Display panel and display device

Abstract

The embodiment of the present application provides a display panel and a display device. The display panel includes: a cover plate, a flexible panel substrate, a flexible circuit board, and a glue layer structure; one end of the flexible circuit board is bonded to the pin area of ​​the flexible panel substrate, and the other end of the flexible circuit board is used to be electrically connected to the electronic component after being bent backward; one side of the glue layer structure is attached to the inner side of the cover plate, and the other side of the glue layer structure is attached to one side of the pin area of ​​the flexible panel substrate. The embodiment of the present application adds an adhesion force from the glue layer structure to the flexible panel substrate, and the adhesion force can offset the stress from the flexible circuit board, so that the flexible panel substrate can remain relatively stable with the cover plate, and the flexible panel substrate can be prevented from being lifted up with the bending of the flexible circuit board, and finally the smooth bending and forming of the flexible circuit board and the protection of the flexible display panel are achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display panel and a display device. Background Art

[0002] Existing display products usually use FPC (flexible printed circuit) to achieve the transmission of control signals between the circuit board and the display panel.

[0003] To meet the narrow frame requirements of current display products, after one end of the FPC is bonded to the pin area of ​​the display panel, the FPC needs to be bent backwards, that is, the other end of the PFC is bent to the back of the display panel to reduce the frame width of the display product.

[0004] However, in flexible display products, the flexible substrate used in the display panel will easily lift up the display panel due to the bending stress during the bending process of the FPC. On the one hand, it will cause the FPC to be unable to form in the bending area, and on the other hand, it will cause excessive bending of the display panel and even cause the internal wiring of the display panel to break, resulting in product scrapping. Summary of the invention

[0005] In view of the shortcomings of the existing methods, the present application proposes a display panel and a display device to solve the technical problem in the prior art that when the FPC is bent in the flexible display product, the display panel is easily lifted up under the action of stress.

[0006] In a first aspect, an embodiment of the present application provides a display panel, comprising: a cover plate, a flexible panel substrate, a flexible circuit board, and a glue layer structure;

[0007] One end of the flexible circuit board is bonded to the pin area of ​​the flexible panel substrate, and the other end of the flexible circuit board is used to be electrically connected to the electronic component after being bent backward;

[0008] One side of the adhesive layer structure is attached to the inner side of the cover plate, and the other side of the adhesive layer structure is attached to one side of the pin area of ​​the flexible panel substrate.

[0009] In a second aspect, an embodiment of the present application provides a display device, comprising: an electronic component, and a display panel provided in the first aspect above;

[0010] The electronic components are located on a side of the flexible circuit board of the display panel away from the cover plate;

[0011] The other end of the flexible circuit board of the display panel is electrically connected to the electronic component after being bent backward.

[0012] The beneficial technical effects brought about by the technical solution provided in the embodiments of the present application include: using a glue layer structure to establish an attached connection relationship between the pin area of ​​the flexible panel substrate and the cover plate, so that in the process of bending the flexible circuit board, the adhesion force of the glue layer structure is increased for the flexible panel substrate. The adhesion force can offset the stress from the flexible circuit board, so that the flexible panel substrate can remain relatively stable with the cover plate, avoiding the flexible panel substrate from being lifted up with the bending of the flexible circuit board, and finally realizing the smooth bending and forming of the flexible circuit board and the protection of the flexible display panel.

[0013] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0015] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0016] Figure 2 A schematic diagram of a cross-sectional structure of a display panel and an electronic component provided in an embodiment of the present application;

[0017] Figure 3 A schematic diagram of a cross-sectional structure of an adhesive layer structure provided in an embodiment of the present application;

[0018] Figure 4 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0019] Figure 5 A schematic cross-sectional structure diagram of another display panel and electronic components provided in an embodiment of the present application.

