Ultrasonic probe and area array ultrasonic probe

Abstract

An ultrasonic probe and a planar array ultrasonic probe, the ultrasonic probe including a piezoelectric layer and a backing block, a first heat sink being provided between the piezoelectric layer and the backing block, because the first heat sink is provided between the piezoelectric layer and the backing block, the first heat sink is attached to the piezoelectric layer, with a large contact area, and sufficient heat exchange between the first heat sink and the middle and surrounding areas of the piezoelectric layer, resulting in a good heat dissipation effect of the ultrasonic probe, capable of ensuring that the ultrasonic probe remains in a low temperature state during long-term use.

Description

Technical Field

[0001] The present application relates to medical detection equipment, and in particular to an ultrasonic probe and an array ultrasonic probe. Background Art

[0002] An ultrasound probe is a key component of ultrasonic diagnostic imaging equipment. It primarily consists of a stacked acoustic window, matching layer, piezoelectric layer, and backing block, along with a circuit board for signal and ground connections. The operating principle of an ultrasound probe is to utilize the piezoelectric effect to convert the ultrasound system's excitation electrical pulse signal into an ultrasonic signal that enters the patient's body. The ultrasonic echo signal reflected from the tissue is then converted into an electrical signal, enabling tissue detection. During this electrical-to-acoustic signal conversion process, the ultrasound probe generates a significant amount of heat, causing the probe temperature to rise. This overheating can potentially impact patient safety, and regulations clearly stipulate that the probe temperature must not exceed a specific temperature when in contact with the patient. Furthermore, prolonged operation of the probe at elevated temperatures accelerates probe aging and shortens its lifespan. However, from a medical diagnostic perspective, increasing the probe's detection depth is desirable. Increasing the probe's excitation voltage is an effective method for increasing the probe's detection depth. However, increasing the excitation voltage also generates greater heat in the probe. Consequently, probe overheating significantly impacts patient comfort, probe lifespan, and performance.

[0003] Currently, some ultrasound probe cooling solutions employ heat sinks installed on the sides or periphery of the probe in an attempt to direct heat toward the rear end of the probe. Because ultrasound probe heating is primarily caused by the incomplete conversion of mechanical energy (acoustic signal) to electrical energy in the piezoelectric material, which is not a good conductor of heat, heat primarily accumulates in the center of the probe array element. However, heat sinks installed on the sides or periphery of the probe cannot be sufficiently close to the center of the heat source, and the cross-sectional area of ​​the heat sink side panels is too small to allow for sufficient heat exchange with the probe array elements. This problem of probe heating remains unresolved. Summary of the Invention

[0004] In one embodiment, an ultrasound probe is provided, comprising an acoustic window, a matching layer, a piezoelectric layer, and a backing block, wherein the acoustic lens, the matching layer, the piezoelectric layer, and the backing block are connected in sequence. The ultrasound probe further comprises a first heat sink, which is connected between the piezoelectric layer and the backing block. The first heat sink comprises a base and a tip protruding from the base. The base of the first heat sink is connected to the piezoelectric layer, the tip of the first heat sink extends into the backing block, and the side surface of the tip is in contact with the backing block.

[0005] In one embodiment, the first heat dissipation block is made of graphite material or a material containing graphite material.

[0006] In one embodiment, the acoustic impedance of the first heat dissipation block is the same as the acoustic impedance of the backing block, the difference between the acoustic impedance of the first heat dissipation block and the acoustic impedance of the backing block is less than 1 mega-Rayleigh, or the difference between the acoustic impedance of the first heat dissipation block and the acoustic impedance of the backing block is less than 0.2 mega-Rayleigh.

[0007] In one embodiment, the tip portion includes at least two side surfaces that are inclined relative to the side surface of the backing block and intersect with each other.

[0008] In one embodiment, the first heat dissipation block includes a plurality of the tips, and the plurality of tips are arranged in one direction or in an array in multiple directions.

[0009] In one embodiment, a first heat dissipation film is provided on at least a portion of the side surface of the tip.

[0010] In one embodiment, the thermal conductivity of the first heat dissipation film is greater than the thermal conductivity of the first heat dissipation block.

