Automatic solder coating device applied to cooler

Abstract

The present invention provides an automatic solder coating device for a cooler, which relates to the field of cooler production and processing. The device includes a solder conveying device for automatically conveying solder, a solder spraying device for spraying solder at a fixed point, and a cooler plate conveyor belt for conveying cooler plates; the solder conveying device includes a stirring motor, a solder storage bin, and a solder conveying pipeline; the solder spraying device includes a pressure spray gun fixedly arranged to face the upper surface of the cooler plate conveyor belt; one end of the solder conveying pipeline is communicated with the solder storage bin, and the other end is communicated with the pressure spray gun; the pressure spray gun automatically sprays solder onto the surface of the cooler plate under the action of pressure control. The automatic solder coating device provided by the present invention coats the cooler plate in an automated manner. Compared with the manual solder coating method, it not only has high coating efficiency but also stable coating quality, greatly reducing the labor cost and being beneficial to ensuring the yield of the welded cooler products.

Description

Technical Field

[0001] The invention relates to the technical field of cooler production and processing, in particular to an automatic solder coating device applied to a cooler. Background Art

[0002] The oil cooler includes an upper plate, a lower plate and fins, wherein the fins are grooved structures with concave and convex patterns, and the upper plate and the lower plate are plate-shaped. In the actual processing and production of the cooler, the fins need to be set between the upper chip and the lower chip through a brazing process. Before brazing, the fins or plates need to be fully coated with solder to ensure that the oil cooler has reliable sealing after brazing to prevent medium leakage during the operation of the cooler and affect the cooling effect.

[0003] In the prior art, when processing coolers, the solder coating method is: workers manually use a brush tool to apply the paste solder to the convex parts of the fins one by one, or apply it to the upper and lower chips, so that the convex parts of the fin plate surface can be fully contacted with the upper and lower chips respectively through the solder, which is convenient for further brazing and forming. However, this manual solder coating method will cause problems such as uneven coating and uncontrollable individual quality due to the different techniques and strengths of individual workers, which will easily lead to the phenomenon of cold soldering and leaking during the later brazing, resulting in a decrease in the yield of the cooler molded product. On the other hand, the manual coating method of workers makes the cooler solder coating efficiency low, and the resulting labor cost is high, which is not conducive to the economic benefits of the enterprise. Summary of the invention

[0004] In response to the above-mentioned problems, the present invention provides an automatic solder coating device for a cooler, which uses automated coating equipment to coat the plates (upper plate and / or lower plate) of the cooler with solder, with stable coating quality and high coating efficiency.

[0005] To achieve the above purpose, the technical solution provided by the present invention is:

[0006] The invention provides an automatic solder coating device for a cooler, comprising a machine base; the machine base is provided with a solder conveying device for automatically conveying solder, a solder spraying device for spraying solder at a fixed point, and a cooler plate conveyor belt for conveying cooler plates; the solder conveying device comprises a stirring motor, a solder storage bin, and a solder conveying pipeline; the solder spraying device comprises a pressure spray gun; the pressure spray gun is fixedly arranged above the cooler plate conveyor belt, and the nozzle of the pressure spray gun is arranged toward the upper surface of the cooler plate conveyor belt; one end of the solder conveying pipeline is connected to the solder storage bin, and the other end is connected to the pressure spray gun; the pressure spray gun is used for automatically spraying solder onto the plate surface of the cooler plate under pressure control.

[0007] The solder automatic coating device for a cooler provided by the present invention, preferably, the solder spraying device includes a spraying material chamber in the structure of a bottomless cube; the spraying material chamber is fixed on the machine base and covers above the cooler plate conveyor belt; the pressure spray gun is fixedly arranged in the spraying material chamber; strip-shaped inlets and strip-shaped outlets are respectively arranged on the spraying material chamber along the conveying direction of the cooler plate conveyor belt; the strip-shaped inlets and the strip-shaped outlets are in clearance fit with the cooler plates in the height direction.

[0008] The solder automatic coating device for a cooler provided by the present invention, preferably, further includes a solder negative pressure pipeline and a first solder recovery container; a solder recovery pipe orifice is arranged on the side wall of the spraying material chamber; one end of the solder negative pressure pipeline is communicated with the spraying material chamber through the solder recovery pipe orifice, and the other end of the solder negative pressure pipeline is communicated with the first solder recovery container; the first solder recovery container is arranged on the machine base.

[0009] The solder automatic coating device for a cooler provided by the present invention, preferably, further includes a vertical baffle; the vertical baffle is vertically and fixedly arranged in the spraying material chamber, and a distance gap for the cooler plates to pass through is spaced between the bottom end face of the vertical baffle and the upper surface of the cooler plate conveyor belt; the vertical baffle divides the spraying material chamber into a plate outlet chamber and a plate inlet chamber; the strip-shaped inlet is sequentially communicated with the strip-shaped outlet through the plate inlet chamber and the plate outlet chamber; the pressure spray gun is fixed on the wall surface of the vertical baffle on the side of the plate inlet chamber; the solder recovery pipe orifice is arranged on the side wall of the spraying material chamber on the side of the plate inlet chamber.

[0010] The solder automatic coating device for a cooler provided by the present invention, preferably, the cooler plate conveyor belt is an endless pulley; a scraper for scraping solder and a second solder recovery container for recovering solder are fixedly arranged below the cooler plate conveyor belt; the second solder recovery container is arranged on the machine base; the top end face of the scraper abuts against the bottom surface of the cooler plate conveyor belt, and the bottom end face of the scraper is fixed in the second solder recovery container.

[0011] The solder automatic coating device for a cooler provided by the present invention, preferably, a pressure regulating valve is fixed on the side wall of the spraying material chamber; the pressure regulating valve is connected with the pressure spray gun through an air circuit.

