A low-contact wafer centering and flipping system

Abstract

The present invention belongs to the field of wafer cleaning in the semiconductor industry, specifically, a low-contact wafer centering and flipping system, wherein a flipping actuator is mounted on a support frame, a turntable is connected to the output end, a clamping actuator is arranged on the turntable, one end of a movable clamping device is connected to the output end of the clamping actuator, one end of a fixed clamping device is mounted on the turntable, the other ends of the movable clamping device and the fixed clamping device are both clamping ends, and a low-contact centering mechanism for centering the wafer is arranged on one side of the wafer; the movable clamping device is driven by the clamping actuator to move relative to the turntable, and clamps the wafer with the fixed clamping device, and the clamping actuator, the movable clamping device, the fixed clamping device and the clamped wafer are driven to rotate with the turntable by the flipping actuator. The present invention can center, clamp and flip the wafer, and can control the contact area of ​​the wafer, calibrate the center of the wafer, and ensure that the wafer is flipped cleanly, accurately and safely.

Description

Technical Field

[0001] The invention belongs to the field of wafer cleaning in the semiconductor industry, and in particular to a low-contact wafer centering and flipping system. Background Art

[0002] With the growth of domestic market demand for mid-to-high-end chip products, the domestic production of high-end chips has also developed to a new level. Therefore, the industry has higher requirements for wafer cleaning and wafer cleanliness, which has also become a new research topic for semiconductor equipment manufacturers. During the research process, it was found that the contamination on the back of the wafer has an important impact on the cleanliness of the surface. The contamination on the back of the wafer has also attracted wider attention in the industry, and the demand for wafer back cleaning has also increased. Basically, in the entire process of wafer processing, back cleaning is required every two steps. If you want to get a higher yield, almost every step of the process cannot be separated from cleaning. Therefore, the low-contact semiconductor wafer flipping system was born in line with the development of the times. Summary of the invention

[0003] In order to meet the existing process requirements for cleaning the back side of wafers and quickly adjust the flipping system to ensure a stable and smooth wafer flipping process, the purpose of the present invention is to provide a low-contact wafer alignment and flipping system.

[0004] The objective of the present invention is achieved through the following technical solutions:

[0005] The present invention comprises a low-contact centering mechanism, a movable clamping device, a fixed clamping device, a wafer flipping mechanism and a support frame, wherein the wafer flipping mechanism comprises a flipping actuator and a clamping actuator, the flipping actuator is mounted on the support frame, and the output end is connected to a turntable, the clamping actuator is arranged on the turntable, one end of the movable clamping device is connected to the output end of the clamping actuator, one end of the fixed clamping device is mounted on the turntable, the other ends of the movable clamping device and the fixed clamping device are both clamping ends, and one side of the wafer is provided with a low-contact centering mechanism for centering the wafer; the movable clamping device is driven by the clamping actuator to move relative to the turntable and clamp the wafer with the fixed clamping device, and the clamping actuator, the movable clamping device, the fixed clamping device and the clamped wafer are driven to rotate along with the turntable by the flipping actuator;

[0006] Wherein: the low-contact centering mechanism comprises a centering lifting structure, a centering motion actuator, a centering support PIN, a centering terminal contactor, a carrier and a clamping arm, the carrier is installed on the centering lifting structure, a centering motion actuator is provided on the carrier, two output ends of the centering motion actuator are respectively connected to clamping arms, and the clamping end of each clamping arm is installed with a centering terminal contactor in contact with the wafer; the carrier is provided with a centering support PIN for supporting the wafer;

[0007] The movable clamping device comprises an upper low contact support column, an upper tray connecting piece, an upper arm and an upper tray, one end of the upper arm is connected to the output end of the clamping actuator, and the other end is provided with an upper tray connecting piece, the upper tray is mounted on the upper tray connecting piece, and the upper tray is provided with an upper low contact support column for clamping the wafer;

[0008] One side of the upper tray connecting piece is connected to the other end of the upper arm, and a height adjustment gap is left between the one side of the upper tray connecting piece and the other end of the upper arm; side adjustment gaps are provided between the front and rear ends of the upper tray and the upper tray connecting piece;

