Semiconductor refrigeration and dehumidification device

Abstract

The present invention discloses a semiconductor refrigeration and dehumidification device, comprising a housing, wherein the housing includes a cold chamber and a hot chamber separated by semiconductor refrigeration fins. The housing is provided with a hot chamber air inlet, an air outlet, and a cold chamber air inlet. The cold chamber is provided with a cold-end heat-absorbing fin fixed to the semiconductor refrigeration fin, the hot chamber is provided with a hot-end heat-releasing fin fixed to the semiconductor refrigeration fin, and a blower fan is provided in the hot chamber. The semiconductor refrigeration fin is provided with a cold-hot chamber connecting hole connecting the cold and hot chambers. The cold-hot chamber connecting hole is provided with a control valve for opening or sealing the cold-hot chamber connecting hole. The control valve is electrically connected to a switch external to the housing. By providing the control valve and the cold-hot chamber connecting hole, the cold chamber and the hot chamber are connected to achieve dehumidification. After the cold chamber and the hot chamber are separated, gas can be circulated only in the hot chamber to effectively heat the chamber, allowing the semiconductor refrigeration and dehumidification device to switch between dehumidification and heating functions.

Description

Technical Field

[0001] The present invention relates to the technical field of refrigeration equipment, and in particular to a semiconductor refrigeration and dehumidification device. Background Art

[0002] Semiconductor refrigeration technology, also known as thermoelectric refrigeration, utilizes a PN junction composed of semiconductor materials to generate cooling when a direct current is applied. Frost forms on the cold end within seconds. Semiconductor refrigeration technology does not require complex mechanical structures such as compressors, nor does it require refrigerants.

[0003] Currently, semiconductor dehumidifiers on the market use semiconductor cooling chips to generate localized low temperatures, causing water vapor in the air to condense, thereby reducing the humidity of the air flowing through it. However, these dehumidifiers only have a dehumidification function and cannot simultaneously perform dehumidification and heating functions.

[0004] Therefore, how to provide a semiconductor refrigeration and dehumidification device that can switch between the two functions of dehumidification and heating is a technical problem that those skilled in the art currently need to solve. Summary of the Invention

[0005] In view of this, an object of the present invention is to provide a semiconductor refrigeration and dehumidification device that can switch between dehumidification and heating functions.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor refrigeration and dehumidification device comprises a shell, wherein the shell comprises a cold chamber and a hot chamber separated by semiconductor refrigeration sheets, the shell is penetrated by a hot chamber air inlet connected to the hot chamber, an air outlet connected to the hot chamber and a cold chamber air inlet connected to the cold chamber, the cold chamber is provided with a cold-end heat-absorbing fin fixed to the semiconductor refrigeration sheet, the hot chamber is provided with a hot-end heat-releasing fin fixed to the semiconductor refrigeration sheet, the hot chamber is provided with a blowing fan, the semiconductor refrigeration sheet is provided with a hot-cold chamber connecting hole connecting the cold chamber and the hot chamber, the hot-cold chamber connecting hole is provided with a control valve for opening or sealing the hot-cold chamber connecting hole, and the control valve is electrically connected to a switching switch external to the shell.

[0008] Preferably, a heat insulation layer is provided on the inner wall of the shell forming the cold chamber.

[0009] Preferably, the cold end heat absorbing fins are provided with a hydrophobic coating.

[0010] Preferably, the cold chamber air inlet and the hot chamber air inlet are opened on opposite wall surfaces of the shell, and the cold and hot chamber connecting holes and the cold chamber air inlet are respectively arranged on both sides of the cold end heat absorbing fins.

[0011] Preferably, the air outlet is arranged opposite to the blowing fan.

[0012] Preferably, a cold chamber drain port connected to the cold chamber is provided through the shell, the cold chamber drain port and the cold chamber air inlet are respectively opened on two adjacent wall surfaces of the shell, and the cold end heat absorption fin is inclined from the cold chamber air inlet toward the cold chamber drain port.

[0013] Preferably, a funnel-shaped water outlet is connected to the cold chamber drain outlet on the outside of the shell, and the tip of the funnel-shaped water outlet is provided through and connected to a cylindrical water pipe interface.