[0012] The solder automatic coating device for a cooler provided by the present invention, preferably, an observation window opening is arranged on the top wall of the spraying material chamber; a transparent observation window plate is movably arranged on the observation window opening; the transparent observation window plate is hermetically arranged on the observation window opening in an openable manner.

[0013] The solder automatic coating device for a cooler provided by the present invention preferably further includes a sheet positioning mechanism; the sheet positioning mechanism includes a first fixing plate and a second fixing plate respectively arranged on both sides of the entrance of the cooler sheet conveyor belt; a plurality of transverse lead screws are rotatably arranged between the first fixing plate and the second fixing plate; the plate surfaces of the first fixing plate and the second fixing plate extend in the conveying direction of the cooler sheet conveyor belt; one end of the transverse lead screw penetrates through the first fixing plate, and the other end penetrates through the second fixing plate; a plurality of positioning lead screw segments for limiting the cooler sheets are arranged on the transverse lead screw; each positioning lead screw segment includes a positive threaded rod body, a lead screw connector and a reverse threaded rod body coaxially connected; wherein, the threads on the reverse threaded rod body and the threads on the positive threaded rod body are symmetrically arranged on both sides of the lead screw connector in a mirror image manner, and the center line of the lead screw connector is aligned with the center line of the pressure spray gun; a first vertical limiting plate and a second vertical limiting plate are further arranged on the positioning lead screw segment; the first vertical limiting plate is threadedly connected to the positive threaded rod body, and the second vertical limiting plate is threadedly connected to the reverse threaded rod body; adjacent positioning lead screw segments are coaxially fixed by a coupling; the outer diameter of the coupling is larger than the inner diameters of the first vertical limiting plate and the second vertical limiting plate.

[0014] For the solder automatic coating device for a cooler provided by the present invention, preferably, a cube groove is provided at the end of the positive threaded rod body; a first threaded hole is punched from the inner wall of the groove towards the outer wall of the positive threaded rod body; a cube convex block is provided at the end of the reverse threaded rod body; a second threaded hole penetrates through the cube convex block; the cube groove of the positive threaded rod body and the cube convex block of the reverse threaded rod body are in concave-convex fit; when the positive threaded rod body and the reverse threaded rod body are coaxially connected, the cube groove can be snap-fitted with the cube convex block, and the first threaded hole can be in a straight line with the second threaded hole; the lead screw connector is in a circular ring column shape; the lead screw connector is detachably sleeved on the snap-fitting part of the positive threaded rod body and the reverse threaded rod body; a third threaded hole penetrates through the side wall of the lead screw connector towards the center; when the cube groove is snap-fitted with the cube convex block, the internal threads of the first threaded hole, the second threaded hole and the third threaded hole can be coplanar.

[0015] The solder automatic coating device applied to a cooler provided by the present invention, preferably, the surfaces of the first fixing plate, the second fixing plate, the first vertical limiting plate and the second vertical limiting plate are all square structures; through holes for rotatably fixing the transverse lead screw are provided at the four corners of the first fixing plate and the second fixing plate; a sprocket transmission mechanism is arranged on the second fixing plate, and a bearing is arranged at the penetration and fixing position of the first fixing plate and the transverse lead screw; the sprocket transmission mechanism includes four sprockets and a chain drivingly connected to the four sprockets; the four sprockets are respectively coaxially arranged at one end of the four transverse lead screws; a rocker arm is arranged at the end of one of the sprockets; a supporting optical bar is also arranged through the centers of the surfaces of the first fixing plate, the second fixing plate, the first vertical limiting plate and the second vertical limiting plate in a collinear manner.

[0016] The above technical solution has the following advantages or beneficial effects:

[0017] The solder automatic coating device applied to a cooler provided by the present invention includes a solder conveying device, a solder spraying device and a cooler plate conveyor belt for conveying cooler plates; the solder conveying device includes a stirring motor, a solder storage bin for storing solder and a solder conveying pipeline; the solder spraying device includes a pressure spray gun fixedly arranged to face the upper surface of the plate conveyor belt; one end of the solder conveying pipeline is communicated with the solder storage bin, and the other end is communicated with the pressure spray gun; the pressure spray gun is used for automatically spraying solder onto the plate surface of the cooler plate under the action of pressure control. The solder automatic coating device provided by the present invention coats the cooler plates by an automated method. Compared with the method of manually coating solder, not only is the coating efficiency high, but also the controllability of the coating quality is high, the solder waste is reduced, the labor cost and material cost generated during the coating process of the cooler plates are reduced, the production and processing efficiency of the cooler is improved, and it is also beneficial to ensure the yield of the welded finished product of the cooler. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] By reading the detailed description of the non-limiting embodiments with reference to the following drawings, the present invention and its features, shape and advantages will become more obvious. The same reference numerals indicate the same parts in all the drawings. The drawings are not deliberately drawn to scale, and the focus is on showing the gist of the present invention.

[0019] Figure 1 is a schematic structural diagram of the solder automatic coating device applied to a cooler provided in Embodiment 1 of the present invention;

[0020] Figure 2 is a schematic front view of the plate positioning mechanism in the solder automatic coating device applied to a cooler provided in Embodiment 1 of the present invention;

[0021] Figure 3 It is a schematic top view of the plate positioning mechanism in the solder automatic coating device applied to the cooler provided in Embodiment 1 of the present invention;

[0022] Figure 4 It is a schematic structural view of the positive threaded rod body in the positioning screw rod section of the solder automatic coating device applied to the cooler provided in Embodiment 1 of the present invention;

[0023] Figure 5 It is a schematic structural view of the reverse threaded rod body in the positioning screw rod section of the solder automatic coating device applied to the cooler provided in Embodiment 1 of the present invention;

[0024] Figure 6 It is a schematic structural view of the screw connector in the positioning screw rod section of the solder automatic coating device applied to the cooler provided in Embodiment 1 of the present invention. Detailed implementation manners

[0025] In the description of the present invention, it should be noted that when terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present invention. When terms such as "installation", "connection", and "coupling" appear, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations. Without conflict, the embodiments and features in the embodiments of the present application can be combined with each other. It should be noted that the terms used in the present invention are only for describing specific implementation manners, rather than intending to limit the exemplary embodiments according to the present application. When using terms such as "comprise" and / or "include" in this specification, it indicates the presence of features, steps, operations, devices, components, and / or their combinations. When terms such as "first", "second", and "third" appear, they are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] Combined with the accompanying drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Therefore, the detailed description of the embodiments of the present invention provided in the following drawings is not intended to limit the scope of the claimed invention, but merely represents the selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts belong to the protection scope of the present invention.

