Electronic device including electrical connections on a package

Abstract

Embodiments of the present disclosure relate to electronic devices including electrical connections on a packaging block. An integrated circuit chip includes a front side having electrical connection pads. An overmolded packaging block encapsulates the integrated circuit chip and includes a front layer that at least partially covers the front side of the integrated circuit chip. A through hole of the packaging block is located above the electrical connection pad of the integrated circuit chip. The wall of the through hole is covered by an inner metal layer, which is bonded to the front pad of the integrated circuit chip. The front metal layer covers a local area of ​​the front side of the front layer, wherein the front metal layer is bonded to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles included in the material of the packaging block.

Description

[0001] Cross-reference fields to related applications

[0002] This application claims the benefit of priority of French Patent Application No. 1872789, filed on December 12, 2018, the contents of which are incorporated herein by reference in their entirety to the maximum extent permitted by law. Technical Field

[0003] Embodiments relate to an electronic device including an integrated circuit chip and a carrier substrate for the integrated circuit chip. Background Art

[0004] Typically, in such electronic devices, the integrated circuit chip is connected to the carrier substrate by wires or by electrical connection elements inserted between the integrated circuit chip and the carrier substrate, and the integrated circuit chip and the wires or electrical connection elements are embedded in a package block in front of the carrier substrate. In the case of stacked integrated circuit chips, the electrical connection is also achieved by wires or inserted electrical connection elements. Summary of the invention

[0005] According to one embodiment, an electronic device includes an integrated circuit chip and an overmolded package block, wherein the front side of the integrated circuit chip is provided with at least one electrical connection pad, and the overmolded package block encapsulates the integrated circuit chip and includes a front layer at least partially covering the front side of the integrated circuit chip.

[0006] The package block includes a plastic material containing additive particles and has through holes over pads of the integrated circuit chip.

[0007] The walls of the hole are covered by an inner metal layer, which is bonded to the front pad of the integrated circuit chip, and a local area of ​​the front side of the overmolded package block extending until the hole is covered by a local front metal layer to form an electrical connection, and the local front metal layer is bonded to the inner metal layer.

[0008] The inner metal layer and the local front metal layer are attached or anchored to additive particles included in the material of the encapsulation block.

[0009] By means of the above arrangement, the electrical connection is direct and straightforward and can be short.

[0010] At least a portion of a periphery of the edge of the hole in the front layer of the package block (on the integrated circuit chip side) may be above and adjacent to the front side of the pad of the integrated circuit chip.

[0011] The front layer of the package block may partially cover the front side of the front pad.

[0012] The edges of the holes in the front layer of the package block (located on the integrated circuit chip side) may be inscribed over the front side of the pads of the integrated circuit chip.

[0013] The back side of the integrated circuit chip may be attached on top of the front side of the carrier substrate.

[0014] The overmolded package may include an annular peripheral portion on top of the front side of the carrier substrate extending around the periphery of the integrated circuit chip.

[0015] The annular peripheral portion of the encapsulated package block may have a through hole, the wall of which is covered by an inner metal layer, which is connected to the electrical connection pads on the front side of the carrier substrate and the local front metal layer to form an electrical connection between the front pads of the integrated circuit chip and the front pads of the carrier substrate.

[0016] Additional electronic components may be mounted on top of the front side of the carrier substrate, at a distance from the integrated circuit chip, and embedded in the overmolded package.

[0017] The annular peripheral portion of the overmolded package block may have a through hole located above the second electrical component, the wall of the through hole being covered by an inner metal layer connected to the electrical connection pads of the front side of the second electronic component and the local front side metal layer.

[0018] Thus, electrical connections may be formed between the front pads of the integrated circuit chip and the front pads of the carrier substrate, the inner metal layer being attached or anchored to the additive particles included in the material of the package block.

[0019] An additional electronic component may be mounted on top of the front layer of the overmolded package block via at least one electrical connection element interposed between the local front metal layer and the pads of the electronic component.

