Anti-metal electronic tag and manufacturing method thereof

Abstract

The present invention discloses an anti-metal electronic tag and a manufacturing method thereof. The anti-metal electronic tag comprises: an electronic tag body, the electronic tag body being suitable for being arranged on a device; and a metal isolator, the metal isolator being connected to the electronic tag body to isolate the electronic tag body from the device. According to the anti-metal electronic tag of the embodiment of the present invention, by arranging the metal isolator on the electronic tag body, the metal isolator can effectively block the influence of the device surface on the reading distance of the electronic tag body, thereby ensuring that the anti-metal electronic tag has good reading performance in different installation environments; thereby, the problem of large differences in the reading distance of the anti-metal electronic tag caused by different metal materials on the device surface, the flatness of the metal material on the device surface, and the thickness of the metal material on the device surface can be solved, and the production is convenient and simple, and the production cost is low.

Description

Technical Field

[0001] The present invention relates to the field of wireless communication technology, and in particular to an anti-metal electronic tag and a manufacturing method thereof. Background Art

[0002] The Internet of Things is a technology based on Internet applications that extends and expands the user end to any information exchange and network communication. It is one of the important components of the modern information industry. RFID is an automatic identification technology and a key component of the Internet of Things technology. It uses radio frequency signals to transmit data and energy, thereby completing non-contact automatic identification. RFID technology has a large number of applications and huge development prospects in many fields such as commodity management, transportation production, manufacturing, and commerce.

[0003] In order to utilize it on metal equipment, an anti-metal tag is proposed based on RFID technology to meet the reading and application performance on metal equipment. However, these anti-metal tags have corresponding application defects after being pasted on the metal surface of the equipment. For example, different metal materials on the surface of the equipment, the flatness of the metal material on the surface of the equipment and the thickness of the metal material on the surface of the equipment will affect the reading performance of the anti-metal tag, which seriously hinders the application of the anti-metal tag on site. There is room for improvement. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide an anti-metal electronic tag, which has a simple structure and ensures that the anti-metal electronic tag has good reading performance in different installation environments.

[0005] The invention also provides a method for manufacturing the anti-metal electronic tag.

[0006] The anti-metal electronic tag according to the first embodiment of the present invention comprises: an electronic tag body, which is suitable for being arranged on a device; and a metal isolator, which is connected to the electronic tag body to isolate the electronic tag body from the device.

[0007] According to the anti-metal electronic tag of the embodiment of the present invention, a metal isolation piece is arranged on the electronic tag body, and the metal isolation piece can effectively block the influence of the device surface on the reading distance of the electronic tag body, thereby ensuring that the anti-metal electronic tag has good reading performance in different installation environments; thereby, the problem of large differences in the reading distance of the anti-metal electronic tag caused by different metal materials on the device surface, the flatness of the metal material on the device surface and the thickness of the metal material on the device surface can be solved, and the production is convenient and simple, and the production cost is low.

[0008] According to the anti-metal electronic tag of the embodiment of the present invention, the surface of the device is a metal structure.

[0009] According to the metal-resistant electronic tag of the embodiment of the present invention, the metal isolating member includes an isolating portion, the isolating portion is suitable for being sandwiched between the electronic tag body and the device, and the shape of the isolating portion corresponds to the shape of the electronic tag body.

[0010] Specifically, the isolation portion forms an isolation plate with a flat surface.

[0011] Specifically, the metal isolation member further includes an extension portion, one end of which is connected to the isolation portion and the other end of which extends in a direction away from the electronic tag body.

[0012] Specifically, the angle between the extension portion and the isolation portion ranges from 90° to 180°.

[0013] Specifically, the extension portion includes a plurality of extension portions, and the plurality of extension portions are connected to each other to form a ring-shaped extension portion surrounding the electronic tag body.

[0014] According to the anti-metal electronic tag of the embodiment of the present invention, the thickness of the metal isolation piece ranges from 0.1 mm to 0.5 mm.

