Thermal superconducting heat transfer plate and radiator

Abstract

The present invention provides a thermal superconducting heat transfer plate and a radiator, comprising: a heat dissipation substrate and a thermal superconducting heat transfer plate; the thermal superconducting heat transfer plate comprises a heat conduction plate of a composite plate structure, a heated area located at the edge of one side of the heat conduction plate, and a condensation heat dissipation and isolation blocking area located on the surface of the heat conduction plate; each condensation heat dissipation and isolation blocking area is arranged in sequence from top to bottom, and the condensation heat dissipation area is located at the top; each condensation heat dissipation area is formed with a heat dissipation pipeline, and the heat dissipation pipelines of each condensation heat dissipation area are connected to form a through closed pipeline, and the closed pipeline is filled with a heat transfer medium; the extension direction of each isolation blocking area is obliquely intersected with the side of the heat conduction plate, and the end adjacent to the heated area is lower than the end away from the heated area. The present invention can solve the high temperature phenomenon caused by the inability to conduct heat due to different heat source positions, and can also solve the heat dissipation problem of multiple heat-generating power devices and avoid the occurrence of local high temperature phenomena, thereby improving the heat dissipation efficiency and heat dissipation capacity of the entire radiator.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a thermal superconducting heat transfer plate and a heat sink. Background Art

[0002] With the rapid development of 5G communication technology, the integration of power components is getting higher and higher, and the power density is getting higher and higher. Traditional aluminum heat sinks can no longer meet the heat dissipation requirements of 5G communication base station equipment.

[0003] Thermal superconducting heat transfer technology includes phase change heat transfer technology that realizes thermal superconducting heat transfer by filling working medium in a closed interconnected micro-channel system and realizing thermal superconducting heat transfer through evaporation and condensation phase change of the working medium; or phase change inhibition (PCI) heat transfer technology that realizes efficient heat transfer by controlling the microstructure state of the working medium in the closed system, that is, in the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and on this basis, the consistency of the working medium microstructure is achieved, thereby realizing efficient heat transfer. Due to the fast thermal conductivity characteristics of thermal superconducting technology, its equivalent thermal conductivity can reach more than 4000W / m℃, which can achieve uniform temperature of the entire thermal superconducting heat transfer plate.

[0004] The thermal superconducting fin heat sink is a heat sink that uses a thermal superconducting heat transfer plate as a heat sink fin. It is mainly composed of a heat sink substrate, multiple thermal superconducting heat transfer plates arranged on the heat sink substrate, and a heat source is arranged on another plane of the heat sink substrate. The heat from the heat source is conducted to multiple heat sink fins through the substrate, and then the heat is dissipated to the surrounding environment through the heat sink fins. Since the thermal superconducting heat transfer plate is a thin plate structure, it has a fast heat conduction rate, a small size, a light weight, and a high fin efficiency. The fin efficiency does not change with the height of the fin, so it is widely used in the heat dissipation of 5G base station equipment.

[0005] At present, the thermal superconducting heat transfer plate on the radiator of 5G base station equipment has a structure such as Figure 1 , Figure 2 As shown in FIG. 1 , most of them adopt a hexagonal honeycomb pipe 11 structure, and the filling amount of the heat transfer medium 12 is generally less than the total volume of the hexagonal honeycomb pipe 11. Since the radiator is installed vertically, under the influence of gravity, the heat transfer medium 12 is mainly concentrated in the lower space of the thermal superconducting heat transfer plate. When the filling amount is too low (such as Figure 1 As shown in the figure, there will be a region without working fluid on the upper part of the thermal superconducting heat transfer plate, and the heat of the heat source 13 on the upper part of the radiator cannot be transferred through the heat transfer working fluid inside the thermal superconducting heat transfer plate, resulting in high temperature of the local heat source. In order to solve the problem of high temperature of the upper heat source 13, the filling amount of the heat transfer working fluid 12 can be increased (as shown in the figure). Figure 2As shown in the figure, due to the influence of gravity, the start-up time of the heat source 13 at the bottom of the thermal superconducting heat transfer plate is long, the thermal resistance at the bottom is large, the temperature of the heat source 13 at the top of the radiator is high, the temperature difference between the upper and lower parts of the thermal superconducting heat transfer plate is large, the radiator effect is poor, and the heating device is easily damaged.

