Substrate processing device and substrate transport method

Abstract

The present invention relates to a substrate processing device and a substrate conveying method. A carrier (13) is provided on the first ID block (2), and a carrier (47) is provided on the second ID block (4). In the past, only the first ID block (2) was provided with a carrier carrier. Therefore, in both the outgoing and return paths, the substrate is conveyed between the first ID block (2) and the IF block (6). According to the present invention, in the return path, the substrate is not conveyed from the IF block (6) to the first ID block (2), but is conveyed to the second ID block (4) arranged between the coating block (3) and the developing block (5). Therefore, in the return path, the conveying process performed by the coating block (3) arranged between the first ID block (2) and the second ID block (4) is reduced. As a result, the overall processing capacity of the substrate processing device (1) can be increased.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate and a method for conveying the substrate. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like. Background Art

[0002] Conventional substrate processing apparatuses include a loading block (hereinafter referred to as an “ID block” as appropriate), a coating block, a developing block, and an interface block (hereinafter referred to as an “IF block” as appropriate) in this order (see, for example, Japanese Patent Application Laid-Open No. 2010-219434).

[0003] The ID block is provided with a carrier stage. The ID block takes out a substrate from a carrier placed on the carrier stage and transports the taken-out substrate to a coating block. The coating block performs a coating process such as a resist. The developing block performs a developing process on the exposed substrate. The IF block carries out and carries in substrates for the exposure device.

[0004] In addition, the substrate processing apparatus includes a storage device (carrier buffer device) (see, for example, Japanese Patent Application Laid-Open No. 2011-187796). The storage device includes a storage rack for storing carriers and a carrier transfer mechanism. Summary of the invention

[0005] [Problems to be solved by the invention]

[0006] However, the substrate processing device has the following problems. The substrate processing device transports the substrate in the order of ID block, coating block, developing block, and IF block (outbound path). At this time, the coating block performs coating treatment on the substrate, but the developing block does not perform developing treatment on the substrate. In addition, the substrate processing device transports the exposed substrate in the order of IF block, developing block, coating block, and ID block (return path). At this time, the coating block does not perform coating treatment on the substrate, but the developing block performs developing treatment on the substrate. This reciprocating substrate transportation between the ID block and the IF block is accompanied by a process of simply passing the substrate through the block without processing. Therefore, there is a concern that the processing capacity of each of the outbound path and the return path will be reduced.

[0007] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus and a substrate transfer method capable of improving the processing throughput.

[0008] [Technical means to solve the problem]

[0009] In order to achieve this object, the present invention adopts the following structure. That is, the substrate processing device for processing substrates of the present invention includes the following elements: a plurality of processing blocks arranged in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; an interface block connected to a processing block at the other end of the plurality of processing blocks and for carrying in and out substrates for an external device that performs a preset processing; and a second loading block arranged between two processing blocks among the plurality of processing blocks and provided with a second carrier mounting table for mounting the carrier; the first loading block takes out a substrate from the carrier mounted on the first carrier mounting table and transports the taken-out substrate to the processing block at the one end, and the plurality of processing blocks and the second loading block transport the substrate transported from the first loading block to the interface block via the second loading block, and after the substrate is transported from the processing block at the one end to the interface block, When the processing block at one end is transported to the interface block, the processing block arranged between the first loading block and the second loading block performs a preset process on the transported substrate, the interface block moves the transported substrate out to the external device, the interface block moves in the substrate that has been subjected to a preset process by the external device from the external device, and transports the moved-in substrate to the processing block at the other end, the processing block arranged between the second loading block and the interface block among the multiple processing blocks transports the substrate transported from the interface block from the processing block at the other end to the second loading block, and when the substrate is transported from the processing block at the other end to the second loading block, the processing block arranged between the second loading block and the interface block performs a preset process on the transported substrate, and the second loading block moves the transported substrate back to the carrier mounted on the second carrier mounting table.

[0010] According to the substrate processing device of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, only the carrier stage was provided on the first loading block. Therefore, in both the outward and return paths, the substrate is transported between the first loading block and the interface block. According to the present invention, in the return path, the substrate is not transported from the interface block to the first loading block, but is transported to the second loading block arranged between the two processing blocks. Therefore, in the return path, the transport process using the processing block arranged between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0011] In the substrate processing device, it is preferred that the plurality of processing blocks include a first processing block for performing a first processing and a second processing block for performing a second processing, the first loading block is connected to the first processing block, the first processing block is connected to the second loading block, the second loading block is connected to the second processing block, the second processing block is connected to the interface block, the interface block carries in and out substrates for an external device that carries out a third processing, the first loading block takes out a substrate from the carrier mounted on the first carrier mounting table and transports the taken-out substrate to the first processing block, the first processing block performs the first processing on the substrate transported from the first loading block, and transports the substrate that has undergone the first processing to The second loading block transfers the substrate transferred from the first processing block to the second processing block, the second processing block transfers the substrate transferred from the second loading block to the interface block, the interface block moves the substrate transferred from the second processing block to the external device, the interface block moves the substrate that has undergone the third processing from the external device and transfers the moved-in substrate to the second processing block, the second processing block performs the second processing on the substrate that has undergone the third processing and transfers the substrate that has undergone the second processing to the second loading block, and the second loading block moves the substrate that has undergone the second processing back to the carrier placed on the second carrier stage.

[0012] According to the substrate processing device of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, only the carrier stage was provided on the first loading block. Therefore, in both the outward and return paths, the substrate is transported between the first loading block and the interface block. According to the present invention, in the return path, the substrate is not transported from the interface block to the first loading block, but is transported to the second loading block arranged between the first processing block and the second processing block. Therefore, in the return path, the transport process using the first processing block arranged between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0013] In addition, the substrate processing device of the present invention for processing substrates includes the following elements: a plurality of processing blocks arranged in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; an interface block connected to a processing block at the other end of the plurality of processing blocks and for carrying in and out substrates for an external device performing a preset processing; and a second loading block arranged between two processing blocks among the plurality of processing blocks and provided with a second carrier mounting table for mounting the carrier; the second loading block removes a substrate from the carrier mounted on the second carrier mounting table and transports the removed substrate to an adjacent processing block adjacent to the interface block side of the second loading block, and the processing block among the plurality of processing blocks arranged between the second loading block and the interface block transports the substrate transported from the second loading block from the adjacent processing block The substrate is transported to the interface block, and when the substrate is transported from the adjacent processing block to the interface block, the processing block arranged between the second loading block and the interface block performs a preset process on the transported substrate, the interface block moves the transported substrate out to the external device, the interface block moves in the substrate that has been subjected to a preset process by the external device from the external device, and transports the moved-in substrate to the processing block at the other end, the multiple processing blocks and the second loading block transport the substrate transported from the interface block via the second loading block from the processing block at the other end to the first loading block, and when the substrate is transported from the processing block at the other end to the first loading block, the processing block arranged between the first loading block and the second loading block performs a preset process on the transported substrate, and the first loading block moves the transported substrate back to the carrier mounted on the first carrier mounting table.

[0014] According to the substrate processing device of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, only the first loading block was provided with a carrier stage. Therefore, in both the outgoing and return paths, the substrate is transported between the first loading block and the interface block. According to the present invention, in the outgoing path, the substrate is not transported from the first loading block to the interface block, but is transported from the second loading block disposed between the two processing blocks. Therefore, in the outgoing path, the transport process performed by the processing block disposed between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0015] In addition, in the substrate processing device, the plurality of processing blocks include a first processing block for performing a first processing and a second processing block for performing a second processing, the first loading block is connected to the first processing block, the first processing block is connected to the second loading block, the second loading block is connected to the second processing block, the second processing block is connected to the interface block, the interface block carries in and out substrates for an external device that carries out a third processing, the second loading block takes out a substrate from the carrier mounted on the second carrier mounting table and transports the taken-out substrate to the second processing block, the second processing block performs the second processing on the substrate transported from the second loading block, and transports the substrate subjected to the second processing to the interface block , the interface block moves the substrate that has undergone the second process out to the external device, the interface block moves the substrate that has undergone the third process in from the external device, and transports the substrate that has undergone the third process to the second process block, the second process block transports the substrate that has undergone the third process to the second loading block, the second loading block transports the substrate that has undergone the third process to the first process block, the first process block performs the first process on the substrate that has been transported from the second loading block and has undergone the third process, and transports the substrate that has undergone the first process to the first loading block, and the first loading block moves the substrate that has undergone the first process back to the carrier mounted on the first carrier mounting table.

[0016] According to the substrate processing device of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, the carrier stage was provided only on the first loading block. Therefore, in both the outgoing and return paths, the substrate is transported between the first loading block and the interface block. According to the present invention, in the outgoing path, the substrate is not transported from the first loading block to the interface block, but is transported from the second loading block disposed between the first processing block and the second processing block. Therefore, in the outgoing path, the transport process using the first processing block disposed between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0017] In addition, in the substrate processing device, preferably, the first processing block has a plurality of first processing layers arranged in an up and down direction, and the second processing block has a single second processing layer or a plurality of second processing layers arranged in an up and down direction, and the number of the first processing layers is greater than the number of the second processing layers.

[0018] In the case where the number of substrate transfer steps of the first processing layer is greater than that of the second processing layer, if the number of the first processing layer and the number of the second processing layer are the same, there is a concern that the standby time of the second processing layer will be longer. Therefore, by making the number of the first processing layer greater than the number of the second processing layer, the substrate processing capacity of the entire first processing layer (the first processing block) can be improved. In addition, the second loading block is arranged between the first processing block and the second processing block. Therefore, even if the number of the first processing layer and the number of the second processing layer are different, the substrate can be transported to each processing layer.

[0019] Furthermore, in the substrate processing apparatus, it is preferred that the first processing block is a coating block that performs coating processing, the second processing block is a developing block that performs developing processing, and the external device is an exposure device that performs exposure processing.

[0020] Thus, the number of coating treatment layers of the coating block can be greater than the number of developing treatment layers of the developing block. In an actual substrate processing device, the number of substrate conveying processes of the coating treatment layer is greater than the number of substrate conveying processes of the developing treatment layer. Therefore, the substrate processing capacity of the entire coating treatment layer (coating block) can be improved.

[0021] In addition, in the substrate processing device, the first processing block preferably has a single first processing layer or a plurality of first processing layers arranged in an up and down direction, and the second processing block has a plurality of second processing layers arranged in an up and down direction, and the number of the second processing layers is greater than the number of the first processing layers.

[0022] In the case where the number of substrate transfer steps of the second processing layer is greater than that of the first processing layer, if the number of the first processing layer and the second processing layer is the same, there is a concern that the standby time of the first processing layer will be longer. Therefore, by making the number of the second processing layer greater than the number of the first processing layer, the substrate processing capacity of the second processing layer as a whole (the second processing block) can be improved. In addition, the second loading block is arranged between the first processing block and the second processing block. Therefore, even if the number of the first processing layer and the second processing layer is different, the substrate can be transported to each processing layer.