[0015] According to the metal-resistant electronic tag of the embodiment of the present invention, an antenna is arranged in the electronic tag body, and the projection of the metal isolating element on the plane where the antenna is located covers the antenna.

[0016] According to the metal-resistant electronic tag of the embodiment of the present invention, the metal isolation piece and the electronic tag body are connected as one body through an injection molding process.

[0017] According to the metal-resistant electronic tag of the embodiment of the present invention, the metal isolation piece is tightly connected to the electronic tag body.

[0018] According to the second aspect of the present invention, the manufacturing method of the anti-metal electronic tag includes the following steps: providing an antenna and a radio frequency chip, a metal layer, and an injection-molded core; providing a metal spacer; assembling the antenna and the radio frequency chip, the metal layer, the injection-molded core, and the metal spacer to form the anti-metal electronic tag.

[0019] According to the manufacturing method of the anti-metal electronic tag of the embodiment of the present invention, the influence of the device surface on the reading distance of the electronic tag body can be effectively blocked, and an anti-metal electronic tag with good reading performance in different installation environments can be manufactured. The manufacturing is convenient and simple, and the production cost is low.

[0020] According to the manufacturing method of the anti-metal electronic tag of an embodiment of the present invention, the assembling of the antenna and the radio frequency chip, the metal layer, the injection molded inner core and the metal isolation member includes: using an injection molding process to assemble the antenna and the radio frequency chip, the metal layer and the injection molded inner core into one body to form the electronic tag body with an injection molded shell; assembling the electronic tag body and the metal isolation member to form the anti-metal electronic tag.

[0021] According to the manufacturing method of the anti-metal electronic tag of an embodiment of the present invention, the assembling of the antenna and the radio frequency chip, the metal layer, the injection molded core and the metal isolation member includes: using an injection molding process to assemble the antenna and the radio frequency chip, the metal layer with the injection molded core and the metal isolation member into one, so as to form the anti-metal electronic tag with an injection molded shell.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0024] Figure 1 is a schematic structural diagram of an anti-metal electronic tag according to an embodiment of the present invention;

[0025] Figure 2 is a schematic structural diagram of a metal isolation member according to an embodiment of the present invention;

[0026] Figure 3 is a schematic diagram of the installation and assembly of an anti-metal electronic tag device according to an embodiment of the present invention;

[0027] Figure 4 is a flow chart of a method for manufacturing an anti-metal electronic tag according to an embodiment of the present invention;

[0028] Figure 5 is a flow chart of a method for manufacturing an anti-metal electronic tag according to a specific embodiment of the present invention;

[0029] Figure 6 The figure is a flow chart of a method for manufacturing an anti-metal electronic tag according to another specific embodiment of the present invention.

[0030] Reference numerals:

[0031] Anti-metal electronic tag 100,

[0032] Electronic tag body 10,

[0033] Metal isolation member 20, isolation portion 21, extension portion 22, first extension portion 221, second extension portion 222,

[0034] Device 30. DETAILED DESCRIPTION

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] Reference below Figure 1-Figure 6 An anti-metal electronic tag 100 according to an embodiment of the present invention is described.

[0039] like Figure 1-Figure 3 As shown, an anti-metal electronic tag 100 according to an embodiment of the present invention includes: an electronic tag body 10 and a metal isolation piece 20. The electronic tag body 10 is suitable for being arranged on a device 30. The metal isolation piece 20 is connected to the electronic tag body 10 to isolate the electronic tag body 10 from the device 30, thereby blocking the influence of the surface of the device 30 on the reading distance of the electronic tag body 10.