[0014] The semiconductor refrigeration and dehumidification device provided by the present invention includes a shell, which includes a cold chamber and a hot chamber separated by a semiconductor refrigeration plate. The shell is penetrated by a hot chamber air inlet connected to the hot chamber, an air outlet connected to the hot chamber, and a cold chamber air inlet connected to the cold chamber. The cold chamber is provided with a cold-end heat-absorbing fin fixed to the semiconductor refrigeration plate, the hot chamber is provided with a hot-end heat-releasing fin fixed to the semiconductor refrigeration plate, the hot chamber is provided with a blowing fan, the semiconductor refrigeration plate is provided with a cold-hot chamber connecting hole connecting the cold chamber and the hot chamber, the cold-hot chamber connecting hole is provided with a control valve for opening or sealing the cold-hot chamber connecting hole, and the control valve is electrically connected to a switching switch outside the shell.

[0015] By controlling the valve and the connection holes between the cold and hot chambers, the on-off control of the cold and hot chambers can be easily achieved. The cold and hot chambers are connected to achieve dehumidification. After the cold and hot chambers are isolated, gas can be circulated only in the hot chamber to effectively heat the chamber, allowing the semiconductor refrigeration and dehumidification device to switch between the two functions of dehumidification and heating. At the same time, a dual-inlet and single-outlet structure is adopted, with a cold chamber air inlet, a hot chamber air inlet, and an air outlet. During the dehumidification process, not only is the semiconductor refrigeration chip used for dehumidification, but the dehumidified and cooled air is also used a second time to dissipate heat from the hot end of the semiconductor refrigeration chip, which can reduce the secondary evaporation of condensed water and give full play to the efficiency of the semiconductor refrigeration chip. While reducing the air flow at the cold end and the evaporation of condensed water, the heat dissipation at the hot end is guaranteed, solving the problem of low semiconductor refrigeration efficiency leading to different air volumes required at the cold and hot ends. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0017] Figure 1 This is a horizontal cross-sectional view of the semiconductor refrigeration and dehumidification device provided by the present invention;

[0018] Figure 2 This is a longitudinal cross-sectional view of the semiconductor refrigeration and dehumidification device provided by the present invention on the cold chamber side.

[0019] Reference numerals:

[0020] 1-cold chamber air inlet, 2-cold end heat absorption fins, 3-cold and hot chamber connecting hole, 4-hot chamber air inlet, 5-hot end heat release fins, 6-blowing fan, 7-air outlet, 8-water pipe interface, 9-semiconductor refrigeration plate, 10-switching switch, 11-shell, 12-insulation layer, 13-funnel-shaped water outlet, 14-cold chamber drain outlet, 15-cold chamber, 16-hot chamber. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] The core of the present invention is to provide a semiconductor refrigeration and dehumidification device that can switch between dehumidification and heating functions.

[0023] It should be noted that when an element is referred to as "fixed" to another element, it may be directly on the other element or there may also be an element centered thereon. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an element centered thereon at the same time. In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0025] The semiconductor refrigeration and dehumidification device provided by the present invention includes a housing 11, which includes a cold chamber 15 and a hot chamber 16 separated by a semiconductor refrigeration plate 9. The housing 11 is provided with a hot chamber air inlet 4 connected to the hot chamber 16, an air outlet 7 connected to the hot chamber 16, and a cold chamber air inlet 1 connected to the cold chamber 15. The cold chamber 15 is provided with a cold end heat absorbing fin 2 fixed to the semiconductor refrigeration plate 9, and the hot end heat releasing fin 5 fixed to the semiconductor refrigeration plate 9 is provided in the hot chamber 16. The semiconductor refrigeration plate 9 is a refrigeration element, the cold end heat absorbing fin 2 is the heat absorbing end of the semiconductor refrigeration plate 9, and the hot end heat releasing fin 5 is the heat releasing end of the semiconductor refrigeration plate 9. A blower fan 6 is provided in the hot chamber 16, wherein only one blower fan 6 can be provided, which simplifies the overall structure and saves materials. A hot and cold cavity connecting hole 3 connecting the cold cavity 15 and the hot cavity 16 is provided on the semiconductor refrigeration plate 9. A control valve for opening or sealing the hot and cold cavity connecting hole 3 is provided on the hot and cold cavity connecting hole 3. The control valve is electrically connected to a switching switch 10 external to the housing 11, and the switching switch 10 can be manually controlled.

