Chip, chip assembly, core and intercooler

Abstract

The present disclosure relates to the technical field of heat exchange devices, and particularly relates to a chip, a chip assembly, a core body and an intercooler, the chip has a first flange and a first plate surface for contacting a cooled medium, the first flange is formed on the first plate surface and extends in a first direction; a raised portion and a cooled medium flow channel are formed on the first plate surface, the raised portion is located between the first flange and the cooled medium flow channel in a second direction, a blocking portion for blocking the cooled medium is formed between the first flange and the raised portion; the first direction is the extension direction of the cooled medium flow channel, and the second direction is parallel to the first plate surface and perpendicular to the first direction. The present disclosure provides a chip, a chip assembly, a core body and an intercooler in view of the fact that high-temperature gas deviates from the high-temperature gas flow channel when passing through the core body.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat exchange devices, and in particular to a chip, a chip assembly, a core body, and an intercooler. Background Art

[0002] High-temperature gas flow channels (cooled medium flow channels) and coolant flow channels (cooling medium flow channels) are formed in the core of the water-to-air intercooler, and the core is usually made up of stacked chips. High-temperature gas flow channels are formed on one side of the two side plates of the chip, and coolant flow channels are formed on the other side. The distribution areas of the high-temperature gas flow channels and the coolant flow channels on the chip should roughly overlap to improve the heat exchange performance. However, it is often the case that some high-temperature gas deviates from the high-temperature gas flow channels when passing through the core, which makes it impossible for the high-temperature gas to fully exchange heat with the coolant, thereby reducing the heat exchange performance of the intercooler. Summary of the Invention

[0003] The present disclosure provides a chip, a chip assembly, a core and an intercooler to address the current situation where part of the high-temperature gas deviates from the high-temperature gas flow path when passing through the core.

[0004] In order to achieve the above objectives, the present disclosure adopts the following technical solutions:

[0005] One aspect of the present disclosure provides a chip, the chip having a first flange and a first plate surface for contacting a cooled medium, the first flange being formed on the first plate surface and extending in a first direction;

[0006] A protrusion and a cooling medium flow channel are formed on the first plate surface, the protrusion is located between the first flange and the cooling medium flow channel in the second direction, and a blocking portion for blocking the cooling medium is formed between the first flange and the protrusion;

[0007] The first direction is an extension direction of the cooled medium flow channel, and the second direction is parallel to the first plate surface and perpendicular to the first direction.

[0008] Optionally, in the second direction, one end of the blocking portion is connected to the first flange, and the other end is connected to the protruding portion.

[0009] The beneficial effect of this technical solution is that it can block most of the cooled medium flowing between the first flange and the protrusion through the blocking portion, further reducing the proportion of the cooled medium that deviates from the cooled medium flow channel.

[0010] Optionally, the blocking portion is formed on the first flange.

[0011] The beneficial effect of this technical solution is that it makes the blocking part and the first flange an integrally formed structure, avoids the appearance of connection marks between the blocking part and the first flange, and further avoids the influence of the connection marks on the connection strength, thereby reducing the possibility of fracture between the blocking part and the first flange under the impact of the cooled medium.

[0012] Optionally, the blocking portion is a strip-shaped structure perpendicular to the first plate surface, or the blocking portion is a strip-shaped structure inclined relative to the first plate surface.

[0013] The beneficial effect of this technical solution is that during processing, the outline of the strip-shaped structure can be cut on the first flange, and then the strip-shaped structure can be bent between the first flange and the raised portion during stamping, and the processing difficulty is relatively low.

[0014] Optionally, the blocking portion is a groove body, the groove opening of the groove body is formed at the first flange, and the groove bottom of the groove body extends to the protruding portion.

