A multi-infrared emitter circuit board testing device

Abstract

The present invention relates to the technical field of electronic component detection, and particularly relates to a multi-infrared emitter circuit board testing device, which includes a support component, a detection component, and an adjustment component. The support component includes a support base for mounting a circuit board to be detected and a support frame located on one side of the support base; the detection component includes an infrared detection board and an infrared receiver located at the bottom end of the infrared detection board and corresponding to the infrared emitter. An infrared isolation component is provided outside the infrared receiver, and the infrared isolation component covers the outside of the infrared emitter; the top end of the adjustment component is connected to the support frame, and the bottom end of the adjustment component is fixedly connected to the infrared detection board. The infrared receiver corresponds to the infrared emitter, which facilitates the infrared receiver to detect whether the infrared emitter is damaged. Whether there is damage among multiple infrared emitters on the circuit board to be detected can be detected through one-time detection, which facilitates screening out unqualified circuit boards to be detected and improves the detection efficiency of the circuit boards to be detected.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component detection, and particularly relates to a test device for a circuit board with multiple infrared emitting heads. Background Art

[0002] Infrared emitting heads are widely used in the technical field of signal reception. During the production process, infrared emitting heads are characterized by small volume and large production volume. For the quality detection of infrared emitting heads, currently, the method of manual single detection is often adopted.

[0003] In the Chinese patent application with the authorization announcement number CN208675238U, a detection device for an optical device emitter is disclosed. In the production and manufacturing of optical devices, it is necessary to measure the performance of the optical emitter to determine its quality. Generally, the performance measurement is to perform a four-directionality test on the optical emitter. During the test process, the test fiber of the test component needs to be inserted into the optical emitter four times from different angles, and then the test component analyzes and processes the data measured four times. This solution can measure the four-directionality of the infrared emission station and measure it separately for each individual infrared emitter.

[0004] However, when there are multiple infrared emitters installed on the circuit board, if the method of manual single detection is continued, the detection efficiency will be relatively low. Summary of the Invention

[0005] The purpose of the present invention is to provide a test device for a circuit board with multiple infrared emitting heads to solve the technical problem of low efficiency in manual single detection when there are multiple infrared emitting heads installed on the circuit board in the prior art.

[0006] To achieve the above purpose, the technical solution adopted by the present invention is to provide a test device for a circuit board with multiple infrared emitting heads, which is used to detect a circuit board to be detected, and there are several infrared emitting heads on the circuit board to be detected. The device includes a support component, a detection component, and an adjustment component for adjusting the infrared receiving head to be close to or far from the infrared emitting head. The support component includes a support base for installing the circuit board to be detected and a support frame located on one side of the support base; the detection component includes an infrared detection board and an infrared receiving head located at the bottom end of the infrared detection board and corresponding to the infrared emitting head. An infrared isolation component is arranged outside the infrared receiving head, and the infrared isolation component covers the outside of the infrared emitting head; the top end of the adjustment component is connected to the support frame, and the bottom end of the adjustment component is fixedly connected to the infrared detection board.

[0007] Further, on one side of the top end of the support frame, there is an installation frame, and a connecting plate for fixing the adjustment component is arranged on the installation frame.

[0008] Further, a sliding through-hole is formed in the connecting plate. The adjusting component includes a sliding rod slidably connected to the sliding through-hole. The detecting component is fixed to the bottom end of the sliding rod, and a handle for pushing and pulling the sliding rod is arranged at the top end of the sliding rod.

[0009] Further, a limiting component for restricting the rotation of the sliding rod is arranged on the sliding rod.

[0010] Further, the limiting component includes a limiting block fixed to one side of the sliding rod. A limiting groove for clamping the limiting block is formed in the side wall of the sliding through-hole, and the limiting block is slidably connected to the limiting groove.

[0011] Further, the length of the limiting block is equal to the length of the sliding rod.

[0012] Further, the infrared isolation component includes an infrared isolation plate located at the bottom end of the infrared detection board and an isolation frame located at the bottom end of the infrared isolation plate. The isolation frame covers the outside of the infrared emitter.

[0013] Further, a limiting boss is arranged on the support base, and a clamping groove that can be clamped to the limiting boss is formed on the circuit board to be detected.

