A radio frequency (RF) switch device including a RF switch integrated circuit (IC) partitioned between sides of a PCB

Abstract

This application relates to RF switch devices including radio frequency (RF) switch integrated circuits (ICs) partitioned between sides of a PCB. A radio frequency (RF) switch device includes a printed circuit board (PCB) having a first side and a second side opposite the first side, at least one blade connection on each of the first side and the second side of the PCB, and at least one throw connection on each of the first side and the second side of the PCB. The RF switch device further includes a first switch integrated circuit (IC) including at least one first switch element for selectively connecting the at least one blade connection and the at least one throw connection on the first side of the PCB, and a second switch IC including at least one second switch element for selectively connecting the at least one blade connection and the at least one throw connection on the second side of the PCB.

Description

TECHNICAL FIELD

[0001] This application generally relates to radio frequency wireless communications. BACKGROUND

[0002] Radio frequency (RF) wireless communication devices, such as cellular telephones, personal communication devices, and portable computers, include printed circuit boards (PCBs) having various components, including, for example, RF switches. The structure of typical RF switch modules (devices) has become increasingly complex in order to support multi-mode and multi-band wireless communication systems.

[0003] Depending on the circuit design, an RF switch module includes one or more poles and one or more throws. For example, an RF switch can be described as an nPmT RF switch having n poles and m throws, where n and m are each positive integers. In a solid state circuit, in order to position each throw to be able to connect to one or more poles in the nPmT RF switch, a number of lines are routed on the PCB. However, as the size of the circuit making up the nPmT switch increases, the number of routing lines of the PCB increases, and the length of the routing lines becomes longer. Generally, longer routing lines create additional insertion loss, increase parasitic capacitance and / or inductance, and otherwise degrade the overall performance of the RF switch module. SUMMARY

[0004] In one aspect, the present application provides a radio frequency (RF) switch device, comprising: a printed circuit board (PCB) having a first side and a second side opposite the first side; at least one pole connection on each of the first side and the second side of the PCB; at least one throw connection on each of the first side and the second side of the PCB; a first switch integrated circuit (IC) including at least one first switch element for selectively connecting the at least one pole connection and the at least one throw connection on the first side of the PCB; and a second switch IC including at least one second switch element for selectively connecting the at least one pole connection and the at least one throw connection on the second side of the PCB.

[0005] In another aspect, the present application provides a printed circuit board (PCB) of a radio frequency (RF) switch device, comprising: a top pole connection and a top throw connection on a top side of the PCB; and a bottom pole connection and a bottom throw connection on a bottom side of the PCB, wherein the top pole connection and the bottom pole connection are connected by a pole via through the PCB, and / or the top throw connection and the bottom throw connection are selectively connected by a throw via through the PCB.

[0006] In another aspect, the present application provides a radio frequency (RF) switch device, the RF switch device comprising: a printed circuit board (PCB) having a first side and a second side opposite the first side; at least one blade connection on each of the first side and the second side of the PCB, the at least one blade connection on the first side being in physical alignment with and electrically connected to the at least one throw connection on the second side of the PCB; at least one throw connection on each of the first side and the second side of the PCB, the at least one throw connection on the first side being in physical alignment with and electrically connected to the at least one throw connection on the second side of the PCB; a first switch integrated circuit (IC) comprising at least one first switch element for selectively connecting the at least one throw connection on the first side of the PCB; and a second switch IC comprising at least one second switch element for selectively connecting the at least one throw connection on the second side of the PCB. BRIEF DESCRIPTION OF DRAWINGS

[0007] The exemplary embodiments are best understood from the following detailed description when read with the accompanying drawing figures. It is emphasized that various features are not necessarily drawn to scale. In fact, the dimensions can be arbitrarily increased or decreased for the sake of discussion. Wherever applicable and practicable, similar reference characters refer to similar elements.

[0008] FIG. 1 is a simplified cross-section of a module having a multi-layer printed circuit board (PCB) with components contained within a cavity, according to a representative embodiment.

[0009] Figure 2A is a simplified cross-section of an RF switch module for an illustrative single-blade multiple-throw switch that includes RF switch integrated circuits (ICs) divided between the top and bottom sides of a PCB, respectively, according to a representative embodiment.

[0010] Figure 2B is a simplified circuit diagram showing possible switch element configurations for a first switch IC and a second switch IC of a divided RF switch IC, according to a representative embodiment.

[0011] Figure 3A is a simplified cross-section of an RF switch module for an illustrative double-blade multiple-throw switch that includes an RF switch IC divided between the top and bottom sides of a PCB, according to a representative embodiment.

[0012] Figure 3Bis a simplified circuit diagram showing possible switch element configurations for a first switch IC and a second switch IC of a partitioned RF switch IC according to representative embodiments.

[0013] Figure 4A is a simplified cross-sectional view of an RF switch module for an illustrative double pole, multiple throw switch including RF switch ICs partitioned between a top side and a bottom side of a PCB according to representative embodiments.

[0014] Figure 4B is a simplified circuit diagram showing possible switch element configurations for a first switch IC and a second switch IC of a partitioned RF switch IC according to representative embodiments.

[0015] Figure 5A is a simplified cross-sectional view of an RF switch module for an illustrative double pole, multiple throw switch including RF switch ICs partitioned between a top side and a bottom side of a PCB according to representative embodiments.

[0016] Figure 5B is a simplified circuit diagram showing possible switch element configurations for a first switch IC and a second switch IC of a partitioned RF switch IC according to representative embodiments.

[0017] Figure 6A is a simplified cross-sectional view of an RF switch module for an illustrative triple pole, multiple throw switch including RF switch ICs partitioned between a top side and a bottom side of a PCB according to representative embodiments.

[0018] Figure 6B is a simplified circuit diagram showing possible switch element configurations for a first switch IC and a second switch IC of a partitioned RF switch IC according to representative embodiments.

[0019] Figure 7A is a simplified cross-sectional view of an RF switch module for an illustrative triple pole, multiple throw switch including RF switch ICs partitioned between a top side and a bottom side of a PCB according to representative embodiments.

[0020] Figure 7B is a simplified circuit diagram showing possible switch element configurations for a first switch IC and a second switch IC of a partitioned RF switch IC according to representative embodiments.

[0021] Figure 8A is a simplified cross-sectional view of an RF switch module for an illustrative quadruple pole, multiple throw switch including RF switch ICs partitioned between a top side and a bottom side of a PCB according to representative embodiments.

[0022] Figure 8Bis a simplified circuit diagram showing possible switch element configurations of a first switch IC and a second switch IC of a divided RF switch IC according to representative embodiments. DETAILED DESCRIPTION

[0023] In the following detailed description, representative embodiments disclosing the disclosure are set forth for the purposes of explanation and not limitation, to provide a thorough understanding of the present teachings. It will be apparent to one having ordinary skill in the art, having the benefit of the present disclosure, that other embodiments of the present teachings can be practiced without departing from the scope of the appended claims. Furthermore, it will be apparent to one of ordinary skill in the art, having the benefit of the present disclosure, that the disclosure can be practiced without the specific details set forth herein. For the sake of brevity and clarity, well-known devices, methods, and materials have not been described in detail herein. It will be apparent to those having ordinary skill in the art, having the benefit of the present disclosure, that numerous modifications, changes, substitutions, and equivalents can be made in the specific embodiments of the present teachings without departing from the scope of the present teachings.

[0024] It should be understood that the drawings and various elements thereof are not drawn to scale. In addition, the use of relative terms such as "above," "below," "top," "bottom," "upper," "lower," "first" and "second" are used to describe the orientation of various elements to one another as illustrated in the figures. It will be understood that these relative terms are intended to encompass different orientations of the device and / or elements in addition to the orientation depicted in the figures. For example, if a device is inverted relative to the view in the figures, then the element described as above other elements would now be below those elements.

[0025] As used in the specification and the appended claims, and as used herein, the terms "substantial" or "substantially" mean within acceptable limits or degrees. For example, "substantially cancels" means that the cancellation would be acceptable to one of ordinary skill in the art. As used in the specification and the appended claims, and as used herein, the term "approximately" means within acceptable limits or amounts to one of ordinary skill in the art. For example, "approximately the same" means that one of ordinary skill in the art would consider the items being compared to be the same.