[0020] In the figure:

[0021] 100-cover plate;

[0022] 200-flexible panel substrate; 210-pin area; 220-driving circuit;

[0023] 300-Flexible circuit board;

[0024] 400-Electronic components;

[0025] 500-adhesive layer structure; 501-first structural area; 502-second structural area; 503-third structural area;

[0026] 510-first adhesive layer;

[0027] 520-thermal conductive material layer; 521-non-metallic thermal conductive layer; 522-metallic thermal conductive layer;

[0028] 530- second adhesive layer;

[0029] 540 - Layer of elastic material. DETAILED DESCRIPTION

[0030] The present application is described in detail below, and examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components with the same or similar functions. In addition, if the detailed description of the known technology is unnecessary for the features of the present application shown, it will be omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limiting the present application.

[0031] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with those in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as here.

[0032] It will be understood by those skilled in the art that, unless expressly stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present application refers to the presence of the features, elements and / or components, but does not exclude the presence or addition of one or more other features, elements, components and / or groups thereof. It should be understood that when we refer to an element as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.

[0033] The inventor of the present application has conducted research and found that in existing real products, the pin area of ​​the display panel is not in contact with the cover plate, that is, the pin area of ​​the display panel is in a suspended state. Therefore, in the process of bending the FPC of the flexible display product, the bending stress can easily lift the flexible display panel, which will not only make the FPC unable to be formed in the bending area, but also cause excessive bending of the display panel, causing the flatness of the bonding area of ​​the pin area, causing poor bonding contact between the driving circuit and the flexible circuit board, and even causing the internal wiring of the display panel to break, resulting in product scrapping.

[0034] The display panel and display device provided in the present application are intended to solve the above technical problems in the prior art.

[0035] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0036] The present application provides a display panel. The structure diagram of the display panel is as follows: Figure 1 and Figure 2 As shown, it includes: a cover plate 100 , a flexible panel substrate 200 , a flexible circuit board 300 , and a glue layer structure 500 .

[0037] One end of the flexible circuit board 300 is bonded to the pin area 210 of the flexible panel substrate 200 , and the other end of the flexible circuit board 300 is used to be electrically connected to the electronic component 400 after being bent backward.

[0038] One side of the adhesive layer structure 500 is attached to the inner side of the cover plate 100 , and the other side of the adhesive layer structure 500 is attached to one side of the pin area 210 of the flexible panel substrate 200 .

[0039] In this embodiment, an adhesive layer structure 500 is used to establish an attached connection relationship between the pin area 210 of the flexible panel substrate 200 and the cover plate 100, so that in the process of bending the flexible circuit board 300, the adhesive force from the adhesive layer structure 500 is increased for the flexible panel substrate 200. The adhesive force can offset the stress from the flexible circuit board 300, so that the flexible panel substrate 200 can remain relatively stable with the cover plate 100, and the flexible panel substrate 200 is prevented from being lifted up with the bending of the flexible circuit board 300, and finally the smooth bending and forming of the flexible circuit board 300 and the protection of the flexible display panel are achieved.

[0040] Among them, the bending forming of the flexible circuit board 300 means that after one end of the flexible circuit board 300 is bonded to the pin area 210 of the flexible panel substrate 200, the other end of the flexible circuit board 300 is bent backward, that is, the other end of the flexible circuit board 300 is bent to the back of the flexible panel substrate 200 to reduce the border width of the display product.

[0041] Alternatively, if Figure 4 and Figure 5 As shown, the adhesive layer structure 500 may use adhesive glue, that is, the adhesive glue is dotted between the pin area 210 of the flexible panel substrate 200 and the cover plate 100 to achieve relative stability between the flexible panel substrate 200 and the cover plate 100. Specifically, the adhesive glue may be silicone glue.

[0042] The inventor of the present application considers that the driving circuit 220 in the pin area 210 of the flexible panel substrate 200 will generate a certain amount of heat during operation. To this end, the present application provides the following possible implementation method for the adhesive layer structure 500:

[0043] like Figure 3 As shown, the adhesive layer structure 500 of the embodiment of the present application includes: a first adhesive layer 510 and a thermal conductive material layer 520 which are stacked.

[0044] The side of the first adhesive layer 510 away from the thermal conductive material layer 520 is attached to the inner side surface of the cover plate 100 .