[0006] Therefore, how to solve the problems of high temperature of local heat source, large temperature difference between the upper and lower parts of the thermal superconducting heat transfer plate, and poor heat sink effect has become one of the urgent problems to be solved by technical personnel in this field. Summary of the invention

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a thermal superconducting heat transfer plate and a heat sink, which are used to solve the problems of high temperature of local heat source, large temperature difference between the upper and lower parts of the thermal superconducting heat transfer plate, and poor heat sink effect in the prior art.

[0008] In order to achieve the above-mentioned object and other related objects, the present invention provides a thermal superconducting heat transfer plate, which at least comprises:

[0009] A heat conducting plate of a composite plate structure, the heat conducting plate comprising a heated area located at an edge of one side of the heat conducting plate, at least two condensation and heat dissipation areas located on the surface of the heat conducting plate and an isolation and blocking area corresponding to each condensation and heat dissipation area;

[0010] Among them, each condensation and heat dissipation area and each isolation and blocking area are arranged in sequence from top to bottom, and each condensation and heat dissipation area is located above the corresponding isolation and blocking area;

[0011] A heat dissipation pipeline is formed in the heat conduction plate of each condensation heat dissipation area, and the heat dissipation pipelines of each condensation heat dissipation area are connected through the heat dissipation pipelines located on both sides of the isolation blocking area to form a through closed pipeline, and the closed pipeline is filled with a heat transfer medium;

[0012] The extension direction of each isolation and blocking area is obliquely intersected with the side of the heat conducting plate, and an end of each isolation and blocking area adjacent to the heated area is lower than an end away from the heated area.

[0013] Optionally, the thermal superconducting heat transfer plate further includes a non-pipeline blank area arranged in at least one condensation and heat dissipation area.

[0014] More optionally, the non-pipeline blank area is away from one side of the heated area.

[0015] Optionally, the shape of the heat dissipation pipelines in each condensation and heat dissipation area is a hexagonal honeycomb, a circular honeycomb, a quadrilateral honeycomb, multiple U-shapes connected end to end in series, a diamond, a triangle, a circular ring, a criss-cross mesh, or any combination of any one or more thereof.

[0016] Optionally, the filling amount of the heat transfer medium is 20% to 70% of the volume of the closed pipeline.

[0017] Optionally, the heat conducting plate in the heated area is a folded edge structure.

[0018] More optionally, the heat conducting plate is a phase change suppression heat sink or a phase change heat sink.

[0019] More optionally, the position of each condensation and heat dissipation area corresponds to the installation position of each heat source; the lower end of each isolation and blocking area is not higher than the lower end of the corresponding heat source, and is not lower than the upper end of the heat source located below the corresponding heat source.

[0020] In order to achieve the above-mentioned object and other related objects, the present invention further provides a radiator, which at least comprises:

[0021] A heat dissipation substrate and a plurality of the above-mentioned thermal superconducting heat transfer plates;

[0022] The first surface of the heat dissipation substrate is provided with grooves arranged at intervals, and the heating areas of each thermal superconducting heat transfer plate are inserted into each groove one by one, and each thermal superconducting heat transfer plate extends in a vertical direction;

[0023] A heat source attachment area is arranged on the second surface of the heat dissipation substrate.

[0024] Optionally, a sintered core heat pipe is embedded in the heat dissipation substrate.

[0025] Optionally, the first surface and the second surface are arranged opposite to each other.

