A fin-type heat dissipation device equipped with a piezoelectric vibration plate

Abstract

The present invention discloses a fin-type heat sink equipped with a piezoelectric vibrating plate. The heat sink comprises a fin-type heat sink, a vibrating plate, a piezoelectric stack, and a jacket; the fin-type heat sink is installed on the surface of the electronic device to be cooled; the vibrating plate is installed above the fin-type heat sink; the piezoelectric stack and the vibrating plate are connected by a jacket and fastening screws; the piezoelectric stack will produce periodic expansion and contraction deformation when an AC voltage is input, and this deformation movement drives the vibrating plate to vibrate laterally under the transmission action of the jacket. Under the influence of the lateral movement of the vibrating plate, the air flowing through the fins of the heat sink rotates to form a multi-longitudinal vortex flow structure, thereby enhancing the heat exchange between the high-temperature gas near the fin surface and the low-temperature fluid in the central area of ​​the flow channel between the fins, and finally achieving the purpose of enhanced heat dissipation. The present invention has a simple structure, reasonable design, and convenient maintenance, and has significant advantages such as good enhanced heat dissipation effect and real-time adjustable enhanced heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the field of forced air cooling of conventional scale electronic equipment, and in particular to a fin-type heat dissipation device equipped with a piezoelectric vibration plate. Background Art

[0002] Electronic devices generate a large amount of heat energy when running. If the heated electronic components or chips are not cooled in time, the electronic system will be damaged or its service life will be shortened. Therefore, most electronic devices usually have a radiator installed inside to cool the heated electronic components.

[0003] At present, conventional electronic devices such as notebooks and desktop computers mostly use finned heat sinks as the main heat dissipation structure, which is heat dissipated by attaching the finned heat sink to the surface of the electronic device and using forced air cooling. This method uses a large number of fins to increase the heat dissipation surface area, and uses forced air cooling to increase the convection heat transfer coefficient to remove the heat generated by the electronic device when it is working. This heat dissipation method has many advantages such as low cost and good reliability.

[0004] However, for the above heat dissipation structure, since the flow state of the gas between the fins under the conventional forced air cooling state is mostly laminar flow or transition flow, the fluid stratification phenomenon is obvious, and the heat exchange intensity between the cold and hot fluids is weak, which ultimately leads to a relatively general actual heat dissipation effect. It can be seen that as the power density of electronic equipment continues to increase, the traditional fin-type heat dissipation structure is prone to the problem of excessive temperature of electronic equipment during heat dissipation, which ultimately affects the normal operation and service life of the electronic equipment. Summary of the invention

[0005] In order to overcome the above-mentioned deficiencies and defects of the prior art, the present invention provides a fin-type heat dissipation device equipped with a piezoelectric vibration plate.

[0006] The specific technical solutions are:

[0007] A fin type heat sink equipped with a piezoelectric vibration plate comprises a fin type heat sink, a vibration plate, a piezoelectric stack and a jacket;

[0008] The fin-type heat sink is installed on the surface of the electronic device to be cooled;

[0009] The vibration plate is installed above the fin type radiator;

[0010] The piezoelectric stack is connected to the vibration plate through a jacket and fastening screws;

[0011] The piezoelectric stack will produce periodic expansion and contraction deformation when AC voltage is input. This deformation movement drives the vibrating plate to vibrate laterally under the transmission action of the jacket. Under the influence of the lateral movement of the vibrating plate, the air flowing through the radiator fins rotates to form a multi-longitudinal vortex flow structure, thereby enhancing the heat exchange between the high-temperature gas near the fin surface and the low-temperature fluid in the central area of ​​the flow channel between the fins, ultimately achieving the purpose of enhanced heat dissipation.

[0012] The fin type radiator is provided with four countersunk holes at the four corners of the upper surface, and four balls are placed in the countersunk holes. The balls can roll in the countersunk holes and the diameter of the balls is greater than the depth of the countersunk holes.

[0013] The vibration plate is placed on the ball bearing, and a boss structure is arranged on the upper surface. The jacket is installed on the boss of the vibration plate through an open square hole. The square hole and the boss surface are clearance-matched, and the jacket can slide up and down relative to the boss on the vibration plate.

