A lithography machine frame and a lithography machine

Abstract

The present invention provides a lithography machine frame and a lithography machine. The lithography machine frame includes a measurement support, a main substrate, a Y-direction interferometer support, and a connecting arm. An extension portion is formed on the lower bottom surface of the measurement support. The two side walls opposite to each other along the Y direction on the extension portion are respectively a first side wall and a second side wall. The bottom surfaces of the lower bottom surface of the measurement support on both sides of the extension portion along the Y direction are respectively a first lower bottom surface and a second lower bottom surface. A groove is formed on the main substrate, and the extension portion is located in the groove. Moreover, the measurement support is connected to the main substrate through the first lower bottom surface and the second lower bottom surface. The Y-direction interferometer support is fixedly connected to one end of the measurement support. The connecting arm is arranged in the main substrate. One end of the connecting arm is fixedly connected to the Y-direction interferometer support, and the other end is fixedly connected to the first side wall. The measurement support and the main substrate are connected in a T-shaped embedding manner, which improves the measurement accuracy of the interference measurement system, reduces the influence of the vibration transmission on the exposure imaging system, and effectively improves the stability of the whole machine system of the lithography machine.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor equipment manufacturing, and relates to a lithography machine frame and a lithography machine. Background Art

[0002] The current world is an information-based and intelligent world. With the rapid development of science and technology, various new intelligent products emerge in an endless stream, making people's lives more convenient. At the same time, people's requirements for the performance of displays are getting higher and higher, and the display screen technology is developing rapidly towards the directions of ultra-thin and low power consumption. The production and manufacturing of better-performing display screens are inseparable from advanced lithography processes, and a stable and highly accurate exposure imaging system is particularly important.

[0003] With the continuous development of lithography machine equipment and the continuous improvement of production efficiency, the size of the lithography machine glass substrate is continuously increasing, and the mass of the moving stage is continuously increasing. When the large-mass moving stage moves rapidly, inertial forces and reaction forces will be generated. Limited by the stiffness of the interfaces of its internal components, it will have a certain impact on the stability of the whole machine system, thus causing errors in the exposure imaging system and reducing the imaging accuracy. This more urgently requires designers to adopt more reasonable structural layouts and connection methods for multi-degree-of-freedom systems, so that the whole machine system can more effectively reduce the impact of external loads, reduce the influence of vibration transmission on the exposure imaging system, and effectively improve the modal of the whole machine and reduce the influence of static deformation on the exposure imaging system.

[0004] The prior art discloses a shock-absorbing frame for a lithography machine, which is used to reduce the vibration of the lithography machine frame. The advantage of this lithography machine shock-absorbing frame is that the masses of different components of the lithography machine are distributed at different positions of the shock-absorbing frame to reduce the reaction force of the motor. The disadvantage is that the stability of the internal frame of this structure is poor.

[0005] Another cast main substrate frame disclosed in the prior art is installed above the workpiece table. The top of the cast main substrate frame is a box structure, and many reinforcing ribs for enhancing the stiffness of the cast main substrate frame are provided inside. At the same time, damping foam is filled in the frame to improve the system stability. The advantages of this cast main substrate frame are that the structure is closed and will not cause pollution to the workpiece table. The disadvantages are that the mass of the main substrate is very large, the processing cost is high, the requirement for the supporting strength of the foundation is relatively high, and it causes difficulties in handling and transportation. Summary of the Invention

[0006] The purpose of the present invention is to provide a lithography machine frame and a lithography machine to improve the stability of the exposure system of the lithography machine.

[0007] To solve the above technical problems, the present invention provides a lithography machine frame, including a measurement bracket and a main substrate. A part of the lower bottom surface of the measurement bracket extends outward away from the lower bottom surface to form an extension part. The bottom surfaces of the lower bottom surface of the measurement bracket located on both sides of the extension part along the Y direction are respectively a first lower bottom surface and a second lower bottom surface;

[0008] A groove matching the extension part is formed on the upper end surface of the main substrate. The extension part is embedded in the groove, and the measurement bracket is connected to the main substrate through the first lower bottom surface and the second lower bottom surface;

[0009] The first lower bottom surface includes two connection areas spaced apart from each other for connecting with the main substrate. The second lower bottom surface includes two connection areas spaced apart from each other for connecting with the main substrate. The straight line where the connection line of the area centers of the two connection areas of the first lower bottom surface intersects with the straight line where the connection line of the area centers of the two connection areas of the second lower bottom surface presents a T-shaped distribution. The Y direction is the scanning direction of the lithography machine.

