A planar moving part position sensing device

Abstract

The present invention discloses a planar moving part position sensing device, comprising a sensor sensing plate, a sensor main control board, a moving part, a frame base and a track, wherein the sensor sensing plate is mounted on the frame base surface, the track is mounted above the sensor sensing plate, the sensor main control board is mounted on the side of the moving part, a magnetic conductive material layer is arranged on the bottom surface of the moving part and can move along the track, the magnetic conductive material layer is spaced from the sensor sensing plate, an annular printed circuit is arranged in the sensor sensing plate and a fundamental wave signal is introduced, the sensor main control board is provided with a signal collection, amplification and calculation comparison circuit connected in sequence, when the moving part moves, an induced voltage is generated by the fundamental wave signal of the annular printed circuit in the sensor sensing plate, and the position and speed information of the moving part is obtained by collecting, amplifying and calculating and comparing the information on the position and speed of the moving part through the sensor main control board. The present invention has a simple structure, a small volume, is easy to install and has low dependence on the environment.

Description

Technical Field

[0001] The present invention relates to the field of mechanical control technology, and in particular to a planar moving part position sensing device, comprising a sensor sensing board, a sensor main control board, a moving part, a frame base and a track. Background Art

[0002] In the field of planar mechanical control technology, in order to accurately control the position and speed of a moving part, it is often necessary to know the position and speed information of the moving part.

[0003] At present, the commonly used position sensors in machinery include photoelectric sensors, Hall sensors, rotary transformers, etc. Among them, photoelectric sensors are widely used in various types of automation equipment due to their high precision, easy adjustment, and small restrictions on the detection of objects. However, their shortcomings are also particularly obvious, such as poor seismic resistance, complex processing technology, high manufacturing cost, large overall size, and easy to be affected by environmental factors. Summary of the invention

[0004] In view of the deficiencies in the prior art, the technical problem solved by the present invention is to provide a planar moving part position sensing device which has a simple structure, is miniaturized, and is not affected by environmental factors.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is a planar moving part position sensing device, including a sensor sensing plate, a sensor main control board, a moving part, a frame base and a track, the sensor sensing plate is installed on the frame base surface, the track is installed above the sensor sensing plate, the sensor main control board is installed on the side of the moving part, the bottom surface of the moving part is provided with a magnetic conductive material layer and can move along the track, the magnetic conductive material layer and the sensor sensing plate are spaced apart, an annular printed circuit is provided in the sensor sensing plate and a fundamental wave signal is passed through, the sensor main control board is provided with signal collection, amplification and calculation comparison circuits connected in sequence, when the moving part moves, the fundamental wave signal of the annular printed circuit in the sensor sensing plate triggers the generation of an induced voltage and is collected, amplified and calculated and compared by the sensor main control board to obtain the position and speed information of the moving part.

[0006] The sensor sensing board includes a fundamental wave layer and an induction layer. The fundamental wave layer and the induction layer are both made of insulating materials and are respectively provided with a fundamental wave coil and an induction coil made of printed circuits. The induction layer is stacked on top of the fundamental wave layer and fixedly connected. The fundamental wave coil and the induction coil are separated by the induction layer. The induced current generated by the fundamental wave coil and the induction coil is used to detect the position and speed information of the moving part.

[0007] The number of the induction coil is at least one, and the specific number can be set according to the needs of the detection position.

[0008] The number of the sensing layers is set to at least one and the specific number can be set according to actual detection needs.

[0009] The fundamental wave coil of the fundamental wave layer is in a divergent loop shape and is provided with a head end and a tail end. The head end is arranged near the middle line of the fundamental wave layer, and the tail end is arranged at the outer edge of the fundamental wave layer.

[0010] The induction coil of the induction layer is a divergent circle, and is provided with a head end and a tail end, wherein the head end is arranged near the center of the circle, and the tail end is arranged outside the circle.

[0011] The sensor main control board is made of insulating material and is provided with a main control board signal output part and a main control board signal collection part. The main control board signal output part includes an initial signal input and output circuit, a fundamental wave operational amplifier circuit and an induced voltage operational amplifier circuit. The initial signal input and output circuit inputs the initial signal into the fundamental wave operational amplifier circuit and the induced voltage operational amplifier circuit for signal amplification through induction of an energized coil; the main control board signal collection part includes a signal comparison and calculation circuit, which compares and calculates the amplified signal input from the main control board signal output part to achieve the purpose of detecting the position and speed information of the rotating part.

[0012] The initial signal input and output circuit includes a fundamental wave coil circuit and a phase induction coil circuit. The fundamental wave coil circuit is provided with a sixth metal film fixed resistor and a fundamental wave coil. The metal film fixed resistor is connected in series with the fundamental wave coil. The fundamental wave coil is arranged on the fundamental wave layer of the matching sensor sensing board. The phase induction coil circuit includes a phase induction coil. The phase induction coil is arranged on the induction layer of the matching sensor sensing board.

[0013] The fundamental wave operational amplifier circuit includes a first operational amplifier, fourth to eighth chip capacitors, and seventh to fourteenth metal film fixed resistors. The seventh and eighth metal film fixed resistors are connected in series and connected to the No. 4 pin of the first operational amplifier, and the other end of the seventh metal film fixed resistor is connected to the HJN output end of the fundamental wave coil; the ninth and tenth metal film fixed resistors are connected in series and connected to the eleventh metal film fixed resistor, the twelfth metal film fixed resistor, and one end of the fifth chip capacitor and then connected to the No. 3 pin of the first operational amplifier, the other end of the ninth metal film fixed resistor is connected to the HJP output end of the fundamental wave coil, the other end of the eleventh metal film fixed resistor is input with a forward voltage, the other end of the twelfth metal film fixed resistor is connected to the other end of the fifth chip capacitor and then grounded; one end of the fourth chip capacitor The first operational amplifier is connected with the seventh and eighth metal film fixed resistors, and the other end is connected with the ninth and tenth metal film fixed resistors; the second pin of the first operational amplifier is grounded, the fifth pin of the first operational amplifier is connected to a forward voltage, and is connected to one end of the seventh chip capacitor before being connected to the forward voltage, and the other end of the seventh chip capacitor is grounded; the sixth chip capacitor is connected to the thirteenth metal film fixed resistor in parallel, and one end is connected to the fourth pin of the first operational amplifier, and the other end is connected to the first pin of the first operational amplifier, and the first pin of the first operational amplifier is also connected to one end of the fourteenth metal film fixed resistor, and the other end of the fourteenth metal film fixed resistor is connected to one end of the eighth chip capacitor and then output through the output terminal J, and the other end of the eighth chip capacitor is grounded.

