A circuit board structure

Abstract

The application relates to the technical field of electronic equipment, in particular to a circuit board structure. The circuit board structure comprises at least one group of circuit components; the circuit components comprise a first circuit board, a second circuit board and a first connecting plate arranged between the first circuit board and the second circuit board and used for connecting the first circuit board and the second circuit board; the first connecting plate comprises a first electrode layer, a second electrode layer and a conversion layer arranged between the first electrode layer and the second electrode layer, wherein the conversion layer can be flexibly and rigidly converted under the action of the first electrode layer and the second electrode layer. The circuit board structure in the application can be bent between the first circuit board and the second circuit board, so that the technical problems in the background art are solved.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and in particular to a circuit board structure. Background Technology

[0002] In existing technologies, connecting two or more circuit boards together typically involves integrating the two or more circuit boards and a flexible circuit board into a single unit, i.e., creating a rigid-flex circuit board. This results in a simple and compact interconnection structure with good installation characteristics. However, with this connection method, the ends of the entire circuit board generally cannot be bent, making it prone to damage. Summary of the Invention

[0003] The present invention provides a circuit board structure in which the first circuit board and the second circuit board can be bent to solve the above-mentioned technical problems.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a circuit board structure comprising:

[0005] At least one set of circuit components;

[0006] The circuit assembly includes a first circuit board, a second circuit board, and a first connecting board disposed between the first circuit board and the second circuit board for connecting the first circuit board and the second circuit board.

[0007] The first connecting plate includes a first electrode layer, a second electrode layer, and a conversion layer disposed between the first electrode layer and the second electrode layer, wherein the conversion layer is capable of switching between flexibility and rigidity under the action of the first electrode layer and the second electrode layer.

[0008] The circuit board structure in this application includes a first circuit board, a second circuit board, and a first connecting board that are interconnected. The conversion layer in the first connecting board can be converted between flexibility and rigidity under the action of the first electrode layer and the second electrode layer. This allows a certain angle to be generated between the first circuit board and the second circuit board in the circuit assembly, so that it can be better adapted to a specific environment when bending is required, and its stability can be guaranteed after bending.

[0009] Furthermore, the conversion layer is provided with connecting lines for connecting the first circuit board and the second circuit board.

[0010] Furthermore, the first circuit board has a first connection port on the side facing the second circuit board, and the second circuit board has a second connection port on the side facing the first circuit board;

[0011] The conversion layer includes a conversion portion located between the first electrode layer and the second electrode layer, and a first connection portion and a second connection portion located outside the first electrode layer and the second electrode layer. The first connection portion and the second connection portion are respectively used to connect to the first connection port and the second connection port.

[0012] Furthermore, the first circuit board, the second circuit board, and the first connecting board are integrally formed.

[0013] Furthermore, the first circuit board includes a substrate, a first connection line is provided on one side of the substrate, and a second connection line is provided on the other side of the substrate, with the first connection line and the second connection line being arranged opposite to each other;

[0014] The width of the second connecting line is greater than the width of the first connecting line.

[0015] Furthermore, the upper end of the first circuit board is provided with a first inductor element, and the lower end of the first circuit board is provided with a second inductor element. The first inductor element includes a first connecting line, which includes a first connecting line and a tail connecting line, and a multi-terminal connecting line disposed between the first connecting line and the tail connecting line. The second inductor element includes a spiral second connecting line, and at least a portion of the second connecting line is perpendicularly aligned with the first connecting line.

[0016] Furthermore, the circuit assembly also includes a third circuit board and a second connecting board for connecting the second circuit board.

[0017] Furthermore, the first circuit board and the second circuit board are in the same plane.

[0018] Furthermore, the first electrode layer includes a plurality of conversion units, which are insulated from each other.

[0019] Furthermore, the first opening and the opening have the same opening direction. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a circuit board structure provided in an embodiment of the present invention;

[0021] Figure 2 This is a side view of the first circuit board in a circuit board structure provided in an embodiment of the present invention;

[0022] Figure 3 This is a top view of the first connecting plate in a circuit board structure provided in an embodiment of the present invention.