[0020] A method for manufacturing an electronic device is also proposed, the method comprising: placing an integrated circuit chip in a mold, the integrated circuit chip having a front side provided with at least one electrical connection pad; and injecting a material provided with additive particles that can be activated by laser radiation into the mold so as to produce a packaging block by overmolding, the packaging block comprising a layer that at least partially covers the said side of the integrated circuit chip; then, after removing the obtained device from the mold: making a hole in the layer of the packaging block above the pad of the integrated circuit chip, and activating the additive particles under the action of laser radiation, the additive particles being located in the wall of the hole and in a local area of ​​the front side of the front layer extending up to the hole; and producing a metallization phase in a metal bath so as to form an inner metal layer and a local front metal layer under the action of the activated particles, the inner metal layer being attached or anchored to the wall of the hole and connected to the front pad of the integrated circuit chip, and the local front metal layer being attached or anchored to the front local area of ​​the front side of the layer of the packaging block and connected to the inner metal layer of the hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] An electronic device and a method of making the same will now be described by way of non-limiting exemplary embodiments illustrated in the accompanying drawings, in which:

[0022] Figure 1 A cross section of an electronic device is shown.

[0023] Figure 2 Shows Figure 1 A partial top view of an electronic device.

[0024] Figure 3 shows a cross section of another electronic device;

[0025] Figure 4 shows a cross section of another electronic device; and

[0026] Figure 5 A cross section of another electronic device is shown. DETAILED DESCRIPTION

[0027] Figure 1 and Figure 2 The electronic device 1 shown comprises an integrated circuit chip 2 having a front side 3 provided with at least one electrical connection pad 4 having a front side 5 .

[0028] The electronic device 1 comprises an overmoulded encapsulation block 6 for encapsulating an integrated circuit chip 2, the encapsulation block 6 comprising a front layer 7 at least partially covering the front side 3 of the integrated circuit chip 2. The encapsulation block 6 has a front side 8.

[0029] The front layer 7 of the package block 6 has a through hole 9 located above the pad 4. At least a portion of the periphery of the edge of the hole 9 (located on the side of the integrated circuit chip 2) is located above and adjacent to the front surface 5 of the pad 4 of the integrated circuit chip 2. In other words, the front layer 7 of the package block 6 partially covers the front surface 5 of the front pad 4 at the periphery of the front surface 5. For example, the through hole 9 is inscribed in the front surface 5 of the pad 4.

[0030] The walls of the through-hole 9 are covered by an inner metal layer 10 which is bonded to (physically contacts) the front pad 4 of the integrated circuit chip 2 so as to form an electrical connection.

[0031] The recessed local area 12 of the front side 8 of the front layer 7 (extending up to the front edge of the through hole 9) is covered with a local front metal layer 12 that is bonded to (physically contacts) the inner metal layer 10 so as to form an electrical connection. Advantageously, the front metal layer 12 is connected to the front periphery of the inner metal layer 10.

[0032] The overmolded packaging block 6 comprises a plastic material (e.g. a resin) containing additive particles dispersed throughout the material. The additive particles located in the surface portion of the wall of the hole 9 and the surface portion of the front region 11 are now activated and comprise metal particles for attaching or anchoring the inner metal layer 10 and the front metal layer 12 to the packaging block 6.

[0033] A manufacturing method of the electronic device 1 includes the following steps.

[0034] The integrated circuit chip 2 is placed in a mold so as to form a molding cavity corresponding to the package block 6 to be manufactured.

[0035] A liquid plastic material (such as a thermosetting resin) is injected into the cavity of the mold. The liquid plastic material contains non-conductive additive particles in a suspension, on which the laser direct structuring (LDS) technique can be performed.

[0036] Once the material solidifies, a solid encapsulating mass 6 is obtained, the front layer 7 of which prolongs or extends over the front pads 4 of the integrated circuit chip 2. Additive particles are then dispersed throughout and included in the solid plastic material.

[0037] Subsequently, once the device has been removed from the mold, the solid material is etched under the action of laser radiation in order to form the through-holes 9 and the grooves in the front region 11. In doing so, the additive particles of the surface portions of the holes 9 and of the grooved front region 11 are activated under the action of the laser radiation in order to allow the appearance of active metal particles.

[0038] Subsequently, the device is immersed in a metal bath. The metal of the metal bath is attached or anchored to the activated additive particles of the walls of the holes 9 and of the front region 11 so as to locally form the inner metal layer 10 and the front metal layer 12.