[0014] The jacket has two cantilever structures.

[0015] The piezoelectric stack has a through hole at one end for mounting with the jacket, and the other end is fixedly supported on an external mounting bracket.

[0016] The fastening screw passes through the through hole on the cantilever on one side of the jacket and the through hole on the piezoelectric stack, and then is screwed into the threaded hole on the cantilever on the other side of the jacket to achieve the connection between the piezoelectric stack and the vibration plate.

[0017] The ratio of the fin height to the fin spacing of the fin type radiator is not greater than 5.

[0018] Beneficial effects of the present invention:

[0019] It has simple structure, reasonable design and convenient maintenance, and has significant advantages such as good enhanced heat dissipation effect and real-time adjustment of enhanced heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0021] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the present invention;

[0022] Figure 2 It is an exploded view of the structure of the present invention;

[0023] Figure 3 It is a top view of the overall structure of the present invention;

[0024] Figure 4 For the present invention Figure 3 Cross-sectional view and schematic diagram of flow channel vortex generation;

[0025] Explanation of the reference numerals: 1. finned heat sink; 2. vibrating plate; 3. piezoelectric stack; 4. jacket; 5. fastening screw; 6. countersunk hole; 7. ball bearing; 8. boss; 9. cantilever. DETAILED DESCRIPTION

[0026] The technical content and detailed description of the present invention will be described as follows with the accompanying drawings. However, the attached drawings are only for illustrative purposes and are not intended to limit the protection scope of the present invention.

[0027] like Figure 1 As shown, a fin-type heat sink device equipped with a piezoelectric vibration plate includes a fin-type heat sink 1, a vibration plate 2, a piezoelectric stack 3, a jacket 4 and a fastening screw 5. The fin-type heat sink 1 is installed on the surface of the electronic device to be cooled. When the electronic device is working, the heat generated will be transferred to the surface of each fin of the fin-type heat sink 1 through the phenomenon of heat conduction. The fin-type heat sink 1 is installed on the surface of the device to be cooled, and it contains a plurality of fin structures. The flow channel between the fins is the main place for convective heat exchange. The cooling airflow driven by an external fan or pump flows into the fin-type heat sink 1 from one side, so that the heat transfer process on the fin surface is changed from natural convection heat exchange to forced convection heat exchange.

[0028] like Figure 2 As shown, the four corners of the upper surface of the finned heat sink 1 are provided with countersunk holes 6, and balls 7 are placed in the countersunk holes 6. The balls 7 can roll freely in the countersunk holes 6, and the diameter of the balls 7 is greater than the depth of the countersunk holes 6. The vibration plate 2 is placed on the balls 7, and the vibration plate 2 can slide on the balls 7 under the action of external force. The upper surface of the vibration plate 2 is processed with a boss structure, and the jacket 4 is installed on the boss 8 of the vibration plate 2 through an open square hole. The square hole and the surface of the boss 8 are clearance-matched, and the jacket 4 can slide up and down relative to the boss 8 of the vibration plate 2.

[0029] like Figure 2 and Figure 3 As shown, the jacket 4 comprises two cantilevers 9, wherein a through hole is processed on one cantilever and a threaded hole is processed at a corresponding position on the other cantilever.

[0030] like Figure 2 and Figure 3 As shown, the piezoelectric stack 3 has a through hole at one end for mounting with the jacket, and the other end is fixedly supported on an external mounting bracket.

[0031] like Figure 3 As shown, the fastening screw 5 passes through the through hole on the cantilever 9 on one side of the jacket 4 and the through hole on the piezoelectric stack 3, and then is screwed into the threaded hole on the cantilever on the other side of the jacket 4 to connect the piezoelectric stack 3 with the vibration plate 2. After the connection is completed, the boss 8 is clamped, and the jacket 4 and the boss 8 cannot move relative to each other.