[0010] Preferably, the first lower bottom surface includes a third connection area and a fourth connection area, and the second lower bottom surface includes a first connection area and a second connection area;

[0011] Alternatively, the first lower bottom surface includes the first connection area and the second connection area, and the second lower bottom surface includes the third connection area and the fourth connection area;

[0012] Wherein, the first connection area and the second connection area are respectively located at both ends of the top of the T shape. The third connection area and the fourth connection area are both located at the bottom of the T shape. Both ends of the top of the T shape are respectively close to the corners of two opposite ends of the measurement bracket. The third connection area is located on the side of the fourth connection area away from the top of the T shape. The top of the T shape is the horizontal side of the T shape, and the bottom of the T shape is the vertical side of the T shape.

[0013] Preferably, a plurality of through holes are formed in each of the first connection area, the second connection area, the third connection area and the fourth connection area. Threaded holes are formed at positions on the main substrate corresponding to the through holes. The measurement bracket and the main substrate are connected by bolts.

[0014] Preferably, the plurality of through holes in the first connection area and the plurality of through holes in the second connection area are respectively distributed in their respective areas in a rectangular array manner;

[0015] The multiple through holes in the third connection region and the fourth connection region are respectively distributed in their respective regions in a circumferential array along the center of the region.

[0016] Preferably, the multiple through holes in the first connection region and the multiple through holes in the second connection region are symmetrically distributed with respect to a symmetry plane of the measurement bracket that is perpendicular to the second bottom surface;

[0017] The center of the third connection region and the center of the fourth connection region are located on the symmetry plane.

[0018] Preferably, the ratio range of L1 / L2 is 1:3 to 1:5, and the ratio range of L2 / L3 is 1:1 to 3:1;

[0019] Wherein, L1 is the distance between the center of the third connection region and the center of the fourth connection region, L2 is the distance from the center of the fourth connection region to the straight line where the centers of the first connection region and the second connection region are located, and L3 is the distance from the center of the first connection region to the symmetry plane.

[0020] Preferably, positioning pins are respectively arranged in the first connection region and the second connection region;

[0021] Positioning pins are respectively arranged in the third connection region and the fourth connection region;

[0022] Positioning holes that respectively match the positioning pins in the first connection region, the second connection region, the third connection region and the fourth connection region are further arranged on the main substrate.

[0023] Preferably, the multiple through holes in the first connection region and the multiple through holes in the second connection region are symmetrically distributed with respect to a symmetry plane of the measurement bracket that is perpendicular to the second bottom surface;

[0024] The positioning pins in the first connection region and the positioning pins in the second connection region are symmetrically distributed with respect to the symmetry plane;

[0025] The center of the third connection region and the center of the fourth connection region are located on the symmetry plane.

[0026] Preferably, the shapes, sizes and distributions of the multiple through holes in the third connection region are the same as those of the multiple through holes in the fourth connection region.

[0027] Preferably, the extending direction of the extending portion is perpendicular to the first bottom surface.

[0028] Preferably, the measurement bracket is detachably or non-detachably connected to the main substrate.

[0029] Preferably, it further includes a Y-direction interferometer bracket and a connecting arm. The two side walls opposite to each other along the Y-direction on the extending portion are respectively a first side wall and a second side wall;

[0030] The Y-direction interferometer bracket is fixedly connected to one end of the measurement bracket close to the first bottom surface. The connecting arm is arranged in the main substrate. One end of the connecting arm is fixedly connected to the Y-direction interferometer bracket, and the other end is fixedly connected to the first side wall.

[0031] Preferably, the connecting arm is also fixedly connected to the first bottom surface.

[0032] The present invention also provides a lithography machine, including the above-mentioned lithography machine frame.