[0015] The beneficial effects of this technical solution are: the trough body can be formed by stamping on the first flange, and the flow of the cooled medium is blocked by the outer wall of the trough body; the trough body can contact the first flange at multiple points at the trough mouth, so that the connection strength between the blocking part and the first flange is relatively large, and it is not easy to deform under the impact of the cooled medium, thereby improving the ability of the blocking part to block the cooled medium and further reducing the proportion of the cooled medium that deviates from the flow channel of the cooled medium; and the trough body can be stamped and formed, and the manufacturing process is relatively simple.

[0016] Optionally, the trough body is a V-shaped trough body or a U-shaped trough body.

[0017] Optionally, the number of the blocking portion is one; or the number of the blocking portion is at least two, and the blocking portions are distributed in the first direction.

[0018] The beneficial effect of this technical solution is that it can form multi-level barriers to the cooled medium flowing between the protrusion and the first flange, effectively reducing the proportion of the cooled medium that deviates from the cooled medium flow channel. When multiple barriers are arranged in the first direction, there can be at least one barrier corresponding to each protrusion.

[0019] Optionally, the chip has a second flange extending in the second direction, the second flange is formed on the first plate surface, and the second flange is located between the first flange and the cooled medium flow channel in the first direction.

[0020] The beneficial effect of this technical solution is that: before the cooled medium flows into the core body, the second flange can first block the cooled medium that wants to flow between the protrusion and the first flange, thereby reducing the proportion of the cooled medium flowing between the protrusion and the first flange, and correspondingly reducing the proportion of the cooled medium that deviates from the cooled medium flow channel.

[0021] Optionally, a projection of the second flange in the first direction covers the protruding portion and the blocking portion.

[0022] The beneficial effect of this technical solution is that it greatly increases the area of ​​the second flange, further increases the obstruction to the cooled medium that wants to flow between the protrusion and the first flange, and reduces the proportion of the cooled medium that deviates from the cooled medium flow channel.

[0023] Optionally, the second flange is connected to the first flange, and a seal is formed between the second flange and the first flange.

[0024] The beneficial effect of this technical solution is that it makes it difficult for the cooled medium to flow from between the first flange and the second flange into between the raised portion and the first flange, thereby reducing the proportion of the cooled medium that deviates from the cooled medium flow channel.

[0025] Another aspect of the present disclosure provides a chip assembly, including a first chip and a second chip stacked on each other, wherein the first chip is the chip provided by the present disclosure, and the first chip and the second chip are overlapped by the first flange.

[0026] Optionally, the second chip has a third flange overlapping the first flange, the third flange is located on the side of the first flange facing the protrusion in the second direction, and a through hole for the blocking portion to pass through is formed on the third flange.

[0027] The beneficial effect of this technical solution is that the raised portion can not only block the cooled medium, but also locate the relative position between the first chip and the second chip when assembling the chip assembly, thereby improving the assembly accuracy and efficiency.

[0028] Optionally, the second chip has a third flange overlapping the first flange, and the third flange is located on a side of the first flange away from the protrusion in the second direction.

[0029] The beneficial effect of this technical solution is that it enables the raised portion to not only block the cooled medium, but also eliminates the need to form a through hole on the third flange for the blocking portion to pass through, thereby simplifying the process steps for machining the through hole and improving production efficiency.

[0030] Optionally, the blocking portion is a groove body, the groove opening of the groove body is formed on the first flange, the groove bottom of the groove body extends to the protruding portion, and a support portion extending into the groove body is formed on the third flange.

[0031] The beneficial effect of this technical solution is that: when the blocking part is impacted by the cooled medium, it can be more strongly supported by the supporting part, reducing the degree of deformation of the blocking part under the impact, and thus can better block the cooled medium flowing between the raised part and the first flange, and reduce the proportion of the cooled medium that deviates from the cooled medium flow channel.

[0032] Optionally, the first chip has a second flange extending in a second direction, the second flange is formed on the first board surface, and a fourth flange overlapping the second flange is formed on the second chip.