[0040] According to the anti-metal electronic tag 100 of the embodiment of the present invention, by setting the metal isolation piece 20 on the electronic tag body 10, the metal isolation piece 20 can effectively block the influence of the surface of the device 30 on the reading distance of the electronic tag body 10, thereby ensuring that the anti-metal electronic tag 100 has good reading performance in different installation environments; thereby, the problem of large difference in the reading distance of the anti-metal electronic tag 100 caused by different metal materials on the surface of the device 30, the flatness of the metal material on the surface of the device 30 and the thickness of the metal material on the surface of the device 30 can be solved, so that the performance of the electronic tag body 10 can be maximized, and the production is convenient and simple, and the production cost is low.

[0041] Among them, the surface of the device 30 here can be a metal structure, and the electronic tag body 10 includes an injection molded core, an antenna, a radio frequency chip and a metal layer. The antenna and the radio frequency chip are assembled on one side of the injection molded core, and the metal layer is assembled on the other side of the injection molded core. The injection molded core here acts as a bracket and can limit the distance between the antenna and the metal layer. Therefore, the electronic tag body 10 can be set on a device with a metal structure on the surface, and cooperate with the metal surface to enhance the sensing ability of the radio frequency signal to the tag.

[0042] According to one embodiment of the present invention, the projection of the metal isolation member 20 on the plane where the antenna is located covers the antenna, thereby ensuring that the metal isolation member 20 effectively blocks the antenna from the device 30, preventing the material, curvature or flatness of the surface of the device 30 from affecting the antenna's recognition, thereby affecting the reading and application performance of the anti-metal electronic tag 100.

[0043] According to one embodiment of the present invention, if the thickness of the metal isolation member 20 is too large, it will easily lead to a large difference in the reading distance of the anti-metal electronic tag 100. If the thickness of the metal isolation member 20 is too small, it will not have an effective barrier effect, which will also affect the reading distance of the anti-metal electronic tag 100. Therefore, the thickness range of the metal isolation member 20 is limited to between 0.1mm-0.5mm, that is, the thickness of the metal isolation member 20 can be 0.1mm, 0.3mm, 0.5mm, etc., to ensure that under the action of the metal isolation member 20, the anti-metal electronic tag 100 has better reading and application performance.

[0044] According to an embodiment of the present invention, the metal spacer 20 and the electronic tag body 10 are connected together by injection molding, so that the metal spacer 20 and the electronic tag body 10 form an integral part, thereby facilitating the installation of the anti-metal electronic tag 100 on any device 30.

[0045] In the injection molding process of the anti-metal electronic tag 100, the metal spacer 20 can be directly injection molded into the shell of the anti-metal electronic tag to form an integrated injection-molded anti-metal electronic tag with the metal spacer 20. At this time, the thickness of the metal spacer 20 can be relatively thin, for example, the thickness is 0.1 mm. The metal spacer 20 can be other metals such as aluminum foil and copper foil. Of course, in the injection molding process of the anti-metal electronic tag 100, the metal spacer 20 can also be injection molded outside the shell of the electronic tag body 10. At this time, the thickness of the metal spacer 20 can be appropriately increased, for example, the thickness is 0.4 mm, so as to facilitate the assembly of the metal spacer 20 without affecting the reading distance of the electronic tag body 10.

[0046] According to one embodiment of the present invention, the metal isolation member 20 is fastened to the electronic tag body 10. For example, the metal isolation member 20 may be a steel plate. The metal isolation member 20 has a slot and the electronic tag body 10 has a buckle. Alternatively, the metal isolation member 20 has a buckle and the electronic tag body 10 has a slot. The buckle and the slot are matched to connect the two, so that the metal isolation member 20 and the electronic tag body 10 are not easily separated, thereby facilitating the installation of the anti-metal electronic tag 100 on any device 30.

[0047] According to one embodiment of the present invention, the metal isolation member 20 includes an isolation portion 21, which is suitable for being clamped between the electronic tag body 10 and the device 30, and the shape of the isolation portion 21 corresponds to the shape of the electronic tag body 10. By making the isolation portion 21 correspond to the shape of the electronic tag body 10, it is convenient for the isolation portion 21 to cooperate with the electronic tag body 10, and it can also ensure that the isolation portion 21 can play an effective barrier effect.