[0033] Compared with the prior art, the present invention provides a lithography machine frame and a lithography machine. The lithography machine frame includes a measurement bracket and a main substrate. A part of the bottom surface of the measurement bracket extends outward away from the bottom surface to form an extending portion. The bottom surfaces of the bottom surface of the measurement bracket on both sides of the extending portion along the Y-direction are respectively a first bottom surface and a second bottom surface. A groove matching the extending portion is provided on the upper end surface of the main substrate. The extending portion is embedded in the groove, and the measurement bracket is connected to the main substrate through the first bottom surface and the second bottom surface. The first bottom surface includes two connecting areas spaced apart from each other for connecting to the main substrate. The second bottom surface includes two connecting areas spaced apart from each other for connecting to the main substrate. The straight line where the connection line of the center of the two connection areas of the first bottom surface is located intersects with the straight line where the connection line of the center of the two connection areas of the second bottom surface to form a T-shaped distribution. By setting the measurement bracket and the main substrate to be connected in a T-shaped embedding manner, the measurement accuracy of the interference measurement system is improved. It enables the whole machine system of the lithography machine to effectively reduce the impact of external loads, reduce the influence of vibration transmission on the exposure imaging system, improve the stability of the exposure system of the lithography machine, and thus can effectively improve the static, modal and dynamic response indexes of the whole machine system of the lithography machine.

[0034] Furthermore, a connecting arm is added between the measurement bracket and the Y-direction interferometer bracket, increasing the connection area between the Y-direction interferometer bracket and the measurement bracket, which can effectively reduce the influence of the vertical deformation of the Y-direction interferometer bracket due to gravity on the measurement accuracy, and further improve the measurement accuracy of the interference measurement system.

[0035] The lithography machine provided by the present invention adopts the above lithography machine frame, optimizes the connection structure of the exposure imaging system of the lithography machine, enables the whole machine system of the lithography machine to effectively reduce the impact of external loads, improves the stability of the exposure system of the lithography machine, and thus can effectively improve the static, modal and dynamic response indexes of the whole machine system of the lithography machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 FIG. 6 is a schematic structural diagram of a lithography machine frame provided in Embodiment 1 of the present invention;

[0037] Figure 2 FIG. 7 is a schematic structural diagram of a measurement bracket provided in Embodiment 1 of the present invention;

[0038] Figure 3 is Figure 2 a partial enlarged view at C in FIG. 7;

[0039] Figure 4 is Figure 2 a partial enlarged view at D in FIG. 7;

[0040] Figure 5 is Figure 2 a partial enlarged view at A in FIG. 7;

[0041] Figure 6 is Figure 2 a partial enlarged view at B in FIG. 7;

[0042] Figure 7 FIG. 8 is a schematic diagram of the first-order mode of a simulation model of a lithography machine in an actual application provided in Embodiment 1 of the present invention;

[0043] Figure 8 FIG. 9 is a schematic diagram of the second-order mode of a simulation model of a lithography machine in an actual application provided in Embodiment 1 of the present invention;

[0044] Figure 9 FIG. 10 is a schematic diagram of the third-order mode of a simulation model of a lithography machine in an actual application provided in Embodiment 1 of the present invention;

[0045] Figure 10 FIG. 11 is a schematic connection diagram of a Y-direction interferometer bracket and a measurement bracket provided in Embodiment 2 of the present invention;

[0046] Wherein, 10 - measurement bracket; 11 - main substrate; 12 - Y-direction interferometer bracket; 13 - connecting arm; 14 - extension part; 15 - first connection area; 16 - second connection area; 17 - third connection area; 18 - fourth connection area; 19 - projection objective; 20 - mask stage bracket; 21 - hanging frame bracket; 22 - hanging frame; 23 - workpiece stage; 24 - through hole; 25 - positioning pin. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0047] The following further elaborates on a lithography machine frame and a lithography machine proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. According to the claims and the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the embodiments of the present invention. The same or similar reference numerals in the drawings represent the same or similar components.

[0048] Embodiment 1

[0049] Figure 1 is a schematic structural diagram of a lithography machine frame provided by Embodiment 1 of the present invention. Figure 2 is a schematic structural diagram of a measurement bracket 10 provided by Embodiment 1 of the present invention. Please refer to Figure 1 and Figure 2 , a lithography machine frame includes a measurement bracket 10 and a main substrate 11. A part of the lower bottom surface of the measurement bracket 10 extends outward in a direction away from the lower bottom surface to form an extension part 14. The bottom surfaces of the measurement bracket 10 along the Y direction on both sides of the extension part 14 are respectively a first lower bottom surface and a second lower bottom surface.

[0050] An upper end surface of the main substrate 11 is provided with a groove matching the extension part 14. The extension part 14 is embedded in the groove, and the measurement bracket 10 is connected to the main substrate 11 through the first lower bottom surface and the second lower bottom surface.

