Coil assembly and method for manufacturing the same

Abstract

The present invention provides a coil component and a method for manufacturing the coil component, the coil component comprising: a main body; a coil portion embedded in the main body; and an insulating substrate embedded in the main body and having a supporting member supporting the coil portion and a first connecting portion and a second connecting portion extending from the supporting member to opposite side surfaces of the main body, respectively, and each of the first connecting portion and the second connecting portion comprises a pair of connecting portions separated from each other.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2018-0131682 filed on October 31, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a coil component and a method for manufacturing the coil component. Background Art

[0003] An inductor, a coil component, is a typical passive electronic component used in electronic devices along with resistors and capacitors.

[0004] As electronic devices have been implemented with increasingly higher levels of performance and have become increasingly smaller, the number of electronic components used in the electronic devices has increased and the sizes of the electronic components have decreased. Summary of the invention

[0005] An aspect of the present disclosure is to provide a coil component capable of preventing a coil part from being deformed in a process of stacking and pressing a magnetic composite sheet and a method of manufacturing the coil component.

[0006] Another aspect of the present disclosure is to provide a coil component capable of reducing a defect rate caused by deformation of a coil part and having a low profile, and a method of manufacturing the coil component.

[0007] According to one aspect of the present disclosure, a coil component includes: a main body; a coil portion embedded in the main body; and an insulating substrate embedded in the main body and having a supporting member supporting the coil portion and a first connecting portion and a second connecting portion extending from the supporting member to opposite side surfaces of the main body, respectively, and each of the first connecting portion and the second connecting portion includes a pair of connecting portions separated from each other.

[0008] According to another aspect of the present disclosure, a method for manufacturing a coil component includes: forming a plurality of coil portions on an insulating substrate; removing a portion of the insulating substrate on which the plurality of coil portions are not formed; forming a main body by stacking magnetic composite sheets including insulating resin and magnetic powder on the insulating substrate; and forming a first external electrode and a second external electrode on a surface of the main body; wherein removing the portion of the insulating substrate includes: forming a first connecting portion and a second connecting portion, and each of the first connecting portion and the second connecting portion includes a pair of connecting portions in the insulating substrate.

[0009] According to another aspect of the present disclosure, a coil component includes: a main body; a coil portion embedded in the main body; and an insulating substrate embedded in the main body and having a supporting member supporting the coil portion, wherein the insulating substrate also includes a pair of first connecting portions and a pair of second connecting portions, the pair of first connecting portions are separated from each other, protruding from the supporting member and exposed to one side surface of the main body, and the pair of second connecting portions are separated from each other, protruding from the supporting member and exposed to another side surface of the main body opposite to the one side surface of the main body.

[0010] Other features and aspects will be apparent from the following detailed description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a schematic perspective view of a coil component according to an exemplary embodiment of the present disclosure;

[0013] Figure 2 is a schematic plan view showing a coil component according to an exemplary embodiment of the present disclosure;

[0014] Figure 3 It is along Figure 1 A cross-sectional view taken along line II';

[0015] Figure 4 It is along Figure 1 A cross-sectional view taken along line II-II'; and

[0016] Figures 5 to 7 are views sequentially illustrating a method of manufacturing a coil component according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0017] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0018] However, the present disclosure may be exemplified in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0019] Throughout the specification, it will be understood that when an element such as a layer, region, or wafer (substrate) is referred to as being "on", "connected to", or "bonded to" another element, the element may be directly "on", "connected to", or "bonded to" the other element, or there may be other elements between them. In contrast, when an element is referred to as being "directly on", "directly connected to", or "directly bonded to" another element, there may be no elements or layers between them. The same reference numerals always indicate the same element. As used herein, the term "and / or" includes any one of the relevant listed items and any combination of any two or more.

[0020] It will be apparent that, although the terms "first," "second," "third," and the like may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions should not be limited by these terms. These terms are merely used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Thus, the first member, first component, first region, first layer, or first portion discussed below may be referred to as a second member, second component, second region, second layer, or second portion without departing from the teachings of the exemplary embodiments.

[0021] For ease of description, spatially relative terms such as "above," "above," "below," and "below" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. It will be understood that the spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, the elements described as being "above" or "above" other elements will then be positioned as being "below" or "below" the other elements. Therefore, the term "above" may include both "above" and "below" orientations depending on the specific orientation of the drawing. The device may also be positioned otherwise (rotated 90 degrees or in other orientations), and the spatially relative terms used herein may be interpreted accordingly.

