Soldering-Free Embedded Copper Ring for Windings, Bending Die, and Manufacturing Method

Abstract

The present invention discloses a solderless embedded copper coil for windings, which includes a copper sheet body. The copper sheet body has a through hole, and bayonets for positioning are provided around the through hole. The copper sheet body has a first pin and a second pin. The copper sheet body is formed by overlapping and winding a first rotating copper sheet and a second rotating copper sheet in an alternating manner. A special bending die for manufacturing it is provided, which includes an upper die base, an upper backing plate, a lower template, a first lower backing plate, a second lower backing plate and a lower die base. The upper die base, the upper backing plate, the lower template, the first lower backing plate, the second lower backing plate and the lower die base are arranged in sequence from top to bottom. The present invention is used in the fields of inductors, transformers, etc. It can eliminate the need for a skeleton design and be welded to the circuit board in the power supply by means of insertion, which is beneficial for wiring. The inductor made of the copper coil of the present invention has very good stability. Since the long and flat copper strip has a small resistance, fast heat dissipation, good linearity of the inductance value, small loss and small magnetic leakage.

Description

Technical Field

[0001] The present invention relates to the field of inductors and transformers, and particularly to a solderless embedded copper coil for windings, a bending die, and a manufacturing method thereof. Background Art

[0002] Inductance is a property of a closed loop. When a current passes through a coil, a magnetic field induction is formed in the coil, and the induced magnetic field will generate an induced current to resist the current passing through the coil. This interaction relationship between the current and the coil is called the inductive reactance of electricity, that is, inductance, and the unit is "Henry (H)".

[0003] Inductance is a physical quantity that measures the ability of a coil to generate electromagnetic induction. When a non-steady current is passed through a coil, a changing magnetic field will be generated around it. The greater the power passed through the coil, the higher the magnetic field strength excited, and vice versa (before the magnetic induction intensity reaches saturation). Inductors are generally divided into two types: air-core inductors and magnetic-core inductors. The inductance of an air-core inductor is a fixed constant, and its application is simple. Large magnetic-core inductors are more widely used in industry, and the accuracy of the inductance value is a key issue, which has great significance both theoretically and in practical applications.

[0004] Analysis is carried out through the formula L = μ × Ae * N2 / l. L represents the inductance, μ represents the magnetic permeability of the magnetic core, Ae represents the cross-sectional area of the magnetic core, N represents the number of turns of the coil, and lm represents the magnetic path length of the magnetic core. It can be seen from this that when a certain inductor is manufactured and formed, Ae, N, and lm are all fixed values, so the only factor that affects the value of the inductor after leaving the factory is the magnetic permeability μ. [1]

[0005] Inductance is a property of a closed loop, that is, when the current passing through the closed loop changes, the inductor will generate an electromotive force to resist the change of the current. This kind of inductor is called self-inductance, which is the property of the closed loop itself. Suppose the current of a closed loop changes, and an electromotive force is generated in another closed loop due to the induction effect. This kind of inductor is called mutual inductance.

[0006] An inductor can be made by winding a conductive material around a magnetic core, typically copper wire. The magnetic core can also be removed or replaced with a ferromagnetic material. Core materials with a higher magnetic permeability than air can confine the magnetic field more tightly around the inductor element, thus increasing the inductance. There are many types of inductors, most of which are made by winding an enamel coated wire around a ferrite bobbin, while some shielded inductors have the coil completely enclosed within the ferrite. The cores of some inductor elements can be adjusted, thereby changing the inductance value. Small inductors can be directly etched on a PCB board using a method of laying a spiral track. Small-value inductors can also be fabricated in an integrated circuit using the same process as that for manufacturing transistors. In these applications, aluminum interconnects are often used as the conductive material. Regardless of the method used, the most commonly applied circuit based on practical constraints is a type called a "gyrator", which uses a capacitor and active components to exhibit the same characteristics as an inductor element. Inductor elements used for high-frequency isolation often consist of a wire passing through a magnetic post or bead.

[0007] The existing solderless embedded copper coils use copper wire windings, which are relatively large in size. Additionally, different winding designs require different formers for cooperation, resulting in high manufacturing costs and low production efficiency. Summary of the Invention

[0008] The purpose of the present invention is to provide a solderless embedded copper coil for winding, a bending die, and a manufacturing method thereof to solve the problems raised in the above background technology.

[0009] To achieve the above purpose, the present invention provides the following technical solutions:

[0010] A solderless embedded copper coil for winding includes a copper sheet body. The copper sheet body has a through hole, and positioning notches are provided around the through hole. The copper sheet body has a first pin and a second pin, and the copper sheet body is formed by overlapping and winding a first rotating copper sheet and a second rotating copper sheet alternately.

[0011] Among them, the first rotating copper sheet and the second rotating copper sheet are connected end to end. The free ends of the first rotating copper sheet and the second rotating copper sheet respectively extend to form the first pin and the second pin. The first rotating copper sheet and the second rotating copper sheet are formed into a spiral overlapping structure by stamping and bending the copper sheet.

[0012] Among them, the cross-sections of the first rotating copper sheet and the second rotating copper sheet are respectively in a counterclockwise and clockwise Ω shape.