[0026] Generally, according to various embodiments, an RF switch module or device includes a printed circuit board (PCB) and a switch integrated circuit (IC) having an nPmT structure divided into two parts, a first switch IC and a second switch IC, which are assembled on the top side and bottom side of the PCB, respectively. One or more of the throws and / or blades that need to be used by both the first switch IC and the second switch IC (on both sides of the PCB) are connected or wired succinctly through corresponding through vias of the PCB. This dual-sided RF switch module reduces or minimizes insertion loss that would otherwise be caused by the wiring lines of the PCB. Additionally, the dual-sided RF switch module helps reduce size by reducing the footprint of the switch IC on the top side of the PCB, where most of the components are attached in a conventional RF switch module. The dual-sided RF switch module can be applied to single-blade multiple-throw switches as well as multiple-blade multiple-throw switches.

[0027] FIG. 1 is a simplified top perspective view of an example of a conventional RF switch module including a multi-layer PCB.

[0028] Referring to FIG. 1, a conventional RF switch module 100 includes a PCB 110 and a switch IC 120 formed on the top side (surface) of the PCB 110. In the depicted example, the RF switch module 100 is a 4PnT (four-blade n-throw) switch, where n is a positive integer. More specifically, the switch IC 120 includes a first blade connection P1 connected to a first blade line 131, a second blade connection P2 connected to a second blade line 132, a third blade connection P3 connected to a third blade line 133, and a fourth blade connection P4 connected to a fourth blade line 134. Additionally, the switch IC 120 includes a first throw connection T1 connected to a first wiring line 141 between two first throw connection T1 terminals, a second throw connection T2 connected to a second wiring line 142 between two second throw connection T2 terminals, a third throw connection T3 connected to a third wiring line 143 between two third throw connection T3 terminals, and an n-th throw connection Tn connected to a fourth wiring line 144 between two n-th throw connection Tn terminals.

[0029] Additionally, the switch IC 120 includes a number of switching elements (switches) operable to selectively connect one or more of the first to nth throw connections T1-Tn to one or more of the first to fourth pole connections P1-P4, depending on the desired circuit connection. In the depicted example, the first throw connection T1 can be selectively connected using one or more of switching elements 151a-151d, the second throw connection T2 can be selectively connected using one or more of switching elements 152a-152d, the third throw connection T3 can be selectively connected using one or more of switching elements 153a-153d, and the fourth throw connection Tn can be selectively connected using one or more of switching elements 154a-154d. Thus, for example, the first throw connection T1 can be connected to the first pole connection P1 by closing switching element 151a, to the second pole connection P2 by closing switching element 152a, to the third pole connection P3 by closing switching element 153a, and to the fourth pole connection P4 by closing switching element 154a. In this way, the first throw connection T1 can be selectively connected to any combination of zero to all of the first to fourth pole connections P1-P4. This also applies to the selective connection of the second to nth throw connections T2-Tn to any or all of the first to fourth pole connections P1-P4.

[0030] As can be seen in FIG. 1, the first to nth wiring lines 141-144 are traces formed on the top side of the PCB 110. Thus, the first to nth wiring lines 141-144 physically occupy space on the PCB 110 (e.g., which could be used for other electrical components). The occupied space must also account for the placement and spacing of the first to fourth pole connections P1-P4, the first to nth throw connections T1-Tn, and the switching elements 151a-151d, 152a-152d, 153a-153d, and 154a-154d to avoid unwanted coupling therebetween. As mentioned above, when the size of the switch IC 120 increases, the length of the first to fourth wiring lines 141-144 of the PCB 110 becomes longer, for example, thereby increasing insertion loss, parasitic capacitance, inductance, and / or unwanted coupling, and degrading the overall performance of the RF switch module 100.

[0031] Figure 2A is a simplified cross-sectional view of an RF switch module for an illustrative single-pole multi-throw switch including a RF switch integrated circuit (IC) divided between a top side and a bottom side of a PCB, in accordance with a representative embodiment. Figure 2B is a simplified circuit diagram showing possible switching element configurations for a first switch IC and a second switch IC of a divided RF switch IC, in accordance with a representative embodiment.

[0032] Referring to Figure 2A The RF switch module 200 includes a multi-layer PCB 210 and a single-pole, multiple-throw RF switch IC 220, which is divided into two parts including a first switch IC 221 (Switch T) arranged on a first side 211 (e.g., a top surface) of the PCB 210 and a second switch IC 222 (Switch B) arranged on a second side 212 (e.g., a bottom surface) of the PCB 210 opposite the first side 211. Each of the first switch IC 221 and the second switch IC 222 is likewise a single-pole, multiple-throw switch, as described below. The first switch IC 221 and the second switch IC 222 (as well as each switch IC of the various embodiments discussed herein) can be covered by a mold compound (not shown) that provides a hermetic seal and protects against environmental elements such as temperature and humidity. The PCB 210 (as well as each multi-layer PCB of the various embodiments discussed herein) can include a plurality of layers of conductive material separated by a plurality of layers of insulating material. For example, the conductive material can include copper (Cu), aluminum (Al), gold (Au), and / or silver (Ag). For example, the insulating material can include a prepreg material and / or a resin-based dielectric material.

[0033] For example, the RF switch module 200 can be connected to additional circuitry, such as a system motherboard 260. That is, the RF switch module 200 can be a ball grid array (BGA) component, for example, that includes an array of solder balls indicated by representative solder balls 261, 262, and 263 that are attached to a bottom layer of the PCB 210 via illustrative second pads 251, 252, and 253 (discussed below), respectively. In various embodiments, for example, the solder balls 261, 262, and 263 are located on multiple sides of, but not underneath, the second switch IC 222. Another option is that, for example, the RF switch module 200 can be a land grid array (LGA) component (which does not include an array of solder balls) or various other types of components without departing from the scope of the present teachings.

[0034] In the depicted embodiment, a single-pole is provided by a first blade connection P1 on the first side 211 of the PCB 210 and another first blade connection P1’ on the second side 212, which are electrically connected by a blade via 231 through the PCB 210 between the first blade connection P1 and the other blade connection P1’. For example, the blade via 231 (as well as each blade via of the various embodiments discussed herein) is a through via formed of a conductive material such as copper (Cu), aluminum (Al), gold (Au), and / or silver (Ag).

[0035] In the depicted embodiment, the first blade connections P1 and P1' are physically aligned with each other on the first side 211 and the second side 212 of the PCB 210 (e.g., aligned along the y-direction, as shown by...). Figure 2A As indicated by the coordinate system shown in the diagram, the knife path 231 is effectively a straight line. In this way, the first knife connections P1 and P1' are arranged at their closest relative to each other, and on opposite sides of the PCB 210, and therefore, the knife path 231 has its shortest length (e.g., approximately the thickness of the PCB 210). Thus, for example, in a conventional RF switch module 100, the knife path 231 is shorter than the knife line 131. This reduces or minimizes insertion loss, parasitic capacitance, parasitic inductance, and / or unwanted coupling. The first switch IC 221 and the second switch IC 222 can also be substantially aligned with each other (for example) to achieve alignment of the first knife connections P1 and P1', but regardless of whether the first switch IC 221 and the second switch IC 222 are substantially aligned with each other, the first knife connections P1 and P1' can be aligned. This is true for the first switch IC and the second switch IC in each of the various embodiments.

[0036] In an alternative embodiment, without departing from the teachings of the present invention, the first blade connections P1 and P1' may not be aligned perpendicularly to each other, thereby increasing the distance between the first blade connections P1 and P1' and extending the blade path 231. That is, for example, in FIG1, even when the first blade connections P1 and P1' are not aligned, the blade path 231 may still be shorter than the blade line 131.