[0051] The first lower bottom surface includes two connection areas spaced apart from each other for connecting to the main substrate 11. The second lower bottom surface includes two connection areas spaced apart from each other for connecting to the main substrate 11. A straight line where the connection line of the regional centers of the two connection areas on the first lower bottom surface intersects with a straight line where the connection line of the regional centers of the two connection areas on the second lower bottom surface presents a T-shaped distribution. The Y direction is the scanning direction of the lithography machine. Figure 2 The direction indicated by the arrow in

[0052] is the positive Y direction. By setting the measurement bracket 10 and the main substrate 11 in a T-shaped embedded connection manner, the measurement accuracy of the interference measurement system is improved. The entire lithography machine system can effectively reduce the impact of external loads, reduce the influence of vibration transmission on the exposure imaging system, improve the stability of the exposure system of the lithography machine, and thus effectively improve the static, modal, and dynamic response indexes of the entire lithography machine system.

[0053] Furthermore, the first lower bottom surface includes a third connection area 17 and a fourth connection area 18, and the second lower bottom surface includes a first connection area 15 and a second connection area 16.

[0054] Alternatively, the first lower bottom surface includes the first connection region 15 and the second connection region 16, and the second lower bottom surface includes the third connection region 17 and the fourth connection region 18;

[0055] Wherein, the first connection region 15 and the second connection region 16 are respectively located at two ends of the top of the T-shape, the third connection region 17 and the fourth connection region 18 are both located at the bottom of the T-shape, and two ends of the top of the T-shape are respectively close to the corners of two opposite ends on the measurement bracket 10. The third connection region 17 is located on a side of the fourth connection region 18 away from the top of the T-shape. The top of the T-shape is the horizontal side of the T-shape, and the bottom of the T-shape is the vertical side of the T-shape.

[0056] Furthermore, a plurality of through holes 24 are provided in each of the first connection region 15, the second connection region 16, the third connection region 17, and the fourth connection region 18. Threaded holes are provided at positions on the main substrate 11 corresponding to the through holes 24. The measurement bracket 10 and the main substrate 11 are connected by bolts.

[0057] Figure 3 Yes Figure 2 Partial enlarged view at C in Figure 4 Yes Figure 2 Partial enlarged view at D in , please refer to Figure 3 and Figure 4 Furthermore, the plurality of through holes 24 in the first connection region 15 and the plurality of through holes 24 in the second connection region 16 are respectively distributed in their respective regions in a rectangular array manner;

[0058] Figure 5 Yes Figure 2 Partial enlarged view at A in Figure 6 Yes Figure 2 Partial enlarged view at B in , please refer to Figure 5 and Figure 6 The plurality of through holes 24 in the third connection region 17 and the fourth connection region 18 are respectively distributed in their respective regions in a circumferential array manner along the center of their regions.

[0059] Furthermore, the plurality of through holes 24 in the first connection region 15 and the plurality of through holes 24 in the second connection region 16 are symmetrically distributed with respect to a symmetry plane of the measurement bracket 10 perpendicular to the second lower bottom surface;

[0060] The center of the region of the third connection region 17 and the center of the region of the fourth connection region 18 are located on the symmetry plane.

[0061] Furthermore, the ratio range of L1 / L2 is 1:3 to 1:5, and the ratio range of L2 / L3 is 1:1 to 3:1;

[0062] Wherein, L1 is the distance between the regional center of the third connection area 17 and the regional center of the fourth connection area 18, L2 is the distance from the regional center of the fourth connection area 18 to the straight line where the regional centers of the first connection area 15 and the second connection area 16 are located, and L3 is the distance from the regional center of the first connection area 15 to the symmetry plane.

[0063] Furthermore, positioning pins 25 are respectively arranged in the first connection area 15 and the second connection area 16;

[0064] Positioning pins 25 are respectively arranged in the third connection area 17 and the fourth connection area 18;

[0065] Positioning holes matching the positioning pins 25 in the first connection area 15, the second connection area 16, the third connection area 17 and the fourth connection area 18 are further arranged on the main substrate 11. The positioning pins 25 and the corresponding positioning holes realize the positioning between the measuring bracket 10 and the main substrate 11, improving the assembly efficiency.