[0027] Embodiment 1:

[0028] The solder automatic coating device for a cooler provided in Embodiment 1 of the present invention, referring to Figure 1 , includes a machine base 1; a solder conveying device for automatically conveying solder, a solder spraying device for spraying solder at a fixed point, and a cooler plate conveyor belt 4 for conveying the cooler plates 5 are provided on the machine base 1; the solder conveying device includes a stirring motor 21, a solder storage bin 22 for storing solder, and a solder conveying pipeline 23; the solder spraying device includes a pressure spray gun 31; the pressure spray gun 31 is fixedly arranged above the cooler plate conveyor belt 4, and the nozzle of the pressure spray gun 31 is arranged towards the upper surface of the cooler plate conveyor belt 4; one end of the solder conveying pipeline 23 is communicated with the solder storage bin 22, and the other end is communicated with the pressure spray gun 31; the pressure spray gun 31 is used to automatically spray solder onto the plate surface of the cooler plate 5 under the action of pressure control.

[0029] The above-mentioned automatic solder coating device for coolers provided in Example 1 of the present invention is provided with a solder conveying device, and the output shaft of the stirring motor 21 is arranged in the solder storage bin 22, so that the solder in the solder storage bin 22 can be stirred to prevent the solder in the solder storage bin 22 from condensing and affecting the normal progress of the solder coating process. The solder storage bin 22 is also a pressurized bin. While storing the solder, it can also be controlled by the external air pressure to convey the solder, and continuously convey it to the pressure spray gun 31 through the solder conveying pipeline 23. The solder spraying device includes a pressure spray gun 31 fixedly arranged above the cooler plate conveyor belt 4, and its fixed position and support method are not limited to a specific structure, as long as the coating station can be fixed. The nozzle of the pressure spray gun 31 is arranged facing the upper surface of the cooler plate conveyor belt 4, and it can be controlled by an external controller to pressurize and spray the absorbed solder. The control of the pressure spray gun 31 by the external controller is not limited to a specific structure and form. In order to specifically illustrate the implementation method of the automatic solder coating device for the cooler provided in Example 1 of the present invention, when the pressure spray gun 31 realizes the automatic solder spraying control function, the solder coating pressure of the pressure spray gun 31 can be set by an external air pressure source. When the cooler plate 5 reaches a preset conveyor belt position (the stop at the spraying station can be controlled by the assembly line equipment), the nozzle of the pressure spray gun 31 is aimed at the plate surface of the cooler plate 5, and the external air pressure source then pressurizes the air pressure chamber of the pressure spray gun 31 through the negative pressure pipeline, and pushes the pressure The piston in the spray gun 31 moves slightly, and the piston then squeezes the solder in the solder chamber delivered to the pressure spray gun 31, so that the solder is automatically sprayed out from the nozzle and coated on the plate surface of the cooler plate 5 (the structure of the pressure spray gun 31 cooperating with the external air pressure source is not shown in the accompanying drawings, but technical personnel in this field can understand its working method based on the text content disclosed in the specification, which will not be elaborated here). In this way, the pressure spray gun 31 is controlled to fully spray mist solder onto the cooler plate 5 on the cooler plate conveyor belt 4. The start and stop control of the pressure spray gun 31 can also use an external air pressure source to perform pressurization and pressure relief control, which will not be elaborated here. In this way, compared with the traditional method of manually applying solder to the cooler plates, the automatic solder coating device applied to the cooler provided in Example 1 of the present invention has higher spraying efficiency, spraying stability and spraying thickness consistency, and can spray the plate surfaces of the cooler plates 5 passing through in sequence in an orderly manner as the cooler plate conveyor belt 4 is slowly transmitted. The automation level is high, which greatly reduces labor costs and labor consumption, and through the parameter control of machine automation, the spraying quality is highly controllable, which is beneficial to ensuring the quality of subsequent brazing forming of the cooler and improving the service life of the cooler processing.

[0030] As a preferred embodiment, refer to Figure 1, the solder spraying device includes a spraying chamber 32 in the structure of a bottomless cube; the spraying chamber 32 is fixed on the machine base 1 and covers above the cooler plate conveyor belt 4; the pressure spray gun 31 is fixedly arranged in the spraying chamber 32; strip-shaped inlets 321 and strip-shaped outlets (not shown in the figure) are respectively opened on the spraying chamber 32 along the conveying direction of the cooler plate conveyor belt 4; the strip-shaped inlets 321 and the strip-shaped outlets are in clearance fit with the cooler plates 5 in the height direction.

[0031] The automatic solder coating device for a cooler provided in Embodiment 1 of the present invention is referred to Figure 1 , by fixing the spraying chamber 32 on the machine base 1, the spraying chamber 32 is in a hood-like bottomless structure, its side walls are fixed on the machine base 1, and the bottom surface of the top wall directly faces the cooler plate conveyor belt 4. The pressure spray gun 31 is fixedly arranged in the spraying chamber 32. Strip-shaped inlets 321 and strip-shaped outlets with heights approximately consistent with those of the cooler plates 5 are opened on the spraying chamber. When the cooler plates 5 are conveyed on the conveyor belt, they can enter the spraying chamber 32 through the strip-shaped inlets 321 with clearance fit. After being sprayed with solder by the pressure spray gun 31 at a fixed position in the spraying chamber 32, they are sent out from the strip-shaped outlets under the action of the cooler plate conveyor belt 4, improving the overall sealing strength of the solder spraying device. When the pressure spray gun 31 performs the spraying work on the cooler plates 5 passing on the conveyor belt, it can be isolated from the influence of a certain external environment, personnel and interference, making the solder coating efficiency higher and the quality control effect better.

