surface in a manner covering the side surface of the wavelength conversion component 20. In this way, a light emitting device having a high contrast between the light emitting area and the non-light emitting area can be obtained. In addition, the light reflecting component 40 is preferably located between the first surface 11 of the light emitting element and the support body 1. In this way, it is possible to prevent the light from the light emitting element 10 from being reflected by the light reflecting component 40 located between the first surface 11 of the light emitting element and the support body and being absorbed by the support body. The light reflecting component 40 is preferably inclined from the outer edge of the wavelength conversion component 20 to the outer edge of the light emitting element, and the thickness of the light reflecting component 40 is reduced at the outer edge of the light emitting element. In this way, when the light emitting device has a sealing component 50 covering the wavelength conversion component 20 and the light reflecting component 40, the position of the lower surface of the sealing component 50 at the outer edge of the light emitting device can be lowered, so that the light emitting device can be made thinner.

[0133] The upper surface of the light reflecting member 40 is preferably higher than the upper surface of the wavelength converting member 20 . Thus, the wavelength-converted light and the light emitted by the light emitting element 10 can be effectively captured and reflected by the inner surface of the wavelength converting member 20 .

[0134] (Sealing member 50)

[0135] like Figure 2 , Figure 6 As shown in the figures, the sealing component 50 is arranged on the upper surface of the wavelength conversion component 20. The sealing component 50 has: a lens portion 51 which is circular in plan view and semispherical in cross section, and a flange portion 52 extending on the outer peripheral side of the lens portion 51. In addition, the sealing component 50 can utilize a sealing component with light transmission. The sealing component 50 can use a light-transmitting resin, glass, etc. In particular, a light-transmitting resin is preferred, and a thermosetting resin such as silicone resin, epoxy resin, phenolic resin, a thermoplastic resin such as polycarbonate resin, acrylic resin, etc. can be used. Silicone resin with good light resistance and heat resistance is particularly suitable. In addition, the sealing component 50 can also contain various fillers for the purpose of adjusting viscosity, etc.

[0136] However, the sealing component is not a necessary component, such as Fig.11 As shown in other modified examples, the light emitting device 400 may not include a sealing member. For example, the light emitting device 400 may be suitably used in applications that do not require light to be focused by a lens unit.

[0137] In addition, the light emitting device 100 may also have a protection element for protecting the light emitting element 10 from overcurrent damage. The protection element may be embedded in the light reflecting member 40. As the above-mentioned protection element, for example, a Zener diode and a capacitor may be used. When it is a single-sided electrode protection element, it is preferred because it can be wirelessly and face-down mounted.

[0138] [Second embodiment]

[0139] In the first embodiment described above, the light reflecting member 40 is formed as follows. Figure 4 The example of making the inner surface of the frame into a flat wall shape is shown in FIG. Figure 6 As shown in the cross-sectional view of FIG, the light reflecting member 40 is formed into an inclined surface below the inner surface. However, the present invention is not limited to the above-mentioned method. For example, in addition to being formed into a straight line or a broken line in the cross section, it can also be formed into a curved surface. Taking the above example as the light emitting device 200 of the second embodiment, Figure 12 to Figure 14 In the above-mentioned figures, Fig.12 is an exploded perspective view showing a light emitting device 200 according to a second embodiment. Fig.13 It means that Fig.12 An exploded perspective view of the light emitting device 200 after further decomposition, Fig.14 2 is a cross-sectional view showing a light emitting device 200 according to the second embodiment. In the light emitting device 200 shown in the above figure, the light reflecting member 40B is formed into a dome shape that is convex downward. Fig.14 As shown in the cross-sectional view of FIG. 4 , by using the inclined surface of the light reflecting member 40B, the light from the light emitting element 10 is continuously reflected, and the uneven brightness caused by the concentration of the reflected light can be suppressed. Figure 4 In the middle, a rectangular frame is formed. Fig.12 , Fig.13 With the above structure, compared with the case of a rectangular shape, it is possible to avoid the concentration of reflected light at the corners where the sides forming the rectangle meet each other, and it is also possible to suppress uneven brightness in a plan view.