[0066] Furthermore, the multiple through holes 24 in the first connection area 15 and the multiple through holes 24 in the second connection area 16 are symmetrically distributed about a symmetry plane perpendicular to the second bottom surface of the measuring bracket 10;

[0067] The positioning pins 25 in the first connection area 15 and the positioning pins 25 in the second connection area 16 are symmetrically distributed about the symmetry plane;

[0068] The regional center of the third connection area 17 and the regional center of the fourth connection area 18 are located on the symmetry plane. To ensure that the measuring bracket 10 is evenly stressed, avoid uneven local stress, and improve its service life.

[0069] Furthermore, the shapes, sizes, and distributions of the multiple through-holes 24 within the third connection region 17 are consistent with those of the multiple through-holes 24 within the fourth connection region 18. It should be realized that such a limitation is only used to illustrate the relationship between the shapes, sizes, and distributions of the multiple through-holes 24 within the third connection region 17 and those of the multiple through-holes 24 within the fourth connection region 18. The shapes, sizes, and distributions of the multiple through-holes 24 within the third connection region 17 and those of the multiple through-holes 24 within the fourth connection region 18 can be specifically set according to requirements. The distribution mentioned here refers to the distribution status of each through-hole 24 relative to the regional center of the connection region where it is located.

[0070] Furthermore, the extending direction of the extension portion 14 is perpendicular to the first lower bottom surface. It should be realized that such a limitation is only used to illustrate the extending direction of the extension portion 14. The extending direction of the extension portion 14 may not be perpendicular to the first lower bottom surface either. For example, the extending direction of the extension portion 14 forms an 80-degree angle with the first lower bottom surface.

[0071] Furthermore, the measuring bracket 10 is detachably or non-detachably connected to the main substrate 11. The connection manner between the measuring bracket 10 and the main substrate 11 can adopt a detachable connection, such as the aforementioned bolt connection, or can also adopt a non-detachable connection method for connection, such as welding.

[0072] Furthermore, the lithography machine frame further includes a mask table bracket 2020, a hanging frame bracket 21, a hanging frame 22, and a workpiece table 23. The mask table bracket 2020 is fixed on the main substrate 11, and the mask table bracket 2020 is used to carry the mask table. The hanging frame bracket 21 is connected to the lower part of the main substrate 11. The hanging frame 22 is connected to two relatively arranged inner sidewalls of the hanging frame bracket 21, and the workpiece table 23 is fixed on the hanging frame 22.

[0073] In a lithography machine frame in an actual application of this embodiment, the multiple through-holes 24 within the first connection region 15 and the multiple through-holes 24 within the second connection region 16 are symmetrically distributed with respect to a symmetry plane of the measuring bracket 10 that is perpendicular to the second lower bottom surface;

[0074] The regional center of the third connection region 17 and the regional center of the fourth connection region 18 are located on the symmetry plane.

[0075] Furthermore, L1 / L2 = 1:4, L2 / L3 = 2:1;

[0076] Further, the plurality of through holes 24 in the first connection area 15 and the plurality of through holes 24 in the second connection area 16 are respectively distributed in their respective areas in the form of a rectangular array of 3 rows and 6 columns, wherein the row direction is perpendicular to the symmetry plane. The rows are arranged in parallel with equal row spacing, the columns are arranged in parallel, and the column spacing between two columns close to the center of the area is smaller than the column spacing between the two columns and the adjacent columns. It should be appreciated that such a definition is only used to illustrate the distribution of the plurality of through holes 24 in the first connection area 15 and the plurality of through holes 24 in the second connection area 16 on the second bottom surface. The plurality of through holes 24 in the first connection area 15 and the plurality of through holes 24 in the second connection area 16 are not necessarily limited to a rectangular array arrangement, and their specific distribution can be set according to requirements.

[0077] Figure 7 is a schematic diagram of a first-order mode of a simulation model of a photolithography machine in a practical application provided by the first embodiment of the present invention, Figure 8 is a schematic diagram of a second-order mode of a simulation model of a photolithography machine in a practical application provided by the first embodiment of the present invention, Figure 9 This is a schematic diagram of the third-order mode of a simulation model of a photolithography machine in practical application provided by the first embodiment of the present invention. Please refer to Figure 7 , Figure 8 and Figure 9 ,in, Figure 8 The first-order modal frequency of the lithography machine is 7.760e+001Hz. Figure 9 The second-order modal frequency of the lithography machine is 8.088e+001Hz. Figure 9 The third-order modal frequency of the lithography machine is 9.056e+001Hz. Table 1 is a static and PSD (Power Spetrum Density, power spectrum density of random vibration signal) simulation analysis data table of a lithography machine in a practical application provided by the second embodiment of the present invention. Please refer to Table 1.