[0037] Furthermore, in the depicted embodiment, the plurality of throws is provided by one or more throw connections on each of a first side 211 and a second side 212 of the PCB 210. For example, the RF switch module 200 can have a total of n throw connections indicated by representative m throw connections Tl, T2,..., Tm on the first side 211 of the PCB 210 and additional throw connections Tm+1, Tm+2,..., Tn on the second side 212, where m is a positive integer greater than or equal to 1 and n is a positive integer greater than or equal to 2. In the depicted embodiment, none of the throw connections are connected to one another by through-PCB vias. Rather, each of the throw connections Tl, T2,..., Tm on the first side 211 are connected to first pads 216, 217, and 218 on the first side 211, respectively. The first pads 216, 217, and 218 can be used to provide electrical and / or mechanical connections for various electrical components, such as dies, surface mount technology (SMT) components, etc., as will be apparent to one of skill in the art. Each of the throw connections Tm+1, Tm+2,..., Tn on the second side 212 are connected to second pads 251, 252, and 253 on the second side 212, respectively. For example, the second pads 251, 252, and 253 can be connected to solder balls 261, 262, and 263. In the depicted embodiment (as well as in other embodiments discussed herein), the solder balls 261, 262, and 263 are arranged alongside the second switch IC 222, e.g., to connect directly to the PCB 210, rather than under the second switch IC 222 itself. This provides reliable electrical and mechanical contact between the solder balls 261, 262, and 263 and the RF switch module 200. For example, the first pads 216, 217, and 218 and the second pads 251, 252, and 253 are formed of electrically conductive materials, such as copper (Cu), aluminum (Al), gold (Au), and / or silver (Ag).

[0038] The first switch IC 221 of the partitioned RF switch IC 220 includes first switch elements for selectively connecting the throw connections Tl, T2,..., Tm to the first blade connection Pl, and the second switch IC 222 includes second switch elements for selectively connecting the throw connections Tm+1, Tm+2,..., Tn to another first blade connection Pl’. With reference to Figure 2B, the possible switch element configuration of each of the throw connections T1, T2,..., Tm of the first switch IC 221 is shown by representative switch element 225, which selectively connects each of the throw connections T1, T2,..., Tm to a first blade connection P1. Similarly, the possible switch element configuration of each of the throw connections Tm+1, Tm+2,..., Tn of the second switch IC 222 is shown by representative switch element 226, which selectively connects each of the throw connections Tm+1, Tm+2,..., Tn to another first blade connection P1’. The first blade connections P1, P1’ are connected by a blade pass 231 indicated by a dashed line.

[0039] Note that only one switch element 225 is shown in the first switch IC 221 and only one switch element 226 is shown in the second switch IC 222 for convenience. However, it should be understood that each of the throw connections T1, T2,..., Tm in the first switch IC 221 can be connected to the first blade connection P1 by a corresponding switch element 225, and each of the throw connections Tm+1, Tm+2,..., Tn in the second switch IC 222 can be connected to the other first blade connection P1’ by a corresponding switch element 226.

[0040] In each of the various embodiments discussed herein, Figures 2A to 8B ) the switch elements (e.g., switch elements 225 and 226) can operate under the control of a controller (not shown) using software, firmware, hardwired logic circuitry, or a combination thereof, such as one or more computer processors, application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or a combination thereof. In particular, the processors can be constructed of any combination of hardware, firmware, or software architectures, and can include their own memory (e.g., non-volatile memory) for storing executable software / firmware executable code that allows the executable software / firmware to perform various functions. In an embodiment, the computer processors can comprise a central processing unit (CPU) that executes an operating system, for example.

[0041] Memory (not shown) can be provided to store software and / or programs executable by the processor(s) and / or data, such as predetermined switch settings for various circuit configurations. For example, the memory can be implemented by any number, type and combination of random access memory (RAM) and read only memory (ROM), and the memory can store, for example, various types of information such as computer programs and software algorithms executable by the one or more processors (and / or other components), as well as data. Various types of ROM and RAM can include any number, type and combination of computer readable storage media that is tangible and non-transitory (e.g., as compared to transitory propagating signals), such as a hard drive, solid state drive, flash memory, universal serial bus (USB) drive, electrically programmable read only memory (EPROM), electrically erasable programmable read only memory (EEPROM), CD, DVD, optical disk, floppy disk, magneto-optical disk, register file of the processor, etc. The term computer readable storage media also refers to various types of recording media capable of being accessed via a network or communication link. For example, data can be retrieved from the memory over the Internet or through a local area network.

[0042] Figure 3A is a simplified cross-sectional view of an RF switch module for an illustrative double pole multiple throw switch, including RF switch ICs partitioned between the top and bottom sides of a PCB, according to representative embodiments. Figure 3B is a simplified circuit diagram showing possible switch element configurations for first and second switch ICs of a partitioned RF switch IC, according to representative embodiments.

[0043] Reference is made to Figure 3A RF switch module 300 includes a multi-layer PCB 310 and a double pole multiple throw RF switch IC 320, which is partitioned into two parts including a first switch IC 321 arranged on a first side 311 (e.g., a top surface) of PCB 310 and a second switch IC 322 arranged on a second side 312 (e.g., a bottom surface) of PCB 310 opposite first side 311. Each of first switch IC 321 and second switch IC 322 is a single pole multiple throw switch, as described below. For example, RF switch module 300 can be connected to additional circuitry, such as system motherboard 260. That is, RF switch module 300 can be a BGA component or LGA component (for example) or other type of component that is attached to system motherboard 260 by a ball grid array indicated by representative balls 261, 262 and 263.

[0044] In the depicted embodiment, dual blades are provided by a first blade connection Pi on a first side 311 of the PCB 310 and a second blade connection P2 on a second side 312. The first blade connection Pi or the second blade connection P2 is not electrically connected to the opposite side of the PCB 310 by a through via. For illustrative purposes, the first blade connection Pi is connected to the second pad 251 by a blade via 334 through the PCB 310, and the second blade connection P2 is connected to the second pad 253.

[0045] Furthermore, in the depicted embodiment, multiple throws are provided by one or more throw connections on each of a first side 311 and a second side 312 of the PCB 310, including one or more isolated throw connections on only the first side 311 or the second side 312, and one or more joined throw connections having throw connections on both the first side 311 and the second side 312 joined by throw vias through the PCB 310. For example, the RF switch module 300 can have representative throw connections Tti, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on the first side 311 of the PCB 310 and additional throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on the second side 312, where each of m, n, and k is a positive integer greater than or equal to 1.

[0046] In the depicted embodiment, none of the throw connections Tt1, Tt2,..., Ttn and Tb1, Tb2,..., Tbk are connected to another throw connection through a through via in the PCB 310. Further, the throw connection Tb1 can be connected to the pad 252. However, for example, the throw connection Ttb1 is connected to another throw connection Ttb1' through a throw via 331, the throw connection Ttb2 is connected to another throw connection Ttb2' through a throw via 332, and the throw connection Ttbm is connected to another throw connection Ttbm' through a throw via 333. More or fewer throw connections can be included on the first side 311 and / or the second side 312 of the PCB 310 without departing from the scope of the present teachings, and the number of throw connections on the first side 311 and the second side 312 can differ from one another. In the depicted embodiment, the throw connections Tt1, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on the first side 311 and the additional throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on the second side 312 connecting the first switch IC 321 and the second switch IC 322 through the throw vias 331, 332, and 333 are located in a central portion of the first switch IC 321 and the second switch IC 322 rather than on an outer portion, while the first blade connection P1 and the second blade connection P2 are located on the outer portion to connect to the solder balls 262 and 263, respectively. Further, for example, the throw vias 331, 332, and 333 (as well as each throw via of the various embodiments discussed herein) are through vias formed of a conductive material such as copper (Cu), aluminum (Al), gold (Au), and / or silver (Ag).

[0047] In the depicted embodiment, the throw connections Ttb1, Ttb1' are physically aligned with one another on the first side 311 and the second side 312 of the PCB 310 (e.g., aligned along the y-direction, as indicated by the coordinate system shown in FIG. 3B), and the throw via 331 is effectively a straight line. In this manner, the throw connections Ttb1, Ttb1' are disposed closest to one another while being on opposite sides of the PCB 310, and thus, the throw via 331 has its shortest length (e.g., approximately the thickness of the PCB 310). Accordingly, for example, in the conventional RF switch module 100, the throw via 331 is shorter than the first routing line 141. This can reduce or decrease insertion loss, parasitic capacitance, parasitic inductance, and / or undesired coupling. In alternative embodiments, the throw connections Ttb1, Ttb1' can not be aligned perpendicularly to one another, thereby increasing the distance between the throw connections Ttb1, Ttb1' and lengthening the throw via 331 without departing from the scope of the present teachings. That is, for example, in FIG. 1, the throw via 331 can still be shorter than the first routing line 141. Figure 3A ​

[0048] Likewise, in the depicted embodiment, the additional throw connections Ttb2, Ttb2' and Ttbm, Ttbm' are shown as physically aligned with each other (e.g., aligned along the y-direction) on the first side 311 and the second side 312 of the PCB 310, respectively, and the throw connection vias 332 and 333 are effectively straight lines. That is, the throw connections Ttb1, Ttb1', Ttb2, Ttb2' and Ttbm, Ttbm' are connected perpendicularly by the throw vias 331, 332 and 333, respectively. Thus, the routing loss of the PCB 310 can be minimized by connecting the opposite throw connections with the shortest distance. However, each set of throw connections Ttb2, Ttb2' and Ttbm, Ttbm' can be diagonally offset with respect to each other, as discussed above, without departing from the scope of the present teachings.