[0013] A bending die for manufacturing a solderless embedded copper coil for a winding, comprising an upper die base, an upper backing plate, a lower template, a first lower backing plate, a second lower backing plate and a lower die base, which are arranged in sequence from top to bottom; the upper die base is fixedly connected to the upper backing plate by screws, and a first bending punch is fixedly connected to the rear end of the upper backing plate; the lower template, the first lower backing plate, the second lower backing plate and the lower die base are fixedly connected by screws, and a first bending slider and a second bending slider are further arranged on the lower template, and a first stop block, a second gasket and a fourth stop block are also arranged on the lower template; a second guide post and a third stop block are arranged inside the lower template, the second guide post is located on the side of the first bending punch, the third stop block is located behind the first bending punch, the first bending slider is located on the top of the second lower backing plate and is located inside the lower template and the first lower backing plate, a second bending slider is arranged on the side of the first bending slider, and a second bending punch and a third bending punch are correspondingly arranged on both the first bending slider and the second bending slider; the lower template is further provided with a first height limiting block and a second height limiting block.

[0014] A manufacturing method for a solderless embedded copper coil for a winding specifically comprises the following steps:

[0015] S1. Stock preparation:

[0016] S2. Blanking: Stamping a copper sheet blank into a first rotating copper sheet and a second rotating copper sheet that are symmetrically arranged and connected end to end.

[0017] S3. Punching holes: Punching holes in the first pin and the second pin.

[0018] S4. Bending and one - body forming: Using a bending die to bend the first rotating copper sheet and the second rotating copper sheet to form a copper sheet body with a spiral laminated structure.

[0019] S5. Flattening and shaping: Using a pneumatic press to flatten and adjust the shape of the copper sheet body with a spiral laminated structure.

[0020] S6. Punching notches to obtain a solderless embedded copper coil for a winding.

[0021] A manufacturing method for a solderless embedded copper coil for a winding specifically comprises the following steps: Specifically comprises the following steps:

[0022] S1. Stock preparation;

[0023] S2. Blanking: Stamping a copper sheet blank into a predetermined flat copper strip shape.

[0024] S3. First bending: Using a bending die to bend the flat copper strip clockwise.

[0025] S4. Second Bending: Use a bending die to bend the flat copper strip counterclockwise to form the copper sheet body with a spiral overlapping structure;

[0026] S5. Flattening: Use a pneumatic press to flatten the copper sheet body with a spiral overlapping structure and adjust its shape;

[0027] S6. Notching and Shaping.

[0028] Among them, after step 6, the following steps are further included:

[0029] S7. Electroplating;

[0030] S8. Combination with Tape;

[0031] S9. Gluing;

[0032] S10. Punching Glue;

[0033] S11. Quality Inspection and Packaging.

[0034] Compared with the prior art, the present invention is used in the fields of inductors, power supplies, uninterruptible power supplies (UPS), transformers, etc. Compared with the prior art using copper wires as windings, the present invention has the characteristics of small volume. In addition, the copper coil of the present invention is formed by one-time punching and shearing of copper material, which can eliminate the skeleton design and is applicable to any inductor and transformer skeleton. The copper coil has pins and can be welded by plugging, which is beneficial for wiring. The inductor made of the integrally formed copper coil by bending according to the present invention has very good stability. Since the flat copper sheet has small resistance, fast heat dissipation, good linearity of inductance value, small loss, and small magnetic leakage. Brief Description of the Drawings

[0035] Figure 1 It is a structural diagram of an embodiment of the present invention.

[0036] Figure 2 It is Figure 1 An unfolded schematic diagram of the product before bending.

[0037] Figure 3 A structural schematic diagram of a solderless embedded copper coil bending die.

[0038] Figure 4 It is a structural schematic diagram of the upper die base of the solderless embedded copper coil bending die.

[0039] Figure 5 It is a side view of the upper die base of the solderless embedded copper coil bending die.

[0040] Figure 6 It is a structural schematic diagram of the upper backing plate of the solderless embedded copper coil bending die.

[0041] Figure 7 It is a side view of the upper backing plate of the solderless embedded copper coil bending die.

[0042] Figure 8 It is a schematic structural diagram of the lower template in the welding-free embedded copper ring bending die.

[0043] Figure 9 It is a front view of the lower template in the welding-free embedded copper ring bending die.

[0044] Figure 10 It is a side view of the lower template in the welding-free embedded copper ring bending die.

[0045] Figure 11 It is a schematic structural diagram of the first lower backing plate in the welding-free embedded copper ring bending die.

[0046] Figure 12 It is a side view of the first lower backing plate in the welding-free embedded copper ring bending die.

[0047] Figure 13 It is a schematic structural diagram of the second lower backing plate in the welding-free embedded copper ring bending die.

[0048] Figure 14 It is a side view of the second lower backing plate in the welding-free embedded copper ring bending die.

[0049] Figure 15 It is a schematic structural diagram of the lower template in the welding-free embedded copper ring bending die.

[0050] Figure 16 It is a front view of the lower template in the welding-free embedded copper ring bending die.