[0023] In addition, the substrate processing apparatus preferably further includes a carrier transfer mechanism that transfers the carrier between the first carrier stage and the second carrier stage. For example, when all substrates are taken out from the carrier mounted on the first carrier stage, the carrier transfer mechanism returns the substrates to the carrier, so that the carrier mounted on the first carrier stage can be transferred to the second carrier stage.

[0024] In addition, in the substrate processing device, it is preferred that the carrier transport mechanism is mounted on the first processing block. In the past, the carrier transport mechanism was arranged in a horizontal direction relative to the loading block. According to the present invention, the carrier transport mechanism is arranged on the first processing block. Therefore, the installation area of ​​the conventional carrier transport mechanism arranged in a horizontal direction relative to the loading block can be reduced. That is, the occupied area of ​​the substrate processing device can be reduced.

[0025] In addition, the substrate transfer method of the substrate processing apparatus of the present invention has the following steps. The substrate processing apparatus comprises: a plurality of processing blocks arranged in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and an interface block connected to a processing block at the other end of the plurality of processing blocks and carrying in and out substrates for an external device that performs a preset process. The process refers to: using the first loading block to take out the substrate from the carrier placed on the first carrier stage, and transporting the taken-out substrate to the processing block at the one end; using the plurality of processing blocks and the second loading block arranged between two of the plurality of processing blocks, transporting the substrate transported from the first loading block to the interface block from the processing block at the one end via the second loading block; when transporting the substrate from the processing block at the one end to the interface block, using the processing block arranged between the first loading block and the second loading block to perform a preset process on the transported substrate; using the interface block to move the transported substrate out to the external device; using the interface block to carry out the transported substrate to the external device; using the interface block to carry out the transported substrate to the external device; using the interface block to carry out the transported substrate to the external device; using the interface block to carry out the transported substrate to the external device; using the interface block to carry out the transported substrate to the external device; using the interface block to carry out the transported substrate to the external device. The port block carries in a substrate that has been subjected to a preset process by the external device, and transports the carried-in substrate to the processing block at the other end; uses a processing block arranged between the second loading block and the interface block among the multiple processing blocks to transport the substrate transported from the interface block from the processing block at the other end to the second loading block; when transporting the substrate from the processing block at the other end to the second loading block, uses the processing block arranged between the second loading block and the interface block to perform a preset process on the transported substrate; and uses the second loading block to move the transported substrate back to the carrier mounted on the second carrier mounting table provided on the second loading block.

[0026] According to the substrate transport method of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, only the carrier stage was provided on the first loading block. Therefore, in both the outward and return paths, the substrate is transported between the first loading block and the interface block. According to the present invention, in the return path, the substrate is not transported from the interface block to the first loading block, but is transported to the second loading block arranged between the two processing blocks. Therefore, in the return path, the transport process using the processing block arranged between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0027] In addition, the substrate conveying method of the substrate processing device of the present invention includes the following steps: the substrate processing device comprises: a plurality of processing blocks arranged in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and an interface block connected to a processing block at the other end of the plurality of processing blocks for carrying in and out substrates for an external device that performs a predetermined process. The steps are: using a second loading block arranged between two processing blocks among the plurality of processing blocks, taking out a substrate from the carrier mounted on a second carrier mounting table provided on the second loading block, and conveying the taken-out substrate to an adjacent processing block adjacent to the interface block side of the second loading block; using a processing block arranged between the second loading block and the interface block among the plurality of processing blocks, conveying the substrate conveyed from the second loading block from the adjacent processing block to the interface block; after conveying the substrate from the adjacent processing block to the interface block When the substrate is transported, a processing block arranged between the second loading block and the interface block is used to perform a preset processing on the transported substrate; the interface block is used to carry out the transported substrate to the external device; the interface block is used to carry in the substrate that has been subjected to a preset processing by the external device from the external device, and the transported substrate is transported to the processing block at the other end; the plurality of processing blocks and the second loading block are used to transport the substrate transported from the interface block to the first loading block via the second loading block;

[0028] When the substrate is transported from the processing block at the other end to the first loading block, the transported substrate is subjected to a predetermined process by using the processing block arranged between the first loading block and the second loading block; and the transported substrate is moved back to the carrier placed on the first carrier stage by using the first loading block.

[0029] According to the substrate transport method of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, only the carrier stage was provided on the first loading block. Therefore, in both the outgoing and return paths, the substrate is transported between the first loading block and the interface block. According to the present invention, in the outgoing path, the substrate is not transported from the first loading block to the interface block, but is transported from the second loading block disposed between the two processing blocks. Therefore, in the outgoing path, the transport process performed by the processing block disposed between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0030] [Effects of the Invention]

[0031] According to the substrate processing apparatus and substrate transfer method of the present invention, the processing throughput can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Several embodiments currently considered to be preferred are shown in the drawings for the purpose of illustrating the invention, but it should be understood that the invention is not limited to the configurations and embodiments shown in the drawings.

[0033] Figure 1 This is a longitudinal sectional view of the substrate processing apparatus of Example 1.

[0034] Figure 2 It is a cross-sectional view of the substrate processing apparatus of Example 1.

[0035] Figure 3 It is a right side view of the substrate processing apparatus of Example 1.

[0036] Figure 4 It is a left side view of the substrate processing apparatus of Example 1.

[0037] Figure 5 It is a diagram showing a carrier transport mechanism.

[0038] Figure 6 It is a diagram showing a carrier buffer device.

[0039] Figure 7 It is a diagram for explaining the operation of a conventional substrate processing apparatus.

[0040] Figure 8 This is a diagram for explaining the operation of the substrate processing apparatus according to the first embodiment.

[0041] Fig. 9 It is a right side view of the substrate processing apparatus of Example 2.

[0042] Fig.10 This is a diagram for explaining the operation of the substrate processing apparatus of Example 2.

[0043] Fig.11It is a right side view of the substrate processing apparatus of Example 3.

[0044] Fig.12 This is a diagram for explaining the operation of the substrate processing apparatus of Example 3.

[0045] Fig.13 This is a diagram for explaining the structure and operation of the substrate processing apparatus of Example 4.

[0046] Fig.14 It is a diagram for explaining the structure and operation of the substrate processing apparatus according to a modified example.

[0047] Fig.15 It is a diagram for explaining the structure and operation of a substrate processing apparatus according to another modified example.

[0048] Fig.16 It is a diagram showing a substrate transfer mechanism and a mounting table of a substrate processing apparatus according to another modified example.

[0049] Fig.17 It is a diagram for explaining the structure and operation of a substrate processing apparatus according to another modified example.

[0050] Fig.18 It is a diagram for explaining the structure and operation of a substrate processing apparatus according to another modified example. DETAILED DESCRIPTION

[0051] [Example 1]

[0052] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 This is a longitudinal sectional view of the substrate processing apparatus of Example 1. Figure 2 is a cross-sectional view of a substrate processing apparatus. Figure 3 It is a right side view of the substrate processing apparatus. Figure 4 It is a left side view of the substrate processing apparatus.

[0053] <Configuration of substrate processing apparatus 1>

[0054] Reference Figure 1 or Figure 2 The substrate processing device 1 includes a first loading block (first ID block) 2, a coating block 3, a second loading block (second ID block) 4, a developing block 5, an interface block (IF block) 6, and a carrier buffer device 8. The exposure device EXP is arranged adjacent to the IF block 6. The first ID block 2, the coating block 3, the second ID block 4, the developing block 5, the IF block 6, and the exposure device EXP are arranged in a straight line in the horizontal direction (X direction).

[0055] In this embodiment, the coating block 3 corresponds to the first processing block of the present invention. The developing block 5 corresponds to the second processing block of the present invention. In addition, the exposure device EXP corresponds to the external device of the present invention.

[0056] (Configuration of the first loading block 2)

[0057] The first ID block 2 has two opening mechanisms 9 and 10 (see Figure 6 ) and two substrate transfer mechanisms TM1, TM2. Two opening mechanisms (carrier placement units) 9, 10 provided in the first ID block 2 are provided with carriers C capable of storing a plurality of substrates W, respectively.

[0058] The carrier C can store multiple (e.g., 25) substrates W in a horizontal position. The carrier C uses, for example, a FOUP (Front Open Unified Pod), but may also be a container other than a FOUP (e.g., a SMIF (Standard Mechanical Interface Face) box). The carrier C includes, for example, a carrier body having an opening for inserting and removing the substrates W, and a cover for covering the opening of the carrier body.

[0059] Each opening mechanism 9, 10 includes: a stage 13 for placing the carrier C; an opening 14 for allowing the substrate W to pass through; a shutter member (not shown) for opening and closing the opening 14 and attaching and detaching the cover to the carrier body; and a shutter member driving mechanism (not shown) for driving the shutter member. The shutter member driving mechanism includes an electric motor. In addition, after the cover is removed from the carrier body, the shutter member moves, for example, downward or in the horizontal direction (Y direction) along the opening 14.

[0060] The mounting platforms 13 of the two opening mechanisms 9 and 10 are arranged on the top platform of the coating block 3. Figure 1 In the embodiment, the mounting table 13 is provided at a position higher than the coating block 3, that is, above the coating block 3. The mounting table 13 may also be provided on the coating block 3, that is, provided in contact with the coating block 3. In addition, the mounting table 13 corresponds to the first carrier mounting table of the present invention.

[0061] Each substrate transport mechanism TM1, TM2 includes two hands 15, an advance / retract drive unit 16, and an elevation / rotation drive unit 18. The two hands 15 hold substrates W, respectively. In addition, the two hands 15 are movably mounted on the advance / retract drive unit 16, respectively. The advance / retract drive unit 16 can cause both of the two hands 15 to enter the carrier C at the same time. In addition, the advance / retract drive unit 16 can cause the two hands 15 to advance / retract, respectively. Therefore, the advance / retract drive unit 16 can cause one of the two hands 15 to enter the carrier C.

[0062] The lifting and rotating driving unit 18 lifts and rotates the two hands 15 by lifting and rotating the advance and retreat driving unit 16. That is, the lifting and rotating driving unit 18 can move the advance and retreat driving unit 16 up and down (Z direction), and can rotate the advance and retreat driving unit 16 around the vertical axis AX1. The advance and retreat driving unit 16 and the lifting and rotating driving unit 18 each include, for example, an electric motor. In addition, each substrate transport mechanism TM1, TM2 is fixed to the bottom of the first ID block 2 in a manner that it cannot move in the horizontal direction (especially the Y direction). In addition, the number of hands 15 can be, for example, 1, or 3 or more.