[0032] It is worth noting that in order to ensure the brazing forming effect of the cooler in the later stage, the solder adopted by the applicant in the automatic solder coating device for a cooler provided in Embodiment 1 of the present invention is copper-free solder, and its cost is much higher than that of general copper solder. The solder is in a paste state in the solder storage bin 22 and is in a mist state after being sprayed out by the pressure spray gun 31. In order to fully spray the plate surface of the cooler plate 3 for subsequent welding, the mist-like solder will continuously escape under the action of pressure, resulting in a certain amount of solder waste, which is not conducive to the cost control of the enterprise. Considering this problem, the automatic solder coating device for a cooler provided in Embodiment 1 of the present invention, further referring to Figure 1 , further includes a solder negative pressure pipeline 6 and a first solder recovery container 7; a solder recovery pipe orifice 325 is opened on the side wall of the spraying chamber 32; one end of the solder negative pressure pipeline 6 is communicated with the spraying chamber 32 through the solder recovery pipe orifice 325, and the other end of the solder negative pressure pipeline 6 is communicated with the first solder recovery container 7; the first solder recovery container 7 is arranged on the machine base 1.

[0033] The solder automatic coating device for a cooler provided in Embodiment 1 of the present invention, by providing a solder negative pressure pipeline 6 and a first solder recovery container 7, while the pressure spray gun 31 continuously sprays the plate surface of the cooler plate 5 conveyed in the spray chamber 32, the solder negative pressure pipeline 6 can absorb the atomized solder escaping from the spray chamber 32 into the first solder recovery container 7. Moreover, the first solder recovery container 7 is arranged on the machine base 1, so that the solder negative pressure pipeline 6 can be set as short as possible, which can reduce the overall cost of the device, reduce the ratio of solder adsorbed by the pipe body during the process of recovering solder, and improve the solder recovery efficiency. Moreover, due to the relative sealing of the spray chamber 32, the solder negative pressure pipeline 6 absorbs the excess solder in the chamber under the power of an external negative pressure pump, which can improve the cleanliness and speed of the recovered solder to a certain extent, improve the secondary utilization rate of solder resources, and avoid the loss of enterprise costs caused by the waste of solder.

[0034] As a specific and preferred embodiment, referring to Figure 1 , the solder automatic coating device for a cooler provided in Embodiment 1 of the present invention further includes a vertical baffle 33; the vertical baffle 33 is vertically and fixedly arranged in the spray chamber 32, and there is a distance gap for the cooler plate 5 to pass through between the bottom end surface of the vertical baffle 33 and the upper surface of the cooler plate conveyor belt 4; the vertical baffle 33 divides the spray chamber 32 into a plate outlet chamber 332 and a plate inlet chamber 331; the strip-shaped inlet 321 is sequentially communicated with the strip-shaped outlet through the plate inlet chamber 331 and the plate outlet chamber 332; the pressure spray gun 31 is fixed on the wall surface of the vertical baffle 33 on the side of the plate inlet chamber 331; the solder recovery pipe orifice 325 is opened on the side wall of the spray chamber 32 on the side of the plate inlet chamber 331.

[0035] The solder automatic coating device for a cooler provided in Embodiment 1 of the present invention, by providing the vertical baffle 33, reasonably fixes the pressure spray gun 31 in the spray chamber 32, reduces the space layout occupied by the solder automatic coating device, has a compact overall volume, and improves the sealing performance during the solder spraying of the cooler plate 5, and is not easily affected by external environmental factors during the spraying process. At the same time, the vertical baffle 33 further divides the space of the spray chamber 32. When the nozzle of the pressure spray gun 31 faces the cooler plate 5 on the conveyor belt, the escaping atomized solder can be blocked to a certain extent on the vertical baffle 33, reducing the escaping range of the atomized solder; then, by arranging the solder recovery pipe orifice 325 on the side wall of the spray chamber 32 on the side where the plate inlet chamber 331 is located, the escaping atomized solder can be further absorbed into the first solder recovery container 7 after turning back on the vertical baffle 33, achieving better solder spraying concentration and improving the efficiency and effect of solder recovery.

[0036] Further, considering that during the automatic solder spraying process of the cooler plate 5, a part of the atomized solder continuously precipitated from the pressure spray gun 31 will be adsorbed on the conveyor belt as the cooler plate conveyor belt 4 conveys. Considering this problem, referring to Figure 1 , in the solder automatic coating device for a cooler provided in Embodiment 1 of the present invention, the cooler plate conveyor belt 4 is an endless pulley; a fixed scraper 8 for scraping solder and a second solder recovery container 9 for recovering solder are provided below the cooler plate conveyor belt 4; the second solder recovery container 9 is provided on the machine base 1; the top end face of the scraper 8 abuts against the bottom surface of the cooler plate conveyor belt 4, and the bottom end face of the scraper 8 is fixed in the second solder recovery container 9.