[0045] A side of the thermal conductive material layer 520 away from the first adhesive layer 510 is attached to a side of the pin region 210 of the flexible panel substrate 200 .

[0046] At least part of the heat conductive material layer 520 contacts the driving circuit 220 of the pin region 210 . The driving circuit 220 is located at one side of the pin region 210 . The heat conductive material layer 520 is used for heat conduction connection with a heat conductive housing (not shown).

[0047] In this embodiment, the first adhesive layer 510 can be attached to the inner side of the cover plate 100 to provide adhesion. The thermal conductive material layer 520 can guide the heat generated by the driving circuit 220 in the pin area 210 of the flexible panel substrate 200 to the thermal conductive housing to achieve heat dissipation, thereby ensuring the working performance of the entire display panel.

[0048] Specifically, the adhesive layer structure 500 provided in this embodiment can be manufactured on the pin area 210 of the flexible panel substrate 200 after bonding is achieved with the pin area 210 of the flexible panel substrate 200 at one end of the flexible circuit board 300, and then in the subsequent process of bonding with the cover plate 100, the pin area 210 of the flexible panel substrate 200 and the display area of ​​the flexible panel substrate 200 are bonded to the inner surface of the cover plate 100 together.

[0049] In some possible implementations, such as Figure 3 As shown, the thermally conductive material layer 520 of the embodiment of the present application includes: a non-metallic thermally conductive layer 521 and a metallic thermally conductive layer 522 .

[0050] The non-metallic heat-conducting layer 521 is at least partially in contact with the metal heat-conducting layer 522 .

[0051] At least one of the non-metallic heat-conducting layer 521 and the metal heat-conducting layer 522 is in contact with the driving circuit 220 of the pin region 210 .

[0052] At least one of the non-metallic heat-conducting layer 521 and the metal heat-conducting layer 522 is used for thermally conducting connection with the heat-conducting housing.

[0053] In this embodiment, the thermal conductive material layer 520 adopts a combined structure including a non-metallic thermal conductive layer 521 and a metal thermal conductive layer 522, which can be advantageously adapted to the drive circuit 220 of the pin area 210 and the material of the thermal conductive housing, and is advantageously advantageous for improving heat conduction efficiency.

[0054] Optionally, the non-metallic heat-conducting layer 521 and the metal heat-conducting layer 522 may be located in different layers and connected by thermal conduction, or may be located in the same layer and connected by thermal conduction.

[0055] The inventor of the present application considers that there are differences in the physical properties between the non-metallic heat-conducting layer 521 and the metal heat-conducting layer 522. Therefore, the present application provides the following possible implementation method for the adhesive layer structure 500:

[0056] The non-metallic heat-conducting layer 521 of the embodiment of the present application is in contact with the driving circuit 220 of the pin area 210 ; the metal heat-conducting layer 522 is used for thermal conduction connection with the heat-conducting housing.

[0057] In this embodiment, the non-metallic thermal conductive layer 521 is brought into contact with the driving circuit 220 of the pin area 210. The physical properties of the non-metallic thermal conductive material, such as elasticity, flexibility or fluidity, can be utilized to increase the effective contact area with the driving circuit 220, thereby improving the thermal conduction efficiency between the thermal conductive material layer 520 and the driving circuit 220.

[0058] The metal heat-conducting layer 522 is used for thermal conduction connection with the heat-conducting housing, and the physical properties of the metal heat-conducting material, such as ductility, toughness or rigidity, etc., can be utilized to facilitate a more matched connection with the heat-conducting housing.

[0059] In the above embodiments, optionally, the non-metallic heat-conducting layer 521 may be made of graphite or thermally conductive silicone grease; and the metal heat-conducting layer 522 may be made of copper foil.

[0060] The inventor of the present application considers that the adhesive layer structure 500 can be manufactured in advance. To this end, the present application provides the following possible implementation method for the adhesive layer structure 500:

[0061] like Figure 3 As shown, the adhesive layer structure 500 of the embodiment of the present application further includes: a second adhesive layer 530 .