[0140] In addition, Fig.14 In the example of Figure 6 In the example, the gap d1 between the end face of the light emitting element 10 and the inner surface of the light reflecting component 40 is wide, so that more light emitted by the light emitting element 10 and not converted in wavelength by the wavelength conversion unit 24 can be output to the outside through the gap d2, which can further improve the effect of suppressing uneven light distribution chromaticity.

[0141] (Light-transmitting portion 26)

[0142] The light-transmitting portion 26 is formed at least around the wavelength conversion member 20. By providing the light-transmitting portion 26 around the wavelength conversion portion 24, the light emitted by the light-emitting element 10 is not converted in wavelength by the wavelength conversion portion 24 but is transmitted through the light-transmitting portion 26. That is, the light component of the light-emitting element 10 can be relatively enhanced around the wavelength conversion portion 24. Figure 7In the example shown, when a light emitting device is considered in which a blue LED is used as the light emitting element 10 and a yellow phosphor such as YAG is used as the wavelength conversion unit 24 to obtain white light by mixing blue light and yellow light, although white light can be obtained near the center of the wavelength conversion unit 24, the optical path length of light reflected and scattered by the wavelength conversion unit 24 becomes relatively longer as it moves toward the periphery, and as a result, the yellow light component tends to be stronger than the blue light. Therefore, by outputting blue light that has not undergone wavelength conversion on the side of the wavelength conversion unit 24, the color tone can be adjusted and the above-mentioned uneven light distribution chromaticity can be suppressed.

[0143] In addition, although the light-transmitting portion 26 is preferably provided around the wavelength conversion member 20, even if there is a portion where the light-transmitting portion is not provided, it is permissible as long as the uneven light distribution chromaticity is not obvious. For example, it is possible to configure such that the light-transmitting portion is provided near the corner of a rectangular light-emitting element where uneven light distribution chromaticity is likely to occur, and the light-transmitting portion is not provided in other portions.

[0144] In addition, Figure 6 In the example of , not only the periphery of the wavelength conversion part 24 but also the upper surface is continuously covered by the light-transmitting part 26. Thus, it is possible to obtain the advantage in the manufacturing process that the light-transmitting part 26 can be easily provided around the wavelength conversion part 24. However, since the light-transmitting part 26 has the function of suppressing uneven light distribution chromaticity even if the light-transmitting part 26 is not provided on the upper surface side of the wavelength conversion part 24, the light-transmitting part on the upper surface side can also be omitted. For example, after the wavelength conversion part is formed, the light-transmitting part on the upper surface side can be eliminated by polishing or the like. As a light-emitting device that makes the above example a third embodiment, it is shown in Fig.15 In particular, by exposing the upper surface of the wavelength conversion section 24 from the light-transmitting section 26 and covering the upper surface with the sealing member 50 , the surface of the wavelength conversion section 24 can be further protected by the sealing member 50 .

[0145] The light-transmitting portion 26 constituting the wavelength conversion member 20 may be used in common with the sealing member 50. Figure 6 As shown in the cross-sectional view of , although the light-transmitting member 30 is embedded between the side surface of the light-emitting element 10 and the inclined surface of the light-reflecting member 40, the present invention is not limited to this structure. Fig.14 As shown in the cross-sectional view of FIG, the light-transmitting member 30 is formed into an inverted triangle shape from the side of the light-emitting element 10 to the back side of the wavelength conversion portion 24, and the light-transmitting portion 26 is further extended on the side of the light-transmitting member 30. Fig.14 , the region of the light-transmitting portion 26 is shown to be integrated with the sealing member 50. In this structure, the boundary surface between the light-transmitting member 30 and the light-transmitting portion 26 is Figure 6 Compared with the horizontal plane in the example shown in the cross-sectional view, Fig.14 In the example of FIG. 1 , the wavelength conversion part 24 is inclined so as to enter obliquely from the lower end of the wavelength conversion part 24, so that the bonding strength of the light-transmitting part 26 can be improved. In addition, the gap d2 between the wavelength conversion part 24 and the light-reflecting member 40B is not necessarily filled with the light-transmitting part 26, etc., and a part or all of it can be hollow. Thus, the luminous flux of the light-emitting device can be improved.