[0037] By further providing the second solder recovery container 9 and the scraper 8 on the machine base 1, while the cooler plate conveyor belt 4 is continuously running, the scraper 8 is fixed in the second solder recovery container 9. When the conveyor belt runs, the position of the scraper 8 is relatively fixed, and the top of the scraper 8 can abut against the surface of the conveyor belt. In this way, the excess solder on the surface of the conveyor belt after passing through the spraying chamber 32 can be further scraped off, which not only plays a role in solder recovery, but also cleans the surface of the conveyor belt, and can avoid polluting the subsequent cooler plates 5 to be coated to a certain extent, and can also prevent pollution to the environment and personnel (due to heavy metals in the solder). When implementing the scraper 8, a blunt material can be selected to prevent damage to the surface of the cooler plate conveyor belt 4, and the cooler plate conveyor belt 4 can be selected as a relatively smooth smooth surface material, which is easy to clean after the conveyor belt stops on the one hand, and also plays a role in enhancing the solder scraping and recovery efficiency on the other hand.

[0038] Further, the solder automatic coating device for a cooler provided in Embodiment 1 of the present invention, referring to Figure 1 , a pressure regulating valve 34 is fixed on the side wall of the spraying chamber 32; the pressure regulating valve 34 is connected to the pressure spray gun 31 through an air path. By setting the pressure regulating valve 34, when the solder automatic coating device operates, the nozzle spraying pressure of the pressure spray gun 31 is adjustable, and the pressure can be adjusted based on the working conditions or the specific situation of the cooler plate 5 to achieve flexible and optimized control and obtain the best coating efficiency.

[0039] The solder automatic coating device for a cooler provided in Embodiment 1 of the present invention, preferably, referring to Figure 1, an observation window opening is provided on the top wall of the spray material chamber 32; a transparent observation window plate 322 is movably provided on the observation window opening; the transparent observation window plate 322 is hermetically and openably provided on the observation window opening. By providing the transparent observation window plate 322 on the top wall of the spray material chamber 32, it is convenient to observe the spraying process of the pressure spray gun 31 on the cooler plate 5 from above, and it is possible to intervene in time when problems occur during the automatic spraying process. Moreover, the transparent observation window plate 322 is hermetically and openably provided on the observation window opening, preventing the solder from escaping from the top when the pressure spray gun 31 sprays solder, and also facilitating opening at any time for maintaining the internal pressure spray gun 31, air circuit, pipeline and other wire harnesses, improving the convenience of maintenance.

[0040] In order to make the solder automatic coating device for coolers provided in Embodiment 1 of the present invention have better controllability of spraying quality, as a preferred implementation, with reference to Figure 2 and Figure 3 for understanding, it further includes a plate positioning mechanism; the plate positioning mechanism includes a first fixing plate 101 and a second fixing plate 102 provided on both sides of the entrance of the cooler plate conveyor belt 4; a plurality of transverse lead screws 11 are rotatably provided between the first fixing plate 101 and the second fixing plate 102; the plate surfaces of the first fixing plate 101 and the second fixing plate 102 extend in the conveying direction of the cooler plate conveyor belt 4; one end of the transverse lead screw 11 penetrates through the first fixing plate 101, and the other end penetrates through the second fixing plate 102; a plurality of positioning lead screw segments 111 for limiting the cooler plate 5 are provided on the transverse lead screw 11; each positioning lead screw segment 111 includes a positive threaded rod body 1111, a lead screw connector 1113 and a reverse threaded rod body 1112 connected coaxially; wherein, the threads on the reverse threaded rod body 1112 and the positive threaded rod body 111 are symmetrically arranged on both sides of the lead screw connector 1113 in a mirror image manner, and the center line of the lead screw connector 1113 is aligned with the center line of the pressure spray gun 31; a first vertical limiting plate 121 and a second vertical limiting plate 122 are further provided on the positioning lead screw segment 111; the first vertical limiting plate 121 is threadedly connected to the positive threaded rod body 111, and the second vertical limiting plate 122 is threadedly connected to the reverse threaded rod body 1112; adjacent positioning lead screw segments 111 are coaxially fixed by a coupling 112; the outer diameter of the coupling 112 is larger than the inner diameters of the first vertical limiting plate 121 and the second vertical limiting plate 122.