[0014] The induction voltage operational amplifier circuit is divided into a U-phase induction voltage operational amplifier circuit, a V-phase induction voltage operational amplifier circuit and a W-phase induction voltage operational amplifier circuit;

[0015] The U-phase induction voltage operational amplifier circuit includes a second operational amplifier, ninth to thirteenth chip capacitors, and fifteenth to twenty-second metal film fixed resistors. The fifteenth and sixteenth metal film fixed resistors are connected in series and connected to the fourth pin of the second operational amplifier, and the other end of the fifteenth metal film fixed resistor is connected to the HUN output end of the U-phase induction coil; the seventeenth and eighteenth metal film fixed resistors are connected in series with the nineteenth metal film fixed resistor, the twentieth metal film fixed resistor, and one end of the tenth chip capacitor and then connected to the third pin of the second operational amplifier, the other end of the seventeenth metal film fixed resistor is connected to the HUP output end of the U-phase induction coil, the other end of the nineteenth metal film fixed resistor is input with a forward voltage, the other end of the twentieth metal film fixed resistor is connected to the other end of the tenth chip capacitor and then grounded; the ninth chip capacitor One end of the capacitor is connected to the fifteenth and sixteenth metal film fixed resistors, and the other end is connected to the seventeenth and eighteenth metal film fixed resistors; Pin 2 of the second operational amplifier is grounded, Pin 5 of the second operational amplifier is connected to a forward voltage, and is connected to one end of the twelfth chip capacitor before being connected to the forward voltage, and the other end of the twelfth chip capacitor is grounded; the eleventh chip capacitor is connected to the twenty-first metal film fixed resistor in parallel, and one end is connected to Pin 4 of the second operational amplifier, and the other end is connected to Pin 1 of the second operational amplifier, and Pin 1 of the second operational amplifier is simultaneously connected to one end of the twenty-second metal film fixed resistor, and the other end of the twenty-second metal film fixed resistor is connected to one end of the thirteenth chip capacitor and then output through the output terminal U, and the other end of the thirteenth chip capacitor is grounded.

[0016] The V-phase induction voltage operational amplifier circuit includes a third operational amplifier, fourteenth to eighteenth chip capacitors, twenty-third to thirtieth metal film fixed resistors, the twenty-third and twenty-fourth metal film fixed resistors are connected in series and connected to the fourth pin of the third operational amplifier, and the other end of the twenty-third metal film fixed resistor is connected to the HVN output end of the V-phase induction coil; the twenty-fifth and twenty-sixth metal film fixed resistors are connected in series and connected to the twenty-seventh metal film fixed resistor, the twenty-eighth metal film fixed resistor, and one end of the fifteenth chip capacitor and then connected to the third pin of the third operational amplifier, the other end of the twenty-fifth metal film fixed resistor is connected to the HVP output end of the V-phase induction coil, the other end of the twenty-seventh metal film fixed resistor is input with a forward voltage, the other end of the twenty-eighth metal film fixed resistor is connected to the other end of the fifteenth chip capacitor and then grounded; One end of the fourteenth chip capacitor is connected to the twenty-third and twenty-fourth metal film fixed resistors, and the other end is connected to the twenty-fifth and twenty-sixth metal film fixed resistors; Pin No. 2 of the third operational amplifier is grounded, Pin No. 5 of the third operational amplifier is connected to a forward voltage, and is connected to one end of the seventeenth chip capacitor before being connected to the forward voltage, and the other end of the seventeenth chip capacitor is grounded; After the sixteenth chip capacitor is connected in parallel with the twenty-ninth metal film fixed resistor, one end is connected to Pin No. 4 of the third operational amplifier, and the other end is connected to Pin No. 1 of the third operational amplifier, and Pin No. 1 of the third operational amplifier is also connected to one end of the thirtieth metal film fixed resistor, and the other end of the thirtieth metal film fixed resistor is connected to one end of the eighteenth chip capacitor and then output through the output terminal V, and the other end of the eighteenth chip capacitor is grounded.

[0017] The W-phase induced voltage operational amplifier circuit includes a fourth operational amplifier, nineteenth to twenty-third chip capacitors, and thirty-first to thirty-eighth metal film fixed resistors. The thirty-first and thirty-second metal film fixed resistors are connected in series and connected to the fourth pin of the fourth operational amplifier, and the other end of the thirty-first metal film fixed resistor is connected to the HWN output end of the W phase induction coil; the thirty-third and thirty-fourth metal film fixed resistors are connected in series and connected to the thirty-fifth metal film fixed resistor, the thirty-sixth metal film fixed resistor, and one end of the twentieth chip capacitor and then connected to the third pin of the fourth operational amplifier, the other end of the thirty-third metal film fixed resistor is connected to the HWJP output end of the W phase induction coil, the other end of the thirty-fifth metal film fixed resistor is input with a forward voltage, the other end of the thirty-sixth metal film fixed resistor is connected to the other end of the twentieth chip capacitor and then grounded; One end of the ninth chip capacitor is connected to the thirty-first and thirty-second metal film fixed resistors, and the other end is connected to the thirty-third and thirty-fourth metal film fixed resistors; Pin 2 of the fourth operational amplifier is grounded, Pin 5 of the fourth operational amplifier is connected to a forward voltage, and is connected to one end of the twenty-second chip capacitor before being connected to the forward voltage, and the other end of the twenty-second chip capacitor is grounded; The twenty-first chip capacitor is connected to the thirty-seventh metal film fixed resistor in parallel, and one end is connected to Pin 4 of the fourth operational amplifier, and the other end is connected to Pin 1 of the fourth operational amplifier, and Pin 1 of the fourth operational amplifier is also connected to one end of the thirty-eighth metal film fixed resistor, and the other end of the thirty-eighth metal film fixed resistor is connected to one end of the twenty-third chip capacitor and then output through the output terminal W, and the other end of the twenty-third chip capacitor is grounded.

[0018] The signal comparison calculation circuit includes a microcontroller, a single-tube diode, first to fifth metal film fixed resistors and first to third chip capacitors. The 8th to 11th pins of the microcontroller are respectively connected to the J output end of the fundamental wave operational amplifier circuit, the U output end of the U-phase inductive voltage operational amplifier circuit, the V output end of the V-phase inductive voltage operational amplifier circuit, and the W output end of the W-phase inductive voltage operational amplifier circuit to receive input signals, and the U-phase signal is output through the 30th pin, the V-phase signal is output through the 28th pin, and the W-phase signal is output through the 27th pin. The first metal film fixed resistor is connected in series with the second chip capacitor and then connected in parallel with the single-tube diode, and one end is grounded, and the other end inputs a forward voltage and is connected to the No. 1 pin of the microcontroller. One end of the first chip capacitor is connected to the No. 1 pin of the microcontroller, and the other end is connected to the No. 32 pin of the microcontroller. The No. 32 pin of the microcontroller is also grounded. The No. 5 pin of the microcontroller is connected to a forward voltage; the No. 16 pin and the No. 17 pin of the microcontroller are respectively connected to the two ends of the third chip capacitor, the No. 16 pin of the microcontroller is grounded, and the No. 17 pin of the microcontroller inputs a forward voltage; the No. 23 pin of the microcontroller is connected to the second metal film fixed resistor, and the other end of the second metal film fixed resistor is connected to the SWDIO port at the output end of the microcontroller, the No. 24 pin of the microcontroller is connected to the third metal film fixed resistor, and the other end of the third metal film fixed resistor is connected to the SWCLK port at the output end of the microcontroller, the No. 31 pin of the microcontroller is connected to the fourth metal film fixed resistor, and the other end of the fourth metal film fixed resistor is grounded; the output end 3 output port of the microcontroller is connected to the fifth metal film fixed resistor and then grounded together with the output end 2 output port, and the output end 4 output port of the microcontroller inputs a forward voltage.