[0146] (Method for Manufacturing Light Emitting Device 100 According to First Embodiment)

[0147] Next, based on Figures 16 to 20 , a method for manufacturing the light emitting device 100 according to the first embodiment is described. First, a wavelength conversion member 20 having a wavelength conversion portion 24 containing a phosphor and a light-transmitting portion 26 disposed around the wavelength conversion portion 24 is prepared. Fig.16 As shown in the figure, a light-transmitting member 26b is prepared by separating a plurality of recesses 26c. The light-transmitting member 26b is a member constituting the light-transmitting portion 26, and can be made of a resin sheet having light-transmittance, such as a silicone resin sheet. In addition, the light-transmitting member 26b is not limited to a resin sheet, and a glass sheet or the like can also be used. On the other hand, the recesses 26c are circular, elliptical, or rectangular in a plan view.

[0148] Then, if Fig.17 As shown in FIG. 1 , each concave portion 26 c is filled with a resin 24 b mixed with a fluorescent substance constituting the wavelength conversion portion 24. Fig.18 As shown, the silicone resin sheet is separated into individual pieces and cut into blocks. Thus, the individual pieces 27 of the wavelength conversion member 20 are obtained.

[0149] Next, the wavelength conversion member 20 is disposed on the light emitting element 10 disposed on the previously prepared support 1. The light emitting element 10 is flip-chip mounted on the support 1. In addition, the light emitting element 10 is formed smaller than the wavelength conversion member 20 in a plan view. Fig.19As shown, a wavelength conversion component 20 is placed on the upper surface of the support body 1 so that the monolithic block 27 is turned over and becomes a posture in which the phosphor, that is, the wavelength conversion part 24 faces the lower surface side. In this state, a translucent component 30 is arranged on the support body 1 to cover the side of the light-emitting element 10 and a part of the translucent part 26. In order to realize the above structure, a translucent adhesive material is applied to the boundary surface between the upper surface of the light-emitting element 10 and the wavelength conversion part 24. Then, when the wavelength conversion part 24 is placed on the upper surface of the light-emitting element 10, the exposed adhesive material extends from the side of the light-emitting element 10 to the periphery of the wavelength conversion component 20 and adheres, and hardens to form a fillet shape. The translucent adhesive material can use the same material as the sealing component 50, for example, silicone resin and epoxy resin are suitable. In addition, in addition to forming the translucent component 30 with the exposed adhesive material, a translucent component can also be added between the side of the light-emitting element 10 and the light reflecting component 40.

[0150] Furthermore, a light reflecting member 40 is disposed on the support body 1. Fig. 20 As shown, a white resin is formed around the upper surface of the support 1 so as to cover the side surfaces of the wavelength conversion member 20 and the light-transmitting member 30 .

[0151] Finally, a sealing member 50 is provided on the upper surfaces of the wavelength conversion member 20 and the light reflection member 40. Figure 6 The light emitting device 100 is shown in a cross-sectional view.

[0152] (Method for Manufacturing Light Emitting Device 300 According to Third Embodiment)

[0153] Next, based on Figure 21 to Figure 30 An example of a method for manufacturing the light emitting device 300 according to the third embodiment is described below. Fig.21 As shown in FIG. 2 , a light-transmitting member 26d is prepared. The light-transmitting member 26d is the same as the light-transmitting member 26b described above, and is a member constituting the light-transmitting portion 26. A light-transmitting resin sheet, such as a silicone resin sheet, can be used.

[0154] Then, if Fig. 22 As shown in FIG. 1 , a hole 26e is formed in the light-transmitting member 26d. The hole 26e is of a predetermined size and is formed at a predetermined interval in the sheet-like light-transmitting member 26d. The shape of the hole 26e can be selected from a circular shape, an elliptical shape, a rectangular shape, a polygonal shape, etc. Here, as shown in FIG. Fig.23 As shown in the perspective view of , the hole 26e is formed into a circular shape. The hole 26e can be formed by, for example, punching or the like.

[0155] In addition, if Fig.24As shown, the wavelength conversion unit 24 is arranged in the hole 26e of the light-transmitting member 26d. Here, the resin 24c containing the fluorescent material constituting the wavelength conversion unit 24 is filled in the hole 26e and hardened. Here, the method of arranging the resin 24c containing the fluorescent material can be selected from the method of coating by printing, pouring and spraying.

