Substrate processing device and substrate transport method

Abstract

The present invention relates to a substrate processing device and a substrate transporting method. The first ID block (2) takes out a substrate (W) from a carrier (C) mounted on a mounting table (13), and transports the taken-out substrate (W) to any one of six processing layers (3A to 3F). In addition, the second ID block (4), for example, moves the substrate (W) transported from the processing layer (3A) back to the carrier (C) mounted on the mounting table (47). Thus, the first ID block (2) can transport more substrates (W) more quickly to the six processing layers (3A to 3F) arranged in the vertical direction. In addition, at the same time, the second ID block (4) can transport multiple substrates (W) transported from the six processing layers (3A to 3F) arranged in the vertical direction to the carrier (C) more quickly. As a result, the processing capacity of the substrate processing device (1) can be increased.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate and a method for conveying the substrate. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like. Background Art

[0002] Conventional substrate processing apparatuses include a loading block and a processing block (see, for example, Japanese Patent Laid-Open No. 2014-022570). The loading block includes: a carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and a substrate transfer robot for transferring a substrate between the carrier mounted on the carrier mounting table and the processing block. The processing block applies, for example, a resist solution to the substrate.

[0003] In addition, the substrate processing apparatus includes a storage device (carrier buffer device) (see, for example, Japanese Patent Laid-Open No. 2011-187796). The storage device is arranged to extend horizontally to the carrier mounting table side. The storage device includes a storage rack for storing carriers and a carrier transfer mechanism. Summary of the invention

[0004] [Problems to be solved by the invention]

[0005] However, in the case of a conventional substrate processing device having such a structure, there is the following problem. That is, the substrate transport process performed by the loading block of the substrate processing device includes a conveying process and a moving back process. The conveying process is a process of taking out a substrate from a carrier placed on a carrier stage and moving the taken-out substrate to a processing block. In addition, the moving back process is a process of receiving a substrate processed by the processing block from a processing block and moving the received substrate back to the carrier placed on the carrier stage. With respect to the conveying process, the moving back process may result in a reduction in the processing volume. In addition, with respect to the moving back process, the conveying process may result in a reduction in the processing volume.

[0006] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus and a substrate transfer method capable of improving the processing throughput.

[0007] [Technical means to solve the problem]

[0008] In order to achieve this purpose, the present invention adopts the following structure. That is, the substrate processing device for processing a substrate of the present invention includes the following elements: a first loading block, provided with a first carrier mounting table, the first carrier mounting table is used to mount a carrier capable of accommodating a plurality of substrates; a single processing block, connected to the first loading block, and having a plurality of processing layers arranged in the vertical direction; and a second loading block, connected to the single processing block, and provided with a second carrier mounting table for mounting the carrier; the first loading block takes out a substrate from the carrier mounted on the first carrier mounting table, and transports the taken-out substrate to any one of the plurality of processing layers, the plurality of processing layers respectively perform specific processing on the transported substrate, and transport the substrate to the second loading block, and the second loading block moves the substrate processed by the processing layer back to the carrier mounted on the second carrier mounting table.

[0009] According to the substrate processing device of the present invention, the first loading block takes out a substrate from a carrier mounted on the first carrier mounting table, and transports the taken-out substrate to any one of a plurality of processing layers. In addition, the second loading block moves the substrate transported from the processing layer back to the carrier mounted on the second carrier mounting table. Thus, the first loading block can more quickly transport a plurality of substrates to a plurality of processing layers arranged in the vertical direction. In addition, at the same time, the second loading block can more quickly transport a plurality of substrates transported from a plurality of processing layers arranged in the vertical direction to the carrier. As a result, the processing capacity of the substrate processing device can be increased.

[0010] In addition, in the substrate processing device, it is preferred that the first loading block takes out a substrate from the carrier mounted on the first carrier mounting table, and transfers the substrate to a first processing layer among the multiple processing layers, the first processing layer performs specific processing on the transferred substrate, and transfers the substrate to the second loading block, the second loading block transfers the transferred substrate to a second processing layer among the multiple processing layers, the second processing layer performs specific processing on the transferred substrate, and transfers the substrate to the first loading block, the first loading block transfers the transferred substrate to a third processing layer among the multiple processing layers, the third processing layer performs specific processing on the transferred substrate, and transfers the substrate to the second loading block, and the second loading block moves the substrate processed by the third processing layer back to the carrier mounted on the second carrier mounting table.

[0011] Each processing layer transports the substrate from the loading block as the substrate transport source to the loading block on the opposite side. The substrate loading unit used for substrate transport is arranged between the processing layer and the loading block. In the case of moving the substrate back to the loading block as the substrate transport source, the two substrate loading units, the substrate loading unit for transport and the substrate loading unit for return, must be arranged near one loading block. Therefore, the number of substrates W that can be loaded on each of the substrate loading unit for transport and the substrate loading unit for return is also limited. However, by transporting the substrate from the loading block as the substrate transport source to the loading block on the opposite side, the number of substrates that can be loaded on the substrate loading unit can be ensured. In addition, since the two loading blocks transport alternately, the two loading blocks can roughly equally share the substrate transport for placing and removing the substrate from the carrier and the substrate transport between layers.

[0012] In addition, in the substrate processing device, it is preferred that the first loading block takes out the substrate from the carrier mounted on the first carrier mounting table and transfers the substrate to the first processing layer among the multiple processing layers, the first processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block, the second loading block transfers the transferred substrate to the second processing layer among the multiple processing layers, the second processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block, and the second loading block moves the substrate processed by the second processing layer back to the carrier mounted on the second carrier mounting table.

[0013] In a configuration in which a specific process is sequentially performed on a substrate using the first processing layer and the second processing layer, two loading blocks can share the substrate transfer for loading and unloading substrates from a carrier and the substrate transfer between layers.

[0014] In addition, in the substrate processing device, the second loading block preferably transfers the substrate processed by the second processing layer and transferred to the third processing layer among the multiple processing layers, the third processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block, and the second loading block moves the substrate processed by the third processing layer back to the carrier placed on the second carrier loading table.

[0015] In a configuration in which a substrate is subjected to specific processing in sequence using the first processing layer, the second processing layer, and the third processing layer, two loading blocks can share the substrate transfer for loading and unloading substrates from a carrier and the substrate transfer between layers.

[0016] In addition, in the substrate processing device, it is preferred that the second loading block is further configured to carry in and out substrates for an external device, the second loading block carries out a substrate processed by the first processing layer to the external device, the second loading block carries in a substrate that has been subjected to a specific processing by the external device from the external device, and transports the carried-in substrate to the second processing layer among the multiple processing layers.

[0017] In a configuration in which a specific process is sequentially performed on a substrate using a first processing layer, a second processing layer, and an external device, two loading blocks can share the substrate transfer for loading and unloading a substrate with a carrier and the substrate transfer between layers.

[0018] In addition, in the substrate processing device, it is preferred that the first loading block takes out the substrate from the carrier mounted on the first carrier mounting table, and transfers the substrate to the first processing layer among the multiple processing layers, the first processing layer performs specific processing on the transferred substrate, and transfers the substrate to the first loading block, the first loading block transfers the transferred substrate to the second processing layer among the multiple processing layers, the second processing layer performs specific processing on the transferred substrate, and transfers the substrate to the second loading block, and the second loading block moves the substrate processed by the second processing layer back to the carrier mounted on the second carrier mounting table.

[0019] In a configuration in which a specific process is sequentially performed on a substrate using the first processing layer and the second processing layer, two loading blocks can share the substrate transfer for loading and unloading substrates from a carrier and the substrate transfer between layers.

[0020] In addition, in the substrate processing device, the second loading block preferably transfers the substrate processed by the second processing layer and transferred to the third processing layer among the multiple processing layers, the third processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block, and the second loading block moves the substrate processed by the third processing layer back to the carrier placed on the second carrier loading table.

[0021] In a configuration in which a substrate is subjected to specific processing in sequence using the first processing layer, the second processing layer, and the third processing layer, two loading blocks can equally share substrate transport for loading and unloading substrates from a carrier and substrate transport between layers.

[0022] In addition, in the substrate processing device, the second loading block is preferably further configured to carry in and out substrates for an external device, the second loading block carries out a substrate processed by the second processing layer to the external device, the second loading block carries in a substrate that has been subjected to a specific processing by the external device from the external device, and transports the carried-in substrate to a third processing layer among the multiple processing layers.

[0023] In a configuration in which a substrate is subjected to specific processing in sequence using a first processing layer, a second processing layer, a third processing layer, and an external device, two loading blocks can share substrate transport for loading and unloading substrates from a carrier and substrate transport between layers.

[0024] In addition, in the substrate processing device, it is preferred that the first loading block takes out a substrate from the carrier mounted on the first carrier mounting table, and transfers the substrate to a first processing layer among the multiple processing layers, the first processing layer performs a specific process on the transferred substrate, and transfers the substrate to the first loading block, the first loading block transfers the transferred substrate to a second processing layer among the multiple processing layers, the second processing layer performs a specific process on the transferred substrate, and transfers the substrate to the first loading block, the first loading block transfers the transferred substrate to a third processing layer among the multiple processing layers, the third processing layer performs a specific process on the transferred substrate, and transfers the substrate to the second loading block, and the second loading block moves the substrate processed by the third processing layer back to the carrier mounted on the second carrier mounting table.

[0025] In a configuration in which a substrate is subjected to specific processing in sequence using the first processing layer, the second processing layer, and the third processing layer, two loading blocks can share the substrate transfer for loading and unloading substrates from a carrier and the substrate transfer between layers.

[0026] In addition, in the substrate processing device, it is preferred that the second loading block is further configured to carry in and out a substrate for an external device, the second loading block takes out a substrate from the carrier mounted on the second carrier mounting table, and transports the substrate to a first processing layer among the multiple processing layers, the first processing layer performs a specific process on the transported substrate, and transports the substrate to the second loading block, the second loading block carries out the substrate processed by the first processing layer to the external device, the second loading block carries in a substrate that has been subjected to a specific process by the external device from the external device, and transports the carried-in substrate to a second processing layer among the multiple processing layers, the second processing layer performs a specific process on the transported substrate, and transports the substrate to the first loading block, and the first loading block moves the substrate processed by the second processing layer back to the carrier mounted on the first carrier mounting table.

[0027] In a configuration in which a specific process is sequentially performed on a substrate using a first processing layer, a second processing layer, and an external device, two loading blocks can share the substrate transfer for loading and unloading a substrate with a carrier and the substrate transfer between layers.

[0028] In addition, in the substrate processing device, it is preferred that the second loading block is further configured to carry in and out a substrate for an external device, the second loading block takes out a substrate from the carrier mounted on the second carrier mounting table, and transports the substrate to a first processing layer among the plurality of processing layers, the first processing layer performs a specific process on the transported substrate, and transports the substrate to the first loading block, the first loading block transports the transported substrate to a second processing layer among the plurality of processing layers, the second processing layer performs a specific process on the transported substrate, The substrate is then transferred to the second loading block, the second loading block transfers the substrate processed by the second processing layer to the external device, the second loading block transfers the substrate processed by the external device from the external device, and transfers the transferred substrate to the third processing layer among the multiple processing layers, the third processing layer performs specific processing on the transferred substrate, and transfers the substrate to the first loading block, the first loading block moves the substrate processed by the third processing layer back to the carrier placed on the first carrier stage.

[0029] In the configuration in which a substrate is subjected to specific processing in sequence by using the first processing layer, the second processing layer, the third processing layer and the external device, since the two loading blocks are transported alternately, the two loading blocks can share the substrate transport for inserting and removing the substrate from the carrier and the substrate transport between layers. In addition, by transporting the substrate from the loading block serving as the substrate transport source to the loading block on the opposite side thereof, the number of substrates that can be mounted on the substrate mounting portion can be ensured.

[0030] In addition, the substrate processing apparatus preferably further includes a carrier transfer mechanism that transfers the carrier between the first carrier stage and the second carrier stage. For example, when all substrates are taken out from the carrier mounted on the first carrier stage, the carrier transfer mechanism returns the substrates to the carrier, so that the carrier mounted on the first carrier stage can be transferred to the second carrier stage.

[0031] In addition, in the substrate processing device, it is preferred that the carrier transport mechanism is mounted on the single processing block. In the past, the carrier transport mechanism was arranged in a horizontal direction relative to the loading block. According to the present invention, the carrier transport mechanism is arranged on the first processing block and the second processing block. Therefore, the installation area of ​​the conventional carrier transport mechanism arranged in a horizontal direction relative to the loading block can be reduced. That is, the occupied area of ​​the substrate processing device can be reduced.

[0032] In addition, the substrate conveying method of the substrate processing device of the present invention includes the following steps: the substrate processing device comprises: a first loading block provided with a first carrier stage for placing a carrier capable of accommodating a plurality of substrates; and a single processing block connected to the first loading block, with a plurality of processing layers arranged in the vertical direction. The steps are: using the first loading block, taking out a substrate from the carrier placed on the first carrier stage, and conveying the taken-out substrate to any one of the plurality of processing layers; using each of the plurality of processing layers, performing a specific process on the conveyed substrate, and conveying the substrate to a second loading block connected to the single processing block; and using the second loading block, moving the substrate processed by the processing layer back to the carrier placed on the second carrier stage provided on the second loading block.