[0022] The terms used herein describe only specific embodiments, and the present disclosure is not limited thereto. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. It will be further understood that when used in this specification, the terms "include" and / or "comprise" list the existence of stated features, quantities, steps, operations, components, elements or their groups, but do not exclude the existence or addition of one or more other features, quantities, steps, operations, components, elements or their groups.

[0023] Hereinafter, embodiments of the present disclosure will be described with reference to schematic diagrams showing embodiments of the present disclosure. For example, in the accompanying drawings, modifications of the shapes shown may be predicted due to manufacturing techniques and / or tolerances. Thus, for example, embodiments of the present disclosure should not be interpreted as being limited to the specific shapes of the regions shown herein, but rather should be interpreted as including changes in shapes caused in manufacturing. The following embodiments may also be constructed by one embodiment or a combination of embodiments.

[0024] The contents of the present disclosure described below may have various configurations, and only required configurations are proposed here, but are not limited thereto.

[0025] In the drawings, the L direction may be defined as a first direction or a length direction, the W direction may be defined as a second direction or a width direction, and the T direction may be defined as a third direction or a thickness direction.

[0026] Hereinafter, a coil component according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. Referring to the accompanying drawings, the same or corresponding components are denoted by the same reference numerals, and repeated descriptions thereof will be omitted.

[0027] Various types of electronic components are used in electronic devices. Here, among these electronic components, various types of coil components can be appropriately used for the purpose of removing noise and the like.

[0028] In other words, the coil component in the electronic device can be used as a power inductor, a high frequency (HF) inductor, a normal magnetic bead, a GHz magnetic bead, a common mode filter, etc.

[0029] Figure 1 is a schematic perspective view of a coil component according to an exemplary embodiment of the present disclosure. Figure 2 is a schematic plan view showing a coil component according to an exemplary embodiment of the present disclosure. Figure 3 It is along Figure 1 A cross-sectional view taken along line II'. Figure 4 It is along Figure 1 A cross-sectional view taken along line II-II'.

[0030] Reference Figures 1 to 4 , a coil component 1000 according to an exemplary embodiment of the present disclosure includes a body 100 , an insulating substrate 200 , a coil part 300 , external electrodes 400 and 500 , and may further include an insulating film 600 .

[0031] The body 100 forms an appearance of the coil component 1000 according to an exemplary embodiment of the present disclosure, and the insulating substrate 200 and the coil part 300 are embedded in the body 100 .

[0032] The main body 100 may be a hexahedron as a whole.

[0033] based on Figure 1 and Figure 4 , the body 100 includes a first surface 101 and a second surface 102 opposite to each other in the length direction L, a third surface 103 and a fourth surface 104 opposite to each other in the width direction W, and a fifth surface 105 and a sixth surface 106 opposite to each other in the thickness direction T. Each of the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the body 100 may correspond to a wall of the body 100 connecting the fifth surface 105 of the body 100 to the sixth surface 106. Hereinafter, both end surfaces of the body 100 refer to the first surface 101 and the second surface 102 of the body 100, both side surfaces of the body 100 refer to the third surface 103 and the fourth surface 104 of the body 100, one surface of the body 100 refers to the sixth surface 106 of the body 100, and the other surface of the body 100 refers to the fifth surface 105 of the body 100.

[0034] By way of example, the main body 100 may be formed to allow the coil component 1000 having the external electrodes 400 and 500 (described later) according to the exemplary embodiment of the present disclosure to have a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. As another example, the main body 100 may be formed to allow the coil component 1000 according to the exemplary embodiment of the present disclosure to be formed to have a length of 2.0 mm, a width of 1.6 mm, and a thickness of 0.55 mm, or a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.55 mm, or a length of 1.2 mm, a width of 1.0 mm, and a thickness of 0.55 mm. In addition, as will be described later, since the coil component 1000 has a low profile, the heat and pressure applied to the insulating substrate 200 and the coil part 300 in the process of forming the main body 100 may be increased. Therefore, the first connection portion 221 and the second connection portion 222 applied to the exemplary embodiment of the present disclosure may be applied to the case where the thickness of the coil component is less than the above thickness. Therefore, the exemplary embodiments of the present disclosure do not limit the thickness range of the coil component and may be applied to a case where the thickness of the coil component is formed to be smaller than the above-mentioned thickness.

[0035] The body 100 may include a magnetic material and an insulating resin 10. In detail, the body 100 may be formed by stacking one or more magnetic composite sheets ( Figure 7 However, the body 100 may have a structure different from the structure in which the magnetic material is dispersed in the insulating resin 10. For example, the body 100 may be formed using a magnetic material such as ferrite.

[0036] By way of example, the magnetic material may be magnetic powder 20, and may be ferrite powder or metal magnetic powder.