[0011] In one embodiment, the first heat dissipation film is a metal foil or a flexible graphite film.

[0012] In one embodiment, the thickness of the first heat dissipation film is no greater than 500 micrometers, or the thickness of the first heat dissipation film is no greater than 25 micrometers.

[0013] In one embodiment, the acoustic impedance of the first heat dissipation film is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the first heat dissipation film and the acoustic impedance of the backing block is less than 1 million Rayleigh.

[0014] In one embodiment, the ultrasound probe further includes a second heat dissipation block connected to the other side of the backing block opposite to the first heat dissipation block.

[0015] In one embodiment, the top end of the tip portion is adjacent to or in contact with the second heat dissipation block.

[0016] In one embodiment, the second heat dissipation block is a metal block or a graphite block.

[0017] In one embodiment, the second heat dissipation block is an aluminum block.

[0018] In one embodiment, the ultrasound probe further includes a second heat dissipation film, which is disposed between the piezoelectric layer and the first heat dissipation block.

[0019] In one embodiment, the thermal conductivity of the second heat dissipation film is greater than the thermal conductivity of the first heat dissipation block.

[0020] In one embodiment, the second heat dissipation film is a metal foil or a flexible graphite film.

[0021] In one embodiment, the thickness of the second heat dissipation film is no greater than 500 micrometers, or the thickness of the second heat dissipation film is no greater than 25 micrometers.

[0022] In one embodiment, the acoustic impedance of the second heat dissipation film is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the second heat dissipation film and the acoustic impedance of the backing block is less than 1 million Rayleigh.

[0023] In one embodiment, the ultrasound probe further includes a heat dissipation side plate, wherein the heat dissipation side plate at least partially covers at least one side surface of the first heat dissipation block and / or the backing block.

[0024] In one embodiment, the heat dissipation side plate is a metal plate or a graphite plate.

[0025] In one embodiment, the heat dissipation side plate and the first heat dissipation block are an integrated structure.

[0026] In one embodiment, the ultrasonic probe further includes a third heat dissipation film, and the third heat dissipation film is arranged between the heat dissipation side plate and the first heat dissipation block and / or the backing block.

[0027] In one embodiment, the ultrasound probe further includes a heat dissipation side plate, which extends to at least partially cover a side surface of the second heat dissipation block.

[0028] In one embodiment, the second heat dissipation block and the heat dissipation side plate are an integrated structure.

[0029] In one embodiment, the ultrasound probe further includes a fourth heat dissipation film, and the fourth heat dissipation film is disposed between the second heat dissipation block and the backing block.

[0030] In one embodiment, an ultrasonic probe is provided, comprising an acoustic lens, a matching layer, a piezoelectric layer, and a backing block, wherein the acoustic lens, the matching layer, the piezoelectric layer, and the backing block are connected in sequence. The ultrasonic probe also comprises a first heat sink connected between the piezoelectric layer and the backing block.

[0031] In one embodiment, a planar array ultrasound probe is provided, comprising an acoustic lens, a matching layer, a piezoelectric layer, and a backing block, wherein the acoustic lens, the matching layer, the piezoelectric layer, and the backing block are connected in sequence, the piezoelectric layer comprises a plurality of array elements arranged in a two-dimensional array, the ultrasound probe further comprises a first heat sink, the first heat sink is connected between the piezoelectric layer and the backing block, the first heat sink comprises a base and a tip protruding from the base, the base of the first heat sink is connected to the piezoelectric layer, the tip of the first heat sink extends into the backing block, and the side surface of the tip is in contact with the backing block.