[0009] The fixed clamping device comprises a lower contact support column, a fixed tray, a fixed tray connector and a fixed arm, one end of the fixed arm is fixedly connected to the turntable, and the other end is provided with a fixed tray connector, a fixed tray is mounted on the fixed tray connector, and a lower contact support column for clamping the wafer is provided on the fixed tray;

[0010] The movable clamping device is provided with a movable clamping device centering guide column, the fixed clamping device is provided with a fixed clamping device centering guide column, a flip unit fixture guide seat is installed on the fixed clamping device centering guide column, and the movable clamping device centering guide column is inserted into the positioning groove of the flip unit fixture guide seat when in the calibration position;

[0011] The rotating disk is provided with a strip groove in the radial direction, and one end of the movable clamping device passes through the strip groove and is connected to the output end of the clamping actuator;

[0012] One end of the movable clamping device is passed through by a rotating disk and is provided with a connecting plate. A slide rail is provided on the rotating disk. The connecting plate is slidably connected to the slide rail through a slider. The output end of the clamping actuator is connected to the connecting plate.

[0013] A wafer detection system is installed on the support frame, and the wafer detection system includes an existence detection sensor, a horizontal detection sensor, a flip position sensor and a clamping position sensor. The side of the support frame facing the wafer is respectively installed with an existence detection sensor for detecting whether the wafer exists and a horizontal detection sensor for detecting whether the wafer is tilted; the side of the support frame away from the wafer is respectively installed with a clamping position sensor for detecting the movement of the movable clamping device and a flip position sensor for detecting the rotation angle of the turntable;

[0014] An airflow particle control system installed on a support frame is provided below the fixed clamping device. The airflow particle control system includes a particle collection box and a control pipeline. The particle collection box is fixedly connected to the support frame, and a control pipeline with negative pressure is externally connected to the particle collection box.

[0015] The advantages and positive effects of the present invention are:

[0016] 1. The present invention can center, clamp and flip the wafer, control the contact area of ​​the wafer, calibrate the center of the wafer, and ensure that the wafer is flipped cleanly, accurately and safely.

[0017] 2. The present invention is provided with a wafer detection system and an airflow particle control system, which can detect the wafer status and collect the airflow suspension.

[0018] 3. The low-contact centering mechanism of the present invention adopts a point-contact PIN support method for the carrier platform, which reduces the contact area between the PIN and the wafer and avoids cross contamination of the wafer.

[0019] 4. The movable clamping device and the fixed clamping device of the present invention can ensure that the wafer is not impacted during the clamping process, while reducing the contact area of ​​the wafer.

[0020] 5. The wafer flipping mechanism of the present invention realizes smooth flipping of the wafer, can determine whether the wafer flipping action is completed, and feed back to the control system for monitoring and detection.

[0021] 6. The sensors in the wafer detection system of the present invention are interrelated and inseparable, thereby achieving the purpose of monitoring the stability of the wafer throughout the entire process.

[0022] 7. The contact part between the clamping and centering terminal and the wafer of the present invention is low-contact clamping, the contact point material is non-metal, the number of contact points is controlled to be at least four, and the clamping is stable and reliable.

[0023] 8. The position adjustment of the part in contact with the wafer of the present invention is divided into X / Y plane adjustment and Z plane adjustment, and each adjustment does not interfere with each other and is adjusted independently.