[0156] Then, after the resin 24c containing the fluorescent substance is hardened, Fig.25 As shown in FIG. 1 , the light-transmitting member 26d is cut into pieces of a predetermined size. The pieces can be cut into pieces by cutting or the like. The cut-out and pieced-in pieces 27b can be in any shape such as a rectangular shape or a polygonal shape. Fig.26 As shown in the three-dimensional view of FIG. 2 , the monolithic block 27 b is a square block. In addition, each monolithic block 27 b is cut in such a manner that each includes the resin 24 c containing the phosphor. Here, although one monolithic block 27 b is cut in such a manner that it includes one resin 24 c containing the phosphor, the monolithic block may be formed in such a manner that one monolithic block includes a plurality of resins 24 c containing the phosphor. The monolithic block 27 b thus obtained constitutes a wavelength conversion component 20 in which a light-transmitting portion 26 is arranged around the wavelength conversion portion 24.

[0157] Next, the monolithic block 27b is bonded to the light emitting element 10. Fig. 27 As shown, the light-emitting element 10 is pre-mounted on the support 1. In this example, the light-emitting element 10 is flip-chip mounted on the support 1. The light-emitting element 10 is also preferably formed to be smaller than the wavelength conversion component 20 in a plan view. The monolithic block 27b is bonded to the upper surface of the support 1 using a light-transmitting adhesive material. The light-transmitting adhesive material is applied to either or both surfaces of the bonding boundary surface, i.e., the upper surface of the light-emitting element 10 and the lower surface of the monolithic block 27b. When the monolithic block 27b is placed on the upper surface of the light-emitting element 10, the adhesive material is exposed from the bonding boundary surface of the light-emitting element 10 and spreads to the surroundings, extending from the side of the light-emitting element 10 to the periphery of the lower surface of the monolithic block 27b, as shown in FIG. Fig. 27 The light-transmitting adhesive material is cured to form the light-transmitting member 30. As described above, the light-transmitting adhesive material can be the same material as the sealing member 50, for example, silicone resin, epoxy resin, etc. are suitable.

[0158] Furthermore, a light reflecting member 40 is disposed on the support body 1. Fig.28 As shown, a white resin containing a diffusion material is placed on the upper surface of the support 1 so as to cover the side surfaces of the wavelength conversion member 20 and the light-transmitting member 30 , and is cured to form the light-reflecting member 40 .

[0159] Finally, if Fig.29As shown in FIG. 1 , a sealing member 50 is provided on the upper surface of the wavelength conversion member 20 and the light reflection member 40. Thus, Fig.30 A light emitting device 300 is shown in a top view.

[0160] (Method for Manufacturing Light Emitting Device 400 According to Fourth Embodiment)

[0161] In the above method, a process is adopted in which a light-transmitting resin sheet corresponding to the light-transmitting portion 26 is prepared first, a hole is formed, and a resin 24c containing a phosphor corresponding to the wavelength conversion portion 24 is filled. However, the present invention is not limited to this process of the method for manufacturing a light-emitting device, and a light-transmitting portion may be arranged around the wavelength conversion portion after the wavelength conversion portion is prepared first. Figures 31 to 40 , a method for manufacturing a light emitting device 400 as a fourth embodiment of the light emitting device is described. First, Fig.31 As shown in FIG. 2 , a phosphor-containing resin sheet 24d is prepared. As the resin sheet 24d, for example, a silicone resin sheet in which phosphor is dispersed is prepared.

[0162] Then, if Fig.32 As shown, grooves 26f are formed in the phosphor-containing resin sheet 24d. In this example, the grooves 26f are formed in a state where the phosphor-containing resin sheet 24d is arranged on the support 24f. The grooves 26f divide the phosphor-containing resin sheet 24d in a predetermined pattern. Fig.33 In the example shown in the stereoscopic view of FIG, grooves 26f are formed in a grid pattern on a silicon sheet for dispersing phosphors, and the phosphor blocks 24e are divided into rectangular shapes. The grooves 26f can be formed by cutting, for example. In addition, in order to hold the divided phosphor blocks 24e, in addition to placing the resin sheet 24d on the support 24f, it is also preferable to place them on a jig or a sheet as a substrate.