[0033] The beneficial effect of this technical solution is that: by connecting the fourth flange with the second flange, the bearing capacity of the second flange under the impact of the cooling medium can be increased, and the probability of the second flange being deformed under the impact can be reduced; and, by overlapping the fourth flange with the second flange, the relative positions of the first chip and the second chip can be positioned when assembling the chip component, thereby improving assembly accuracy and efficiency.

[0034] Optionally, the first chip has a second board surface arranged away from the second chip, and the first chip has a first inter-group positioning portion formed on the second board surface.

[0035] Optionally, the first inter-group positioning portion is an inter-group positioning protrusion protruding from the second plate surface.

[0036] The beneficial effect of this technical solution is that when assembling the core body, the inter-group positioning protrusions on the chip components can cooperate with adjacent chip components for positioning, so as to improve the assembly efficiency and assembly accuracy of the core body.

[0037] Optionally, the second chip has a third board surface arranged away from the first chip, and a second inter-group positioning portion for cooperating with an inter-group positioning protrusion of an adjacent chip component is formed on the third board surface.

[0038] The beneficial effect of this technical solution is that the assembly efficiency and assembly accuracy of the core body are further improved by the second group of positioning parts.

[0039] Optionally, the inter-group positioning protrusion is formed on the protruding portion.

[0040] The beneficial effect of this technical solution is that it improves the utilization rate of the position occupied by the protrusion, and provides more sufficient space for arranging other structures on the first chip.

[0041] Optionally, the inter-group positioning protrusion has a port arranged facing the second chip, the port forms an intra-group positioning portion, and an intra-group positioning protrusion matched with the intra-group positioning portion is formed on the second chip.

[0042] The beneficial effect of this technical solution is that the assembly efficiency of the chip assembly can be improved by cooperating between the intra-group positioning portion and the intra-group positioning protrusion.

[0043] A third aspect of the present disclosure provides an intercooler, comprising the chip assembly provided by the embodiment of the present disclosure.

[0044] The technical solution provided by the present disclosure can achieve the following beneficial effects:

[0045] The chip, chip assembly, core and intercooler provided by the embodiments of the present disclosure form a blocking portion between the first flange and the protrusion to block the cooled medium that deviates from the cooled medium flow channel and flows around between the first flange and the protrusion, thereby reducing the proportion of cooled medium that deviates from the cooled medium flow channel, allowing the cooled medium and the cooling medium to exchange heat more fully, thereby improving the heat exchange performance of the intercooler.

[0046] Additional technical features and advantages of the present disclosure will be more clearly explained in the following description, or can be understood through specific practice of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] To more clearly illustrate the technical solutions of the specific embodiments of the present disclosure, the following briefly introduces the drawings required for describing the specific embodiments. Obviously, the drawings described below are some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0048] Figure 1 A schematic diagram of a three-dimensional structure of an implementation of a first chip provided in an embodiment of the present disclosure;

[0049] Figure 2 A schematic top view of a first chip according to an embodiment of the present disclosure;

[0050] Figure 3 for Figure 1 A schematic diagram of the three-dimensional structure from another angle;

[0051] Figure 4 A schematic diagram of a three-dimensional structure of an implementation of a second chip provided in an embodiment of the present disclosure;

[0052] Figure 5 A schematic diagram of a three-dimensional structure of an implementation of a chip assembly provided in an embodiment of the present disclosure;

[0053] Figure 6 for Figure 5 A schematic diagram of the three-dimensional structure from another angle;

[0054] Figure 7 A schematic top view of a chip assembly according to an embodiment of the present disclosure;

[0055] Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure at AA in the middle;

[0056] Figure 9 A schematic structural diagram of an implementation method for cooperating a first chip of one chip assembly with a second chip of another chip assembly in two adjacent chip assemblies provided in an embodiment of the present disclosure;

[0057] Figure 10 for Figure 9 A schematic diagram of a partially enlarged cross section at point B;

[0058] Figures 11 to 16 Schematic diagrams of the partial structures of six implementations of the chip components provided in the embodiments of the present disclosure.