[0024] 9. The present invention has a special quick adjustment fixture for the concentric clamping design of the upper and lower contact points, a mechanical limit teaching coaxiality, and a mechanical limit height initial value adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is one of the three-dimensional structural schematic diagrams of the present invention;

[0026] Figure 2 This is the second schematic diagram of the three-dimensional structure of the present invention;

[0027] Figure 3 It is a schematic diagram of the three-dimensional structure of the low-contact centering mechanism of the present invention;

[0028] Figure 4 It is a structural schematic diagram of the movable clamping device and the fixed clamping device of the present invention;

[0029] Figure 5 It is a structural schematic diagram of the wafer flipping mechanism of the present invention;

[0030] Figure 6 It is a structural schematic diagram of a positioning fixture for a flipping device of the present invention;

[0031] Figure 7 It is a structural schematic diagram of the airflow particle control system of the present invention;

[0032] Wherein: 1 is a low contact centering mechanism, 101 is a centering lifting structure, 102 is a centering motion actuator, 103 is a centering support PIN (pillar), 104 is a centering terminal contactor, 105 is a bearing platform, and 106 is a clamping arm;

[0033] 2 is a movable clamping device, 201 is an upper low contact support column, 202 is a centering guide column of the movable clamping device, 203 is an upper tray connecting piece, 204 is an upper arm, 205 is an upper tray, and 206 is a height adjustment gap;

[0034] 3 is a fixed clamping device, 301 is a lower contact support column, 302 is a fixed tray, 303 is a fixed tray connector, 304 is a fixed arm, and 305 is a centering guide column for the fixed clamping device;

[0035] 4 is a wafer detection system, 401 is a presence detection sensor, 402 is a level detection sensor, 403 is a flip position sensor, and 404 is a clamping position sensor;

[0036] 5 is an airflow particle control system, 501 is a control pipeline, and 502 is a particle collection box;

[0037] 6 is a wafer;

[0038] 7 is a wafer flipping mechanism, 701 is a flipping actuator, 702 is a clamping actuator, 703 is a flipping mechanism angle adjustment fixture, 704 is a fixed adjustment plate, 705 is a connecting plate, 706 is a slide rail, and 707 is a coupling;

[0039] 8 is a turning unit fixture guide seat;

[0040] 9 is a support frame, 901 is a turntable, 902 is a front plate, and 903 is a rear plate. DETAILED DESCRIPTION

[0041] The present invention will be further described below in conjunction with the accompanying drawings.

[0042] like Figures 1 to 7As shown, the present invention includes a low-contact centering mechanism 1, a movable clamping device 2, a fixed clamping device 3, a wafer detection system 4, an airflow particle control system 5, a wafer flipping mechanism 7 and a support frame 9, wherein the wafer flipping mechanism 7 includes a flipping actuator 701 and a clamping actuator 702, the flipping actuator 701 is installed on the support frame 9, and the output end is connected to a turntable 901, the clamping actuator 702 is arranged on the turntable 901, one end of the movable clamping device 2 is connected to the output end of the clamping actuator 702, one end of the fixed clamping device 3 is fixedly connected to the turntable 901, the other ends of the movable clamping device 2 and the fixed clamping device 3 are both clamping ends, and one side of the wafer 6 is provided with a low-contact centering mechanism 1 for centering it. The movable clamping device 2 is driven by the clamping actuator 702 to move relative to the turntable 901, and clamps the wafer 6 with the fixed clamping device 3. The clamping actuator 702, the movable clamping device 2, the fixed clamping device 3 and the clamped wafer 6 rotate along with the turntable 901 driven by the flip actuator 701. An airflow particle control system 5 fixed to the support frame 9 is provided below the fixed clamping device 3. A wafer detection system 4 is also installed on the support frame 9.

[0043] like Figure 1 , Figure 2 and Figure 3 As shown, the low-contact centering mechanism 1 of the present embodiment is located below the fixed clamping device 3, and the low-contact centering mechanism 1 includes a centering lifting structure 101, a centering motion actuator 102, a centering support PIN 103, a centering terminal contactor 104, a bearing platform 105 and a clamping arm 106. The centering lifting structure 101 includes a lifting power source and a lifting rod, one end of the lifting rod is connected to the output end of the lifting power source, and the other end is fixedly connected to the bearing platform 105, and the bearing platform 105 is driven to lift by the lifting power source. A centering motion actuator 102 is provided on the carrier 105. The centering motion actuator 102 can be a cylinder, an electric cylinder or a hydraulic cylinder. In this embodiment, it is a bidirectional cylinder. The two output ends of the centering motion actuator 102 are respectively connected to an "L"-shaped clamping arm 106. One end of each clamping arm 106 is connected to an output end of the bidirectional cylinder, and the other end is a clamping end. A centering terminal contactor 104 that contacts the wafer 6 is installed on the clamping end. The centering terminal contactor 104 can be a roller or a bearing. A plurality of centering support PINs 103 that support the wafer 6 are evenly distributed along the circumferential direction on the carrier 105.

