A micro diode lead processing mold and use method thereof

Abstract

The present invention provides a micro diode lead processing mold and a method for using the same; the mold comprises a winding mold, the winding mold is mounted on a rotating shaft, driven by a motor, the side wall of the winding mold is combined into the shape of a diode lead by a U-shaped mold surface and a plane mold surface, and the center of the plane mold surface is processed with a guide groove along the axial direction of the rotating shaft. The winding mold solves the problem that the traditional process cannot be used for production due to the small area of ​​the micro diode core, the small diameter of the electrode lead, the light weight, and the lack of a pier head of the electrode lead. The present invention can quickly process the micro diode lead through this mold, and the specifications of the processed leads are consistent, thereby improving the quality of the diode.

Description

Technical Field

[0001] The invention relates to a micro diode lead processing die and a use method thereof. Background Art

[0002] The traditional production process of axial diodes is to assemble the produced tube core, solder, lead electrode, etc. through a special mold, melt the solder at high temperature, use the solder to weld the tube core and the lead electrode together, and then corrode, passivate and package the tube core.

[0003] As electronic equipment develops towards integration and miniaturization, discrete devices are required to have thin leads, small size and light weight. There is a huge market demand for axial lead micro diodes, which require that the tube diameter is less than 1mm, the tube length is less than 0.25mm, and the lead diameter is less than 0.15mm. Due to their small tube core area, small electrode lead diameter, light weight and no piers on the electrode leads, they can no longer be produced using traditional processes. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a micro diode lead processing mold and a use method thereof.

[0005] The present invention is achieved through the following technical solutions.

[0006] The present invention provides a micro diode lead processing die and a method for using the same; the die comprises a winding die, the winding die is mounted on a rotating shaft, driven by a motor, the side wall of the winding die is combined into the shape of a diode lead by a U-shaped die surface and a plane die surface, and a guide groove is processed in the center of the plane die surface along the axial direction of the rotating shaft. The winding die solves the problem that the micro diode core area is small, the electrode lead diameter is too small, the weight is light, and the electrode lead has no pier head, which makes it impossible to use traditional processes for production.

[0007] In order to prevent the blade from tilting and causing the cut wire to be uneven in length when cutting the wire, the guide groove opening is processed with a V-shaped opening to allow the blade to be embedded in the guide groove as a flare, and the lower end of the guide groove is processed as a limit groove. The width of the limit groove is slightly larger than the width of the blade to guide the blade during the cutting process.

[0008] In order to enable the winding die to be quickly installed on the motor and facilitate the replacement of winding dies with different diode lead diameters, a shaft hole is processed on the winding die, and a positioning key is processed on the side wall of the shaft hole. The winding die can be quickly installed through the shaft hole and the positioning key.

[0009] In order to make the metal wire form a neat track on the winding die and to make the specifications of the formed diode lead wire consistent, a positioning groove is also processed on the outer wall composed of the U-shaped die surface and the flat die surface. During the winding process, the worker holding the metal wire only needs to tighten the metal wire and embed the metal wire into the positioning groove according to the track of the positioning groove. There is no need to deliberately control the deflection angle. The positioning groove is processed in a thread-like shape on the winding die. The positioning groove is a semicircular arc groove, and its diameter is the diameter of the diode lead wire.

[0010] In order to ensure that the contact points of the processed lead wire and the diode are on the same straight line, the trajectory of the positioning groove on the plane mold surface is made into several straight lines perpendicular to the rotating axis, so that the bright spots at the disconnected points of the lead wire obtained after cutting can be on the straight line.

[0011] In order to facilitate the positioning of the metal wire on the winding die before winding, the guide groove is provided with a rib adjacent to one end of the rotating shaft, and a wire clamping hole is processed on the rib. During processing, the metal wire is inserted into the wire clamping hole, and then bent along the initial part of the positioning groove, so that the starting point of the metal wire on the winding die forms a bend at a certain angle between the wire clamping hole and the positioning groove, which facilitates the positioning of the metal wire on the winding die. After the winding is completed, during the cutting process, since the center of the wire clamping hole is different from the center of the guide groove and is far away from the end of the positioning groove, the bend can be separated from the required lead by the blade.

[0012] In order to prevent the metal wire from being cut by the edge of the winding die due to being too thin, the junction between the U-shaped die surface and the flat die surface is rounded.

[0013] 1Fix one end of the unseparated wire on the winding die, and then tighten the wire;

[0014] 2 Start the motor and adjust the angle appropriately after the motor rotates one circle;

[0015] 3. Stop the motor after the mold is filled;

[0016] 4 Use a blade to cut the wound wire along the guide groove;

[0017] 5 Remove the cut metal wire to obtain the diode lead.