[0032] According to the ultrasonic probe of the above embodiment, since a first heat dissipation block is provided between the piezoelectric layer and the backing block, the first heat dissipation block is attached to the piezoelectric layer with a large contact area, and sufficient heat exchange is carried out between the first heat dissipation block and the middle and surrounding parts of the piezoelectric layer, so that the heat dissipation effect of the ultrasonic probe is good, and it can ensure that the ultrasonic probe remains in a low temperature state during long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0034] Figure 2 This is a schematic structural diagram of a first heat dissipation block in an embodiment;

[0035] Figure 3 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0036] Figure 4 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0037] Figure 5 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0038] Figure 6 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0039] Figure 7 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0040] Figure 8 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0041] Figure 9 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0042] Figure 10 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0043] Figure 11 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0044] Figure 12 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0045] Figure 13 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0046] Figure 14 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0047] Figure 15 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0048] Figure 16 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0049] Figure 17 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0050] Figure 18 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0051] Figure 19 This is a schematic structural diagram of an ultrasound probe in one embodiment;

[0052] Figure 20 Schematic diagram of the structure of an ultrasound probe in an embodiment. DETAILED DESCRIPTION

[0053] The ultrasonic probe in the embodiment of the present invention is an important component of the ultrasonic diagnostic imaging equipment. A first heat sink is provided between the piezoelectric layer and the backing block of the ultrasonic probe. The first heat sink extends to the middle of the piezoelectric layer. The first heat sink has sufficient heat exchange with the middle and surrounding parts of the piezoelectric layer, thereby improving the heat dissipation effect. The first heat sink can be made of graphite material or a material containing graphite material. Graphite material has the advantages of structural strength, temperature stability and high thermal conductivity. There are also rich types of graphite products, from porous graphite to tungsten-impregnated graphite. The acoustic impedance of graphite can vary within a wide range. Therefore, it can be designed to be the same or similar to the acoustic impedance of the backing block, which facilitates acoustic design and does not affect the detection performance of the ultrasonic probe.

[0054] In one embodiment, an ultrasound probe is provided, such as Figure 1 As shown, the ultrasound probe 1 of this embodiment may include an acoustic window 2, a matching layer 3, a piezoelectric layer 4, and a backing block 5. The acoustic window 2, matching layer 3, piezoelectric layer 4, and backing block 5 may be connected in sequence. The acoustic window may be designed as a planar structure or a structure capable of focusing ultrasound waves, such as a convex structure. The convex acoustic window may be referred to as an acoustic lens. The ultrasound probe 1 also includes a first heat sink 6, which is connected between the piezoelectric layer 4 and the backing block 5. In one embodiment, the first heat sink 6 may be fully bonded between the piezoelectric layer 4 and the backing block 5.

[0055] In one embodiment, the ultrasonic probe 1 may be a planar array ultrasonic probe, wherein the piezoelectric layer may include a plurality of array elements arranged in a two-dimensional array.

[0056] In this document, when two elements are “connected”, they can be directly connected or indirectly connected, that is, one or more intermediate elements can exist between the two elements.

[0057] The first heat sink 6 can be made of graphite or a material containing graphite. Graphite has advantages such as structural strength, temperature stability, and high thermal conductivity, so that the first heat sink 6 has both heat conduction effect and stable structural support capability.

[0058] In one embodiment, the acoustic impedance of the first heat sink can be the same as the acoustic impedance of the backing block. In another embodiment, the acoustic impedance of the first heat sink is similar to that of the backing block, for example, the difference between the two is less than 1 million Rayleigh. Thus, by making the acoustic impedance of the first heat sink equal to or similar to that of the backing block, the impact of the first heat sink on the acoustic performance of the probe can be effectively reduced.

[0059] In one embodiment, the difference between the acoustic impedance of the first heat dissipation block and the acoustic impedance of the backing block may be less than 0.2 million Rayles, thereby more effectively reducing the impact of the first heat dissipation block on the acoustic performance of the probe.

[0060] In one embodiment, the first heat dissipation block 6 may be a flat plate structure with a certain thickness. In another embodiment, the first heat dissipation block 6 may include a base and a tip protruding from the plate surface of the base, and the tip may include at least two side surfaces that are inclined relative to the side surfaces of the backing block and intersect with each other, such as Figure 2 In this paper, this tip structure is called a wedge structure.

[0061] The first heat dissipation block 6 may include a plurality of such tips, which may be arranged in one direction or in an array in multiple directions.