[0026] Dehumidification mode: Triggering switch 10 controls the valve to open the hot-cold chamber connecting hole 3, connecting the cold chamber 15 and the hot chamber 16. When the blower fan 6 at the air outlet 7 is operating, air flows from the hot chamber inlet 4 to the hot-end heat release fins 5 below the blower fan 6, removing heat from the hot end. This creates a low pressure in the air duct at the hot chamber inlet 4 as it flows through the hot-end heat release fins 5, causing external air from the cold chamber inlet 1 to flow into the cold chamber 15. After being cooled and cooled by the cold-end heat absorption fins 2, the air flows through the hot-cold chamber connecting hole 3 and merges with the airflow at the hot chamber inlet 4. The air then flows to the hot-end heat release fins 5, dissipating heat from the hot-end heat absorption fins 5 before being blown out through the blower fan 6 at the air outlet 7. The air entering the cold chamber inlet 1 cools down as it passes through the cold-end heat absorption fins 2, causing water vapor in the air to condense on the cold-end heat absorption fins 2. The resulting condensed water droplets fall when they reach a certain size. The air flowing in through the cold chamber air inlet 1 has a slow flow rate, which can effectively prevent the secondary evaporation of the condensed water vapor and improve the dehumidification effect.

[0027] Heating mode: Triggering switch 10 controls the valve to close hot and cold chamber communication hole 3, isolating cold chamber 15 from hot chamber 16. Only air from hot chamber 16 circulates within housing 11. Fan 6 operates, forcing air into hot chamber 16 from hot chamber air inlet 4. Air flows through hot end heat release fins 5, where it is heated and then discharged through air outlet 7, achieving the heater function.

[0028] In this embodiment, by controlling the valve and the cold-hot chamber connecting hole 3, the on-off control of the cold chamber 15 and the hot chamber 16 can be conveniently achieved. The cold chamber 15 and the hot chamber 16 are connected to achieve dehumidification. After the cold chamber 15 and the hot chamber 16 are isolated, gas can be circulated only in the hot chamber 16 to effectively heat the air, allowing the semiconductor refrigeration and dehumidification device to switch between dehumidification and heating functions. Furthermore, the dual-inlet and single-outlet configuration of the cold chamber air inlet 1, the hot chamber air inlet 4, and the air outlet 7 is adopted. During the dehumidification process, the semiconductor refrigeration chip 9 is not only utilized for dehumidification, but also the dehumidified and cooled air is reused to dissipate heat from the hot end of the semiconductor refrigeration chip 9. This can reduce the secondary evaporation of condensed water, fully utilize the efficiency of the semiconductor refrigeration chip 9, and ensure heat dissipation from the hot end while reducing the air flow at the cold end and evaporation of condensed water. This solves the problem of low semiconductor refrigeration efficiency leading to different air volumes required at the cold and hot ends.

[0029] Furthermore, an insulation layer 12 is provided on the inner wall of the shell 11 constituting the cold chamber 15, which can reduce the heat exchange between the cold chamber 15 and the outside through the shell 11, prevent the shell of the cold chamber from generating low temperature and causing water vapor to condense on the shell, thereby enhancing the working efficiency in the dehumidification and heating modes.

[0030] Furthermore, a hydrophobic coating is provided on the cold-end heat-absorbing fins 2. By providing a hydrophobic material on the cold-end heat-absorbing fins 2, condensation water can be prevented from accumulating on the cold-end heat-absorbing fins 2, and condensation water can be prevented from infiltrating the cold-end heat-absorbing fins 2 and accumulating to increase thermal resistance, thereby enhancing the ability of air to pass through the hot-end heat-releasing fins 5, facilitating drainage, and improving dehumidification capacity and efficiency.