[0059] Reference numerals:

[0060] 100 - first chip; 110 - intra-group positioning unit;

[0061] 120- second flange; 130- raised portion;

[0062] 140-blocking portion; 150-first plate surface;

[0063] 160-first flange; 170-inter-group positioning protrusion;

[0064] 180-second board surface; 200-second chip;

[0065] 210- positioning protrusion within the group; 220- third flange;

[0066] 221-through hole; 230-fourth flange;

[0067] 240 - third plate surface; 250 - second inter-group positioning portion;

[0068] 260-support portion; 270-fourth panel;

[0069] 300- Cooling medium flow channel. DETAILED DESCRIPTION

[0070] The technical solutions of the present disclosure are described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described are only a portion of the embodiments of the present disclosure, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present disclosure without creative effort are within the scope of protection of the present disclosure.

[0071] In the description of this disclosure, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this disclosure and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this disclosure. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0072] In the description of this disclosure, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on the specific circumstances.

[0073] like Figures 1 to 16 As shown, one aspect of the present disclosure provides a chip, the chip having a first flange 160 and a first plate surface 150 for contacting a cooled medium, the first flange 160 being formed on the first plate surface 150 and extending in a first direction;

[0074] A protrusion 130 and a cooling medium flow channel 300 are formed on the first plate surface 150. The protrusion 130 is located between the first flange 160 and the cooling medium flow channel 300 in the second direction. A blocking portion 140 for blocking the cooling medium is formed between the first flange 160 and the protrusion 130.

[0075] The first direction is the extending direction of the cooled medium flow channel 300 , and the second direction is parallel to the first plate surface 150 and perpendicular to the first direction.

[0076] The cooling medium and the cooled medium in the embodiments of the present disclosure can be either liquid or gas; the above-mentioned protrusion 130 can be used to be fixedly connected to the protrusion 130 on the adjacent chip, and can also be used to cooperate with the intra-group positioning protrusion 210 on the adjacent chip; the chip can be formed with a protrusion 130 at both ends in the second direction, and a cooled medium flow channel 300 is formed between the two protrusions 130 arranged in the second direction.

[0077] The chip provided in the embodiment of the present disclosure forms a blocking portion 140 between the first flange 160 and the raised portion 130 to block the cooled medium that deviates from the cooled medium flow channel 300 and flows around the first flange 160 and the raised portion 130, thereby reducing the proportion of the cooled medium that deviates from the cooled medium flow channel 300, allowing the cooled medium and the cooling medium to exchange heat more fully, thereby improving the heat exchange performance of the intercooler.

[0078] Optionally, in the second direction, one end of the blocking portion 140 is connected to the first flange 160, and the other end is connected to the protruding portion 130. In this way, the blocking portion 140 can block most of the cooled medium flowing between the first flange 160 and the protruding portion 130, further reducing the proportion of the cooled medium that deviates from the cooled medium flow channel 300.

[0079] Optionally, the blocking portion 140 is formed on the first flange 160. This allows the blocking portion 140 and the first flange 160 to be an integrally formed structure, thereby avoiding the appearance of connection marks between the blocking portion 140 and the first flange 160, and further avoiding the influence of the connection marks on the connection strength, thereby reducing the possibility of fracture between the blocking portion 140 and the first flange 160 under the impact of the cooling medium. Of course, if Figure 16 As shown, the blocking portion 140 may also be formed on the protrusion 130 .

[0080] like Figure 14 and Figure 15 As shown, the blocking portion 140 can optionally be a strip-shaped structure perpendicular to the first plate surface 150, or the blocking portion 140 can be a strip-shaped structure arranged obliquely relative to the first plate surface 150. During processing, the outline of the strip-shaped structure can be cut on the first flange 160, and then the strip-shaped structure can be bent between the first flange 160 and the protrusion 130 by stamping, which is relatively easy to process.