[0051] Figure 17 It is a front view of the first stop block in the welding-free embedded copper ring bending die.

[0052] Figure 18 It is a front view of the second guide post in the welding-free embedded copper ring bending die.

[0053] Figure 19 It is a front view of the first bending slider in the welding-free embedded copper ring bending die.

[0054] Figure 20 It is a side view of the first bending slider in the welding-free embedded copper ring bending die.

[0055] Figure 21 It is a front view of the second bending slider in the welding-free embedded copper ring bending die.

[0056] Figure 22 It is a side view of the second bending slider in the welding-free embedded copper ring bending die.

[0057] Figure 23 It is a side view of the third stop block in the welding-free embedded copper ring bending die.

[0058] Figure 24 It is a schematic structural diagram of the fourth stop block in the solderless embedded copper ring bending die.

[0059] Figure 25 It is a schematic structural diagram of the second gasket in the solderless embedded copper ring bending die.

[0060] Figure 26 It is a front view of the first bending punch in the solderless embedded copper ring bending die.

[0061] Figure 27 It is a side view of the first bending punch in the solderless embedded copper ring bending die.

[0062] Figure 28 It is a schematic structural diagram of the second bending punch in the solderless embedded copper ring bending die.

[0063] Figure 29 It is a schematic structural diagram of the third bending punch in the solderless embedded copper ring bending die.

[0064] Figure 30 It is a front view of the first height limiting block in the solderless embedded copper ring bending die.

[0065] Figure 31 It is a side view of the first height limiting block in the solderless embedded copper ring bending die.

[0066] Figure 32 It is a front view of the second height limiting block in the solderless embedded copper ring bending die.

[0067] Figure 33 It is a side view of the second height limiting block in the solderless embedded copper ring bending die.

[0068] Figure 34 It is a top view of the solderless embedded copper ring bending die.

[0069] Figure 35 It is a side view of the solderless embedded copper ring bending die.

[0070] Figure 36 It is a schematic diagram of process 1 in the manufacturing method of the solderless embedded copper ring in Example 1.

[0071] Figure 37 It is a schematic diagram of process 2 in the manufacturing method of the solderless embedded copper ring in Example 1.

[0072] Figure 38 It is a schematic diagram of process 3 in the manufacturing method of the solderless embedded copper ring in Example 1.

[0073] Figure 39 It is a schematic diagram of process 4 in the manufacturing method of the solderless embedded copper ring in Example 1.

[0074] Figure 40 For Figure 39 Another perspective schematic diagram.

[0075] Figure 41 It is a schematic diagram of Step 5 in the manufacturing method of the solderless embedded copper ring in Embodiment 1.

[0076] Figure 42 It is a schematic diagram of Step 6 in the manufacturing method of the solderless embedded copper ring in Embodiment 1.

[0077] Figure 43 It is a schematic diagram of Step 7 in the manufacturing method of the solderless embedded copper ring in Embodiment 1.

[0078] Figure 44 It is a schematic diagram of Step 9 in the manufacturing method of the solderless embedded copper ring in Embodiment 1.

[0079] Figure 45 For Figure 44 Another perspective schematic diagram.

[0080] Figure 46 It is a schematic diagram of the structure of the solderless embedded copper ring in Embodiment 1.

[0081] Figure 47 It is a schematic diagram of Step 1 in the manufacturing method of the solderless embedded copper ring in Embodiment 2.

[0082] Figure 48 It is a schematic diagram of the structure of the solderless embedded copper ring in Embodiment 2.

[0083] Figure 49 It is a schematic diagram of Step 1 in the manufacturing method of the solderless embedded copper ring in Embodiment 3.

[0084] Figure 50 It is a schematic diagram of Step 6 in the manufacturing method of the solderless embedded copper ring in Embodiment 3.

[0085] Figure 51 It is a schematic diagram of Step 8 in the manufacturing method of the solderless embedded copper ring in Embodiment 3.

[0086] Figure 52 It is a schematic diagram of Step 10 in the manufacturing method of the solderless embedded copper ring in Embodiment 3.

[0087] Figure 53 It is a schematic diagram of the structure of the solderless embedded copper ring in Embodiment 3.

[0088] Figure 54 It is a schematic diagram of Step 1 in the manufacturing method of the solderless embedded copper ring in Embodiment 4.

[0089] Figure 55 It is a schematic diagram of Step 2 in the manufacturing method of the solderless embedded copper ring in Embodiment 4.

[0090] Figure 56 Schematic diagram of process 3 in the manufacturing method of the solderless embedded copper coil in Example 4.

[0091] Figure 57 Schematic diagram of process 4 in the manufacturing method of the solderless embedded copper coil in Example 4.

[0092] Figure 58 Schematic diagram of process 5 in the manufacturing method of the solderless embedded copper coil in Example 4.

[0093] Figure 59 Schematic diagram of process 7 in the manufacturing method of the solderless embedded copper coil in Example 4.

[0094] Figure 60 For Figure 59 Another perspective view.

[0095] Figure 61 Schematic diagram of process 8 in the manufacturing method of the solderless embedded copper coil in Example 4.

[0096] Figure 62 For Figure 61 Another perspective view.