[0062] The second adhesive layer 530 is located on a side of the thermal conductive material layer 520 away from the first adhesive layer 510 ; the side of the second adhesive layer 530 away from the thermal conductive material layer 520 is attached to a side of the pin region 210 of the flexible panel substrate 200 .

[0063] In this embodiment, the second adhesive layer 530 cooperates with the first adhesive layer 510 to sandwich the thermal conductive material layer 520 in the middle, thereby forming a sandwich structure of "first adhesive layer 510 / thermal conductive material layer 520 / second adhesive layer 530", so that both sides of the adhesive layer structure 500 have adhesion capabilities, which is beneficial to enhancing the adhesion between the pin area 210 of the flexible panel substrate 200 and the cover plate 100, and improving the relative stability between the flexible panel substrate 200 and the cover plate 100.

[0064] By using the adhesive layer structure 500 provided in this embodiment, the adhesive layer structure 500 can be manufactured first, and then the pin area 210 of the flexible panel substrate 200 and the cover plate 100 are assembled together, which can greatly simplify the attachment process between the flexible panel substrate 200 and the cover plate 100. In addition, the adhesive layer structure 500 can be manufactured first, which is conducive to the large-scale production of the adhesive layer structure 500, which can effectively reduce the production cost of the adhesive layer structure 500.

[0065] Optionally, at least one of the first adhesive layer 510 and the second adhesive layer 530 can be made of silicone adhesive.

[0066] It is understandable that the adhesive layer structure 500 provided in this embodiment can also be manufactured layer by layer on the pin area 210 of the flexible panel substrate 200 after bonding one end of the flexible circuit board 300 to the pin area 210 of the flexible panel substrate 200 .

[0067] The inventor of the present application considers that during the process of laminating the flexible panel substrate 200 and the cover plate 100, or during the use of the finished display panel, it is inevitable that the flexible panel substrate 200 and the cover plate 100 will touch each other. If the impact force of the touch is too large, it is easy to cause damage to the flexible panel substrate 200. To this end, the present application provides the following possible implementation method for the adhesive layer structure 500:

[0068] like Figure 3 As shown, the adhesive layer structure 500 of the embodiment of the present application further includes: an elastic material layer 540 .

[0069] The elastic material layer 540 is located between the first adhesive layer 510 and the thermal conductive material layer 520 ; or, the elastic material layer 540 is located between the thermal conductive material layer 520 and the second adhesive layer 530 .

[0070] In this embodiment, the elastic material layer 540 in the adhesive layer structure 500 can absorb impact and play a buffering role, which can effectively reduce the hard impact between the cover plate 100 and the flexible panel substrate 200, thereby achieving the purpose of protecting the flexible panel substrate 200.

[0071] Specifically, the elastic material layer 540 can be located between the first adhesive layer 510 and the thermally conductive material layer 520, or between the thermally conductive material layer 520 and the second adhesive layer 530. Of course, the elastic material layer 540 can also be arranged between the first adhesive layer 510 and the thermally conductive material layer 520 and between the thermally conductive material layer 520 and the second adhesive layer 530.

[0072] Optionally, the elastic material layer 540 may be made of foam.

[0073] A specific implementation of the adhesive layer structure 500 is provided below:

[0074] like Figure 1 As shown, the glue layer structure 500 includes a first structural area 501 and a second structural area 502 .

[0075] The first structural area 501 and the second structural area 502 both include a first adhesive layer 510 and a thermal conductive material layer 520 which are stacked. The side of the first adhesive layer 510 away from the thermal conductive material layer 520 is attached to the inner side of the cover plate 100 .

[0076] At least a portion of the heat conductive material layer 520 in the first structure region 501 is in contact with the driving circuit 220 of the pin region 210 . The driving circuit 220 is located at one side of the pin region 210 .

[0077] The second structural area 502 also includes an elastic material layer 540 and a second adhesive layer 530; the second adhesive layer 530 is located on the side of the thermal conductive material layer 520 away from the first adhesive layer 510, and is attached to one side of the pin area 210 of the flexible panel substrate 200; the elastic material layer 540 is located between the first adhesive layer 510 and the thermal conductive material layer 520, or, the elastic material layer 540 is located between the thermal conductive material layer 520 and the second adhesive layer 530.