[0019] Compared with the prior art, the present invention has a simple structure, a small volume, is easy to install, and has little dependence on the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the sensor board structure decomposition;

[0022] Figure 3 It is a schematic diagram of the fundamental wave layer structure;

[0023] Figure 4 Schematic diagram of the sensing layer structure;

[0024] Figure 5 This is a schematic diagram of the structure of the sensor main control board;

[0025] Figure 6 It is a schematic diagram of the working principle of the present invention;

[0026] Figure 7 It is the waveform diagram of the fundamental wave coil;

[0027] Figure 8 It is the waveform diagram of the phase induction coil;

[0028] Fig. 9 is a fundamental wave coil circuit;

[0029] Fig.10 It is the U phase induction coil circuit;

[0030] Fig.11 It is the V phase induction coil circuit;

[0031] Fig.12 It is a W phase induction coil circuit;

[0032] Fig.13 It is a fundamental wave operational amplifier circuit;

[0033] Fig.14 It is the U-phase induced voltage operational amplifier circuit;

[0034] Fig.15 It is a V-phase induced voltage operational amplifier circuit;

[0035] Fig.16 It is a W-phase induced voltage operational amplifier circuit;

[0036] Fig.17 It is a signal comparison calculation circuit;

[0037] Fig.18 This is a schematic diagram of the microcontroller output port;

[0038] Fig.19 It is a schematic block diagram of the working process of the present invention;

[0039] Fig. 20 Input and output ports for the sensor main control board. DETAILED DESCRIPTION

[0040] The specific implementation modes of the present invention are further described below in conjunction with the accompanying drawings and embodiments, but the present invention is not limited thereto.

[0041] Example:

[0042] Figure 1The invention shows a planar moving part position sensing device, which includes a sensor sensing plate 1, a sensor main control board 2, a moving part 3, a frame base 4 and a track 5. The sensor sensing plate 1 is installed on the frame base 4 surface, the track 5 is installed above the sensor sensing plate 1, the sensor main control board 2 is installed on the side of the moving part 3, the bottom surface of the moving part 3 is provided with a magnetic conductive material layer 31 and can move along the track 5, the magnetic conductive material layer 31 is spaced from the sensor sensing plate 1, an annular printed circuit is provided in the sensor sensing plate 1 and a fundamental wave signal is introduced, the sensor main control board 2 is provided with a signal collection, amplification and calculation comparison circuit connected in sequence, when the moving part 3 moves, the fundamental wave signal of the annular printed circuit in the sensor sensing plate 1 triggers an induced voltage to be generated and the position and speed information of the moving part 3 is obtained by collecting, amplifying and calculating and comparing the information through the sensor main control board 2.

[0043] like Figure 2 The sensor sensing board 1 shown in the figure includes a fundamental wave layer 11 and an induction layer 12. The fundamental wave layer 11 and the induction layer 12 are both made of insulating materials and are respectively provided with a fundamental wave coil 111 and an induction coil 121 made of printed circuits. The induction layer 12 is stacked on the fundamental wave layer 11 and fixedly connected. The fundamental wave coil 111 and the induction coil 121 are separated by the induction layer 12. The induced current generated by the fundamental wave coil 111 and the induction coil 121 is used to detect the position and speed information of the moving part.

[0044] The number of the induction coil 121 is at least one, and the specific number can be set according to the need of the detection position.

[0045] The number of the sensing layers 12 is set to be at least one, and the specific number can be set according to actual detection needs.

[0046] like Figure 3 As shown, the fundamental wave coil 111 of the fundamental wave layer 11 is divergent and has a head end and a tail end, the head end is arranged near the middle line of the fundamental wave layer 11, and the tail end is arranged at the outer edge of the fundamental wave layer 11. Preferably, the fundamental wave coil 111 is a printed coil with a line width of 0.15 mm, a line spacing of 0.15 mm, and a coil number of 50 turns.

[0047] like Figure 4 As shown, the induction coil 121 of the induction layer 12 is a divergent circle, with a head end and a tail end, the head end is located near the center of the circle, and the tail end is located outside the circle. Preferably, the induction coil 121 is a printed coil with a line width of 0.15 mm, a line spacing of 0.15 mm, and 20 coils.

[0048] like Figure 5The sensor main control board 2 shown is made of insulating material and is provided with a main control board signal output part 21 and a main control board signal collection part 22. The main control board signal output part 21 includes an initial signal input and output circuit, a fundamental wave operational amplifier circuit and an induced voltage operational amplifier circuit. The initial signal input and output circuit inputs the initial signal into the fundamental wave operational amplifier circuit and the induced voltage operational amplifier circuit for signal amplification through induction of the energized coil; the main control board signal collection part 22 includes a signal comparison and calculation circuit, which compares and calculates the amplified signal input from the main control board signal output part 21 to achieve the purpose of detecting the position and speed information of the rotating part 3.

[0049] like Figure 6 As shown, the initial signal in the signal output part 21 of the main control board is input into the reference signal on the left side of the rotating member 3 through the input and output circuit to obtain Figure 7 The fundamental wave graph shown is Figure 6 The phase energized coil on the right side of the rotating member 3 shown in the figure senses Figure 8 The phase induced wave pattern shown.

[0050] The initial signal input and output circuit includes a fundamental wave coil circuit and a phase induction coil circuit, such as Fig. 9 As shown, the fundamental wave coil circuit is provided with a sixth metal film fixed resistor R6 and a fundamental wave coil Coil1, the sixth metal film fixed resistor R6 is connected in series with the fundamental wave coil Coil1, the fundamental wave coil Coil1 is provided on the fundamental wave layer on the matching sensor sensing board 1, and the phase induction coil circuit includes phase induction coils Coil2 to Coil4, as shown Figures 10 to 12 As shown, the phase induction coils Coil2 to Coil4 are arranged on the induction layer of the matching sensor induction board 1. Preferably, the model parameter of the sixth metal film fixed resistor R6 is 200R / 2W.