[0063] A substrate transfer buffer SBF1 is provided between the first ID block 2 and the upper coating treatment layer 3A described below of the coating block 3. A substrate transfer buffer SBF2 is provided between the first ID block 2 and the lower coating treatment layer 3B described below of the coating block 3. The two substrate transfer buffers SBF1 and SBF2 are respectively configured to be able to carry a plurality of substrates W.

[0064] The first substrate transport mechanism TM1 transports the substrate W from the carrier C mounted on the mounting table 13 of the opening mechanism 9 to one of the two transport substrate buffers SBF1 and SBF2. In addition, the second substrate transport mechanism TM2 transports the substrate W from the carrier C mounted on the mounting table 13 of the opening mechanism 10 to one of the two transport substrate buffers SBF1 and SBF2. The two substrate transport mechanisms TM1 and TM2 alternately transport the substrate W to the two transport substrate buffers SBF1 and SBF2.

[0065] The first substrate transport mechanism TM1 can take out a substrate W from the carrier C of the opening mechanism 9, but cannot take out a substrate W from the carrier C of the opening mechanism 10. The second substrate transport mechanism TM2 can take out a substrate W from the carrier C of the opening mechanism 10, but cannot take out a substrate W from the carrier C of the opening mechanism 9.

[0066] (Configuration of Coating Block 3 and Developing Block 5)

[0067] The coating block 3 is connected to the first ID block 2. The coating block 3 performs coating processing. In addition, the developing block 5 is connected to the second ID block 4. The developing block 5 performs developing processing.

[0068] The coating block 3 includes two (plural) coating treatment layers 3A and 3B arranged in the vertical direction (Z direction). The developing block 5 includes two (plural) developing treatment layers 5A and 5B arranged in the vertical direction. The four treatment layers 3A, 3B, 5A, and 5B each include a third substrate transport mechanism TM3 and a transport space 20 (see Figure 2 ), liquid treatment section 22 and heat treatment section 23.

[0069] The third substrate transport mechanism TM3 transports the substrate W between the processing layers 3A, 3B, 5A, and 5B. The third substrate transport mechanism TM3 includes two hands 24 , an advance / retract drive unit 25 , a rotation drive unit 26 , a first moving mechanism 27 , and a second moving mechanism 28 .

[0070] The two hands 24 hold the substrate W respectively. The two hands 24 are movably mounted on the advance / retract drive unit 25. The advance / retract drive unit 25 makes the two hands 24 advance / retract respectively. The rotation drive unit 26 rotates the advance / retract drive unit 25 around the vertical axis AX2. Thus, the orientation of the two hands 24 can be changed. The first moving mechanism 27 makes the rotation drive unit 26 move in a certain direction. Figure 1 The second moving mechanism 28 moves the first moving mechanism 27 in the front-rear direction (X direction). Thus, the advance-retract drive unit 25 can be moved in the X direction. The second moving mechanism 28 moves the first moving mechanism 27 in the up-down direction (Z direction). Thus, the advance-retract drive unit 25 can be moved in the Z direction.

[0071] Furthermore, the forward / retractable driving unit 25 , the rotation driving unit 26 , the first moving mechanism 27 , and the second moving mechanism 28 each include an electric motor.

[0072] like Figure 2 As shown, the third substrate transfer mechanism TM3 is provided in the transfer space 20. The transfer space 20 is configured to extend linearly in the horizontal direction (X direction). When viewed from above the substrate processing apparatus 1, the transfer space 20 is rectangular. The liquid processing unit 22 and the heat treatment unit 23 are arranged so as to sandwich the transfer space 20.

[0073] Figure 3 It is a right side view showing the configuration of the liquid processing unit 22 of the coating block 3 and the developing block 5. The two coating processing layers 3A and 3B are respectively provided with four liquid processing units 22. These four liquid processing units 22 are arranged in a manner of 2 rows in the horizontal direction and 2 layers in the vertical direction in 2 rows × 2 layers. The two liquid processing units 22 in the lower layer of the four liquid processing units 22 are coating units BARC. In addition, the two liquid processing units 22 in the upper layer are coating units RESIST. The coating unit BARC forms an antireflection film on the substrate W. The coating unit RESIST forms a resist film such as a photoresist on the substrate W.

[0074] In addition, the two development processing layers 5A and 5B each include three liquid processing units 22. The three liquid processing units 22 are arranged in 3 rows × 1 layer. The two development processing layers 5A and 5B are each configured so that the liquid processing units 22 can be arranged in 3 rows × 2 layers. The three liquid processing units 22 are development units DEV. The development unit DEV develops the substrate W after exposure.

[0075] like Figure 2As shown, the liquid processing unit 22 includes a holding and rotating unit 31, a nozzle 32, and a nozzle moving mechanism 33. The holding and rotating unit 31 holds the substrate W by vacuum adsorption, for example, and rotates the held substrate W around a vertical axis (Z direction). The rotation is performed by, for example, an electric motor. The nozzle 32 supplies a coating liquid (for example, a liquid for forming an anti-reflective film or a photoresist liquid) or a developer to the substrate W. The nozzle moving mechanism 33 moves the nozzle 32 to an arbitrary position. The nozzle moving mechanism 33 includes, for example, an electric motor.

[0076] Figure 4 3 is a diagram showing the arrangement of the heat treatment unit 23 of the coating block 3 and the developing block 5. The four processing layers 3A, 3B, 5A, and 5B each include a plurality of heat treatment units 23. The heat treatment unit 23 performs heat treatment and includes a plate 35 (see FIG. 3 ) on which the substrate W is placed. Figure 2 The flat plate 35 is heated by, for example, a heater, and the flat plate 35 is cooled by, for example, a water-cooling mechanism.

[0077] In the two coating treatment layers 3A and 3B, the heat treatment sections 23 are configured to be arranged in 3 rows x 5 layers. Figure 4 In the embodiment, the two coating treatment layers 3A and 3B each include 14 heat treatment sections 23. That is, the two coating treatment layers 3A and 3B each include 3 adhesion strengthening treatment sections PAHP, 2 cooling sections CP, and 9 heating and cooling sections PHP.

[0078] In addition, in the two development processing layers 5A and 5B, the heat treatment unit 23 is configured to be arranged in 4 rows × 5 layers. The two development processing layers 5A and 5B are respectively equipped with 1 cooling unit CP, 12 heating and cooling units PHP, and 1 edge exposure unit EEW. In addition, in the coating block 3, the developing block 5, and the IF block 6, the number and type of processing units other than the liquid processing unit 22 and the heat treatment unit 23 can be appropriately changed.

[0079] The adhesion enhancement treatment section PAHP improves the adhesion between the substrate W and the anti-reflection film by applying an adhesion enhancement agent such as hexamethyldisilazane (HMDS) on the substrate W and heating it. The adhesion enhancement treatment section PAHP also has the function of cooling the substrate W after heating. The cooling section CP cools the substrate W. The heating and cooling section PHP performs heating and cooling processes in sequence. The edge exposure section EEW performs exposure processing on the peripheral portion of the substrate W.

[0080] (Configuration of the Second Loading Block 4)

[0081] like Figure 1 As shown, the second ID block 4 is connected to the coating block 3, and the second ID block 4 is connected to the developing block 5. That is, the second ID block 4 is arranged between the coating block 3 and the developing block 5.

[0082] The second ID block 4 has two opening mechanisms 45 and 46 (see Figure 6 ) and two substrate transfer mechanisms TM4, TM5. Two opening mechanisms 45, 46 provided in the second ID block 4 are provided with carriers C capable of accommodating a plurality of substrates W, respectively.

[0083] Each of the opening mechanisms 45 and 46 includes, similarly to the opening mechanism 9, a stage 47 for placing the carrier C, an opening 48 for allowing the substrate W to pass through, a shutter member (not shown) for opening and closing the opening 48 and for attaching and detaching the cover of the carrier body, and a shutter member driving mechanism for driving the shutter member. The shutter member driving mechanism includes an electric motor. In addition, after the cover is removed from the carrier body, the shutter member moves, for example, downward or in the horizontal direction along the opening 48.

[0084] The mounting table 47 is disposed on the top platform of the coating block 3. Figure 1 In the embodiment, the mounting table 47 is provided at a position higher than the coating block 3, that is, above the coating block 3. The mounting table 47 may also be provided on the coating block 3, that is, provided in contact with the coating block 3. In addition, the mounting table 47 corresponds to the second carrier mounting table of the present invention.

[0085] Each of the substrate transport mechanisms TM4 and TM5 includes two hands 15, an advance / retreat drive unit 16, and an elevation / rotation drive unit 18. Each of the substrate transport mechanisms TM4 and TM5 has the same configuration as the substrate transport mechanism TM1 (TM2).

[0086] A substrate placement part PS1 is provided between the upper coating treatment layer 3A and the second ID block 4. A substrate placement part PS2 is provided between the lower coating treatment layer 3B and the second ID block 4. A substrate placement part PS3 and a substrate return buffer part RBF3 are provided between the second ID block 4 and the upper development treatment layer 5A. In addition, a substrate placement part PS4 and a substrate return buffer part RBF4 are provided between the second ID block 4 and the lower development treatment layer 5B.

[0087] The fourth substrate transport mechanism TM4 transports the substrate W between the four substrate mounting portions PS1 to PS4, the two return substrate buffer portions RBF3 and RBF4, and the carrier C mounted on the mounting table 47 of the opening mechanism 45. The fourth substrate transport mechanism TM4 can also carry the substrate W mounted on the opening mechanism 45 (see Figure 6 ) to take out and store the substrate W, but it is impossible to take out and store the substrate W for the carrier C placed on the opening mechanism 46.

[0088] The fifth substrate transport mechanism TM5 transports the substrate W between the four substrate mounting portions PS1 to PS4, the two return substrate buffer portions RBF3 and RBF4, and the carrier C mounted on the mounting table 47 of the opening mechanism 46. The fifth substrate transport mechanism TM5 can also carry the substrate W mounted on the opening mechanism 46 (see Figure 6 ) to take out and store the substrate W, but it is impossible to take out and store the substrate W for the carrier C placed on the opening mechanism 45.

[0089] (Interface block (IF block) 6)

[0090] The IF block 6 is connected to the developing block 5. The IF block 6 carries in and carries out the substrate W to the exposure device EXP that performs the exposure process as the third process. The IF block 6 includes three substrate transport mechanisms TM6 to TM8, a plurality of pre-exposure cleaning units 161, a plurality of post-exposure cleaning units 162, three placement and cooling units P-CP, and a substrate placement unit PS9 (see Figure 1 to Figure 4 ).