[0078] In this embodiment, a partition design is performed on the same adhesive layer structure 500 for a representative area between the pin area 210 of the flexible panel substrate 200 and the cover plate 100 .

[0079] The first structural area 501 of the adhesive layer structure 500 corresponds to the area where the driving circuit 220 of the flexible panel substrate 200 is located. The driving circuit 220 generates a certain amount of heat when working. Therefore, the first structural area 501 of the adhesive layer structure 500 adopts a structure including a first adhesive layer 510 and a thermal conductive material layer 520. Among them, the first adhesive layer 510 can be attached to the inner side of the cover plate 100 to provide adhesion. The thermal conductive material layer 520 can guide the heat generated by the driving circuit 220 in the pin area 210 of the flexible panel substrate 200 to the thermal conductive housing to achieve heat dissipation, thereby ensuring the working performance of the entire display panel.

[0080] The second structural area 502 of the adhesive layer structure 500 corresponds to the area where the flexible circuit board 300 and the flexible panel substrate 200 are bonded. The second structural area 502 of the adhesive layer structure 500 adopts a structure including a first adhesive layer 510, a thermal conductive material layer 520, an elastic material layer 540 and a second adhesive layer 530. The second adhesive layer 530 cooperates with the first adhesive layer 510, sandwiching the thermal conductive material layer 520 in the middle, so as to form a sandwich structure of "first adhesive layer 510 / thermal conductive material layer 520 / elastic material layer 540 / second adhesive layer 530", so that both sides of the adhesive layer structure 500 have adhesion ability, which is conducive to enhancing the adhesion between the pin area 210 of the flexible panel substrate 200 and the cover plate 100, and improving the relative stability between the flexible panel substrate 200 and the cover plate 100. The elastic material layer 540 can absorb impact and play a buffering role, which can effectively reduce the hard impact between the cover plate 100 and the flexible panel substrate 200, thereby protecting the bonding structure between the flexible circuit board 300 and the pin area 210 of the flexible panel substrate 200.

[0081] In some possible implementations, such as Figure 1 As shown, the glue layer structure 500 further includes a third structural area 503 .

[0082] The third structural area 503 includes a first glue layer 510 , a heat conductive material layer 520 , an elastic material layer 540 and a second glue layer 530 which are stacked.

[0083] The second adhesive layer 530 in the third structural area 503 is used to adhere to a heat-conducting housing (not shown in the figure).

[0084] The thickness of the elastic material layer 540 in the third structural area 503 is greater than the thickness of the elastic material layer 540 in the second structural area 502 .

[0085] The heat-conducting material layer 520 of at least one of the first structure area 501 , the second structure area 502 and the third structure area 503 is used for heat-conducting connection with the heat-conducting housing.

[0086] In this embodiment, the third structural area 503 of the adhesive layer structure 500 corresponds to a partial area of ​​the cover plate 100, which refers to an area extending from the pin area 210 of the flexible panel substrate 200 along the frame of the display panel and can be attached to the heat-conducting housing. The third structural area 503 of the adhesive layer structure 500 also adopts a structure including a first adhesive layer 510, a heat-conducting material layer 520, an elastic material layer 540 and a second adhesive layer 530, and the specific position relationship of each structural layer can be the same as the aforementioned second structural area 502. Among them, the second adhesive layer 530 cooperates with the first adhesive layer 510, sandwiching the heat-conducting material layer 520 in the middle, and a sandwich structure of "first adhesive layer 510 / heat-conducting material layer 520 / elastic material layer 540 / second adhesive layer 530" can be formed, so that both sides of the adhesive layer structure 500 have the ability to adhere, which is conducive to enhancing the adhesion between the cover plate 100 and the heat-conducting housing. The elastic material layer 540 can absorb impact and play a buffering role, which can effectively reduce the hard impact between the cover plate 100 and the thermal conductive shell, thereby indirectly reducing the hard impact between the cover plate 100 and the flexible panel substrate 200 to protect the flexible panel substrate 200.

