Dust-proof structure, microphone packaging structure, and electronic device

Abstract

The present invention discloses a dustproof structure, a microphone packaging structure and an electronic device, comprising: a carrier, the carrier is made of metal material, a through hole is formed in the middle of the carrier; a membrane, the membrane is made of metal material, the membrane comprises a grid structure and a connecting portion arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting portion is connected to the carrier. One technical effect of the present invention is that by setting the carrier and the membrane to be all made of metal material, the thermal expansion coefficient of the carrier of the dustproof structure is reduced, and the deformation amount of the dustproof structure after being affected by heat is reduced.

Description

Technical Field

[0001] The present invention relates to the field of acoustic and electrical technology, and more specifically, to a dustproof structure, a microphone packaging structure and an electronic device. Background Art

[0002] There are delicate components inside the microphone. When the microphone is in use, dust and other pollutants from the outside will enter through the sound hole and affect the performance of the components.

[0003] The dustproof structure will be heated during the process of being assembled to the printed circuit board or during use after being assembled to the printed circuit board. The dustproof structure itself will be deformed after being heated. Due to the different thermal expansion coefficients between different parts, the deformation of the dustproof structure after being heated may cause it to fall off from the circuit board or be damaged.

[0004] Therefore, it is necessary to provide a new technical solution to solve the above problems. Summary of the invention

[0005] An object of the present invention is to provide a new technical solution for a dustproof structure, a microphone packaging structure and an electronic device.

[0006] According to a first aspect of the present invention, there is provided a dustproof structure, comprising:

[0007] A carrier, wherein the carrier is made of metal material and a through hole is formed in the middle of the carrier;

[0008] The film body is made of metal material and comprises a grid structure and a connecting portion arranged around the grid structure. The grid structure covers one end of the through hole, and the connecting portion is connected to the carrier.

[0009] Optionally, the membrane body and the carrier are made of the same metal material.

[0010] Optionally, the material of the carrier is nickel or copper.

[0011] Optionally, the carrier comprises at least one layer of structure.

[0012] Optionally, the film body comprises at least one layer of structure.

[0013] Optionally, the metal material of the film body is a single element metal or an alloy.

[0014] Optionally, the metal material of the carrier is a single element metal or an alloy.

[0015] Optionally, the carrier comprises a multi-layer structure, and in the carrier, a thermal expansion coefficient of an outermost layer structure at a side away from the film body is lower than thermal expansion coefficients of structures in other layers.

[0016] Optionally, in the carrier, the thermal expansion coefficient of each layer structure decreases layer by layer from the side where the film body is located to the side away from the film body.

[0017] Optionally, the thickness of the carrier is 10um-70um.

[0018] According to a second aspect of the present invention, there is provided a microphone packaging structure, comprising any one of the above-mentioned dustproof structures, wherein the dustproof structure is fixed on the sound hole of the microphone packaging structure;

[0019] Alternatively, the dustproof structure covers the MEMS chip in the microphone packaging structure.

[0020] According to a third aspect of the present invention, there is provided an electronic device comprising the above-mentioned microphone packaging structure.

[0021] According to an embodiment of the present disclosure, by setting the carrier and the film body to be all made of metal materials, the thermal expansion coefficient of the carrier of the dustproof structure is reduced, thereby reducing the deformation of the dustproof structure caused by heat.

[0022] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0024] Figure 1 FIG. 1 is a schematic structural diagram of a dustproof structure in an embodiment of the present disclosure.

[0025] Figure 2 FIG. 1 is a schematic structural diagram of an embodiment of the present disclosure in which the carrier and the membrane are made of the same metal.

[0026] Figure 3 1 is a schematic structural diagram of an embodiment of the present disclosure in which both the carrier and the membrane body have a multilayer structure.

[0027] Figure 4 It is a diagram of the deformation process that occurs during the installation of the dustproof structure in the prior art.