[0039] Once out of the metal bath, the electronic device 1 is directly obtained.

[0040] More specifically, according to Figure 1 and Figure 2 In one exemplary embodiment shown, the electronic device 1 comprises a carrier substrate 13 having a front side 14 and a back side 15 .

[0041] An integrated circuit chip 2 is attached to the top of the front side 14 of the carrier substrate 13 via an adhesive layer 16 , the integrated circuit chip 2 covering a central area of ​​the front side 14 .

[0042] The carrier substrate 13 is provided with a network 17 of electrical connections from one face to the other and comprises in the front face 14 electrical connection pads 18 situated at a distance from the periphery of the integrated circuit chip 2 and having a front face 19 .

[0043] The package block 6 comprises a front layer 7 and an annular peripheral portion 20 which surrounds the periphery of the integrated circuit chip 2, extends on top of the peripheral area of ​​the front side 14 of the carrier substrate 13 and is bonded to the front layer 7. The front side 8 of the package block 6 is flat and parallel to the carrier substrate 13.

[0044] The peripheral portion 20 of the package block 6 has a through hole 21 located above the pad 18. The through hole 21 is positioned relative to the pad 18 of the carrier substrate 13 in the same way as the position of the hole 9 relative to the pad 4 of the integrated circuit chip 2 (described above).

[0045] The walls of the through-hole 21 are covered by an inner metal layer 22 which is bonded to the front pad 18 of the carrier substrate 13 in order to form an electrical connection.

[0046] The recessed partial area 11 of the front side 8 of the package block 6 extends up to the front edge of the through hole 21 and the front metal layer 12 is bonded to the inner metal layer 22 in order to form an electrical connection.

[0047] Thus, the front pads 4 of the integrated circuit chip 2 and the front pads 18 of the network of electrical connections 17 are connected by electrical connections 23 comprising the inner metal layers 9 and 22 and the front metal layer 12, which constitutes the front traces.

[0048] One way of manufacturing the electronic device 1 thus formed comprises steps equivalent to those described above for forming the electrical connection 23 .

[0049] The electronic device 1 may comprise a plurality of electrical connections 23 connecting further front pads of the integrated circuit chip to further front pads of the network of electrical connections 17 of the carrier substrate 13 .

[0050] According to the same Figure 1 In a variant embodiment illustrated in the figure, the electronic device 1 may further include a plurality of wires (bonding wires) 24, which are embedded in the packaging block 6 when the constituent materials of the packaging block are injected, and these wires 24 connect other front pads 26 of the integrated circuit chip 2 to other front pads 27 of the network of electrical connections 17 of the carrier substrate 13.

[0051] The electronic device 1 may be mounted on top of a printed circuit board (not shown) via electrical connection elements (not shown) placed on back pads 18 of a network of electrical connections 17 located in the back side 15 of the electronic device 1 .

[0052] according to Figure 3 In one variant embodiment illustrated, the electronic device 1A comprises an integrated circuit chip 2 bonded to a carrier substrate 13 .

[0053] The front side 3 of the integrated circuit chip 2 is provided with front electrical connection pads 27 and 28 .

[0054] The front layer 7 of the overmolded package block 6 has through holes 29 and 30, which are connected to the upper Figure 1 to Figure 2 is positioned over the front pads 27 and 28 in a manner equivalent to that described in .

[0055] The walls of the holes 29 and 30 are covered with inner metal layers 31 and 32 , which are bonded to the pads 27 and 28 .

[0056] The grooved front partial areas 33 and 34 of the front side 8 of the front layer 7 of the package block 6 are covered with partial front metal layers 35 and 36, which extend to the front edges of the through holes 29 and 30 respectively, and the front metal layers 35 and 36 are respectively bonded to the inner metal layers 31 and 32.

[0057] The inner metal layers 31 and 32 and the front metal layers 35 and 36 form electrical connections 37 and 38, which are connected to the upper Figure 1 to Figure 2 produced in a manner equivalent to that described in .

[0058] According to a variant embodiment, the electronic device 1A includes an additional electronic component 39, such as a discrete component (passive or active), an integrated circuit chip or a specific electronic package, which is mounted on the top of the front layer 7 of the packaging block 6 via electrical connection elements 40 and 41, and the electrical connection elements 40 and 41 are inserted between the front metal layers 35 and 36 and the pads 42 and 43 of the additional component 39, so that the integrated circuit chip 2 and the additional component 39 are connected.