[0041] When the solder automatic coating device for coolers provided in Embodiment 1 of the present invention is implemented, a plurality of transverse lead screws 11 are rotatably arranged through the first fixing plate 101 and the second fixing plate 102 (with reference to Figure 2 , Figure 3It is understood that the first fixed plate 101 and the second fixed plate 102 can be part of the positioning frame 10 to ensure the supporting stability. The positioning frame 10 can be fixed on the machine base 1 or on the ground to achieve its fixed position relative to the cooler plate conveyor belt 4. One end of the transverse lead screw 11 passes through the first fixed plate 101, and the other end passes through the second fixed plate 102. By rotating the transverse lead screw 11 in a coaxial drive manner, the rotation of the positioning lead screw section 111 provided on the transverse lead screw 11 can be driven. When the positioning lead screw section 111 rotates, since the threads of the positive threaded rod body 1111 and the reverse threaded rod body 1112 arranged coaxially are in a mirror image state with respect to the lead screw connector 1113, the thread directions are opposite. Therefore, when the transverse lead screw 11 rotates, it will drive the first vertical limiting plate 121 and the second vertical limiting plate 122 to move away from each other or move towards each other in the horizontal direction to adjust the distance between the limiting plates. By adjusting the distance between the limiting plates, cooler plates 5 of different sizes to be coated with solder can be set on the cooler plate conveyor belt 4 between the first vertical limiting plate 121 and the second vertical limiting plate 122 to achieve the function of positioning the initial conveying direction towards the spraying chamber 32. During the positioning process, since the thread on the reverse threaded rod body 1112 is mirror-symmetrical to the thread on the positive threaded rod body 1111 along the center line of the lead screw connector 1113, that is, the thread directions are opposite, the pitches are the same, and the thread lengths are the same, and the lead screw connector 1113 is exactly at the center of the coaxial positive threaded rod body 1111 and reverse threaded rod body 1112, and the center line of the lead screw connector 1113 is directly opposite the center line of the pressure spray gun 31. (In the present invention, it is understood that the center line of the lead screw connector 1113 and the center line of the pressure spray gun 31 fixedly arranged in the spraying chamber 32 are on the same straight line in the projection on the cooler plate conveyor belt 4). In this way, no matter how the transverse lead screw 11 rotates, for the vertical limiting plates (121, 122) provided on the positioning lead screw section 111, the distance between the plates is adjusted in a manner that the center line remains unchanged. After the cooler plate 5 is positioned at the entrance of the cooler plate conveyor belt 4 according to the adjusted distance between the plates, it can be ensured that after the cooler plate 5 reaches the spraying chamber 32 under the conveying action of the conveyor belt, the center of the plate surface of the cooler plate 5 can still be directly opposite the nozzle of the pressure spray gun 31, so that the cooler plate 5 can be fully coated with solder by the pressure spray gun 31 in the spraying chamber 32, reducing the probability of the solder being sprayed onto the cooler plate conveyor belt 4, greatly improving the accuracy and efficiency of the coating control, reducing the waste caused by the solder being coated outside the plate, and thus saving the material cost of the enterprise. The solder automatic coating device for the cooler provided in Embodiment 1 of the present invention has a simple plate positioning method for the cooler plate 5 at the entrance of the cooler plate conveyor belt 4, and the number of the positioning lead screw sections 111 can be set according to the number of the pressure spray guns 31 in the spraying chamber 32 (refer to Figure 2In the provided embodiment, there are two groups of positioning lead screw segments 111. The positioning distance sandwiched between the two groups of limiting plates can be adjusted in parallel by rotating the transverse lead screw 11. When there are multiple groups of positioning lead screw segments 111, convenient adaptive expansion and disassembly can be achieved through the coupling 112. It should be noted that each group of positioning lead screw segments 111 in the present invention has the same specification. Since adjacent positioning lead screw segments 111 are coaxially fixed through the coupling 112, and the outer diameter of the coupling 112 is greater than the inner diameters of the first vertical limiting plate 121 and the second vertical limiting plate 122, in this way, when the vertical limiting plates (121, 122) adjust the plate spacing (to adapt to different sizes of the cooler plates 5), the adjustable spacing range is controllable, and during adjustment, the vertical limiting plates will not shift to other positioning lead screw segments 111 due to excessive rotation amplitude of the transverse lead screw 11. During implementation, after the distance between the first vertical limiting plate 121 and the second vertical limiting plate 122 is adjusted, the positioning of the cooler plates 5 on the conveyor belt is completed. Refer to Figure 2 and Figure 3 , place the cooler plates 5 between the first vertical limiting plate 121 and the second vertical limiting plate 122 (a gap is left between the bottom end faces of the first vertical limiting plate 121 and the second vertical limiting plate 122 and the surface of the cooler plate conveyor belt 4, which can be understood by those skilled in the art and is subject to not interfering with the normal conveyance of the cooler plate conveyor belt 4), and the effective positioning of the cooler plates 5 can be achieved, effectively preventing the problems of low coating efficiency of the pressure spray gun 31 caused by the inclination or deviation of the conveyance position of the cooler plates 5 at the conveyor belt entrance, as well as uncontrollable coating quality and solder waste.

[0042] Furthermore, to facilitate the machining and assembly of the transverse lead screw 11, the solder automatic coating device for a cooler provided in Embodiment 1 of the present invention refers to Figure 4 , Figure 5 and Figure 6, a cube-shaped groove 11111 is provided at the end of the right-threaded rod body 1111; a first threaded hole 11112 is punched from the inner wall of the groove 11111 towards the outer wall of the right-threaded rod body 1111; a cube-shaped convex block 11121 is provided at the end of the left-threaded rod body 1112; a second threaded hole 11122 penetrates through the cube-shaped convex block 11121; the cube-shaped groove 11111 of the right-threaded rod body 1111 is in concave-convex fit with the cube-shaped convex block 11121 of the left-threaded rod body 1112; when the right-threaded rod body 1111 and the left-threaded rod body 1112 are coaxially connected, the cube-shaped groove 11111 can be snap-fitted with the cube-shaped convex block 11121, and the first threaded hole 11112 and the second threaded hole 11122 can be on the same straight line; the lead screw connector 1113 is in the shape of a circular ring column; the lead screw connector 1113 is detachably sleeved on the snap-fitting part of the right-threaded rod body 1111 and the left-threaded rod body 1112; a third threaded hole 11131 penetrates through the side wall of the lead screw connector 1113 towards the center; when the cube-shaped groove 11111 is snap-fitted with the cube-shaped convex block 11121, the internal threads of the first threaded hole 11112, the second threaded hole 11122 and the third threaded hole 11131 are coplanar.

[0043] The solder automatic coating device for a cooler provided in Embodiment 1 of the present invention further provides a detachable structure for the positioning lead screw section 111. The right-threaded rod body 1111, the left-threaded rod body 1112 and the lead screw connector 1113 can be conveniently assembled and disassembled, which is convenient for maintenance. By setting the end of the right-threaded rod body 1111 as a cube-shaped groove 11111, and then setting a cube-shaped convex block 11121 at the end of the left-threaded rod body 1112, the shape is simple and the processing is convenient. Compared with the cylindrical convex and concave matching shapes, it is convenient to punch threaded holes, and at the same time, it is more convenient to align the threaded holes with each other, and there is no need to frequently adjust the alignment angle to align the threaded holes, which greatly improves the assembly efficiency. When implementing the solder automatic coating device for a cooler provided in Embodiment 1 of the present invention, when assembling the positioning lead screw section 111, only need to first pre-sleeve the circular ring column-shaped lead screw connector 1113 on the outer surface of the right-threaded rod body 1111 or the left-threaded rod body 1112, and then snap the cube-shaped convex block 11121 on the left-threaded rod body 1112 into the cube-shaped groove 11111 of the right-threaded rod body 1111, and then move the position of the lead screw connector 1113 to the snap-connection part of the right-threaded rod body 1111 and the left-threaded rod body 1112, align the third threaded hole 11131 with the first threaded hole 11112 and the second threaded hole 11122, so that their internal threads are on a cylindrical surface, and then assemble the bolts, which has a high assembly efficiency and a low implementation cost.