[0037] For example, the ferrite powder can be at least one of spinel ferrite (such as Mg-Zn-based ferrite, Mn-Zn-based ferrite, Mn-Mg-based ferrite, Cu-Zn-based ferrite, Mg-Mn-Sr-based ferrite, Ni-Zn-based ferrite, etc.), hexagonal ferrite (such as Ba-Zn-based ferrite, Ba-Mg-based ferrite, Ba-Ni-based ferrite, Ba-Co-based ferrite, Ba-Ni-Co-based ferrite, etc.), garnet-type ferrite (such as Y-based ferrite, etc.) and Li-based ferrite.

[0038] The metal magnetic powder may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). For example, the metal magnetic powder may be at least one of pure iron powder, Fe-Si-based alloy powder, Fe-Si-Al-based alloy powder, Fe-Ni-based alloy powder, Fe-Ni-Mo-based alloy powder, Fe-Ni-Mo-Cu-based alloy powder, Fe-Co-based alloy powder, Fe-Ni-Co-based alloy powder, Fe-Cr-based alloy powder, Fe-Cr-Si-based alloy powder, Fe-Si-Cu-Nb-based alloy powder, Fe-Ni-Cr-based alloy powder and Fe-Cr-Al-based alloy powder.

[0039] The metal magnetic powder may be amorphous or crystalline. For example, the metal magnetic powder may be Fe-Si-B-Cr based amorphous alloy powder, but is not limited thereto.

[0040] Each particle of the ferrite powder and the metal magnetic powder may have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto.

[0041] The body 100 may include two or more types of magnetic powders 20 dispersed in an insulating resin. Here, different types of magnetic powders 20 mean that two or more types of magnetic powders 20 dispersed in the insulating resin 10 are distinguished from each other by any one of the average diameter, composition, crystallinity, and shape of their particles. For example, the body 100 may include two or more types of magnetic powders 20 having different average particle sizes from each other.

[0042] The insulating resin 10 may include one of epoxy resin, polyimide, liquid crystal polymer, and a mixture thereof, but is not limited thereto.

[0043] The body 100 includes a core 110 passing through a coil part 300 (to be described later). The core 110 can be formed by using a magnetic composite sheet ( Figure 7 30) is formed by filling the through hole of the coil part 300, but is not limited thereto.

[0044] The body 100 may have an effective part 120 and a covering part 130 disposed on the effective part 120. The effective part 120 refers to an area where the coil component 1000 according to the exemplary embodiment of the present disclosure plays a substantial role due to the coil part 300 of the body 100, and the covering part 130 refers to another area that assists the function of the effective part 120 of the body 100. By way of example only and not limitation, based on Figure 3 and Figure 4 , and based on the area of ​​the body 100 disposed in the upper portion of the insulating substrate 200, the effective portion 120 may refer to an area in which the second coil pattern 312 of the coil part 300 is disposed, and the covering portion 130 may refer to an area disposed on the effective portion 120. As another example, the effective portion 120 may be defined as an area of ​​the body 100 corresponding to the sum of the thickness of the first coil pattern 311 and the thickness of the second coil pattern 312 and the thickness of the insulating substrate 200, and the covering portion 130 may be defined as another area of ​​the body 100 disposed on the first coil pattern 311 and the second coil pattern 312. Hereinafter, the effective portion 120 and the covering portion 130 applied to the present disclosure will be described in the sense of the former.

[0045] The thickness a of the effective part 120 is formed to be greater than the thickness b of the covering part 130. Therefore, the coil component 1000 according to the exemplary embodiment of the present disclosure can ensure the thickness of the area for playing a substantial role, while reducing the thickness of the entire coil component 1000, that is, the coil component 1000 can have a low profile. Only by way of example and not limitation, the effective part 120 can be formed to have a magnetic permeability greater than the magnetic permeability of the covering part 130. To this end, the magnetic powder of the effective part 120 can have a magnetic permeability greater than the magnetic permeability of the magnetic powder of the covering part 130. Alternatively or simultaneously, the filling rate of the magnetic powder of the effective part 120 can be greater than the filling rate of the magnetic powder of the covering part 130.

[0046] The insulating substrate 200 may be embedded in the body 100. The insulating substrate 200 may be provided as a component supporting a coil part 300 (to be described later).

[0047] The insulating substrate 200 may be formed as an insulating material including a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a photosensitive insulating resin, or may be formed as an insulating resin in which a reinforcement such as glass fiber or an inorganic filler is impregnated. As an example, the insulating substrate 200 may be formed using an insulating material such as a prepreg, ABF (Ajinomoto build-up film), FR-4, bismaleimide triazine (BT) film, a photosensitive dielectric (PID) film, but is not limited thereto.