[0097] Figure 63 Schematic diagram of the structure of the solderless embedded copper coil in Example 4. Detailed implementation manners

[0098] The technical solution of this patent will be further described in detail below in conjunction with the specific implementation manners.

[0099] Please refer to Figure 1-2 , a solderless embedded copper coil for a winding, including a copper sheet body, the copper sheet body has a through hole 104, a bayonet 103 for positioning is arranged around the through hole 104, the copper sheet body has a first pin 105 and a second pin 106, and the copper sheet body is formed by overlapping and winding the first rotating copper sheet 101 and the second rotating copper sheet 102 alternately.

[0100] Wherein, the first rotating copper sheet 101 and the second rotating copper sheet 102 are connected end to end, the free ends of the first rotating copper sheet 101 and the second rotating copper sheet 102 respectively extend the first pin 105 and the second pin 106, and the first rotating copper sheet 101 and the second rotating copper sheet 102 are formed into a spiral overlapping structure by stamping and bending the copper sheet.

[0101] Wherein, the cross-sections of the first rotating copper sheet 101 and the second rotating copper sheet 102 are respectively in a counterclockwise and clockwise Ω shape.

[0102] Please refer to Figure 1-35, A solderless embedded copper ring bending die, including an upper die base 1, an upper backing plate 2, a lower template 3, a first lower backing plate 4, a second lower backing plate 5 and a lower die base 6. The upper die base 1, the upper backing plate 2, the lower template 3, the first lower backing plate 4, the second lower backing plate 5 and the lower die base 6 are arranged in sequence from top to bottom; the upper die base 1 is fixedly connected to the upper backing plate 2 by screws, and the rear end of the upper backing plate 2 is fixedly connected to a first bending punch 10. The lower template 3, the first lower backing plate 4, the second lower backing plate 5 and the lower die base 6 are fixedly connected by screws. The lower template 3 is also provided with a first bending slider 11 and a second bending slider 12, and the lower template 3 is also provided with a first stop block 13, a second gasket 14 and a fourth stop block 15. The inside of the lower template 3 is provided with a second guide post 16 and a third stop block 17. The second guide post 16 is located on the side of the first bending punch 10, and the third stop block 17 is located behind the first bending punch 10. A first bending slider 18 is located on the top of the second lower backing plate 5, and the first bending slider 18 is located inside the lower template 3 and the first lower backing plate 4. A second bending slider 19 is provided on the side of the first bending slider 18. The first bending slider 18 and the second bending slider 19 are respectively provided with a second bending punch 20 and a third bending punch 21. The lower template 3 is also provided with a first height limiting block 22 and a second height limiting block 23.

[0103] The size of the upper die base 1 is 120x150x54mm. Two M8 screw countersunk holes are opened on the upper die base 1, and the specifications of the M8 screw countersunk are φ9.0mm drilling, φ14.0mm countersunk, and 12.0mm depth;

[0104] The size of the upper backing plate 2 is 25x150x54mm. An M8 screw is opened on the upper die base 1, and the tapping depth is 20;

[0105] The size of the lower template 3 is 30x150.0x100.0mm. The following are machined on the lower template 3:

[0106] M: 2 - M4 threads, drilled through, with a front tapping depth of 15.0;

[0107] M1: 2 - φ9.0 through holes, drilled through;

[0108] M2: 4 - M8 countersunk (φ9.0 drilled through, φ14.0 front milled, 15.0mm depth);

[0109] M3: 2 - M12 side tapping depth of 20;

[0110] M4: 1 - M10 front tapping depth of 17;

[0111] The size of the first lower backing plate 4 is 10x150.0x100.0mm. The following are machined on the first lower backing plate 4:

[0112] L: 2 - φ8.00 dowel pin, cut 1 and grind 1, single +0.005;

[0113] M: 6 - φ9.0;

[0114] W1: 1 - cut 1 and grind 1, single +0.01;

[0115] The size of the second lower backing plate 5 is 510x150.0x100.0 mm, and the second lower backing plate 5 is machined with:

[0116] M: 6 - φ9.0 through - hole, drill through;

[0117] L: 2 - φ8.00 dowel pin, cut 1 and grind 1, single +0.005;

[0118] W1: 1 - cut 1 and grind 1, single +0.005;

[0119] The size of the lower die base 6 is 620x200.0x100.0 mm; the lower die base 6 is machined with:

[0120] L: 2 - φ8.00 dowel pin, ream;

[0121] M: 4 - M8 threads, tap through;

[0122] M1: 2 - M8 counterbore holes (drill through with φ9.0, mill the back with φ14.0, depth 10.0);

[0123] Furthermore, it further includes a first stop block, a second guide post, a first bent slider, a second bent slider, a third stop block, a fourth stop block, a second gasket, a first bent punch, a second bent punch, a third bent punch, a first height - limiting block and a second height - limiting block.

