Micro-LED device, detection method and display panel

Abstract

The present invention discloses a Micro-LED device, a detection method and a display panel. The Micro-LED device includes: a substrate and a first driving circuit, a second driving circuit, a driving array and a Micro-LED array composed of a plurality of Micro-LED particles located on a first surface of the substrate; the first driving circuit and the second driving circuit are both connected to the driving array; the driving array is used to carry the Micro-LED array and is connected to the Micro-LED particles; the first driving circuit and the second driving circuit are arranged at the periphery of the driving array, and the distance from the first driving circuit to the driving array is greater than the distance from the second driving circuit to the driving array. During detection, an electrical signal is applied to the first driving circuit, so that the driving array drives each Micro-LED particle to emit light. After the detection is completed, the portion where the first driving circuit is located is cut off, and the portion where the second driving circuit, the driving array and the Micro-LED array are located is retained, thereby avoiding the contamination of the Micro-LED device caused by the detection process, and at the same time, improving the detection efficiency and reducing the risk of damage to the Micro-LED particles.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a Micro-LED device, a detection method and a display panel. Background Art

[0002] Micro-LED is a thin-film, arrayed, miniaturized LED. Compared with traditional LEDs, it has the advantages of small size, low power consumption, and high brightness. Therefore, it has received widespread attention and is expected to be used in fields such as wearable displays, large-screen displays, and wireless optical communications. In order to obtain high-quality and reliable Micro-LED arrays, they must be tested to ensure that Micro-LEDs can be mass-produced.

[0003] Currently, the inspection of Micro-LED is divided into wafer-level inspection before packaging and finished product-level inspection after packaging. The so-called wafer-level inspection is to inspect a single Micro-LED on the wafer before the wafer is cut and packaged.

[0004] As for pre-packaging detection, there are currently conventional electrical methods, four-probe method, photocurrent method, etc. The four-probe method is to detect the relevant parameters of Micro-LED by injecting current into Micro-LED through probes and obtaining the relationship between voltage and current. The four-probe method will not only damage the probes, but also damage Micro-LED, and the efficiency is low. The photocurrent method is a non-contact method that uses the photovoltaic effect of the PN junction to detect the working status of Micro-LED. The device is relatively complex and prone to missed detection. Conventional electrical methods detect by energizing the Micro-LED to make it emit light, which can find more defects. Therefore, this method has become a common detection method for Micro-LED. However, the electrical method is a contact method, which is easy to cause wafer contamination. Summary of the invention

[0005] The embodiments of the present invention provide a Micro-LED device, a detection method and a display panel, which can avoid contamination of the Micro-LED device and improve detection efficiency.

[0006] In a first aspect, an embodiment of the present invention provides a Micro-LED device, comprising: a substrate, and a first driving circuit, a second driving circuit, a driving array, and a Micro-LED array composed of a plurality of Micro-LED particles located on a first surface of the substrate;

[0007] The first driving circuit and the second driving circuit are both connected to the driving array;

[0008] The driving array is used to carry the Micro-LED array and is connected to the Micro-LED particles;

[0009] The first driving circuit and the second driving circuit are arranged at the periphery of the driving array, and the distance from the first driving circuit to the driving array is greater than the distance from the second driving circuit to the driving array.

[0010] Optionally, the first driving circuit and the second driving circuit are respectively located on two adjacent sides of the driving array.

[0011] Optionally, a cutting mark is provided on the substrate;

[0012] The connection lines of the cutting marks enclose a reserved area, the second driving circuit and the driving array are located in the reserved area, and the first driving circuit is located outside the reserved area.

[0013] Optionally, the second surface of the substrate is placed on the base, and the second surface is arranged opposite to the first surface;

[0014] The base is connected to the second driving circuit, and the base is used to connect to an external circuit.

[0015] Optionally, it is characterized in that the driving array includes a plurality of scan lines and a plurality of data lines;

[0016] The scan line extends along a first direction, the data line extends along a second direction, and the first direction is perpendicular to the second direction;

[0017] The scan line intersects with the data line to define a pixel area, and the Micro-LED particles are located in the pixel area;

[0018] The Micro-LED particles are connected to the scan lines and the data lines.

[0019] Optionally, the first driving circuit includes a first scan driving circuit and a first data driving circuit;

[0020] The first scan driving circuit is connected to the scan line and is used to provide a scan signal to the scan line. The first data driving circuit is connected to the data line and is used to provide a data signal to the data line.