[0033] According to the substrate conveying method of the present invention, the first loading block takes out a substrate from a carrier mounted on a first carrier mounting table, and conveys the taken-out substrate to any one of a plurality of processing layers. In addition, the second loading block moves the substrate conveyed from the processing layer back to the carrier mounted on the second carrier mounting table. Thus, the first loading block can more quickly convey a plurality of substrates to a plurality of processing layers arranged in the vertical direction. In addition, at the same time, the second loading block can more quickly convey a plurality of substrates conveyed from a plurality of processing layers arranged in the vertical direction to the carrier. As a result, the processing capacity of the substrate processing device can be increased.

[0034] [Effects of the Invention]

[0035] According to the substrate processing apparatus and substrate transfer method of the present invention, the processing throughput can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Several embodiments currently considered to be preferred are shown in the drawings for the purpose of illustrating the invention, but it should be understood that the invention is not limited to the configurations and embodiments shown in the drawings.

[0037] Figure 1 This is a longitudinal sectional view of the substrate processing apparatus of Example 1.

[0038] Figure 2 It is a cross-sectional view of the substrate processing apparatus of Example 1.

[0039] Figure 3It is a right side view of the substrate processing apparatus of Example 1.

[0040] Figure 4 This is a diagram showing a portion of the left side of the substrate processing apparatus of Example 1.

[0041] Figure 5 It is a diagram showing a carrier transport mechanism.

[0042] Figure 6 It is a top view showing the carrier buffer device.

[0043] Figure 7 It is a diagram for explaining the operation of a conventional substrate processing apparatus.

[0044] Figure 8 This is a diagram for explaining the operation of the substrate processing apparatus according to the first embodiment.

[0045] Fig. 9 It is a right side view of the substrate processing apparatus of Example 2 and is a diagram for explaining its operation.

[0046] Fig.10 This is a diagram for explaining the operation of the substrate processing apparatus according to the variation of the second embodiment.

[0047] Fig.11 It is a right side view of the substrate processing apparatus of Example 3 and is a diagram for explaining its operation.

[0048] Figures 12A to 12C It is a diagram for explaining the operation of the substrate processing apparatus according to the variation of the third embodiment.

[0049] Fig.13 This is a longitudinal sectional view of a substrate processing apparatus according to a fourth embodiment.

[0050] Fig.14 It is a cross-sectional view of a substrate processing apparatus according to a fourth embodiment.

[0051] Fig.15 It is a right side view of the substrate processing apparatus of Example 4 and is a diagram for explaining its operation.

[0052] Fig.16 This is a diagram showing a portion of the left side of the substrate processing apparatus of Example 4.

[0053] Fig.17A , Fig. 17B This is a diagram for explaining the operation of the substrate processing apparatus according to a variation of the fourth embodiment.

[0054] Fig.18 It is a right side view of the substrate processing apparatus of Example 5 and is a diagram for explaining its operation.

[0055] Fig.19 This is a diagram for explaining the operation of the substrate processing apparatus of Example 5.

[0056] Fig. 20A , Fig. 20B It is a figure which shows a cleaning device.

[0057] Fig.21 It is a diagram for explaining the structure and operation of the substrate processing apparatus according to a modified example.

[0058] Figures 22A to 22C It is a diagram for explaining the structure and operation of the substrate processing apparatus according to a modified example.

[0059] Figures 23A to 23C It is a diagram for explaining the structure and operation of the substrate processing apparatus according to a modified example.

[0060] Figures 24A to 24C It is a diagram for explaining the structure and operation of the substrate processing apparatus according to a modified example.

[0061] Fig.25A , Fig.25B It is a diagram for explaining the structure and operation of the substrate processing apparatus according to a modified example.

[0062] Fig.26 It is a cross-sectional view showing the first loading block of a modified example.

[0063] Fig. 27 It is a cross-sectional view showing a second loading block according to a modified example.

[0064] Fig.28 FIG. 1 is a cross-sectional view showing a substrate processing apparatus according to a modified example. DETAILED DESCRIPTION

[0065] [Example 1]

[0066] Hereinafter, Embodiment 1 of the present invention will be described with reference to the accompanying drawings. In the following description, the surface of the substrate on which various patterns such as circuit patterns are formed is referred to as the front surface, and the surface on the opposite side is referred to as the back surface. In addition, the surface of the substrate facing downward is referred to as the lower surface, and the surface of the substrate facing upward is referred to as the upper surface.

[0067] Figure 1 It is a longitudinal sectional view of the substrate processing apparatus 1 of the first embodiment. Figure 2 is a cross-sectional view of the substrate processing apparatus 1 . Figure 3 It is a right side view of the substrate processing apparatus 1 . Figure 4 It is a diagram showing a part of the left side of the substrate processing apparatus 1 .

[0068] Reference Figure 1 , Figure 2The substrate processing apparatus 1 includes a first loading block (hereinafter appropriately referred to as "first ID block") 2, a single processing block 3, a second loading block (hereinafter appropriately referred to as "second ID block") 4, and a carrier buffer device 8. The first ID block 2, the processing block 3, and the second ID block 4 are arranged in a row in a straight line.

[0069] (Configuration of the first loading block 2)

[0070] The first ID block 2 has two opening mechanisms 9 and 10 (see Figure 2 , Figure 6 ) and two substrate transfer mechanisms (robots) TM1, TM2. Two opening mechanisms (carrier placement parts) 9, 10 provided in the first ID block 2 are used to place carriers C, respectively.

[0071] The carrier C can store multiple (e.g., 25) substrates W in a horizontal position. The carrier C uses, for example, a FOUP (Front Open Unified Pod), but may also be a container other than a FOUP (e.g., a SMIF (Standard Mechanical Interface Face) box). The carrier C includes, for example, a carrier body having an opening for inserting and removing the substrates W, and a cover for covering the opening of the carrier body.

[0072] Each opening mechanism 9, 10 includes: a stage 13 for placing the carrier C; an opening 14 for allowing the substrate W to pass through; a shutter member (not shown) for opening and closing the opening 14 and attaching and detaching the cover to the carrier body; and a shutter member driving mechanism (not shown) for driving the shutter member. The shutter member driving mechanism includes an electric motor. In addition, after the cover is removed from the carrier body, the shutter member moves, for example, downward or in the horizontal direction (Y direction) along the opening 14.

[0073] The mounting table 13 is disposed on the top platform of the processing block 3. Figure 1 As shown, the mounting table 13 is provided at a position higher than the processing block 3, that is, above the processing block 3. The mounting table 13 may also be provided on the processing block 3, that is, in contact with the upper surface of the processing block 3. In addition, the mounting table 13 corresponds to the first carrier mounting table of the present invention.

[0074] The two substrate transport mechanisms TM1 and TM2 are respectively provided with two hands 21, an advance / retract drive unit 23, and an elevation / rotation drive unit 25. The two hands 21 respectively hold the substrate W. In addition, the two hands 21 are respectively movably mounted on the advance / retract drive unit 23. The advance / retract drive unit 23 can make both of the two hands 21 enter the carrier C at the same time. In addition, the advance / retract drive unit 23 can make the two hands 21 advance / retract respectively. Therefore, the advance / retract drive unit 23 can make one of the two hands 21 enter the carrier C.

[0075] The lifting and rotating driving unit 25 lifts and rotates the two hands 21 by lifting and rotating the advance and retreat driving unit 23. That is, the lifting and rotating driving unit 25 can move the advance and retreat driving unit 23 in the up and down direction (Z direction) and can rotate the advance and retreat driving unit 23 around the vertical axis AX1. The advance and retreat driving unit 23 and the lifting and rotating driving unit 25 each include an electric motor. In addition, the two substrate transport mechanisms TM1 and TM2 are fixed to the bottom of the first ID block 2 in a manner that they cannot move in the horizontal direction (especially the Y direction).

[0076] Six substrate loading units PS1A to PS6A are provided between the first ID block 2 and the six processing layers 3A to 3F described below. The six substrate loading units PS1A to PS6A and the six substrate loading units PS1B to PS6B described below are configured to be capable of loading one or more substrates W. The first substrate transport mechanism TM1 is capable of transporting substrates W between the carrier C mounted on the opening mechanism 9 and the six substrate loading units PS1A to PS6A. The second substrate transport mechanism TM2 is capable of transporting substrates W between the carrier C mounted on the opening mechanism 10 and the six substrate loading units PS1A to PS6A. In addition, the first substrate transport mechanism TM1 cannot take out or store the substrate W from the carrier C mounted on the opening mechanism 10. In addition, the second substrate transport mechanism TM2 is unable to take out or store the substrate W from the carrier C mounted on the opening mechanism 9.

[0077] (Configuration of Processing Block 3)

[0078] The processing block 3 is connected to the first ID block 2 and the second ID block 4. That is, the processing block 3 is arranged between the two ID blocks 2 and 4. The processing block 3 performs a coating process on the substrate W.

[0079] The processing block 3 includes six processing layers 3A to 3F. The six processing layers 3A to 3F are arranged in a stacked manner in the vertical direction (Z direction). The six processing layers 3A to 3F are respectively provided with a third substrate transfer mechanism TM3, a transfer space 27, a liquid processing unit 28, and a heat treatment unit 29. The six processing layers 3A to 3F have the same structure.

[0080] The third substrate transport mechanism TM3 transports the substrate W between the processing layers 3A to 3F. The third substrate transport mechanism TM3 includes two hands 31 , an advance / retract drive unit 32 , a rotation drive unit 33 , a first moving mechanism 34 , and a second moving mechanism 35 .

[0081] The two hands 31 hold the substrate W respectively. The two hands 31 are movably mounted on the advance / retract drive unit 32. The advance / retract drive unit 32 moves the two hands 31 forward / retract individually. The rotation drive unit 33 rotates the advance / retract drive unit 32 around the vertical axis AX2. Thus, the orientation of the two hands 31 can be changed. The first moving mechanism 34 rotates the rotation drive unit 33 in a Figure 1 The second moving mechanism 35 moves the first moving mechanism 34 in the front-rear direction (X direction). Thus, the advance-retract drive unit 32 can be moved in the X direction. The second moving mechanism 35 moves the first moving mechanism 34 in the up-down direction (Z direction). Thus, the advance-retract drive unit 32 can be moved in the Z direction.

[0082] Furthermore, the forward / retractable driving unit 32 , the rotation driving unit 33 , the first moving mechanism 34 , and the second moving mechanism 35 each include an electric motor.

[0083] like Figure 2 As shown, the third substrate transfer mechanism TM3 is provided in the transfer space 27. The transfer space 27 is configured to extend linearly in the horizontal direction (X direction). The liquid processing unit 28 and the heat processing unit 29 are arranged so as to sandwich the transfer space 27.

[0084] Figure 3 1 is a right side view showing the configuration of the liquid processing unit 28 of the processing block 3. The six processing layers 3A to 3F are respectively provided with four liquid processing units 28. These four liquid processing units 28 are arranged in a manner of 4 columns x 1 layer in the horizontal direction and 1 layer in the vertical direction. The two liquid processing units 28 on the side of the 1st ID block 2 among the four liquid processing units 28 are coating units BARC. In addition, the two liquid processing units 28 on the side of the 2nd ID block 4 are coating units RESIST. The coating unit BARC forms an antireflection film on the substrate W. The coating unit RESIST forms a resist film such as a photoresist on the substrate W.

[0085] like Figure 2 As shown in FIG. 2 , the liquid processing unit 28 includes a holding and rotating unit 37, a nozzle 38, and a nozzle moving mechanism 39. The holding and rotating unit 37 holds the lower surface of the substrate W by vacuum adsorption, for example, and rotates the held substrate W around a vertical axis (Z direction). The rotation is performed by, for example, an electric motor. The nozzle 38 supplies a coating liquid (for example, a liquid for forming an antireflective film or a photoresist liquid) to the substrate W. The nozzle moving mechanism 39 moves the nozzle 38 to an arbitrary position. The nozzle moving mechanism 39 includes, for example, an electric motor.

[0086] Figure 4 FIG. 2 is a diagram showing a portion of the left side of the arrangement of the heat treatment unit 29 of the processing block 3. Each of the processing layers 3A to 3F includes a plurality of heat treatment units 29. The heat treatment unit 29 performs heat treatment and includes a plate 41 (see FIG. 2 ) on which the substrate W is placed. Figure 2 The flat plate 41 is heated by, for example, a heater, and the flat plate 41 is cooled by, for example, a water-cooling mechanism.

[0087] In the six treatment layers 3A to 3F, the heat treatment parts 29 are configured to be arranged in 5 rows x 3 layers. Figure 4 In the embodiment, the six processing layers 3A to 3F are respectively provided with 14 heat treatment units 29. That is, the six processing layers 3A to 3F are respectively provided with 3 close contact strengthening processing units PAHP, 2 cooling units CP and 9 heating and cooling units PHP. In addition, for example, in the processing block 3, the number and type of processing units other than the liquid processing unit 28 and the heat treatment unit 29 can be appropriately changed. For example, the processing unit may also be an edge exposure unit EEW that performs exposure processing on the peripheral portion of the substrate W.

[0088] The adhesion enhancing treatment section PAHP improves the adhesion between the substrate W and the anti-reflection film by applying an adhesion enhancing agent such as hexamethyldisilazane (HMDS) on the substrate W and heating it. The adhesion enhancing treatment section PAHP also has the function of cooling the substrate W after heating. The cooling section CP cools the substrate W. The heating and cooling section PHP performs heating treatment and cooling treatment in sequence.

