Welding composition, shell assembly, preparation method and electronic equipment

Abstract

The invention provides a welding composition which is used for sealing ceramic and / or glass and comprises the following components in percentage by weight: 45%-65% of P2O5, 15%-35% of SnO, 5%-10% of ZnO, 3%-10% of MgO, 1%-3% of CaO, 2%-5% of SrO and 2%-5% of BaO. The welding composition is used for sealing ceramic and / or glass, and can solve the problems of poor binding force and poor air tightness after the existing ceramic matrix is bonded with a glass lens. The invention further provides a shell assembly, a preparation method of the shell assembly, and electronic equipment.

Description

Technical field

[0001] The application relates to the technical field of shell materials, and in particular to a welding composition, a shell component, a preparation method and electronic equipment. Background technique

[0002] At present, mobile phones or smart wearable devices made of ceramic materials mainly use glue (dispensing or back glue) to bond the glass lens to the ceramic substrate. However, the glue is prone to aging and is susceptible to water erosion, resulting in weak bonding between the glass lens and the ceramic substrate, easy to fall off, and poor air tightness, which is not conducive to the long-term use of the equipment. Summary of the invention

[0003] The present application provides a welding composition, which is used for the sealing of ceramics and / or glass, and can solve the problems of poor bonding force and poor airtightness after the existing ceramic substrate and glass lens are bonded. The technical solution is as follows:

[0004] In the first as...

Examples

preparation example Construction

[0042] A solder composition provided by an embodiment of the present application can be prepared by the following methods, including:

[0043] After the raw materials of each component are uniformly mixed, they are heated in an inert or reducing atmosphere to form a molten liquid, then the molten liquid is transferred to cold water for quenching, and then ground and dried to obtain the solder composition.

[0044] Optionally, the heating temperature is 1100-1300°C, and the time is 30-60 min. The heating time here is the holding time after reaching the heating temperature. In one embodiment, the heating time is 40-60 min.

[0045] Among them, the purpose of the inert or reducing atmosphere is to prevent Sn 2+ Is oxidized to Sn 4+ ; Because the soldering composition described in this application is a low melting point solder, for example, the soldering composition may contain P-Sn-Zn low melting point substances, and the SnO and P in the soldering composition 2 O 5 , ZnO is easier to ...

Embodiment 1

[0076] A method for preparing a shell assembly includes the following steps:

[0077] Take the ceramic substrate and the glass lens, and then set the solder composition between the ceramic substrate and the glass lens. After soldering at 340°C for 40 minutes, and the cooling rate is about 5-8°C / min, a connecting layer is formed between the ceramic substrate and the glass lens. , And then further finishing processing to obtain a shell assembly, wherein the solder composition includes the following parts by weight: P 2 O 5 54 parts, SnO 27 parts, ZnO 6 parts, MgO 3 parts, CaO 2 parts, SrO 2 parts, BaO 3 parts.

Embodiment 2

[0079] A method for preparing a shell assembly includes the following steps:

[0080] Take the ceramic substrate and the glass lens, and then set the solder composition between the ceramic substrate and the glass lens. After soldering at 320°C for 40 minutes, and the cooling rate is about 5-8°C / min, a connecting layer is formed between the ceramic substrate and the glass lens. , And then further finishing processing to obtain a shell assembly, wherein the solder composition includes the following parts by weight: P 2 O 5 54 parts, SnO 27 parts, ZnO 6 parts, MgO 3 parts, CaO 2 parts, SrO 2 parts, BaO 3 parts, MnO 2 1 serving, B 2 O 3 1.5 copies, and K 2 O0.5 parts.

Technical field

[0001] The application relates to the technical field of shell materials, and in particular to a welding composition, a shell component, a preparation method and electronic equipment. Background technique

[0002] At present, mobile phones or smart wearable devices made of ceramic materials mainly use glue (dispensing or back glue) to bond the glass lens to the ceramic substrate. However, the glue is prone to aging and is susceptible to water erosion, resulting in weak bonding between the glass lens and the ceramic substrate, easy to fall off, and poor air tightness, which is not conducive to the long-term use of the equipment. Summary of the invention

[0003] The present application provides a welding composition, which is used for the sealing of ceramics and / or glass, and can solve the problems of poor bonding force and poor airtightness after the existing ceramic substrate and glass lens are bonded. The technical solution is as follows:

[0004] In the first as...

Examples

preparation example Construction

[0042] A solder composition provided by an embodiment of the present application can be prepared by the following methods, including:

[0043] After the raw materials of each component are uniformly mixed, they are heated in an inert or reducing atmosphere to form a molten liquid, then the molten liquid is transferred to cold water for quenching, and then ground and dried to obtain the solder composition.

[0044] Optionally, the heating temperature is 1100-1300°C, and the time is 30-60 min. The heating time here is the holding time after reaching the heating temperature. In one embodiment, the heating time is 40-60 min.

[0045] Among them, the purpose of the inert or reducing atmosphere is to prevent Sn 2+ Is oxidized to Sn 4+ ; Because the soldering composition described in this application is a low melting point solder, for example, the soldering composition may contain P-Sn-Zn low melting point substances, and the SnO and P in the soldering composition 2 O 5 , ZnO is easier to ...

Embodiment 1

[0076] A method for preparing a shell assembly includes the following steps:

[0077] Take the ceramic substrate and the glass lens, and then set the solder composition between the ceramic substrate and the glass lens. After soldering at 340°C for 40 minutes, and the cooling rate is about 5-8°C / min, a connecting layer is formed between the ceramic substrate and the glass lens. , And then further finishing processing to obtain a shell assembly, wherein the solder composition includes the following parts by weight: P 2 O 5 54 parts, SnO 27 parts, ZnO 6 parts, MgO 3 parts, CaO 2 parts, SrO 2 parts, BaO 3 parts.

Embodiment 2

[0079] A method for preparing a shell assembly includes the following steps:

[0080] Take the ceramic substrate and the glass lens, and then set the solder composition between the ceramic substrate and the glass lens. After soldering at 320°C for 40 minutes, and the cooling rate is about 5-8°C / min, a connecting layer is formed between the ceramic substrate and the glass lens. , And then further finishing processing to obtain a shell assembly, wherein the solder composition includes the following parts by weight: P 2 O 5 54 parts, SnO 27 parts, ZnO 6 parts, MgO 3 parts, CaO 2 parts, SrO 2 parts, BaO 3 parts, MnO 2 1 serving, B 2 O 3 1.5 copies, and K 2 O0.5 parts.

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