[0049] The first switch IC 321 of the partitioned RF switch IC 320 includes first switch elements for selectively connecting the throw connections Tt1, Tt2,..., Ttn to the first blade connection P1 on the first side 311 and for selectively connecting the throw connections Ttb1, Ttb2,..., Ttbm to the first blade connection P1 and the second blade connection P2 on the first side 311 and the second side 312, respectively. Similarly, the second switch IC 322 of the partitioned RF switch IC 320 includes second switch elements for selectively connecting the throw connections Tb1, Tb2,..., Tbn to the second blade connection P2 on the second side 312 and for selectively connecting the throw connections Ttb1', Ttb2',..., Ttbm' to the first blade connection P1 and the second blade connection P2 on the first side 311 and the second side 312, respectively.

[0050] With reference to Figure 3B The possible switch element configurations for each of the throw connections Tt1, Tt2,..., Ttn and the throw connections Ttb1, Ttb2,..., Ttbm of the first switch IC 321 are shown by representative switch elements 325 and 327. The switch element 325 selectively connects the throw connections Tt1, Tt2,..., Ttn to the first blade connection P1. Similarly, the switch element 326 selectively connects the throw connections Tb1, Tb2,..., Tbk to the second blade connection P2. The switch elements 327 and 328 selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection P1 and the second blade connection P2. The throw connections Ttb1, Ttb2,..., Ttbm are connected to the throw connections Ttb1', Ttb2',..., Ttbm' by throw vias 331, 332 and 333, respectively, which are indicated by a single dashed line for ease of illustration.

[0051] Note that only one switch element 325 and one switch element 327 are shown in the first switch IC 321 for convenience, and only one switch element 326 and one switch element 328 are shown in the second switch IC 322. However, it should be understood that each of the throw connections Tt1, Tt2,..., Ttn in the first switch IC 321 can be connected to the first blade connection P1 through a corresponding switch element 325, each of the throw connections Ttb1, Ttb2,..., Ttbm in the first switch IC 321 can be connected to the first blade connection P1 through a corresponding switch element 327, each of the throw connections Tb1, Tb2,..., Tbk in the second switch IC 322 can be connected to the second blade connection P2 through a corresponding switch element 326, and each of the throw connections Ttb1', Ttb2',..., Ttbm' in the second switch IC 322 can be connected to the second blade connection P2 through a corresponding switch element 328. Of course, whenever a throw connection Ttb1, Ttb2,..., Ttbm is connected to the first blade connection P1 through a corresponding switch element 327, the throw connection Ttb1', Ttb2',..., Ttbm' is likewise connected to the first blade connection P1 via the throw paths 331, 332, and 333. Furthermore, whenever a throw connection Ttb1', Ttb2',..., Ttbm' is connected to the second blade connection P2 through a corresponding switch element 328, the throw connection Ttb1, Ttb2,..., Ttbm is likewise connected to the second blade connection P2 via the throw paths 331, 332, and 333.

[0052] Figure 4A is a simplified cross-sectional view of an RF switch module for an illustrative double-blade multi-throw switch, according to representative embodiments, including an RF switch IC partitioned between a top side and a bottom side of a PCB. Figure 4B is a simplified circuit diagram showing possible switch element configurations for a first switch IC and a second switch IC of a partitioned RF switch IC, according to representative embodiments.

[0053] Reference is made to Figure 4A The RF switch module 400 includes a multi-layer PCB 410 and a double-blade multi-throw RF switch IC 420, which is partitioned into two parts including a first switch IC 421 arranged on a first side 411 (e.g., a top surface) of the PCB 410 and a second switch IC 422 arranged on a second side 412 (e.g., a bottom surface) of the PCB 410 opposite the first side 411. Each of the first switch IC 421 and the second switch IC 422 is a double-blade multi-throw switch, as described below. The RF switch module 400 can be connected to additional circuitry, such as a system motherboard 260, for example, as discussed above with reference to other embodiments.

[0054] In the depicted embodiment, the dual blades are provided by first blade connections P1, P1' and second blade connections P2, P2'. The first blade connection P1 on the first side 411 of the PCB 410 and the other first blade connection P1' on the second side 412 are electrically connected by a blade pass 431 through the PCB 410 between the first blade connection P1 and the other first blade connection P1'. The second blade connection P2 on the first side 411 of the PCB 410 and the other second blade connection P2' on the second side 412 are electrically connected by a blade pass 432 through the PCB 410 between the second blade connection P2 and the other second blade connection P2'. For illustrative purposes, the first blade connections P1, P1' are connected to the second pads 251 and the second blade connections P2, P2' are connected to the second pads 253.

[0055] Furthermore, in the depicted embodiment, a plurality of throws are provided by one or more throw connections on each of the first side 411 and the second side 412 of the PCB 410, including one or more isolated throw connections on only the first side 411 or the second side 412, and one or more joined throw connections having throw connections on both the first side 411 and the second side 412 joined by a throw pass through the PCB 410. For example, the RF switch module 400 can have representative throw connections Tt1, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on the first side 411 of the PCB 410 and additional throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on the second side 412, where each of m, n, and k is a positive integer greater than or equal to 1.

[0056] In the depicted embodiment, as in Figure 3AIn particular embodiments, none of the throw connections Tt1, Tt2,..., Ttn and Tb1, Tb2,..., Tbk are connected to another throw connection through a via in the PCB 410. However, the throw connections Ttb1, Ttb1' are connected through the throw via 331, the throw connections Ttb2, Ttb2' are connected through the throw via 332, and the throw connections Ttbm, Ttbm' are connected through the throw via 333, for example, as discussed above. Further, in the depicted embodiment, the throw connections Ttb1, Ttb1', the throw connections Ttb2, Ttb2', and the throw connections Ttbm, Ttbm' are physically aligned with each other on the first side 411 and the second side 412 of the PCB 410, respectively (e.g., aligned along the y-direction), and the connecting throw vias 331, 332, and 333 are effectively straight lines, as discussed above. However, each set of throw connections Ttb1, Ttb1', Ttb2, Ttb2', and Ttbm, Ttbm' can be diagonally offset relative to each other without departing from the scope of the present teachings.

[0057] The first switch IC 421 of the split RF switch IC 420 includes first switch elements for selectively connecting the throw connections Tt1, Tt2,..., Ttn and the throw connections Ttb1, Ttb2,..., Ttbm to the first blade connection P1 and the second blade connection P2 on the first side 411. Similarly, the second switch IC 422 of the split RF switch IC 420 includes second switch elements for selectively connecting the throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' to the first blade connection P1 and the second blade connection P2 on the second side 412.

[0058] Reference is made to Figure 4B The possible (optional) switch element configurations for each of the throw connections Tt1, Tt2,..., Ttn of the first switch IC 421 are shown by representative switch elements 425a, 425b, 425c, and 425d. That is, each of the throw connections Tt1, Tt2,..., Ttn can be implemented in the first switch IC 421 using switch element 425a, using switch element 425b, or using switch elements 425c and 425d to provide unique benefits for any particular situation or to meet specialized design requirements of various embodiments, as will be apparent to those skilled in the art. Switch element 425a is configured to selectively connect the throw connections Tt1, Tt2,..., Ttn to the first blade connection P1. Switch element 425b is configured to selectively connect the throw connections Tt1, Tt2,..., Ttn to the second blade connection P2. Switch elements 425c and 425d are configured to selectively connect the throw connections Tt1, Tt2,..., Ttn to the first blade connection P1, the second blade connection P2, or both.