[0051] like Fig.13As shown, the fundamental wave operational amplifier circuit includes a first operational amplifier U2, a fourth chip capacitor C4 to an eighth chip capacitor C8, a seventh metal film fixed resistor R7 to a fourteenth metal film fixed resistor R14, the seventh metal film fixed resistor R7 and the eighth metal film fixed resistor R8 are connected in series and connected to the No. 4 pin of the first operational amplifier U2, and the other end of the seventh metal film fixed resistor R7 is connected to the HJN output end of the fundamental wave coil Coil1; the ninth metal film fixed resistor R9 and the tenth metal film fixed resistor R10 are connected in series and connected to the eleventh metal film fixed resistor R11, the twelfth metal film fixed resistor R12, and one end of the fifth chip capacitor C5 and then connected to the No. 3 pin of the first operational amplifier U2, the other end of the ninth metal film fixed resistor R9 is connected to the HJP output end of the fundamental wave coil Coil1, the other end of the eleventh metal film fixed resistor R11 is input with a forward voltage of 3.3V, and the other end of the twelfth metal film fixed resistor R12 is connected to the fifth chip capacitor C5. The other end is connected and grounded; one end of the fourth chip capacitor C4 is connected to the seventh metal film fixed resistor R7 and the eighth metal film fixed resistor R8, and the other end is connected to the ninth metal film fixed resistor R9 and the tenth metal film fixed resistor R10; Pin 2 of the first operational amplifier U2 is grounded, Pin 5 of the first operational amplifier U2 is connected to a forward voltage of 3.3V, and is connected to one end of the seventh chip capacitor C7 before being connected to the forward voltage, and the other end of the seventh chip capacitor C7 is grounded; the sixth chip capacitor C6 is connected to the thirteenth metal film fixed resistor R13 in parallel and then connected to Pin 4 of the first operational amplifier U2, and the other end is connected to Pin 1 of the first operational amplifier U2, Pin 1 of the first operational amplifier U2 is also connected to one end of the fourteenth metal film fixed resistor R14, the other end of the fourteenth metal film fixed resistor R14 is connected to one end of the eighth chip capacitor C8 and then output through the output terminal J, and the other end of the eighth chip capacitor C8 is grounded. Preferably, the model parameters of the first operational amplifier U2 are TSV911ILT, the model parameters of the fourth chip capacitor C4 and the eighth chip capacitor C8 are 101J / 50V / X7R, the model parameters of the fifth chip capacitor C5 and the sixth chip capacitor C6 are 150J / 50V / X7R, and the model parameters of the seventh chip capacitor C7 are 104K / 50V / X7R; the model parameters of the seventh metal film fixed resistor R7, the ninth metal film fixed resistor R9, and the fourteenth metal film fixed resistor R14 are 100R-F / 0.1W, the model parameters of the eighth metal film fixed resistor R8 and the tenth metal film fixed resistor R10 are 3.9K-F / 0.1W, the model parameters of the eleventh metal film fixed resistor R11 and the twelfth metal film fixed resistor R12 are 20K-F / 0.1W, and the model parameters of the thirteenth metal film fixed resistor R13 are 10K-F / 0.1W;

[0052] The induction voltage operational amplifier circuit is divided into a U-phase induction voltage operational amplifier circuit, a V-phase induction voltage operational amplifier circuit and a W-phase induction voltage operational amplifier circuit;

[0053] like Fig.14As shown, the U-phase induction voltage operational amplifier circuit includes a second operational amplifier U3, a ninth chip capacitor C9 to a thirteenth chip capacitor C13, a fifteenth metal film fixed resistor R15 to a twenty-second metal film fixed resistor R20, the fifteenth metal film fixed resistor R15 and the sixteenth metal film fixed resistor R16 are connected in series and connected to the fourth pin of the second operational amplifier U3, and the other end of the fifteenth metal film fixed resistor R15 is connected to the HUN output end of the U-phase phase induction coil Coil2; the seventeenth metal film fixed resistor R17 and the eighteenth metal film fixed resistor R18 are connected in series and connected to the nineteenth metal film fixed resistor R19, the twentieth metal film fixed resistor R22, and one end of the tenth chip capacitor C10 and then connected to the third pin of the second operational amplifier U3, the other end of the seventeenth metal film fixed resistor R17 is connected to the HUP output end of the U-phase phase induction coil Coil2, the other end of the nineteenth metal film fixed resistor R19 is input with a forward voltage of 3.3V, and the other end of the twentieth metal film fixed resistor R20 is connected to the tenth chip capacitor C10. The other end of the capacitor C10 is connected to the ground; one end of the ninth chip capacitor C9 is connected to the fifteenth metal film fixed resistor R15 and the sixteenth metal film fixed resistor R16, and the other end is connected to the seventeenth metal film fixed resistor R17 and the eighteenth metal film fixed resistor R18; the second operational amplifier U3 pin 2 is grounded, the second operational amplifier U3 pin 5 is connected to the forward voltage 3.3V, and before the forward voltage is connected, one end of the twelfth chip capacitor C12 is connected, and the twelfth chip capacitor C 12 the other end is grounded; the eleventh chip capacitor C11 is connected in parallel with the twenty-first metal film fixed resistor R21, and one end is connected to the No. 4 pin of the second operational amplifier U3, and the other end is connected to the No. 1 pin of the second operational amplifier U3, and the No. 1 pin of the second operational amplifier U3 is also connected to one end of the twenty-second metal film fixed resistor R22, the other end of the twenty-second metal film fixed resistor R22 is connected to one end of the thirteenth chip capacitor C13 and then output through the output terminal U, and the other end of the thirteenth chip capacitor C13 is grounded. Preferably, the model parameters of the second operational amplifier U3 are TSV911ILT, the model parameters of the ninth chip capacitor C9 and the thirteenth chip capacitor C13 are 101J / 50V / X7R, the model parameters of the tenth chip capacitor C10 and the eleventh chip capacitor C11 are 150J / 50V / X7R, and the model parameters of the twelfth chip capacitor C12 are 104K / 50V / X7R; the model parameters of the fifteenth metal film fixed resistor R15, the seventeenth metal film fixed resistor R17, and the twenty-second metal film fixed resistor R22 are 100R-F / 0.1W, the model parameters of the sixteenth metal film fixed resistor R16 and the eighteenth metal film fixed resistor R18 are 3.9K-F / 0.1W, the model parameters of the nineteenth metal film fixed resistor R19 and the twentieth metal film fixed resistor R20 are 20K-F / 0.1W, and the model parameters of the twenty-first metal film fixed resistor R21 are 10K-F / 0.1W.