[0021] The second driving circuit includes a second scanning driving circuit and a second data driving circuit;

[0022] The second scan driving circuit is connected to the scan line and is used to provide a scan signal to the scan line. The second data driving circuit is connected to the data line and is used to provide a data signal to the data line.

[0023] Optionally, the driving array further includes a plurality of pixel circuits, and the pixel circuits are located in the pixel area;

[0024] The pixel circuit includes at least one thin film transistor, a gate of the thin film transistor is connected to the scan line, a source of the thin film transistor is connected to the data line, and a drain of the thin film transistor is connected to the Micro-LED particle.

[0025] Optionally, the first driving circuit and the second driving circuit are both formed in the same layer as the pixel circuit.

[0026] In a second aspect, an embodiment of the present invention provides a method for detecting a Micro-LED device, which is used to detect the Micro-LED device provided by the first aspect of the present invention, comprising:

[0027] The first driving circuit receives the electrical signal and sends a detection signal to the driving array to drive the Micro-LED particles to emit light;

[0028] Detecting the light emission of the Micro-LED particles by using a detection device;

[0029] The quality of the Micro-LED particle is determined according to the detection signal and the light emission of the Micro-LED particle under the detection signal.

[0030] In a third aspect, an embodiment of the present invention provides a display panel, which is obtained by cutting the Micro-LED device provided in the first aspect of the present invention and retaining the second driving circuit, the driving array and the Micro-LED array.

[0031] The Micro-LED device provided by the embodiment of the present invention is provided with a first driving circuit and a second driving circuit on a substrate, and the first driving circuit and the second driving circuit can drive each Micro-LED particle to emit light individually through a driving array. The first driving circuit and the second driving circuit are arranged at the periphery of the Micro-LED array, and the distance from the first driving circuit to the Micro-LED array is greater than the distance from the second driving circuit to the Micro-LED array. During detection, an electrical signal is applied to the first driving circuit through a detection device, so that the driving array drives each Micro-LED particle to emit light. After the detection is completed, the portion where the first driving circuit is located is cut off, and the portion where the second driving circuit, the driving array and the Micro-LED array are located is retained, thereby avoiding contamination of the Micro-LED device caused by the detection process. At the same time, the detection efficiency is improved and the risk of damage to the Micro-LED particles is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0033] Figure 1 A top view of a Micro-LED device provided in an embodiment of the present invention;

[0034] Figure 2 A front view of a Micro-LED device provided by an embodiment of the present invention;

[0035] Figure 3 A circuit structure diagram of a Micro-LED device provided in an embodiment of the present invention;

[0036] Figure 4 is a schematic structural diagram of a pixel circuit in an embodiment of the present invention;

[0037] Figure 5 A flow chart of a method for detecting a Micro-LED device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0038] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0039] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. In addition, the terms "first" and "second" are only used to distinguish in description and have no special meaning.

[0041] An embodiment of the present invention provides a Micro-LED device, Figure 1 A top view of a Micro-LED device provided in an embodiment of the present invention, Figure 2 A front view of a Micro-LED device provided in an embodiment of the present invention, such as Figure 1 , 2 As shown, the Micro-LED device includes a substrate 100 and a first driving circuit 200 , a second driving circuit 300 , a driving array 400 and a Micro-LED array composed of a plurality of Micro-LED particles 500 located on a first surface of the substrate 100 .

[0042] Exemplarily, the substrate 100 may be a silicon wafer, a gallium arsenide wafer, or a substrate of other semiconductor materials. The first drive circuit 200, the second drive circuit 300, and the drive array 400 may be manufactured using a semiconductor process. Specifically, a mask is pre-designed and drawn, and then a semiconductor process is used for manufacturing, and the basic process includes thin film growth, photolithography, etching, metal deposition, etc.

[0043] The Micro-LED particles 500 can be transferred to the driving array 400 on the substrate 100 by particle transfer to form a Micro-LED array. In the embodiment of the present invention, the particle transfer method is not limited.

[0044] Among them, the first driving circuit 200 and the second driving circuit 300 are both connected to the driving array 400, the driving array 400 is used to carry the Micro-LED array and is connected to the Micro-LED particles 500, and the first driving circuit 200 is used to send a detection signal to each driving array 400.