[0124] Please refer to Figure 1-63 , Example 1, a manufacturing method of a solder - free embedded copper ring, specifically including the following steps:

[0125] S1. Prepare materials, prepare copper plate materials, and mark the required copper strip specifications on the copper plate materials;

[0126] S2. Blanking; Use a press to punch out flat copper strips from the copper sheet; The press is above 45T;

[0127] S3. Bending 1; Use a bending die to bend the flat copper strip clockwise;

[0128] S4. Bending 2; Use a bending die to bend the flat copper strip counter - clockwise to form a copper sheet body with a spiral laminated structure; S5. Flattening + shaping; Use a press to flatten the copper sheet body, make the first rotating copper sheet and the second rotating copper sheet fit tightly, and correct the outer - ring size;

[0129] S6. Notch punching; Use a press to punch a notch at the edge of the through-hole of the copper sheet body;

[0130] S7. Small angle folding; Use a press to bend a certain pin;

[0131] S8. Electroplating;

[0132] S9. Tape sticking; Insert the tape 110 with a thickness of 0.06 MM between the first rotating copper sheet and the second rotating copper sheet;

[0133] S10. Glue punching; Use equipment: pneumatic press

[0134] S11. Glue scribing;

[0135] S12. Product inspection and packaging.

[0136] Among them, for process 2: 1. Check the key dimensions as shown in the figure; 2. For the burr at the thickened part B, ≤0.05 mm, for the burr at other outer shape parts, ≤0.1 mm. Observe at the B part under a ten-fold magnifying glass, the cross-section is smooth without protrusions or depressions; 3. Pay attention to the poor appearance of the product; 4. Use measuring tools: calipers; 5. Arrange neatly to prevent deformation; 6. For the first piece and spot checks, all bends must be tested without breakage before proceeding to the next process.

[0137] Among them, for process 3: 1. Check the key dimensions as shown in the figure; 2. Pay attention to the poor appearance of the product; 3. Arrange neatly to prevent deformation; 4. For the first piece and spot checks in this process, judge based on the dimensions after flattening in process 5; 5. When setting up the mold for production, bending and flattening must be carried out simultaneously.

[0138] Among them, for process 4: 1. Check the key dimensions as shown in the figure; 2. Pay attention to the poor appearance of the product; 3. Arrange neatly to prevent deformation; 4. For the first piece and spot checks in this process, judge based on the dimensions after flattening in process 5; 5. When setting up the mold for production, bending and flattening must be carried out simultaneously.

[0139] Among them, for process 5: 1. Check the key dimensions as shown in the figure; 2. Pay attention to the poor appearance of the product; 3. Use measuring tools: calipers; 4. Arrange neatly to prevent deformation; 5. In the free state, the dimension A ranges between 1.4 and 1.6, and ≤1.4 mm in the pinched state; 6. The small foot hole distance shall be subject to passing the inspection fixture.

[0140] Among them, for process 6: 1. Check the key dimensions as shown in the figure; 2. Pay attention to the poor appearance of the product; 3. Use measuring tools: calipers, fixture; 4. Arrange neatly to prevent deformation.

[0141] Among them, for process 7: 1. Check the key dimensions as shown in the figure; 2. Pay attention to the poor appearance of the product; 3. Use measuring tools: calipers; 4. Arrange neatly to prevent deformation.

[0142] Among them, process 8: 1. Entrust an external manufacturer for electroplating; 2. Electroplating requirements: matte tin plating of 5uM MIN.; 3. Measuring tools used: calipers;. Place them neatly to prevent deformation.

[0143] Among them, process 9: 1. The key dimensions for inspection are as shown in the figure; 2. The specific glue - sticking positions are as shown in the figure; 3. There should be no bubbles, residual glue, wrinkling and other defects during glue - sticking; 4. Tape specification: 3M#92T = 0.16MM, semi - finished product code: 2; 5. Measuring tools used: calipers, fixtures; 6. Place them neatly to prevent deformation.

[0144] Among them, process 10: 1. The key dimensions for inspection are as shown in the figure; 2. Pay attention to the appearance defects of the product; 3. After the tape is die - cut, there should be no exposed copper on the tape part of the product; 4. Measuring tools used: calipers, fixtures; 5. Place them neatly to prevent deformation.

[0145] Among them, process 11: 1. The key dimensions for inspection are as shown in the figure; 2. Pay attention to the appearance defects of the product; 3. Measuring tools used: calipers, fixtures; 4. Place them neatly to prevent deformation.

[0146] Among them, process 12: 1. Pay attention to the defects in the previous process of the product; 2. Pay attention to the appearance defects of the product; 3. There should be no exposed copper on the tape part of the product; 4. Measuring tools used: calipers, inspection fixtures; 5. Packaging method: Place it in a PE bag and seal it in a box; 6. Place them neatly to prevent deformation.

[0147] Example 2, a manufacturing method of a solderless embedded copper coil, specifically includes the following steps:

[0148] S1. Prepare materials; Prepare copper plate materials and engrave the required copper strip specifications on the copper plate materials;

[0149] S2. Blanking; Use a press to punch out flat copper strips from the copper sheet;

[0150] S3. Punch holes and make MARKs (for engineering molds); Equipment used: press

[0151] S4. Bending 1; Use a bending die to bend the flat copper strip clockwise;

[0152] S5. Bending 2; Use a bending die to bend the flat copper strip counter - clockwise to form a copper sheet body with a spiral laminated structure;

[0153] S6. Flattening; Use a press to flatten the copper sheet body so that the first rotating copper sheet and the second rotating copper sheet are in close contact;

[0154] S7. Punching notches and shaping; Use a press to punch out notches at the edge of the through - hole of the copper sheet body;

[0155] S8. Electroplating;

[0156] Combination with tape; Equipment used: jig

[0157] S10. Glue punching; Equipment used: pneumatic press

[0158] S11. Inspection and packaging.