[0087] Since the distance between the cover plate 100 and the heat conductive housing is greater than the distance between the cover plate 100 and the flexible panel substrate 200, the thickness of the elastic material layer 540 in the third structural area 503 is greater than the thickness of the elastic material layer 540 in the second structural area 502 to accommodate the distance difference.

[0088] It should be noted that, in the same adhesive layer structure 500 with a partition design provided in the above embodiment, the same structural layers in the first structural area 501, the second structural area 502 and the third partition structure 503 (for example, the first adhesive layer 510 portion located in the first structural area 501, the second structural area 502 and the third partition structure 503) can be continuous or partially interrupted as needed.

[0089] Based on the same inventive concept, the present application provides a display device, the structure of which is intended to be as follows: Figure 2 or Figure 5 As shown, the display device includes: an electronic component 400, and any display panel provided by the above embodiments.

[0090] The electronic component 400 is located on a side of the flexible circuit board 300 of the display panel away from the cover plate 100 .

[0091] The other end of the flexible circuit board 300 of the display panel is electrically connected to the electronic component 400 after being bent backward.

[0092] In this embodiment, since the display device adopts any one of the display panels provided in the aforementioned embodiments, its principles and technical effects can be referred to in the aforementioned embodiments and will not be described in detail here.

[0093] Optionally, the electronic component 400 may be a PCB (Printed Circuit Board).

[0094] In some possible implementations, the display device further includes: a heat-conductive housing (not shown in the figure).

[0095] The heat-conducting bottom shell covers the inner side of the cover plate 100 of the display panel, and forms a device cavity with the cover plate 100;

[0096] The display panel and the electronic component 400 are both located in the device cavity;

[0097] The heat-conducting material layer 520 in the glue layer structure 500 of the display panel is thermally connected to the heat-conducting bottom shell.

[0098] In this embodiment, the heat-conductive housing can protect the display panel and the electronic components 400 on the one hand, and can establish a heat conduction connection with the heat-conductive material layer 520 in the adhesive layer structure 500 of the display panel on the other hand, so that the heat generated by the driving circuit 220 in the pin area 210 of the flexible panel substrate 200 can be guided to the heat-conductive housing to achieve heat dissipation, thereby ensuring the working performance of the entire display panel.

[0099] Optionally, the metal heat-conducting layer 522 in the heat-conducting material layer 520 is thermally connected to the heat-conducting bottom shell.

[0100] By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

[0101] 1. The adhesive layer structure 500 is used to establish an attached connection relationship between the pin area 210 of the flexible panel substrate 200 and the cover plate 100, so that in the process of bending the flexible circuit board 300, the adhesive force of the adhesive layer structure 500 is increased for the flexible panel substrate 200. The adhesive force can offset the stress from the flexible circuit board 300, so that the flexible panel substrate 200 can remain relatively stable with the cover plate 100, and the flexible panel substrate 200 is prevented from being lifted up with the bending of the flexible circuit board 300, and finally the smooth bending and forming of the flexible circuit board 300 and the protection of the flexible display panel are achieved.

[0102] 2. The first adhesive layer 510 can be attached to the inner side of the cover plate 100 to provide adhesion. The thermal conductive material layer 520 can guide the heat generated by the driving circuit 220 in the pin area 210 of the flexible panel substrate 200 to the thermal conductive housing to achieve heat dissipation, thereby ensuring the working performance of the entire display panel.

[0103] 3. The heat-conducting material layer 520 adopts a combined structure including a non-metallic heat-conducting layer 521 and a metal heat-conducting layer 522, which can be helpful to adapt to the drive circuit 220 of the pin area 210 and the material of the heat-conducting shell, and is helpful to improve the heat conduction efficiency.

[0104] 4. The non-metallic heat-conducting layer 521 is in contact with the driving circuit 220 of the pin area 210, which can increase the effective contact area with the driving circuit 220, thereby improving the heat conduction efficiency between the heat-conducting material layer 520 and the driving circuit 220. The metal heat-conducting layer 522 is used for heat conduction connection with the heat-conducting housing, which is conducive to establishing a more matching connection with the heat-conducting housing.