[0062] Specifically, such as Figure 2 As shown, the first heat sink 6 has four specific structures: 6-1 represents a first heat sink with a flat plate structure, 6-2 represents a first heat sink with a wedge structure, 6-3 represents a first heat sink with three wedge structures arranged side by side, and 6-4 represents a first heat sink with a 3×5 array wedge structure. Figure 1 The direction parallel to the obliquely crossed plane is defined as the longitudinal direction, and the direction perpendicular to the obliquely crossed plane is defined as the transverse direction.

[0063] In addition to the four structures described above, the first heat sink 6 of this embodiment may also have a wedge structure with other numbers and distribution patterns, such as a structure with five longitudinally distributed wedges or a structure with four transversely distributed wedges. The wedge length of the first heat sink 6 may also be designed as needed.

[0064] like Figure 3 As shown, the first heat sink 6 is arranged between the piezoelectric layer 4 and the backing block 5. Figures 4 to 6As shown, the base of the first heat dissipation block 6 is in contact with the piezoelectric layer 4, the tip of the first heat dissipation block 6 extends into the interior of the backing block 5, the side surface of the tip of the first heat dissipation block 6 is in contact with the backing block 5, and the top of the tip of the first heat dissipation block 6 does not penetrate the backing block 5. Here, the top of the tip of the first heat dissipation block 6 can be sharp, flat, or curved.

[0065] In one embodiment, a first heat dissipation film (not shown) may be provided on at least a portion of the side surface of the tip of the first heat dissipation block 6. Specifically, the first heat dissipation film may be disposed between the first heat dissipation block 6 and the backing block 5. The first heat dissipation film may be connected to or thermally coupled to other heat dissipation elements within the probe that are disposed outside the backing block and / or at the rear end of the probe. In this way, the first heat dissipation film can conduct heat away from the backing block, thereby better dissipating heat from the backing block and the central area of ​​the piezoelectric layer, enhancing heat dissipation.

[0066] The first heat dissipation film may be a metal foil or a flexible graphite film having a higher thermal conductivity than that of the first heat dissipation block 6. For example, the first heat dissipation film may be a flexible graphite film having a higher thermal conductivity. The thermal conductivity of the flexible graphite film having a high thermal conductivity is 1500 to 1800 W / m·K, which far exceeds the thermal conductivity of metal foils such as copper and aluminum, and can better conduct heat.

[0067] The thickness of the first heat dissipation film can be relatively thin to reduce its influence on the acoustic performance of the probe. The thinner the thickness of the first heat dissipation film, the smaller its influence on the acoustic performance of the probe, but at the same time, the smaller its heat capacity is, the less heat can be stored, which will affect the heat dissipation performance. In some embodiments of the present invention, the first heat dissipation film is arranged on the first heat dissipation block 6, and the first heat dissipation block 6 has a large heat capacity and can store more heat conducted by the first heat dissipation film. Therefore, the first heat dissipation film and the first heat dissipation block 6 cooperate with each other, that is, the thickness of the first heat dissipation film can be reduced as much as possible to reduce the influence on the acoustic performance of the probe as much as possible, and sufficient heat capacity can be provided to provide good heat dissipation performance, which well achieves a balance between the acoustic performance and heat dissipation performance of the probe. For example, in one embodiment, the thickness of the first heat dissipation film can be no more than 500 microns. Furthermore, in one embodiment, the thickness of the first heat dissipation film can be no more than 25 microns.

[0068] In one embodiment, the acoustic impedance of the first heat dissipation film can be equal to or similar to that of the backing block. For example, the acoustic impedance of the first heat dissipation film can be the same as that of the backing block, or the difference between the two can be less than 1 megaryl. This can further reduce the impact of the first heat dissipation film on the acoustic performance of the probe.

[0069] The ultrasound probe of this embodiment may further include a heat dissipation side plate 7 , which may include one or more heat dissipation side plates 7 . The heat dissipation side plates 7 at least partially fit and cover at least one side surface of the first heat dissipation block 6 and the backing block 5 .