[0059] A plurality of electrical connections 37 and 38 and electrical connection elements 40 and 41 may be provided to connect the integrated circuit chip 2 and the additional component 39 .

[0060] The electronic device 1A comprises electrical connections 23 and / or electrical wires 24 (see Figure 2 ), or a plurality of electrical connections 23 and / or wires 24, so that the integrated circuit chip 2 is connected to the network of electrical connections 17 of the carrier substrate 13 in a manner equivalent to that described above.

[0061] According to a variant embodiment (not shown), the second integrated circuit chip 39 may then be embedded in an additional packaging layer formed on top of the front side 8 of the packaging block 6 .

[0062] According to a variant embodiment (not shown), the second integrated circuit chip 39 is not present above the integrated circuit chip 2 or is located elsewhere above the integrated circuit chip 2, and at least one of the local front metal layers 35 and 36 or a plurality of such local front metal layers can be connected to the front pads of the network of electrical connections 17 of the carrier substrate 13 via wires located outside the packaging block 6.

[0063] according to Figure 4 In an exemplary embodiment illustrated, the electronic device 1B includes an additional electronic component 44, such as a discrete component (passive or active) or an integrated circuit chip, and the additional electronic component 44 is mounted on the top of the front side 14 of the carrier substrate 13, at a certain distance from the integrated circuit chip 2, and the additional electronic component 44 is embedded in the packaging block 6.

[0064] The electronic components 44 are connected to the network of electrical connections 17 of the carrier substrate 13 via intermediate electrical connection elements and / or electrical wires.

[0065] The electrical connection 23 is modified so that the through hole 22 is formed over the front pad 45 of the additional electronic component 44, and the inner layer 22 is connected to the front pad 45. Therefore, the integrated circuit chip 2 and the electronic component 44 are connected via the electrical connection 23 formed in this way. The integrated circuit chip 2 and the electronic component 44 can be connected via a plurality of electrical connections 23 formed in this way.

[0066] according to Figure 5 In one exemplary embodiment shown, an electronic device 101 includes an integrated circuit chip 102 having a front side 103 and a back side 105 , wherein the front side 103 is provided with a plurality of electrical connection pads 104 .

[0067] The integrated circuit chip 102 is embedded in an overmolded package block 106, which includes a front layer 107 extending above the surface 103 of the integrated circuit chip 102 and an annular portion 108 surrounding the periphery of the integrated circuit chip 102, so that the package block 106 has a front side 109 parallel to the surfaces 103 and 105 of the integrated circuit chip 102 and an annular back side 110 located in the plane of the back side 105 of the integrated circuit chip 102.

[0068] The package block 106 is provided with a plurality of electrical connections 111 which are formed by etching the package block 106 by laser means as described above.

[0069] Each electrical connection 111 includes an inner metal layer 112 covering the walls of a through hole 113 (through the front layer 107 of the packaging block 106) and is connected to the front pad 103 of the integrated circuit chip 102, and includes a local front metal layer 114, which covers a grooved local area 115 of the front side 109 of the packaging block 106 and is connected to the inner metal layer 112.

[0070] The electronic device 201 may be mounted on top of a printed circuit board (not shown) via electrical connection elements (not shown) placed on the local front metal layer 114 of the electrical connections 111 .

[0071] According to variant embodiments, the electronic device may include a combination of the various electrical connections described in the exemplary embodiments and variant embodiments above and a combination of several packaging layers on top of each other and having a combination of electrical connections including inner metal layers and front metal layers.

Claims

1. An electronic device, comprising: An integrated circuit chip having a front side provided with electrical connection pads; as well as an overmolded package block for packaging the integrated circuit chip, the overmolded package block comprising a front layer at least partially covering the front side of the integrated circuit chip, wherein the overmolded package block comprises a plastic material containing additive particles; wherein the overmolded package block includes a through hole located above the electrical connection pad of the integrated circuit chip and a local area of ​​the front surface of the overmolded package block extending up to the through hole; an inner metal layer covering the walls of the through-hole, wherein the inner metal layer is bonded to the electrical connection pads of the integrated circuit chip and is attached or anchored to the additive particles at the walls; as well as a local front metal layer on the local area of ​​the front side of the overmolded package block, wherein the local front metal layer is bonded to the inner metal layer and is attached or anchored to the additive particles at the local area; The local front metal layer forms an electrical connection.