[0026] As described above, the thermal superconducting heat transfer plate and the heat sink of the present invention have the following beneficial effects:

[0027] The thermal superconducting heat transfer plate of the present invention is provided with a non-pipeline isolation and blocking area with an inclined angle in the direction from the wing root to the wing top at a height near the heat source. The steam above the isolation and blocking area is condensed and then flows back to the isolation and blocking area, and forms a certain amount of liquid accumulation near the heat source; thereby, the high temperature phenomenon caused by the inability to conduct heat due to the different positions of the heat sources can be solved.

[0028] The heat sink of the present invention adopts the above-mentioned thermal superconducting heat transfer plate, which is fixed on the heat dissipation substrate by means of bonding, welding, expansion connection and cogging, so as to form a heat sink for communication base station equipment or power supply equipment, so as to solve the heat dissipation problem of multiple heat-generating power devices and avoid the occurrence of local high temperature, thereby improving the heat dissipation efficiency and heat dissipation capacity of the entire heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram showing the principle of high temperature of local heat source of thermal superconducting heat transfer plate in the prior art.

[0030] Figure 2 It is a schematic diagram showing the principle of large temperature difference between the upper and lower parts of the thermal superconducting heat transfer plate and the heat dissipation effect in the prior art.

[0031] Figure 3 It is a schematic structural diagram of a thermal superconducting heat transfer plate of the present invention.

[0032] Figure 4 Another schematic structural diagram of the thermal superconducting heat transfer plate of the present invention is shown.

[0033] Figure 5 It is a schematic diagram of a partially enlarged structure of a thermal superconducting heat transfer plate according to the second embodiment of the present invention.

[0034] Figure 6 Shown is another structural schematic diagram of the thermal superconducting heat transfer plate of the present invention.

[0035] Figure 7 Shown is a schematic structural diagram of the radiator of the present invention.

[0036] Figure 8 It is a partially enlarged schematic diagram showing the connection between the thermal superconducting heat transfer plate and the heat dissipation substrate in the heat sink of the present invention.

[0037] Component number description

[0038] 11 Hexagonal honeycomb pipeline

[0039] 12 Heat transfer fluid

[0040] 13 Heat Source

[0041] 2 Thermal superconducting heat transfer plate

[0042] 21 Heat conducting plate

[0043] 211 Heated Area

[0044] 212 Condensation and cooling area

[0045] 213 Isolation and Blockage Area

[0046] 213a Main isolation blocking area

[0047] 213b Sub-isolation blocking area

[0048] 214 Non-pipeline blank area

[0049] 22 Cooling pipe

[0050] 23 Heat transfer fluid

[0051] 3. Heat dissipation substrate

[0052] 4 Heat Source

[0053] 4a Main heat source

[0054] 4b Secondary heat source DETAILED DESCRIPTION

[0055] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0056] See also Figure 3 to Figure 8 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0057] Embodiment 1

[0058] like Figure 3 As shown, this embodiment provides a thermal superconducting heat transfer plate 2, and the thermal superconducting heat transfer plate 2 includes:

[0059] A heat conducting plate 21, wherein the heat conducting plate 21 comprises a heated area 211 located at an edge of one side of the heat conducting plate 21, at least two condensation heat dissipation areas 212 located on the surface of the heat conducting plate 21 and an isolation blocking area 213 corresponding to each condensation heat dissipation area 212; wherein each condensation heat dissipation area 212 and each isolation blocking area 213 are arranged in sequence from top to bottom, and each condensation heat dissipation area 212 is located above the corresponding isolation blocking area 213; a heat dissipation pipeline 22 is formed in the heat conducting plate of each condensation heat dissipation area 212, and the heat dissipation pipeline 22 of each condensation heat dissipation area 212 is connected by the heat dissipation pipelines located on both sides of the isolation blocking area 213 to form a through closed pipeline, and the closed pipeline is filled with a heat transfer medium 23; the extension direction of each isolation blocking area 213 is oblique to the side of the heat conducting plate 21, and the end of each isolation blocking area 213 adjacent to the heated area 211 is lower than the end away from the heated area 211.