[0081] Optionally, the blocking portion 140 is a groove body, the groove opening of the groove body being formed at the first flange 160, and the groove bottom extending to the protrusion 130. The groove body can be formed by stamping on the first flange 160, and the flow of the cooled medium is blocked by the outer wall of the groove body. The groove body can contact the first flange 160 at multiple points at the groove opening, thereby increasing the connection strength between the blocking portion 140 and the first flange 160, making it less likely to deform under the impact of the cooled medium, thereby improving the blocking portion 140's ability to block the cooled medium and further reducing the proportion of the cooled medium that deviates from the cooled medium flow channel 300. Moreover, the groove body can be stamped, and the manufacturing process is relatively simple.

[0082] like Figures 11 to 13 and Figure 16 As shown, optionally, the trough body is a V-shaped trough body or a U-shaped trough body.

[0083] Optionally, there is one blocking portion 140; or, there are at least two blocking portions 140, each of which is distributed in the first direction. This can form multiple levels of obstruction for the cooled medium flowing between the protrusion 130 and the first flange 160, effectively reducing the proportion of the cooled medium that deviates from the cooled medium flow channel 300. When multiple blocking portions 140 are arranged in the first direction, at least one blocking portion 140 can be located at each protrusion 130.

[0084] Optionally, the chip has a second flange 120 extending in the second direction. The second flange 120 is formed on the first plate surface 150 and is located in the first direction between the first flange 160 and the cooled medium flow channel 300. The second flange 120 can block the cooled medium that is about to flow between the raised portion 130 and the first flange 160 before it flows into the core body, thereby reducing the proportion of cooled medium that flows between the raised portion 130 and the first flange 160, and correspondingly reducing the proportion of cooled medium that deviates from the cooled medium flow channel 300.

[0085] Optionally, the projection of the second flange 120 in the first direction covers the protrusion 130 and the blocking portion 140. This significantly increases the area of ​​the second flange 120, further increasing the blocking of the cooled medium that intends to flow between the protrusion 130 and the first flange 160, and reducing the proportion of the cooled medium that deviates from the cooled medium flow channel 300.

[0086] Optionally, the second flange 120 is connected to the first flange 160, and a seal is formed between the second flange 120 and the first flange 160. This makes it difficult for the cooled medium to flow from between the first flange 160 and the second flange 120 into between the protrusion 130 and the first flange 160, thereby reducing the proportion of the cooled medium that deviates from the cooled medium flow channel 300. The connection between the second flange 120 and the first flange 160 can be an integral connection, or the second flange 120 and the first flange 160 can be formed separately and then connected to each other.

[0087] Another aspect of the present disclosure provides a chip assembly including a first chip 100 and a second chip 200 stacked on each other. The first chip 100 is the chip provided in an embodiment of the present disclosure. The first chip 100 and the second chip 200 are overlapped by a first flange 160 .

[0088] The chip assembly provided in the embodiment of the present disclosure adopts the chip provided in the embodiment of the present disclosure. By forming a blocking portion 140 between the first flange 160 and the raised portion 130, the cooled medium that deviates from the cooled medium flow channel 300 and flows around the first flange 160 and the raised portion 130 is blocked, thereby reducing the proportion of the cooled medium that deviates from the cooled medium flow channel 300, allowing the cooled medium and the cooling medium to exchange heat more fully, thereby improving the heat exchange performance of the intercooler.

[0089] like Figure 12 and Figure 15 As shown, the second chip 200 optionally has a third flange 220 that overlaps the first flange 160. The third flange 220 is located on the side of the first flange 160 facing the raised portion 130 in the second direction. A through hole 221 for the blocking portion 140 to pass through is formed in the third flange 220. This allows the raised portion 130 to not only block the cooling medium, but also to position the first chip 100 and the second chip 200 relative to each other during chip assembly, thereby improving assembly accuracy and efficiency.