[0054] like Fig.15As shown, the V-phase induction voltage operational amplifier circuit includes a third operational amplifier U4, a fourteenth chip capacitor C14 to an eighteenth chip capacitor C18, a twenty-third metal film fixed resistor R23 to a thirtieth metal film fixed resistor R30, the twenty-third metal film fixed resistor R23 and the twenty-fourth metal film fixed resistor R24 ​​are connected in series and connected to the fourth pin of the third operational amplifier U4, and the other end of the twenty-third metal film fixed resistor R23 is connected to the HVN output end of the V-phase phase induction coil Coil3; the twenty-fifth metal film fixed resistor R25 and the twenty-sixth metal film fixed resistor R26 are connected in series with the twenty-seventh metal film fixed resistor R27, the twenty-eighth metal film fixed resistor R28, and one end of the fifteenth chip capacitor C15 and then connected to the third pin U4, the other end of the twenty-fifth metal film fixed resistor R25 is connected to the HVP output end of the V-phase induction coil Coil3, the other end of the twenty-seventh metal film fixed resistor R27 is input with a forward voltage of 3.3V, and the other end of the twenty-eighth metal film fixed resistor R28 is connected to the The other end of the fifteenth chip capacitor C15 is connected to the ground; one end of the fourteenth chip capacitor C14 is connected to the twenty-third metal film fixed resistor R23 and the twenty-fourth metal film fixed resistor R24, and the other end is connected to the twenty-fifth metal film fixed resistor R25 and the twenty-sixth metal film fixed resistor R26; the second pin of the third operational amplifier U4 is grounded, the fifth pin of the third operational amplifier U4 is connected to the forward voltage 3.3V, and before the forward voltage is connected, one end of the seventeenth chip capacitor C17 is connected, and the tenth The other end of the seven chip capacitors C17 is grounded; the sixteenth chip capacitor C16 is connected in parallel with the twenty-ninth metal film fixed resistor R29, and one end is connected to the No. 4 pin of the third operational amplifier U4, and the other end is connected to the No. 1 pin of the third operational amplifier U4. The No. 1 pin of the third operational amplifier U4 is also connected to one end of the thirtieth metal film fixed resistor R30. The other end of the thirtieth metal film fixed resistor R30 is connected to one end of the eighteenth chip capacitor C18 and then output through the output terminal V. The other end of the eighteenth chip capacitor C18 is grounded.Preferably, the model parameters of the third operational amplifier U4 are TSV911ILT, the model parameters of the fourteenth chip capacitor C14 and the eighteenth chip capacitor C18 are 101J / 50V / X7R, the model parameters of the fifteenth chip capacitor C15 and the sixteenth chip capacitor C16 are 150J / 50V / X7R, and the model parameters of the seventeenth chip capacitor C17 are 104K / 50V / X7R; the model parameters of the twenty-third metal film fixed resistor R23, the twenty-fifth metal film fixed resistor R25, and the thirtieth metal film fixed resistor R30 are 100R-F / 0.1W, the model parameters of the twenty-fourth metal film fixed resistor R24 ​​and the twenty-sixth metal film fixed resistor R26 are 3.9K-F / 0.1W, the model parameters of the twenty-seventh metal film fixed resistor R27 and the twenty-eighth metal film fixed resistor R28 are 20K-F / 0.1W, and the model parameters of the twenty-ninth metal film fixed resistor R29 are 10K-F / 0.1W;.

[0055] like Fig.16As shown, the W-phase induced voltage operational amplifier circuit includes a fourth operational amplifier U5, a nineteenth chip capacitor C19 to a twenty-third chip capacitor C23, a thirty-first metal film fixed resistor R31 to a thirty-eighth metal film fixed resistor R38, the thirty-first metal film fixed resistor R31 and the thirty-second metal film fixed resistor R32 are connected in series and connected to the fourth pin of the fourth operational amplifier U5, and the other end of the thirty-first metal film fixed resistor R31 is connected to the HWN output end of the W phase induction coil Coil4; the thirty-third metal film fixed resistor R33 and the thirty-fourth metal film fixed resistor R34 are connected in series with the thirty-fifth metal film fixed resistor R35, the thirty-sixth metal film fixed resistor R36, and one end of the twentieth chip capacitor C2 and then connected to the third pin of the fourth operational amplifier U5, the other end of the thirty-third metal film fixed resistor R33 is connected to the HWJP output end of the W phase induction coil Coil4, the other end of the thirty-fifth metal film fixed resistor R35 is input with a forward voltage of 3.3V, and the other end of the thirty-sixth metal film fixed resistor R36 is connected to the twentieth chip capacitor C2 The other end of the chip capacitor C20 is connected to the ground; one end of the nineteenth chip capacitor C19 is connected to the thirty-first metal film fixed resistor R31 and the thirty-second metal film fixed resistor R32, and the other end is connected to the thirty-third metal film fixed resistor R33 and the thirty-fourth metal film fixed resistor R34; the second pin of the fourth operational amplifier U5 is grounded, the fifth pin of the fourth operational amplifier U5 is connected to the forward voltage 3.3V, and before the forward voltage is connected, one end of the twenty-second chip capacitor C22 is connected, and the twenty-second chip The other end of capacitor C22 is grounded; the twenty-first chip capacitor C21 is connected in parallel with the thirty-seventh metal film fixed resistor R37, and one end is connected to pin 4 of the fourth operational amplifier U5, and the other end is connected to pin 1 of the fourth operational amplifier U5. Pin 1 of the fourth operational amplifier U5 is also connected to one end of the thirty-eighth metal film fixed resistor R38. The other end of the thirty-eighth metal film fixed resistor R38 is connected to one end of the twenty-third chip capacitor C23 and then output through the output terminal W. The other end of the twenty-third chip capacitor C23 is grounded.Preferably, the model parameters of the fourth operational amplifier U5 are TSV911ILT, the model parameters of the nineteenth chip capacitor C19 and the twenty-third chip capacitor C23 are 101J / 50V / X7R, the model parameters of the twentieth chip capacitor C20 and the twenty-first chip capacitor C21 are 150J / 50V / X7R, and the model parameters of the twenty-second chip capacitor C22 are 104K / 50V / X7R; the model parameters of the thirty-first metal film fixed resistor R31, the thirty-third metal film fixed resistor R33, and the thirty-eighth metal film fixed resistor R38 are 100R-F / 0.1W, the model parameters of the thirty-second metal film fixed resistor R32 and the thirty-fourth metal film fixed resistor R34 are 3.9K-F / 0.1W, the model parameters of the thirty-fifth metal film fixed resistor R35 and the thirty-sixth metal film fixed resistor R36 are 20K-F / 0.1W, and the model parameters of the thirty-seventh metal film fixed resistor R37 are 10K-F / 0.1W;.