[0060] like Figure 3As shown, the heat conducting plate 21 is a composite plate structure. The heat conducting plate 21 includes at least two layers of plates, and the number of plates can be set according to actual needs, which will not be described here one by one. As an example, the heat conducting plate 21 realizes heat transfer based on thermal superconducting heat transfer technology; one thermal superconducting technology is to fill the heat transfer medium in a sealed and interconnected micro-groove system (i.e., the heat dissipation pipeline 22 described in this embodiment), and realize thermal superconducting heat transfer through the evaporation or condensation phase change of the heat transfer medium. The other thermal superconducting technology is to achieve the phase change suppression (PCI) heat transfer technology of efficient heat transfer through the microstructure state of the heat transfer medium in the microgroove system, that is, in the heat transfer process, the boiling of the liquid heat transfer medium (or the condensation of the gaseous heat transfer medium) is suppressed, and on this basis, the consistency of the microstructure of the heat transfer medium is achieved, thereby realizing the phase change suppression (PCI) heat transfer technology of efficient heat transfer.

[0061] like Figure 3 As shown, one side edge of the heat conducting plate 21 is a heated area 211. In this embodiment, the heated area 211 is located at the left edge of the heat conducting plate 21. As an example, the heated area 211 is a folded edge structure. In actual use, the structure of the heated area 211 is not limited as long as heat conduction can be achieved.

[0062] like Figure 3 As shown, a condensation heat dissipation area 212 and an isolation blocking area 213 are provided on the surface of the heat conducting plate 21. The condensation heat dissipation area 212 and the isolation blocking area 213 are arranged alternately from top to bottom. In this embodiment, two condensation heat dissipation areas 212 and two isolation blocking areas 213 are included.

[0063] Specifically, a heat dissipation pipeline 22 is formed in the heat conducting plate 21 of the condensation and heat dissipation area 212. The heat dissipation pipeline 22 is a pipeline formed by the protrusion of the plate located on the outside of the composite plate structure. The heat dissipation pipeline 22 can be prepared by a single-sided inflation process or a double-sided inflation process, which will not be described in detail here. The shape of the heat dissipation pipeline 22 in the condensation and heat dissipation area 212 includes but is not limited to a hexagonal honeycomb, a circular honeycomb, a quadrilateral honeycomb, a plurality of U-shapes connected end to end in series, a diamond, a triangle, a circular ring, a criss-cross mesh, or any combination of any one or more thereof. In the present embodiment, a hexagonal honeycomb is used. As an example, Figure 3 As shown, the length of the condensation and heat dissipation area 212 in the vertical direction close to the side of the heated area 211 covers (the position corresponds and the length value is large) or basically covers (the position basically corresponds and the length value is large) the length of the area where the corresponding heat source 4 (the heat source is used to illustrate the principle of the thermal superconducting heat transfer plate of this embodiment and is not included in the thermal superconducting heat transfer plate) is located in the vertical direction.

[0064] Specifically, the isolation blocking area 213 is arranged below the corresponding condensation and heat dissipation area 212, and the isolation blocking area 213 is used to block the upper and lower connections between the heat dissipation pipes 22. It should be noted that the isolation blocking area 213 does not completely block the connection of the heat dissipation pipes 22, and the heat dissipation pipes in different condensation and heat dissipation areas 212 can still be connected through the pipes at both ends of the isolation blocking area 213. As an example, the isolation blocking area 213 extends in the left and right directions and is in a strip structure, and the isolation blocking area 213 is tilted upward from left to right, so that the condensation and heat dissipation area 212 above the isolation blocking area 213 can obtain an inclined lower end surface, thereby allowing the heat transfer medium 23 to flow back to the vicinity of the heat source 4; as an example, the isolation blocking area 213 can also include multiple strip structures, thereby providing multiple reflux paths, and the inclination direction of each strip structure is consistent. As an example, if Figure 3 As shown, a lower end (the lowest end on the left side) of the isolation blocking area 213 is not higher than a lower end of a corresponding heat source, and is not lower than an upper end of a heat source below the corresponding heat source.