[0044] like Figure 1 , Figure 2 and Figure 5As shown, the support frame 9 includes a front plate 902 and a rear plate 903 connected to each other, and a space is formed between the front plate 902 and the rear plate 903. The turntable 901 is arranged in the middle of the front plate 902, and a strip groove is opened radially on the turntable 901, one end of the movable clamping device 2 passes through the strip groove, and a connecting plate 705 is provided. The turntable 901 is provided with a slide rail 706, and the connecting plate 705 is slidably connected to the slide rail 706 through a slider; the clamping actuator 702 is fixed on the turntable 901, and the output end is connected to the connecting plate 705. The flip actuator 701 is fixed on the rear plate 903, and the output shaft is fixedly connected to the middle of the turntable 901 through a coupling 707. In this embodiment, the flip actuator 701 is a rotary motor, and the clamping actuator 702 is a cylinder.

[0045] like Figure 1 , Figure 2 and Figure 4As shown, the movable clamping device 2 includes an upper low contact support column 201, an upper tray connector 203, an upper arm 204 and an upper tray 205. One end of the upper arm 204 passes through the strip groove on the turntable 901 and is connected to the output end of the clamping actuator 702. The other end of the upper arm 204 is provided with an upper tray connector 203. One side (upper side) of the upper tray connector 203 is connected to the other end of the upper arm 204, and a height adjustment gap 206 is left between one side of the upper tray connector 203 and the other end of the upper arm 204. The upper tray 205 is installed on the other side (lower side) of the upper tray connector 203. Side adjustment gaps are provided between the front and rear ends of the upper tray 205 and the upper tray connector 203. On the side of the upper tray 205 facing the wafer 6, an upper low contact support column 201 for clamping the wafer 6 is provided at the edge corner. The fixed clamping device 3 includes a lower contact support column 301, a fixed tray 302, a fixed tray connector 303 and a fixed arm 304. One end of the fixed arm 304 is fixedly connected to the turntable 901, and the other end is provided with a fixed tray connector 303. The fixed tray 302 is installed on the fixed tray connector 303. On the side of the fixed tray 302 facing the wafer 6, a lower contact support column 301 for clamping the wafer 6 is provided at the edge corner end. A movable clamping device centering guide post 202 is provided in the middle of the upper tray 205 facing the wafer 6, and a fixed clamping device centering guide post 305 is provided in the middle of the fixed tray 302 facing the wafer 6. The fixed clamping device centering guide post 305 is installed with a flip unit fixture guide seat 8. The movable clamping device centering guide post 202 is inserted into the positioning groove of the flip unit fixture guide seat 8 when in the calibration position; if the center of the upper tray 205 and the fixed tray 302 are not concentric, it is necessary to adjust the side adjustment gap between the upper tray 205 and the upper tray connector 203 until the movable clamping device centering guide post 202 can be inserted into the positioning groove of the flip unit fixture guide seat 8. When the mechanism is working, when the wafer 6 is clamped, the upper surface abuts against the upper low contact support post 201, and the lower surface abuts against the lower low contact support post 301.