[0045] Exemplarily, the first driving circuit 200 and the second driving circuit 300 are connected to the driving array 400 through wires arranged on the substrate 100. The first driving circuit 200, the second driving circuit 300 and the driving array 400 each include a plurality of electronic components, such as thin film transistors and capacitors. In an embodiment of the present invention, the electronic components in the first driving circuit 200, the second driving circuit 300 and the driving array 400 are prepared on the same layer to simplify the process and reduce the production cost.

[0046] The first driving circuit 200 and the second driving circuit 300 can drive each Micro-LED particle to emit light individually through the driving array 400.

[0047] The first driving circuit 200 and the second driving circuit 300 are disposed at the periphery of the driving array 400 , and the distance from the first driving circuit 200 to the driving array is greater than the distance from the second driving circuit 300 to the driving array.

[0048] Exemplarily, in an embodiment of the present invention, Figure 1 As shown, the area where the drive array is located forms a display area AA, and the first drive circuit 200 and the second drive circuit 300 are arranged at the periphery of the display area AA. The distance from the first drive circuit 200 to the edge of the display area AA closest to the first drive circuit 200 is D1, and the distance from the second drive circuit 300 to the edge of the display area AA closest to the second drive circuit 300 is D2, and D1 is greater than D2.

[0049] When testing the Micro-LED device, an electrical signal is applied to the first driving circuit 200, and the first driving circuit 200 sends a detection signal to the driving array 400. The driving array 400 uses an active addressing driving mode or a semi-active addressing driving mode according to the detection signal to send a detection signal to the Micro-LED particle 500, and controls each Micro-LED particle 500 individually to light up the Micro-LED particle 500. The light emission of each Micro-LED particle 500 is detected by a detection device (usually a charge coupled camera, i.e., a CCD camera), and it is determined whether the Micro-LED particle 500 has a quality problem, thereby realizing online self-detection. By testing the entire Micro-LED array at one time, the problem of low efficiency caused by testing each Micro-LED particle individually in the traditional detection method is avoided, and at the same time, the contact between the detection device and the Micro-LED particle is avoided to the greatest extent, thereby reducing the risk of damage to the Micro-LED particle.

[0050] During the detection process, since the first driving circuit 200 needs to contact with external devices, the part where the first driving circuit 200 is located will inevitably be contaminated. Therefore, after the detection of the Micro-LED device is completed, the part where the first driving circuit 200 is located is cut off, and the part where the second driving circuit 300, the driving array 400 and the Micro-LED array are located is retained, thereby avoiding the contamination of the Micro-LED device caused by the detection process; in addition, the retained second driving circuit 300 can still drive the Micro-LED particles 500 to emit light through the driving array 400.

[0051] The Micro-LED device provided by the embodiment of the present invention is provided with a first driving circuit and a second driving circuit on a substrate, and the first driving circuit and the second driving circuit can drive each Micro-LED particle to emit light individually through a driving array. The first driving circuit and the second driving circuit are arranged at the periphery of the Micro-LED array, and the distance from the first driving circuit to the Micro-LED array is greater than the distance from the second driving circuit to the Micro-LED array. During detection, an electrical signal is applied to the first driving circuit through a detection device to light up each Micro-LED particle. After the detection is completed, the portion where the first driving circuit is located is cut off, and the portion where the second driving circuit, the driving array and the Micro-LED array are located is retained, thereby avoiding contamination of the Micro-LED device caused by the detection process. At the same time, the detection efficiency is improved and the risk of damage to the Micro-LED particles is reduced.

[0052] For example, in one embodiment of the present invention, the first driving circuit 200 and the second driving circuit 300 are respectively located on two adjacent sides of the driving array 400 .

[0053] Specifically, Figure 1 As shown, the display area AA formed by the driving array 400 is a square area, the first driving circuit 200 is located on the left side of the display area AA, the second driving circuit 300 is located on the upper side of the display area AA, and the distance D1 from the first driving circuit 200 to the edge of the display area AA closest to the first driving circuit 200 is greater than the distance D2 from the second driving circuit 300 to the edge of the display area AA closest to the second driving circuit 300. As mentioned above, the first driving circuit 200 and the second driving circuit 300 are both connected to each Micro-LED particle 500 through wires, so there are a large number of wires between the first driving circuit 200 and the display area AA, and between the second driving circuit 300 and the display area AA. By locating the first driving circuit 200 and the second driving circuit 300 on two adjacent sides of the driving array 400, the arrangement of the wires can be facilitated, saving wiring costs.