[0048] The inorganic filler can be one or more selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3).

[0049] When the insulating substrate 200 is formed using an insulating material including a reinforcement, the insulating substrate 200 can provide more excellent rigidity. When the insulating substrate 200 is formed using an insulating material that does not include glass fiber, the insulating substrate 200 is conducive to reducing the thickness of the entire coil part 300, that is, it is conducive to having a low profile. When the insulating substrate 200 is formed using an insulating material including a photosensitive insulating resin, the number of processes for forming the coil part 300 is reduced, thereby facilitating the reduction of manufacturing costs and enabling the formation of fine vias.

[0050] The insulating substrate 200 includes a supporting member 210 that supports a coil portion 300 (to be described later) and a first connection portion 221 and a second connection portion 222 that extend from the supporting member 210 to the third surface 103 and the fourth surface 104 of the body 100 that are opposite to each other. The supporting member 210 is a member that supports the first coil pattern 311, the second coil pattern 312, the end 311-1 of the first coil pattern 311, and the end 312-1 of the second coil pattern 312 of the coil portion 300, and can be formed into a shape corresponding to the shape of the first coil pattern 311, the second coil pattern 312, the end 311-1 of the first coil pattern 311, and the end 312-1 of the second coil pattern 312. As will be described later, when the magnetic composite sheets ( Figure 730), the first connection part 221 and the second connection part 222 can prevent deformation of each unit coil part 300 by connecting adjacent unit coil parts 300 to each other. The first connection part 221 and the second connection part 222 are formed to have the following form: connecting the unit support member 210, supporting adjacent unit coil parts 300, and then separated by the operation of separating the unit coil parts 300 into individuals to be exposed to the third surface 103 and the fourth surface 104 of the body 100 of each unit coil assembly 1000, respectively.

[0051] According to an exemplary embodiment of the present disclosure, each of the first connection portion 221 and the second connection portion 222 is provided as a pair of connection portions separated from each other. Figure 1 , Figure 2 and Figure 4 As shown, the first connection portion 221 extends from the support member 210 of the insulating substrate 200, each end surface of which is exposed to the third surface 103 of the main body 100, and the first connection portion is set as a pair of first connection portions separated from each other. The second connection portion 222 extends from the support member 210, each end surface of which is exposed to the fourth surface 104 of the main body 100, and the second connection portion is set as a pair of second connection portions separated from each other. Since the coil component 1000 has a low profile, the pressure and temperature applied to the main body 100 during the formation of the main body 100 of the coil component 1000 increase. In this case, the possibility of deformation of the coil part 300 increases. According to an exemplary embodiment of the present disclosure, each of the first connection portion 221 and the second connection portion 222 is set as a pair of connection portions separated from each other. Therefore, during the formation of the main body 100, the stress applied to the coil part 300 and the insulating substrate 200 can be reduced. That is, as an example, the magnetic composite sheet ( Figure 7 A portion of the coil 30) can flow into the space between the pair of first connection parts 221 separated from each other, so that the deformation of the insulating substrate 200 can be significantly reduced. Therefore, the deformation of the coil part 300 provided on the insulating substrate 200 can be significantly reduced.

[0052] The first connection portion 221 and the second connection portion 222 may be formed symmetrically relative to each other. Here, "symmetrically formed" includes the concept of point symmetry and line symmetry. By way of example only and not limitation, the spacing distance between a pair of first connection portions 221 may correspond to the spacing distance between a pair of second connection portions 222. As another example, relative to Figure 2 In the direction of the left side, the first connection portion 221 and the second connection portion 222 disposed on the left side may be located together on a line segment parallel to the width direction W of the main body 100, and relative to Figure 2, the first connection portion 221 disposed on the right side and the second connection portion 222 disposed on the right side may be located together on another line segment parallel to the width direction W of the body 100. In the former and the latter cases, during the formation of the body 100, the stress applied to the insulating substrate 200 and the coil part 300 is relatively uniformly distributed in the width direction W of the body 100, and thus the deformation of the coil part 300 can be significantly reduced.

[0053] The coil part 300 is embedded in the body 100, thereby having the characteristics of a coil component. For example, when the coil component 1000 according to the exemplary embodiment of the present disclosure is used as a power inductor, the coil part 300 can be used to stabilize the power of the electronic device by storing the electric field as a magnetic field and maintaining the output voltage.