[0163] Then, if Fig.34 As shown in FIG. 2 , a light-transmitting portion 26 is formed around the fluorescent body block 24e. For example, a light-transmitting silicone resin is poured into the groove portion 26f. The light-transmitting silicone resin is cured, thereby forming the light-transmitting portion 26 around the fluorescent body block 24e.

[0164] Furthermore, Fig.35 As shown in FIG. 2 , the resin sheet 24d having the light-transmitting portion 26 formed thereon is singulated into a predetermined size. The singulated block 27c may be in any shape such as a rectangular shape or a polygonal shape. Fig.36As shown in the three-dimensional diagram of FIG. 2 , the monolithic block 27c is a square-shaped monolithic block 27c. In addition, each monolithic block 27c is cut so as to contain a phosphor block 24e. Here, although one monolithic block 27c is cut to include one phosphor block 24e, as described above, a monolithic block may be formed so that one monolithic block includes a plurality of phosphor blocks. The monolithic block 27c thus obtained constitutes a wavelength conversion component 20 in which a light-transmitting portion 26 is arranged around the wavelength conversion portion 24.

[0165] Next, the monolithic block 27c is similarly bonded to the light emitting element 10. Fig.37 As shown, the light emitting element 10 is mounted on the support 1 in advance. The monolithic block 27c is bonded to the upper surface of the support 1 using a light-transmitting adhesive material. The light-transmitting adhesive material is exposed from the bonding boundary surface of the light emitting element 10, spreads to the periphery, extends from the side surface of the light emitting element 10 to the lower surface periphery of the monolithic block 27c, forms a rounded shape, and is hardened to form a light-transmitting member 30.

[0166] Furthermore, Fig.38 As shown, a light reflecting member 40 is disposed on the support body 1, as shown in FIG. Fig.39 As shown in FIG. 1 , a sealing member 50 is provided on the upper surface of the wavelength conversion member 20 and the light reflection member 40. Thus, Fig.40 A light emitting device 400 is shown in a top view.

[0167] The light emitting device according to the embodiment of the present invention is suitable for use in, for example, backlight sources of LED panels, liquid crystal display devices, etc., lighting light sources, headlights, signal lights, light switches, various sensors, and various indicator lights.

[0168] Although various preferred embodiments of the present invention are shown and described, the above embodiments are only illustrative and should not be considered as limiting the present invention to the disclosed specific embodiments, which should be obvious to those skilled in the art. The scope of the present invention is not represented by the above description but by the scope of the claims, and is intended to include all changes within the meaning and scope equivalent to the scope of the claims.

[0169] CROSS-REFERENCE TO RELATED APPLICATIONS

[0170] This application claims priority under 35 U.S.C. §119 based on Patent Application No. 2019-012949 filed in Japan on January 29, 2019 and Patent Application No. 2018-179935 filed in Japan on September 26, 2018, the entire contents of which are incorporated herein by reference.

Claims

1. A light emitting device, characterized in that: have: Support body; A light emitting element, which is arranged on the support body and has a first surface as a mounting surface, a second surface as a light emitting surface located on the opposite side of the first surface, and a side surface; a wavelength conversion member having a wavelength conversion portion disposed on the second surface and a light-transmitting portion disposed around the wavelength conversion portion; a light reflecting member separated from the wavelength converting portion and the side surface of the light emitting element and arranged on the supporting body; a light-transmitting member disposed in contact with the side surface of the light-emitting element and a portion of the light-transmitting portion; a sealing member disposed on an upper surface of the wavelength conversion member and having a lens portion; The wavelength conversion component is larger than the light emitting element in a plan view, A gap is formed between the side surface of the light emitting element and the light reflecting member, which is connected from the side surface of the light emitting element to the side surface of the wavelength conversion portion, and the light-transmitting member and the light-transmitting portion are arranged in the gap. A path is provided on the side of the light emitting element so that the light emitted by the light emitting element passes through the gap without wavelength conversion and is emitted to the outside through the light-transmitting member and the light-transmitting portion. The light-transmitting member includes a light-transmitting bonding member provided between the light-emitting element and the wavelength conversion member.

2. The light emitting device according to claim 1, characterized in that: The light-transmitting bonding member is provided continuously with the light-transmitting member in contact with the side surface of the light-emitting element.