[0048] The isolating portion 21 forms an isolating plate with a flat surface, and the electronic tag body 10 cooperates with the isolating portion 21 to avoid the uneven surface of the isolating portion 21 affecting the reading distance of the electronic tag body 10, while facilitating assembly, connection or injection molding of the isolating portion 21 and the electronic tag body 10.

[0049] In some examples, if the thickness of the isolation portion 21 is too large, it may easily lead to a large difference in the reading distance of the anti-metal electronic tag 100. If the thickness of the isolation portion 21 is too small, it will not have an effective barrier effect, which will also affect the reading distance of the anti-metal electronic tag 100. Therefore, the thickness range of the isolation portion 21 is limited to between 0.1mm-0.5mm, that is, the thickness of the isolation portion 21 can be 0.1mm, 0.3mm, 0.5mm, etc., to ensure that under the action of the isolation portion 21, the anti-metal electronic tag 100 has better reading and application performance.

[0050] In some examples, an antenna is provided in the electronic tag body 10, and the projection of the isolation portion 21 on the plane where the antenna is located covers the antenna, thereby ensuring that the isolation portion 21 effectively blocks the antenna from the device 30, preventing the material, curvature or flatness of the surface of the device 30 from affecting the antenna recognition and affecting the reading and application performance of the anti-metal electronic tag 100.

[0051] In some examples, the isolation part 21 is connected to the electronic tag body 10 through an injection molding process. That is, in the production of the anti-metal electronic tag 100 by injection molding, the isolation part 21 can be directly injection molded into the shell of the anti-metal electronic tag to form an anti-metal electronic tag 100 with an isolation part 21. In this case, the isolation part 21 can be other metals such as aluminum foil and copper foil, and the thickness of the isolation part 21 can be 0.1mm. Of course, in the production of the anti-metal electronic tag 100 by injection molding, the isolation part 21 can also be injection molded outside the shell of the electronic tag body 10. In this case, the isolation part 21 can be a steel plate, and the thickness of the isolation part 21 can be 0.4mm.

[0052] like Figure 1 As shown, according to an embodiment of the present invention, the metal isolator 20 includes: an isolating portion 21 and an extending portion 22. The isolating portion 21 is suitable for being sandwiched between the electronic tag body 10 and the device 30. The isolating portion 21 forms an isolating plate with a flat surface. One end of the extending portion 22 is connected to the isolating portion 21, and the other end extends in a direction away from the electronic tag body 10. Under the action of the extending portion 22 and the isolating portion 21, the metal isolator 20 can wrap the electronic tag body 10 to a certain extent, further maximizing the performance of the electronic tag body 10.

[0053] In some specific examples, the angle between the extension portion 22 and the isolation portion 21 ranges from 90° to 180°, that is, the extension portion 22 can extend outward along the extension direction of the isolation portion 21, and the angle between the extension portion 22 and the isolation portion 21 is 180°. The extension portion 22 can also be arranged perpendicular to the isolation portion 21, and the angle between the extension portion 22 and the isolation portion 21 is 90°. Of course, the angle between the extension portion 22 and the isolation portion 21 can also be 120°, 145°, 150°, etc. Under the action of the extension portion 22, the electronic tag body 10 is half-wrapped to ensure that the performance of the electronic tag body 10 is maximized.

[0054] Among them, the extension part 22 may include one, or may include two or more, and the extension part 22 is located at any edge of the isolation part 21. That is to say, any edge of the isolation part 21 may be provided with an extension part 22, or may not be provided with an extension part 22. The angle between each extension part 22 and the isolation part 21 may be the same or different, so as to achieve the best performance of the electronic tag body 10.