[0105] 5. The second adhesive layer 530 cooperates with the first adhesive layer 510 to sandwich the thermal conductive material layer 520 in the middle, thereby forming a sandwich structure of "first adhesive layer 510 / thermal conductive material layer 520 / second adhesive layer 530", so that both sides of the adhesive layer structure 500 have adhesion capabilities, which is beneficial to enhance the adhesion between the pin area 210 of the flexible panel substrate 200 and the cover plate 100, and improve the relative stability between the flexible panel substrate 200 and the cover plate 100.

[0106] 6. The elastic material layer 540 in the adhesive layer structure 500 can absorb impact and play a buffering role, which can effectively reduce the hard impact between the cover plate 100 and the flexible panel substrate 200, thereby achieving the purpose of protecting the flexible panel substrate 200.

[0107] Those skilled in the art will appreciate that, in the description of the present application, it is necessary to understand that the terms “center”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0108] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0109] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0110] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0111] The above description is only a partial implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A display panel, characterized in that: include: A cover plate, a flexible panel substrate, a flexible circuit board, and a glue layer structure, wherein the glue layer structure uses a spot-coated adhesive glue; One end of the flexible circuit board is bonded to the pin area of ​​the flexible panel substrate, and the other end of the flexible circuit board is used to be electrically connected to the electronic component after being bent backward; One side of the adhesive layer structure is attached to the inner side of the cover plate, and the other side of the adhesive layer structure is attached to one side of the pin area of ​​the flexible panel substrate; The glue layer structure includes a first structural area and a second structural area; The first structural area and the second structural area both include a first adhesive layer and a thermal conductive material layer which are stacked; a side of the first adhesive layer away from the thermal conductive material layer is attached to the inner side surface of the cover plate; At least a portion of the thermally conductive material layer in the first structural region is in contact with the driving circuit in the pin region; The second structural area also includes an elastic material layer and a second adhesive layer; the second adhesive layer is located on the side of the thermal conductive material layer away from the first adhesive layer, and is attached to one side of the pin area of ​​the flexible panel substrate; the elastic material layer is located between the first adhesive layer and the thermal conductive material layer, or the elastic material layer is located between the thermal conductive material layer and the second adhesive layer.

2. The display panel according to claim 1, characterized in that: The thermally conductive material layer comprises: a non-metallic thermally conductive layer and a metallic thermally conductive layer; The non-metallic heat-conducting layer is at least partially in contact with the metal heat-conducting layer; At least one of the non-metallic heat-conducting layer and the metal heat-conducting layer is in contact with the driving circuit in the pin area; At least one of the non-metallic heat-conducting layer and the metal heat-conducting layer is used for thermally conducting connection with the heat-conducting housing.

3. The display panel according to claim 2, characterized in that: The non-metallic heat-conducting layer is in contact with the driving circuit in the pin area; the metal heat-conducting layer is used for heat-conducting connection with the heat-conducting housing.

4. The display panel according to claim 1, characterized in that: The glue layer structure also includes a third structural area; The third structural area includes a first adhesive layer, a heat conductive material layer, an elastic material layer, and a second adhesive layer which are stacked; The second adhesive layer in the third structural area is used to adhere to the heat-conducting housing; The thickness of the elastic material layer in the third structural region is greater than the thickness of the elastic material layer in the second structural region; The thermally conductive material layer of at least one of the first structural region, the second structural region and the third structural region is used for thermally conductive connection with the thermally conductive housing.

5. A display device, characterized in that: include: An electronic component, and a display panel as claimed in any one of claims 1 to 4; The electronic component is located on a side of the flexible circuit board of the display panel away from the cover plate; The other end of the flexible circuit board of the display panel is electrically connected to the electronic component after being bent backward.

6. The display device according to claim 5, characterized in that: The display device further includes: a heat-conducting housing; The heat-conducting housing is covered with the inner side surface of the cover plate of the display panel to form a device cavity with the cover plate; The display panel and the electronic components are both located in the device cavity; The heat-conducting material layer in the glue layer structure of the display panel is thermally connected to the heat-conducting housing.

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