[0059] Likewise, the possible switch element configurations for each of the throw connections Tb1, Tb2,..., Tbk of the second switch IC 422 are shown by representative switch elements 426a, 426b, and 426c. That is, as discussed above, each of the throw connections Tt1, Tt2,..., Ttk can be implemented in the second switch IC 422 using switch element 426a, using switch element 426b, or using switch elements 426c and 426d to provide unique benefits for any particular situation or to meet specialized design requirements of various embodiments, as will be apparent to those skilled in the art. Switch element 426a is configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the second blade connection P2’. Switch element 426b is configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the first blade connection P1’. Switch elements 426c and 426d are configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the first blade connection P1’, the second blade connection P2’, or both.

[0060] Figure 4B Also shown are the possible switch element configurations for each of the throw connections Ttb1, Ttb2,..., Ttbm of the first switch IC 421 as shown by representative switch elements 427a, 427b, 427c, 427d, 427e, 427f, 427g, 427h, 427i, 427j, 427k, and 4271 in the first switch IC 421, and the possible switch element configurations for each of the throw connections Ttb1’, Ttb2’,..., Ttbm’ of the second switch IC 422 as shown by representative switch elements 428a, 428b, 428c, 428d, 428e, 428f, 428g, 428h, 428i, 428j, 428k, and 4281 in the second switch IC 422. As described above, each of the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1’, Ttb2’,..., Ttbm’ can be implemented according to one of the depicted possible switch element configurations to provide unique benefits for any particular situation or to meet specialized design requirements of various embodiments, as will be apparent to those skilled in the art.

[0061] Switch elements 427a and 428a are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2', or both. Switch elements 427b and 428b are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second blade connection P2, the first blade connection PI', or both. Switch elements 427c and 428c are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the first blade connection PI', or both. Switch elements 427d and 428d are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second blade connection P2, the second blade connection P2', or both.

[0062] Switch elements 427e, 427f, and 428e are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2, the second blade connection P2', or any combination thereof. Switch elements 427g, 427h, and 428f are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2, the first blade connection PI', or any combination thereof. Switch elements 427i, 428g, and 428h are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2', the first blade connection PI', or any combination thereof. Switch elements 427j, 428i, and 428j are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second blade connection P2, the second blade connection P2', the first blade connection PI', or any combination thereof. Switch elements 427k, 4271, 428k, and 4281 are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2, the second blade connection P2', the first blade connection PI', or any combination thereof.

[0063] The throw connections Ttb1, Ttb2,..., Ttbm are connected to the throw connections Ttb1', Ttb2',..., Ttbm' by throw paths 331, 332, and 333, respectively, which are indicated by dashed lines for ease of illustration. In addition, the first blade connections P1, P1' are connected by a blade path 431, and the second blade connections P2, P2' are connected by a blade path 432, which are indicated by dashed lines, respectively.

[0064] Figure 5A is a simplified cross-sectional view of an RF switch module for an illustrative double-blade multi-throw switch, including a split RF switch IC between a top side and a bottom side of a PCB, according to representative embodiments. Figure 5B is a simplified circuit diagram showing possible switch element configurations of a first switch IC and a second switch IC of a split RF switch IC, according to representative embodiments.

[0065] Reference is made to Figure 5A , the RF switch module 500 includes a multi-layer PCB 510 and a double-blade multi-throw RF switch IC 520, which is split into two parts including a first switch IC 521 arranged on a first side 511 (e.g., a top surface) of the PCB 510 and a second switch IC 522 arranged on a second side 512 (e.g., a bottom surface) of the PCB 510 opposite the first side 511. In the depicted embodiment, the first switch IC 521 is a double-blade multi-throw switch, and the second switch IC 522 is a single-blade multi-throw switch, as described below. The RF switch module 500 can be connected to additional circuitry, such as a system motherboard 260, for example, as discussed above with reference to other embodiments.

[0066] In the depicted embodiment, the double-blade of the first switch IC 521 is provided by first and second blade connections P1 and P2, and the single-blade of the second switch IC 522 is provided by a second blade connection P2'. In alternative embodiments, without departing from the scope of the present teachings, the implementation can be reversed such that the first switch IC 521 is configured to implement the single-blade of the RF switch IC 520, and the second switch IC 522 is configured to implement the double-blade of the RF switch IC 520.

[0067] In Figure 5AFor illustrative purposes, first blade connection PI on first side 511 is electrically connected to second pad 251 (which is connected to solder ball 261) by a blade pass-through 531 through PCB 510. Second blade connection P2 on first side 511 and another second blade connection P2' on second side 512 are electrically connected by a blade pass-through 532 through PCB 510 between second blade connection P2 and another second blade connection P2'. For illustrative purposes, second blade connections P2, P2' are connected to second pad 253.

[0068] Furthermore, in the depicted embodiment, for example, RF switch module 500 can have representative throw connections Tti, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on first side 511 of PCB 510 and additional throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on second side 512 of PCB 510, where each of m, n, and k is a positive integer greater than or equal to 1. The arrangement of representative throw connections Tti, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on first side 511 of PCB 510 and throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on second side 512 of PCB 510 is substantially the same as discussed above with reference to RF switch modules 300 and 400, and thus, will not be described again here.

[0069] First switch IC 521 of partitioned RF switch IC 520 includes first switch elements for selectively connecting throw connections Tti, Tt2,..., Ttn and throw connections Ttb1, Ttb2,..., Ttbm to first blade connection PI and second blade connection P2 on first side 511. Similarly, second switch IC 522 of partitioned RF switch IC 520 includes second switch elements for selectively connecting throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' to second blade connection P2' on second side 512.

[0070] Reference is made to Figure 5B The possible switch element configurations for each of throw connections Tti, Tt2,..., Ttn of first switch IC 521 are shown by representative switch elements 425a, 425b, 425c, and 425d, which are the same as discussed above with reference to Figure 4BThe same is discussed and thus will not be repeated here. The possible switch element configuration for each of the throw connections Ttb1, Ttb2,..., Ttbm of the first switch IC 521 is shown as by representative switch elements 527a, 527b, 527c, and 527d in the first switch IC 521, and the possible switch element configuration for each of the throw connections Ttb1', Ttb2',..., Ttbm' of the second switch IC 522 is shown as by representative switch elements 528a, 528b, and 528c in the second switch IC 522. As described above, each of the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' can be implemented according to one of the depicted possible switch element configurations to provide unique benefits for any particular situation or to meet specialized design requirements of various embodiments, as will be apparent to one of skill in the art.

[0071] Figure 5B The same is discussed and thus will not be repeated here. The possible switch element configuration for each of the throw connections Ttb1, Ttb2,..., Ttbm of the first switch IC 521 is shown as by representative switch elements 527a, 527b, 527c, and 527d in the first switch IC 521, and the possible switch element configuration for each of the throw connections Ttb1', Ttb2',..., Ttbm' of the second switch IC 522 is shown as by representative switch elements 528a, 528b, and 528c in the second switch IC 522. As described above, each of the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' can be implemented according to one of the depicted possible switch element configurations to provide unique benefits for any particular situation or to meet specialized design requirements of various embodiments, as will be apparent to one of skill in the art.

[0072] Switch elements 527a and 528a are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2', or both. Switch elements 527b and 528b are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second blade connection P2, the second blade connection P2', or both. Switch elements 527c, 527d, and 528c are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2, the second blade connection P2', or any combination thereof. The throw connections Ttb1, Ttb2,..., Ttbm are connected to the throw connections Ttb1', Ttb2',..., Ttbm' by throw paths 331, 332, and 333, respectively, which are indicated by dashed lines for ease of illustration. Further, the second blade connections P2, P2' are connected by a blade path 532, and the second blade connections P2, P2' are connected by a blade path 432, which are indicated by dashed lines, respectively.

[0073] Figure 6Ais a simplified cross-sectional view of an RF switch module for an illustrative three-pole multi-throw switch, including a split RF switch IC, according to representative embodiments. Figure 6B is a simplified circuit diagram showing possible switch element configurations for a first switch IC and a second switch IC of a split RF switch IC, according to representative embodiments.

[0074] Reference is made to Figure 6A , the RF switch module 600 includes a multi-layer PCB 610 and a three-pole multi-throw RF switch IC 620 split into two parts including a first switch IC 621 arranged on a first side 611 (e.g., a top surface) of the PCB 610 and a second switch IC 622 arranged on a second side 612 (e.g., a bottom surface) of the PCB 610 opposite the first side 611. In the depicted embodiment, the first switch IC 621 is a two-pole multi-throw switch and the second switch IC 622 is a two-pole multi-throw switch, as described below. The RF switch module 600 can be connected to additional circuitry, such as a system motherboard 260, for example, as discussed above with reference to other embodiments.