[0089] (Configuration of the Second Loading Block 4)

[0090] The second ID block 4 is connected to the processing block 3. The second ID block 4 has two opening mechanisms 45 and 46 (see Figure 6 ) and two substrate transfer mechanisms TM4, TM5. Two opening mechanisms 45, 46 provided in the second ID block 4 are provided with carriers C capable of storing a plurality of substrates W, respectively.

[0091] Each of the opening mechanisms 45 and 46 includes, similarly to the opening mechanism 9, a stage 47 for placing the carrier C, an opening 48 for allowing the substrate W to pass through, a shutter member (not shown) for opening and closing the opening 48 and for attaching and detaching the cover of the carrier body, and a shutter member driving mechanism for driving the shutter member. The shutter member driving mechanism includes an electric motor. In addition, after the cover is removed from the carrier body, the shutter member moves, for example, downward or in the horizontal direction (Y direction) along the opening 48.

[0092] The mounting table 47 is disposed on the top platform of the processing block 3. Figure 1In the embodiment, the mounting table 47 is provided at a position higher than the processing block 3, that is, above the processing block 3. The mounting table 47 may also be provided on the coating block 3, that is, provided in contact with the processing block 3. In addition, the mounting table 47 corresponds to the second carrier mounting table of the present invention.

[0093] Each of the substrate transport mechanisms TM4 and TM5 includes two hands 21, an advance / retreat drive unit 23, and an elevation / rotation drive unit 25. Each of the substrate transport mechanisms TM4 and TM5 has the same configuration as the substrate transport mechanism TM1 (TM2).

[0094] Six substrate mounts PS1B to PS6B are provided between the six processing layers 3A to 3F and the second ID block 4. The fourth substrate transport mechanism TM4 can transport a substrate W between the carrier C mounted on the opening mechanism 45 and the six substrate mounts PS1B to PS6B. The fifth substrate transport mechanism TM5 can transport a substrate W between the carrier C mounted on the opening mechanism 46 and the six substrate mounts PS1B to PS6B. In addition, the fourth substrate transport mechanism TM4 cannot take out or store a substrate W for the carrier C mounted on the opening mechanism 46. In addition, the fifth substrate transport mechanism TM5 cannot take out or store a substrate W for the carrier C mounted on the opening mechanism 45.

[0095] (Carrier buffer device 8)

[0096] The substrate processing apparatus 1 includes a carrier buffer device 8 on or above the first ID block 2, the processing block 3, and the second ID block 4. The carrier buffer device 8 includes a carrier transfer mechanism 51 and a carrier storage rack 53 (see Figure 6 ).

[0097] Reference Figure 5 . Figure 5 : is a diagram showing a carrier transport mechanism 51. The carrier transport mechanism 51 includes two multi-joint arms 61 and 62. A holding portion 63 is provided at one end of the first multi-joint arm 61, and a holding portion 64 is provided at one end of the second multi-joint arm 62. In addition, the other end of the first multi-joint arm 61 is supported on a pillar-shaped lifting drive portion 65 so as to be movable in the vertical direction, and the other end of the second multi-joint arm 62 is supported on the lifting drive portion 65 so as to be movable in the vertical direction.

[0098] The two holding parts 63 and 64 are respectively configured to hold, for example, a protrusion provided on the upper surface of the carrier C. The two holding parts 63 and 64 are respectively provided with an electric motor.

[0099] The two multi-joint arms 61 and 62 are respectively equipped with one or more electric motors. The first multi-joint arm 61 is configured to be able to rotate the first holding portion 63 360 degrees around the vertical axis AX3. The second multi-joint arm 62 is configured in the same manner as the first multi-joint arm 61. For example, the first multi-joint arm 61 may be responsible for Figure 6 The second multi-joint arm 62 is responsible for transporting the carrier C on the upper side (opening mechanism 10, 46 side) Figure 6 The conveyance of carrier C on the lower side (opening mechanism 9, 45 side).

[0100] The lifting drive unit 65 is configured to be able to lift and lower the two multi-joint arms 61 and 62 individually. The lifting drive unit 65 includes an electric motor. The lifting drive unit 65 may include, for example, a belt and a plurality of pulleys for one multi-joint arm.

[0101] The front-rear drive unit 67 includes a support portion 67A that supports the lifting drive unit 65, a longitudinal portion 67B that extends long in the front-rear direction (X direction), and an electric motor (not shown). For example, the longitudinal portion 67B may be a track (guide rail), and the support portion 67A may be a trolley. In this case, the trolley (support portion 67A) may be moved along the track (longitudinal portion 67B) by using an electric motor.

[0102] In addition, for example, an electric motor, a plurality of pulleys, a belt and a guide rail may be built into the longitudinal portion 67B, and the support portion 67A may be fixed to the belt. In this case, the pulley may be rotated by the electric motor to move the belts hung on the pulleys, thereby moving the support portion 67A along the guide rail.

[0103] Reference Figure 6 The carrier storage rack 53 has an input port 71, an output port 72, an unprocessed substrate carrier rack 73, an empty carrier rack 74, and a processed substrate carrier rack 75. The input port 71 is a rack for receiving a carrier C containing an unprocessed substrate W from an external transport mechanism OHT (Overhead Hoist Transport). The external transport mechanism OHT transports the carrier C within the factory. The so-called unprocessed means that the substrate has not been processed using the processing block 3. Figure 1 , Figure 6 As shown, the input port 71 is provided on the ID block 2, that is, on the top platform of the ID block 2. A rail 77 of the external transport mechanism OHT is provided above the ID block 2. The external transport mechanism OHT transports the carrier C to one of the two input ports 71.

[0104] In addition, Figure 6In the figure, the unprocessed substrate carrier rack 73 and the processed substrate carrier rack 75 are arranged in the longitudinal direction of the substrate processing device 1 in a manner along the longitudinal portion 67B. The unprocessed substrate carrier rack 73 is for loading the unprocessed substrate W that cannot be transferred to either of the two loading tables 13, i.e., it is loaded on the input port 71. The empty carrier rack 74 is for loading the unprocessed substrate W that cannot be transferred to either of the two loading tables 47, i.e., the substrates W have all been taken out onto the loading table 13 and cannot be transferred to either of the two loading tables 47. The empty carrier rack 74 is arranged on the second ID block 4, i.e., on the top platform of the second ID block 4. The processed substrate carrier rack 75 is for loading the unprocessed substrate W that cannot be transferred to either of the two output ports 72, i.e., it is for loading the unprocessed substrate W that cannot be transferred to either of the two output ports 72. The so-called processed means that it has been processed by the processing block 3.

[0105] The output port 72 is a rack for delivering the carrier C containing the processed substrate W to the external transport mechanism OHT. Figure 1 , Figure 6 As shown, the output port 72 is provided on the ID block 2, that is, on the top platform of the ID block 2. The carrier transport mechanism 51 can freely move the carrier C between the respective mounting tables 13, 47 and the respective racks 71-75.

[0106] In addition, if Figure 1 , Figure 6 As shown in FIG. 1 , the mounting table 13 and the opening 14 (opening mechanisms 9 and 10) are provided on the processing block 3 side, and the mounting table 47 and the opening 48 (opening mechanisms 45 and 46) are provided on the processing block 3 side. That is, the mounting table 13 and the mounting table 47 are provided in a manner facing each other. Thus, the mounting table 13 and the mounting table 47 are provided toward the carrier transport mechanism 51, so that the carrier transport mechanism 51 can easily transport the carrier C. In addition, for example, in the case where the first ID block 2 is sandwiched on the opposite side of the processing block 3 (see FIG. 1 ), the carrier C can be easily transported by the carrier transport mechanism 51. Figure 6 In the case where a stage is provided as indicated by the arrow AR2, the stage 13 protrudes. However, since the stage 13 and the stage 47 are arranged facing each other, the protrusion of the stage 13 can be suppressed. Therefore, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0107] In addition, the carrier transport mechanism 51 includes two sets of multi-joint arms and holding parts, but may also include one set or three or more sets of multi-joint arms and holding parts. In addition, the lifting drive unit 65 may also be configured to be rotationally driven around a vertical axis relative to the support portion 67A. In addition, the track 77 may also pass through a position other than the top of the first ID block 2. In this case, an input port 71 and an output port 72 are provided at a position above the track passing device 1. The number and type of the carrier storage rack 53 may be appropriately changed.

[0108] In addition, if Figure 2As shown, the substrate processing device 1 includes one or more control units 79 and an operating unit 80. The control unit 79 includes, for example, a central processing unit (CPU). The control unit 79 controls each component of the substrate processing device 1. The operating unit 80 includes a display unit (for example, a liquid crystal display), a storage unit, and an input unit. The storage unit includes, for example, at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The input unit includes at least one of a keyboard, a mouse, a touch pad, and various buttons. The storage unit stores various conditions for substrate processing and action programs required for controlling the substrate processing device 1.

[0109] <Operation of substrate processing apparatus 1>

[0110] Next, the operation of the substrate processing apparatus 1 will be described. The plurality of processing steps performed in the substrate processing apparatus 1 are just examples, and the operator selects a desired step. Figure 1 The external transport mechanism OHT transports the carrier C to the input port 71 provided on the first ID block 2. The carrier transport mechanism 51 transports the carrier C from the input port 71 to, for example, the mounting table 13 of the opening mechanism 9. The shutter portion of the opening mechanism 9 opens the opening 14 while removing the cover of the carrier C and holding the cover.

[0111] (Step S01) 1st ID block 2

[0112] The first ID block 2 takes out a substrate W from a carrier C mounted on a stage 13 of any one of the two opening mechanisms 9 and 10, and transports the taken-out substrate W to any one of the six processing layers 3A to 3F. For example, the first substrate transport mechanism TM1 takes out a substrate W from a carrier C mounted on a stage 13 of the opening mechanism 9. The first substrate transport mechanism TM1 transports the taken-out substrate W to, for example, a substrate mounting portion PS1A. In addition, the first substrate transport mechanism TM1 transports the taken-out substrate W to, for example, the processing layers 3A to 3F approximately evenly. In addition, the second substrate transport mechanism TM2 takes out a substrate W from a carrier C mounted on a stage 13 of the opening mechanism 10.

[0113] When all the substrates W are taken out from the carrier C, the opening mechanism 9 closes the opening 14 with the shutter while attaching the cover to the carrier C. Thereafter, the carrier transport mechanism 51 replaces the empty carrier C after taking out the substrates W with another carrier C storing unprocessed substrates W. Then, the empty carrier C is transported to, for example, the mounting table 47 of the opening mechanism 45. When the empty carrier C cannot be transported to any of the opening mechanisms 45 and 46, the carrier transport mechanism 51 transports the empty carrier C to the empty carrier rack 74.

[0114] (Step S02) Processing Block 3

[0115] Each of the processing layers 3A to 3F of the processing block 3 performs coating processing on the transported substrate W, and transports the substrate W subjected to the coating processing to the second ID block 4. This will be described in detail.

[0116] For example, in the processing layer 3A of the processing block 3, the third substrate transport mechanism TM3 receives the substrate W from the substrate mounting portion PS1A. The third substrate transport mechanism TM3 transfers the received substrate W according to Figure 3 or Figure 4 The third substrate transport mechanism TM3 transports the substrate W on which the anti-reflection film is formed by the coating unit BARC in the order of the heating and cooling unit PHP, the cooling unit CP, the coating unit RESIST, and the heating and cooling unit PHP. The third substrate transport mechanism TM3 transports the substrate W on which the resist film is formed by the coating unit RESIST to the substrate loading unit PS1B. In addition, the processing layers 3B to 3F are the same as the processing layer 3A, and the substrate W transported is subjected to coating processing. In addition, the process of using the close contact strengthening processing unit PAHP can also be omitted.

[0117] (Step S03) Second ID Block 4

[0118] The second ID block 4 moves the substrate W processed by any one of the processing layers 3A to 3F back to the carrier C placed on the stage 47 of any one of the two opening mechanisms 45 and 46. To be described in detail. The carrier C on the stage 47 is in a state where the opening portion 48 is opened by the opening mechanism 45. The fourth substrate transport mechanism TM4 receives the substrate W from the substrate mounting portion PS1B and moves the received substrate W back to the carrier C placed on the stage 47 of the opening mechanism 45. In addition, the substrate W is moved back to the carrier C in which it was stored before the coating process was performed. That is, the substrate W is moved back to the original carrier C. In addition, when the substrate W is moved back to the carrier C placed on the stage 47 of the opening mechanism 46, the fifth substrate transport mechanism TM5 is used.

[0119] After all processed substrates W are stored in the carrier C, the opening mechanism 45 closes the opening 48 while attaching the cover to the carrier C. The carrier transport mechanism 51 transports the carrier C storing the processed substrates W from the mounting table 47 of the opening mechanism 45 to the output port 72. Thereafter, the external transport mechanism OHT transports the carrier C from the output port 72 to the next destination.

[0120] The effects of this embodiment will be described. Figure 7 It is a diagram for explaining the operation of a conventional substrate processing apparatus. Figure 8FIG. 2 is a diagram for explaining the operation when the processing block 3 has a single processing layer. Figure 7 In the conventional substrate processing apparatus 101, the substrate transfer process using the ID block 102 includes a transfer process and a return process. The transfer process is a process of taking out a substrate W from a carrier C mounted on a carrier mounting table 113 and transferring the taken-out substrate W to the processing block 103. In addition, the return process is a process of receiving a substrate W processed by the processing block 103 from the processing block 103 and transferring the received substrate W back to the carrier C mounted on the carrier mounting table 113.