[0054] The coil part 300 includes coil patterns 311 and 312 and a via 320. Figure 1 , Figure 3 and Figure 4 The first coil pattern 311 and the end 311-1 of the first coil pattern 311 are disposed on the lower surface of the insulating substrate 200 opposite to the sixth surface 106 of the body 100, and the second coil pattern 312 and the end 312-1 of the second coil pattern 312 are disposed on the upper surface of the insulating substrate 200. The via 320 passes through the insulating substrate 200 to contact each of the first coil pattern 311 and the second coil pattern 312. Thus, the coil portion 300 can be used as a single coil that forms one or more turns around the core 110 as a whole.

[0055] Each of the first coil pattern 311 and the second coil pattern 312 may have a planar spiral shape forming at least one turn around the core 110 set as an axis. As an example, the first coil pattern 311 may form at least one turn around the core 110 set as an axis in the lower portion of the insulation substrate 200.

[0056] At least one of the via 320, coil patterns 311 and 312 may include one or more conductive layers. As an example, when the second coil pattern 312, the end 312-1 of the second coil pattern 312 and the via 320 are formed on the other side of the insulating substrate 200 by plating, each of the second coil pattern 312, the end 312-1 of the second coil pattern 312 and the via 320 may include a seed layer such as an electroless plating layer and an electroplating layer. Here, the electroplating layer may have a single-layer structure, or may have a multi-layer structure. The electroplating layer with a multi-layer structure may have a conformal film structure in which one electroplating layer is covered by another electroplating layer, or may have a form in which one electroplating layer is only stacked on one side of another electroplating layer. The seed layer of the second coil pattern 312, the seed layer of the end 312-1 of the second coil pattern 312 and the seed layer of the via 320 are formed integrally, so that no boundary may be formed between them, but the embodiment is not limited thereto. The plating layer of the second coil pattern 312 , the plating layer of the end portion 312 - 1 of the second coil pattern 312 , and the plating layer of the via hole 320 are integrally formed, and thus no boundary may be formed therebetween, but the embodiment is not limited thereto.

[0057] As another example, relative to Figure 1 , Figure 3 and Figure 4 In the direction of the first coil pattern 311 and the end 311-1 of the first coil pattern 311 disposed on the lower surface of the insulating substrate 200 and the second coil pattern 312 and the end 312-1 of the second coil pattern 312 disposed on the upper surface of the insulating substrate 200 are separately arranged from each other, and then batch stacked on the insulating substrate 200 to form the coil portion 300. In this case, the via 320 may include a high melting point metal layer and a low melting point metal layer, and the low melting point metal layer has a melting point lower than the melting point of the high melting point metal layer. Here, the low melting point metal layer may be formed using a solder including lead (Pb) and / or tin (Sn). By way of example, since the pressure and temperature during batch stacking cause at least a portion of the low melting point metal layer to melt, an intermetallic compound (IMC) layer may be formed at the boundary between the low melting point metal layer and the second coil pattern 312 and / or at the boundary between the low melting point metal layer and the first coil pattern 311.

[0058] based on Figure 3 and Figure 4, the first coil pattern 311 and the end 311-1 of the first coil pattern 311 may protrude from the lower surface of the insulating substrate 200, and the second coil pattern 312 and the end 312-1 of the second coil pattern 312 may protrude from the upper surface of the insulating substrate 200. As another example, the first coil pattern 311 and the end 311-1 of the first coil pattern 311 protrude from the lower surface of the insulating substrate 200, while the second coil pattern 312 and the end 312-1 of the second coil pattern 312 are embedded in the upper surface of the insulating substrate 200. Therefore, the upper surface of each of the second coil pattern 312 and the end 312-1 of the second coil pattern 312 may be exposed to the upper surface of the insulating substrate 200. In this case, the recess is formed in the upper surface of the second coil pattern 312 and / or the end 312-1 of the second coil pattern 312. Therefore, the upper surface of the second coil pattern 312 and / or the end 312-1 of the second coil pattern 312 and the upper surface of the insulating substrate 200 may not be located on the same plane. As another example, the second coil pattern 312 and the end 312-1 of the second coil pattern 312 protrude from the upper surface of the insulating substrate 200, while the first coil pattern 311 and the end 311-1 of the first coil pattern 311 are embedded in the lower surface of the insulating substrate 200. Therefore, the lower surface of each of the first coil pattern 311 and the end 311-1 of the first coil pattern 311 may be exposed to the lower surface of the insulating substrate 200. In this case, a recess is formed in the lower surface of the first coil pattern 311 and / or the end 311-1 of the first coil pattern 311. Therefore, the lower surface of the first coil pattern 311 and / or the end 311-1 of the first coil pattern 311 and the lower surface of the insulating substrate 200 may not be located on the same plane.

[0059] Each of the via 320, the coil patterns 311 and 312 may include a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof, but is not limited thereto.