[0014] Further, the number of the limiting bosses is at least two and they are arranged oppositely, and the number and positions of the clamping grooves correspond to those of the limiting bosses.

[0015] Further, the detecting component further includes a detecting mounting table fixed to the bottom end of the sliding rod, and the infrared detection board is located at the bottom end of the detecting mounting table.

[0016] The beneficial effects of the present invention are as follows:

[0017] 1. The infrared receiver is corresponding to the infrared emitter, which is convenient for the infrared receiver to detect whether the infrared emitter is damaged. It can detect whether there is damage among multiple infrared emitters on the circuit board to be detected through one detection, which is convenient for screening out unqualified circuit boards to be detected and improves the detection efficiency of the circuit boards to be detected. By arranging the infrared isolation component, the infrared emitter can be isolated, so that each infrared receiver can only receive the signal emitted by the corresponding infrared emitter, and the detection accuracy of the circuit board to be detected is improved.

[0018] 2. By arranging the connecting plate for connecting the adjusting component, it is convenient for the adjusting component to adjust the position of the detecting component and convenient for the detecting component to detect.

[0019] 3. When it is necessary to detect the circuit board to be detected, pull the handle to move the sliding rod in the sliding hole, thereby driving the detection component to rise. At this time, the circuit board to be detected can be placed on the support base, and then release the handle. Under the action of the gravity of the detection component, the detection component will descend and abut against the infrared emitter, and then the infrared emitter can be started for detection.

[0020] 4. By setting the limit component, the rotation of the sliding rod is avoided, ensuring that the horizontal position of the infrared receiver does not shift, which is beneficial to the detection of the circuit board to be detected.

[0021] 5. The limit block and the limit groove can not only meet the requirements of limiting, but also have a simple structure and are easy to design and manufacture.

[0022] 6. The length of the limit block is equal to that of the sliding rod, so that the limit block can always be clamped in the limit groove, avoiding the limit block sliding out of the limit groove when the sliding rod slides, and preventing the rotation of the limit rod from causing the horizontal position of the infrared receiver to shift.

[0023] 7. Since the distance between the infrared emitters is relatively close, the infrared emitters will interfere with each other and affect the normal detection of the infrared receiver, resulting in inaccurate detection of the circuit board to be detected. When detecting the infrared emitter, one end of the infrared emitter is located inside the isolation frame, and the infrared receiver is located at the other end inside the isolation frame. By setting the isolation frame, the infrared emitters are isolated, so that each infrared receiver can only receive the signal emitted by the corresponding infrared emitter, enhancing the detection accuracy of the circuit board to be detected.

[0024] 8. The limit boss can limit the installation position of the circuit board to be detected, making the detection position of the circuit board to be detected fixed, facilitating the correspondence between the infrared receiver and the infrared emitter, and being beneficial to the detection of the circuit board to be detected.

[0025] 9. The number of limit bosses is at least two and they are arranged oppositely, so that both opposite sides of the circuit board to be detected are clamped and positioned, avoiding the position shift caused by the shaking of the circuit board to be detected after installation, and being beneficial to the detection of the infrared receiver to a certain extent.

[0026] 10. By setting the detection installation platform, it is convenient to install and replace the infrared detection board and the infrared receiver after they are damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0028] Figure 1 Schematic three-dimensional structure diagram of a multi-infrared emitter circuit board testing device provided by an embodiment of the present invention;

[0029] Figure 2 Exploded structure diagram of a multi-infrared emitter circuit board testing device provided by an embodiment of the present invention;

[0030] Figure 3 Schematic position diagram of a limiting groove adopted by a multi-infrared emitter circuit board testing device provided by an embodiment of the present invention;

[0031] Figure 4 Overall structure diagram of an infrared isolation component adopted by a multi-infrared emitter circuit board testing device provided by an embodiment of the present invention.