[0046] like Figure 2 , Figure 5As shown, a wafer detection system 4 is installed on the support frame 9, and the wafer detection system 4 includes an existence detection sensor 401, a horizontal detection sensor 402, a flip position sensor 403 and a clamping position sensor 404. The side of the support frame 9 facing the wafer 6 (i.e., the front plate 902) is respectively installed with an existence detection sensor 401 for detecting whether there is a wafer 6 between the movable clamping device 2 and the fixed clamping device 3 and a horizontal detection sensor 402 for detecting whether the wafer 6 is tilted; the horizontal detection sensors 402 of this embodiment are two, which can be laser sensors, and the two horizontal detection sensors 402 are respectively arranged on both sides of the support frame 9. The side of the support frame 9 away from the wafer 6 (i.e., the back plate 903) is respectively installed with a clamping position sensor 404 for detecting the movement of the movable clamping device 2 and a flip position sensor 403 for detecting the rotation angle of the turntable 901. There are two clamping position sensors 404 in this embodiment, which are located on one side of the slide rail 706. All sensors of the present invention are prior art. In the present invention, a damper having a buffering effect is provided at the movement limit point at one end of the movable clamping device 2 and the rotation limit point of the turntable 901. The damper is also a prior art.

[0047] like Figure 1 , Figure 2 and Figure 7 As shown, the airflow particle control system 5 includes a particle collection box 502 and a control pipeline 501. The particle collection box 502 is fixedly connected to the support frame 9 and is located below the fixed clamping device 3. The particle collection box 502 is externally connected to the control pipeline 501 with negative pressure. During the continuous movement of the movable clamping device 2, the fixed clamping device 3, and the wafer flipping mechanism 7, dust and other impurities may be generated. The particle collection box 502 is used to collect particle pollutants, dust, etc. that fall off the wafer 6 itself, and then the external control pipeline 501 with negative pressure discharges the pollutants in the particle collection box 502 in a centralized manner to avoid affecting other modules.

[0048] like Figure 6As shown, the rotation adjustment of the wafer flip mechanism 7 requires the use of a fixed adjustment plate 704 with a groove and a flip mechanism angle adjustment fixture 703 with a positioning groove. The fixed adjustment plate 704 is placed in the positioning groove of the flip mechanism angle adjustment fixture 703. When adjusting, first place the level ruler on the fixed tray 302 to ensure that the fixed tray 302 is level. Then place the fixed adjustment plate 704 on the fixed tray 302, and make the output shaft of the flip actuator 701 pass through the groove on the fixed adjustment plate 704, then screw the angle adjustment screw on the flip actuator 701, and move the flip mechanism angle adjustment fixture 703 so that the positioning groove on it clamps the output shaft of the flip actuator 701, thereby determining the initial position and end position of the output shaft of the flip actuator 701, so as to ensure that the flip actuator 701 drives the turntable 901 to rotate 180° from the initial position to the end position. When the wafer flip mechanism 7 is working, it is necessary to ensure that the turntable 901 drives the movable clamping device 2 and the fixed clamping device 3 to rotate 180° accurately, and the above adjustment is required.

[0049] When the movable clamping device 2 and the fixed clamping device 3 need to be recalibrated after clamping the wafer 6 for the first time or after multiple uses, the flip unit fixture guide seat 8 needs to be adjusted. During adjustment, first keep the fixed clamping device 3 in the lower position, and keep the fixed arm 304 stationary. Then, position the fixed tray 302 and the fixed tray connector 303, and lock them with connecting screws. At the same time, the fixed clamping device centering guide column 305 is positioned and locked with connecting screws, and the flip unit fixture guide seat 8 is sleeved on the fixed clamping device centering guide column 305. Lower the movable clamping device 2 until the lower end of the movable clamping device centering guide column 202 can be inserted into the positioning groove of the flip unit fixture guide seat 8 to achieve center position adjustment. After adjusting the center positions of the movable clamping device 2 and the fixed clamping device 3, place the wafer 6 in the lower low contact support column 301 of the fixed clamping device 3 to adjust the clamping height, and then lower the movable clamping device 2 until the upper low contact support column 201 contacts the upper surface of the wafer 6, and then adjust the front and rear installation positions by using the height adjustment gap 206 between the upper arm 204 and the upper tray connector 203, and by using the side adjustment gap between the upper tray 205 and the upper tray connector 203. After all the above positions are adjusted, tighten them with screws.