[0078] Table 1 Static force and PSD simulation analysis data of lithography machine

[0079]

[0080] In Table 1, the difference point is a point on the photolithography machine component corresponding to the left column of the difference position, the response point is a point on the photolithography machine component corresponding to the right column of the difference position, the data in the difference point and the response point are the numbers of the points on the corresponding photolithography machine components, and the vector difference between the displacement vector of the difference point in the thermal simulation and the displacement vector of the response point in the thermal simulation is It can be decomposed into three vectors respectively along the X, Y, and Z axes of the lithography machine coordinate system, and the coordinate values of the three vectors are the x, y, and z coordinates corresponding to the thermal deformation on the horizontal axis in Table 1;

[0081] The vector difference between the displacement vector of the acting point in the static simulation and the displacement vector of the response point in the static simulation It can be decomposed into three vectors respectively along the X, Y, and Z axes of the lithography machine coordinate system, and the coordinate values of the three vectors are the x, y, and z coordinates corresponding to the static deformation on the horizontal axis in Table 1;

[0082] The vector difference between the displacement vector of the acting point under the combination of static simulation and thermal simulation and the displacement vector of the response point under the combination of static simulation and thermal simulation can be decomposed into three vectors respectively along the X, Y, and Z axes of the lithography machine coordinate system, and the coordinate values of the three vectors are the x, y, and z coordinates corresponding to the comprehensive item on the horizontal axis in Table 1, where the vector difference between the displacement vector of the acting point under the combination of static simulation and thermal simulation and the displacement vector of the response point under the combination of static simulation and thermal simulation is the vector difference And the vector difference Of the vector sum;

[0083] The index values of the thermal deformation and static deformation items on the horizontal axis of Table 1 are used to evaluate the data in the comprehensive item to determine whether it meets the standard. The dynamic response on the horizontal axis of Table 1 is 15 - 500 Hz, indicating that the PSD simulation performs dynamic response measurement in the frequency range of 15 - 500 Hz. The vector difference between the displacement vector of the acting point in the PSD simulation and the displacement vector of the response point in the PSD simulation can be decomposed into three vectors respectively along the X, Y, and Z axes of the lithography machine coordinate system, and the coordinate values of the three vectors are the x, y, and z coordinates corresponding to the dynamic response of 15 - 500 Hz on the horizontal axis in Table 1; The index values on the horizontal axis of Table 1 including the dynamic response are used to evaluate the data in the PSD simulation;

[0084] Among them, H is the XOY coordinate plane direction of the lithography machine coordinate system, both Z and V are in the Z direction of the lithography machine coordinate system, the PV value is the response value, and the PV value is used for separate comparison with the corresponding x, y, or z for evaluation. PO1 and PO2 are the right objective lens and the left objective lens of the projection objective lens 19 of the lithography machine respectively. Ifrs is the mask stage interferometer, ifps is the workpiece stage 23 interferometer, PA1 and PA2 are the right off-axis alignment structure and the left off-axis alignment structure of the lithography machine respectively, FLS1 and FLS2 are the right focus and leveling structure and the left focus and leveling structure of the lithography machine respectively, PS is the moving stage. The data at the subtraction point and the response point are respectively a point on the lithography machine component corresponding to the left column at the subtraction position and a point on the lithography machine component corresponding to the right column at the subtraction position. A single number in the data of the subtraction point and the response point, such as 1 or 6, etc., represents a point corresponding to the digital serial number, and 13 - 17 represents a point between the digital serial number 13 and the digital serial number 17.

[0085] The subtraction position is usually selected on the components that are concerned and most representative in the structural design of the lithography machine. Since the relevant vectors involved in the simulation can be decomposed into vectors along the X, Y, and Z axes of the lithography machine coordinate system, and the PV value is used for separate comparison with the corresponding x, y, or z, the coordinate values not marked in Table 1 can be understood as data not concerned in the simulation and will not affect the simulation evaluation.

[0086] Embodiment 2

[0087] Figure 10 It is a schematic connection diagram of the Y - direction interferometer support 12 and the measurement support 10 provided by Embodiment 2 of the present invention. Please refer to Figure 10 The difference from Embodiment 1 is that: the lithography machine frame further includes a Y - direction interferometer support 12 and a connecting arm 13. The two side walls opposite to each other along the Y - direction on the extension part 14 are respectively the first side wall and the second side wall;

[0088] The Y - direction interferometer support 12 is fixedly connected to one end of the measurement support 10 close to the first bottom surface. The connecting arm 13 is arranged in the main substrate 11. One end of the connecting arm 13 is fixedly connected to the Y - direction interferometer support 12, and the other end is fixedly connected to the first side wall.