[0055] like Figure 2 As shown, in some examples, the extension portion 22 includes two first extension portions 221 arranged opposite to each other, and the angle between the first extension portion 221 and the isolation portion 21 is 150°. Under the action of the two first extension portions 221, the side of the electronic tag body 10 is wrapped to ensure that the performance of the electronic tag body 10 is maximized.

[0056] In some examples, the extension portion 22 includes a plurality of extension portions 22, which are connected to each other to form a ring-shaped extension portion surrounding the electronic tag body 10, such as Figure 1 As shown, the outer side of the isolation portion 21 has two oppositely arranged first extension portions 221 and two oppositely arranged second extension portions 222, the angle between the first extension portion 221 and the isolation portion 21 is 150°, the angle between the second extension portion 222 and the isolation portion 21 is 180°, the first extension portion 221 and the second extension portion 222 are interconnected to form an annular extension portion, thereby improving the barrier effect of the metal isolation member 20 on the electronic tag body 10, ensuring that the performance of the electronic tag body 10 is maximized.

[0057] In some specific examples, the isolation portion 21 and the extension portion 22 are plate structures of equal thickness, and the thickness range is between 0.1mm-0.5mm, that is, the thickness of the metal isolation member 20 can be 0.1mm, 0.3mm, 0.5mm, etc., to ensure that under the action of the metal isolation member 20, the anti-metal electronic tag 100 has better reading and application performance.

[0058] The method for manufacturing an anti-metal electronic tag according to an embodiment of the present invention comprises the following steps:

[0059] S1, provides antenna and RF chip, metal layer, and injection molded core;

[0060] S2, providing metal isolation parts;

[0061] S3, assembling the antenna and the radio frequency chip, the metal layer, the injection molded inner core and the metal spacer to form an anti-metal electronic tag.

[0062] According to the manufacturing method of the anti-metal electronic tag of the embodiment of the present invention, the influence of the device surface on the reading distance of the electronic tag body can be effectively blocked, and an anti-metal electronic tag with good reading performance in different installation environments can be manufactured. The manufacturing is convenient and simple, and the production cost is low.

[0063] The injection molded inner core acts as a bracket and can also limit the distance between the antenna and the metal layer. Thus, the anti-metal electronic tag can be set on a device with a metal surface and cooperate with the metal surface to enhance the sensitivity of the radio frequency signal to the tag.

[0064] According to one embodiment of the present invention, assembling the antenna and the RF chip, the metal layer, the injection molded inner core and the metal spacer includes: assembling the antenna and the RF chip, the metal layer and the injection molded inner core into one piece by an injection molding process to form an electronic tag body with an injection molded shell; assembling the electronic tag body and the metal spacer to form an anti-metal electronic tag. Therefore, in the production of the anti-metal electronic tag injection molding process, the metal spacer is injection molded outside the shell of the electronic tag body.

[0065] Combine the following Figure 5 , describing a method for manufacturing an anti-metal electronic tag according to the present invention.

[0066] First, FPC plate making is carried out to make FPC antenna; printing or patch processing is carried out; the RF chip is welded on the FPC antenna through SMT welding and dispensing process; an injection molded core is provided; a metal layer is provided at the same time, and assembly is carried out so that the antenna and the RF chip are located on one side of the injection molded core, and the metal layer is located on the other side of the injection molded core, and then, the electronic tag body is formed by injection molding the outer shell; a finished metal spacer is provided; finally, the electronic tag body and the metal spacer are assembled to form an anti-metal electronic tag.

[0067] According to another embodiment of the present invention, assembling the antenna and the RF chip, the metal layer, the injection-molded inner core and the metal spacer includes: assembling the antenna and the RF chip, the metal layer, the injection-molded inner core and the metal spacer into one piece by an injection molding process to form an anti-metal electronic tag with an injection-molded shell. That is, in the injection molding process of the anti-metal electronic tag, the metal spacer can be directly injection-molded into the shell of the anti-metal electronic tag to form an integrated injection-molded anti-metal electronic tag with a metal spacer.