[0159] For process 2: 1. Inspect key dimensions as shown in the figure; 2. Burr at thickened part A ≤ 0.05mm, burr at other outer shape parts ≤ 0.1mm; Observe under a ten - power magnifying glass, the cross - section at A is smooth without protrusions or depressions; 3. Pay attention to defective product appearance; 4. Measuring tools used: caliper; 5. Arrange neatly to prevent deformation; 6. For the first piece and spot checks, all bends must be tested without breakage before proceeding to the next process; 7. Tolerance of X.XX is ±0.08mm; 8. MARK 053.

[0160] For process 3: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to defective product appearance; 3. Measuring tools used: caliper, jig; 4. Arrange neatly to prevent deformation; 5. MARK 053

[0161] For process 4: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to defective product appearance; 3. Arrange neatly to prevent deformation; 4. For the first piece and spot checks in this process, the dimensions after flattening in process 6 shall be used as the criterion for judgment; 5. Bending and flattening must be carried out simultaneously during tooling and production start - up

[0162] For process 5: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to defective product appearance; 3. Arrange neatly to prevent deformation; 4. For the first piece and spot checks in this process, the dimensions after flattening in process 6 shall be used as the criterion for judgment; 5. Bending and flattening must be carried out simultaneously during tooling and production start - up.

[0163] For process 6: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to defective product appearance; 3. Measuring tools used: caliper; 4. Arrange neatly to prevent deformation; 5. Dimension B ≤ 1.6mm in free state, ≤ 1.3mm in pinched state; 6. The small - foot hole pitch and inner and outer diameters shall be based on passing the inspection jig.

[0164] For process 7: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to defective product appearance; 3. Measuring tools used: caliper, jig; 4. Arrange neatly to prevent deformation.

[0165] For process 8: 1. Sub - contract the electroplating to a manufacturer; 2. Electroplating requirements: matte tin plating 5uM MIN.; 3. Measuring tools used: caliper; 4. Arrange neatly to prevent deformation.

[0166] Among them, process 9: 1. Check the key dimensions as shown in the figure; 2. The specific gluing position is as shown in the figure; 3. There must be no bubbles, glue residue and wrinkles in the gluing; 4. Tape specifications: 3M 92#T=0.16MM, semi-finished product code: 2; 5. Use measuring jigs: calipers, jigs; 6. Arrange neatly to prevent deformation.

[0167] Among them, process 10: 1. Check the key dimensions as shown in the figure; 2. Pay attention to the poor appearance of the product; 3. After the tape is punched, there must be no exposed copper on the tape part of the product; 4. Use measuring jigs: calipers, jigs; 5. Arrange neatly to prevent deformation; 6. The dimension C in the free state is ≤2.0mm, and in the pinched state is ≤1.5mm.

[0168] Among them, process 11: 1. Pay attention to the defects of the previous process of the product; 2. Pay attention to the poor appearance of the product; 3. No copper is exposed on the tape part of the product; 4. Use measuring jigs: caliper, inspection jig; 5. Packaging method: Place in PE bag and seal in a box; 6. Arrange neatly to prevent deformation.

[0169] Embodiment 3, a method for manufacturing a solderless embedded copper ring, specifically comprising the following steps:

[0170] S1. Material preparation: prepare copper sheet and carve the required copper strip specifications on the copper sheet;

[0171] S2. Blanking: Use a press to punch out flat copper strips from the copper sheet;

[0172] S3. Bending 1: Bend the flat copper strip clockwise using a bending die;

[0173] S4. Bending 2: The flat copper strip is bent counterclockwise using a bending die to form a copper sheet body with a spiral laminated structure;

[0174] S5. Flattening, punching the bayonet; using a press to flatten the copper sheet body, so that the first rotating copper sheet and the second rotating copper sheet are close together, while punching out the bayonet in the copper sheet body;

[0175] S6. Electroplating;

[0176] S7 and tape combination; the thickness of the tape 110 0.06MM respectively covered with the first rotating copper sheet and the second rotating copper sheet surface;

[0177] S8. Glue sticking; fold back the tape;

[0178] S9. Punching: Use a table press to punch out excess waste tape;

[0179] S10. Quality inspection and packaging.

[0180] Among them, Process 2: 1. Inspect key dimensions as shown in the figure; 2. The burr at the thickened part A should be ≤ 0.05 mm, and the burr at other outer shape parts should be ≤ 0.1 mm. Observe under a ten-fold magnifying glass, the cross-section at A is smooth without protrusions or depressions; 3. Pay attention to the appearance defects of the product; 4. Use measuring tools: calipers; 5. Arrange neatly to prevent deformation; 6. For the first piece and spot checks, all bends should be tested without breakage before proceeding to the next process; 7. Tolerance of X.XX is ±0.08.