[0056] like Fig.17 As shown, the signal comparison calculation circuit includes a microcontroller U1, a single-tube diode ZD1, a first metal film fixed resistor R1 to a fifth metal film fixed resistor R5 and a first chip capacitor C1 to a third chip capacitor C3. The 8th to 11th pins of the microcontroller U1 are respectively connected to the J output end of the fundamental wave operational amplifier circuit, the U output end of the U phase induction voltage operational amplifier circuit, the V output end of the V phase induction voltage operational amplifier circuit, and the W output end of the W phase induction voltage operational amplifier circuit to receive input signals. The U phase signal is output through the 30th pin, the V phase signal is output through the 28th pin, and the W phase signal is output through the 27th pin. The first metal film fixed resistor R1 is connected in series with the second chip capacitor C2 and then connected in parallel with the single-tube diode ZD1, with one end grounded and the other end inputting a forward signal. The voltage is 3.3V and connected to the No. 1 pin of the microcontroller U1. One end of the first chip capacitor C1 is connected to the No. 1 pin of the microcontroller U1, and the other end is connected to the No. 32 pin of the microcontroller U1. The No. 32 pin of the microcontroller U1 is also grounded; the No. 5 pin of the microcontroller U1 is connected to the forward voltage of 3.3V; the No. 16 pin and the No. 17 pin of the microcontroller U1 are respectively connected to the two ends of the third chip capacitor C3, the No. 16 pin of the microcontroller U1 is grounded, and the No. 17 pin of the microcontroller U1 inputs the forward voltage of 3.3V; the No. 23 pin of the microcontroller U1 is connected to the second metal film fixed resistor R2, and the other end of the second metal film fixed resistor R2 is connected to the SWDIO port of the output end of the microcontroller U1, such as Fig.18 As shown; the 24th pin of the microcontroller U1 is connected to the third metal film fixed resistor R3, and the other end of the third metal film fixed resistor R3 is connected to the SWCLK port of the output end of the microcontroller U1, as shown Fig.18As shown; pin 31 of the microcontroller U1 is connected to the fourth metal film fixed resistor R4, and the other end of the fourth metal film fixed resistor R4 is grounded; the output end 3 output port of the microcontroller is connected to the fifth metal film fixed resistor R5 and then grounded together with the output end 2 output port, and the output end 4 output port of the microcontroller inputs a forward voltage of 3.3V. Preferably, the model parameter of the microcontroller U1 is STM32F031K6T7, the model parameter of the single-tube diode ZD1 is KDZ3.6B, the model parameter of the first metal film fixed resistor R1 is 10K-F / 0.1W, the model parameters of the second metal film fixed resistor R2 and the third metal film fixed resistor R3 are 100R-F / 0.1W, the model parameter of the fourth metal film fixed resistor R4 is 1K-F / 0.1W, the model parameter of the fifth metal film fixed resistor R5 is 4.7K-F / 0.1W, the model parameter of the first chip capacitor C1 is 225K / 50V / X7R, the model parameters of the second chip capacitor C2 and the third chip capacitor C3 are 104K / 50V / X7R, and the model parameter of the fourth chip capacitor C4 is 101J / 50V / X7R.

[0057] Working process of the present invention:

[0058] like Figure 1 , Fig.19 As shown, the sensor main control board 2 is used together with the sensor induction board 1 to measure the rotation position and speed information of the rotating part 3. The sensor main control board 2 and the sensor induction board 1 are fixed and installed on the axial end surface of the rotating part 3 and have a certain gap with the axial end surface of the rotating part 3. The fundamental wave coil Coil1 and the phase induction coils Coil2 to Coil4 are separately connected to the initial signal input and output circuit on the sensor main control board 2, and the initial signal input and output circuit signal input signal comparison calculation circuit. A 10V / 100KHz sinusoidal signal is input to the fundamental wave coil Coil1, and the fundamental wave coil Coil1 and the phase induction coils Coil2 to Coil4 respectively induce an induced voltage. When the rotating part 3 rotates, the rotating part 3 will change the magnetic field around the fundamental wave coil Coil1 and the phase induction coils Coil2 to Coil4. The amplitude and phase of the induced voltage of the fundamental wave coil Coil1 and the phase induction coils Coil2 to Coil4 will change with the induction. The fundamental wave and phase signals are amplified by the operational amplifier and collected by the signal comparison calculation circuit on the sensor main control board 2. The signal comparison calculation circuit compares the amplitude and phase of the induced voltage on the fundamental wave coil Coil1 and the phase induction coils Coil2 to Coil4 respectively, and the position and speed information of the rotating part 3 is obtained by comparing the signals according to the comparison calculation. Specifically, Fig. 20 As shown, the connection port of the sensor main control board 2 corresponds to the connection Fig. 9 The fundamental wave coil circuit shown in FIG. 1 and the induction signal output when the rotating member 3 rotates are as follows: Fig.10 ,8 , as shown in 9, the sensing signal input Figures 13 to 16 The fundamental wave operational amplifier circuit, the U phase induction voltage operational amplifier circuit, the V phase induction voltage operational amplifier circuit, and the W phase induction voltage operational amplifier circuit shown in the figure are connected to the No. 1 pin after being amplified by the first operational amplifier U2. Fig.17 The U-phase signal is amplified by the second operational amplifier U3 and then connected to the pin 1. Fig.17 The V phase signal is amplified by the third operational amplifier U4 and then connected to the pin 1. Fig.17 The W-phase signal is amplified by the fourth operational amplifier U5 and then connected to the pin 10 of the microcontroller U1. Fig.17 The U, V, and W phase signals are calculated by the microcontroller U1 and output from the 30th, 28th, and 27th pins of the microcontroller U1. The signal comparison calculation circuit compares the amplitude and phase of the induced voltage on the fundamental wave and the phase induction coil. Figure 7 , Figure 8 As shown, a comparison is made, and the position and speed information of the rotating part are obtained by comparing the signals according to the comparison calculation.

[0059] Compared with the prior art, the present invention has a simple structure, a small volume, is easy to install, and has little dependence on the environment.

[0060] The above is a detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and embodiments, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations to these embodiments without departing from the principles and spirit of the present invention still fall within the scope of protection of the present invention.

Claims

1. A planar moving part position sensing device, characterized in that: It includes a sensor induction board, a sensor main control board, a moving part, a frame base and a track, wherein the sensor induction board is installed on the frame base surface, the track is installed above the sensor induction board, the sensor main control board is installed on the side of the moving part, the bottom surface of the moving part is provided with a magnetic conductive material layer and can move along the track, the magnetic conductive material layer is spaced from the sensor induction board, an annular printed circuit is provided in the sensor induction board and a fundamental wave signal is introduced, the sensor main control board is provided with a signal collection, amplification and calculation comparison circuit connected in sequence, when the moving part moves, the fundamental wave signal of the annular printed circuit in the sensor induction board triggers the generation of an induced voltage, and the position and speed information of the moving part are obtained through the collection, amplification and calculation comparison by the sensor main control board; The sensor induction board includes a fundamental wave layer and an induction layer, the fundamental wave layer and the induction layer are both made of insulating materials and are respectively provided with a fundamental wave coil and an induction coil made of printed circuits, the induction layer is stacked on the fundamental wave layer and fixedly connected, and the fundamental wave coil and the induction coil are separated by the induction layer; The fundamental wave coil is a divergent circular shape, and is provided with a head end and a tail end, wherein the head end is arranged near the middle line of the fundamental wave layer, and the tail end is arranged at the outer edge of the fundamental wave layer; the induction coil is a divergent circular shape, and is provided with a head end and a tail end, wherein the head end is arranged near the center of the circle, and the tail end is arranged outside the circle; The sensor main control board is made of insulating material and is provided with a main control board signal output part and a main control board signal collection part. The main control board signal output part includes an initial signal input and output circuit, a fundamental wave operational amplifier circuit and an induced voltage operational amplifier circuit. The initial signal input and output circuit inputs the initial signal into the fundamental wave operational amplifier circuit and the induced voltage operational amplifier circuit through the induction of the energized coil for signal amplification; the main control board signal collection part includes a signal comparison calculation circuit, which performs signal comparison calculation on the amplified signal input from the main control board signal output part.