[0089] By adding a connecting arm 13 between the measurement support 10 and the Y - direction interferometer support 12 on the basis of the structure of the lithography machine frame provided in Embodiment 1, the connection area between the Y - direction interferometer support 12 and the measurement support 10 is increased, which can effectively reduce the influence of the vertical deformation of the Y - direction interferometer support 12 caused by gravity on the measurement accuracy, and improve the measurement accuracy of the interference measurement system.

[0090] Further, the connecting arm 13 is also fixedly connected to the first bottom surface. This further increases the connection area between the Y-direction interferometer support 12 and the measurement support 10, and can effectively reduce the influence of the vertical deformation of the Y-direction interferometer support 12 caused by gravity on the measurement accuracy, thereby further improving the measurement accuracy of the interference measurement system.

[0091] Embodiment III

[0092] The present invention also provides a lithography machine, including the above-mentioned lithography machine frame. By optimizing the connection structure of the exposure imaging system of the lithography machine, the overall system of the lithography machine can effectively reduce the impact of external loads, improve the stability of the exposure system of the lithography machine, and thus effectively improve the static, modal and dynamic response indexes of the overall system of the lithography machine.

[0093] In summary, the present invention provides a lithography machine frame and a lithography machine. The lithography machine frame includes a measurement support and a main substrate. A part of the bottom surface of the measurement support extends outward in a direction away from the bottom surface to form an extension part. The bottom surfaces of the measurement support along the Y direction on both sides of the extension part are respectively the first bottom surface and the second bottom surface. A groove matching the extension part is provided on the upper end surface of the main substrate, and the extension part is embedded in the groove. The measurement support is connected to the main substrate through the first bottom surface and the second bottom surface. The first bottom surface includes two connection areas spaced apart from each other for connecting to the main substrate, and the second bottom surface includes two connection areas spaced apart from each other for connecting to the main substrate. The straight line connecting the centers of the two connection areas of the first bottom surface intersects with the straight line connecting the centers of the two connection areas of the second bottom surface in a T-shaped distribution. By setting the measurement support and the main substrate in a T-shaped embedded connection manner, the measurement accuracy of the interference measurement system is improved. The overall system of the lithography machine can effectively reduce the impact of external loads, reduce the influence of vibration transmission on the exposure imaging system, improve the stability of the exposure system of the lithography machine, and thus effectively improve the static, modal and dynamic response indexes of the overall system of the lithography machine.

[0094] Further, a connecting arm is added between the measurement support and the Y-direction interferometer support, increasing the connection area between the Y-direction interferometer support and the measurement support, and can effectively reduce the influence of the vertical deformation of the Y-direction interferometer support caused by gravity on the measurement accuracy, thereby further improving the measurement accuracy of the interference measurement system.

[0095] The lithography machine adopting the above lithography machine frame provided by the present invention optimizes the connection structure of the exposure imaging system of the lithography machine, enabling the whole machine system of the lithography machine to effectively reduce the impact of external loads, improving the stability of the exposure system of the lithography machine, and thus effectively improving the static, modal and dynamic response indexes of the whole machine system of the lithography machine.

[0096] It should be noted that the embodiments in this specification are described in a progressive manner. The key point of each embodiment is the difference from other embodiments. The same and similar parts among the embodiments can be referred to each other.

[0097] The above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention in any way. Any changes and modifications made by those of ordinary skill in the field of the present invention according to the above disclosure shall fall within the protection scope of the claims.

Claims

1. A lithography machine frame, characterized in that, It includes a measuring bracket and a main substrate. A part of the lower bottom surface of the measuring bracket extends outward in a direction away from the lower bottom surface to form an extension part. The bottom surfaces of the lower bottom surface of the measuring bracket located on both sides of the extension part along the Y direction are the first lower bottom surface and the second lower bottom surface respectively; A groove matching the extension part is provided on the upper end surface of the main substrate. The extension part is embedded in the groove, and the measuring bracket is connected to the main substrate through the first lower bottom surface and the second lower bottom surface; The first lower bottom surface includes two connection areas arranged at intervals for connecting with the main substrate. The second lower bottom surface includes two connection areas arranged at intervals for connecting with the main substrate. The straight line where the connection line of the regional centers of the two connection areas of the first lower bottom surface is located intersects with the straight line where the connection line of the regional centers of the two connection areas of the second lower bottom surface to present a T-shaped distribution. The Y direction is the scanning direction of the lithography machine.