[0044] As a preferred embodiment, the solder automatic coating device for a cooler provided in Embodiment 1 of the present invention, with reference to Figure 2 and Figure 3 , the surfaces of the first fixing plate 101, the second fixing plate 102, the first vertical limiting plate 121 and the second vertical limiting plate 122 are all of a square structure; through holes for rotatably fixing the transverse lead screw 11 are provided at the four corners of the first fixing plate 101 and the second fixing plate 102; a sprocket transmission mechanism is provided on the second fixing plate 102, and bearings (not shown in the figure) are provided at the through-fixing positions of the first fixing plate 101 and the transverse lead screw 11; the sprocket transmission mechanism includes four sprockets 141 and a chain 142 drivingly connected to the four sprockets; the four sprockets 141 are respectively coaxially arranged at one end of the four transverse lead screws 11; a rocker arm 15 is provided at the end of one of the sprockets 141; a support optical bar 13 is further provided through the centers of the surfaces of the first fixing plate 101, the second fixing plate 102, the first vertical limiting plate 121 and the second vertical limiting plate 122 in a collinear manner.

[0045] For the solder automatic coating device for a cooler provided in Embodiment 1 of the present invention, by processing the surfaces of the first fixing plate 101, the second fixing plate 102, the first vertical limiting plate 121 and the second vertical limiting plate 122 into a square structure, the processing is convenient and the implementation cost is relatively low. Through holes are provided at the four corners of the first fixing plate 101 and the second fixing plate 102, so that the first vertical limiting plate 121 and the second vertical limiting plate 122 can be positioned and adjusted by the four transverse lead screws 11. During implementation, by shaking the rocker arm 15, the four sprockets 141 can be simultaneously driven to rotate through the sprocket transmission mechanism drivingly connected thereto, and then the four transverse lead screws 11 can be driven to rotate together, which is relatively labor-saving. The four transverse lead screws 11 can then drive the first vertical limiting plate 121 and the second vertical limiting plate 122 on the set multiple groups of positioning lead screw segments 111 to move simultaneously, realizing the parallel adjustment of the distances between multiple groups of plate pieces, and having a relatively high synchronous adjustment efficiency. Bearings are provided at the contact parts where the first fixing plate 101 is fixedly penetrated by the transverse lead screw 11, which can reduce the friction coefficient of the transverse lead screw 11 during movement and ensure its rotational accuracy. Further, the provided support optical bar 13 can play a further supporting role for the overall device, which is beneficial to ensuring the stability of the device.

[0046] The solder automatic coating device applied to the cooler provided in Embodiment 1 of the present invention, during implementation, the rocker arm 15 is used to provide the power for rotation. Since the cooler plates 5 are transferred in batches on the cooler plate conveyor belt 4 and enter the spraying chamber 32 before the solder spraying process, during the automatic solder coating process, there is no need for frequent adjustment. The on-site workers can manually rotate the rocker arm 15 to drive the chain to rotate the four sprockets 141 simultaneously, and the sprockets 141 then drive the four horizontal lead screws 11 arranged coaxially respectively; compared with setting an additional control motor for synchronously rotating the horizontal lead screws 11, manually rotating the rocker arm 15 has a lower implementation cost, reduces the complexity of the mechanism, and can be adjusted flexibly and independently. The spraying process in the spraying chamber 32 will not be delayed during adjustment. The horizontal lead screws 11 drive a plurality of groups of vertical limiting plates (the first vertical limiting plate 121, the second vertical limiting plate 122) on them to adjust the positioning distance through the coaxial drive of the sprockets 141, so as to adapt to the positioning of cooler plates 5 of different sizes at the entrance of the cooler plate conveyor belt 4. During the adjustment process, since the lead screw connector 1113 has been pre-fixed at the central position relative to the pressure spray gun 31 in the spraying chamber 32, no matter how the horizontal lead screws 11 rotate and how the vertical limiting plates move, it can be ensured that when the cooler plates 5 enter the spraying chamber 32 after positioning, they can be as much as possible under the nozzle of the pressure spray gun 31, reducing the solder waste caused by the deviation of the position of the cooler plates 5 on the conveyor belt, which in turn leads to excessive spraying of the pressure spray gun 31 on the conveyor belt, and can also improve the efficiency of solder coating to a certain extent.

[0047] Those skilled in the art should understand that those skilled in the art can implement the above-mentioned variation examples in combination with the prior art and the above embodiments, which will not be elaborated here. Such variation examples do not affect the essence of the present invention and will not be elaborated here.