2. The planar moving part position sensing device according to claim 1, characterized in that: The initial signal input and output circuit includes a fundamental wave coil circuit and a phase induction coil circuit. The fundamental wave coil circuit is provided with a sixth metal film fixed resistor and a fundamental wave coil. The metal film fixed resistor is connected in series with the fundamental wave coil. The fundamental wave coil is arranged on the fundamental wave layer of the matching sensor sensing board. The phase induction coil circuit includes a phase induction coil. The phase induction coil is arranged on the induction layer of the matching sensor sensing board.

3. The planar moving part position sensing device according to claim 1, characterized in that: The fundamental wave operational amplifier circuit includes a first operational amplifier, fourth to eighth chip capacitors, and seventh to fourteenth metal film fixed resistors. The seventh and eighth metal film fixed resistors are connected in series and connected to the No. 4 pin of the first operational amplifier, and the other end of the seventh metal film fixed resistor is connected to the HJN output end of the fundamental wave coil; the ninth and tenth metal film fixed resistors are connected in series and connected to the eleventh metal film fixed resistor, the twelfth metal film fixed resistor, and one end of the fifth chip capacitor and then connected to the No. 3 pin of the first operational amplifier, the other end of the ninth metal film fixed resistor is connected to the HJP output end of the fundamental wave coil, the other end of the eleventh metal film fixed resistor is input with a forward voltage, the other end of the twelfth metal film fixed resistor is connected to the other end of the fifth chip capacitor and then grounded; one end of the fourth chip capacitor The first operational amplifier is connected with the seventh and eighth metal film fixed resistors, and the other end is connected with the ninth and tenth metal film fixed resistors; the second pin of the first operational amplifier is grounded, the fifth pin of the first operational amplifier is connected to a forward voltage, and is connected to one end of the seventh chip capacitor before being connected to the forward voltage, and the other end of the seventh chip capacitor is grounded; the sixth chip capacitor is connected to the thirteenth metal film fixed resistor in parallel, and one end is connected to the fourth pin of the first operational amplifier, and the other end is connected to the first pin of the first operational amplifier, and the first pin of the first operational amplifier is also connected to one end of the fourteenth metal film fixed resistor, and the other end of the fourteenth metal film fixed resistor is connected to one end of the eighth chip capacitor and then output through the output terminal J, and the other end of the eighth chip capacitor is grounded.

4. The planar moving part position sensing device according to claim 1, characterized in that: The induced voltage operational amplifier circuit is divided into a U-phase induced voltage operational amplifier circuit, a V-phase induced voltage operational amplifier circuit and a W-phase induced voltage operational amplifier circuit.

5. The planar moving part position sensing device according to claim 4, characterized in that: The U-phase induction voltage operational amplifier circuit includes a second operational amplifier, ninth to thirteenth chip capacitors, and fifteenth to twenty-second metal film fixed resistors. The fifteenth and sixteenth metal film fixed resistors are connected in series and connected to the fourth pin of the second operational amplifier, and the other end of the fifteenth metal film fixed resistor is connected to the HUN output end of the U-phase induction coil; the seventeenth and eighteenth metal film fixed resistors are connected in series with the nineteenth metal film fixed resistor, the twentieth metal film fixed resistor, and one end of the tenth chip capacitor and then connected to the third pin of the second operational amplifier, the other end of the seventeenth metal film fixed resistor is connected to the HUP output end of the U-phase induction coil, the other end of the nineteenth metal film fixed resistor is input with a forward voltage, the other end of the twentieth metal film fixed resistor is connected to the other end of the tenth chip capacitor and then grounded; the ninth chip capacitor One end of the capacitor is connected to the fifteenth and sixteenth metal film fixed resistors, and the other end is connected to the seventeenth and eighteenth metal film fixed resistors; the second operational amplifier pin No. 2 is grounded, the second operational amplifier pin No. 5 is connected to the forward voltage, and is connected to one end of the twelfth patch capacitor before being connected to the forward voltage, and the other end of the twelfth patch capacitor is grounded; the eleventh patch capacitor is connected to the twenty-first metal film fixed resistor in parallel, and one end is connected to the fourth pin of the second operational amplifier, and the other end is connected to the first pin of the second operational amplifier, the first pin of the second operational amplifier is also connected to one end of the twenty-second metal film fixed resistor, the other end of the twenty-second metal film fixed resistor is connected to one end of the thirteenth patch capacitor and then output through the output terminal U, and the other end of the thirteenth patch capacitor is grounded; The V-phase induction voltage operational amplifier circuit includes a third operational amplifier, fourteenth to eighteenth chip capacitors, twenty-third to thirtieth metal film fixed resistors, the twenty-third and twenty-fourth metal film fixed resistors are connected in series and connected to the fourth pin of the third operational amplifier, and the other end of the twenty-third metal film fixed resistor is connected to the HVN output end of the V-phase induction coil; the twenty-fifth and twenty-sixth metal film fixed resistors are connected in series and connected to the twenty-seventh metal film fixed resistor, the twenty-eighth metal film fixed resistor, and one end of the fifteenth chip capacitor and then connected to the third pin of the third operational amplifier, the other end of the twenty-fifth metal film fixed resistor is connected to the HVP output end of the V-phase induction coil, the other end of the twenty-seventh metal film fixed resistor is input with a forward voltage, the other end of the twenty-eighth metal film fixed resistor is connected to the other end of the fifteenth chip capacitor and then grounded; One end of the fourteenth patch capacitor is connected to the twenty-third and twenty-fourth metal film fixed resistors, and the other end is connected to the twenty-fifth and twenty-sixth metal film fixed resistors; the second pin of the third operational amplifier is grounded, the fifth pin of the third operational amplifier is connected to a forward voltage, and is connected to one end of the seventeenth patch capacitor before being connected to the forward voltage, and the other end of the seventeenth patch capacitor is grounded; the sixteenth patch capacitor is connected to the fourth pin of the third operational amplifier after being connected in parallel with the twenty-ninth metal film fixed resistor, and the other end is connected to the first pin of the third operational amplifier, and the first pin of the third operational amplifier is simultaneously connected to one end of the thirtieth metal film fixed resistor, and the other end of the thirtieth metal film fixed resistor is connected to one end of the eighteenth patch capacitor and then output through the output terminal V, and the other end of the eighteenth patch capacitor is grounded; The W-phase induced voltage operational amplifier circuit includes a fourth operational amplifier, nineteenth to twenty-third chip capacitors, and thirty-first to thirty-eighth metal film fixed resistors. The thirty-first and thirty-second metal film fixed resistors are connected in series and connected to the fourth pin of the fourth operational amplifier, and the other end of the thirty-first metal film fixed resistor is connected to the HWN output end of the W phase induction coil; the thirty-third and thirty-fourth metal film fixed resistors are connected in series and connected to the thirty-fifth metal film fixed resistor, the thirty-sixth metal film fixed resistor, and one end of the twentieth chip capacitor and then connected to the third pin of the fourth operational amplifier, the other end of the thirty-third metal film fixed resistor is connected to the HWJP output end of the W phase induction coil, the other end of the thirty-fifth metal film fixed resistor is input with a forward voltage, the other end of the thirty-sixth metal film fixed resistor is connected to the other end of the twentieth chip capacitor and then grounded; One end of the ninth chip capacitor is connected to the thirty-first and thirty-second metal film fixed resistors, and the other end is connected to the thirty-third and thirty-fourth metal film fixed resistors; Pin 2 of the fourth operational amplifier is grounded, Pin 5 of the fourth operational amplifier is connected to a forward voltage, and is connected to one end of the twenty-second chip capacitor before being connected to the forward voltage, and the other end of the twenty-second chip capacitor is grounded; The twenty-first chip capacitor is connected to the thirty-seventh metal film fixed resistor in parallel, and one end is connected to Pin 4 of the fourth operational amplifier, and the other end is connected to Pin 1 of the fourth operational amplifier, and Pin 1 of the fourth operational amplifier is also connected to one end of the thirty-eighth metal film fixed resistor, and the other end of the thirty-eighth metal film fixed resistor is connected to one end of the twenty-third chip capacitor and then output through the output terminal W, and the other end of the twenty-third chip capacitor is grounded.