[0065] like Figure 3 As shown, the heat transfer medium 23 is arranged in the heat dissipation pipeline 22. As an example, the filling amount of the heat transfer medium 23 is 20% to 70% of the volume of the closed pipeline. In this embodiment, the filling amount of the heat transfer medium 23 is 45% of the volume of the closed pipeline. In actual use, the filling amount of the heat transfer medium 23 can be set according to actual needs. As an example, the heat transfer medium 23 is a fluid. Preferably, the heat transfer medium 23 can be a gas or a liquid or a mixture of a gas and a liquid. More preferably, in this embodiment, the heat transfer medium 23 is a mixture of a liquid and a gas.

[0066] The thermal superconducting heat transfer plate of this embodiment is provided with an inclined non-pipeline isolation and blocking area 213 near the lower end of the height position of the heat source 4, which separates the heat dissipation pipeline 23 on the thermal superconducting heat transfer plate into several areas, and the heat dissipation pipelines 23 in each area are connected to each other through two outer pipelines. During operation, even if the filling amount of the heat transfer medium 23 is relatively small, the heat source 4 starts to input heat, and the lower heat source 4 conducts heat to the heat transfer medium 23 near the heat source, which undergoes phase change and vaporizes after being heated, and becomes steam and moves upward and enters the upper heat dissipation pipeline 23 area through the pipelines on both sides, and condenses into liquid after heat exchange with the outside. The condensed liquid at the top first passes through the partition of the upper isolation blocking area 213, and flows along the internal inclined pipeline to the vicinity of the upper heat source 4. Because the temperature of the upper heat source 4 is relatively high, the condensed liquid near the heat source evaporates and turns into gas and flows upward, and condenses in the upper condensation heat dissipation area 212 for heat dissipation. In this cycle, the heat is continuously transferred to various parts of the thermal superconducting heat transfer plate for dissipation. The condensed liquid participates in the phase change heat conduction cycle in the upper condensation heat dissipation area 212; the excess liquid flows to the bottom through the pipelines on both sides of the upper isolation blocking area 213. The gas evaporated by the heat source 4 at the bottom is heated, condensed in the lower condensation heat dissipation area 212, and flows back to the heat dissipation pipeline 23 near the lower heat source 4 to participate in the heat conduction cycle of continued evaporation and condensation. When the heat at the bottom is large, more steam is generated, and the corresponding gas phase pressure is large. The excess steam enters the upper condensation heat dissipation area 212 along the pipelines on both sides of the upper isolation blocking area 213 to maintain the temperature and heat dissipation balance and uniform temperature on the entire plate surface.

[0067] Embodiment 2

[0068] like Figure 4 and Figure 5 As shown, this embodiment provides a thermal superconducting heat transfer plate 2 , which is different from the first embodiment in that the thermal superconducting heat transfer plate further includes a non-pipeline blank area 214 disposed in at least one condensation and heat dissipation area 212 .

[0069] Specifically, Figure 4 As shown, in this embodiment, the non-pipeline blank area 214 is set in each condensation and heat dissipation area 212. In actual use, the non-pipeline blank area 214 can be set in one of the condensation and heat dissipation areas 212, which is not limited to this embodiment.

[0070] This can reduce the number of heat dissipation pipes 23, further reduce the amount of heat transfer medium in the thermal superconducting heat transfer plate 2, reduce costs, and speed up the startup rate of the thermal superconducting plate.

[0071] As an example, the non-pipeline blank area 214 is a block structure, and the length in the vertical direction is greater than the length in the horizontal direction. The non-pipeline blank area 214 can also be a strip structure, and the length in the vertical direction is less than the length in the horizontal direction, which will not be described in detail here.