[0075] In the depicted embodiment, the two poles of the first switch IC 621 are provided by a first pole connection P1 and a second pole connection P2, and the two poles of the second switch IC 622 are provided by a first pole connection P1’ and a third pole connection P3. For illustrative purposes, the first pole connection P1 on the first side 611 and another first pole connection P1’ on the second side 612 are electrically connected by a pole via 631 through the PCB 610 and further connected to the second pad 251 (which is connected to the solder ball 261). For illustrative purposes, the second pole connection P2 on the first side 611 is electrically connected to the second pad 253 (which is connected to the solder ball 263) by a pole via 632 through the PCB 610. For illustrative purposes, the third pole connection P3 on the second side 612 is electrically connected to the second pad 252 (which is connected to the solder ball 262).

[0076] Furthermore, in the depicted embodiment, the RF switch module 600 can have representative throw connections Tt1, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on a first side 611 of the PCB 610 and additional throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on a second side 612 of the PCB 610, by way of example. The arrangement of the representative throw connections Tt1, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on the first side 611 and the throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on the second side 612 of the PCB 610 is substantially the same as discussed above with reference to the RF switch modules 300 and 400, and thus, will not be repeated here.

[0077] The first switch IC 621 of the partitioned RF switch IC 620 includes first switch elements for selectively connecting the throw connections Tt1, Tt2,..., Ttn and the throw connections Ttb1, Ttb2,..., Ttbm to the first blade connection P1 and the second blade connection P2 on the first side 611. The second switch IC 622 of the partitioned RF switch IC 620 includes second switch elements for selectively connecting the throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' to the first blade connection P1' and the third blade connection P3 on the second side 612.

[0078] With reference to Figure 6B , the possible switch element configurations for each of the throw connections Tt1, Tt2,..., Ttn of the first switch IC 621 are shown by representative switch elements 425a, 425b, 425c, and 425d, which are the same as discussed above with reference to Figure 4B , and thus, will not be repeated here. The possible switch element configurations for each of the throw connections Tb1, Tb2,..., Tbk of the second switch IC 622 are shown by representative switch elements 626a, 626b, 626c, and 626d. The switch element 626a is configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the third blade connection P3. The switch element 626b is configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the first blade connection P1'. The switch elements 626c and 626d are configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the third blade connection P3, the first blade connection P1', or both.

[0079] Figure 6BAlso shown are possible switch element configurations for each of the throw connections Ttb1, Ttb2,..., Ttbm of the first switch IC 621 as shown by representative switch elements 627a, 627b, 627c, 627d, 627e, 627f, 627g, 627h, 627i, 627j, 627k, and 6271 in the first switch IC 621, and for each of the throw connections Ttb1', Ttb2',..., Ttbm' of the second switch IC 622 as shown by representative switch elements 628a, 628b, 628c, 628d, 628e, 628f, 628g, 628h, 628i, 628j, 628k, and 6281 in the second switch IC 622. As described above, each of the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' can be implemented according to one of the depicted possible switch element configurations to provide unique benefits for any particular situation or to meet specialized design requirements of various embodiments, as will be apparent to those skilled in the art.

[0080] Switch elements 627a and 628a are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first pole connection P1, the third pole connection P3, or both. Switch elements 627b and 628b are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second pole connection P2, the first pole connection P1', or both. Switch elements 627c and 628c are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first pole connection P1, the first pole connection P1', or both. Switch elements 627d and 628d are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second pole connection P2, the third pole connection P3, or both.

[0081] Switch elements 627e, 627f, and 628e are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection P1, the second blade connection P2, the third blade connection P3, or any combination thereof. Switch elements 627g, 627h, and 628f are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection P1, the second blade connection P2, the first blade connection P1', or any combination thereof. Switch elements 627i, 628g, and 628h are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection P1, the third blade connection P3, the first blade connection P1', or any combination thereof. Switch elements 627j, 628i, and 628j are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second blade connection P2, the third blade connection P3, the first blade connection P1', or any combination thereof. Switch elements 627k, 6271, 628k, and 6281 are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection P1, the second blade connection P2, the third blade connection P3, the first blade connection P1', or any combination thereof.

[0082] The throw connections Ttb1, Ttb2,..., Ttbm are connected to the throw connections Ttb1', Ttb2',..., Ttbm' by throw paths 331, 332, and 333, respectively, which are indicated by dashed lines for ease of illustration. In addition, the first blade connections P1, P1' are connected by a blade path 631, which is indicated by a dashed line.

[0083] Figure 7A is a simplified cross-sectional view of an RF switch module for an illustrative three-blade multi-throw switch that includes a split RF switch IC between a top side and a bottom side of a PCB according to a representative embodiment. Figure 7B is a simplified circuit diagram showing possible switch element configurations of a first switch IC and a second switch IC of a split RF switch IC according to a representative embodiment.

[0084] Reference is made to Figure 7AThe RF switch module 700 includes a multi-layer PCB 710 and a three-pole, multi-throw RF switch IC 720, which is divided into two parts including a first switch IC 721 arranged on a first side 711 (e.g., a top surface) of the PCB 710 and a second switch IC 722 arranged on a second side 712 (e.g., a bottom surface) of the PCB 710 opposite the first side 711. In the depicted embodiment, the first switch IC 721 is a two-pole, multi-throw switch and the second switch IC 722 is a single-pole, multi-throw switch, as described below. The RF switch module 700 can be connected to additional circuitry, such as the system motherboard 260, for example, as discussed above with reference to other embodiments.

[0085] In the depicted embodiment, the two poles of the first switch IC 721 are provided by a first pole connection P1 and a second pole connection P2, and the single pole of the second switch IC 722 is provided by a third pole connection P3. In alternative embodiments, the implementation can be reversed such that the first switch IC 721 is configured to implement the single pole of the RF switch IC 720 and the second switch IC 722 is configured to implement the two poles of the RF switch IC 720, without departing from the scope of the present teachings.

[0086] For illustrative purposes, the first pole connection P1 on the first side 711 is electrically connected to the second pad 251 (which is connected to the solder ball 261) by a pole via 731 through the PCB 710. For illustrative purposes, the second pole connection P2 on the first side 711 is electrically connected to the second pad 253 (which is connected to the solder ball 263) by a pole via 732 through the PCB 710. For illustrative purposes, the third pole connection P3 on the second side 712 is electrically connected to the second pad 252 (which is connected to the solder ball 262). The RF switch module 700 does not include a pole via on the opposite side of the PCB 710 connecting the terminals of the same pole.

[0087] Furthermore, in the depicted embodiment, the RF switch module 700 can have representative throw connections Tt1, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on a first side 711 of the PCB 710 and additional throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on a second side 712 of the PCB 710, for example. Each of m, n, and k is a positive integer greater than or equal to 1. The arrangement of the representative throw connections Tt1, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on the first side 711 of the PCB 710 and the throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on the second side 712 of the PCB 710 is substantially the same as discussed above with reference to the RF switch modules 300 and 400, and thus, will not be repeated here.

[0088] The first switch IC 721 of the partitioned RF switch IC 720 includes first switch elements for selectively connecting the throw connections Tt1, Tt2,..., Ttn and the throw connections Ttb1, Ttb2,..., Ttbm to a first blade connection P1 and a second blade connection P2 on the first side 711. The second switch IC 722 of the partitioned RF switch IC 720 includes second switch elements for selectively connecting the throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' to a third blade connection P3 on the second side 712.

[0089] With reference to Figure 7B , the possible switch element configurations for each of the throw connections Tt1, Tt2,..., Ttn of the first switch IC 721 are shown by representative switch elements 425a, 425b, 425c, and 425d, which are the same as discussed above with reference to Figure 4B , and thus, will not be repeated here. The possible switch element configurations for each of the throw connections Tb1, Tb2,..., Tbk of the second switch IC 722 are shown by representative switch elements 726, which are configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the third blade connection P3.