[0023] Figure label:

[0024] 10-First circuit board; 11-First connector; 12-First wiring; 13-Second wiring; 20-Second circuit board; 21-Second connector; 30-First connector plate; 31-First electrode layer; 32-Second electrode layer; 33-Conversion layer; 34-Conversion unit; 35-First connector; 36-Second connector. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] The present invention provides a circuit board structure in which the first circuit board and the second circuit board can be bent to solve the above-mentioned technical problems.

[0027] See Figure 1-3 As shown, a circuit board structure includes:

[0028] At least one set of circuit components;

[0029] The circuit assembly includes a first circuit board 10, a second circuit board 20, and a first connecting plate 30 disposed between the first circuit board 10 and the second circuit board 20 for connecting the first circuit board 10 and the second circuit board 20.

[0030] The first connecting plate 30 includes a first electrode layer 31, a second electrode layer 32, and a conversion layer 33 disposed between the first electrode layer 31 and the second electrode layer 32. The conversion layer 33 is capable of converting between flexibility and rigidity under the action of the first electrode layer 31 and the second electrode layer 32.

[0031] The circuit board structure in this application includes a first circuit board 10, a second circuit board 20, and a first connecting plate 30 that are interconnected. The conversion layer 33 in the first connecting plate 30 can be converted between flexibility and rigidity under the action of the first electrode layer 31 and the second electrode layer 32. This allows a certain angle to be generated between the first circuit board 10 and the second circuit board 20 in the circuit assembly, so that it can be better adapted to specific environments when bending is required, and its stability can be guaranteed after bending.

[0032] It should be noted that the material of the conversion layer 33 is an electrically variable material.

[0033] Alternatively, the conversion layer 33 may include connecting lines for connecting the first circuit board 10 and the second circuit board 20. The connecting lines allow the first circuit board 10 and the second circuit board 20 to be connected, and the connecting lines are bent or curved within the conversion layer 33 to ensure a stable connection between the connecting lines and the first circuit board 10 and the second circuit board 20 when the conversion layer 33 is bent.

[0034] As an alternative, the first circuit board 10 has a first connection port 11 on the side facing the second circuit board 20, and the second circuit board 20 has a second connection port 21 on the side facing the first circuit board 10;

[0035] The conversion layer 33 includes a conversion portion located between the first electrode layer 31 and the second electrode layer 32, and a first connecting portion 35 and a second connecting portion 36 located outside the first electrode layer 31 and the second electrode layer 32. The first connecting portion 35 and the second connecting portion 36 are respectively used to connect to the first connecting port 11 and the second connecting port 21. Specifically, the size of the first connecting portion 35 and the second connecting portion 36 should be larger than the size of the first connecting port 11 and the second connecting port 21 to make the connection more stable. At the same time, it is not necessary to set the connector on the surface of the first circuit board 10 and the second circuit board 20. The connecting port is directly opened on the first circuit board 10 and the second circuit board 20, which reduces the thickness of the first circuit board 10 when connected to the second circuit board 20, thereby reducing the thickness of the product and facilitating the ultra-thin design of the product.

[0036] It should be noted that the opening directions of the first connection port 11 and the second connection port 21 are the same. That is, when the first connection port 11 extends along the length direction of the surface of the first circuit board 10 near the second circuit board 20, the second connection port 21 extends along the length direction of the surface of the second circuit board 20 near the first circuit board 10. When the first connection port 11 extends along the surface perpendicular to the surface of the first circuit board 10 near the second circuit board 20 and toward the side of the first circuit board 10 away from the second circuit board 20, the second connection port 21 is arranged on the second circuit board 20 in the same way (that is, the first connection port 11 and the second connection port 21 are arranged in a V-shape).

[0037] Alternatively, the first circuit board 10, the second circuit board 20, and the first connecting board 30 can be integrated into one unit. This integrated design is beneficial for the stable operation of the entire circuit assembly.