[0028] Figure 5 The present invention discloses an embodiment in which a carrier and a film body are made of different metals and undergo deformation.

[0029] Figure 6 FIG. 1 is a diagram of a deformation process in which a carrier and a film body are made of the same metal in an embodiment of the present invention.

[0030] Figure 7One of the embodiments disclosed herein is a schematic diagram of a dustproof structure provided in a sound hole on a substrate of a microphone packaging structure.

[0031] Figure 8 One of the present disclosures is a schematic diagram of a dustproof structure provided at a MEMS chip on a microphone packaging structure substrate in an embodiment.

[0032] In the figure, 1 is a membrane body, 11 is a first membrane body, 12 is a second membrane body, 13 is a third membrane body, 2 is a carrier, 21 is a first carrier, 22 is a second carrier, 3 is a printed substrate, 31 is an acoustic hole, 32 is a MEMS chip, and 4 is an adhesive. DETAILED DESCRIPTION

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0035] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0036] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0037] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0038] According to one embodiment of the present disclosure, a dustproof structure is provided, such as Figure 1 As shown, the dust-proof structure includes:

[0039] A carrier 2, wherein the carrier 2 is made of metal material and a through hole is formed in the middle of the carrier 2;

[0040] The film body 1 is made of metal material and includes a grid structure and a connecting portion arranged around the grid structure. The grid structure covers one end of the through hole, and the connecting portion is connected to the carrier 2.

[0041] During the manufacturing and installation of the dustproof structure, a thermal bonding process is used. During the process, the dustproof structure is heated, which causes the carrier 2 and the film body 1 to deform. The deformation occurs due to the thermal expansion properties of the material itself, and the deformation cannot be controlled.

[0042] In this embodiment, the carrier 2 supports the membrane body 1, and the membrane body 1 is fixed to the carrier 2 through the connection part, so that the grid structure covers one end of the through hole. The grid structure has a filtering effect on the through hole, for example, filtering out dust and other pollutants in the air passing through, so that the dust-proof structure plays a dust-proof role.

[0043] The membrane body 1 and the carrier 2 are both made of metal materials, and the thermal expansion coefficient of metal materials is lower than that of organic materials. The dustproof structure made in this way has a lower thermal expansion coefficient than the existing dustproof structure whose carrier is an organic material. When a heat treatment process is performed, the thermal deformation of the dustproof structure after being heated will be greatly reduced, and the shape deformation of the dustproof structure can be effectively suppressed. For example, when bonding is performed by a thermal bonding process, the deformation of the dustproof structure can be effectively suppressed in this embodiment.

[0044] For example, the material of the carrier 2 is a metal material, which has a lower thermal expansion coefficient than that of the carrier 2 using an organic material. During the heat treatment process, the deformation degree of the carrier 2 is smaller, which effectively suppresses the shape deformation of the carrier 2. In this way, during the installation of the dustproof structure, the carrier 2 is more in line with the set shape and is more convenient to install.

[0045] In one embodiment, Figure 2 As shown, the film body 1 and the carrier 2 are made of the same metal material.

[0046] In this embodiment, the film body 1 and the carrier 2 are made of the same metal material. The same metal material has the same properties, the same thermal expansion coefficient, and the same degree of parallelism when affected by heat.

[0047] The membrane body 1 and the carrier 2 are made of the same metal material. During the process of making the membrane body 1 and the carrier 2 into a dustproof structure, or during the installation of the manufactured dustproof structure, the dustproof structure is deformed by the heat of the heat treatment. During the deformation process, because the membrane body 1 and the carrier 2 are made of the same material, the thermal expansion coefficients of the two are the same. In this way, the degree of deformation is also the same, and there will be no relative deformation caused by different degrees of deformation between the membrane body 1 and the carrier 2. In this way, the structure between the membrane body 1 and the carrier 2 will maintain its original state and will not be damaged. In this way, the dustproof structure can eliminate its own deformation caused by thermal expansion.