[0068] Combine the following Figure 6 , describing a method for manufacturing an anti-metal electronic tag according to the present invention.

[0069] First, FPC plate making is carried out to make FPC antenna; printing or patch processing is carried out; the RF chip is welded to the FPC antenna through SMT welding and dispensing process; an injection molded core is provided; then, a metal layer is provided, and a manufactured metal spacer is provided at the same time, and then assembly is carried out so that the antenna and the RF chip are located on one side of the injection molded core, the metal layer is located on the other side of the injection molded core, and the metal spacer is also located on the other side of the injection molded core, and finally an anti-metal electronic tag is formed through an injection molded shell.

[0070] Therefore, the manufactured anti-metal electronic tag can effectively block the influence of the device surface on the reading distance of the electronic tag body. Since each anti-metal electronic tag carries a unique asset identity code, it can identify the device and use radio frequency signals to transmit the device code, which can easily realize the full life cycle management of device assets.

[0071] Other structures and operations of the anti-metal electronic tag 100 according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0072] In the description of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.

[0073] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0074] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An anti-metal electronic tag, characterized in that: include: An electronic tag body, wherein the electronic tag body is arranged on the device; A metal isolator connected to the electronic tag body to isolate the electronic tag body from the device; The metal isolating member includes an isolating portion, the isolating portion is sandwiched between the electronic tag body and the device, and the shape of the isolating portion corresponds to the shape of the electronic tag body; The metal isolation member further comprises: An extension portion, one end of which is connected to the isolation portion and the other end of which extends in a direction away from the electronic tag body; The extension portion is provided at any edge of the isolation portion; The included angle between the extension portion and the isolation portion is in the range of 120°-150°.

2. The anti-metal electronic tag according to claim 1, characterized in that: The surface of the device is a metal structure.

3. The anti-metal electronic tag according to claim 1, characterized in that: The isolation portion forms an isolation plate with a flat surface.

4. The anti-metal electronic tag according to claim 1, characterized in that: The extension portion includes a plurality of portions, and the plurality of extension portions are connected to each other to form a ring-shaped extension portion surrounding the electronic tag body.

5. The anti-metal electronic tag according to claim 1, characterized in that: The thickness of the metal isolation piece ranges from 0.1 mm to 0.5 mm.

6. The anti-metal electronic tag according to claim 1, characterized in that: An antenna is arranged in the electronic tag body, and the projection of the metal isolating element on the plane where the antenna is located covers the antenna.

7. The anti-metal electronic tag according to any one of claims 1 to 6, characterized in that: The metal isolating piece and the electronic tag body are connected as one body through an injection molding process.

8. The anti-metal electronic tag according to any one of claims 1 to 6, characterized in that: The metal isolation piece is tightly connected to the electronic tag body.

9. A method for manufacturing an anti-metal electronic tag according to any one of claims 1 to 6, characterized in that: The following steps are involved: Provide antenna and RF chip, metal layer, injection molded core; Providing metal isolation parts; The antenna and the radio frequency chip, the metal layer, the injection-molded inner core and the metal isolation member are assembled to form the anti-metal electronic tag.

10. The method for manufacturing an anti-metal electronic tag according to claim 9, characterized in that: The assembling of the antenna and the radio frequency chip, the metal layer, the injection molded inner core and the metal spacer comprises: The antenna and the radio frequency chip, the metal layer and the injection molded inner core are assembled into one body by using an injection molding process to form the electronic tag body with an injection molded outer shell; The electronic tag body and the metal isolation piece are assembled to form the anti-metal electronic tag.

11. The method for manufacturing an anti-metal electronic tag according to claim 9, characterized in that: The assembling of the antenna and the radio frequency chip, the metal layer, the injection molded inner core and the metal spacer comprises: The antenna and the radio frequency chip, the metal layer, the injection-molded inner core and the metal isolator are assembled into one by an injection-molded process to form the anti-metal electronic tag with an injection-molded shell.

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