[0072] As an example, the non-pipeline blank area 214 is away from one side of the heated area 21, thereby ensuring that the heat transfer medium 23 is accumulated on the side close to the heat source 4, thereby improving the heat dissipation efficiency.

[0073] like Figure 5 As shown, the heat transfer medium 23 undergoes phase change and vaporizes when heated, and after becoming steam, it flows upward through the heat dissipation pipe 23 on the left side (close to the heat source) of the condensation and heat dissipation area 212, and after condensation, it flows back downward through the heat dissipation pipe 23 on the right side (away from the heat source) of the condensation and heat dissipation area 212, and flows toward the vicinity of the heat source along the internal inclined pipe. Other principles are the same as those in the first embodiment, and are not described one by one here.

[0074] Embodiment 3

[0075] like Figure 6 As shown, this embodiment provides a thermal superconducting heat transfer plate 2, which is different from the first embodiment in that the thermal superconducting heat transfer plate is used in the case of multiple heat sources.

[0076] Specifically, Figure 6 As shown, in this embodiment, four heat sources are provided along the height direction, wherein the two middle heat sources 4 are main heat sources 4a with relatively large power, and the upper and lower heat sources are auxiliary heat sources 4b with relatively small power. An inclined main isolation blocking area 213a and an auxiliary isolation blocking area 213b are provided at the lower ends of the corresponding height positions of the main heat source 4a and the auxiliary heat source 4b. Among them, the area of ​​the main isolation blocking area 213a is larger than that of the auxiliary isolation blocking area 213b, so that liquid heat transfer medium can be provided near the heat-generating power devices at different heights, and the heat from the heat source can be exported and dissipated by relying on the rapid heat conduction of the evaporation and condensation phase change of the heat transfer medium.

[0077] Specifically, Figure 6 As shown, in this embodiment, a non-pipeline blank area 214 is provided in the condensation and heat dissipation area 212 corresponding to the three heat sources located at the lower side, and the area of ​​the non-pipeline blank area 214 is smaller than the area of ​​the non-pipeline blank area 214 in the second embodiment.

[0078] It should be noted that the positions of the condensation and heat dissipation area 212, the isolation and blocking area 213, and the non-pipeline blank area 214 in the thermal superconducting heat transfer plate of the present invention can be set according to the different numbers and positions of the heat sources. Those skilled in the art can make adaptive adjustments according to actual needs based on the contents recorded in the present invention, which will not be described in detail here.

[0079] Embodiment 4

[0080] like Figure 7 and Figure 8 As shown, the present invention provides a radiator, the radiator comprising:

[0081] A heat dissipation substrate 3 and several of the above-mentioned superconducting heat transfer plates 2, wherein the first surface of the heat dissipation substrate 3 is provided with grooves arranged at intervals, and the heated areas of each superconducting heat transfer plate 2 are inserted into each groove one by one, and each superconducting heat transfer plate extends in a vertical direction; and a heat source mounting area is provided on the second surface of the heat dissipation substrate 3.

[0082] Specifically, in this embodiment, the heat dissipation substrate 3 is a flat structure, and the first surface of the heat dissipation substrate 3 is provided with grooves for inserting each thermal superconducting heat transfer plate 2 (not shown in the figure), and the second surface is provided with a heat source mounting area for installing a heating device. As an example, the first surface is arranged opposite to the second surface. The heating device includes but is not limited to a power device. Each groove extends along a first direction on the surface of the heat dissipation substrate 3 and is arranged at intervals along a second direction, and the first direction is perpendicular to the second direction; in this embodiment, each groove is perpendicular to the surface of the heat dissipation substrate 3. In actual use, each groove may also be inclined at a certain angle relative to the surface of the heat dissipation substrate 3. Verticality is only used to indicate a directional trend, and does not mean a 90° angle with the horizontal plane in a strict sense, and is not limited to this embodiment.