[0090] Figure 7BAlso shown are possible switch element configurations for each of the throw connections Ttb1, Ttb2,..., Ttbm of the first switch IC 721 as shown by representative switch elements 727a, 727b, 727c, and 727d in the first switch IC 721, and for each of the throw connections Ttb1', Ttb2',..., Ttbm' of the second switch IC 722 as shown by representative switch elements 728a, 728b, and 728c in the second switch IC 722. As described above, each of the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' can be implemented according to one of the depicted possible switch element configurations to provide unique benefits for any particular situation or to meet specialized design requirements of various embodiments, as will be apparent to those skilled in the art.

[0091] Switch elements 727a and 728a are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first pole connection P1, the third pole connection P3, or both. Switch elements 727b and 728b are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second pole connection P2, the third pole connection P3, or both. Switch elements 727c, 727d, and 728c are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first pole connection P2, the second pole connection P2, the third pole connection P3, or any combination thereof. The throw connections Ttb1, Ttb2,..., Ttbm are connected to the throw connections Ttb1', Ttb2',..., Ttbm' by throw paths 331, 332, and 333, respectively, which are indicated by dashed lines for ease of illustration.

[0092] Figure 8A is a simplified cross-sectional view of an RF switch module for an illustrative four-pole multi-throw switch including RF switch ICs partitioned between the top and bottom sides of a PCB according to representative embodiments. Figure 8B is a simplified circuit diagram showing possible switch element configurations for a first switch IC and a second switch IC of a partitioned RF switch IC according to representative embodiments.

[0093] Reference is made to Figure 8AThe RF switch module 800 includes a multi-layer PCB 810 and a four-pole, multi-throw RF switch IC 820, which is divided into two parts including a first switch IC 821 arranged on a first side 811 (e.g., a top surface) of the PCB 810 and a second switch IC 822 arranged on a second side 812 (e.g., a bottom surface) of the PCB 810 opposite the first side 811. In the depicted embodiment, the first switch IC 821 is a two-pole, multi-throw switch and the second switch IC 822 is a two-pole, multi-throw switch, as described below. The RF switch module 800 can be connected to additional circuitry, such as the system motherboard 260, for example, as discussed above with reference to other embodiments.

[0094] In the depicted embodiment, the two poles of the first switch IC 821 are provided by a first pole connection P1 and a second pole connection P2, and the two poles of the second switch IC 822 are provided by a third pole connection P3 and a fourth pole connection P4. For illustrative purposes, the first pole connection P1 on the first side 811 is electrically connected to the second pad 251 (which is connected to the solder ball 261) by a pole via 831 through the PCB 810. For illustrative purposes, the second pole connection P2 on the first side 811 is electrically connected to the second pad 253 (which is connected to the solder ball 263) by a pole via 832 through the PCB 810. For illustrative purposes, the third pole connection P3 on the second side 812 is electrically connected to the second pad 254 (which is connected to the solder ball 264). For illustrative purposes, the fourth pole connection P4 on the second side 812 is electrically connected to the second pad 252 (which is connected to the solder ball 262).

[0095] Furthermore, in the depicted embodiment, the RF switch module 800 can have representative throw connections Tt1, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on the first side 811 of the PCB 810 and additional throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on the second side 812 of the PCB 810, for example, where each of m, n, and k is a positive integer greater than or equal to 1. The arrangement of the representative throw connections Tt1, Tt2,..., Ttn and Ttb1, Ttb2,..., Ttbm on the first side 811 of the PCB 810 and the throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' on the second side 812 are substantially the same as discussed above with reference to the RF switch modules 300 and 400, and thus, will not be described again here.

[0096] The first switch IC 821 of the divided RF switch IC 820 includes first switch elements for selectively connecting the throw connections Tt1, Tt2,..., Ttn and the throw connections Ttb1, Ttb2,..., Ttbm to the first blade connection PI and the second blade connection P2 on the first side 811. The second switch IC 822 of the divided RF switch IC 820 includes second switch elements for selectively connecting the throw connections Tb1, Tb2,..., Tbk and Ttb1', Ttb2',..., Ttbm' to the third blade connection P3 and the fourth blade connection P4 on the second side 812.

[0097] With reference to Figure 8B , the possible switch element configurations for each of the throw connections Tt1, Tt2,..., Ttn of the first switch IC 821 are shown by representative switch elements 425a, 425b, 425c, and 425d, which are the same as discussed above with reference to Figure 4B , and thus the description will not be repeated here. The possible switch element configurations for each of the throw connections Tb1, Tb2,..., Tbk of the second switch IC 822 are shown by representative switch elements 826a, 826b, 826c, and 826d. Switch element 826a is configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the third blade connection P3. Switch element 826b is configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the fourth blade connection P4. Switch elements 826c and 826d are configured to selectively connect the throw connections Tb1, Tb2,..., Tbk to the third blade connection P3, the fourth blade connection P4, or both.

[0098] Figure 8BAlso shown are possible switch element configurations for each of the throw connections Ttb1, Ttb2,..., Ttbm of the first switch IC 821 as shown by representative switch elements 827a, 827b, 827c, 827d, 827e, 827f, 827g, 827h, 827i, 827j, 827k, and 8271 in the first switch IC 821, and possible switch element configurations for each of the throw connections Ttb1', Ttb2',..., Ttbm' of the second switch IC 822 as shown by representative switch elements 828a, 828b, 828c, 828d, 828e, 828f, 828g, 828h, 828i, 828j, 828k, and 8281 in the second switch IC 822. As described above, each of the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' can be implemented according to one of the depicted possible switch element configurations to provide unique benefits for any particular situation or to meet specialized design requirements of various embodiments, as will be apparent to those skilled in the art.

[0099] Switch elements 827a and 828a are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection P1, the third blade connection P3, or both. Switch elements 827b and 828b are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second blade connection P2, the fourth blade connection P4, or both. Switch elements 827c and 828c are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection P1, the fourth blade connection P4, or both. Switch elements 827d and 828d are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second blade connection P2, the third blade connection P3, or both.

[0100] Switch elements 827e, 827f, and 828e are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2, the third blade connection P3, or any combination thereof. Switch elements 827g, 827h, and 828f are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2, the fourth blade connection P4, or any combination thereof. Switch elements 827i, 828g, and 828h are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the third blade connection P3, the fourth blade connection P4, or any combination thereof. Switch elements 827j, 828i, and 828j are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the second blade connection P2, the third blade connection P3, the fourth blade connection P4, or any combination thereof. Switch elements 827k, 8271, 828k, and 8281 are configured to selectively connect the throw connections Ttb1, Ttb2,..., Ttbm and Ttb1', Ttb2',..., Ttbm' to the first blade connection PI, the second blade connection P2, the third blade connection P3, the fourth blade connection P4, or any combination thereof.

[0101] The throw connections Ttb1, Ttb2,..., Ttbm are connected to the throw connections Ttb1', Ttb2',..., Ttbm' by throw paths 331, 332, and 333, respectively, which are indicated by dashed lines for ease of illustration. None of the first blade connection PI through the fourth blade connection P4 are interconnected by blade paths.

[0102] In various embodiments, the number and arrangement of blades and throws can vary without departing from the scope of the present teachings. For example, in each of the depicted embodiments, the number of isolated throws and joined throws is illustrative and is not otherwise limited by the number shown in the figures. Various components, structures, and parameters are included by way of illustration and example only, and are not meant by way of limitation. In view of the present teachings, those skilled in the art can implement the present teachings in determining the applications of the present teachings and the required components, materials, structures, and equipment to implement the same, while remaining within the scope of the appended claims.

Claims

1. A radio frequency (RF) switch device, comprising: a printed circuit board (PCB) having a first side and a second side opposite the first side; at least one blade connection on each of the first side and the second side of the PCB, wherein the at least one blade connection on the first side of the PCB is connected to the at least one blade connection on the second side of the PCB through a blade via through the PCB; a plurality of throw connections on each of the first side and the second side of the PCB; a first switch IC configured to connect the at least one blade connection on the first side of the PCB to any of the plurality of throw connections on the first side of the PCB, and including at least one first switch element for selectively connecting the at least one blade connection on the first side of the PCB to one of the plurality of throw connections on the first side of the PCB; and a second switch IC configured to connect the at least one blade connection on the second side of the PCB to any of the plurality of throw connections on the second side of the PCB, and including at least one second switch element for selectively connecting the at least one blade connection on the second side of the PCB to one of the plurality of throw connections on the second side of the PCB.

2. The RF switch device of claim 1, wherein at least one throw connection on the first side of the PCB is connected to at least one throw connection on the second side of the PCB through a throw via through the PCB.