[0048] For example, the film body 1 and the carrier 2 are made of the same metal material. First, the material of the film body 1 and the carrier 2 is metal, and the thermal expansion coefficient is much lower than that of organic materials, and the deformation amount when it is heated and expanded is very small. Secondly, the expansion degree of the film body 1 and the carrier 2 is the same, and the film body 1 deforms synchronously with respect to the carrier 2. In this way, the deformation of the dustproof structure caused by the different expansion degrees of the film body 1 and the carrier 2 can be eliminated.

[0049] For example, the material of the carrier 2 is nickel or copper. Using nickel or copper as the material of the carrier 2 can make the carrier 2 have a lower thermal expansion coefficient. Reduce the deformation of the carrier 2 during the heat treatment process. For example, the material of the film body 1 can also be nickel or copper. Nickel and copper have lower thermal expansion coefficients, which can reduce the deformation of the film body 1 during the heat treatment process.

[0050] In one embodiment, the carrier 2 includes at least one layer structure.

[0051] The carrier 2 has the function of supporting the whole structure in the dustproof structure. The thickness of the carrier 2 can affect the size of the dustproof structure. Under different requirements, the size requirements of the dustproof structure are also different. The dustproof structure can be set to at least one layer structure, such as a one-layer structure, a two-layer structure, a three-layer structure, etc. In this way, the size of the dustproof structure can be controlled by setting the number of layers of the carrier 2.

[0052] The process steps for manufacturing carriers 2 with different numbers of layers are different, and the number of layers can be adjusted according to needs to simplify the process steps for manufacturing the carrier 2. Those skilled in the art can select the number of layers of the carrier 2 according to actual needs.

[0053] For example Figure 3 As shown, the carrier 2 includes a first carrier layer 21 and a second carrier layer 22.

[0054] In one embodiment, the film body 1 includes at least one layer structure.

[0055] The membrane body 1 has the function of filtering and preventing dust in the dustproof structure. The number of layers of the membrane body 1 determines the number of filtration times and can affect the dustproof ability. In addition, the number of layers of the membrane body 1 can also affect the overall thickness of the dustproof structure and the size of the dustproof structure. Those skilled in the art can select the appropriate number of layers of the membrane body 1 according to different dustproof requirements, so that the dustproof structure can have a suitable dustproof ability and a suitable size.

[0056] For example Figure 3 As shown, the film body 1 includes a first film body layer 11 , a second film body layer 12 and a third film body layer 13 .

[0057] In one embodiment, the metal material of the membrane body 1 is a single element metal or an alloy.

[0058] The thermal expansion coefficient of the membrane body 1 made of a single element metal or alloy can reach a low value, which can ensure that the membrane body 1 maintains a low deformation when deformed by heat, helps to reduce the deformation of the dustproof structure, and protects the dustproof structure from damage due to deformation.

[0059] In one embodiment, the metal material of the carrier 2 is a single element metal or an alloy.

[0060] The thermal expansion coefficient of the carrier 2 made of a single element metal or alloy can reach a low value, which can ensure that the carrier 2 maintains a low deformation when deformed by heat, helps to reduce the deformation of the dustproof structure, and protects the dustproof structure from damage due to deformation.

[0061] In one embodiment, Figure 3 As shown, the carrier 2 includes a multi-layer structure, in which the thermal expansion coefficient of the outermost layer structure at a side away from the film body 1 is lower than the thermal expansion coefficients of the structures of other layers.

[0062] In this embodiment, the carrier 2 includes a multilayer structure. In the carrier 2 with such a structure, the outermost layer on the side away from the film body 1 is set to have a lower thermal expansion coefficient than the other layers. In this way, the deformation of the outermost layer of the carrier 2 is the smallest when the carrier 2 is thermally expanded.