[0121] According to the present embodiment, the first ID block 2 takes out the substrate W from the carrier C placed on the stage 13, and transports the taken-out substrate W to the six processing layers 3A to 3F (see Figure 1 ) (transfer process). In addition, the second ID block 4 moves the substrate W transported from each of the six processing layers 3A to 3F back to the carrier C mounted on the mounting table 47 (return process). Figure 8 As shown, the two ID blocks 2 and 4 share the substrate transport (transfer process and return process) for placing and removing the substrate W from the carrier C. Thus, the first ID block 2 can be arranged in the six processing layers 3A to 3F in the vertical direction (see Figure 1 ) more quickly transports a large number of substrates W. At the same time, the second ID block 4 can more quickly transport a plurality of substrates W conveyed from the six processing layers 3A to 3F arranged in the vertical direction to the carrier C. As a result, the processing throughput of the substrate processing apparatus 1 can be increased.

[0122] In addition, if Figure 1 As shown in FIG. 1 , the substrate processing apparatus 1 includes a carrier transfer mechanism 51 for transferring the carrier C between the stage 13 and the stage 47. For example, when all substrates W are taken out from the carrier C placed on the stage 13, the carrier transfer mechanism 51 can transfer the carrier C placed on the stage 13 to the stage 47 in order to return the substrate W to the carrier C.

[0123] In addition, the carrier transport mechanism 51 is mounted on a single processing block 3. In the past, the carrier transport mechanism was arranged in a horizontal direction relative to the first ID block 2. According to the present invention, the carrier transport mechanism 51 is mounted on a single processing block 3. Therefore, the installation area of ​​the conventional carrier transport mechanism arranged in a horizontal direction relative to the first ID block 2 can be reduced. That is, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0124] In addition, the substrate processing apparatus 1 includes a carrier storage rack 53 mounted on the first ID block 2, the processing block 3, and the second ID block 4. The carrier transport mechanism 51 transports the carrier C between the mounting table 13, the mounting table 47, and the carrier storage rack 53. Conventionally, the carrier storage rack 53 is provided in a horizontal direction relative to the first ID block 2. According to the present invention, the carrier storage rack 53 is, for example, mounted on the processing block 3. Therefore, the installation area of ​​the conventional carrier storage rack provided in a horizontal direction relative to the first ID block 2 can be reduced. That is, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0125] [Example 2]

[0126] Next, Embodiment 2 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with Embodiment 1 will be omitted.

[0127] In the first embodiment, the six processing layers 3A to 3F are respectively formed with a resist film after forming an antireflection film on the substrate W. That is, the six processing layers 3A to 3F are subjected to the same coating process. In contrast, in the second embodiment, one processing layer may be subjected to the first coating process on the substrate W, and another processing layer may be subjected to the second coating process on the substrate W subjected to the first coating process.

[0128] Fig. 9 This is a right side view showing the configuration of the liquid processing unit 28 of the processing block 3 of Example 2. In the processing block 3, the three processing layers 3A to 3C on the lower side are subjected to the first coating process for forming an antireflection film, and the three processing layers 3D to 3F on the upper side are subjected to the second coating process for forming a resist film.

[0129] In addition, Fig. 9 In the embodiment, between the second ID block 4 and the three processing layers 3D to 3F, there are provided substrate placement portions PS4B to PS6B for transfer and substrate placement portions PS4D to PS6D for return.

[0130] <Operation of substrate processing apparatus 1>

[0131] Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Fig. 9 .

[0132] (Step S11) First ID Block 2

[0133] The first ID block 2 takes out a substrate W from a carrier C placed on a stage 13 of any one of the two opening mechanisms 9 and 10, and transports the taken-out substrate W to any one of the three processing layers 3A to 3C. For example, the first substrate transport mechanism TM1 takes out a substrate W from a carrier C placed on a stage 13 of the opening mechanism 9. The first substrate transport mechanism TM1 transports the taken-out substrate W to the substrate mounting portion PS1A. In addition, the first substrate transport mechanism TM1 transports the taken-out substrate W to, for example, the processing layers 3A to 3C approximately evenly.

[0134] When all substrates W are taken out from the carrier C of the opening mechanism 9 by the first substrate transport mechanism TM1, the carrier transport mechanism 51 transports the empty carrier C to, for example, the mounting table 47 of the opening mechanism 45 (see Fig. 9 The dashed line between the carrier C of the mounting table 13 and the carrier C of the mounting table 47 is shown.

[0135] (Step S12) Processing Layers 3A to 3C of Processing Block 3 (First Coating Process)

[0136] Each of the processing layers 3A to 3C of the processing block 3 performs a first coating process (eg, forming an antireflection film) on the transported substrate W, and transports the substrate W subjected to the first coating process to the second ID block 4. This will be described in detail.

[0137] For example, in processing layer 3A of processing block 3, Figure 1 The third substrate transport mechanism TM3 shown receives the substrate W from the substrate mounting part PS1A. The third substrate transport mechanism TM3 transports the received substrate W in the order of the close contact strengthening treatment part PAHP, the cooling part CP, and the coating unit BARC. In the coating unit BARC, an anti-reflection film is formed on the substrate W. The third substrate transport mechanism TM3 transports the substrate W on which the anti-reflection film is formed by the coating unit BARC to the substrate mounting part PS1B. In addition, the processing layers 3B and 3C perform the first coating process on the transported substrate W in the same manner as the processing layer 3A.

[0138] (Step S13) Second ID Block 4

[0139] The second ID block 4 transports the substrate W processed in the processing layer 3A from the processing layer 3A to the processing layer 3D where the second coating process is performed. Fig. 9 The substrate placement part PS1B shown in the figure transfers the substrate W to the substrate placement part PS4B. In addition, the substrate W subjected to the first coating process in the processing layer 3B is transported to the processing layer 3E. The substrate W subjected to the first coating process in the processing layer 3C is transported to the processing layer 3F.

[0140] (Step S14) Processing Layers 3D to 3F of Processing Block 3 (Second Coating Process)

[0141] Each of the processing layers 3D to 3F of the processing block 3 performs a second coating process (eg, forming a resist film) on the conveyed substrate W, and returns the substrate W subjected to the second coating process to the second ID block 4. This will be described in detail.

[0142] In processing layer 3D of processing block 3, Figure 1 The third substrate transport mechanism TM3 shown in FIG. 1 receives the substrate W from the substrate placement unit PS4B. Figure 4 , Fig. 9 As shown, the third substrate transport mechanism TM3 transports the received substrate W in the order of the heating and cooling part PHP, the cooling part CP, the coating unit RESIST and the heating and cooling part PHP. The third substrate transport mechanism TM3 transports the substrate W on which the resist film is formed by the coating unit RESIST to the substrate mounting part PS4D. In addition, the processing layers 3E and 3F perform the second coating process on the transported substrate W in the same manner as the processing layer 3D.

[0143] (Step S15) Second ID Block 4

[0144] The second ID block 4 moves the substrate W processed by any one of the processing layers 3D to 3F back to the carrier C placed on the stage 47 of any one of the two opening mechanisms 45 and 46. To be described in detail. The carrier C on the stage 47 is in a state where the opening portion 48 is opened by the opening mechanism 45. The fourth substrate transport mechanism TM4 receives the substrate W from the substrate mounting portion PS4D and moves the received substrate W back to the carrier C placed on the stage 47 of the opening mechanism 45. In addition, the substrate W is moved back to the carrier C that was stored before the coating process. In addition, when the substrate W is moved back to the carrier C placed on the stage 47 of the opening mechanism 46, the fifth substrate transport mechanism TM5 is used.

[0145] <Other action examples>

[0146] also, Fig. 9 The processing block 3 shown can also be Fig.10 Move as shown. Fig.10 In the embodiment, substrate placement portions PS1A to PS3A for transfer and substrate placement portions PS1C to PS3C for return are provided between the first ID block 2 and the three processing layers 3A to 3C.

[0147] The first ID block 2 takes out a substrate W from a carrier C placed on a stage 13 of any one of the two opening mechanisms 9 and 10, and transports the taken-out substrate W to any one of the three processing layers 3A to 3C. Each processing layer 3A to 3C of the processing block 3 performs a first coating process (e.g., forming an anti-reflection film) on the transported substrate W, and moves the substrate W subjected to the first coating process back to the first ID block 2. For example, in the processing layer 3A, the third substrate transport mechanism TM3 receives the substrate W from the substrate mounting portion PS1A, performs the first coating process, and then transports the substrate W subjected to the first coating process to the substrate mounting portion PS1C.

[0148] The first ID block 2 transports the substrate W processed by the processing layer 3A from the processing layer 3A to the processing layer 3D for the second coating process. Each processing layer 3D to 3F of the processing block 3 performs the second coating process (e.g., forming a resist film) on the transported substrate W, and transports the substrate W subjected to the second coating process to the second ID block 4. The second ID block 4 moves the substrate W processed by any one of the processing layers 3D to 3F back to the carrier C mounted on the mounting table 47 of any one of the two opening mechanisms 45 and 46.

[0149] According to this embodiment, for example, in a configuration where different coating processes are sequentially performed on substrates W using processing layer 3A and processing layer 3D, two ID blocks 2 and 4 can share the substrate transport of loading and unloading substrates W into and out of carrier C and the substrate transport between layers.

[0150] [Example 3]

[0151] Next, Embodiment 3 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with Embodiments 1 and 2 will be omitted.

[0152] In the first embodiment, the six processing layers 3A to 3F are respectively formed with an antireflection film on the substrate W and then with a resist film. That is, the six processing layers 3A to 3F are subjected to the same coating process. In contrast, in the second embodiment, one processing layer may be subjected to the first coating process on the substrate W, and another processing layer may be subjected to the second coating process on the substrate W subjected to the first coating process. In addition, another processing layer may be subjected to the third coating process on the substrate W subjected to the second coating process.

[0153] Fig.111 is a right side view showing the configuration of the liquid treatment unit 28 of the treatment block 3 of Example 3. In the treatment block 3, the two treatment layers 3A and 3B on the lower side are subjected to the first coating treatment for forming an antireflection film, and the two treatment layers 3C and 3D in the middle are subjected to the second coating treatment for forming a resist film. Then, the two treatment layers 3E and 3F on the upper side are subjected to the third coating treatment for forming a resist protective film. The coating unit for forming the resist protective film includes, for example, a holding rotating unit 37, a nozzle 38, and a nozzle moving mechanism 39 (see FIG. 1 ). Figure 2 ). The resist protective film is, for example, a water-repellent film. In addition, the first coating process, the second coating process, and the third coating process may also form the following films. That is, the first coating process forms a lower film (SOC: Spin On Carbon), the second coating process forms an intermediate film (SOG: Spin On Glass), and the third coating process forms a resist film.

[0154] <Operation of substrate processing apparatus 1>

[0155] Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Fig.11 .

[0156] (Step S21) 1st ID block 2

[0157] The first ID block 2 is placed on two opening mechanisms 9 and 10 (see Figure 6 ) and transports the taken-out substrate W to any one of the two processing layers 3A and 3B. For example, the first substrate transport mechanism TM1 takes out the substrate W from the carrier C mounted on the mounting table 13 of the opening mechanism 9. The first substrate transport mechanism TM1 transports the taken-out substrate W to the substrate mounting portion PS1A.

[0158] (Step S22) Processing Layers 3A and 3B of Processing Block 3 (First Coating Process)

[0159] Each processing layer 3A, 3B of the processing block 3 performs a first coating process (for example, forming an antireflection film) on the transported substrate W, and transports the substrate W subjected to the first coating process to the second ID block 4. For example, in the processing layer 3A of the processing block 3, Figure 1 The third substrate transport mechanism TM3 shown receives the substrate W from the substrate mounting part PS1A. The third substrate transport mechanism TM3 transports the received substrate W in the order of the adhesion enhancement processing part PAHP, the cooling part CP, and the coating unit BARC. The third substrate transport mechanism TM3 transports the substrate W on which the anti-reflection film is formed by the coating unit BARC to the substrate mounting part PS1B.

[0160] (Step S23) Second ID Block 4

[0161] The second ID block 4 transports the substrate W processed in the processing layer 3A from the processing layer 3A to the processing layer 3C where the second coating process is performed. Fig.11 The substrate mounting portion PS1B shown in the figure transfers the substrate W to the substrate mounting portion PS3B. In addition, the substrate W subjected to the first coating process in the processing layer 3B is transported to the processing layer 3D.

[0162] (Step S24) Processing Layers 3C and 3D of Processing Block 3 (Second Coating Process)

[0163] Each processing layer 3C and 3D of the processing block 3 performs a second coating process (e.g., forming a resist film) on the conveyed substrate W, and conveys the substrate W subjected to the second coating process to the first ID block 2. For example, in the processing layer 3C of the processing block 3, Figure 1 The third substrate transport mechanism TM3 shown receives the substrate W from the substrate mounting part PS3B. The third substrate transport mechanism TM3 transports the received substrate W in the order of the heating and cooling part PHP, the cooling part CP, the coating unit RESIST and the heating and cooling part PHP. The third substrate transport mechanism TM3 transports the substrate W on which the resist film is formed by the coating unit RESIST to the substrate mounting part PS3A.

[0164] (Step S25) First ID Block 2

[0165] The first ID block 2 transports the substrate W processed in the processing layer 3C from the processing layer 3C to the processing layer 3E where the third coating process is performed. That is, one of the two substrate transport mechanisms TM1 and TM2 is switched from Fig.11 The substrate placement part PS3A shown in the figure transfers the substrate W to the substrate placement part PS5A. In addition, the substrate W subjected to the second coating process in the processing layer 3D is transported to the processing layer 3F.