3. The RF switch device of claim 1, wherein the at least one blade connection on the first side of the PCB includes a first blade connection and a second blade connection, and the at least one blade connection on the second side of the PCB includes another first blade connection and a third blade connection, the another first blade connection being electrically connected to the first blade connection through a blade via through the PCB, wherein the second blade connection and the third blade connection are electrically separated from each other.

4. The RF switch device of claim 3, wherein the first switch IC is a double-blade, multiple-throw switch circuit, and the at least one first switch element is selectively connectable to at least one of the first blade connection and the second blade connection, and wherein the second switch IC is a double-blade, multiple-throw switch circuit, and the at least one second switch element is selectively connectable to at least one of the another first blade connection and the third blade connection, thereby providing a triple-blade, multiple-throw RF switch device. ​ 5. The RF switch device of claim 1, wherein the at least one blade connection on the first side of the PCB comprises a first blade connection and a second blade connection, and the at least one blade connection on the second side of the PCB comprises another first blade connection and another second blade connection, the another first blade connection and the another second blade connection connected to the first blade connection and the second blade connection on the first side of the PCB by a first blade via and a second blade via through the PCB, respectively.

6. The RF switch device of claim 5, wherein the first switch IC is a double-blade, multi-throw switch circuit, and the at least one first switch element is selectively connectable to at least one of the first blade connection and the second blade connection, and wherein the second switch IC is a double-blade, multi-throw switch circuit, and the at least one second switch element is selectively connectable to at least one of the another first blade connection and the another second blade connection, thereby providing a double-blade, multi-throw RF switch device.

7. The RF switch device of claim 1, wherein the at least one blade connection on the first side of the PCB comprises a first blade connection and a second blade connection, and the at least one blade connection on the second side of the PCB comprises another first blade connection, the another first blade connection connected to the first blade connection on the first side of the PCB by a blade via through the PCB.

8. The RF switch device of claim 7, wherein the first switch IC is a double-blade, multi-throw switch circuit, and the at least one first switch element is selectively connectable to at least one of the first blade connection and the second blade connection, and wherein the second switch IC is a single-blade, multi-throw switch circuit, and the at least one second switch element is connectable to the another first blade connection, thereby providing a double-blade, multi-throw RF switch device.

9. The RF switch device of claim 1, wherein the at least one blade connection on the first side of the PCB comprises a first blade connection, and the at least one blade connection on the second side of the PCB comprises another first blade connection, the another first blade connection connected to the first blade connection on the first side of the PCB by a blade via, wherein the first switch IC is a single-blade, multi-throw switch circuit, and the at least one first switch element is connectable to the first blade connection on the first side of the PCB, and wherein the second switch IC is a single-blade, multi-throw switch circuit, and the at least one second switch element is connectable to the another first blade connection on the second side of the PCB, thereby providing a single-blade, multi-throw RF switch device.

10. A radio frequency (RF) switch device, comprising: a printed circuit board (PCB) having a first side and a second side opposite the first side; at least one blade connection on each of the first side and the second side of the PCB; ​ ​ ​ ​ a plurality of throw connections on each of the first side and the second side of the PCB, wherein at least one throw connection on the first side of the PCB is connected to at least one throw connection on the second side of the PCB through a throw via through the PCB; a first switch IC configured to connect the at least one blade connection on the first side of the PCB to any of the plurality of throw connections on the first side of the PCB, and including at least one first switch element for selectively connecting the at least one blade connection on the first side of the PCB to one of the plurality of throw connections on the first side of the PCB; and a second switch IC configured to connect the at least one blade connection on the second side of the PCB to any of the plurality of throw connections on the second side of the PCB, and including at least one second switch element for selectively connecting the at least one blade connection on the second side of the PCB to one of the plurality of throw connections on the second side of the PCB.

11. The RF switch device of claim 10, wherein the at least one blade connection on the first side of the PCB includes a first blade connection and a second blade connection, and the at least one blade connection on the second side of the PCB includes a third blade connection and a fourth blade connection, wherein the first blade connection, the second blade connection, the third blade connection, and the fourth blade connection are electrically separated from one another, thereby providing a four-blade switch device; wherein at least one throw connection on the first side of the PCB is connected to a corresponding throw connection on the second side of the PCB through a throw via through the PCB.

12. The RF switch device of claim 11, wherein the first switch IC is a two-blade, multiple-throw switch circuit, and the at least one first switch element is selectively connectable to at least one of the first blade connection and the second blade connection, and wherein the second switch IC is a two-blade, multiple-throw switch circuit, and the at least one second switch element is selectively connectable to at least one of the third blade connection and the fourth blade connection, thereby providing a four-blade, multiple-throw RF switch device.

13. The RF switch device of claim 10, wherein the at least one blade connection includes a first blade connection and a second blade connection on the first side of the PCB and a third blade connection on the second side of the PCB, wherein the first blade connection, the second blade connection, and the third blade connection are electrically separated from one another; and wherein at least one throw connection on the first side of the PCB is connected to a corresponding throw connection on the second side of the PCB through a throw via through the PCB.

14. The RF switch device of claim 13, wherein the first switch IC is a two-blade, multiple-throw switch circuit, and the at least one first switch element is selectively connectable to at least one of the first blade connection and the second blade connection, and wherein the second switch IC is a two-blade, multiple-throw switch circuit, and the at least one second switch element is selectively connectable to at least one of the third blade connection and the fourth blade connection, thereby providing a four-blade, multiple-throw RF switch device. wherein the second switch IC is a single pole multi-throw switch circuit and the at least one second switch element is connectable to the third pole connection, thereby providing a triple pole multi-throw RF switch device.

15. The RF switch device of claim 10, wherein the at least one pole connection comprises a first pole connection on the first side of the PCB and a second pole connection on the second side of the PCB, wherein the first switch IC is a single pole multi-throw switch circuit and the at least one first switch element is connectable to the first pole connection, and wherein the second switch IC is a single pole multi-throw switch circuit and the at least one second switch element is connectable to the second pole connection, thereby providing a double pole multi-throw RF switch device.

16. A printed circuit board (PCB) for a radio frequency (RF) switch device, the PCB comprising: a top pole connection and a plurality of top throw connections on a top side of the PCB; and a bottom pole connection and a plurality of bottom throw connections on a bottom side of the PCB, wherein the top pole connection and the bottom pole connection are connected by a pole passage through the PCB and / or at least one of the plurality of top throw connections and at least one of the plurality of bottom throw connections are selectively connected by a throw passage through the PCB, and wherein the top pole connection is connectable to any of the plurality of top throw connections by a first switch IC of the RF switch device and the top pole connection is selectively connectable to one of the plurality of top throw connections by a switch element in the first switch IC, and wherein the bottom pole connection is connectable to any of the plurality of bottom throw connections by a second switch IC of the RF switch device and the bottom pole connection is selectively connectable to one of the plurality of bottom throw connections by a switch element in the second switch IC.

17. A radio frequency (RF) switch device comprising: a printed circuit board (PCB) having a first side and a second side opposite the first side; at least one pole connection on each of the first side and the second side of the PCB, the at least one pole connection on the first side being in physical alignment with and electrically connected to the at least one pole connection on the second side of the PCB; a plurality of throw connections on each of the first side and the second side of the PCB, at least one of the plurality of throw connections on the first side being in physical alignment with and electrically connected to at least one of the plurality of throw connections on the second side of the PCB; a first switch IC configured to connect the at least one pole connection and any of the plurality of throw connections on the first side of the PCB, and comprising at least one first switch element for selectively connecting one of the plurality of throw connections on the first side of the PCB; and a second switch IC configured to connect the at least one pole connection and any of the plurality of throw connections on the second side of the PCB, and comprising at least one second switch element for selectively connecting one of the plurality of throw connections on the second side of the PCB. a second switch IC configured to connect the at least one blade connection and any of the plurality of throw connections on the second side of the PCB and comprising at least one second switch element for selectively connecting one of the plurality of throw connections on the second side of the PCB. a second switch IC configured to connect the at least one blade connection and any of the plurality of throw connections on the second side of the PCB and comprising at least one second switch element for selectively connecting one of the plurality of throw connections on the second side of the PCB. a second switch IC configured to connect the at least one blade connection and any of the plurality of throw connections on the second side of the PCB and comprising at least one second switch element for selectively connecting one of the

Images