[0070] like Figures 3 to 6 As shown, two heat dissipation side plates 7 are symmetrically attached to the lateral sides of the first heat dissipation block 6 and the backing block 5. These plates are made of metal or graphite plates with high thermal conductivity, such as aluminum. The presence of these plates increases the heat dissipation area, allowing heat absorbed by the first heat dissipation block 6 to be transferred to the plates 7. These plates can then connect to the rear heat dissipation mechanism, transferring the heat to the rear heat dissipation mechanism and exposing it to the external environment, improving heat dissipation efficiency.

[0071] In its embodiment, the heat dissipation side plate 7 and the first heat dissipation block 6 are an integrated structure and can both be made of graphite. The heat energy absorbed by the first heat dissipation block 6 can be transferred to the heat dissipation side plate 7 more quickly for dissipation, thereby achieving a better heat dissipation effect.

[0072] The ultrasonic probe provided in this embodiment has a first heat dissipation block 6 with a certain thickness provided between the piezoelectric layer 4 and the backing block 5. The first heat dissipation block 6 fits and covers the middle and four sides of the piezoelectric layer 4, and can exchange heat with the middle and four sides of the piezoelectric layer 4. The heat generated by the piezoelectric layer 4 is quickly transferred to the rear end heat dissipation mechanism connected to the outside world through the first heat dissipation block 6 and the heat dissipation side plate 7 fitted on the side of the backing block 5, and dissipated into the air more quickly, avoiding the continuous accumulation and increase of heat at the front end of the ultrasonic probe. Therefore, the ultrasonic probe of this embodiment has a good heat dissipation effect, which can ensure that the ultrasonic probe remains in a low temperature state during long-term use.

[0073] In one embodiment, an ultrasonic probe is provided. The ultrasonic probe of this embodiment is provided with a heat dissipation film in addition to the above embodiments.

[0074] like Figures 7 to 10 As shown, the second heat dissipation film 9 can be arranged between the piezoelectric layer 4 and the first heat dissipation block 6. The second heat dissipation film 9 can also extend outward to between the heat dissipation side plate 7 and the first heat dissipation block 6 and the backing block 5, forming a heat dissipation film between the heat dissipation side plate 7 and the first heat dissipation block 6 and the backing block 5. In this article, the heat dissipation film between the heat dissipation side plate 7 and the first heat dissipation block 6 and the backing block 5 is referred to as a third heat dissipation film. The third heat dissipation film can be formed by extending the second heat dissipation film 9 (as shown in FIG. Figures 7 to 10 The embodiments shown in FIG. 1 and FIG. 2 are each denoted by reference numeral 9, and may also be a separate component separated from the second heat dissipation film 9.

[0075] In this embodiment, the second and third heat dissipation films may be metal foils with high thermal conductivity or flexible graphite films with high thermal conductivity. For example, flexible graphite films with high thermal conductivity have a thermal conductivity of 1500-1800 W / m·K, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the second heat dissipation film 9 may be no greater than 500 microns. Furthermore, in one embodiment, the thickness of the first heat dissipation film may be no greater than 25 microns.

[0076] The acoustic impedance of the second heat dissipation film can be equal to or similar to that of the backing block. For example, the acoustic impedance of the second heat dissipation film can be the same as that of the backing block, or the difference between the two can be less than 1 megaryl. This can reduce the impact of the second heat dissipation film on the acoustic performance of the probe.

[0077] The ultrasonic probe provided in this embodiment is provided with a second and / or third heat dissipation film on the basis of the first heat dissipation block 6 and the heat dissipation side plate 7. The heat dissipation film plays a heat transfer role, quickly transferring the heat energy generated by the piezoelectric layer 4 to the first heat dissipation block 6, the backing block 5 and / or the heat dissipation side plate 7 to improve the heat dissipation effect.

[0078] In one embodiment, an ultrasound probe is provided. The ultrasound probe of this embodiment is provided with a second heat sink 8 in addition to the first heat sink 6 and the heat sink side plate 7 .

[0079] like Figures 11 to 14 As shown, the second heat sink 8 is attached to the other side of the backing block 5 opposite to the first heat sink 6, that is, the second heat sink 8 and the first heat sink 6 are respectively attached to the two opposite sides of the backing block 5. The heat sink side plate 7 extends to at least partially cover the side surface of the second heat sink 8.