[0091] The sixth substrate transport mechanism TM6 and the seventh substrate transport mechanism TM7 are arranged side by side in the Y direction orthogonal to the front-rear direction (X direction). The eighth substrate transport mechanism TM8 is arranged behind the two substrate transport mechanisms TM6 and TM7 ( Figure 1 on the right side of the substrate W). The pre-exposure cleaning unit 161 and the post-exposure cleaning unit 162 are arranged in a manner opposing each other with two substrate transport mechanisms TM6 and TM7 interposed therebetween. The pre-exposure cleaning unit 161 cleans and dries the substrate W before the exposure process. The post-exposure cleaning unit 162 cleans and dries the substrate W after the exposure process. Each of the cleaning units 161 and 162 includes: a holding rotating unit that holds the substrate W; and a nozzle that sprays, for example, a cleaning liquid and a rinse liquid onto the substrate W. In addition, each of the cleaning units 161 and 162 can also perform a polishing process on the back side and the end (inclined portion) of the substrate W using a brush or the like. In addition, the back side of the substrate W refers to, for example, the surface on the opposite side of the surface on which the circuit pattern is formed.

[0092] Three loading and cooling parts P-CP and substrate loading part PS9 are provided between three substrate transport mechanisms TM6 to TM8. The three loading and cooling parts P-CP and substrate loading part PS9 are arranged in the up-down direction. Between the upper development processing layer 5A and the IF block 6, a conveying substrate buffer part SBF5 and a substrate loading part PS5 are provided. Between the lower development processing layer 5B and the IF block 6, a conveying substrate buffer part SBF6 and a substrate loading part PS6 are provided.

[0093] The sixth substrate transfer mechanism TM6 can transfer the substrate W between two substrate transfer buffers SBF5 and SBF6 , three substrate placement parts PS5 , PS6 , and PS9 , three placement and cooling parts P-CP, and the pre-exposure cleaning unit 161 .

[0094] The seventh substrate transport mechanism TM7 can transport the substrate W between the two substrate transfer buffers SBF5 and SBF6, the three substrate placement units PS5, PS6, and PS9, the three placement and cooling units P-CP, and the post-exposure cleaning unit 162. In addition, the seventh substrate transport mechanism TM7 can transport the substrate W between the eight heating and cooling units PHP (see FIG. 1 ) arranged on the side of the IF block 6 in the vertical direction. Figure 2 , Figure 4 ) The substrate W is delivered and received directly without going through, for example, the substrate buffer SBF5 and the substrate placement part PS5.

[0095] The eighth substrate transport mechanism TM8 can transport the substrate W between the substrate mounting portion PS9, the three mounting and cooling portions P-CP, and the external exposure device EXP. The three substrate transport mechanisms TM6 to TM8 are respectively configured to be substantially the same as the first substrate transport mechanism TM1 (TM2), so the description thereof is omitted. In addition, the substrate mounting portions PS1 to PS6 and PS9 may be capable of mounting only one substrate W or a plurality of substrates W.

[0096] (Carrier buffer device 8)

[0097] The substrate processing apparatus 1 includes a carrier buffer device 8 on or above the first ID block 2, the coating block 3, and the second ID block 4. The carrier buffer device 8 includes a carrier transport mechanism 51 and a carrier storage rack 53 (see Figure 6 ).

[0098] Reference Figure 5 . Figure 5 : is a diagram showing a carrier transport mechanism 51. The carrier transport mechanism 51 includes two multi-joint arms 61 and 62. A holding portion 63 is provided at one end of the first multi-joint arm 61, and a holding portion 64 is provided at one end of the second multi-joint arm 62. In addition, the other end of the first multi-joint arm 61 is supported on a pillar-shaped lifting drive portion 65 so as to be movable in the vertical direction, and the other end of the second multi-joint arm 62 is supported on the lifting drive portion 65 so as to be movable in the vertical direction.

[0099] The two holding parts 63 and 64 are respectively configured to hold, for example, a protrusion provided on the upper surface of the carrier C. The two holding parts 63 and 64 are respectively provided with an electric motor.

[0100] The two multi-joint arms 61 and 62 are respectively equipped with one or more electric motors. The first multi-joint arm 61 is configured to be able to rotate the first holding portion 63 360 degrees around the vertical axis AX3. The second multi-joint arm 62 is configured in the same manner as the first multi-joint arm 61. For example, the first multi-joint arm 61 may be responsible for Figure 6 The second multi-joint arm 62 is responsible for transporting the carrier C on the upper side (opening mechanism 10, 46 side) Figure 6 The conveyance of carrier C on the lower side (opening mechanism 9, 45 side).

[0101] The lifting drive unit 65 is configured to be able to lift and lower the two multi-joint arms 61 and 62 individually. The lifting drive unit 65 includes an electric motor. The lifting drive unit 65 may include, for example, a belt and a plurality of pulleys for one multi-joint arm.

[0102] The front-rear drive unit 67 includes a support portion 67A that supports the lifting drive unit 65, a longitudinal portion 67B that extends long in the front-rear direction (X direction), and an electric motor (not shown). For example, the longitudinal portion 67B may be a track (guide rail), and the support portion 67A may be a trolley. In this case, it is also possible to configure the trolley (support portion 67A) to move along the track (longitudinal portion 67B) using an electric motor.

[0103] In addition, for example, an electric motor, a plurality of pulleys, a belt and a guide rail may be built into the longitudinal portion 67B, and the support portion 67A may be fixed to the belt. In this case, the pulley may be rotated by the electric motor to move the belts hung on the pulleys, thereby moving the support portion 67A along the guide rail.

[0104] Reference Figure 6 The carrier storage rack 53 has an input port 71, an output port 72, an unprocessed substrate carrier rack 73, an empty carrier rack 74, and a processed substrate carrier rack 75. The input port 71 is a rack for receiving a carrier C containing an unprocessed substrate W from an external transport mechanism OHT (Overhead Hoist Transport). The external transport mechanism OHT transports the carrier C within the factory. The so-called unprocessed means that the substrate has not been processed using the coating block 3 and the developing block 5. Figure 1 , Figure 6 As shown, the input port 71 is provided on the ID block 2, that is, on the top platform of the ID block 2. A rail 77 of the external transport mechanism OHT is provided above the ID block 2. The external transport mechanism OHT transports the carrier C to one of the two input ports 71.

[0105] In addition, Figure 6In the embodiment, the unprocessed substrate carrier rack 73, the empty carrier rack 74, and the processed substrate carrier rack 75 are arranged in the longitudinal direction of the substrate processing device 1 along the longitudinal portion 67B. The unprocessed substrate carrier rack 73 is for loading the unprocessed substrate W that cannot be transferred to either of the two loading tables 13, such as the unprocessed substrate carrier rack C. The unprocessed substrate carrier rack 73 is for loading the unprocessed substrate W that cannot be transferred to either of the two loading tables 13, such as the unprocessed substrate carrier rack C. The empty carrier rack 74 is for loading the unprocessed substrate W that cannot be transferred to either of the two loading tables 47, such as the unprocessed substrate carrier rack C. The processed substrate carrier rack 75 is for loading the unprocessed substrate W that cannot be transferred to either of the two output ports 72, such as the unprocessed substrate carrier rack C. In this embodiment, the so-called processed substrate carrier rack means that the substrate W has been processed by the coating block 3 and the developing block 5.

[0106] The output port 72 is a rack for delivering the carrier C containing the processed substrate W to the external transport mechanism OHT. Figure 1 , Figure 6 As shown, the output port 72 is provided on the ID block 2, that is, on the top platform of the ID block 2. The carrier transport mechanism 51 can freely move the carrier C between the respective mounting tables 13, 47 and the respective racks 71-75.

[0107] In addition, if Figure 1 , Figure 6 As shown in FIG. 1 , the placing table 13 and the opening 14 (opening mechanisms 9 and 10) are arranged on the coating block 3 side, and the placing table 47 and the opening 48 (opening mechanisms 45 and 46) are arranged on the coating block 3 side. That is, the placing table 13 and the placing table 47 are arranged in a manner facing each other. Thus, the placing table 13 and the placing table 47 are arranged toward the carrier conveying mechanism 51, so that the carrier conveying mechanism 51 can easily convey the carrier C. In addition, for example, in the case where the ID block 2 is sandwiched on the opposite side of the coating block 3 (see FIG. 1 ), the placing table 13 and the placing table 47 are arranged in a manner facing each other. Figure 6 In the case where a stage is provided as indicated by the arrow AR1, the stage 13 protrudes. However, since the stage 13 and the stage 47 are provided facing each other, the protrusion of the stage 13 can be suppressed. Therefore, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0108] In addition, the carrier transport mechanism 51 has two sets of multi-joint arms and holding parts, but may also have one or more sets of multi-joint arms and holding parts. In addition, the lifting drive unit 65 may also be configured to be rotationally driven around a vertical axis relative to the support portion 67A. In addition, the track 77 may also pass through a position other than the top of the first ID block 2. In this case, an input port 71 and an output port 72 are provided at a position passing through the top of the device 1. The number and type of the carrier storage rack 53 may be appropriately changed.

[0109] In addition, if Figure 2As shown, the substrate processing device 1 includes one or more control units 79 and an operating unit 80. The control unit 79 includes, for example, a central processing unit (CPU). The control unit 79 controls each component of the substrate processing device 1. The operating unit 80 includes a display unit (for example, a liquid crystal display), a storage unit, and an input unit. The storage unit includes, for example, at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The input unit includes at least one of a keyboard, a mouse, a touch pad, and various buttons. The storage unit stores various conditions for substrate processing and action programs required for controlling the substrate processing device 1.

[0110] <Operation of substrate processing apparatus 1>

[0111] Next, the operation of the substrate processing apparatus 1 will be described. The plurality of processing steps performed in the substrate processing apparatus 1 are just examples, and the operator selects a desired step. Figure 1 The external transport mechanism OHT transports the carrier C to the input port 71 provided on the first ID block 2. The carrier transport mechanism 51 conveys the carrier C from the input port 71 to, for example, the mounting table 13 of the opening mechanism 9. The shutter portion of the opening mechanism 9 opens the opening 14 while removing the cover of the carrier C and holding the cover.

[0112] (Step S01) 1st ID block 2

[0113] The first substrate transport mechanism TM1 of the first ID block 2 takes out a substrate W from a carrier C mounted on the mounting table 13 of the opening mechanism 9, and transports the taken-out substrate W to the coating block 3. For example, the first substrate transport mechanism TM1 alternately transports the substrate W taken out from the carrier C to two transfer substrate buffers SBF1 and SBF2. In addition, the second substrate transport mechanism MHU2 takes out a substrate W from a carrier C mounted on the mounting table 13 of the opening mechanism 10, and transports the taken-out substrate to the coating block 3.