[0032] Description of reference numerals:

[0033] 1. Support assembly; 11. Support base; 111. Limiting boss; 12. Support frame; 13. Mounting frame; 14. Connecting plate; 141. Sliding through-hole; 142. Limiting groove; 2. Detection assembly; 21. Infrared detection board; 22. Infrared receiver; 23. Detection mounting table; 3. Circuit board to be detected; 31. Infrared emitter; 32. Card slot; 4. Adjustment assembly; 41. Sliding rod; 42. Handle; 5. Limiting assembly; 51. Limiting block; 6. Infrared isolation assembly; 61. Infrared isolation board; 62. Isolation frame. Detailed implementation manners

[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0035] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0036] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0038] Referring to Figure 1 , an embodiment of the present invention provides a multi-infrared emitter circuit board testing device for testing a circuit board 3 to be detected, and there are several infrared emitters 31 on the circuit board 3 to be detected. The multi-infrared emitter circuit board testing device includes a support assembly 1, a detection assembly 2, and an adjustment assembly 4.

[0039] Referring to Figure 1 and Figure 2 , the support assembly 1 includes a support base 11, a support frame 12, a mounting frame 13, and a connection plate 14. The support base 11 can mount the circuit board 3 to be detected. The support frame 12 is fixed to one side of the support base 11. The mounting frame 13 is fixed to the top of the support frame 12 and the mounting frame 13 is located directly above the support base 11. A connection plate 14 is fixedly installed on the mounting frame 13, and a sliding through hole 141 is opened at the middle position of the connection plate 14.

[0040] The detection assembly 2 includes a detection mounting table 23, an infrared detection board 21, and an infrared receiver 22. The infrared detection board 21 is fixed to the bottom end of the detection mounting table 23. The infrared receiver 22 is located at the bottom end of the infrared detection board 21, and the number and positions of the infrared receivers 22 correspond to those of the infrared emitters 31. By providing the detection mounting table 23, it is convenient to install and replace the infrared detection board 21 and the infrared receiver 22 after they are damaged. An infrared isolation assembly 6 is provided outside the infrared receiver 22, and the infrared isolation assembly 6 covers the outside of the infrared emitter 31. By providing the infrared isolation assembly 6, the infrared emitter 31 can be isolated, so that each infrared receiver 22 can only receive the signal emitted by the corresponding infrared emitter 31, improving the detection accuracy of the circuit board 3 to be detected.

[0041] The infrared receivers 22 correspond to the infrared emitters 31, which is convenient for the infrared receivers 22 to detect whether the infrared emitters 31 are damaged. Whether there is damage to multiple infrared emitters 31 on the circuit board 3 to be detected can be detected through one detection, which is convenient for screening out unqualified circuit boards 3 to be detected and improving the detection efficiency of the circuit board 3 to be detected.

[0042] The adjusting component 4 can adjust the infrared receiving head 22 to be closer to or farther from the infrared transmitting head 31. The adjusting component 4 includes a sliding rod 41 which is slidably connected to the sliding through hole 141. One end of the sliding rod 41 is located above the sliding through hole 141, and the other end is located below the sliding through hole 141. The detection mounting table 23 is fixed to the bottom end of the sliding rod 41, and a handle 42 for pushing and pulling the sliding rod 41 is provided at the top end of the sliding rod 41. When it is necessary to detect the circuit board 3 to be detected, pull the handle 42 to move the sliding rod 41 in the sliding through hole 141, thereby driving the detection component 2 to rise. At this time, the circuit board 3 to be detected can be placed on the support base 11, and then release the handle 42. Under the action of the gravity of the detection component 2, the detection component 2 will descend and abut against the infrared transmitting head 31, and then the infrared transmitting head 31 can be started for detection.

[0043] Wherein, the adjusting component 4 can also be replaced by a telescopic rod. The telescopic rod is fixed on the support base 11, and an installation groove for placing the circuit board 3 to be detected is provided at the top end of the telescopic rod. At this time, the detection component 2 is fixed to the bottom end of the connecting plate 14. After the telescopic rod is started and extended, the circuit board 3 to be detected rises. At this time, the infrared transmitting head 31 can be moved into the isolation component 6 for the infrared receiving head 22 to detect.

[0044] Referring to Figure 1 , further, as a multi-infrared transmitting head circuit board testing device provided by an embodiment of the present invention, a limiting component 5 for restricting the rotation of the sliding rod 41 is provided on the sliding rod 41. By providing the limiting component 5, the rotation of the sliding rod 41 is avoided, ensuring that the horizontal position of the infrared receiving head 22 does not shift, which is beneficial to the detection of the circuit board 3 to be detected.