[0060] The external electrodes 400 and 500 are disposed on the surface of the body 100 to be respectively connected to the two ends 311-1 and 312-1 of the coil part 300. According to an exemplary embodiment of the present disclosure, the two ends 311-1 and 312-1 of the coil part 300 are respectively exposed to the first surface 101 and the second surface 102 of the body 100. Therefore, the first external electrode 400 is disposed on the first surface 101 to contact and connect with the end 311-1 of the first coil pattern 311 exposed to the first surface 101 of the body 100, and the second external electrode 500 is disposed on the second surface 102 to contact and connect with the end 312-1 of the second coil pattern 312 exposed to the second surface 102 of the body 100.

[0061] The external electrodes 400 and 500 may be formed as a single layer or multiple layers. As an example, the first external electrode 400 may include a first layer including copper, a second layer disposed on the first layer and including nickel (Ni), and a third layer disposed on the second layer and including tin (Sn). Here, each of the first layer, the second layer, and the third layer may be formed by plating, but is not limited thereto. As another example, the first external electrode 400 may include a resin electrode and a plating layer, the resin electrode including a conductive powder and a resin, and the plating layer is formed on the resin electrode by plating.

[0062] The external electrodes 400 and 500 may include a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof, but are not limited thereto.

[0063] The insulating film 600 may be formed on the insulating substrate 200 and the coil part 300. The insulating film 600 is provided to insulate the coil part 300 from the main body 100, and may include a known insulating material such as polyparaxylene. Any insulating material may be used for the insulating material included in the insulating film 600, and is not specifically limited. The insulating film 600 may be formed using methods such as vapor deposition, but is not limited thereto. Alternatively, the insulating film 600 may be formed by stacking an insulating film on each of the two sides of the insulating substrate 200. In the aforementioned case, the insulating film 600 may have the form of a conformal film along the surface of the insulating substrate 200 and the coil part 300. In addition, according to an exemplary embodiment of the present disclosure, the insulating film 600 is an optional configuration. When sufficient insulation resistance can be ensured in the main body 100 under the operating voltage and operating current of the coil component 1000 according to the exemplary embodiment of the present disclosure, the insulating film 600 may be omitted.

[0064] In this regard, in the coil component 1000 according to the exemplary embodiment of the present disclosure, the connection parts 221 and 222 are formed on the insulating substrate 200 , and thus deformation of the insulating substrate 200 and the coil part 300 that may occur during a manufacturing process may be significantly reduced.

[0065] Figures 5 to 7 are views sequentially illustrating a method of manufacturing a coil component according to an exemplary embodiment of the present disclosure.

[0066] Reference Figures 5 to 7, a method for manufacturing a coil component according to an exemplary embodiment of the present disclosure includes: forming a plurality of coil parts on an insulating substrate; removing a portion where the plurality of coil parts are not formed from the insulating substrate; forming a body by stacking a magnetic composite sheet including an insulating resin and a magnetic powder on the insulating substrate; and forming a first external electrode and a second external electrode on a surface of the body. Removing the portion where the plurality of coil parts are not formed from the insulating substrate includes: connecting a support member supporting the plurality of coil parts to an adjacent support member, and forming a first connection portion and a second connection portion in the insulating substrate, each of the first connection portion and the second connection portion being set as a pair of connection portions.

[0067] First, refer to Figure 5 , a plurality of coil parts 300 are formed on an insulating substrate 200 .

[0068] The insulating substrate 200 is not particularly limited, and may be at least one of a copper clad laminate, a prepreg (PPG), an ABF (Ajinomoto build-up film), and a photosensitive dielectric (PID), and may have a thickness of 20 μm to 100 μm.

[0069] By way of example, the formation method of the coil part 300 may be an electroplating method, but is not limited thereto. Alternatively, the coil part 300 may be formed by including a metal having excellent electrical conductivity, and may be formed using silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or alloys thereof.

[0070] A via hole is formed in a portion of the insulating substrate 200 and filled with a conductive material to form a via hole 320. In addition, the coil pattern 311 formed on one side of the insulating substrate 200 and the coil pattern 312 formed on the other side of the insulating substrate 200 may be electrically connected to each other through the via hole 320.

[0071] The coil part 300 may include two ends 311-1 and 312-1 respectively exposed to the first and second surfaces 101 and 102 of the body 100 after cutting. Under the condition of the coil substrate before cutting, both ends of the unit coil parts 300 adjacent to each other may be physically and electrically connected to each other.

[0072] Reference Figure 6 , a portion where the coil part 300 is not formed may be removed from the insulating substrate 200 .