[0054] It should be noted that the arrangement of the above-mentioned first driving circuit 200 and second driving circuit 300 is an exemplary illustration of the present invention. In other embodiments of the present invention, the first driving circuit 200 and the second driving circuit 300 can also be arranged on opposite sides of the driving array 400 or on the same side of the driving array 400, as long as the distance from the first driving circuit 200 to the driving array 400 is greater than the distance from the second driving circuit 300 to the driving array. The embodiments of the present invention are not limited herein.

[0055] Exemplarily, in an embodiment of the present invention, cutting marks 101 are provided on the substrate. The connecting lines of the cutting marks 101 enclose a reserved area BB. The second driving circuit 300 and the driving array 400 are located within the reserved area BB, and the first driving circuit 200 is located outside the reserved area BB.

[0056] Specifically, as Figure 1 shown, four cutting marks 101 with arrows are formed on the substrate 100. Each cutting mark 101 has two arrows with perpendicular directions, respectively pointing to adjacent cutting marks. The connecting lines of the arrows of the four cutting marks 101 enclose the reserved area BB. The distance from the cutting mark 101 to the edge of the display area AA closest to the cutting mark 101 is D3, where D2 < D3 < D1. Therefore, the second driving circuit 300 and the driving array 400 are located within the reserved area BB, and the first driving circuit 200 is located outside the reserved area BB.

[0057] After the detection is completed, the cutting marks 101 guide the direction of the cutting blade, and the Micro-LED device is cut along the arrow directions of the cutting marks 101, and the part where the first driving circuit 200 is located is removed, and the part where the second driving circuit 300, the driving array 400, and the Micro-LED array are located is retained.

[0058] In the embodiments of the present invention, the cutting marks 101 can also be used to align the Micro-LED device during the detection process, so that the Micro-LED device is accurately aligned with the detection device, improving the detection accuracy.

[0059] Exemplarily, the cutting marks 101 can be prepared on the same layer as the first driving circuit 200, the second driving circuit 300, and the driving array 400, and are formed by processes such as exposing and etching the substrate 100.

[0060] It should be noted that in the above embodiments, the present invention is exemplarily illustrated by taking the cutting marks with arrows as an example. In other embodiments of the present invention, the cutting marks can also be other shapes, such as rhombus, as long as they can achieve the functions of cutting guidance and alignment. The embodiments of the present invention are not limited herein.

[0061] Exemplarily, in one embodiment of the present invention, Figure 2 As shown, the second surface of the substrate 100 is placed on the base 600, and the second surface is a surface opposite to the first surface. Exemplarily, the base 600 is arranged opposite to the second driving circuit 300, the base 600 is connected to the second driving circuit 300, and the base 600 includes a circuit interface for connecting an external circuit.

[0062] For example, Figure 3 A circuit structure diagram of a Micro-LED device provided in an embodiment of the present invention, such as Figure 3 As shown, the driving array includes a plurality of scan lines Ls and a plurality of data lines Ld. The scan lines Ls extend along a first direction X, and the data lines Ld extend along a second direction Y, and the first direction X is perpendicular to the second direction Y.

[0063] The scan lines Ls and the data lines Ld intersect to define a pixel region P, and the Micro-LED particles 500 are located in the pixel region P.

[0064] It should be noted that Figure 3 The circuit structure diagram shown is an exemplary description of the present invention. Those skilled in the art should understand that for the sake of convenience of description, Figure 3 Some elements are omitted, such as power lines. The arrangement of the scan lines and the data lines may also be in other forms, for example, two scan lines are located between two adjacent rows of pixel regions, which is not limited in the embodiment of the present invention.

[0065] The driving array also includes a pixel circuit located in the pixel area P, and the pixel circuit includes at least one thin film transistor T. In each pixel area P, the gate of the thin film transistor T is connected to the scan line Ls, the source of the thin film transistor T is connected to the data line Ld, the drain of the thin film transistor T is connected to the anode of the Micro-LED particle, and the cathode of the Micro-LED particle is grounded.

[0066] It should be noted that, in the above embodiment, the pixel circuit only shows the thin film transistor T. In an actual circuit, the pixel circuit may also include a plurality of thin film transistors and other elements, such as a capacitor.