[0045] Referring to Figure 1 , specifically, the limiting component 5 includes a limiting block 51 fixed to one side of the sliding rod 41, and a limiting groove 142 for clamping the limiting block 51 is formed on the side wall of the sliding through hole 141. The limiting block 51 is slidably connected to the limiting groove 142. The limiting block 51 and the limiting groove 142 can not only meet the limiting requirements, but also have a simple structure and are easy to design and manufacture. The limiting block 51 is equal in length to the sliding rod 41. The limiting block 51 is equal in length to the sliding rod 41, so that the limiting block 51 can always be clamped in the limiting groove 142, avoiding the limiting block 51 sliding out of the limiting groove 142 when the sliding rod 41 slides, and preventing the rotation of the sliding rod 41 from causing the horizontal position of the infrared receiving head 22 to shift.

[0046] Among them, the limiting component 5 may further include a guiding groove. At this time, a guiding protrusion is fixed on the side wall of the sliding through hole 141, and the guiding protrusion is located in the guiding groove. The guiding groove is opened on the side wall of the sliding rod 41 and has the same length as the sliding rod 41. The limiting component 5 may not be provided. At this time, the sliding through hole 141 may be set in the shape of a polygon such as a triangle or a quadrilateral, and the sliding rod 41 is set in the shape of a prism that matches the sliding through hole 141. The prism and the polygonal hole have a limiting effect on their own structures and are not easy to rotate in the radial direction of the prism. Therefore, at this time, there is no need to add the limiting component 5.

[0047] Referring to Figure 1 and Figure 4 , further, as a multi-infrared emitter circuit board testing device provided by an embodiment of the present invention, the infrared isolation component 6 includes an infrared isolation board 61 located at the bottom end of the infrared detection board 21 and an isolation frame 62 located at the bottom end of the infrared isolation board 61. The isolation frame 62 is in the shape of a cube, and the number and position of the isolation frames 62 correspond to the infrared emitters 31. The isolation frame 62 covers the outside of the infrared emitter 31. Since the distance between the infrared emitters 31 is relatively close, the infrared emitters 31 will interfere with each other and affect the normal detection of the infrared receiver 22, resulting in inaccurate detection of the circuit board 3 to be detected. When detecting the infrared emitter 31, one end of the infrared emitter 31 is located inside the isolation frame 62, and the infrared receiver 22 is located at the other end inside the isolation frame 62. By providing the isolation frame 62, the infrared emitter 31 is isolated, so that each infrared receiver 22 can only receive the signal emitted by the corresponding infrared emitter 31, which improves the detection accuracy of the circuit board 3 to be detected. Among them, the isolation frame 62 may also be set in the shape of a cylinder, as long as it can completely cover the infrared emitter 31, and its specific shape is not limited.

[0048] Referring to Figure 1 , further, as a multi-infrared emitter circuit board testing device provided by an embodiment of the present invention, a limiting boss 111 is provided on the support base 11, and a card slot 32 that can be clamped to the limiting boss 111 is provided on the circuit board 3 to be detected. The limiting boss 111 can limit the installation position of the circuit board 3 to be detected, so that the detection position of the circuit board 3 to be detected is fixed, which is convenient for the infrared receiver 22 to correspond to the infrared emitter 31 and is beneficial to the detection of the circuit board 3 to be detected.

[0049] Among them, the positions of the limiting boss 111 and the card slot 32 can be interchanged, that is, the limiting boss 111 is provided on the circuit board 3 to be detected, and the card slot 32 is provided on the support base 11. At this time, the shapes and structures of the circuit board 3 to be detected and the support base 11 need to be adjusted accordingly.

[0050] Specifically 1, the number of the limiting bosses 111 is at least two and they are arranged oppositely. The number and positions of the card slots 32 correspond to those of the limiting bosses 111. The number of the limiting bosses 111 is at least two and they are arranged oppositely, so that both opposite sides of the circuit board 3 to be detected are clamped and positioned, avoiding the position deviation caused by the shaking of the circuit board 3 to be detected after installation, which is beneficial to the detection of the infrared receiving head 22 to a certain extent.