2. The lithography machine frame according to claim 1, characterized in that, The first lower bottom surface includes a third connection area and a fourth connection area. The second lower bottom surface includes a first connection area and a second connection area; Alternatively, the first lower bottom surface includes the first connection area and the second connection area, and the second lower bottom surface includes the third connection area and the fourth connection area; Wherein, the first connection area and the second connection area are respectively located at both ends of the top of the T shape. The third connection area and the fourth connection area are both located at the bottom of the T shape. And both ends of the top of the T shape are respectively close to the corners of two opposite ends of the measuring bracket. The third connection area is located on one side of the fourth connection area away from the top of the T shape. The top of the T shape is the horizontal side of the T shape, and the bottom of the T shape is the vertical side of the T shape.

3. The lithography machine frame according to claim 2, characterized in that, A plurality of through holes are provided in each of the first connection area, the second connection area, the third connection area and the fourth connection area. Threaded holes are provided at positions on the main substrate corresponding to the through holes. The measuring bracket and the main substrate are connected by bolts.

4. The lithography machine frame according to claim 3, characterized in that, The plurality of through holes in the first connection area and the plurality of through holes in the second connection area are respectively distributed in their respective areas in a rectangular array manner; The plurality of through holes in the third connection area and the fourth connection area are respectively distributed in their respective areas in a circumferential array manner along the center of their areas.

5. The lithography machine frame according to claim 4, characterized in that, The plurality of through holes in the first connection area and the plurality of through holes in the second connection area are symmetrically distributed with respect to a symmetry plane of the measuring bracket perpendicular to the second lower bottom surface; The center of the third connection area and the center of the fourth connection area are located on the symmetry plane.

6. The lithography machine frame according to claim 5, characterized in that, The ratio range of L1 / L2 is 1:3 to 1:5, and the ratio range of L2 / L3 is 1:1 to 3:1; Wherein, L1 is the distance between the regional center of the third connection region and the regional center of the fourth connection region, L2 is the distance from the regional center of the fourth connection region to the straight line where the regional centers of the first connection region and the second connection region are located, and L3 is the distance from the regional center of the first connection region to the symmetry plane.

7. The lithography machine frame according to claim 3, characterized in that, Positioning pins are respectively arranged in the first connection region and the second connection region; Positioning pins are respectively arranged in the third connection region and the fourth connection region; Positioning holes respectively matching the positioning pins in the first connection region, the second connection region, the third connection region and the fourth connection region are further arranged on the main substrate.

8. The lithography machine frame according to claim 7, characterized in that, The multiple through holes in the first connection region and the multiple through holes in the second connection region are symmetrically distributed with respect to a symmetry plane of the measuring bracket perpendicular to the second bottom surface; The positioning pins in the first connection region and the positioning pins in the second connection region are symmetrically distributed with respect to the symmetry plane; The regional center of the third connection region and the regional center of the fourth connection region are located on the symmetry plane.

9. The lithography machine frame according to claim 5 or 8, characterized in that, The shapes, sizes and distributions of the multiple through holes in the third connection region are the same as those of the multiple through holes in the fourth connection region.

10. The lithography machine frame according to claim 1, characterized in that, The extending direction of the extending portion is perpendicular to the first bottom surface.

11. The lithography machine frame according to claim 1, characterized in that, The measuring bracket is detachably or non-detachably connected to the main substrate.

12. The lithography machine frame according to claim 1, characterized in that, It further includes a Y-direction interferometer bracket and a connecting arm. The two side walls opposite to each other along the Y direction on the extending portion are respectively a first side wall and a second side wall; The Y-direction interferometer bracket is fixedly connected to one end of the measuring bracket close to the first bottom surface. The connecting arm is arranged in the main substrate. One end of the connecting arm is fixedly connected to the Y-direction interferometer bracket, and the other end is fixedly connected to the first side wall.

13. The lithography machine frame according to claim 12, characterized in that, The connecting arm is further fixedly connected to the first bottom surface.

14. A lithography machine, characterized in that, It includes a lithography machine frame according to any one of claims 1-13.

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