[0114] When all the substrates W are taken out from the carrier C, the opening mechanism 9 closes the opening 14 with the shutter while attaching the cover to the carrier C. Thereafter, the carrier transport mechanism 51 replaces the empty carrier C after taking out the substrates W with another carrier C storing unprocessed substrates W. Then, the empty carrier C is transported to, for example, the mounting table 47 of the opening mechanism 45. When the empty carrier C cannot be transported to any of the opening mechanisms 45 and 46, the carrier transport mechanism 51 transports the empty carrier C to the empty carrier rack 74.

[0115] (Step S02) Coating Block 3

[0116] The coating block 3 performs coating processing on the substrate W conveyed from the first ID block 2, and conveys the substrate W subjected to the coating processing to the second ID block 4. This will be described in detail.

[0117] In the coating process layer 3A of the coating block 3, for example, the third substrate transport mechanism TM3 receives the substrate W from the substrate transfer buffer SBF1. The third substrate transport mechanism TM3 transfers the received substrate W according to Figure 3 , Figure 4 The third substrate transport mechanism TM3 transports the substrate W formed with an antireflection film by the coating unit BARC in the order of the heating and cooling part PHP, the cooling part CP, the coating unit RESIST, and the heating and cooling part PHP. The third substrate transport mechanism TM3 transports the substrate W formed with a resist film by the coating unit RESIST to the substrate loading part PS1. In addition, the process of using the close contact strengthening treatment part PAHP can also be omitted. In addition, the coating treatment layer 3B is treated the same as the coating treatment layer 3A.

[0118] (Step S03) Second ID Block 4

[0119] The second ID block 4 transports the substrate W transported from the coating block 3 to the developing block 5. That is, one of the two substrate transport mechanisms TM4 and TM5 of the second ID block 4 receives the substrate W from the substrate mounting portion PS1 and transports the received substrate W to, for example, the substrate mounting portion PS3. Alternatively, the received substrate W can also be transported to the substrate mounting portion PS4. In addition, one of the two substrate transport mechanisms TM4 and TM5 transports the substrate W from the substrate mounting portion PS2 to the substrate mounting portion PS4.

[0120] (Step S04) Development Block 5

[0121] The developing block 5 does not develop the coated substrate W, but transports the substrate W transported from the second ID block 4 to the IF block 6. That is, in the upper developing layer 5A, the third substrate transport mechanism TM3 receives the substrate W from the substrate placement portion PS3 and transports the received substrate W to the transport substrate buffer portion SBF5.

[0122] (Step S05) IF block 6

[0123] The IF block 6 carries out the substrate W conveyed from the developing block 5 to the exposure device EXP. Then, the IF block 6 carries in the substrate W subjected to the exposure process from the exposure device EXP, and conveys the substrate W subjected to the exposure process to the developing block 5. This will be described in detail.

[0124] In the IF block 6, the sixth substrate transport mechanism TM6 receives the substrate W from the substrate transfer buffer SBF5, and transports the received substrate W in the order of the pre-exposure cleaning unit 161 and the loading and cooling unit P-CP. The eighth substrate transport mechanism TM8 transports the substrate W from the loading and cooling unit P-CP to the exposure device EXP. The exposure device EXP exposes the transported substrate W.

[0125] The eighth substrate transport mechanism TM8 transports the substrate W exposed by the exposure device EXP from the exposure device EXP to the substrate loading unit PS9. The seventh substrate transport mechanism TM7 receives the substrate W from the substrate loading unit PS9 and transports the received substrate W to the post-exposure cleaning unit 162. Thereafter, the seventh substrate transport mechanism TM7 directly transports the substrate W to the heating and cooling unit PHP of the development block 5, for example, the development processing layer 5A. In the heating and cooling unit PHP of the development processing layer 5A, a post-exposure bake (PEB) process is performed. In addition, the seventh substrate transport mechanism TM7 alternately transports the substrate W from the post-exposure cleaning unit 162 to the upper development processing layer 5A or the lower development processing layer 5B.

[0126] In addition, the seventh substrate transport mechanism TM7 directly transports the substrate W to the heating and cooling part PHP of the developing block 5. In this regard, the seventh substrate transport mechanism TM7 may transport the substrate W to, for example, the substrate mounting part PS5 (PS6), and the third substrate transport mechanism TM3 of the developing layer 5A (5B) may transport the substrate W from the substrate mounting part PS5 (PS6) to the heating and cooling part PHP.

[0127] (Step S06) Development Block 5

[0128] The developing block 5 performs developing processing on the substrate W that has been subjected to the exposure processing, and transports the substrate W that has been subjected to the developing processing to the second ID block 4. This will be described in detail. For example, in the developing processing layer 5A, the third substrate transport mechanism TM3 receives the substrate W from the heating and cooling part PHP, and transports the received substrate W in the order of the cooling part CP, the developing unit DEV, the heating and cooling part PHP, and the substrate buffer part RBF3. In addition, the process performed by the heating and cooling part PHP after the processing by the developing unit DEV can also be omitted. In addition, the developing processing layer 5B performs the same processing as the developing processing layer 5A.

[0129] (Step S07) Second ID Block 4

[0130] The second ID block 4 moves the substrate W that has been subjected to the development process back to the carrier C placed on the stage 47 of the opening mechanism 45. This will be described in detail. The carrier C on the stage 47 is in a state where the opening 48 is opened by the opening mechanism 45. The fourth substrate transport mechanism TM4 receives the substrate W from the substrate return buffer RBF3 (RBF4), and moves the received substrate W back to the carrier C placed on the stage 47 of the opening mechanism 45. In addition, the substrate W is moved back to the carrier C where it was stored before the coating and development process. That is, the substrate W is moved back to the original carrier C. In addition, when the substrate W is moved back to the carrier C placed on the stage 47 of the opening mechanism 46, the fifth substrate transport mechanism TM5 is used.

[0131] After all processed substrates W are stored in the carrier C, the opening mechanism 45 closes the opening 48 while attaching the cover to the carrier C. The carrier transport mechanism 51 transports the carrier C storing the processed substrates W from the mounting table 47 of the opening mechanism 45 to the output port 72. Thereafter, the external transport mechanism OHT transports the carrier C from the output port 72 to the next destination.

[0132] Figure 7 1 is a diagram for explaining the operation of the conventional substrate processing apparatus 101. The conventional substrate processing apparatus 101 transports the substrate W in the order of the ID block 102, the coating block 103, the developing block 105, and the IF block 106 (outward path FW). At this time, the coating block 103 performs coating processing on the substrate W, but the developing block 105 does not perform developing processing on the substrate W. In addition, the substrate processing apparatus 101 transports the substrate W that has been subjected to exposure processing in the order of the IF block 106, the developing block 105, the coating block 103, and the ID block 102 (return path RT). At this time, the coating block 103 does not perform coating processing on the substrate W, but the developing block 105 performs developing processing on the substrate W.

[0133] According to this embodiment, Figure 8 As shown in FIG. 1 , the first ID block 2, the coating block 3, the second ID block 4, the developing block 5 and the IF block 6 are sequentially arranged. A mounting table 13 is provided on the first ID block 2, and a mounting table 47 is provided on the second ID block 4. Figure 7 As shown in FIG. 1 , only the carrier stage 113 is provided on the first ID block 102. Therefore, in both the forward path FW and the return path RT, the substrate W is transported between the first ID block 102 and the IF block 106. According to the present invention, in the return path, the substrate W is not transported from the IF block 6 to the first ID block 2, but is transported to the second ID block 4 disposed between the coating block 3 and the developing block 5. Therefore, in the return path, the number of substrates is reduced. Figure 8As shown by arrow A2, the conveying process is performed by the coating block 3 disposed between the first ID block 2 and the second ID block 4. The conveying process reduces one process. By reducing one process, other conveying processes can be performed. As a result, the overall processing capacity of the substrate processing device 1 can be increased.

[0134] In addition, if Figure 1 As shown in FIG. 1 , the substrate processing apparatus 1 includes a carrier transfer mechanism 51 for transferring the carrier C between the stage 13 and the stage 47. For example, when all substrates W are taken out from the carrier C placed on the stage 13, the carrier transfer mechanism 51 can transfer the carrier C placed on the stage 13 to the stage 47 in order to return the substrate W to the carrier C.

[0135] In addition, in the past, the carrier transport mechanism was arranged in the horizontal direction relative to the ID block 2. According to the present invention, the carrier transport mechanism 51 is mounted on the coating block 3. Therefore, the installation area of ​​the conventional carrier transport mechanism arranged in the horizontal direction relative to the ID block 2 can be reduced. That is, the occupied area of ​​the substrate processing device 1 can be reduced.

[0136] In addition, the substrate processing apparatus 1 includes a carrier storage rack 53 mounted on the first ID block 2, the coating block 3, and the second ID block 4. The carrier transport mechanism 51 transports the carrier C between the mounting table 13, the mounting table 47, and the carrier storage rack 53. Conventionally, the carrier storage rack 53 is arranged in a horizontal direction relative to the ID block 2. According to the present invention, the carrier storage rack 53 is mounted on the coating block 3. Therefore, the installation area of ​​the conventional carrier storage rack arranged in a horizontal direction relative to the ID block 2 can be reduced. That is, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0137] In addition, in this embodiment, the coating block 3 and the developing block 5 each include two processing layers. In this regard, the coating block 3 and the developing block 5 may each include a single processing layer or may include three or more processing layers.

[0138] [Example 2]

[0139] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first embodiment will be omitted.

[0140] In the first embodiment, the substrate processing apparatus 1 is placed on Figure 1 The carrier C on the mounting table 13 of the first ID block 2 shown on the left side of FIG. 1 takes out the substrate W and stores the substrate W on the mounting table 13 of the first ID block 2. Figure 1 The carrier C on the mounting table 47 of the second ID block 4 shown on the right side of FIG. This point may also be reversed. That is, the substrate processing apparatus 1 may also be placed on the second ID block 4. Figure 1 The carrier C on the mounting table 47 of the second ID block 4 shown on the right side of FIG. 1 takes out the substrate W and stores the substrate W on the mounting table 47 of the second ID block 4. Figure 1 The carrier C on the mounting table 13 of the first ID block 2 is shown on the left side.

[0141] Fig. 9 1 is a right side view showing the arrangement of the coating block 3 and the liquid processing unit 22 of the developing block 5 of the substrate processing apparatus 1 of the second embodiment. Figure 1 Compared with the substrate processing apparatus 1 shown in the figure, the configuration of the coating block 3 and the developing block 5 is opposite. The first ID block 2, the developing block 5, the second ID block 4, the coating block 3 and the IF block 6 are sequentially arranged in a straight line. The other configurations of the substrate processing apparatus 1 of this embodiment are substantially the same as those of the substrate processing apparatus 1 of the first embodiment.

[0142] In this embodiment, the developing block 5 corresponds to the first processing block of the present invention. The developing processing corresponds to the first processing of the present invention. The coating block 3 corresponds to the second processing block of the present invention. The coating processing corresponds to the second processing of the present invention.