[0067] For example, Figure 4 is a schematic diagram of the structure of a pixel circuit in an embodiment of the present invention. Figure 4As shown, the pixel circuit is a common 2T1C circuit, i.e., two thin film transistors and a capacitor, wherein the source of the thin film transistor T1 is connected to the data line Ld, the gate of the thin film transistor T1 is connected to the scan line Ls, and the drain of the thin film transistor T1 is connected to the gate of the thin film transistor T2. The source of the thin film transistor T2 is connected to the power line for inputting the power signal VDD, the drain of the thin film transistor T2 is connected to the anode of the Micro-LED particle 500, and the cathode of the Micro-LED particle 500 is grounded or connected to the reference level.

[0068] In the above embodiment, the scan lines Ls, data lines Ld and components in the pixel circuit, such as thin film transistors and capacitors, can be manufactured on the same layer as the electronic components in the first driving circuit 200 and the second driving circuit 300 to simplify the process and reduce production costs.

[0069] For example, Figure 1 As shown, the first driving circuit 200 includes a first scan driving circuit 210 and a first data driving circuit 220 .

[0070] The first scan driving circuit 210 is connected to the scan line Ls and is used to provide a scan signal to the scan line Ls. The first data driving circuit 220 is connected to the data line Ld and is used to provide a data signal to the data line Ld.

[0071] Similarly, the second driving circuit 300 includes a second scan driving circuit 310 and a second data driving circuit 320 .

[0072] The second scan driving circuit 310 is connected to the scan line Ls and is used to provide a scan signal to the scan line Ls. The second data driving circuit 320 is connected to the data line Ld and is used to provide a data signal to the data line Ld.

[0073] Specifically, when the scanning signal selects the pixel circuit, the switch tube T1 is turned on, and the data voltage charges the storage capacitor C through the T1 tube, and the voltage of C controls the drain current of the driving tube T2; when the scanning signal does not select the pixel circuit, T1 is turned off, and the charge stored on the capacitor C continues to maintain the gate voltage of T2, and T2 remains in the on state, so during the entire frame period, the Micro-LED particles 500 are in constant current control.

[0074] An embodiment of the present invention further provides a method for detecting a Micro-LED device, which is used to detect the Micro-LED device provided by the above embodiment. Figure 5 A flow chart of a method for detecting a Micro-LED device provided by an embodiment of the present invention, such as Figure 5 As shown, the method comprises the following steps:

[0075] S11. The first driving circuit receives an electrical signal and sends a detection signal to the driving array to drive the Micro-LED particles to emit light.

[0076] Specifically, an electrical signal is applied to the first driving circuit 200 through an external device, and the first driving circuit 200 sends a detection signal to the driving array 400. The driving array 400 adopts an active addressing driving mode or a semi-active addressing driving mode according to the detection signal to individually control each Micro-LED particle 500 to light up the Micro-LED particle 500.

[0077] S12. Detect the luminescence of Micro-LED particles through a detection device.

[0078] Exemplarily, the detection device may be a CCD camera. When the Micro-LED array is lit, the CCD camera is used to photograph the Micro-LED array to obtain a corresponding image, and the image is processed by a computer to determine the brightness of each pixel in the image. According to the corresponding positional relationship between the image pixels and the Micro-LED particles 500 in the Micro-LED array, the luminous brightness of each Micro-LED particle 500 is obtained.

[0079] S13. Determine the quality of the Micro-LED particles according to the detection signal and the light emission of the Micro-LED particles under the detection signal.

[0080] Specifically, according to the correspondence between the size of the predetermined data signal and the luminous brightness of the Micro-LED particle 500, it is determined whether the luminous brightness of the Micro-LED particle 500 measured under the data signal in the detection signal meets the preset correspondence, and then it is determined whether the quality of the Micro-LED particle 500 is qualified.

[0081] Exemplarily, after the inspection is completed, the portion where the first driving circuit 200 is located is cut off, and the portion where the second driving circuit 300, the driving array 400 and the Micro-LED array are located is retained, thereby avoiding contamination of the Micro-LED device caused by the inspection process; in addition, the retained second driving circuit 300 can still be used to drive the Micro-LED particles 500 to emit light.