[0063] During the installation of the dustproof structure, the outermost layer of the carrier 2 is in contact with the installation site. It receives the most heat during thermal bonding. Setting the structure of the outermost layer to have a lower thermal expansion coefficient than other layers can minimize the deformation of the structure of the outermost layer during expansion and deformation, and can reduce the deformation between the dustproof structure and the installation site. This improves the reliability of installing the dustproof structure. In addition, the carrier 2 is an integral structure, and the deformation of the outermost layer structure is reduced, which can limit the deformation of the structures of other layers.

[0064] In one embodiment, in the carrier 2 , along the side where the film body 1 is located to the side away from the film body 1 , the thermal expansion coefficient of each layer structure decreases layer by layer.

[0065] In this embodiment, the multi-layered carrier 2 is arranged from the side where the film body 1 is located to the side away from the film body 1, and the thermal expansion coefficient of each layer structure decreases layer by layer. For example, different metal materials are used for each layer structure of the carrier 2 to change the thermal expansion coefficient of the carrier 2 layer by layer. The structure on the side away from the film body 1 is the outermost structure.

[0066] During the installation of the dustproof structure, it is installed through heat treatment. For example, the dustproof structure is installed by thermal bonding. The outermost metal material of the carrier 2 has the lowest thermal expansion coefficient and the amount of deformation when affected by heat is the least. The outermost structure of the carrier 2 is directly bonded to the installation position, and the outermost structure receives the most heat, which decreases layer by layer toward the membrane body 1 side. The carrier 2 is arranged from the side where the membrane body 1 is located to the side away from the membrane body 1, and the thermal expansion coefficient of each layer of the structure decreases layer by layer, which can effectively suppress the expansion deformation of the carrier 2, and make the deformation between each layer of the structure more uniform, effectively reducing the deformation of the carrier.

[0067] For example Figure 3 As shown, the thermal expansion coefficient of the first carrier layer 21 may be greater than the thermal expansion coefficient of the second carrier layer 22. In this case, the second carrier layer 22 is in direct contact with the mounting part and is more affected by the heat. The deformation of the second carrier layer 22 after heating is smaller than that of the first carrier layer 21. The deformation of the carrier can be better suppressed, and the structure of the dustproof structure is protected from being damaged.

[0068] In one embodiment, the thickness of the carrier 2 is 10 um-70 um.

[0069] Within this thickness range, the dustproof structure can meet the actual size requirements. When the carrier 2 is within this range, the adhesive can be prevented from being melted by heat during the heat treatment process and adhering to the carrier 2 along both sides, thereby improving the reliability of the dustproof structure installation.

[0070] Figure 4 This is a diagram showing the deformation process of the dustproof structure during installation in the prior art.

[0071] The adhesive 4 on the printed substrate 3 softens after being heated, and the carrier 2 and the film body 1 are deformed.

[0072] The temperature of the dustproof structure drops after being unheated, and the carrier 2 and the film body 1 return to their original state, but the adhesive 4 begins to solidify, fixing the carrier 2 and the film body 1 in the deformed structure. In this way, the dustproof structure maintains the deformed structure, which will cause damage to the dustproof structure.

[0073] Figure 5 The present disclosure is a diagram of the deformation process of the carrier and the film body in the embodiment of the present disclosure being different metals.

[0074] The adhesive 4 on the printed substrate 3 softens after being heated, and the carrier 2 and the film body 1 are deformed.

[0075] The carrier 2 and the membrane 1 are made of different metals, and the thermal expansion coefficient of the membrane 1 is less than that of the carrier 2. The carrier 2 is made of metal and has a small deformation. The deformation of the membrane 1 is smaller than that of the carrier 2. After the dustproof structure is not heated, the temperature drops, the carrier 2 and the membrane 1 return to their original state, and the adhesive 4 begins to solidify. After re-fixation, the deformation of the carrier 2 and the membrane 1 is very small, and the dustproof structure will not be damaged. The overall deformation of the dustproof structure is very small.

[0076] Figure 6 One of the disclosed embodiments is a diagram of a deformation process in which the carrier and the film are made of the same metal.