[0166] (Step S26) Processing Layers 3E and 3F of Processing Block 3 (Third Coating Process)

[0167] Each processing layer 3E, 3F of the processing block 3 performs a third coating process (e.g., forming a resist protective film) on the conveyed substrate W, and conveys the substrate W subjected to the third coating process to the second ID block 4. For example, in the processing layer 3E of the processing block 3, Figure 1The third substrate transport mechanism TM3 shown receives the substrate W from the substrate loading unit PS5A. The third substrate transport mechanism TM3 transports the received substrate W in the order of the coating unit for forming the resist protection film and the heating and cooling unit PHP. The third substrate transport mechanism TM3 transports the substrate W with the resist protection film formed thereon to the substrate loading unit PS5B. In addition, the substrate W processed by the heating and cooling unit PHP may be transported to the edge exposure unit EEW, and the substrate W processed by the edge exposure unit EEW may be transported to the substrate loading unit PS5B.

[0168] (Step S27) Second ID Block 4

[0169] The second ID block 4 moves the substrate W processed by any of the processing layers 3E and 3F back to the substrate W placed on the two opening mechanisms 45 and 46 (see Figure 6 ) to the carrier C on the mounting table 47 of any one of the opening mechanisms 45. The fourth substrate transport mechanism TM4 receives the substrate W from the substrate mounting portion PS5B, and moves the received substrate W back to the carrier C mounted on the mounting table 47 of the opening mechanism 45.

[0170] According to the present embodiment, each processing layer 3A to 3F transports the substrate W from the ID block serving as the transport source of the substrate W to the ID block on the opposite side thereof (for example, from the first ID block 2 to the second ID block 4). The substrate carriers PS1A to PS6A used for substrate transport are provided between the processing layers 3A to 3F and the first ID block 2. In addition, the substrate carriers PS1B to PS6B are provided between the processing layers 3A to 3F and the second ID block 4. In the case of moving the substrate W back to the ID block serving as the transport source of the substrate W (for example, in the case of moving the substrate W transported from the first ID block 2 back to the first ID block 2), both substrate carriers, namely the transport substrate carrier and the return substrate carrier, must be provided near one ID block (for example, refer to Fig.10 The substrate placement sections PS2A and PS2C shown in the figure). Therefore, the number of substrates W that can be placed on each of the transport substrate placement section and the return substrate placement section is also limited. However, by transferring the substrates from the ID block that is the transfer source of the substrates W to the ID block on the opposite side, the number of substrates W that can be placed on the substrate placement section can be ensured. In addition, since the two ID blocks 2 and 4 are transferred alternately, the two ID blocks 2 and 4 can share the transfer of substrates between layers roughly equally.

[0171] Next, refer to Figures 12A to 12C To illustrate other examples of actions. Figures 12A to 12C In the embodiment, the processing block 3 includes three processing layers 3A, 3C, and 3E. As described above, the processing layer 3A forms an antireflection film for the substrate W, and the processing layer 3C forms a resist film for the substrate W. In addition, the processing layer 3E forms a resist protection film for the substrate W, for example.

[0172] <Other Action Example 1>

[0173] Reference Fig. 12A The first ID block 2 takes out the substrate W from the carrier C of the stage 13 and transfers the taken-out substrate W to the processing layer 3A. The substrate W transferred to the processing layer 3A is sequentially transferred to the second ID block 4, the processing layer 3C, the second ID block 4, the processing layer 3E, and the second ID block 4. Then, the second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the stage 47. In addition, the three processing layers 3A, 3C, and 3E perform a predetermined coating process respectively.

[0174] <Other Action Example 2>

[0175] Reference Fig. 12B The first ID block 2 takes out the substrate W from the carrier C of the stage 13 and transfers the taken-out substrate W to the processing layer 3A. The substrate W transferred to the processing layer 3A is sequentially transferred to the first ID block 2, the processing layer 3C, the first ID block 2, the processing layer 3E, and the second ID block 4. The second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the stage 47. In addition, the three processing layers 3A, 3C, and 3E perform a predetermined coating process, respectively.

[0176] According to other operation examples 1 and 2, for example, in a configuration where different coating processes are sequentially performed on substrate W using processing layers 3A, 3C, and 3E, two ID blocks 2 and 4 can share the substrate transport for loading and unloading substrates W from carrier C and the substrate transport between layers.

[0177] <Other Action Example 3>

[0178] Reference Fig. 12C The first ID block 2 takes out the substrate W from the carrier C of the stage 13 and transfers the taken-out substrate W to the processing layer 3A. The substrate W transferred to the processing layer 3A is sequentially transferred to the first ID block 2, the processing layer 3C, the second ID block 4, the processing layer 3E, and the second ID block 4. The second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the stage 47. In addition, the three processing layers 3A, 3C, and 3E perform a predetermined coating process, respectively.

[0179] In the case of this operation example, the first ID block 2 transfers the substrate W between the two processing layers 3A and 3C, and the second ID block 4 transfers the substrate W between the two processing layers 3C and 3D. According to this operation example, in a configuration where, for example, different coating processes are sequentially performed on the substrate W using the processing layers 3A, 3C, and 3E, the two ID blocks 2 and 4 can equally share the substrate transfer for loading and unloading the substrate W from the carrier C, and the substrate transfer between layers. In particular, the two ID blocks 2 and 4 can equally share the substrate transfer between the two processing layers. Therefore, the substrate transfer can be performed more simply.

[0180] [Example 4]

[0181] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first to third embodiments will be omitted.

[0182] In Embodiment 1, the second ID block 4 is connected to the processing block 3 and is provided with a stage 47 (opening mechanisms 45 and 46). In this regard, in this embodiment, the second ID block 4 is further configured to carry the substrate W into and out of the exposure apparatus EXP.

[0183] Fig.13 It is a longitudinal sectional view of the substrate processing apparatus 1 of the fourth embodiment. Fig.14 is a cross-sectional view of the substrate processing apparatus 1 . Fig.15 It is a right side view of the substrate processing apparatus 1 . Fig.16 It is a diagram showing a part of the left side of the substrate processing apparatus 1 .

[0184] like Fig.13 As shown, the second ID block 4 is configured to carry in and out the substrate W for the exposure device EXP. The second ID block 4 also functions as an interface block. The second ID block 4 includes three substrate transport mechanisms TM4 to TM6, a plurality of pre-exposure cleaning units 161, a plurality of post-exposure cleaning units 162, a heating and cooling unit PHP (PEB), three placement and cooling units P-CP, and a placement unit PS9.

[0185] The fourth substrate transport mechanism TM4 and the fifth substrate transport mechanism TM5 are arranged in a manner that they are aligned in the Y direction orthogonal to the front-rear direction (X direction). The sixth substrate transport mechanism TM6 is arranged behind the two substrate transport mechanisms TM4 and TM5 ( Fig.14 The pre-exposure cleaning unit 161 and the post-exposure cleaning unit 162 are arranged in a manner of facing each other with the two substrate transport mechanisms TM4 and TM5 interposed therebetween. The three cleaning units 161 and the two cleaning units 162 are arranged on both sides of the fourth substrate transport mechanism TM4 side and the fifth substrate transport mechanism TM5 side (refer to Fig.14 , 15 ).

[0186] The pre-exposure cleaning unit 161 cleans and dries the substrate W before the exposure process. The post-exposure cleaning unit 162 cleans and dries the substrate W after the exposure process. Each cleaning unit 161, 162 includes: a holding and rotating unit that holds the substrate W; and a nozzle that sprays, for example, a cleaning liquid and a rinse liquid onto the substrate W. In addition, each cleaning unit 161, 162 can also polish the back side and end (bevel portion) of the substrate W using a brush or the like. In addition, the back side of the substrate W refers to, for example, the surface on the opposite side of the surface on which the circuit pattern is formed.

[0187] like Fig.14 As shown, the heating and cooling unit PHP of the IF block 6 is arranged in a manner opposite to the sixth substrate transport mechanism TM6. Fig.14 , Fig.15 ) side, 6 heating and cooling units PHP are arranged in the up and down direction. In addition, on the fifth substrate transport mechanism TM5 side (refer to Fig.14 ), 6 heating and cooling parts PHP are also arranged in the up and down directions.

[0188] Between the three substrate transport mechanisms TM4 to TM6, three placement and cooling units P-CP and a placement unit PS9 are provided (see Fig.13 , Fig.14 ). The three loading and cooling parts P-CP and the substrate loading part PS9 are arranged in the up-down direction.

[0189] The fourth substrate transfer mechanism TM4 can transfer a substrate W between eight substrate placement parts PS1B to PS7B, PS9, three placement and cooling parts P-CP, the cleaning units 161 and 162, the heating and cooling part PHP, and the carrier C placed on the opening mechanism 45.

[0190] The fifth substrate transfer mechanism TM5 can transfer a substrate W between eight substrate placement parts PS1B to PS7B, PS9, three placement and cooling parts P-CP, the cleaning units 161 and 162, the heating and cooling part PHP, and the carrier C placed on the opening mechanism 46.

[0191] The sixth substrate transport mechanism TM6 can transport the substrate W between the substrate mounting portion PS9, three mounting and cooling portions P-CP, and the external exposure apparatus EXP. The three substrate transport mechanisms TM4 to TM6 are respectively configured substantially the same as the first substrate transport mechanism TM1, for example, and thus their description is omitted.

[0192] Seven substrate mounting portions PS1A to PS7A are disposed between the first ID block 2 and the seven processing layers 3A to 3G. Also, seven substrate mounting portions PS1B to PS7B are disposed between the seven processing layers 3A to 3G and the second ID block 4.

[0193] (Configuration of Processing Block 3)

[0194] Reference Fig.15 The processing block 3 includes seven processing layers 3A to 3G. The seven processing layers 3A to 3G are arranged in a stacked manner in the up-down direction (Z direction). The two processing layers 3A and 3B on the lower side include a coating unit BARC for forming an antireflection film on the substrate W. The two processing layers 3C and 3D in the middle include a coating unit RESIST for forming a resist film on the substrate W.

[0195] In addition, the three upper processing layers 3E to 3G (3E, 3F, 3G) include four developing units DEV as the liquid processing section 28. The developing units DEV perform development processing on the exposed substrate W. The four developing units DEV are arranged in 4 rows x 1 layer. Fig.14 A nozzle 38 is shown supplying developer liquid.

[0196] In addition, if Fig.16 As shown in the treatment layer 3G, the heat treatment units 29 of the three treatment layers 3E to 3G are configured to be arranged in 5 rows × 3 layers. The three treatment layers 3E to 3G are respectively equipped with 1 cooling unit CP and 12 heating and cooling units PHP. In addition, the number and type of units other than the liquid treatment unit 28 and the heat treatment unit 29 can be appropriately changed. In addition, Fig.16 The arrangement of the heat treatment parts 29 of the three treatment layers 3A, 3C, and 3G is shown with seven treatment layers 3A to 3G as representatives. The heat treatment parts 29 of the two treatment layers 3B and 3D are arranged in the same manner as the treatment layers 3A and 3C. In addition, the heat treatment parts 29 of the treatment layers 3E and 3F are arranged in the same manner as the treatment layer 3G.

[0197] <Operation of substrate processing apparatus 1>

[0198] Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Fig.15 .

[0199] (Step S31) Second ID Block 4

[0200] The second ID block 4 takes out a substrate W from a carrier C mounted on a mounting table 47 of either of the two opening mechanisms 45 and 46, and transfers the taken-out substrate W to either of the two processing layers 3A and 3B. This will be described in detail. In the second ID block 4, for example, the fourth substrate transfer mechanism TM4 takes out a substrate W from a carrier C mounted on a mounting table 47 of the opening mechanism 45, and transfers the taken-out substrate W to the substrate mounting portion PS1B.

[0201] (Step S32) Processing Layers 3A and 3B of Processing Block 3 (First Coating Process)

[0202] The processing layers 3A and 3B respectively perform the first coating process (for example, forming an antireflection film) on the conveyed substrate W, and convey the substrate W subjected to the first coating process to the first ID block 2. For example, in the processing layer 3A of the processing block 3, Fig.13 , Fig.14 The third substrate transport mechanism TM3 shown receives the substrate W from the substrate mounting portion PS1B and transports the received substrate W to at least the coating unit BARC. Thereafter, the third substrate transport mechanism TM3 transports the substrate W on which the antireflection film is formed by the coating unit BARC to the substrate mounting portion PS1A.

[0203] (Step S33) 1st ID block 2

[0204] The first ID block 2 performs the first coating process and transfers the transferred substrate W to the processing layer 3C. That is, one of the two substrate transfer mechanisms TM1 and TM2 is switched from Fig.15 The substrate placement part PS1A shown in the figure transfers the substrate W to the substrate placement part PS3A. In addition, the substrate W subjected to the first coating process in the processing layer 3B is transported to the processing layer 3D (that is, transported from the substrate placement part PS2A to PS4A).

[0205] (Step S34) Processing Layers 3C and 3D of Processing Block 3 (Second Coating Process)

[0206] Each processing layer 3C, 3D performs a second coating process (eg, forming a resist film) on the conveyed substrate W, and conveys the substrate W subjected to the second coating process to the second ID block 4. For example, in the processing layer 3C of the processing block 3, Fig.13 , Fig.14 The third substrate transport mechanism TM3 shown receives the substrate W from the substrate placement part PS3A. The third substrate transport mechanism TM3 transports the received substrate W to at least the coating unit RESIST. The third substrate transport mechanism TM3 transports the substrate W on which the resist film is formed by the coating unit RESIST to the substrate placement part PS3B.