[0050] The working principle of the present invention is:

[0051] When wafer 6 is flipping, the equipment is first turned on and initialized, so that each unit is in the initial working position. Wafer 6 is sent to the low-contact centering mechanism 1 by the external conveying mechanism, and the center of wafer 6, the center of the movable clamping device 2, and the center of the fixed clamping device 3 are calibrated. Then, it is transferred to the movable clamping device 2 and the fixed clamping device 3 by the low-contact centering mechanism 1. Then, the wafer detection system 4 is used to judge and the detection result is fed back to the external control system (the external control system of the present invention is the prior art). Then, the external control system performs the flipping action of wafer 6 according to the feedback result. After wafer 6 is flipped 108°, the external conveying mechanism takes wafer 6 away for the next step. Specifically:

[0052] During the centering process, the centering lifting structure 101 is first raised to allow the centering support PIN 103 to receive the wafer 6, and then the centering motion actuator 102 drives the clamping arms 106 at both ends to move toward the wafer 6, and the centering terminal contactor 104 is used to calibrate the center of the wafer 6 so that the center of the wafer 6 is the same as the center of the movable clamping device 2 and the fixed clamping device 3 to ensure that the clamping action can be accurate. Then the centering lifting structure 101 is lowered to transfer the wafer 6 to the low-contact support column of the movable clamping device 2 or the fixed clamping device 3.

[0053] When the wafer 6 falls onto the low-contact support column, the presence detection sensor 401 of the wafer detection system 4 will detect whether the wafer 6 has been transferred to the clamping device, and the horizontal detection sensor 402 will detect whether the wafer 6 is tilted; at the same time, the above detection results are fed back to the external control system to determine whether an alarm is required or the next step is performed. When all the detection results are correct, the external control system controls the clamping actuator 702 to act, and the clamping actuator 702 drives the movable clamping device 2 to smoothly and gently approach the fixed clamping device 3; under the limiting action of the clamping actuator 702, the upper low-contact support column 201 and the lower low-contact support column 301 of the movable clamping device 2 and the fixed clamping device 3 are in low contact with the wafer 6 and press the wafer 6, and at the same time, the clamping position sensor 404 is triggered and fed back to the external control system, and the external control system controls the flipping actuator 701 to work, drive the turntable 901 to flip, and then drive the wafer 6 to flip 180° safely. After the flipping action is completed, the flipping position sensor 403 is triggered and a signal is sent to the external control system, thereby controlling the action of the clamping actuator 702, and the clamping actuator 702 drives the movable clamping device 2 to open smoothly and gently, while triggering the clamping position sensor 404 and feeding back to the external control system to determine the next action to be executed.

[0054] The present invention provides a low-contact wafer alignment and flipping system used in a wafer cleaning process, and utilizes a wafer detection system 4 and an airflow particle control system 5 to ensure the safety and cleanliness of the wafer flipping process, thereby solving the problem of quickly adjusting the wafer flipping system during the wafer process and ensuring the safety and cleanliness of the wafer flipping process.

Claims

1. A low-contact wafer centering and flipping system, characterized in that: The invention comprises a low-contact centering mechanism (1), a movable clamping device (2), a fixed clamping device (3), a wafer flipping mechanism (7) and a support frame (9), wherein the wafer flipping mechanism (7) comprises a flipping actuator (701) and a clamping actuator (702), the flipping actuator (701) is installed on the support frame (9), and the output end is connected to a turntable (901), the clamping actuator (702) is arranged on the turntable (901), one end of the movable clamping device (2) is connected to the output end of the clamping actuator (702), and one end of the fixed clamping device (3) is connected to the output end of the clamping actuator (702). Installed on a turntable (901), the other ends of the movable clamping device (2) and the fixed clamping device (3) are both clamping ends, and a low-contact centering mechanism (1) for centering the wafer (6) is provided on one side of the wafer (6); the movable clamping device (2) is driven by a clamping actuator (702) to move relative to the turntable (901) and clamp the wafer (6) with the fixed clamping device (3); the clamping actuator (702), the movable clamping device (2), the fixed clamping device (3) and the clamped wafer (6) are driven to rotate along with the turntable (901) by a flip actuator (701); The low-contact centering mechanism (1) comprises a centering lifting structure (101), a centering motion actuator (102), a centering support PIN (103), a centering terminal contactor (104), a carrier (105) and a clamping arm (106); the carrier (105) is mounted on the centering lifting structure (101); the carrier (105) is provided with a centering motion actuator (102); two output ends of the centering motion actuator (102) are respectively connected to clamping arms (106); a clamping end of each clamping arm (106) is provided with a centering terminal contactor (104) in contact with a wafer (6); and the carrier (105) is provided with a centering support PIN (103) for supporting the wafer (6).