[0048] The preferred embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the above specific embodiments. The devices and structures not described in detail should be understood to be implemented in a common manner in the art; any person skilled in the art can make many possible changes and modifications without departing from the technical solution of the present invention, or modify it into an equivalent embodiment with equivalent changes, which does not affect the essence of the present invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. An automatic solder coating device for a cooler, characterized in that, it includes a machine base; on the machine base, there are provided a solder conveying device for automatically conveying solder, a solder spraying device for spraying solder at a fixed point, and a cooler plate conveyor belt for conveying cooler plates; the solder conveying device includes a stirring motor, a solder storage bin and a solder conveying pipeline; the solder spraying device includes a pressure spray gun; the pressure spray gun is fixedly arranged above the cooler plate conveyor belt, and the nozzle of the pressure spray gun is arranged towards the upper surface of the cooler plate conveyor belt; one end of the solder conveying pipeline is communicated with the solder storage bin, and the other end is communicated with the pressure spray gun; the pressure spray gun is used to automatically spray solder onto the plate surface of the cooler plate under the action of pressure control; the cooler plate conveyor belt is an annular pulley; below the cooler plate conveyor belt, there is fixedly arranged a scraper for scraping solder and a second solder recovery container for recovering solder; the second solder recovery container is arranged on the machine base; the top end face of the scraper abuts against the bottom surface of the cooler plate conveyor belt, and the bottom end face of the scraper is fixedly arranged in the second solder recovery container; it further includes a plate positioning mechanism; the plate positioning mechanism includes a first fixed plate and a second fixed plate respectively arranged on both sides of the entrance of the cooler plate conveyor belt; between the first fixed plate and the second fixed plate, several transverse lead screws are rotatably arranged; the plate surfaces of the first fixed plate and the second fixed plate extend towards the conveying direction of the cooler plate conveyor belt; one end of the transverse lead screw penetrates through the first fixed plate, and the other end penetrates through the second fixed plate; on the transverse lead screw, there are several positioning lead screw sections for limiting the cooler plates; each positioning lead screw section includes a positive threaded rod body, a lead screw connector and a reverse threaded rod body which are coaxially connected; wherein, the threads on the reverse threaded rod body and the positive threaded rod body are symmetrically arranged on both sides of the lead screw connector in a mirror image manner, and the center line of the lead screw connector is directly opposite to the center line of the pressure spray gun; on the positioning lead screw section, there are also arranged a first vertical limiting plate and a second vertical limiting plate; the first vertical limiting plate is threadedly connected to the positive threaded rod body, and the second vertical limiting plate is threadedly connected to the reverse threaded rod body; adjacent positioning lead screw sections are coaxially fixed by a coupling; the outer diameter of the coupling is larger than the inner diameters of the first vertical limiting plate and the second vertical limiting plate.

2. The automatic solder coating device for a cooler according to claim 1, characterized in that, the solder spraying device includes a spraying chamber with a bottomless cube structure; the spraying chamber is fixed on the machine base and covers the upper part of the cooler plate conveyor belt; the pressure spray gun is fixedly arranged in the spraying chamber; strip-shaped entrances and strip-shaped exits are respectively opened on the side walls of the spraying chamber along the conveying direction of the cooler plate conveyor belt; the strip-shaped entrances and the strip-shaped exits are in clearance fit with the cooler plates in the height direction.

3. The solder automatic coating device applied to a cooler as described in claim 2, characterized in that, it further includes a solder negative pressure pipeline and a first solder recovery container; a solder recovery pipe orifice is opened on the side wall of the spray material chamber; one end of the solder negative pressure pipeline is communicated with the spray material chamber through the solder recovery pipe orifice, and the other end of the solder negative pressure pipeline is communicated with the first solder recovery container; the first solder recovery container is arranged on the machine base.

4. The solder automatic coating device applied to a cooler as described in claim 3, characterized in that, it further includes a vertical baffle; the vertical baffle is vertically and fixedly arranged in the spray material chamber, and a distance gap for the cooler plate to pass through is spaced between the bottom end face of the vertical baffle and the upper surface of the cooler plate conveyor belt; the vertical baffle divides the spray material chamber into a plate outlet chamber and a plate inlet chamber; the strip-shaped inlet is sequentially communicated with the strip-shaped outlet through the plate inlet chamber and the plate outlet chamber; the pressure spray gun is fixed on the wall surface of the vertical baffle on the side of the plate inlet chamber; the solder recovery pipe orifice is opened on the side wall of the spray material chamber on the side of the plate inlet chamber.

5. The solder automatic coating device applied to a cooler as described in claim 2, characterized in that, a pressure regulating valve is fixed on the side wall of the spray material chamber; the pressure regulating valve is connected to the pressure spray gun through an air circuit.

6. The solder automatic coating device applied to a cooler as described in claim 2, characterized in that, an observation window opening is opened on the top wall of the spray material chamber; a transparent observation window plate is movably arranged on the observation window opening; the transparent observation window plate is hermetically arranged on the observation window opening in an openable manner.

7. The solder automatic coating device applied to a cooler as described in claim 1, characterized in that, a cube groove is arranged at the end of the positive threaded rod body; a first threaded hole is punched from the inner wall of the groove towards the outer wall of the positive threaded rod body; a cube convex block is arranged at the end of the reverse threaded rod body; a second threaded hole penetrates through the cube convex block; the cube groove of the positive threaded rod body and the cube convex block of the reverse threaded rod body are in concave-convex fit; when the positive threaded rod body and the reverse threaded rod body are coaxially connected, the cube groove can be snap-fitted with the cube convex block, and the first threaded hole can be in a straight line with the second threaded hole; the lead screw connector is in a circular column shape; the lead screw connector is detachably sleeved at the snap-fitting part of the positive threaded rod body and the reverse threaded rod body; a third threaded hole penetrates through the side wall of the lead screw connector towards the center; when the cube groove is snap-fitted with the cube convex block, the internal threads of the first threaded hole, the second threaded hole and the third threaded hole are coplanar.

8. The solder automatic coating device applied to a cooler as described in claim 1, characterized in that, The surfaces of the first fixed plate, the second fixed plate, the first vertical limiting plate and the second vertical limiting plate are all square structures; through holes for rotatably fixing the transverse lead screw are provided at the four corners of the first fixed plate and the second fixed plate; a sprocket transmission mechanism is arranged on the second fixed plate, and bearings are arranged at the through-fixing positions of the first fixed plate and the transverse lead screw; the sprocket transmission mechanism includes four sprockets and a chain drivingly connected to the four sprockets; the four sprockets are respectively coaxially arranged at one ends of the four transverse lead screws; a rocker arm is arranged at the end of one of the sprockets; a support optical bar is also arranged through the centers of the surfaces of the first fixed plate, the second fixed plate, the first vertical limiting plate and the second vertical limiting plate in a collinear manner.

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