[0207] (Step S35) Second ID Block 4 (Exposure Processing by Exposure Device)

[0208] The second ID block 4 carries out the substrate W processed by one of the two processing layers 3C and 3D to the exposure device EXP. In addition, the second ID block 4 carries in the substrate W subjected to the exposure processing by the exposure device EXP from the exposure device EXP. The second ID block 4 carries the carried-in substrate W to the three processing layers 3E to 3G. This will be described in detail.

[0209] In the second ID block 4, one of the two substrate transport mechanisms TM4 and TM5 receives the substrate W from the substrate placement part PS3B, and transports the received substrate W in the order of the pre-exposure cleaning unit 161 and the placement and cooling part P-CP. The sixth substrate transport mechanism TM6 transports the substrate W from the placement and cooling part P-CP to the exposure device EXP. The exposure device EXP exposes the transported substrate W.

[0210] The sixth substrate transport mechanism TM6 transports the substrate W exposed by the exposure device EXP from the exposure machine EXP to the substrate mounting part PS9. One of the two substrate transport mechanisms TM4 and TM5 receives the substrate W from the substrate mounting part PS9, and transports the received substrate W in the order of the post-exposure cleaning unit 162, the heating and cooling part PHP of the second ID block 4, and, for example, the substrate mounting part PS5B. In addition, in the heating and cooling part PHP, a post-exposure bake (PEB) process is performed.

[0211] (Step S36) Processing Layers 3E to 3G of Processing Block 3 (Development Processing)

[0212] Any of the three processing layers 3E to 3G of the processing block 3 performs a development process on the transferred substrate W, and transfers the developed substrate W to the first ID block 2. For example, in the processing layer 3E, the third substrate transfer mechanism TM3 receives the substrate W from the substrate mounting part PS5B, and transfers the received substrate W in the order of the cooling part CP, the developing unit DEV, the heating and cooling part PHP, and the substrate mounting part PS5A. In addition, in the three processing layers 3E to 3G, the process of the heating and cooling part PHP after the developing unit DEV may be omitted.

[0213] (Step S37) 1st ID block 2

[0214] The first ID block 2 moves the substrate W that has been developed by any of the processing layers 3E to 3G back to the carrier C placed on the stage 13 of any of the two opening mechanisms 9 and 10. To be specific, for example, the first substrate transport mechanism TM1 receives the substrate W from the substrate placement unit PS5A and moves the received substrate W back to the carrier C placed on the stage 13 of the opening mechanism 9.

[0215] According to the present embodiment, each processing layer 3A to 3G transfers a substrate W from an ID block serving as a transfer source of the substrate W to an ID block on the opposite side thereof (e.g., from the first ID block 2 to the second ID block 4). The substrate placement units PS1A to PS7A used for substrate transfer are provided between the processing layers 3A to 3G and the first ID block 2. In addition, the substrate placement units PS1B to PS7B are provided between the processing layers 3A to 3G and the second ID block 4. In the case of returning the substrate W to the ID block serving as a transfer source of the substrate W (e.g., in the case of returning the substrate W transferred from the first ID block 2 to the first ID block 2), the two types of substrate placement units, the transfer substrate placement unit and the return substrate placement unit, must be provided near one ID block. Therefore, the number of substrates W that can be placed on each of the transfer substrate placement unit and the return substrate placement unit is also limited. However, the number of substrates W that can be placed on the substrate placement portion can be ensured by transferring the substrates from the ID block serving as the transfer source of the substrates W to the ID block on the opposite side. In addition, since the two ID blocks 2 and 4 transfer the substrates alternately, the two ID blocks 2 and 4 can share the transfer of substrates between layers approximately equally.

[0216] Next, refer to Fig.17A , Fig. 17B To illustrate other examples of actions. Fig.17A , Fig. 17B In the embodiment, the processing block 3 includes three processing layers 3A, 3C, and 3E. As described above, the processing layer 3A forms an antireflection film for the substrate W, and the processing layer 3C forms a resist film for the substrate W. The processing layer 3E performs a development process on the substrate W, for example.

[0217] <Other Action Example 1>

[0218] Reference Fig.17A The first ID block 2 takes out the substrate W from the carrier C of the stage 13 and transports the taken-out substrate W to the processing layer 3A. The substrate W transported to the processing layer 3A and processed by the processing layer 3A is sequentially transported to the first ID block 2, the processing layer 3C (second coating process), the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3E (development process), and the second ID block 4. Then, the second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the stage 47.

[0219] <Other Action Example 2>

[0220] Reference Fig. 17BThe first ID block 2 takes out the substrate W from the carrier C of the stage 13 and transports the taken-out substrate W to the processing layer 3A. The substrate W transported to the processing layer 3A and processed by the processing layer 3A is sequentially transported to the second ID block 4, the processing layer 3C (second coating process), the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3E (development process), and the second ID block 4. Then, the second ID block 4 stores the substrate W processed by the processing layer 3E on the carrier C of the stage 47.

[0221] According to other action examples 1 and 2, for example, in a configuration in which different coating processes are sequentially performed on substrate W using processing layers 3A, 3C, 3E and exposure device EXP, the two ID blocks 2 and 4 can share the substrate transport for placing and removing substrate W from carrier C and the interlayer side substrate transport.

[0222] [Example 5]

[0223] Next, a fifth embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first to fourth embodiments will be omitted.

[0224] In Example 4, the processing block 3 includes two processing layers 3A and 3B for forming an antireflection film, two processing layers 3C and 3D for forming a resist film, and three processing layers 3E to 3G for performing a development process. That is, the processing block 3 of Example 4 includes three types of processing layers. In this regard, in this embodiment, two types of processing layers may also be included.

[0225] Fig.18 This is a right side view showing the configuration of the liquid processing unit 28 of the processing block 3 of Example 5. The processing block 3 has six processing layers 3A to 3F. After forming an antireflection film, the three processing layers 3A to 3C on the lower side form a resist film. In addition, the three processing layers on the upper side are subjected to development processing.

[0226] Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Fig.18 . The first ID block 2 takes out the substrate W from the carrier C of the stage 13, and transports the taken-out substrate W to, for example, the processing layer 3A. The substrate W that has been transported to and processed by the processing layer 3A is sequentially transported to the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the second ID block 4. Then, the second ID block 4 stores the substrate W that has been processed by the processing layer 3D on the carrier C of the stage 47. In addition, after exposure, the substrate W that has been processed by the processing layer 3B is subjected to development processing, for example, by the processing layer 3E. In addition, after exposure, the substrate W that has been processed by the processing layer 3C is subjected to development processing, for example, by the processing layer 3F.

[0227] <Other action examples>

[0228] Reference Fig.19 The second ID block 4 takes out the substrate W from the carrier C of the stage 47 and transports the taken-out substrate W to the processing layer 3A. The substrate W transported to and processed by the processing layer 3A is sequentially transported to the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the first ID block 2. Then, the first ID block 2 stores the substrate W processed by the processing layer 3E on the carrier C of the stage 13.

[0229] According to this embodiment, for example, in a configuration where different coating processes are sequentially performed on substrate W using processing layers 3A and 3D and exposure device EXP, two ID blocks 2 and 4 can share the substrate transport for loading and unloading substrates W from carrier C and substrate transport between layers.

[0230] The present invention is not limited to the above-described embodiment, and can be implemented in various modified forms as follows.

[0231] (1) In the embodiment 1, Figure 3 As shown, the six processing layers 3A to 3F are respectively provided with four liquid processing units 28, and the four liquid processing units 28 are composed of two coating units BARC and two coating units RESIST. In this regard, for example, the four liquid processing units 28 can also be composed of the coating unit BARC. In addition, the four liquid processing units 28 can also be composed of the coating unit RESIST. The four liquid processing units 28 can also be composed of the coating unit for forming the resist protective film.

[0232] (2) In the embodiment 1, Figure 3 As shown in FIG. 1 , each processing layer 3A to 3F of the processing block 3 performs coating processing on the substrate W, but each processing layer 3A to 3F may also perform developing processing on the substrate W. In addition, each processing layer 3A to 3F may also perform cleaning processing on the substrate W. In addition, when performing cleaning processing on the back side of the substrate W, the substrate W may also be configured to pass through the substrate W. Figure 2 The substrate W is turned over by any one of the turning units R1 to R4 shown by the dotted lines on the two ID blocks 2 and 4. For example, when the front side is facing up, the substrate W is turned over so that the front side faces down. In addition, a turning unit may be provided in at least one of the substrate mounting portions PS6A to PS6F between the ID block 2 and each of the processing layers 3A to 3F.

[0233] As the treatment liquid used for cleaning, for example, APM (ammonia-hydrogen peroxide water mixed solution), pure water (DIW), carbonated water, hydrogen water, ammonia water (NH4OH), SC1 (Standard Clean 1, standard cleaning solution 1), SC2 (Standard Clean 2, standard cleaning solution 2), citric acid aqueous solution, FOM (hydrofluoric acid / ozone mixed solution), FPM (hydrofluoric acid / hydrogen peroxide water / pure water mixed solution), hydrofluoric acid (HF), HCl, IPA (isopropyl alcohol), TMAH (tetramethylammonium hydroxide) and trimethyl-2-hydroxytetraethylammonium hydroxide aqueous solution (CHOLINE) can also be used.

[0234] (3) In the second embodiment, Fig. 9 As shown, the three processing layers 3A to 3C on the lower side of the processing block 3 are subjected to the first coating process for forming an antireflection film, and the three processing layers 3D to 3F on the upper side are subjected to the second coating process for forming a resist film. Alternatively, the three processing layers 3A to 3C on the lower side are subjected to the back cleaning process (the first cleaning process), and the three processing layers 3D to 3F on the upper side are subjected to the front cleaning process (the second cleaning process).

[0235] The cleaning unit 81 for performing the front cleaning process is, for example, Fig. 20A As shown in FIG. 1 , the holding and rotating unit 82, the liquid supply unit 83 and the spray cleaning mechanism 120 are provided. The holding and rotating unit 82 includes: a rotating chuck 86A for holding the substrate W by vacuuming the lower surface of the substrate W, for example; and a driving unit 88 for rotating the rotating chuck 86A around the vertical axis AX4. The liquid supply unit 83 includes a nozzle 90 for spraying a processing liquid, and a pipe 92 connected to the nozzle 90. The spray cleaning mechanism 120 includes a spray nozzle (two-fluid nozzle) 121, and a liquid supply pipe 123 connected to the spray nozzle 121.

[0236] The processing liquid is supplied to the nozzle 121 through the liquid supply pipe 123, and nitrogen (inert gas) is supplied. The holding rotating part 82 rotates the held substrate W. The processing liquid is sprayed from the nozzle 90 onto the upper surface of the rotating substrate W. The mist-like processing liquid is sprayed from the nozzle 121 onto the upper surface of the rotating substrate W. Thus, the upper surface of the substrate W, that is, the front surface of the substrate W is cleaned. Fig. 20A The cleaning unit 81 shown may also include a Fig. 20B The rotating chuck 86B is shown.

[0237] In addition, the cleaning unit 81 for performing back cleaning processing is as follows. Fig. 20BAs shown in FIG. 1 , the holding and rotating part 82, the liquid supply part 83 and the brush cleaning mechanism 84 are provided. The rotating chuck 86B holds the substrate W by contacting the end of the substrate W with a plurality of holding pins 85. The brush cleaning mechanism 84 includes: a brush cleaning tool 94; an arm 96 that supports the brush cleaning tool 94 at one end in a rotatable manner; and a driving part 98 that supports the other end of the arm 96 and rotates the arm 96 around the vertical axis AX5. In addition, the driving part 98 can raise and lower the arm 96. The two driving parts 88 and 98 each include an electric motor. Fig. 20B The cleaning unit 81 shown sprays a processing liquid from a nozzle 90 onto the upper surface of a rotating substrate W, for example, while bringing a brush cleaning tool 94 into contact with the upper surface of the substrate W. Thus, the upper surface of the substrate W, that is, the back surface of the substrate W is cleaned.

[0238] In addition, Fig. 9 In the embodiment, the three processing layers 3A to 3C on the lower side may be subjected to the bevel cleaning process (first cleaning process), and the three processing layers 3D to 3F on the upper side may be subjected to the back cleaning process (second cleaning process). In addition, the so-called bevel cleaning refers to cleaning the outer edge of the substrate W by supplying a processing liquid to the outer edge of the upper surface of the substrate W using the outer edge cleaning nozzle.

[0239] (4) In the embodiment 3, Fig.11 As shown, the two lower processing layers 3A and 3B of the processing block 3 are subjected to the first coating process for forming an antireflection film, the two middle processing layers 3C and 3D are subjected to the second coating process for forming a resist film, and further, the two upper processing layers 3E and 3F are subjected to the third coating process for forming a resist protective film. Alternatively, the lower processing layers 3A and 3B may be subjected to the first cleaning process, the middle processing layers 3C and 3D may be subjected to the second cleaning process, and the upper processing layers 3E and 3F may be subjected to the third cleaning process.