[0031] Furthermore, the cold chamber air inlet 1 and the hot chamber air inlet 4 are provided on opposite walls of the housing 11, and the cold and hot chamber connecting holes 3 and the cold chamber air inlet 1 are respectively provided on both sides of the cold end heat absorbing fins 2, thereby ensuring that the air from the cold chamber air inlet 1 can flow through the cold end heat absorbing fins 2 before entering the cold and hot chamber connecting holes 3 and can quickly merge with the air from the hot chamber air inlet 4. Figure 1 As shown, the cold chamber air inlet 1 and the hot chamber air inlet 4 are respectively arranged on two opposite walls of the shell 11 perpendicular to the horizontal direction, and the outside air enters the cold chamber air inlet 1 and the hot chamber air inlet 4 horizontally.

[0032] Furthermore, the air outlet 7 is arranged opposite to the blowing fan 6, so that the gas in the heat chamber 16 can be discharged quickly and efficiently.

[0033] Furthermore, a cold cavity drain port 14 is provided on the shell 11 and is connected to the cold cavity 15. The cold cavity drain port 14 and the cold cavity air inlet 1 are respectively provided on two adjacent walls of the shell 11. The cold end heat absorbing fins 2 are tilted from the cold cavity air inlet 1 toward the cold cavity drain port 14. Figure 2As shown, the cold chamber air inlet 1 is arranged on the wall surface of the shell 11 perpendicular to the horizontal direction, and the hot chamber air inlet 4 is arranged on the bottom wall surface of the shell 11 parallel to the horizontal direction. The cold end heat absorbing fins 2 are arranged in sequence from top to bottom, and each cold end heat absorbing fin 2 is inclined relative to the horizontal direction. The overall structure formed by each cold end heat absorbing fin 2 is a rectangular structure. After the outside air enters the cold chamber 15 through the cold chamber air inlet 1, the cold end heat absorbing fin 2 has a guiding function to guide the wind flow and prevent the cold end heat absorbing fin 2 from blocking the air flow. The cold end heat absorbing fin 2 also has a guiding function for the condensed water, which can be drained toward the wall surface where the cold chamber drain port 14 is located, facilitating the condensed water to slide down and improving the condensed water discharge efficiency. Among them, the base material of the cold end heat absorbing fin 2 is aluminum alloy.

[0034] Furthermore, a funnel-shaped water outlet 13 is connected to the cold chamber drain outlet 14 on the outside of the shell 11 to further improve the drainage efficiency. The tip of the funnel-shaped water outlet 13 is penetrated and connected to a cylindrical water pipe interface 8, which can be connected to a standard water outlet pipe.

[0035] The semiconductor refrigeration and dehumidification device in this embodiment comprises a single housing 11. A layer of thermal insulation material is applied to the inner surface of the cold chamber 15 of the housing 11 as a thermal insulation layer 12. Furthermore, dual air inlets, a single air outlet, a single fan, and a drain are provided. After cooling and condensing, the air in the cold chamber 15 flows into the hot chamber 16, dissipating heat to the hot end while also reducing the air flow rate in the cold chamber 15 and minimizing evaporation of condensed water. The dual air inlets increase heat dissipation to the hot end heat release fins 5 and significantly and precisely reduce the proportion of the sensible heat of the air passing through the hot end heat release fins 5 in the cooling capacity of the semiconductor refrigeration fins 9. The proportion of the latent heat of phase change of water vapor in the air in the cooling capacity of the refrigeration fins is effectively and precisely increased. Furthermore, the cold chamber is covered by the thermal insulation layer 12, minimizing cooling capacity losses. Furthermore, the provision of a switchable hot and cold chamber connecting hole 3 facilitates the transition between dehumidification and heating. At the same time, the use of hydrophobic cold end heat absorbing fins 2 is conducive to the condensed water sliding down the cold end heat absorbing fins 2 quickly without accumulation.