[0143] <Operation of substrate processing apparatus 1>

[0144] Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Fig.10 1 is a diagram for explaining the operation of the substrate processing apparatus 1. Fig.10 As shown, for ease of explanation of the operation, the coating block 3 and the developing block 5 include a single processing layer.

[0145] Reference Fig.10 The second ID block 4 is placed on two opening mechanisms 45 and 46 (see Figure 6 ) takes out the substrate W, and transports the taken out substrate W to the coating block 3. Then, the coating block 3 performs coating processing on the substrate W transported from the second ID block 4, and transports the coated substrate W to the IF block 6. In addition, the coating block 3 forms an anti-reflection film and a resist film on the substrate W in sequence.

[0146] After that, the IF block 6 carries out the substrate W subjected to the coating process to the exposure device EXP. After that, the IF block 6 carries in the substrate W subjected to the exposure process from the exposure device EXP, and transports the substrate W subjected to the exposure process to the coating block 3. The coating block 3 does not perform the coating process on the substrate W transported from the IF block 6, but transports the substrate W subjected to the exposure process to the second ID block 4.

[0147] The second ID block 4 transports the exposed substrate W to the developing block 5. Then, the developing block 5 develops the exposed substrate W transported from the second ID block 4 and transports the developed substrate W to the first ID block 2. The first ID block 2 moves the developed substrate W back to the two opening mechanisms 9 and 10 (see FIG. Figure 6 ) on a carrier C on any one of the mounting tables 13.

[0148] According to the present embodiment, a carrier stage 13 is provided on the first ID block 2, and a carrier stage 47 is provided on the second ID block 4. In the past, only the carrier stage was provided on the first ID block 2. Therefore, in both the outward and return paths, the substrate W is transported between the first ID block 2 and the IF block 6. According to the present invention, in the outward path, the substrate W is not transported from the first ID block 2 to the IF block 6, but is transported from the second ID block 4 disposed between the developing block 5 and the coating block 3 to the IF block 6. Therefore, in the outward path, the transport process using the developing block 5 disposed between the first ID block 2 and the second ID block 4 is reduced. As a result, the overall processing capacity of the substrate processing device 1 can be improved.

[0149] [Example 3]

[0150] Next, Embodiment 3 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with Embodiments 1 and 2 will be omitted.

[0151] In Example 1, for example Figure 3 In the embodiment, the coating block 3 and the developing block 5 each have two (plural) processing layers, and the number of coating processing layers of the coating block 3 is the same as the number of developing processing layers of the developing block 5. In this regard, the number of coating processing layers may be greater than the number of developing processing layers.

[0152] Fig.11 1 is a right side view showing the configuration of the coating block 3 and the liquid processing unit 22 of the developing block 5 of the substrate processing apparatus of Example 3. Fig.11 As shown, the first ID block 2, the coating block 3, the second ID block 4, the developing block 5 and the IF block 6 are sequentially arranged. The coating block 3 has two coating processing layers 3A and 3B arranged in the up-down direction. The developing block 5 has a single developing processing layer 5A. That is, the number of coating processing layers of the coating block 3 (2) is greater than the number of developing processing layers of the developing block 5 (1). In addition, the coating block 3 may have three coating processing layers arranged in the up-down direction, and the developing block 5 may have two developing processing layers arranged in the up-down direction.

[0153] <Operation of substrate processing apparatus 1>

[0154] Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Fig.11 or Fig.12 The first ID block 2 is placed on the opening mechanism 9, 10 (see Figure 6 ) takes out the substrate W, and transports the taken out substrate W to any one of the two coating treatment layers 3A and 3B of the coating block 3. In addition, the two coating treatment layers 3A and 3B are configured to be able to perform coating treatment in parallel.

[0155] The two coating treatment layers 3A and 3B respectively perform coating treatment on the substrate W transported from the first ID block 2, and transport the coated substrate W to the second ID block 4. The second ID block 4 transports the substrate W transported from the two coating treatment layers 3A and 3B to a single development treatment layer 5A of the development block 5. The development treatment layer 5A does not perform development treatment on the substrate W, but transports the substrate W transported from the second ID block 4 to the IF block 6.

[0156] The IF block 6 carries out the substrate W conveyed from the development processing layer 5A to the exposure device EXP. The external exposure device EXP performs exposure processing on the substrate W conveyed from the IF block 6. The IF block 6 carries in the exposed substrate W from the exposure device EXP and conveys the exposed substrate W to the single development processing layer 5A of the development block 5.

[0157] The development processing layer 5A develops the exposed substrate W and transports the developed substrate W to the second ID block 4. The second ID block 4 moves the developed substrate W back to the substrate mounted on the opening mechanisms 45 and 46 (see Figure 6 ) on a carrier C on a mounting table 47 of any one of the above.

[0158] According to the present embodiment, when the number of substrate conveying steps of the coating treatment layer is greater than that of the substrate conveying steps of the developing treatment layer, if the number of the coating treatment layer and the developing treatment layer is the same, there is a concern that the standby time of the developing treatment layer will be longer. Therefore, by making the number of the coating treatment layer greater than the number of the developing treatment layer, the substrate processing capacity of the coating treatment layer as a whole (coating block 3) can be improved, thereby increasing the conveying speed of the substrate W from the coating treatment layer to the second ID block 4. In addition, the second ID block 4 is arranged between the coating block 3 and the developing block 5. Therefore, even if the number of the coating treatment layer and the developing treatment layer is different, the substrate can be conveyed to each treatment layer.

[0159] In addition, in the actual substrate processing device 1, the number of substrate conveying processes of the coating treatment layer is greater than the number of substrate conveying processes of the developing treatment layer. For example, according to the description of steps S02 and S06 of the embodiment 1, the third substrate conveying mechanism TM3 of the coating block 3 conveys the substrate W received from the conveying substrate buffer SBF3 in the order of the close contact strengthening treatment part PAHP, the cooling part CP, the coating unit BARC, the heating and cooling part PHP, the cooling part CP, the coating unit RESIST, the heating and cooling part PHP, and the substrate loading part PS1 (a total of 8 places), while the substrate conveying mechanism TM3 of the developing block 5 conveys the substrate W received from the heating and cooling part PHP to the cooling part CP, the developing unit DEV, the heating and cooling part PHP, and the substrate buffer RBF3 (a total of 4 places) in sequence. Therefore, by making the number of coating treatment layers greater than the number of developing treatment layers, the substrate processing capacity of the coating treatment layer as a whole (coating block 3) can be improved, thereby improving the conveying speed of the substrate from the coating treatment layer to the second ID block 4.

[0160] [Example 4]

[0161] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first to third embodiments will be omitted.

[0162] In Embodiment 3, the substrate processing apparatus 1 is placed on Fig.12 The carrier C on the mounting table 13 of the first ID block 2 shown on the left side of FIG. 1 takes out the substrate W and stores the substrate W on the mounting table 13 of the first ID block 2. Fig.12 The carrier C on the mounting table 47 of the second ID block 4 shown on the right side of FIG. This point may also be reversed. That is, the substrate processing apparatus 1 may also be placed on the second ID block 4. Fig.12 The carrier C on the mounting table 47 of the second ID block 4 shown on the right side of FIG. 1 takes out the substrate W and stores the substrate W on the mounting table 47 of the second ID block 4. Fig.12 The carrier C on the mounting table 13 of the first ID block 2 is shown on the left side.

[0163] Fig.13 1 is a diagram for explaining the structure and operation of the substrate processing apparatus 1. Fig.13 As shown in FIG. 1 , the first ID block 2, the developing block 5 (first processing block), the second ID block 4, the coating block 3 (second processing block), and the IF block 6 are sequentially arranged. The developing block 5 has a single developing processing layer 5A. The coating block 3 has two coating processing layers 3A and 3B arranged in the up-down direction. That is, the number of coating processing layers (2) of the coating block 3 (second processing block) is greater than the number of developing processing layers (1) of the developing block 5 (first processing block).

[0164] The second ID block 4 takes out a substrate W from a carrier C placed on a stage 47 of one of the two opening mechanisms 45 and 46, and transports the taken-out substrate W to one of the two coating treatment layers 3A and 3B of the coating block 3. The two coating treatment layers 3A and 3B respectively perform coating treatment on the substrate W transported from the second ID block 4, and transport the substrate W subjected to the coating treatment to the IF block 6. In addition, the two coating treatment layers 3A and 3B are configured to be able to perform coating treatment in parallel.

[0165] The IF block 6 carries out the substrate W subjected to the coating process to the exposure device EXP. The external exposure device EXP performs exposure processing on the substrate W carried out from the IF block 6. The IF block 6 carries in the substrate W subjected to the exposure process from the exposure device EXP and transports the substrate W subjected to the exposure process to one of the two coating processing layers 3A and 3B.

[0166] The two coating process layers 3A and 3B respectively transport the substrate W subjected to the exposure process to the second ID block 4. The second ID block 4 transports the substrate W subjected to the exposure process to the single development process layer 5A of the development block 5.

[0167] The development processing layer 5A develops the substrate W that has been transported from the second ID block 4 and has been subjected to the exposure process, and transports the developed substrate W to the first ID block 2. The first ID block 2 moves the developed substrate W back to the carrier C mounted on the mounting table 13 of one of the two opening mechanisms 9 and 10.

[0168] According to the present embodiment, when the number of substrate conveying steps of the coating treatment layer is greater than that of the substrate conveying steps of the developing treatment layer, if the number of the coating treatment layer and the developing treatment layer is the same, there is a concern that the standby time of the developing treatment layer will be longer. Therefore, by making the number of the coating treatment layer greater than the number of the developing treatment layer, the substrate processing capacity of the coating treatment layer as a whole (coating block 3) can be improved. In addition, the second ID block 4 is arranged between the coating block 3 and the developing block 5. Therefore, even if the number of the coating treatment layer and the developing treatment layer is different, the substrate W can be conveyed to each treatment layer.

[0169] In the actual substrate processing apparatus 1, the number of substrate transfer steps in the coating process layer is greater than that in the development process layer. Therefore, the substrate processing capacity of the entire coating process layer (coating block 3) can be improved.

[0170] The present invention is not limited to the above-described embodiment, and can be implemented in various modified forms as follows.

[0171] (1) In the embodiment 3, Fig.12As shown in FIG. 1 , the number of coating treatment layers (2) of the coating block 3 (first treatment block) is greater than the number of developing treatment layers (1) of the developing block 5 (second treatment block). Fig.14 As shown, the number of coating treatment layers (1) may be less than the number of development treatment layers (2).

