A circuit board according to an embodiment includes an insulating layer; and a lead pattern portion provided in the insulating layer, wherein the lead pattern portion includes a first portion provided in the insulating layer, a second portion extending from one end of the first portion, and a third portion connected to the first portion through the second portion and having a via, the first portion is provided to overlap the insulating layer in a vertical direction, the second and third portions are provided at an outside of the insulating layer and do not overlap the insulating layer, and the lead pattern portion has a center line average roughness in a range of 0.05 μm to 0.5 μm or a 10-point average roughness in a range of 1.0 μm to 5.0 μm.