[0082] The detection method of the Micro-LED device provided in the embodiment of the present invention is used to detect the Micro-LED device provided in the above embodiment of the present invention, apply an electrical signal to the first drive circuit, send a detection signal to the drive array, so that the drive array drives the Micro-LED particles to emit light, detect the light emission of the Micro-LED particles through the detection equipment, and determine the quality of the Micro-LED particles based on the detection signal and the light emission of the Micro-LED particles under the detection signal, thereby improving the detection efficiency and reducing the risk of damage to the Micro-LED particles. After the detection is completed, the part where the first drive circuit is located is cut off, and the part where the second drive circuit, the drive array and the Micro-LED array are located are retained, thereby avoiding contamination of the Micro-LED device caused by the detection process.

[0083] The embodiment of the present invention further provides a display panel, which is obtained by cutting the Micro-LED device provided in the above embodiment of the present invention, retaining the second drive circuit, the drive array and the Micro-LED array, and the surface of the display panel is free of pollution and damage. Specifically, the Micro-LED device and the cutting of the Micro-LED device have been described in detail in the above embodiment, and the embodiment of the present invention will not be repeated here.

[0084] In the description of this article, it is necessary to understand that the terms "up", "down", "left", "right", and other orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0085] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0086] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0087] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A Micro-LED device, characterized in that: include: A substrate and a first driving circuit, a second driving circuit, a driving array and a Micro-LED array composed of a plurality of Micro-LED particles located on a first surface of the substrate; The first driving circuit and the second driving circuit are both connected to the driving array; The driving array is used to carry the Micro-LED array and is connected to the Micro-LED particles; The first driving circuit and the second driving circuit are arranged at the periphery of the driving array, and the distance from the first driving circuit to the driving array is greater than the distance from the second driving circuit to the driving array; The driving array includes a plurality of scanning lines and a plurality of data lines; The first driving circuit includes a first scan driving circuit and a first data driving circuit; The first scan driving circuit is connected to the scan line and is used to provide a scan signal to the scan line. The first data driving circuit is connected to the data line and is used to provide a data signal to the data line. The second driving circuit includes a second scanning driving circuit and a second data driving circuit; The second scan driving circuit is connected to the scan line and is used to provide a scan signal to the scan line. The second data driving circuit is connected to the data line and is used to provide a data signal to the data line.

2. The Micro-LED device according to claim 1, characterized in that: The first driving circuit and the second driving circuit are respectively located on two adjacent sides of the driving array.

3. The Micro-LED device according to claim 1, characterized in that: The substrate is provided with a cutting mark; The connection lines of the cutting marks enclose a reserved area, the second driving circuit and the driving array are located in the reserved area, and the first driving circuit is located outside the reserved area.

4. The Micro-LED device according to claim 1, characterized in that: The second surface of the substrate is placed on the base, and the second surface is arranged opposite to the first surface; The base is connected to the second driving circuit, and the base is used to connect to an external circuit.

5. The Micro-LED device according to any one of claims 1 to 4, characterized in that: The scan line extends along a first direction, the data line extends along a second direction, and the first direction is perpendicular to the second direction; The scan line intersects with the data line to define a pixel area, and the Micro-LED particles are located in the pixel area; The Micro-LED particles are connected to the scan lines and the data lines; The driving array further comprises a plurality of pixel circuits, wherein the pixel circuits are located in the pixel area; The pixel circuit includes at least one thin film transistor, a gate of the thin film transistor is connected to the scan line, a source of the thin film transistor is connected to the data line, and a drain of the thin film transistor is connected to the Micro-LED particle.

6. The Micro-LED device according to claim 5, characterized in that: The first driving circuit and the second driving circuit are both formed in the same layer as the pixel circuit.

7. A method for detecting a Micro-LED device, characterized in that: Used to detect the Micro-LED device according to any one of claims 1 to 6, comprising: The first driving circuit receives the electrical signal and sends a detection signal to the driving array to drive the Micro-LED particles to emit light; Detecting the light emission of the Micro-LED particles by using a detection device; Determine the quality of the Micro-LED particle according to the detection signal and the light emission of the Micro-LED particle under the detection signal; The determining the quality of the Micro-LED particle according to the detection signal and the light emission of the Micro-LED particle under the detection signal includes: According to the correspondence between the size of the predetermined data signal and the luminous brightness of the Micro-LED particles, it is determined whether the luminous brightness of the Micro-LED particles measured under the data signal in the detection signal meets the preset correspondence, and whether the quality of the Micro-LED particles is qualified.

8. A display panel, characterized in that: The Micro-LED device according to any one of claims 1 to 6 is cut to obtain a device having a second driving circuit, a driving array and a Micro-LED array.

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