[0080] In one embodiment, the top end of the tip of the first heat dissipation block 6 may be adjacent to or in contact with the second heat dissipation block 8, thereby transferring heat from the backing block and the center of the piezoelectric layer to the second heat dissipation block 8, further improving heat dissipation efficiency.

[0081] The second heat dissipation block 8 is a metal block or a graphite block with high thermal conductivity and large specific heat capacity. In one embodiment, the second heat dissipation block 8 can be an aluminum block.

[0082] The ultrasonic probe of this embodiment is provided with a second heat dissipation block 8 at the rear end of the backing block 5. The second heat dissipation block 8 improves the heat dissipation efficiency, and the second heat dissipation block 8 can be connected to the heat dissipation mechanism at the rear end of the backing block 5, which can increase the heat capacity of the heat dissipation mechanism and prevent sudden temperature changes from affecting the heat dissipation effect.

[0083] In one embodiment, an ultrasonic probe is provided. The ultrasonic probe of this embodiment is provided with a fourth heat dissipation film in addition to the above embodiments.

[0084] like Figures 15 to 18 As shown, the second heat sink 8 is attached to the other side of the backing block 5 opposite the first heat sink 6. That is, the second heat sink 8 and the first heat sink 6 are attached to the opposite sides of the backing block 5. The heat sink side plate 7 extends to fit over the side of the second heat sink 8. The heat sink film 9 is sandwiched between the piezoelectric layer 4 and the first heat sink 6. The heat sink films 9 on both sides extend outward to be sandwiched between the heat sink side plate 7, the first heat sink 6, and the backing block 5. A fourth heat sink film is provided between the backing block 5 and the second heat sink 8.

[0085] The fourth heat dissipation film can be a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity. The thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800 W / m〃K, which is far higher than the thermal conductivity of metal foils such as copper and aluminum.

[0086] The ultrasonic probe provided in this embodiment has a fourth heat dissipation film added on the basis of the first heat dissipation block 6 and the heat dissipation side plate 7. The fourth heat dissipation film improves the heat conduction efficiency. The second heat dissipation block 8 can be connected to the heat dissipation mechanism at the rear end of the backing block 5, which can increase the heat capacity of the heat dissipation mechanism and prevent sudden temperature changes from affecting the heat dissipation effect.

[0087] The above specific examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. For those skilled in the art, according to the concept of the present invention, the above specific embodiments can be modified.

Claims

1. An ultrasonic probe, characterized in that: The ultrasonic probe includes an acoustic lens, a matching layer, a piezoelectric layer and a backing block, wherein the acoustic window, the matching layer, the piezoelectric layer and the backing block are connected in sequence. The ultrasonic probe also includes a first heat dissipation block, which is connected between the piezoelectric layer and the backing block. The first heat dissipation block includes a base and a tip protruding from the base. The base of the first heat dissipation block is located between the piezoelectric layer and the backing block. The tip of the first heat dissipation block extends into the backing block in a direction away from the piezoelectric layer, and the tip shrinks in a direction away from the piezoelectric layer. The tip includes at least two side surfaces that are inclined relative to the side of the backing block and intersect with each other, and the side surfaces of the tip are in contact with the backing block.

2. The ultrasonic probe according to claim 1, wherein: The first heat dissipation block is made of graphite material or a material containing graphite material.

3. The ultrasonic probe according to claim 1, wherein: The acoustic impedance of the first heat dissipation block is the same as the acoustic impedance of the backing block, the difference between the acoustic impedance of the first heat dissipation block and the acoustic impedance of the backing block is less than 1 million Rayleigh, or the difference between the acoustic impedance of the first heat dissipation block and the acoustic impedance of the backing block is less than 0.2 million Rayleigh.

4. The ultrasonic probe according to claim 1, wherein: The first heat dissipation block includes a plurality of the tips, and the plurality of tips are arranged in one direction or in an array in multiple directions.