[0032] like Figure 4 As shown, the piezoelectric stack 3 will produce periodic expansion and contraction deformation when an AC voltage is input, and this deformation movement drives the vibrating plate 2 to vibrate laterally under the transmission action of the jacket 4. Under the influence of the lateral movement of the vibrating plate 2, the gas near the vibrating plate 2 in the flow channel between the fins will move laterally with the vibrating plate 2. When the movement direction of the vibrating plate 2 is switched, the pressure gradient direction changes, and the gas on the surface of the plate produces flow separation, forming a longitudinal vortex flow structure with a rotation direction perpendicular to the mainstream direction. The longitudinal vortex structure brings the low-temperature gas in the central area of ​​the flow channel between the fins to the vicinity of the fin surface, and then takes away the high-temperature gas on the fin surface, thereby enhancing the energy exchange between the cold and hot fluids in the flow channel between the fins, and finally achieving the purpose of enhanced heat dissipation.

[0033] like Figure 4 As shown, in order to reduce the inhibitory effect of the wall constraint effect on the generation of longitudinal vortices, the ratio of the fin height to the fin spacing of the fin type heat sink 1 should not exceed 5.

[0034] like Figure 4 As shown, in the fin-type heat dissipation device equipped with a piezoelectric vibrating plate, the working state of the piezoelectric stack 3 can be adjusted according to the actual heat dissipation demand. Specifically, when the heat dissipation demand of the electronic device is small, the AC voltage input to the piezoelectric stack 3 can be turned off to achieve energy saving; when the heat dissipation demand of the electronic device is high, the AC voltage can be input to the piezoelectric stack 6 to make the vibrating plate produce lateral vibration to achieve the effect of enhanced heat dissipation. This method is easy to adjust and responds quickly, and can be widely used in heat dissipation occasions of electronic equipment with large heat generation fluctuations.

Claims

1. A fin-type heat sink equipped with a piezoelectric vibrating plate, characterized in that: It comprises a fin-type heat sink (1), a vibration plate (2), a piezoelectric stack (3), and a jacket (4); The fin-type heat sink (1) is installed on the surface of the electronic device to be cooled; The vibration plate (2) is installed above the fin type heat sink (1); The piezoelectric stack (3) is connected to the vibration plate (2) via a jacket (4) and fastening screws (5); The piezoelectric stack (3) will produce periodic expansion and contraction deformation when an alternating current voltage is input. This deformation movement drives the vibrating plate (2) to vibrate laterally under the transmission action of the jacket (4). Under the influence of the lateral movement of the vibrating plate (2), the air flowing through the fins of the radiator rotates, forming a multi-longitudinal vortex flow structure, thereby enhancing the heat exchange between the high-temperature gas near the fin surface and the low-temperature fluid in the central area of ​​the flow channel between the fins, ultimately achieving the purpose of enhanced heat dissipation.

2. The heat dissipation device according to claim 1, characterized in that: The fin-type heat sink (1) is provided with four countersunk holes (6) at the four corners of the upper surface, and four balls (7) are placed in the countersunk holes (6). The balls (2) can roll in the countersunk holes (7) and the diameter of the balls (7) is greater than the depth of the countersunk holes (6).

3. The heat dissipation device according to claim 1, characterized in that: The vibration plate (2) is placed on the ball (2), and a boss (8) structure is arranged on the upper surface. The jacket (4) is installed on the boss (8) of the vibration plate (2) through an open square hole. The square hole and the surface of the boss (8) are clearance-matched, and the jacket (4) can slide up and down relative to the boss (8) on the vibration plate (2).

4. The heat dissipation device according to claim 1, characterized in that: The jacket (4) has two cantilever (9) structures, one cantilever is processed with a through hole, and the other cantilever is processed with a threaded hole at a corresponding position.

5. The heat dissipation device according to claim 1, wherein: The piezoelectric stack (3) has a through hole at one end for mounting with the jacket, and the other end is fixedly supported on an external mounting bracket.

6. The heat dissipation device according to claim 1, characterized in that: The fastening screw (5) passes through the through hole on the cantilever (9) on one side of the jacket (4) and the through hole on the piezoelectric stack (3), and then is screwed into the threaded hole on the cantilever (9) on the other side of the jacket (4) to achieve the connection between the piezoelectric stack (3) and the vibration plate (2).

7. The heat dissipation device according to claim 1, characterized in that The ratio of the fin height to the fin spacing of the fin type heat sink (1) is not greater than 5.

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