[0083] As an example, a sintered core heat pipe (not shown) is embedded in the heat dissipation substrate 3. The sintered core heat pipe is a sintered powder core formed by sintering a certain mesh of metal powder on the inner wall of a metal tube and integrated with the tube wall. The metal powder sintered on the inside of the metal tube forms a liquid wick capillary structure, so that the sintered core heat pipe has a high capillary suction force, so that the heat conduction direction of the sintered core heat pipe is not affected by gravity, and the sintered liquid wick capillary structure strengthens the evaporation heat absorption and condensation heat release, greatly improving the heat conduction capacity and transmission power of the heat pipe, so that the sintered core heat pipe has a large axial equivalent thermal conductivity (several hundred to thousands of times that of copper). The sintered core heat pipe is embedded in the heat dissipation substrate 3, so that the heat generated by the heating device arranged on the surface of the heat dissipation substrate 3 can be quickly diffused to other positions of the heat dissipation substrate 3, so that the heat distribution on the heat dissipation substrate 3 is relatively uniform, effectively improving the heat dissipation efficiency and heat dissipation capacity of the radiator.

[0084] Specifically, the heated area 211 of each thermal superconducting heat transfer plate 2 is inserted into the groove vertically (it may also have a certain inclination angle, not limited to the present embodiment), and each thermal superconducting heat transfer plate 2 is fixedly connected to the radiator substrate 3 through a mechanical extrusion process, a thermal conductive adhesive bonding process or a brazing welding process, and the bonding strength is increased as much as possible, the bonding thermal resistance is reduced, and the heat dissipation capacity and efficiency of the radiator are improved.

[0085] The working principle of the heat sink described in this embodiment is as follows: the heat generated by the heat source located on the surface of the heat sink substrate 3 when working is rapidly transferred to the entire heat sink substrate 3 via the sintered core heat pipe, and the heat sink substrate 3 rapidly transfers the heat to each thermal superconducting heat transfer plate 2, and the heat transfer medium in the heat dissipation pipeline 22 in each thermal superconducting heat transfer plate 2 rapidly transfers the heat to the surface of the entire thermal superconducting heat transfer plate 2, and then the heat is taken away by the air flow flowing through the gaps of the thermal superconducting heat transfer plates 2. The working principles of each thermal superconducting heat transfer plate 2 are not described in detail here.

[0086] In summary, the present invention provides a thermal superconducting heat transfer plate and a heat sink, comprising: a heat dissipation substrate and a plurality of thermal superconducting heat transfer plates. The thermal superconducting heat transfer plate comprises a heat conducting plate of a composite plate structure, wherein the heat conducting plate comprises a heated area located at one edge of the heat conducting plate, at least two condensation heat dissipation areas located on the surface of the heat conducting plate, and an isolation blocking area corresponding to each condensation heat dissipation area; wherein each condensation heat dissipation area and each isolation blocking area are sequentially arranged from top to bottom, and each condensation heat dissipation area is located above the corresponding isolation blocking area; a heat dissipation pipeline is formed in the heat conducting plate of each condensation heat dissipation area, and the heat dissipation pipeline of each condensation heat dissipation area is connected by the heat dissipation pipelines located on both sides of the isolation blocking area to form a through closed pipeline, and the closed pipeline is filled with a heat transfer medium; the extension direction of each isolation blocking area is oblique to the side of the heat conducting plate, and the end of each isolation blocking area adjacent to the heated area is lower than the end away from the heated area. The thermal superconducting heat transfer plate of the present invention is provided with a non-pipeline isolation and blocking area with an inclined angle at a height near the heat source along the direction from the wing root to the wing top. The steam above the isolation and blocking area condenses and flows back to the isolation and blocking area, and forms a certain amount of liquid accumulation near the heat source; thereby, the high temperature phenomenon caused by the inability to conduct heat due to the different positions of the heat source can be solved. The radiator of the present invention adopts the above-mentioned thermal superconducting heat transfer plate, which is fixed on the heat dissipation substrate by means of bonding, welding, expansion and cogging, etc., to form a radiator for communication base station equipment or power supply equipment, so as to solve the heat dissipation problem of multiple heat-generating power devices and avoid the occurrence of local high temperature phenomena, thereby improving the heat dissipation efficiency and heat dissipation capacity of the entire radiator. Therefore, the present invention effectively overcomes the various shortcomings in the prior art and has a high industrial utilization value.