[0090] Optionally, the second chip 200 has a third flange 220 that overlaps the first flange 160. The third flange 220 is located in the second direction on the side of the first flange 160 that is away from the raised portion 130. This allows the raised portion 130 to not only block the cooled medium, but also eliminates the need to form a through hole 221 in the third flange 220 for the blocking portion 140 to pass through, thereby simplifying the process steps for forming the through hole 221 and improving production efficiency.

[0091] Optionally, the blocking portion 140 is a groove, the groove opening of which is formed at the first flange 160, the groove bottom of which extends to the protrusion 130, and a support portion 260 extending into the groove is formed on the third flange 220. This ensures that the blocking portion 140 receives stronger support from the support portion 260 when impacted by the cooling medium, reducing the degree of deformation of the blocking portion 140 under the impact, thereby effectively blocking the cooling medium flowing between the protrusion 130 and the first flange 160, and reducing the proportion of the cooling medium that deviates from the cooling medium flow channel 300.

[0092] Optionally, the first chip 100 has a second flange 120 extending in the second direction, the second flange 120 being formed on the first board surface 150, and a fourth flange 230 overlapping the second flange 120 being formed on the second chip 200. The connection between the fourth flange 230 and the second flange 120 can increase the ability of the second flange 120 to withstand the impact of the cooling medium and reduce the probability of deformation of the second flange 120 under such impact. Furthermore, the overlapping connection between the fourth flange 230 and the second flange 120 can also facilitate the relative positioning of the first chip 100 and the second chip 200 during chip assembly, thereby improving assembly accuracy and efficiency.

[0093] Optionally, the first chip 100 has a second board surface 180 disposed away from the second chip 200 , and the first chip 100 has a first inter-group positioning portion formed on the second board surface. The first inter-group positioning portion is an inter-group positioning protrusion 170 protruding from the second board surface 180 .

[0094] When assembling the core, the inter-group positioning protrusions 170 on the chip assembly can cooperate with adjacent chip assemblies for positioning, so as to improve the assembly efficiency and assembly accuracy of the core.

[0095] Optionally, the second chip 200 has a third board surface 240 that is disposed away from the first chip 100, and a second inter-group positioning portion 250 is formed on the third board surface 240 for cooperating with the inter-group positioning protrusion 170 of the adjacent chip assembly. The second inter-group positioning portion 250 further improves the assembly efficiency and assembly accuracy of the core. Of course, if Figure 10 As shown, the second inter-group positioning portion 250 can also be a protruding structure, and the first inter-group positioning portion is a through-hole structure, so that the protruding structure cooperates with the through-hole structure to perform positioning between two adjacent chip components.

[0096] Optionally, the inter-group positioning protrusions 170 are formed on the protruding portions 130 , which improves the utilization rate of the space occupied by the protruding portions 130 and provides more sufficient space for arranging other structures on the first chip 100 .

[0097] Optionally, the inter-group positioning protrusion 170 has a port facing the second chip 200, which forms the intra-group positioning portion 110. The second chip 200 is formed with an intra-group positioning protrusion 210 that cooperates with the intra-group positioning portion 110. The cooperation between the intra-group positioning portion 110 and the intra-group positioning protrusion 210 can improve the assembly efficiency of the chip assembly. The inter-group positioning protrusion 170 can be a groove with a notch located on the protrusion 130, and the intra-group positioning portion 110 is formed at the notch. This allows the intra-group positioning portion 110 to be formed simultaneously with the processing of the inter-group positioning protrusion 170, thereby improving production efficiency. The second chip 200 has a fourth plate surface 270 facing the first chip 100, and the intra-group positioning protrusion 210 can be located on this fourth plate surface 270.

[0098] A third aspect of the present disclosure provides an intercooler, comprising the chip assembly provided in an embodiment of the present disclosure.

