The invention relates to the technical field of backlight substrate treatment, in particular to a Mini LED backlight substrate
cutting method which comprises the following steps that S1, a backlight substrate is pretreated, the edge of the upward face of the backlight substrate is subjected to
coating treatment, and the pretreated backlight substrate is placed on a
cutting device; s2, the
coating face of the backlight substrate is moved into the sealed
cutting space, when the backlight substrate is moved to the position below a
laser cutter, the position of the
coating is detected through a
detector, the shape of the backlight substrate is determined, and a
numerical control system finds out a corresponding cutting mode; and S3, the backlight substrate is fixed to the cutting area, then the
laser cutter is controlled to move through the
numerical control system, cutting treatment is conducted on the backlight substrate, and meanwhile protective gas is sprayed out of the two sides of the
laser cutter to conduct cutting protection. According to the cutting device, cutting
modes of different specifications can be rapidly adjusted, and the cutting efficiency of the backlight substrate is improved.