[0073] The removal of the insulating substrate 200 may be performed by applying a mechanical drilling, laser drilling, sand blasting, or a punching process, for example, the removal of the insulating substrate 200 may be performed by applying a CO 2 laser drilling.

[0074] A central area of ​​the insulating substrate 200 where the coil part 300 is not formed is removed to form a through hole passing through the insulating substrate 200 .

[0075] In this case, a portion of the insulating substrate 200 where the coil portion 300 is not formed except for some portions is removed, thereby forming the first connection portion 221 and the second connection portion 222. Each of the first connection portion 221 and the second connection portion 222 (remaining portions not removed from the insulating substrate 200) may be provided as a pair of connection portions separated from each other.

[0076] In the prior art, all regions of the insulating substrate 200 except for a portion in which the coil part 300 is formed are removed. However, according to an exemplary embodiment of the present disclosure, since a portion of the region of the insulating substrate 200 in which the coil part 300 is not formed is not removed, the first connection part 221 and the second connection part 222 are formed, thereby increasing the force for supporting the coil part 300. Therefore, when the magnetic composite sheets are stacked and pressed, the deformation of the coil part 300 can be significantly reduced.

[0077] An insulating film 600 covering the coil part 300 may be formed on the surface of the coil part 300. The insulating film 600 may be formed using a method such as screen printing, a spraying process, a vacuum impregnation process, a vapor deposition process such as chemical vapor deposition (CVD), a film lamination process, etc., but is not limited thereto. Figure 7 , the magnetic composite sheet 30 is stacked on the insulating substrate 200 on which the coil part 300 is formed to form the body 100 .

[0078] The magnetic composite sheets 30 are stacked on both sides of the insulating substrate 200 and pressed by a lamination method or a hydrostatic pressing method to form the body 100 .

[0079] In this case, the through hole formed in the central portion of the insulating substrate 200 is filled with at least a portion of the magnetic composite sheet 30 , and thus the core 110 may be provided.

[0080] In addition, although not shown, after the above operation, a cutting process of dividing the plurality of coil parts 300 into individuals may be included, and the first external electrode 400 and the second external electrode 500 may be formed on the surface of the individualized body 100. In the cutting process, the connection parts 221 and 222 connecting the support members 210 of the plurality of coil parts 300 adjacent to each other are cut by a cutting head to be exposed to the third surface 103 and the fourth surface 104 of the body 100.

[0081] As described above, according to exemplary embodiments in the present disclosure, deformation of the coil part in the process of stacking and pressing the magnetic composite sheets may be prevented.

[0082] Although the coil component has a low profile, a defect rate due to deformation of a coil part can be reduced.

[0083] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present invention as defined by the appended claims.

Claims

1. A coil assembly, comprising: main body; A coil portion, embedded in the main body; as well as an insulating substrate embedded in the body and including a support member supporting the coil portion in a thickness direction and first and second connection portions extending from the support member to opposite side surfaces of the body, respectively, wherein each of the first connection portion and the second connection portion includes a pair of connection portions separated from each other, wherein the coil portion includes a first coil pattern disposed on one side of the insulating substrate and forming a plurality of turns, the main body includes a first covering portion, the first covering portion being defined as a portion of the main body disposed above the first coil pattern, the thickness of the first coil pattern being greater than the thickness of the first covering portion, and Here, when viewed in the thickness direction, an outer contour line of the support member is formed along an outer contour line of an outermost turn of the first coil pattern.

2. The coil assembly according to claim 1, wherein: The main body has an effective portion, the coil portion is disposed in the effective portion, and the first covering portion is disposed on the effective portion. The magnetic permeability of the effective portion is greater than the magnetic permeability of the first covering portion.

3. The coil assembly according to claim 1, wherein: The first connection portion includes a pair of first connection portions, the second connection portion includes a pair of second connection portions, and The spacing distance between the pair of first connection portions is equal to the spacing distance between the pair of second connection portions.

4. The coil assembly according to claim 1, wherein: Both ends of the coil part are respectively exposed to opposite end surfaces of the body connecting the opposite side surfaces of the body to each other.

5. The coil assembly according to claim 1, wherein: The first connection portion and the second connection portion are symmetrical to each other.

6. The coil assembly according to claim 1, wherein: The first coil pattern has a planar spiral shape, The coil portion further includes: a second coil pattern having a planar spiral shape and provided on the other side of the insulating substrate opposite to the one side of the insulating substrate; and A via hole passes through the insulating substrate to connect the first coil pattern to the second coil pattern.