[0181] Among them, Process 3: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to the appearance defects of the product; 3. Arrange neatly to prevent deformation; 4. For the first piece and spot checks in this process, judge based on the dimensions after flattening in Process 6; 5. When setting up the mold for production, bending and flattening must be carried out simultaneously.

[0182] Among them, Process 4: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to the appearance defects of the product; 3. Arrange neatly to prevent deformation; 4. For the first piece and spot checks in this process, judge based on the dimensions after flattening in Process 6; 5. When setting up the mold for production, bending and flattening must be carried out simultaneously

[0183] Among them, Process 5: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to the appearance defects of the product; 3. Use measuring tools: calipers; 4. Arrange neatly to prevent deformation; 5. Dimension B ≤ 1.4 mm in the free state and ≤ 1.2 mm in the pinched state; 6. The small foot hole distance and inner and outer diameters shall be subject to passing the inspection fixture.

[0184] Among them, Process 6: 1. Outsource the electroplating to a manufacturer; 2. Electroplating requirements: Fog tin plating 5uM MIN.; 3. Use measuring tools: calipers; 4. Arrange neatly to prevent deformation.

[0185] Among them, Process 7: 1. Inspect key dimensions as shown in the figure; 2. The specific tape sticking position is as shown in the figure; 3. There should be no glue residue, air bubbles, wrinkling and other defects during tape sticking; 4. The tape specifications are: PB416F W = 30 mm (2 PCS); Semi-finished product code: 3; 5. Use measuring tools: calipers, fixture; 6. Arrange neatly to prevent deformation.

[0186] Among them, Process 8: 1. Inspect key dimensions as shown in the figure; 2. The specific tape sticking position is as shown in the figure; 3. There should be no glue residue, air bubbles, wrinkling and other defects during tape sticking; 4. The tape specifications are: PB416F T = 0.065 mm; Semi-finished product code: 4; 5. Use measuring tools: calipers, fixture; 6. Arrange neatly to prevent deformation.

[0187] Among them, Process 9: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to the appearance defects of the product; 3. After the tape is die-cut, there should be no exposed copper on the tape part of the product; 4. Use measuring tools: calipers, fixture; 5. Arrange neatly to prevent deformation; 6. Dimension C ≤ 1.7 mm in the free state and ≤ 1.5 mm in the pinched state

[0188] Among them, process 10: 1. Pay attention to the defects in the previous process of the product; 2. Pay attention to the appearance defects of the product; 3. The copper part of the product tape shall not expose copper; 4. Measuring tools used: calipers, inspection jigs; 5. Packaging method: Place it in a PE bag and seal it in a box; 6. Arrange it neatly to prevent deformation.

[0189] Example 4, a manufacturing method of a solderless embedded copper ring, specifically includes the following steps:

[0190] S1. Prepare materials: Prepare copper plate materials and mark the required copper sheet specifications on the copper plate materials;

[0191] S2. Blanking: Use a press to punch out the first rotating copper sheet and the second rotating copper sheet that are symmetrically arranged and connected end to end from the copper sheet;

[0192] S3. Punching and cutting: Use a press to punch and cut the first pin and the second pin;

[0193] S4. Bending: Use a bending die to bend the first rotating copper sheet and the second rotating copper sheet to form a copper sheet body with a spiral laminated structure;

[0194] S5. Flattening: Use a press to flatten the copper sheet body so that the first rotating copper sheet and the second rotating copper sheet are closely attached;

[0195] S6. Electroplating;

[0196] S7. Glue pasting 1: Insert the tape 110 with a thickness of 0.06MM between the first rotating copper sheet and the second rotating copper sheet;

[0197] S8. Glue pasting 2: Paste the tape 110 with a thickness of 0.06MM on the second pin;

[0198] S9. Scraping glue: Use a bench press to punch and remove the excess waste tape;

[0199] S10. Product inspection and packaging.

[0200] Among them, in process 2: 1. The key dimensions for inspection are as shown in the figure; 2. The burr at the thickened part A ≤ 0.05mm, and the burr at other outer shape parts ≤ 0.1mm; Observe under a ten-fold magnifying glass, and the cross-section is smooth without protrusions or depressions; 3. Pay attention to the appearance defects of the product; 4. Measuring tools used: calipers; 5. Arrange it neatly to prevent deformation; 6. When inspecting the first piece and conducting spot checks, all bends should be tested; Only when there is no fracture can it enter the next process; 7. The tolerance of X.XX is ±0.08mm; 8. Mark "*" as the key controlled dimension.

[0201] Among them, in process 3: 1. The key dimensions for inspection are as shown in the figure; 2. The burr at the outer shape part ≤ 0.05t; 3. Pay attention to the appearance defects of the product; 4. Measuring tools used: calipers; 5. Arrange it neatly to prevent deformation.

[0202] Among them, Process 4: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to defective product appearance; 3. Arrange neatly to prevent deformation; 4. For the first piece and spot checks in this process, the dimensions after flattening in Process 7 shall be used as the criterion for judgment; 5. When setting up the mold for production, bending and flattening must be carried out simultaneously.