5. The ultrasonic probe according to any one of claims 1 to 4, characterized in that: A first heat dissipation film is provided on at least a portion of the side surface of the tip.

6. The ultrasonic probe according to claim 5, wherein: The thermal conductivity of the first heat dissipation film is greater than the thermal conductivity of the first heat dissipation block.

7. The ultrasonic probe according to claim 5, wherein: The first heat dissipation film is a metal foil or a flexible graphite film.

8. The ultrasonic probe according to claim 5, wherein: The thickness of the first heat dissipation film is no greater than 500 micrometers, or the thickness of the first heat dissipation film is no greater than 25 micrometers.

9. The ultrasonic probe according to claim 5, wherein: The acoustic impedance of the first heat dissipation film is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the first heat dissipation film and the acoustic impedance of the backing block is less than 1 megaryl.

10. The ultrasonic probe according to any one of claims 1 to 4, characterized in that: The invention also includes a second heat dissipation block connected to the other side of the backing block opposite to the first heat dissipation block.

11. The ultrasonic probe according to claim 10, wherein: The top end of the tip portion is adjacent to or in contact with the second heat dissipation block.

12. The ultrasonic probe according to claim 10, wherein: The second heat dissipation block is a metal block or a graphite block.

13. The ultrasonic probe according to claim 12, wherein: The second heat dissipation block is an aluminum block.

14. The ultrasonic probe according to any one of claims 1 to 4, characterized in that: The device further includes a second heat dissipation film, which is arranged between the piezoelectric layer and the first heat dissipation block. 15 . The ultrasonic probe according to claim 14 , wherein the thermal conductivity of the second heat dissipation film is greater than the thermal conductivity of the first heat dissipation block.

16. The ultrasonic probe according to claim 14, wherein: The second heat dissipation film is a metal foil or a flexible graphite film.

17. The ultrasonic probe according to claim 14, wherein: The thickness of the second heat dissipation film is 10 to 500 micrometers, or the thickness of the second heat dissipation film is 17 to 25 micrometers.

18. The ultrasonic probe according to claim 14, wherein: The acoustic impedance of the second heat dissipation film is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the second heat dissipation film and the acoustic impedance of the backing block is less than 1 megarai.

19. The ultrasonic probe according to any one of claims 1 to 4, characterized in that: It also includes a heat dissipation side plate, which at least partially covers at least one side surface of the first heat dissipation block and / or the backing block.

20. The ultrasonic probe according to claim 19, wherein: The heat dissipation side plate is a metal plate or a graphite plate.

21. The ultrasonic probe according to claim 19, wherein The heat dissipation side plate and the first heat dissipation block are an integrated structure.

22. The ultrasonic probe according to claim 19, wherein: It also includes a third heat dissipation film, which is arranged between the heat dissipation side plate and the first heat dissipation block and / or the backing block.

23. The ultrasonic probe according to claim 10, wherein: It also includes a heat dissipation side plate, which extends to at least partially cover the side surface of the second heat dissipation block.

24. The ultrasonic probe according to claim 23, wherein: The second heat dissipation block and the heat dissipation side plate are an integrated structure.

25. The ultrasound probe according to claim 10, wherein: The device further includes a fourth heat dissipation film, which is disposed between the second heat dissipation block and the backing block.

26. A planar array ultrasound probe, characterized in that: The ultrasonic probe includes an acoustic lens, a matching layer, a piezoelectric layer and a backing block, wherein the acoustic lens, the matching layer, the piezoelectric layer and the backing block are connected in sequence, the piezoelectric layer includes a plurality of array elements arranged in a two-dimensional array, and the ultrasonic probe also includes a first heat dissipation block, which is connected between the piezoelectric layer and the backing block. The first heat dissipation block includes a base and a tip protruding from the base. The base of the first heat dissipation block is located between the piezoelectric layer and the backing block, the tip of the first heat dissipation block extends into the backing block in a direction away from the piezoelectric layer, the tip shrinks in a direction away from the piezoelectric layer, the tip includes at least two side surfaces that are inclined relative to the side of the backing block and intersect with each other, and the side surfaces of the tip are in contact with the backing block.

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