3. The light emitting device according to claim 2, characterized in that: The cross-sectional shape of the light-transmitting bonding member is an inverted triangle extending in the direction of the light-transmitting portion.

4. The light emitting device according to any one of claims 1 to 3, characterized in that The lens portion is circular in plan view and semi-spherical in cross section; The sealing member includes a flange portion extending on the outer peripheral side of the lens portion.

5. The light emitting device according to any one of claims 1 to 3, characterized in that: In a plan view, the lens portion is larger than the wavelength conversion member.

6. The light emitting device according to any one of claims 1 to 3, characterized in that: The wavelength conversion part is cylindrical.

7. The light emitting device according to claim 6, characterized in that: The light-transmitting portion is in a polygonal shape.

8. The light emitting device according to any one of claims 1 to 3, characterized in that: The light-transmitting portion is disposed on the upper surface of the wavelength conversion portion, The light-transmitting portion forms an upper surface of the wavelength conversion member.

9. The light emitting device according to any one of claims 1 to 3, characterized in that: The wavelength conversion portion and the light-transmitting portion surrounding it constitute an upper surface of the wavelength conversion member.

10. A method for manufacturing a light emitting device, comprising: A step of preparing a support body on which a light-emitting element is arranged; A step of preparing a wavelength conversion member having a wavelength conversion portion containing a fluorescent substance and a light-transmitting portion provided around the wavelength conversion portion and being larger than the light-emitting element in a plan view; A step of disposing the wavelength conversion component on the light emitting element; a step of disposing a light reflecting member on the support so as to cover the side surface of the wavelength converting member; a step of providing a sealing member having a lens portion on the upper surfaces of the wavelength conversion member and the light reflection member; The step of disposing the wavelength conversion component is configured to include disposing a light-transmitting adhesive extending from the side surface of the light-emitting element to the periphery of the wavelength conversion component and covering a portion of the light-transmitting portion, so that the light-transmitting component is in contact with the side surface of the light-emitting element and a portion of the light-transmitting portion, In the step of disposing the light reflecting member, the light reflecting member covers the side surface of the light-transmitting adhesive; A gap is formed on the side of the light emitting element as a path for light emitted from the light emitting element to pass through the light-transmitting member and the light-transmitting portion and be emitted to the outside without being wavelength-converted. The light-transmitting member includes a light-transmitting bonding member provided between the light-emitting element and the wavelength conversion member.

11. The method for manufacturing a light emitting device according to claim 10, wherein: The process of preparing the wavelength conversion component comprises: a step of preparing a light-transmitting member having a recessed portion formed therein; The step of filling the concave portion with a material containing a fluorescent substance to form the wavelength conversion member, wherein the wavelength conversion member includes the wavelength conversion portion containing the fluorescent substance and the light-transmitting portion provided around the wavelength conversion portion.

12. The method for manufacturing a light emitting device according to claim 11, wherein: The step of preparing the light-transmitting member is a step of preparing a light-transmitting member having a plurality of recessed portions formed therein. The step of preparing the wavelength conversion member is a step of singulating the light-transmitting member so as to include the wavelength conversion portion containing the phosphor and the light-transmitting portion to form a plurality of wavelength conversion members. The step of arranging the wavelength conversion members is a step of bonding the plurality of wavelength conversion members to the plurality of light emitting elements arranged on the support body, respectively.

13. The method for manufacturing a light emitting device according to claim 10, wherein: The process of preparing the wavelength conversion component comprises: A process for preparing a light-transmitting component; A step of forming a hole in the light-transmitting member; The step of filling the hole with a material containing a fluorescent substance to form the wavelength conversion member, wherein the wavelength conversion member includes the wavelength conversion portion containing the fluorescent substance and the light-transmitting portion provided around the wavelength conversion portion.

14. The method for manufacturing a light emitting device according to claim 10, wherein: The process of preparing the wavelength conversion component comprises: A step of preparing a resin plate containing a fluorescent substance; A step of forming a groove in a resin plate containing the phosphor; A step of disposing a light-transmitting resin material in the groove to form the wavelength conversion member, wherein the wavelength conversion member includes the wavelength conversion portion containing the phosphor and the light-transmitting portion provided around the wavelength conversion portion.

Images