[0077] The adhesive 4 on the printed substrate 3 softens after being heated, and the carrier 2 and the film body 1 are deformed.

[0078] The carrier 2 and the film body 1 are made of the same metal, and the thermal expansion coefficients of the carrier 2 and the film body 1 are the same. During the thermal bonding process using the adhesive 4, the carrier 2 and the film body 1 expand at the same time, which can eliminate the deformation caused by the expansion. After the adhesive 4 is re-cured, the dustproof structure can maintain its original shape, thereby improving the reliability of the dustproof structure in the heat treatment process.

[0079] According to an embodiment of the present invention, there is provided a microphone packaging structure, the microphone packaging structure comprising the above-mentioned dustproof structure, wherein the dustproof structure is fixed on the sound hole 31 of the microphone packaging structure;

[0080] Alternatively, the dustproof structure covers the MEMS chip 32 in the microphone packaging structure.

[0081] Generally, the microphone packaging structure includes a shell forming a receiving cavity and a substrate fixed to the shell. The sound hole 31 can be arranged on the substrate or on the shell.

[0082] In this embodiment, the dustproof structure may be fixed to the sound hole 31 from the outside of the microphone packaging structure, thereby protecting the components in the microphone packaging structure from the outside.

[0083] It can also be, Figure 7 As shown, the dustproof structure is fixed on the sound hole 31 from the inside of the microphone packaging structure, thereby protecting the components of the microphone packaging structure from the inside.

[0084] It can also be, Figure 8 As shown, the dustproof structure is fixed on the substrate to protect the sound hole 31 and the interior of the microphone packaging structure. The MEMS chip 32 is fixed by the dustproof structure.

[0085] Alternatively, the dustproof structure is fixed inside the microphone packaging structure and covers the MEMS chip 32. This can protect the MEMS chip 32. In this structure, the carrier 2 can be fixed on the substrate where the MEMS chip 32 is located to form a cover. The carrier 2 can also be fixed on the substrate of the MEMS chip 32 to form a cover. The above structures can all protect the MEMS chip 32.

[0086] The microphone packaging structure can effectively prevent the dustproof structure from being damaged by heat during the installation and use of the microphone, and can also protect the components in the microphone, for example, protecting the MEMS chip 32 from being contaminated by external dust and other pollutants.

[0087] According to one embodiment of the present disclosure, an electronic device is provided, comprising the above-mentioned microphone packaging structure.

[0088] The electronic device includes the microphone and has all the advantages of the microphone packaging structure. For example, the electronic device can be an audio device, a mobile phone, a computer and other products.

[0089] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A dustproof structure, characterized in that: include; A carrier, wherein the carrier is made of metal material and a through hole is formed in the middle of the carrier; A film body, wherein the film body is made of metal material, comprises a grid structure and a connecting portion arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting portion is connected to the carrier; The carrier comprises a multi-layer structure, in which the thermal expansion coefficient of the outermost layer structure at a side away from the film body is lower than the thermal expansion coefficients of the structures of other layers.

2. The dustproof structure according to claim 1, characterized in that: The film body includes at least one layer structure.

3. The dustproof structure according to claim 1, characterized in that: The metal material of the film body is a single element metal or an alloy.

4. The dustproof structure according to claim 1, characterized in that: In the carrier, the thermal expansion coefficient of each layer structure decreases layer by layer along the side where the film body is located to the side away from the film body.

5. The dustproof structure according to any one of claims 1 to 3, characterized in that: The thickness of the carrier is 10um-70um.

6. A microphone packaging structure, characterized in that: The dustproof structure comprises the dustproof structure according to any one of claims 1 to 5, wherein the dustproof structure is fixed on the sound hole of the microphone packaging structure; Alternatively, the dustproof structure covers the MEMS chip in the microphone packaging structure.

7. An electronic device, characterized in that: Including the microphone packaging structure as described in claim 6.

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