7. The coil assembly according to claim 6, wherein: The body further includes a second covering portion defined as a portion of the body disposed below the second coil pattern, The thickness of the second coil pattern is greater than the thickness of the second covering portion, and The main body has an effective portion in which the first coil pattern and the second coil pattern are disposed, and a magnetic permeability of the effective portion is greater than a magnetic permeability of the second cover portion.

8. The coil assembly according to claim 1, wherein: The body includes insulating resin and magnetic powder.

9. The coil assembly according to claim 1, further comprising: A first external electrode and a second external electrode are provided on the body and are respectively connected to both ends of the coil part.

10. The coil assembly according to claim 1, wherein: An insulating film is provided on an outside of the coil portion and on an outside of the insulating substrate to cover the first connection portion and the second connection portion, and the insulating film covering the first connection portion and the second connection portion extends to the opposite side surfaces of the body.

11. The coil assembly according to claim 1, wherein: The first connection portion and the second connection portion do not overlap the coil portion in a stacking direction of the coil portion and the insulating substrate.

12. A method for manufacturing a coil assembly, comprising: forming a plurality of coil parts on an insulating substrate, the coil parts including a first coil pattern provided on one side of the insulating substrate and forming a plurality of turns; removing a portion of the insulating substrate on which the plurality of coil parts are not formed; providing an insulating film on the outside of the coil portion and on the outside of the insulating substrate, forming a body by stacking magnetic composite sheets including an insulating resin and a magnetic material on the insulating substrate, wherein the body includes a first covering portion defined as a portion of the body disposed above the first coil pattern, the first coil pattern having a thickness greater than a thickness of the first covering portion; and forming a first external electrode and a second external electrode on a surface of the body; wherein removing the portion of the insulating substrate comprises: removing a portion of the insulating substrate where the coil portion is not formed to form a support member supporting the coil portion in a thickness direction and a first connection portion and a second connection portion extending from the support member to opposite side surfaces of the main body, respectively, and each of the first connection portion and the second connection portion comprises a pair of connection portions in the insulating substrate, and Here, when viewed in the thickness direction, an outer contour line of the support member is formed along an outer contour line of an outermost turn of the first coil pattern.

13. A coil assembly, comprising: main body; A coil portion, embedded in the main body; as well as an insulating substrate embedded in the body and including a supporting member supporting the coil portion in a thickness direction, Wherein, the insulating substrate further comprises: a pair of first connection parts and a pair of second connection parts, the pair of first connection parts are separated from each other, protruded from the support member and exposed to one side surface of the main body, and the pair of second connection parts are separated from each other, protruded from the support member and exposed to the other side surface of the main body opposite to the one side surface of the main body, wherein the coil portion includes a first coil pattern disposed on one side of the insulating substrate and forming a plurality of turns, and a second coil pattern disposed on the other side of the insulating substrate opposite to the one side and forming a plurality of turns, The body has a first covering portion and a second covering portion, the first covering portion is defined as a portion of the body disposed above the first coil pattern, the second covering portion is defined as a portion of the body disposed below the second coil pattern, the first coil pattern has a thickness greater than that of the first covering portion, the second coil pattern has a thickness greater than that of the second covering portion, and Here, when viewed in the thickness direction, an outer contour line of the support member is formed along an outer contour line of an outermost turn of the first coil pattern.

14. The coil assembly according to claim 13, wherein: An insulating film is disposed on an exterior of the coil portion and extends along side walls of the turns of the first coil pattern and the second coil pattern.

15. The coil assembly according to claim 13, wherein: The body also has an effective portion, and a region of the body corresponding to a sum of a thickness of the first coil pattern and a thickness of the second coil pattern and a thickness of the insulating substrate is defined as the effective portion.

16. The coil assembly according to claim 13, wherein: The spacing distance between the pair of first connection portions is equal to the spacing distance between the pair of second connection portions.

17. The coil assembly according to claim 13, wherein: Both ends of the coil part are respectively exposed to opposite end surfaces of the body connecting the one side surface and the other side surface of the body to each other.

18. The coil assembly according to claim 13, wherein: The pair of first connection portions and the pair of second connection portions are symmetrical to each other.

19. The coil assembly according to claim 13, wherein: The first coil pattern has a planar spiral shape, The second coil pattern has a planar spiral shape, and The coil part further includes a via hole penetrating the insulating substrate to connect the first coil pattern to the second coil pattern.

20. The coil assembly according to claim 15, wherein The magnetic permeability of the effective portion is greater than the magnetic permeability of the first covering portion and the magnetic permeability of the second covering portion.

21. The coil assembly according to claim 13, wherein: The pair of first connection portions and the pair of second connection portions do not overlap the coil portion in a stacking direction of the coil portion and the insulating substrate.

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