[0018] The beneficial effects of the present invention are: the micro diode leads can be quickly processed by the mold, and the specifications of the processed leads are consistent, thereby improving the quality of the diode. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the winding frame structure of the present invention;

[0021] Figure 3It is a diagram of the diode lead and die assembly structure;

[0022] In the figure: 1-motor, 2-rotating shaft, 3-winding die, 31-U-shaped die surface, 32-flat die surface, 33-guide groove, 331-V-shaped mouth, 332-limiting groove, 34-positioning groove, 35-rotating shaft hole, 36-cable clamping hole. DETAILED DESCRIPTION

[0023] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0024] A micro diode lead processing mold and a method of using the same; comprising a winding mold 3, the winding mold 3 is mounted on a rotating shaft 2 and driven by a motor 1, the side wall of the winding mold 3 is combined into the shape of a diode lead by a U-shaped mold surface 31 and a plane mold surface 32, and a guide groove 33 is processed at the center of the plane mold surface 32 along the axial direction of the rotating shaft 2.

[0025] The opening of the guide groove 33 is processed to have a V-shaped opening 331, and the lower end of the guide groove 33 is processed to be a limiting groove 332.

[0026] The winding die 3 is provided with a shaft hole 35, and a positioning key is provided on the side wall of the shaft hole 35.

[0027] The outer wall formed by the U-shaped die surface 31 and the plane die surface 32 is also processed with positioning grooves 34. A plurality of positioning grooves 34 are processed on the winding die 3 in a thread-like shape. The positioning grooves 34 are semicircular arc grooves, and their diameter is the diameter of the diode lead.

[0028] The tracks of the positioning grooves 34 on the planar mold surface 32 are a plurality of straight lines perpendicular to the rotating shaft 2 .

[0029] The guide groove 33 is provided with a rib adjacent to one end of the rotating shaft 2 , and a wire clamping hole 36 is processed on the rib. The center of the wire clamping hole 36 is different from the center of the guide groove 33 and is far away from the end of the positioning groove 34 .

[0030] The junction between the U-shaped die surface 31 and the plane die surface 32 is rounded.

[0031] 1Fix one end of the unseparated wire on the winding die, and then tighten the wire;

[0032] 2 Start the motor and adjust the angle appropriately after the motor rotates one circle;

[0033] 3. Stop the motor after the mold is filled;

[0034] 4 Use a blade to cut the wound wire along the guide groove;

[0035] 5 Remove the cut metal wire to obtain the diode lead.

[0036] like Figure 3 The present invention processes the lead by utilizing its elasticity, clamping a very light tube core at both ends of the lead opening to complete the assembly of the tube core and the lead. After the processing is completed, the electrode lead is cut open, so that the micro diode can be processed using traditional technology.

Claims

1. A micro diode lead processing mold, characterized in that: The invention comprises a winding die (3), wherein the winding die (3) is mounted on a rotating shaft (2) and driven by a motor (1); the side wall of the winding die (3) is combined into the shape of a diode lead by a U-shaped die surface (31) and a plane die surface (32); and a guide groove (33) is machined at the center of the plane die surface (32) along the axial direction of the rotating shaft (2); The opening of the guide groove (33) is processed to have a V-shaped opening (331), and the lower end of the guide groove (33) is processed to be a limiting groove (332); A positioning groove (34) is also machined on the outer wall formed by the combination of the U-shaped die surface (31) and the plane die surface (32); the positioning groove (34) is machined on the winding die (3) in a thread-like shape; the positioning groove (34) is a semicircular arc groove, and its diameter is the diameter of the diode lead wire; The junction between the U-shaped die surface (31) and the plane die surface (32) is rounded; The guide groove (33) is provided with a retaining edge at one end adjacent to the rotating shaft (2), and a wire clamping hole (36) is processed on the retaining edge. The center of the wire clamping hole (36) is different from the center of the guide groove (33) and is far away from the end of the positioning groove (34).

2. The micro diode lead processing mold according to claim 1, characterized in that: A rotating shaft hole (35) is machined on the winding die (3), and a positioning key is machined on the side wall of the rotating shaft hole (35).

3. The micro diode lead processing mold according to claim 1, characterized in that: The tracks of the positioning grooves (34) on the plane mold surface (32) are a plurality of straight lines perpendicular to the rotating shaft (2).

4. The micro diode lead processing mold according to claim 1, wherein the method of using the micro diode lead processing mold comprises the following steps: 1) Fix one end of the unseparated wire on the winding die, and then tighten the wire; 2) Start the motor and adjust the angle appropriately after the motor rotates one circle; 3) Stop the motor after the mold is filled; 4) Use a blade to cut the wound wire along the guide groove; 5) Remove the cut metal wire to obtain the diode lead.

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