[0203] Among them, Process 5: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to defective product appearance; 3. Use measuring fixtures: calipers; 4. Arrange neatly to prevent deformation; 5. In the free state, dimension B ≤ 1.6, and in the pinched state, ≤ 1.3 mm.

[0204] Among them, Process 6: 1. Outsource electroplating to a manufacturer; 2. Electroplating requirements: matte tin plating 5uM MIN.; 3. Use measuring fixtures: calipers; 4. Arrange neatly to prevent deformation.

[0205] Among them, Process 7: 1. Inspect key dimensions as shown in the figure; 2. Specific glue - sticking positions are as shown in the figure; 3. There shall be no bubbles, residual glue, wrinkling or other defective phenomena during glue - sticking; 4. The assembled product is: PB416F T = 0.06MM; 5. Use measuring fixtures: calipers, fixtures; 6. Arrange neatly to prevent deformation.

[0206] Among them, Process 8: 1. Inspect key dimensions as shown in the figure; 2. Specific glue - sticking positions are as shown in the figure; 3. There shall be no bubbles, residual glue, wrinkling or other defective phenomena during glue - sticking; 4. The assembled product is: PB416F T = 0.06MM; 5. Use measuring fixtures: calipers, fixtures; 6. Arrange neatly to prevent deformation; 7. The tape specification is 10 * 20.

[0207] Among them, Process 9: 1. Inspect key dimensions as shown in the figure; 2. Pay attention to defective product appearance; 3. Use measuring fixtures: calipers, fixtures; 4. Arrange neatly to prevent deformation; 5. In the free state, dimension C ≤ 2.0, and in the pinched state, ≤ 1.5 mm; 6. The copper ring shall not be damaged after punching the glue.

[0208] Among them, Process 10: 1. Pay attention to defects in the previous process of the product; 2. Pay attention to defective product appearance; 3. Use measuring fixtures: calipers; 4. Packaging method: Place it in a PE bag and seal it in a box; 5. Arrange neatly to prevent deformation.

[0209] The above has made a detailed description of the preferred embodiments of this patent. However, this patent is not limited to the above - mentioned embodiments. Within the scope of knowledge possessed by ordinary technicians in the art, various changes can be made without departing from the purpose of this patent.

Claims

1. Manufacturing method of a solderless embedded copper coil for a winding. The solderless embedded copper coil for a winding includes a copper sheet body. The copper sheet body has a through hole, and a bayonet for positioning is provided around the through hole. The copper sheet body has a first pin and a second pin. The copper sheet body is formed by overlapping and winding the first rotating copper sheet and the second rotating copper sheet in an alternating manner. The first rotating copper sheet and the second rotating copper sheet are connected end to end. The free ends of the first rotating copper sheet and the second rotating copper sheet extend the first pin and the second pin respectively. The first rotating copper sheet and the second rotating copper sheet are formed into a spiral overlapping structure through stamping and bending of the copper sheet. The cross-sections of the first rotating copper sheet and the second rotating copper sheet are in a counterclockwise Ω shape and a clockwise Ω shape respectively. Before forming the spiral overlapping structure, the first pins and the second pins of the first rotating copper sheet and the second rotating copper sheet are adjacent and are not separated by other structures. This manufacturing method includes the following steps: S1. Stock preparation: S2. Blanking: Stamping the copper plate material into the first rotating copper sheet and the second rotating copper sheet which are symmetrically arranged and connected end to end; S3. Punching: Punching holes in the first pin and the second pin; S4. Bending and one-step forming: Using a bending die to bend the first rotating copper sheet and the second rotating copper sheet to form the copper sheet body with a spiral overlapping structure; S5. Flattening and shaping: Using a pneumatic press to flatten the copper sheet body with a spiral overlapping structure and adjust its outer shape; S6. Punching the bayonet to obtain the solderless embedded copper coil for a winding.

2. A bending die for manufacturing the solderless embedded copper ring for windings according to claim 1, characterized in that, It includes an upper die base, an upper backing plate, a lower template, a first lower backing plate, a second lower backing plate and a lower die base. The upper die base, the upper backing plate, the lower template, the first lower backing plate, the second lower backing plate and the lower die base are arranged in sequence from top to bottom; The upper die base is fixedly connected to the upper backing plate by screws. The rear end of the upper backing plate is fixedly connected with a first bending punch. The lower template, the first lower backing plate, the second lower backing plate and the lower die base are fixedly connected by screws. The lower template is also provided with a first bending slider and a second bending slider. The lower template is also provided with a first stop block, a second gasket and a fourth stop block. A second guide post and a third stop block are arranged inside the lower template. The second guide post is located on the side of the first bending punch. The third stop block is located behind the first bending punch. The first bending slider is located on the top of the second lower backing plate and is located inside the lower template and the first lower backing plate. A second bending slider is arranged on the side of the first bending slider. The first bending slider and the second bending slider are respectively provided with a second bending punch and a third bending punch. The lower template is also provided with a first height limiting block and a second height limiting block. Two M8 screw countersunk holes are opened on the upper die base.

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