[0051] The implementation process of the embodiment of the present invention is as follows: When it is necessary to detect the circuit board 3 to be detected, the operator pulls the handle 42 to lift the detection component 2. At this time, the circuit board 3 to be detected can be placed on the support base 11, and the position of the circuit board 3 to be detected is adjusted so that the limiting bosses 111 are clamped in the card slots 32. After the circuit board 3 to be detected is fixed, the handle 42 is slowly released to make the detection component 2 move downward. When the detection component 2 moves to the lowest end, at this time, the infrared receiving head 22 and the infrared transmitting head 31 are both in the corresponding isolation frames 62 and are completely isolated from each other. Then press the detection button. At this time, each infrared transmitting head 31 will emit infrared rays. Due to the isolation of the isolation frame 62, each infrared receiving head 22 will only receive the infrared rays emitted by its corresponding infrared transmitting head 31. At this time, if each infrared receiving head 22 can receive infrared rays, it means that each infrared transmitting head 31 is good, and the device will prompt that the test passes. Otherwise, as long as one infrared receiving head 22 fails to detect, the device will prompt that the test fails.

[0052] The embodiments of the present specific implementation manners are all preferred embodiments of the present invention, and do not limit the protection scope of the present invention accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be covered within the protection scope of the present invention.

Claims

1. A multi-infrared emitter circuit board testing device is used to test a circuit board to be detected (3), and a plurality of infrared emitters (31) are provided on the circuit board to be detected (3). It is characterized in that, Comprising: A support component (1), which includes a support base (11) for mounting a circuit board (3) to be detected and a support frame (12) located on one side of the support base (11). On one side of the top end of the support frame (12), there is a mounting frame (13). A connecting plate (14) is arranged on the mounting frame (13), and the connecting plate (14) is provided with a sliding through hole (141); A detection component (2), which includes an infrared detection board (21) and an infrared receiving head (22) located at the bottom end of the infrared detection board (21) and corresponding to the infrared transmitting head (31). An infrared isolation component (6) is arranged outside the infrared receiving head (22), and the infrared isolation component (6) covers the outside of the infrared transmitting head (31); and An adjusting component (4) for adjusting the infrared receiving head (22) to be close to or far from the infrared transmitting head (31). The top end of the adjusting component (4) is connected to the support frame (12), and the bottom end of the adjusting component (4) is fixedly connected to the infrared detection board (21); The adjusting component (4) includes a sliding rod (41) slidably connected to the sliding through hole (141), and the detection component (2) is fixed to the bottom end of the sliding rod (41); A limiting component (5) for restricting the rotation of the sliding rod (41) is arranged on the sliding rod (41); The limiting component (5) includes a limiting block (51) fixed to one side of the sliding rod (41). A limiting groove (142) for clamping the limiting block (51) is formed on the side wall of the sliding through hole (141), and the limiting block (51) is slidably connected to the limiting groove (142); The infrared isolation component (6) includes an infrared isolation board (61) located at the bottom end of the infrared detection board (21) and an isolation frame (62) located at the bottom end of the infrared isolation board (61). The isolation frame (62) covers the outside of the infrared transmitting head (31).

2. The multi-infrared emitter circuit board testing device according to claim 1, wherein, A handle (42) for pushing and pulling the sliding rod (41) is arranged at the top end of the sliding rod (41).

3. The multi-infrared emitter circuit board testing device according to claim 2, wherein The length of the limiting block (51) is equal to the length of the sliding rod (41).

4. The multi-infrared emitter circuit board testing device according to claim 1, characterized in that, A limiting boss (111) is arranged on the support base (11), and a card slot (32) capable of being clamped to the limiting boss (111) is formed on the circuit board (3) to be detected.

5. The multi-infrared emitter circuit board testing device according to claim 4, wherein The number of the limiting bosses (111) is at least two and they are arranged oppositely, and the number and positions of the card slots (32) correspond to those of the limiting bosses (111).

6. The multi-infrared emitter circuit board testing device according to claim 2, wherein, The detection component (2) further includes a detection mounting table (23). The detection mounting table (23) is fixed to the bottom end of the sliding rod (41), and the infrared detection board (21) is located at the bottom end of the detection mounting table (23).

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