[0172] In this case, before exposure, the second ID block 4 transports the substrate W that has been transported from the single coating treatment layer 3A and subjected to coating treatment to one of the two developing treatment layers 5A and 5B of the developing block 5. The two developing treatment layers 5A and 5B respectively transport the substrate W transported from the second ID block 4 to the IF block 6. In addition, after exposure, the two developing treatment layers 5A and 5B respectively perform development treatment on the substrate W that has been transported from the IF block 6 and subjected to exposure treatment, and transport the substrate W that has been subjected to development treatment to the second ID block 4. The second ID block 4 moves the substrate W that has been subjected to development treatment back to the carrier C of the mounting table 47.

[0173] (2) In the embodiment 4, Fig.13 As shown in FIG. 1 , the number of coating treatment layers (2) of the coating block 3 (the second treatment block) is greater than the number of developing treatment layers (1) of the developing block 5 (the first treatment block). Fig.15 As shown, the number of coating treatment layers (1) may be less than the number of development treatment layers (2).

[0174] In this case, after exposure, the second ID block 4 transports the substrate W transported from the coating block 3 and subjected to exposure to one of the two development processing layers 5A and 5B of the development block 5. The two development processing layers 5A and 5B respectively develop the substrate W subjected to exposure, and transport the substrate W subjected to development to the first ID block 2. The first ID block 2 moves the substrate W subjected to development back to the carrier C of the mounting table 13.

[0175] (3) In each of the above-mentioned embodiments and variations, the first ID block 2 includes two substrate transfer mechanisms TM1 and TM2. Fig.16 As shown, the first ID block 2 may also include a single substrate transport mechanism TM1. In this case, a plurality of (e.g., four) stages 13 may be arranged along the Y direction on the wall portion 84 of the first ID block 2. In order to take out and store the substrate W from the carrier C placed on these stages 13, the substrate transport mechanism TM1 may also be configured to move in the Y direction by being driven by an electric motor.

[0176] In addition, the first ID block 2 may not include the substrate transport mechanism TM2, but may include only the substrate transport mechanism TM1. The single substrate transport mechanism TM1 may be fixed to the bottom of the first ID block 2 in a manner that does not move in the horizontal direction (particularly the Y direction) as in the first embodiment. In addition, the first ID block 2 may include three or more substrate transport mechanisms.

[0177] (4) In each of the above-mentioned embodiments and variations, the second ID block 4 includes two substrate transfer mechanisms TM4 and TM5. Fig.16 As shown in FIG. 1 , the second ID block 4 may also include a single substrate transport mechanism TM4. In this case, a plurality of (e.g., four) stages 47 may be arranged along the Y direction on the wall portion 88 of the second ID block 4. In order to take out and store the substrate W from the carrier C placed on these stages 47, the substrate transport mechanism TM4 may also be configured to move in the Y direction by being driven by an electric motor.

[0178] In addition, the single substrate transfer mechanism TM1 may be fixed to the bottom of the second ID block 4 so as not to move in the horizontal direction (particularly the Y direction) as in Embodiment 1. In addition, the second ID block 4 may include three or more substrate transfer mechanisms.

[0179] (5) In the above embodiments and variations, Figure 1 As shown, the fourth substrate transfer mechanism TM4 of the second ID block 4 transfers the substrate W between the four substrate mounting parts PS1 to PS4, the two return substrate buffers RBF3 and RBF4, and the carrier C placed on the opening mechanism 45. In addition, the fifth substrate transfer mechanism TM5 transfers the substrate W between the four substrate mounting parts PS1 to PS4, the two return substrate buffers RBF3 and RBF4, and the carrier C placed on the opening mechanism 46.

[0180] For example, the fourth substrate transport mechanism TM4 may transport the substrate W between the four substrate placement parts PS1 to PS4 (i.e., between the coating block 3 and the developing block 5), and the fifth substrate transport mechanism TM5 may transport the substrate W between the two return substrate buffer parts RBF3 and RBF4 and the opening mechanism 46. The functions between the fourth substrate transport mechanism TM4 and the fifth substrate transport mechanism TM5 may be opposite.

[0181] (6) In each of the above-described embodiments and variations, after a resist liquid is supplied from a nozzle and a resist film is formed on a substrate W, the substrate W is transported to an exposure device EXP in this state. At this point, a resist protection film may be formed on the resist film formed on the substrate W. Figure 3 As shown, the two development processing layers 5A and 5B of the development block 5 may each include two coating units 91 .

[0182] The coating unit 91 includes: a holding and rotating part 31 for holding the substrate W and rotating the held substrate W; and a nozzle 32 for ejecting a processing liquid for the resist protection film. The coating unit 91 of the developing block 5 ejects the processing liquid from the nozzle 32 onto the substrate W subjected to the resist coating process, thereby forming a resist protection film on the resist film of the substrate W. The developing block 5 may also transport the substrate W subjected to the resist protection film forming process to the IF block 6. After exposure, the resist protection film is removed by the developing unit DEV.

[0183] (7) In the above-described embodiments and modifications, the substrate processing apparatus 1 includes two processing blocks (the coating block 3 and the developing block 5). In this regard, the substrate processing apparatus 1 may include three or more processing blocks.

[0184] First of all, Fig.17 The substrate processing device 1 shown in FIG. Fig.17 As shown, for example, the substrate processing device 1 includes three (plural) processing blocks 93 to 95 for performing predetermined processing. The three processing blocks 93 to 95 are arranged in a row. In addition, the three processing blocks 93 to 95 are a first coating block 93, a second coating block 94, and a developing block 95. The three processing blocks 93 to 95 each include one processing layer. In addition, Fig.17 In the embodiment, the processing blocks 93 and 94 on the left side (the first ID block 2 side) of the second ID block 4 can also be referred to as at least one processing block on one end side. In addition, the processing block 95 on the right side (the IF block 6 side) of the second ID block 4 can also be referred to as at least one processing block on the other end side.

[0185] The first coating block 93 performs a first coating process for forming an antireflection film on the substrate W. The first coating block 93 includes, for example, a contact enhancement processing unit PAHP, a cooling unit CP, a coating unit BARC, and a third substrate transport mechanism TM3.

[0186] The second coating block 94 performs a second coating process for forming a resist film on the substrate W. The second coating block 94 includes, for example, a heating and cooling part PHP, a cooling part CP, a coating unit RESIST, and a third substrate transport mechanism TM3. The developing block 95 performs a developing process. The developing block 95 includes, for example, a cooling part CP, a developing unit DEV, a heating and cooling part PHP, and a third substrate transport mechanism TM3.

[0187] The first ID block 2 is connected to the first coating block 93 at one end of the three processing blocks 93 to 95. The IF block 6 is connected to the developing block 95 at the other end of the three processing blocks 93 to 95. In addition, the second ID block 4 is arranged between the second coating block 94 and the developing block 95 in the three processing blocks 93 to 95.

[0188] Next, the operation of the substrate processing apparatus 1 according to this variation is described. The first ID block 2 is placed on the two opening mechanisms 9 and 10 (see Figure 6 ) takes out the substrate W with a carrier C on one of the mounting tables 13, and transports the taken-out substrate W to the first coating block 93. The three processing blocks 93 to 95 and the second ID block 4 transport the substrate W transported from the first ID block 2 to the IF block 6 via the second ID block 4. That is, the substrate W is transported in the order of the first coating block 93, the second coating block 94, the second ID block 4, and the developing block 95.

[0189] When the substrate W is transported from the first coating block 93 to the IF block 6, the processing blocks 93 and 94 disposed between the first ID block 2 and the second ID block 4 perform a preset process on the transported substrate W. That is, the first coating block 93 performs a first coating process for forming an antireflection film on the substrate W. The second coating block 94 performs a second coating process for forming a resist film on the substrate W.

[0190] The IF block 6 carries out the conveyed substrate W to the exposure unit EXP. The IF block 6 carries in the substrate W subjected to the exposure process by the exposure unit EXP from the exposure unit EXP, and carries the carried-in substrate W to the developing block 95.

[0191] The developing block 95 disposed between the second ID block 4 and the IF block 6 among the three processing blocks 93 to 95 transports the substrate W transported from the IF block 6 from the developing block 95 to the second ID block 4. When the substrate W is transported from the developing block 95 to the second ID block 4, the developing block 95 performs a developing process on the transported substrate W. The second ID block 4 moves the transported substrate W back to the substrate mounted on the two opening mechanisms 45 and 46 (see Figure 6 ) on a carrier C on one of the mounting tables 47.

[0192] According to this variation, a carrier stage 13 is provided on the first ID block 2, and a carrier stage 47 is provided on the second ID block 4. Conventionally, only the carrier stage is provided on the first ID block 2. Therefore, in both the outward and return paths, the substrate W is transported between the first ID block 2 and the IF block 6. According to the present invention, in the return path, the substrate W is not transported from the IF block 6 to the first ID block 2, but is transported to the second ID block 4 disposed between the two processing blocks 94 and 95. Therefore, in the return path, the transport process using the processing blocks 93 and 94 disposed between the first ID block 2 and the second ID block 4 is reduced. As a result, the overall processing throughput of the substrate processing apparatus 1 can be improved.

[0193] (8) Next, Fig.18 The substrate processing apparatus 1 shown in FIG. Fig.18In the substrate processing apparatus 1 shown, a first ID block 2, a developing block 95, a second ID block 4, a first coating block 93, a second coating block 94, and an IF block 6 are arranged in this order.

[0194] The operation of the substrate processing apparatus 1 according to this modification will be described. In addition, each of the three processing blocks 93 to 95 includes a single processing layer.

[0195] The second ID block 4 is placed on two opening mechanisms 45 and 46 (see Figure 6 ) takes out the substrate W and transports the taken-out substrate W to the first coating block 93 adjacent to the IF block 6 side of the second ID block 4.

[0196] The processing blocks 93 and 94 disposed between the second ID block 4 and the IF block 6 among the three processing blocks 93 to 95 transport the substrate W transported from the second ID block 4 from the first coating block 93 to the IF block 6. When the substrate W is transported from the first coating block 93 to the IF block 6, each processing block 93 and 94 disposed between the second ID block 4 and the IF block 6 performs a preset process on the transported substrate W.

[0197] The IF block 6 carries out the conveyed substrate W to the exposure unit EXP. The IF block 6 carries in the substrate W subjected to the exposure process in the exposure unit EXP from the exposure unit EXP, and carries the carried-in substrate W to the second coating block 94.

[0198] The three processing blocks 93 to 95 and the IF block 6 transport the substrate W transported from the IF block 6 to the first ID block 2 from the second coating block 94 via the second ID block 4. When the substrate W is transported from the second coating block 94 to the first ID block 2, the developing block 95 disposed between the first ID block 2 and the second ID block 4 performs a developing process on the transported substrate W. The first ID block 2 moves the transported substrate W back to the two opening mechanisms 9 and 10 (see FIG. Figure 6 ) is a carrier C on one of the mounting tables 13.