2. The device of claim 1 , wherein at least a portion of the periphery at the edge of the hole in the front layer of the packaging block is located above and in contact with the front side of the electrical connection pad of the integrated circuit chip. 3 . The device of claim 1 , wherein the front layer of the package block at least partially covers the front side of the electrical connection pads.

4. The apparatus of claim 1, wherein edges of the apertures in the front layer of the package block are inscribed over front surfaces of the electrical connection pads of the integrated circuit chip.

5. The apparatus of claim 1 , wherein a back side of the integrated circuit chip is attached to the top of a front side of a carrier substrate, and the overmolded package comprises an annular peripheral portion extending around a periphery of the integrated circuit chip over the front side of the carrier substrate.

6. The apparatus of claim 5, wherein the annular peripheral portion of the overmolded package mass comprises additional through-holes located above electrical connection pads of the carrier substrate; and A further inner metal layer covers the walls of the further through-holes, wherein the further inner metal layer is bonded to the electrical connection pads of the carrier substrate and the local front metal layer, the further inner metal layer being attached or anchored to the additive particles at the walls.

7. The apparatus according to claim 5, further comprising: an additional electronic component mounted on top of the front side of the carrier substrate at a location spaced apart from the integrated circuit chip; wherein the additional electronic component is embedded in the annular peripheral portion of the overmolded package block; wherein the annular peripheral portion of the overmolded package comprises a further through hole located above a pad of the additional electronic component; and A further inner metal layer covers the walls of the further through-hole, wherein the further inner metal layer is bonded to the pad of the additional electronic component and to the local front metal layer, the further inner metal layer being attached or anchored to the additive particles at the walls.

8. The device according to claim 1 comprises an additional electronic component, which is mounted on top of the front layer of the overmolded package block via at least one electrical connection element, and the at least one electrical connection element is inserted between the local front metal layer and the pad of the additional electronic component.

9. A method for manufacturing an electronic device, comprising: placing an integrated circuit chip in the mold, the integrated circuit chip having a front side provided with electrical connection pads; injecting a material into the mold, the material being provided with additive particles activatable in response to laser radiation; curing the injected material to produce an overmolded device including an encapsulation block including a layer at least partially covering the front side of the integrated circuit chip; removing the overmolded device from the mold; making through holes in the layer of the package block above the electrical connection pads of the integrated circuit chip; applying laser radiation to activate the additive particles, which are located at the walls of the through-holes and in localized regions of the front side of the layer extending up to the through-holes; as well as A metallization phase is produced in a metal bath so that an inner metal layer and a local front metal layer are formed under the action of the activated additive particles, wherein the inner metal layer is attached or anchored to the wall of the through-hole and is connected to the electrical connection pad of the integrated circuit chip, and the local front metal layer is attached or anchored to the local area of ​​the front side of the layer of the package block and is connected to the inner metal layer of the through-hole.

10. The method of claim 9, further comprising mounting the integrated circuit chip to a front side of a carrier substrate, and wherein placing comprises placing the integrated circuit chip mounted to the carrier substrate in the mold. 11 . The method of claim 10 , wherein the package block further comprises an annular peripheral portion extending around a periphery of the integrated circuit chip over the front side of the carrier substrate.

12. The method according to claim 11, further comprising: making a further through hole in the annular peripheral partial layer of the encapsulating block; applying laser radiation to activate the additive particles at the walls of the further through-holes; as well as The metallization phase is produced in the metal bath so as to produce, under the action of the activated additive particles, a further inner metal layer which is attached or anchored to the wall of the further through-hole and connected to the local front metal layer. 13 . The method of claim 12 , wherein making the further via comprises extending the further via to reach a pad on the front side of the carrier substrate.

14. The method of claim 12, wherein making the further through-via comprises extending the further through-via to reach a pad of an electronic component mounted to the front side of the carrier substrate.

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