6. The planar moving part position sensing device according to claim 5, characterized in that: In the U-phase induced voltage operational amplifier circuit, the model parameter of the second operational amplifier is TSV911ILT, the model parameters of the ninth and thirteenth chip capacitors are 101J / 50V / X7R, the model parameters of the tenth and eleventh chip capacitors are 150J / 50V / X7R, and the model parameter of the twelfth chip capacitor is 104K / 50V / X7R; the model parameters of the fifteenth, seventeenth and twenty-second metal film fixed resistors are 100R-F / 0.1W, the model parameters of the sixteenth and eighteenth metal film fixed resistors R18 are 3.9KF / 0.1W, the model parameters of the nineteenth and twentieth metal film fixed resistors are 20K-F / 0.1W, and the model parameter of the twenty-first metal film fixed resistor is 10K-F / 0.1W; In the V-phase induced voltage operational amplifier circuit, the model parameter of the third operational amplifier U4 is TSV911ILT, the model parameters of the fourteenth chip capacitor C14 and the eighteenth chip capacitor C18 are 101J / 50V / X7R, the model parameters of the fifteenth chip capacitor C15 and the sixteenth chip capacitor C16 are 150J / 50V / X7R, and the model parameters of the seventeenth chip capacitor C17 are 104K / 50V / X7R; the twenty-third metal film fixed resistor R23, The model parameters of the twenty-fifth metal film fixed resistor R25 and the thirtieth metal film fixed resistor R30 are 100R-F / 0.1W, the model parameters of the twenty-fourth metal film fixed resistor R24 ​​and the twenty-sixth metal film fixed resistor R26 are 3.9KF / 0.1W, the model parameters of the twenty-seventh metal film fixed resistor R27 and the twenty-eighth metal film fixed resistor R28 are 20K-F / 0.1W, and the model parameters of the twenty-ninth metal film fixed resistor R29 are 10K-F / 0.1W; In the W-phase induced voltage operational amplifier circuit, the fourth operational amplifier U5 model parameter is TSV911ILT, the nineteenth patch capacitor C19 and the twenty-third patch capacitor C23 model parameters are 101J / 50V / X7R, the twentieth patch capacitor C20 and the twenty-first patch capacitor C21 model parameters are 150J / 50V / X7R, and the twenty-second patch capacitor C22 model parameters are 104K / 50V / X7R; the thirty-first metal film fixed resistor R31 The model parameters of the thirty-third metal film fixed resistor R33 and the thirty-eighth metal film fixed resistor R38 are 100R-F / 0.1W, the model parameters of the thirty-second metal film fixed resistor R32 and the thirty-fourth metal film fixed resistor R34 are 3.9KF / 0.1W, the model parameters of the thirty-fifth metal film fixed resistor R35 and the thirty-sixth metal film fixed resistor R36 are 20K-F / 0.1W, and the model parameters of the thirty-seventh metal film fixed resistor R37 are 10K-F / 0.1W.

7. The planar moving part position sensing device according to claim 1, characterized in that: The signal comparison calculation circuit includes a microcontroller, a single-tube diode, first to fifth metal film fixed resistors and first to third chip capacitors. The 8th to 11th pins of the microcontroller are respectively connected to the J output end of the fundamental wave operational amplifier circuit, the U output end of the U-phase inductive voltage operational amplifier circuit, the V output end of the V-phase inductive voltage operational amplifier circuit, and the W output end of the W-phase inductive voltage operational amplifier circuit to input signals, and the U-phase signal is output through the 30th pin, the V-phase signal is output through the 28th pin, and the W-phase signal is output through the 27th pin; the first metal film fixed resistor is connected in series with the second chip capacitor and then connected in parallel with the single-tube diode and one end is grounded, and the other end inputs a forward voltage and is connected to the No. 1 pin of the microcontroller. One end of the first chip capacitor is connected to the No. 1 pin of the microcontroller, and the other end is connected to the No. 32 pin of the microcontroller. The No. 32 pin of the microcontroller is also grounded; Pin 5 of the microcontroller is connected to a forward voltage; Pins 16 and 17 of the microcontroller are respectively connected to the two ends of the third chip capacitor, Pin 16 of the microcontroller is grounded, and Pin 17 of the microcontroller inputs a forward voltage; Pin 23 of the microcontroller is connected to the second metal film fixed resistor, and the other end of the second metal film fixed resistor is connected to the SWDIO port at the output end of the microcontroller, Pin 24 of the microcontroller is connected to the third metal film fixed resistor, and the other end of the third metal film fixed resistor is connected to the SWCLK port at the output end of the microcontroller, Pin 31 of the microcontroller is connected to the fourth metal film fixed resistor, and the other end of the fourth metal film fixed resistor is grounded, the output end 3 output port of the microcontroller is connected to the fifth metal film fixed resistor and then grounded together with the output end 2 output port, and the output end 4 output port of the microcontroller inputs a forward voltage.

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