[0036] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0037] The above describes in detail the semiconductor refrigeration and dehumidification device provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above examples is intended only to facilitate understanding of the method and core concepts of the present invention. It should be noted that those skilled in the art may make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications fall within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor refrigeration and dehumidification device, characterized in that: The invention comprises a shell (11), wherein the shell (11) comprises a cold chamber and a hot chamber separated by a semiconductor refrigeration plate (9), the shell (11) is provided with a hot chamber air inlet (4) communicating with the hot chamber, an air outlet (7) communicating with the hot chamber, and a cold chamber air inlet (1) communicating with the cold chamber, the cold chamber is provided with a cold end heat absorbing fin (2) fixed to the semiconductor refrigeration plate (9), the hot chamber is provided with a hot end heat releasing fin (5) fixed to the semiconductor refrigeration plate (9), the hot chamber is provided with a blowing fan (6), the semiconductor refrigeration plate (9) is provided with a hot-cold chamber connecting hole (3) connecting the cold chamber and the hot chamber, the hot-cold chamber connecting hole (3) is provided with a control valve for opening or sealing the hot-cold chamber connecting hole (3), and the control valve is electrically connected to a switching switch (10) externally arranged on the shell (11); The cold chamber air inlet (1) and the hot chamber air inlet (4) are respectively provided on two opposite wall surfaces of the shell (11) perpendicular to the horizontal direction; the cold and hot chamber connecting hole (3) and the cold chamber air inlet (1) are respectively provided on both sides of the cold end heat absorbing fin (2); the cold and hot chamber connecting hole (3) and the hot chamber air inlet (4) are provided on the same side of the hot end heat releasing fin (5); the air outlet (7) and the blowing fan (6) are arranged opposite to each other; the air outlet (7) and the hot chamber air inlet (4) are provided on adjacent wall surfaces of the shell (11); In the dehumidification mode, the switching switch (10) is triggered, and the control valve opens the hot and cold chamber connecting hole (3), so that the cold chamber and the hot chamber are connected. When the blowing fan (6) at the air outlet (7) is working, the air flows from the hot chamber air inlet (4) to the hot end heat release fins (5) below the blowing fan (6) to take away the heat, and a low pressure is formed on the air duct flowing through the hot end heat release fins (5) at the hot chamber air inlet (4), so that the external air at the cold chamber air inlet (1) flows into the cold chamber, and then passes through the After the cold end heat absorbing fins (2) reduce the temperature and humidity, they flow through the hot and cold cavity connecting holes (3) into the air flow of the hot cavity air inlet (4) and flow to the hot end heat releasing fins (5), dissipating heat for the hot end heat releasing fins (5), and then blown out through the blowing fan (6) at the air outlet (7). The air entering from the cold cavity air inlet (1) cools down when passing through the cold end heat absorbing fins (2), and the water vapor in the air condenses on the cold end heat absorbing fins (2). The generated condensed water droplets fall when they reach a certain size. In the heating mode, the switching switch (10) is triggered, the control valve closes the hot and cold chamber connecting hole (3), so that the cold chamber and the hot chamber are isolated, and the blowing fan (6) is operated, so that the air flow enters the hot chamber from the hot chamber air inlet (4), flows through the hot end heat release fins (5), is heated, and is discharged through the air outlet (7), thereby realizing the heater function; The shell (11) is provided with a cold chamber drain port (14) connected to the cold chamber, the cold chamber drain port (14) and the cold chamber air inlet (1) are respectively provided on two adjacent wall surfaces of the shell (11), and the cold end heat absorbing fin (2) is arranged to be inclined from the cold chamber air inlet (1) toward the cold chamber drain port (14); Wherein, each of the cold end heat absorbing fins (2) is arranged in sequence from top to bottom, and each of the cold end heat absorbing fins (2) is arranged at an angle relative to the horizontal direction. The cold end heat absorbing fins (2) have a guiding effect on the condensed water, and can be drained toward the wall surface where the cold cavity drain port (14) is located, so as to facilitate the sliding of the condensed water. The cold end heat absorbing fins (2) also have a guiding effect to guide the flow of wind and prevent the cold end heat absorbing fins (2) from blocking the passage of airflow. The cold chamber drain outlet (14) is connected to a funnel-shaped water outlet groove (13) on the outside of the shell (11), and the tip of the funnel-shaped water outlet groove (13) is provided through the funnel-shaped water outlet groove (13), and the tip is connected to a cylindrical water pipe interface (8).

2. The semiconductor refrigeration and dehumidification device according to claim 1, characterized in that: A heat insulation layer (12) is provided on the inner wall of the shell (11) forming the cold chamber.

3. The semiconductor refrigeration and dehumidification device according to claim 1, characterized in that: The cold end heat absorbing fin (2) is provided with a hydrophobic coating.

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