[0199] According to this variation, a carrier stage 13 is provided on the first ID block 2, and a carrier stage 47 is provided on the second ID block 4. Conventionally, only the carrier stage is provided on the first ID block 2. Therefore, in both the outward and return paths, the substrate W is transported between the first ID block 2 and the IF block 6. According to the present invention, in the outward path, the substrate W is not transported from the first ID block 2 to the IF block 6, but is transported from the second ID block 4 disposed between the two processing blocks 95 and 93 to the IF block 6. Therefore, in the outward path, the transport process performed by the developing block 5 disposed between the first ID block 2 and the second ID block 4 is reduced. As a result, the overall processing capacity of the substrate processing apparatus 1 can be improved.

[0200] The present invention can be embodied in other specific forms without departing from the spirit or essence thereof and, therefore, reference should be made to the appended claims rather than to the foregoing description as indicating the scope of the invention.

[0201] [Explanation of Symbols]

[0202] 1 Substrate processing device

[0203] 2 1st loading block (1st ID block)

[0204] 3 Coating block

[0205] 4 2nd loading block (2nd ID block)

[0206] 5 Development block

[0207] 6 Interface block (IF block)

[0208] 8 Carrier buffer device

[0209] 13, 47 loading platform

[0210] 51 Carrier transport mechanism

[0211] 53 Vehicle Storage Rack

[0212] C Vehicles

[0213] TM1~TM8 Substrate transport mechanism

[0214] EXP Exposure Device

[0215] W substrate

Claims

1. A substrate processing device for processing a substrate, comprising the following elements: Multiple processing blocks, configured in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; an interface block connected to a processing block at the other end of the plurality of processing blocks, and carrying in and out a substrate with respect to an external device that performs a preset process; and a second loading block, arranged between two of the plurality of processing blocks and provided with a second carrier mounting table for mounting the carrier; The first loading block takes out a substrate from the carrier mounted on the first carrier mounting table, and transports the taken-out substrate to the processing block at the one end. The plurality of processing blocks and the second loading block transport the substrate transported from the first loading block to the interface block from the processing block at one end via the second loading block. When a substrate is transported from the processing block at one end to the interface block, the processing block disposed between the first loading block and the second loading block performs a preset process on the transported substrate. The interface block moves the delivered substrate to the external device. The interface block carries in a substrate that has been subjected to a predetermined process by the external device from the external device, and transports the carried-in substrate to the processing block at the other end. A processing block disposed between the second loading block and the interface block among the plurality of processing blocks transfers the substrate transferred from the interface block from the processing block at the other end to the second loading block, When the substrate is transported from the processing block at the other end to the second loading block, the processing block disposed between the second loading block and the interface block performs a preset process on the transported substrate. The second loading block moves the conveyed substrate back to the carrier mounted on the second carrier mounting table.

2. The substrate processing apparatus according to claim 1, wherein The plurality of processing blocks include a first processing block for performing a first processing and a second processing block for performing a second processing, and the first loading block is connected to the first processing block. The first processing block is connected to the second loading block. The second loading block is connected to the second processing block, The second processing block is connected to the interface block, The interface block carries out the loading and unloading of the substrate to the external device that performs the third process. The first loading block takes out a substrate from the carrier mounted on the first carrier mounting table and transports the taken-out substrate to the first processing block. The first processing block performs the first processing on the substrate transferred from the first loading block, and transfers the substrate that has been subjected to the first processing to the second loading block. The second loading block transports the substrate transported from the first processing block to the second processing block, The second processing block transports the substrate transported from the second loading block to the interface block, The interface block carries out the substrate transferred from the second processing block to the external device. The interface block carries in the substrate that has been subjected to the third process from the external device and transports the carried-in substrate to the second process block. The second processing block performs the second processing on the substrate that has been subjected to the third processing, and transports the substrate that has been subjected to the second processing to the second loading block. The second loading block moves the substrate subjected to the second process back to the carrier mounted on the second carrier mounting table.

3. The substrate processing apparatus according to claim 1 or 2, further comprising a carrier transport mechanism, The carrier transport mechanism transports the carrier between the first carrier mounting platform and the second carrier mounting platform.

4. The substrate processing apparatus according to claim 2, further comprising a carrier transport mechanism, The carrier transport mechanism transports the carrier between the first carrier mounting platform and the second carrier mounting platform; and The carrier transport mechanism is mounted on the first processing block.

5. A substrate processing device for processing a substrate, comprising the following elements: Multiple processing blocks, configured in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; an interface block connected to a processing block at the other end of the plurality of processing blocks, and carrying in and out a substrate with respect to an external device that performs a preset process; and a second loading block, arranged between two of the plurality of processing blocks and provided with a second carrier mounting table for mounting the carrier; The second loading block takes out a substrate from the carrier mounted on the second carrier mounting table and transports the taken-out substrate to an adjacent processing block adjacent to the interface block side of the second loading block, A processing block disposed between the second loading block and the interface block among the plurality of processing blocks transfers the substrate transferred from the second loading block from the adjacent processing block to the interface block, When a substrate is transported from the adjacent processing block to the interface block, the processing block disposed between the second loading block and the interface block performs a predetermined process on the transported substrate. The interface block moves the delivered substrate to the external device. The interface block carries in a substrate that has been subjected to a predetermined process by the external device from the external device, and transports the carried-in substrate to the processing block at the other end. The plurality of processing blocks and the second loading block transfer the substrate transferred from the interface block to the first loading block from the processing block at the other end via the second loading block. When the substrate is transported from the processing block at the other end to the first loading block, the processing block disposed between the first loading block and the second loading block performs a preset process on the transported substrate. The first loading block moves the conveyed substrate back to the carrier mounted on the first carrier mounting table.

6. The substrate processing apparatus according to claim 5, wherein The plurality of processing blocks include a first processing block for performing a first processing and a second processing block for performing a second processing, and the first loading block is connected to the first processing block. The first processing block is connected to the second loading block. The second loading block is connected to the second processing block, The second processing block is connected to the interface block, The interface block carries out the loading and unloading of the substrate to the external device that performs the third process. The second loading block takes out a substrate from the carrier mounted on the second carrier mounting table and transports the taken-out substrate to the second processing block. The second processing block performs the second processing on the substrate transferred from the second loading block, and transfers the substrate that has been subjected to the second processing to the interface block. The interface block carries out the substrate subjected to the second process to the external device, The interface block carries in the substrate having undergone the third process from the external device, and transports the substrate having undergone the third process to the second process block. The second processing block transports the substrate subjected to the third processing to the second loading block, The second loading block transports the substrate subjected to the third process to the first processing block, The first processing block performs the first processing on the substrate that has been transferred from the second loading block and has been subjected to the third processing, and transfers the substrate that has been subjected to the first processing to the first loading block. The first loading block moves the substrate subjected to the first process back to the carrier mounted on the first carrier mounting table.

7. The substrate processing apparatus according to claim 6, wherein The first processing block includes a plurality of first processing layers arranged in a vertical direction. The second processing block includes a single second processing layer or a plurality of second processing layers arranged in a vertical direction. The number of the first processing layers is greater than the number of the second processing layers.

8. The substrate processing apparatus according to claim 7, wherein The first processing block is a coating block for performing coating processing. The second processing block is a developing block for performing a developing process, and The external device is an exposure device that performs an exposure process.

9. The substrate processing apparatus according to claim 6, wherein The first processing block includes a single first processing layer or a plurality of first processing layers arranged in a vertical direction. The second processing block includes a plurality of second processing layers arranged in a vertical direction. The number of the second processing layers is greater than the number of the first processing layers.

10. The substrate processing apparatus according to any one of claims 5 to 9, further comprising a carrier transport mechanism, The carrier transport mechanism transports the carrier between the first carrier mounting platform and the second carrier mounting platform.

11. The substrate processing apparatus according to any one of claims 6 to 9, further comprising a carrier transport mechanism, The carrier transport mechanism transports the carrier between the first carrier mounting platform and the second carrier mounting platform; and The carrier transport mechanism is mounted on the first processing block.

12. A substrate transfer method, which is a substrate transfer method of a substrate processing apparatus having the following components, wherein the components are: a plurality of processing blocks arranged in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and The interface block is connected to a processing block at the other end of the plurality of processing blocks, and carries in and out a substrate for an external device that performs a preset process; and the substrate transport method includes the following steps: Using the first loading block to take out a substrate from the carrier mounted on the first carrier mounting table, and transporting the taken out substrate to the processing block at the one end; Using the plurality of processing blocks and a second loading block disposed between two of the plurality of processing blocks, the substrate transported from the first loading block is transported from the processing block at one end to the interface block via the second loading block; When a substrate is transported from the processing block at one end to the interface block, a processing block disposed between the first loading block and the second loading block is used to perform a preset process on the transported substrate; Using the interface block to move the delivered substrate to the external device; Using the interface block, a substrate that has been subjected to a predetermined process by the external device is loaded from the external device, and the loaded substrate is transported to the processing block at the other end; Using a processing block disposed between the second loading block and the interface block among the plurality of processing blocks, the substrate transported from the interface block is transported from the processing block at the other end to the second loading block; When the substrate is transported from the processing block at the other end to the second loading block, the transported substrate is subjected to a predetermined process by using the processing block disposed between the second loading block and the interface block; and The conveyed substrate is moved back to the carrier mounted on the second carrier mounting table provided on the second loading block by the second loading block.

13. A substrate transfer method, which is a substrate transfer method of a substrate processing apparatus having the following components, wherein the components are: a plurality of processing blocks arranged in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and The interface block is connected to a processing block at the other end of the plurality of processing blocks, and carries in and out a substrate for an external device that performs a preset process; and the substrate transport method includes the following steps: Using a second loading block disposed between two of the plurality of processing blocks, a substrate is taken out from the carrier mounted on a second carrier mounting table provided on the second loading block, and the taken out substrate is transported to an adjacent processing block adjacent to the interface block side of the second loading block; using a processing block disposed between the second loading block and the interface block among the plurality of processing blocks to transfer the substrate transferred from the second loading block from the adjacent processing block to the interface block; When a substrate is transported from the adjacent processing block to the interface block, a processing block disposed between the second loading block and the interface block is used to perform a predetermined process on the transported substrate; Using the interface block to move the delivered substrate to the external device; Using the interface block, a substrate that has been subjected to a predetermined process by the external device is loaded from the external device, and the loaded substrate is transported to the processing block at the other end; Using the plurality of processing blocks and the second loading block, the substrate transported from the interface block is transported from the processing block at the other end to the first loading block via the second loading block; When the substrate is transported from the processing block at the other end to the first loading block, the transported substrate is subjected to a predetermined process by using the processing block arranged between the first loading block and the second loading block; and The conveyed substrate is moved back to the carrier mounted on the first carrier mounting table by the first loading block.

Images