[0240] (5) In the embodiment 3, Fig.11 As shown, the second ID block 4 transfers the transferred substrate W to, for example, the processing layer 3C (A process). The processing layer 3C performs a specific process on the transferred substrate W and transfers the substrate to the first ID block 2 (B process). The first ID block 2 transfers the transferred substrate W to the processing layer 3E (C process). The processing layer 3E performs a specific process on the transferred substrate W and transfers the substrate W to the second ID block 4 (D process). Then, the second ID block 4 moves the substrate W processed by the processing layer 3E back to the carrier C mounted on the mounting table 47.

[0241] Alternatively, the second ID block 4 may not move the substrate W processed by the processing layer 3E back to the carrier C, but the substrate processing apparatus 1 (or its control unit 79) may perform the following operation. Fig.21The substrate processing device 1 can be operated in the manner shown. That is, the substrate processing device 1 also includes two processing layers 3G and 3H that perform different processing. As from the A process to the D process, the two processing layers 3G and 3H can also be reciprocated once between the two ID blocks 2 and 4 while performing specific processing respectively. In addition, in addition to the two processing layers 3G and 3H, the substrate processing device 1 can also be provided with two processing layers that perform different processing. At this time, the two processing layers can also be further reciprocated once between the two ID blocks 2 and 4 while performing specific processing respectively. Then, it can also be operated in the following manner: the substrate W processed by the processing layer of the last process is moved back to the carrier C placed on the mounting table 47.

[0242] illustrate Fig.21 The operation of the substrate processing device 1 shown in FIG. 1 is a diagram showing the operation of the substrate processing device 1. The first ID block 2 takes out a substrate W from the carrier C of the stage 13, and transports the taken-out substrate W to one of the two processing layers 3A and 3B (for example, the processing layer 3A). The processing layer 3A performs the first processing on the transported substrate W, and transports the substrate W to the second ID block 4. The second ID block 4 transports the transported substrate W to the processing layer 3C. The processing layer 3C performs the second processing on the transported substrate W, and transports the substrate W to the first ID block 2. The first ID block 2 transports the transported substrate W to the processing layer 3E. The processing layer 3E performs the third processing on the transported substrate W, and transports the substrate W to the second ID block 4.

[0243] Here, the second ID block 4 does not move the substrate W back to the carrier C of the stage 47, but transports the substrate W to the processing layer 3G. The processing layer 3G performs the fourth process on the transported substrate W, and transports the substrate W to the first ID block 2. The first ID block 2 transports the transported substrate W to the processing layer 3H. The processing layer 3H performs the fifth process on the transported substrate W, and transports the substrate W to the second ID block 4. The second ID block 4 moves the substrate W processed by the processing layer 3H of the final process back to the carrier C of the stage 47.

[0244] Fig.21 The processing block 3 shown in the figure performs the first to fifth five types of processing using five processing layers 3A, 3C, 3E, 3F, and 3H, but it is also possible to perform seven types of processing using seven processing layers. Fig.21 In the embodiment, when the substrate W is transferred to the processing layer 3B, the substrate W subjected to the first process in the processing layer 3B is transferred to the processing layer 3D via the second ID block 4. Thereafter, the substrate W subjected to the second process in the processing layer 3D is transferred to the processing layer 3F via the first ID block 2. Thereafter, as described above, the substrate W subjected to the third process in the processing layer 3F is transferred in the order of the processing layer 3G and the processing layer 3H.

[0245] (6) In the above-described embodiments 1 to 3, the first ID block 2 takes out the substrate W from the carrier C mounted on the stage 13, and the second ID block 4 moves the substrate W processed in the processing block 3 back to the carrier C mounted on the stage 47. In this regard, the substrate W may also be transported in the reverse direction. That is, the second ID block 4 takes out the substrate W from the carrier C mounted on the stage 47, and the first ID block 2 moves the substrate W processed in the processing block 3 back to the carrier C mounted on the stage 13.

[0246] (7) In the above-described embodiment 4, for example, Fig.15 As shown, the first coating process is performed using two processing layers 3A and 3B, but the first coating process may be performed using one processing layer, or more than three processing layers. In addition, the second coating process is performed using two processing layers 3C and 3D, but the second coating process may be performed using one processing layer, or more than three processing layers. In addition, the development process is performed in three processing layers 3E to 3G, but it may be performed in one or two processing layers, or more than four processing layers.

[0247] (8) In the fourth embodiment, the processing block 3 includes, for example, three processing layers 3A, 3C, and 3E for performing three different types of processing. In this regard, the processing block 3 may include, for example, four processing layers for performing four different types of processing.

[0248] Figures 22A to 22C , Figures 23A to 23C 1 is a diagram for explaining the structure and operation of a substrate processing apparatus according to a modified example. Figures 22A to 23C And the following Figures 24A to 25B In the description, repeated descriptions are omitted appropriately. Figures 22A to 23C And the following Figures 24A to 25B In the embodiment, the processing block 3 includes four processing layers 3A to 3D for performing four different types of processing. For example, the first processing is performed using a single processing layer 3A, but may be performed using a plurality of processing layers.

[0249] exist Fig.22A In the processing block 3 shown, the processing layer 3A is subjected to the first coating process, for example, and the processing layer 3B is subjected to the second coating process, for example. In addition, the processing layer 3C is subjected to the third coating process, for example, and the processing layer 4D is subjected to the development process, for example.

[0250] exist Fig.22A, the first ID block 2 takes out the substrate W from the carrier C of the stage 13, and transfers the taken-out substrate W to the processing layer 3A. The processing layer 3A performs the first coating process on the transferred substrate W, and transfers the substrate W to the second ID block 4. The second ID block 4 transfers the transferred substrate W to the processing layer 3B. The processing layer 3B performs the second coating process on the transferred substrate W, and transfers (returns) the substrate W to the second ID block 4. The second ID block 4 transfers the transferred substrate W to the processing layer 3C. The processing layer 3C performs the third coating process on the transferred substrate W, and transfers (returns) the substrate W to the second ID block 4.

[0251] After that, the second ID block 4 carries out the substrate W processed by the processing layer 3C to the exposure device EXP. The second ID block 4 carries in the substrate W subjected to the exposure process by the exposure device EXP from the exposure device EXP, and carries the carried substrate W to the processing layer 3D. The processing layer 3D performs a development process on the carried substrate W, and carries the substrate W to the second ID block 4. The second ID block 4 moves the carried substrate W back to the carrier C of the mounting table 47.

[0252] also, Fig.22A The four processing layers 3A to 3D may be processed as follows. Processing layer 3A may be subjected to the first coating process, and processing layer 3B may be subjected to the second coating process. Processing layer 3C may be subjected to post-exposure cleaning and post-exposure baking, and processing layer 3D may be subjected to development. In this case, Fig.22A As shown by the dotted arrow AR1, the exposure process is performed between the processing layer 3B and the processing layer 3C by the exposure device EXP. In addition, when the exposure process is performed at the position of the arrow AR1, the substrate W processed in the processing layer 3C is transported to the processing layer 3D through the second ID block 4.

[0253] illustrate Fig. 22B The first ID block 2 takes out the substrate W from the carrier C of the stage 13. The taken-out substrate W is transported in the order of the processing layer 3A, the second ID block 4, the processing layer 3B, the first ID block 2, the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D, and the second ID block 4. After that, the second ID block 4 stores the substrate W processed by the processing layer 3D on the carrier C of the stage 47. In addition, each processing layer 3A to 3D performs the first to fourth specific processes, respectively.

[0254] illustrate Fig. 22CThe first ID block 2 takes out the substrate W from the carrier C of the stage 13. The taken-out substrate W is transported in the order of the processing layer 3A, the second ID block 4, the processing layer 3B, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3C, the first ID block 2, the processing layer 3D, and the second ID block 4. After that, the second ID block 4 stores the substrate W processed by the processing layer 3D on the carrier C of the stage 47. In addition, each processing layer 3A to 3D performs the first to fourth specific processes, respectively.

[0255] exist Fig.23A In the process, the substrate W taken out from the carrier C of the loading part 13 of the 1st ID block 2 is transported in the order of processing layer 3A, 1st ID block 2, processing layer 3B, 2nd ID block 4, exposure device EXP, 2nd ID block 4, processing layer 3C, 1st ID block 2, processing layer 3D and 2nd ID block 4.

[0256] exist Fig. 23B In the embodiment, the substrate W taken out from the carrier C of the loading section 13 of the first ID block 2 is transported in the order of the processing layer 3A, the first ID block 2, the processing layer 3B, the second ID block 4, the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D and the second ID block 4. Fig. 23B As shown by arrow AR1, an exposure process is performed between the processed layer 3B and the processed layer 3C by the exposure device EXP.

[0257] exist Fig.23C In the process, the substrate W taken out from the carrier C of the loading part 13 of the 1st ID block 2 is transported in the order of processing layer 3A, 1st ID block 2, processing layer 3B, 1st ID block 2, processing layer 3C, 2nd ID block 4, exposure device EXP, 2nd ID block 4, processing layer 3D and 2nd ID block 4.

[0258] Next, explain Figures 24A to 25B The operation of the substrate processing apparatus 1 is shown. Figures 24A to 25B In the substrate processing apparatus 1 shown, the second ID block 4 takes out a substrate W from a carrier C on a stage 47 and transfers the taken-out substrate W to a processing layer 3A. The first ID block 2 moves (stores) the substrate W processed in the processing layer 3D back to the carrier C on the stage 13. Each processing layer 3A to 3D performs first to fourth specific processes, respectively.

[0259] exist Fig.24A In the embodiment, the substrate W taken out from the carrier C of the loading section 47 of the second ID block 4 is transported in the order of the processing layer 3A, the first ID block 2, the processing layer 3B, the second ID block 4, the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D and the first ID block 2. Fig.24A As indicated by an arrow AR1 indicated by a dotted line, an exposure process is performed between the processed layer 3B and the processed layer 3C by using the exposure device EXP.

[0260] exist Fig. 24B In the process, the substrate W taken out from the carrier C of the loading part 47 of the second ID block 4 is transported in the order of processing layer 3A, first ID block 2, processing layer 3B, first ID block 2, processing layer 3C, second ID block 4, exposure device EXP, second ID block 4, processing layer 3D and first ID block 2.

[0261] exist Fig.24C In the embodiment, the substrate W taken out from the carrier C of the loading section 47 of the second ID block 4 is transported in the order of the processing layer 3A, the second ID block 4, the processing layer 3B, the second ID block 4, the processing layer 3C, the second ID block 4, the exposure device EXP, the second ID block 4, the processing layer 3D and the first ID block 2. Fig.24C As indicated by an arrow AR1 indicated by a dotted line, an exposure process is performed between the processed layer 3B and the processed layer 3C by using the exposure device EXP.

[0262] exist Fig.25A In the process, the substrate W taken out from the carrier C of the loading part 47 of the second ID block 4 is transported in the order of processing layer 3A, second ID block 4, processing layer 3B, first ID block 2, processing layer 3C, second ID block 4, exposure device EXP, second ID block 4, processing layer 3D and first ID block 2.

[0263] exist Fig.25B In the process, the substrate W taken out from the carrier C of the loading part 47 of the 2nd ID block 4 is transported in the order of processing layer 3A, 2nd ID block 4, processing layer 3B, 2nd ID block 4, exposure device EXP, 2nd ID block 4, processing layer 3C, 1st ID block 2, processing layer 3D and 1st ID block 2.

[0264] (9) In the embodiments 4 and 5, Fig.13 As shown, the first substrate transfer mechanism TM1 of the first ID block 2 transfers substrates W between the seven substrate mounting portions PS1A to PS7A and the carrier C of the opening mechanism 9 . The second substrate transfer mechanism TM2 transfers substrates W between the seven substrate mounting portions PS1A to PS7A and the carrier C of the opening mechanism 10 .

[0265] Regarding the functions of the two substrate transport mechanisms TM1 and TM2, for example, the second substrate transport mechanism TM2 can also transport the substrate W between the four substrate mounting portions PS1A to PS4A. In this case, the first substrate transport mechanism TM1 can also transport the substrate between the three substrate mounting portions PS5A to PS7A and the carrier C of the opening mechanism 9. The functions between the first substrate transport mechanism TM1 and the second substrate transport mechanism TM2 can also be opposite. In addition, for example, Fig.26 As shown, the first substrate transport mechanism TM1 may be configured to be movable in the Y direction in which the opening mechanisms 9 and 10 are arranged, and the second substrate transport mechanism TM2 may be arranged between the first substrate transport mechanism TM1 and the processing block 3 .

[0266] (10) In the embodiments 4 and 5, Fig.13 As shown, the fourth substrate transport mechanism TM4 of the second ID block 4 transports the substrate W between the eight substrate mounting parts PS1A to PS7A, PS9, the pre-exposure cleaning unit 161, the post-exposure cleaning unit 162, the heating and cooling part PHP, the three mounting and cooling parts P-CP, and the carrier C mounted on the opening mechanism 45. In addition, the fifth substrate transport mechanism TM5 transports the substrate W between the eight substrate mounting parts PS1A to PS7A, PS9, the pre-exposure cleaning unit 161, the post-exposure cleaning unit 162, the heating and cooling part PHP, the three mounting and cooling parts P-CP, and the carrier C mounted on the opening mechanism 46.

[0267] For example, the fifth substrate transport mechanism TM5 may transport the substrate W between the six substrate mounting parts PS3B to PS7B, PS9, the pre-exposure cleaning unit 161, the post-exposure cleaning unit 162, the heating and cooling part PHP, and the three mounting and cooling parts P-CP. In this case, the fourth substrate transport mechanism TM4 may transport the substrate W between the two substrate mounting parts PS1B, PS2B and the carrier C of the opening mechanism 45. The functions of the fourth substrate transport mechanism TM4 and the fifth substrate transport mechanism TM5 may be opposite.