2. The low-contact wafer centering and flipping system according to claim 1, characterized in that: The movable clamping device (2) comprises an upper low contact support column (201), an upper tray connecting member (203), an upper arm (204) and an upper tray (205); one end of the upper arm (204) is connected to the output end of the clamping actuator (702), and the other end is provided with an upper tray connecting member (203); an upper tray (205) is mounted on the upper tray connecting member (203); and an upper low contact support column (201) for clamping a wafer (6) is provided on the upper tray (205).

3. The low-contact wafer centering and flipping system according to claim 2, characterized in that: One side of the upper tray connecting piece (203) is connected to the other end of the upper arm (204), and a height adjustment gap (206) is left between one side of the upper tray connecting piece (203) and the other end of the upper arm (204); and side adjustment gaps are provided between the front and rear ends of the upper tray (205) and the upper tray connecting piece (203).

4. The low-contact wafer centering and flipping system according to claim 1, characterized in that: The fixed clamping device (3) comprises a lower low contact support column (301), a fixed tray (302), a fixed tray connecting piece (303) and a fixed arm (304); one end of the fixed arm (304) is fixedly connected to the turntable (901), and the other end is provided with a fixed tray connecting piece (303); a fixed tray (302) is mounted on the fixed tray connecting piece (303); and a lower low contact support column (301) for clamping a wafer (6) is provided on the fixed tray (302).

5. The low-contact wafer centering and flipping system according to claim 1, characterized in that: The movable clamping device (2) is provided with a movable clamping device centering guide column (202), and the fixed clamping device (3) is provided with a fixed clamping device centering guide column (305), and a flip unit fixture guide seat (8) is installed on the fixed clamping device centering guide column (305), and the movable clamping device centering guide column (202) is inserted into the positioning groove of the flip unit fixture guide seat (8) when in the calibration position.

6. The low-contact wafer centering and flipping system according to claim 1, characterized in that: The rotating disk (901) is provided with a strip groove in the radial direction, and one end of the movable clamping device (2) passes through the strip groove and is connected to the output end of the clamping actuator (702).

7. The low-contact wafer centering and flipping system according to claim 1, characterized in that: One end of the movable clamping device (2) is passed through a rotating disk (901) and is provided with a connecting plate (705). A slide rail (706) is provided on the rotating disk (901). The connecting plate (705) is slidably connected to the slide rail (706) via a slider. The output end of the clamping actuator (702) is connected to the connecting plate (705).

8. The low-contact wafer centering and flipping system according to claim 1, characterized in that: A wafer detection system (4) is installed on the support frame (9), and the wafer detection system (4) includes an existence detection sensor (401), a horizontal detection sensor (402), a flip position sensor (403) and a clamping position sensor (404). The side of the support frame (9) facing the wafer (6) is respectively installed with an existence detection sensor (401) for detecting the presence or absence of the wafer (6) and a horizontal detection sensor (402) for detecting whether the wafer (6) is tilted; the side of the support frame (9) away from the wafer (6) is respectively installed with a clamping position sensor (404) for detecting the movement of the movable clamping device (2) and a flip position sensor (403) for detecting the rotation angle of the turntable (901).

9. The low-contact wafer centering and flipping system according to claim 1, characterized in that: An airflow particle control system (5) mounted on a support frame (9) is provided below the fixed clamping device (3). The airflow particle control system (5) comprises a particle collection box (502) and a control pipeline (501). The particle collection box (502) is fixedly connected to the support frame (9), and a control pipeline (501) with negative pressure is externally connected to the particle collection box (502).

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