[0038] As an optional embodiment, the first circuit board 10 includes a substrate, with a first connection 12 disposed on one side of the substrate and a second connection 13 disposed on the other side of the substrate, the first connection 12 and the second connection 13 being disposed opposite to each other; wherein the width of the second connection 13 is greater than the width of the first connection 12. This reduces the manufacturing cost of the first connection 12 and the second connection 13; furthermore, the projection of the first connection 12 away from the horizontal plane is located within the projection of the second connection 13 on the horizontal plane, so as to ensure a high degree of overlap between the first connection 12 and the second connection 13, thereby reducing the manufacturing cost of the first connection 12 and the second connection 13.

[0039] As an alternative, the upper end of the first circuit board 10 is provided with a first inductor element, and the lower end of the first circuit board 10 is provided with a second inductor element. The first inductor element includes a first connecting line, which includes a first connecting line and a tail connecting line, and a multi-terminal connecting line disposed between the first connecting line and the tail connecting line. The second inductor element includes a spiral second connecting line, at least a portion of which is perpendicularly aligned with the first connecting line.

[0040] Alternatively, the circuit assembly may further include a third circuit board and a second connecting plate for connecting the second circuit board 20. The third circuit board has a third connection port, and the second circuit board 20 has another second connection port 21 on the side near the third circuit, so that the second connecting plate can connect the third circuit board and the second circuit board 20.

[0041] It should be noted that the circuit assembly may also include a fourth circuit board, a fifth circuit board, a sixth circuit board, and so on.

[0042] Alternatively, the first circuit board 10 and the second circuit board 20 may be in the same plane. When there is no included angle between the first circuit board 10 and the second circuit board 20, they have the same thickness.

[0043] Alternatively, the first electrode layer 31 may include a plurality of conversion units 34, which are insulated from each other. The arrangement of the conversion units 34 allows for better control over the bending of various parts of the conversion layer 33, resulting in higher precision in its adjustment and control.

[0044] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope of the invention. Therefore, if these modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.

Claims

1. A circuit board structure, characterized in that, include: At least one set of circuit components; The circuit assembly includes a first circuit board, a second circuit board, and a first connecting board disposed between the first circuit board and the second circuit board for connecting the first circuit board and the second circuit board, wherein the first circuit board and the second circuit board are placed horizontally side by side. The first connecting plate includes a first electrode layer, a second electrode layer, and a conversion layer disposed between the first electrode layer and the second electrode layer, wherein the conversion layer is capable of switching between flexibility and rigidity under the action of the first electrode layer and the second electrode layer; The conversion layer is made of an electrically variable material; The first circuit board has a first connection port on the side facing the second circuit board, and the second circuit board has a second connection port on the side facing the first circuit board. The conversion layer includes a conversion portion located between the first electrode layer and the second electrode layer, and a first connection portion and a second connection portion located outside the first electrode layer and the second electrode layer, wherein the first connection portion and the second connection portion are respectively used to connect to the first connection port and the second connection port; The conversion layer is provided with connecting lines for connecting the first circuit board and the second circuit board.

2. The circuit board structure according to claim 1, characterized in that, The first circuit board includes a substrate, a first connection line is provided on one side of the substrate, and a second connection line is provided on the other side of the substrate, with the first connection line and the second connection line being arranged opposite to each other; The width of the second connecting line is greater than the width of the first connecting line.

3. The circuit board structure according to claim 1, characterized in that, The first circuit board has a first inductor at its upper end and a second inductor at its lower end. The first inductor includes a first connecting line, which includes a first connecting line and a tail connecting line, as well as a multi-terminal connecting line disposed between the first connecting line and the tail connecting line. The second inductor includes a spiral second connecting line, at least a portion of which is perpendicularly aligned with the first connecting line.

4. The circuit board structure according to claim 1, characterized in that, The circuit assembly also includes a third circuit board and a second connecting board for connecting the second circuit board and the third circuit board.

5. The circuit board structure according to claim 1, characterized in that, The first electrode layer includes a plurality of conversion units, which are insulated from each other.

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