[0268] (11) In the above-mentioned embodiments and variations, for example Fig.15 The processing block 3 shown is provided with two processing layers 3A and 3B for the first coating process, two processing layers 3C and 3D for the second coating process, and three processing layers 3E to 3G for the development process in order from the bottom. The arrangement of the processing layers in the up-down direction is not limited to this. For example, the three processing layers 3E to 3G for the development process may be provided below the two processing layers 3A and 3B for the first coating process.

[0269] (12) In the above-mentioned embodiments and variations, Fig.15The two lower processing layers 3A and 3B shown can also be used to form an anti-reflection film and a resist film on the substrate W. In addition, the two middle processing layers 3C and 3D can also be used to form a resist protection film and clean the back surface of the substrate W. The three upper processing layers 3E to 3G can also be used to perform a development process on the substrate W.

[0270] (13) In the above-mentioned embodiments 4 and 5, the second ID block 4 functions as an interface block. Fig. 27 As shown, the second ID block 4 may also include an ID block body 200 and an interface block (hereinafter appropriately referred to as "IF block") 201. In this case, the ID block body 200 includes two opening mechanisms 45, 46 and two substrate transfer mechanisms TM4, TM5. The IF block 201 includes two substrate transfer mechanisms TM7, TM8 in addition to the pre-exposure cleaning unit 161, the post-exposure cleaning unit 162, the heating and cooling unit PHP and the sixth substrate transfer mechanism TM6. In addition, a substrate loading unit PS8 is provided between the ID block body 200 and the IF block 201. The substrate loading unit PS8 is divided into a conveying unit for the substrate W and a returning unit for the substrate W.

[0271] (14) In each of the above-mentioned embodiments and variations, the first ID block 2 includes two substrate transfer mechanisms TM1 and TM2. Fig.28 As shown, the first ID block 2 may also include a single substrate transport mechanism TM1. In this case, a plurality of (e.g., four) stages 13 may be arranged along the Y direction on the wall portion 206 of the first ID block 2. In order to take out and store the substrate W from the carrier C placed on these stages 13, the substrate transport mechanism TM1 may also be configured to move in the Y direction by driving an electric motor.

[0272] In addition, a single substrate transfer mechanism TM1 may be fixed to the bottom of the first ID block 2 so as not to move in the horizontal direction (particularly the Y direction) as in Embodiment 1. In addition, the first ID block 2 may include three or more substrate transfer mechanisms.

[0273] (15) In each of the above-mentioned embodiments and variations, the second ID block 4 includes two substrate transfer mechanisms TM4 and TM5. Fig.28 As shown, the second ID block 4 may also include a single substrate transport mechanism TM4. In this case, a plurality of (e.g., four) stages 47 may be arranged along the Y direction on the wall portion 208 of the second ID block 4. In order to take out and store the substrate W from the carrier C placed on these stages 47, the substrate transport mechanism TM4 may also be configured to move in the Y direction by driving an electric motor.

[0274] In addition, a single substrate transfer mechanism TM4 may be fixed to the bottom of the second ID block 4 so as not to move in the horizontal direction (particularly the Y direction) as in Embodiment 1. In addition, the second ID block 4 may include three or more substrate transfer mechanisms.

[0275] (16) In the above-described embodiments and variations, the number of processing layers in the processing block 3 is 6 to 7, but any number of processing layers is acceptable.

[0276] (17) In each of the above-described embodiments and variations, the processing block 3 includes a plurality of processing layers (for example, six processing layers 3A to 3F) stacked in the vertical direction. Figure 1 In the embodiment, the third substrate transfer mechanism TM3 of each processing layer 3A to 3F can transfer the substrate W between the first ID block 2 and the second ID block 4 using only the processing block 3. For example, a single processing block 3 includes at least one processing layer capable of transferring the substrate W between two ID blocks 2 and 4. Figure 1 In the process, the third substrate transfer mechanism TM3 of the processing layer 3A receives the substrate W from the substrate mounting portion PS1A, and transfers the received substrate W to the liquid processing portion 28 and the heat treatment portion 29 (see Figure 2 )Thereafter, the substrate W is transferred to the substrate mounting portion PS1B.

[0277] The present invention can be embodied in other specific forms without departing from the spirit or essence thereof and, therefore, reference should be made to the appended claims rather than to the foregoing description as indicating the scope of the invention.

[0278] [Explanation of Symbols]

[0279] 1 Substrate processing device

[0280] 2 1st loading block (1st ID block)

[0281] 3 Processing Blocks

[0282] 3A~3H Treatment layer

[0283] 4 2nd loading block (2nd ID block)

[0284] 8 Carrier buffer device

[0285] 9, 10, 45, 46 opening mechanism

[0286] 13, 47 loading platform

[0287] 28 Liquid Handling Department

[0288] 29 Heat Treatment Department

[0289] BARC coating unit

[0290] RESIST coating unit

[0291] DEV Development Unit

[0292] 51 Carrier transport mechanism

[0293] 79 Control Department

[0294] 81 Cleaning unit

Claims

1. A substrate processing device for processing a substrate, comprising the following elements: The first loading block is provided with a first carrier mounting table, and the first carrier mounting table is used to mount a carrier capable of accommodating a plurality of substrates; A single processing block connected to the first loading block and having a plurality of processing layers arranged in a vertical direction; and a second loading block connected to the single processing block and provided with a second carrier mounting table for mounting the carrier; The first loading block takes out a substrate from the carrier mounted on the first carrier mounting table, and transports the taken-out substrate to a first processing layer among the plurality of processing layers. The first processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block transfers the transferred substrate to the second processing layer among the plurality of processing layers. The second processing layer performs specific processing on the transferred substrate and transfers the substrate to the first loading block. The first loading block transfers the transferred substrate to a third processing layer among the plurality of processing layers. The third processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block moves the substrate processed by the third processing layer back to the carrier mounted on the second carrier mounting table.

2. The substrate processing apparatus according to claim 1, further comprising a carrier transport mechanism, The carrier transport mechanism transports the carrier between the first carrier mounting platform and the second carrier mounting platform.

3. The substrate processing apparatus according to claim 2, wherein The carrier transport mechanism is mounted on the single processing block.

4. A substrate processing device for processing a substrate, comprising the following elements: The first loading block is provided with a first carrier mounting table, and the first carrier mounting table is used to mount a carrier capable of accommodating a plurality of substrates; A single processing block connected to the first loading block and having a plurality of processing layers arranged in a vertical direction; and a second loading block connected to the single processing block and provided with a second carrier mounting table for mounting the carrier; The first loading block takes out a substrate from the carrier mounted on the first carrier mounting table, and transports the taken-out substrate to a first processing layer among the plurality of processing layers. The first processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block transfers the transferred substrate to the second processing layer among the plurality of processing layers. The second processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block moves the substrate processed by the second processing layer back to the carrier mounted on the second carrier mounting table.

5. The substrate processing apparatus according to claim 4, wherein The second loading block transfers the substrate processed by the second processing layer to a third processing layer among the plurality of processing layers. The third processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block moves the substrate processed by the third processing layer back to the carrier mounted on the second carrier mounting table.

6. The substrate processing apparatus according to claim 5, wherein The second loading block is further configured to carry in and out the substrate to and from an external device. The second loading block carries out the substrate processed by the second processing layer to the external device. The second loading block carries in a substrate that has been subjected to a specific process by the external device from the external device, and transfers the carried-in substrate to a third processing layer among the plurality of processing layers.

7. The substrate processing apparatus according to claim 4, wherein The second loading block is further configured to carry in and out the substrate to and from an external device. The second loading block carries out the substrate processed by the first processing layer to the external device. The second loading block carries in a substrate that has been subjected to a specific process by the external device from the external device, and transfers the carried-in substrate to a second processing layer among the plurality of processing layers.

8. A substrate processing device for processing a substrate, comprising the following elements: The first loading block is provided with a first carrier mounting table, and the first carrier mounting table is used to mount a carrier capable of accommodating a plurality of substrates; A single processing block connected to the first loading block and having a plurality of processing layers arranged in a vertical direction; and a second loading block connected to the single processing block and provided with a second carrier mounting table for mounting the carrier; The first loading block takes out a substrate from the carrier mounted on the first carrier mounting table, and transports the taken-out substrate to a first processing layer among the plurality of processing layers. The first processing layer performs specific processing on the transferred substrate and transfers the substrate to the first loading block. The first loading block transfers the transferred substrate to a second processing layer among the plurality of processing layers. The second processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block moves the substrate processed by the second processing layer back to the carrier mounted on the second carrier mounting table.

9. The substrate processing apparatus according to claim 8, wherein The second loading block transfers the substrate processed by the second processing layer to a third processing layer among the plurality of processing layers. The third processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block moves the substrate processed by the third processing layer back to the carrier mounted on the second carrier mounting table.

10. The substrate processing apparatus according to claim 9, wherein The second loading block is further configured to carry in and out the substrate to and from an external device. The second loading block carries out the substrate processed by the second processing layer to the external device. The second loading block carries in a substrate that has been subjected to a specific process by the external device from the external device, and transfers the carried-in substrate to a third processing layer among the plurality of processing layers.

11. A substrate processing device for processing a substrate, comprising the following elements: The first loading block is provided with a first carrier mounting table, and the first carrier mounting table is used to mount a carrier capable of accommodating a plurality of substrates; A single processing block connected to the first loading block and having a plurality of processing layers arranged in a vertical direction; and a second loading block connected to the single processing block and provided with a second carrier mounting table for mounting the carrier; The first loading block takes out a substrate from the carrier mounted on the first carrier mounting table, and transports the taken-out substrate to a first processing layer among the plurality of processing layers. The first processing layer performs specific processing on the transferred substrate and transfers the substrate to the first loading block. The first loading block transfers the transferred substrate to a second processing layer among the plurality of processing layers. The second processing layer performs specific processing on the transferred substrate and transfers the substrate to the first loading block. The first loading block transfers the transferred substrate to a third processing layer among the plurality of processing layers. The third processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block moves the substrate processed by the third processing layer back to the carrier mounted on the second carrier mounting table.

12. A substrate processing device for processing a substrate, comprising the following elements: The first loading block is provided with a first carrier mounting table, and the first carrier mounting table is used to mount a carrier capable of accommodating a plurality of substrates; A single processing block connected to the first loading block and having a plurality of processing layers arranged in a vertical direction; and a second loading block connected to the single processing block and provided with a second carrier mounting table for mounting the carrier; The second loading block is further configured to carry in and out the substrate to and from an external device. The second loading block takes out a substrate from the carrier mounted on the second carrier mounting table and transfers the substrate to a first processing layer among the plurality of processing layers. The first processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block carries out the substrate processed by the first processing layer to the external device. The second loading block carries in a substrate that has been subjected to a specific process by the external device from the external device, and carries the carried-in substrate to a second processing layer among the plurality of processing layers. The second processing layer performs specific processing on the transferred substrate and transfers the substrate to the first loading block. The first loading block moves the substrate processed by the second processing layer back to the carrier mounted on the first carrier mounting table.

13. A substrate processing device for processing a substrate, comprising the following elements: The first loading block is provided with a first carrier mounting table, and the first carrier mounting table is used to mount a carrier capable of accommodating a plurality of substrates; A single processing block connected to the first loading block and having a plurality of processing layers arranged in a vertical direction; and a second loading block connected to the single processing block and provided with a second carrier mounting table for mounting the carrier; The second loading block is further configured to carry in and out the substrate to and from an external device. The second loading block takes out a substrate from the carrier mounted on the second carrier mounting table and transfers the substrate to a first processing layer among the plurality of processing layers. The first processing layer performs specific processing on the transferred substrate and transfers the substrate to the first loading block. The first loading block transfers the transferred substrate to a second processing layer among the plurality of processing layers. The second processing layer performs specific processing on the transferred substrate and transfers the substrate to the second loading block. The second loading block carries out the substrate processed by the second processing layer to the external device. The second loading block carries in a substrate that has been subjected to a specific process by the external device from the external device, and carries the carried-in substrate to a third processing layer among the plurality of processing layers. The third processing layer performs specific processing on the transferred substrate and transfers the substrate to the first loading block. The first loading block moves the substrate processed by the third processing layer back to the carrier mounted on the first carrier mounting table.

14. A substrate transfer method, which is a substrate transfer method of a substrate processing apparatus having the following components, wherein the components are: a first loading block having a first carrier mounting table, the first carrier mounting table being used to mount a carrier capable of accommodating a plurality of substrates; and A single processing block is connected to the first loading block and has a plurality of processing layers arranged in a vertical direction; and the substrate transfer method includes the following steps: Using the first loading block, taking out a substrate from the carrier mounted on the first carrier mounting table, and transferring the taken out substrate to a first processing layer among the plurality of processing layers; Using the first processing layer, a specific process is performed on the conveyed substrate, and the substrate is transported to a second loading block connected to the single processing block; Using the second loading block, the transferred substrate is transferred to a second processing layer among the plurality of processing layers; Using the second processing layer, a specific process is performed on the transferred substrate, and the substrate is transferred to the first loading block; Using the first loading block, the transferred substrate is transferred to a third processing layer among the plurality of processing layers; Using the third processing layer, performing specific processing on the transferred substrate, and transferring the substrate to the second loading block; and The substrate processed by the third processing layer is moved back to the carrier mounted on the second carrier mounting table provided on the second loading block by the second loading block.

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