[0099] The intercooler provided by the embodiment of the present disclosure adopts the chip assembly provided by the embodiment of the present disclosure. By forming a blocking portion 140 between the first flange 160 and the raised portion 130, the cooled medium that deviates from the cooled medium flow channel 300 and flows around the first flange 160 and the raised portion 130 is blocked, thereby reducing the proportion of the cooled medium that deviates from the cooled medium flow channel 300, allowing the cooled medium and the cooling medium to exchange heat more fully, thereby improving the heat exchange performance of the intercooler.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A chip, characterized in that The chip has a first flange and a first plate surface for contacting a cooling medium, wherein the first flange is formed on the first plate surface and extends in a first direction; A protrusion and a cooling medium flow channel are formed on the first plate surface, the protrusion is located between the first flange and the cooling medium flow channel in the second direction, and a blocking portion for blocking the cooling medium is formed between the first flange and the protrusion; The first direction is the extension direction of the cooling medium flow channel, and the second direction is parallel to the first plate surface and perpendicular to the first direction; In the second direction, one end of the blocking portion is connected to the first flange, and the other end is connected to the protruding portion; The chip has a second flange extending in a second direction, the second flange is formed on the first plate surface, and the second flange is located between the first flange and the cooled medium flow channel in the first direction; the projection of the second flange in the first direction covers the protrusion and the blocking portion.

2. The chip according to claim 1, characterized in that The blocking portion is formed on the first flange.

3. The chip according to claim 2, characterized in that The blocking portion is a strip-shaped structure perpendicular to the first plate surface, or the blocking portion is a strip-shaped structure inclined relative to the first plate surface.

4. The chip according to claim 2, characterized in that The blocking portion is a groove body, the groove opening of the groove body is formed at the first flange, and the groove bottom of the groove body extends to the protruding portion.

5. The chip according to claim 4, characterized in that The trough body is a V-shaped trough body or a U-shaped trough body.

6. The chip according to claim 1, characterized in that The number of the blocking portion is one; or the number of the blocking portion is at least two, and the blocking portions are distributed in the first direction.

7. The chip according to any one of claims 1 to 6, characterized in that: The second flange is connected to the first flange, and a seal is formed between the second flange and the first flange.

8. A chip assembly, characterized in that The device comprises a first chip and a second chip stacked on each other, wherein the first chip is the chip according to any one of claims 1 to 7, and the first chip and the second chip are overlapped by the first flange.

9. The chip assembly according to claim 8, characterized in that: The second chip has a third flange overlapping the first flange, the third flange is located on the side of the first flange facing the protrusion in the second direction, and a through hole for the blocking portion to pass through is formed on the third flange.

10. The chip assembly according to claim 8, wherein: The second chip has a third flange overlapping the first flange, and the third flange is located on a side of the first flange away from the protruding portion in the second direction.

11. The chip assembly according to claim 10, wherein: The blocking portion is a groove body, the groove opening of the groove body is formed on the first flange, the groove bottom of the groove body extends to the protruding portion, and a supporting portion extending into the groove body is formed on the third flange.

12. The chip assembly according to claim 8, wherein: The first chip has a second flange extending in a second direction, the second flange is formed on the first board surface, and a fourth flange overlapping the second flange is formed on the second chip.

13. The chip assembly according to claim 8, wherein: The first chip has a second board surface that is arranged away from the second chip, and the first chip has a first inter-group positioning portion formed on the second board surface.

14. The chip assembly according to claim 13, wherein: The first inter-group positioning portion is an inter-group positioning protrusion protruding from the second plate surface.

15. The chip assembly according to claim 14, wherein: The second chip has a third board surface arranged away from the first chip, and a second inter-group positioning portion for cooperating with the inter-group positioning protrusion of the adjacent chip assembly is formed on the third board surface.

16. The chip assembly according to claim 14, wherein: The inter-group positioning protrusion is formed on the protruding portion.

17. The chip assembly according to claim 16, wherein: The inter-group positioning protrusion has a port arranged facing the second chip, the port forming an intra-group positioning portion, and an intra-group positioning protrusion matched with the intra-group positioning portion is formed on the second chip.

18. Intercooler, characterized in that The chip assembly comprises the chip assembly according to any one of claims 8 to 17.

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