[0087] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A thermal superconducting heat transfer plate, characterized in that: The thermal superconducting heat transfer plate at least comprises: A heat conducting plate of a composite plate structure, the heat conducting plate comprising a heated area located at an edge of one side of the heat conducting plate, at least two condensation and heat dissipation areas located on the surface of the heat conducting plate and an isolation and blocking area corresponding to each condensation and heat dissipation area; Among them, each condensation and heat dissipation area and each isolation and blocking area are arranged in sequence from top to bottom, and each condensation and heat dissipation area is located above the corresponding isolation and blocking area; A heat dissipation pipeline is formed in the heat conduction plate of each condensation heat dissipation area, and the heat dissipation pipelines of each condensation heat dissipation area are connected through the heat dissipation pipelines located on both sides of the isolation blocking area to form a through closed pipeline, and the closed pipeline is filled with a heat transfer medium; The extension direction of each isolation and blocking area is obliquely intersected with the side of the heat conducting plate, and an end of each isolation and blocking area adjacent to the heated area is lower than an end away from the heated area.

2. The thermal superconducting heat transfer plate according to claim 1, characterized in that: The thermal superconducting heat transfer plate further includes a non-pipeline blank area arranged in at least one condensation and heat dissipation area.

3. The thermal superconducting heat transfer plate according to claim 2, characterized in that: The non-pipeline blank area is away from one side of the heated area.

4. The thermal superconducting heat transfer plate according to claim 1, characterized in that: The shape of the heat dissipation pipelines in each condensation and heat dissipation area is a hexagonal honeycomb, a circular honeycomb, a quadrilateral honeycomb, a plurality of U-shapes connected end to end in series, a diamond, a triangle, a circular ring, a criss-cross mesh, or any combination of any one or more thereof.

5. The thermal superconducting heat transfer plate according to claim 1, characterized in that: The filling amount of the heat transfer medium is 20% to 70% of the volume of the closed pipeline.

6. The thermal superconducting heat transfer plate according to claim 1, characterized in that: The heat conducting plate in the heating area is a folded edge structure.

7. The thermal superconducting heat transfer plate according to any one of claims 1 to 6, characterized in that: The heat conducting plate is a phase change suppression heat dissipation plate or a phase change heat dissipation plate.

8. The thermal superconducting heat transfer plate according to claim 7, characterized in that: The position of each condensation and heat dissipation area corresponds to the installation position of each heat source; the lower end of each isolation and blocking area is not higher than the lower end of the corresponding heat source, and is not lower than the upper end of the heat source located below the corresponding heat source.

9. A radiator, characterized in that: The radiator at least comprises: A heat dissipation substrate and a plurality of thermal superconducting heat transfer plates as claimed in any one of claims 1 to 8; The first surface of the heat dissipation substrate is provided with grooves arranged at intervals, and the heating areas of each thermal superconducting heat transfer plate are inserted into each groove one by one, and each thermal superconducting heat transfer plate extends in a vertical direction; A heat source mounting area is arranged on the second surface of the heat dissipation substrate.

10. The heat sink according to claim 9, characterized in that: A sintered core heat pipe is embedded in the heat dissipation substrate.

11. The heat sink according to claim 9, characterized in that: The first surface is arranged opposite to the second surface.

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