Method for manufacturing a conductive terminal

Abstract

A method for manufacturing a conductive terminal comprises the following steps: providing a first substrate, the first substrate being made of copper and having a contact portion; providing a second substrate, the second substrate being made of copper and having a welding portion; electroplating at least the contact portion of the first substrate to form a first metal composite layer having an outer surface layer of a rhodium alloy plating layer; electroplating at least the welding portion of the second substrate to form a second metal composite layer having an outer surface layer of a third gold plating layer; assembling the first substrate and the second substrate into one by laser so that the contact portion and the welding portion are arranged facing each other.

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a conductive terminal, and in particular to a method for manufacturing a conductive terminal used for charging contacts on a wearable device. [Background technology]

[0002] In the prior art, in order to prevent the terminals of the electrical connector from being corroded, the surfaces of the terminals are electroplated with rhodium alloy, which has good anti-corrosion and anti-wear properties. However, due to the poor welding performance of rhodium alloy, the welding part of the terminal used for the charging contact of a wearable device cannot be well welded to the circuit board.

[0003] Therefore, it is necessary to provide a method for manufacturing a conductive terminal for charging contacts on wearable devices that has both corrosion resistance and can be well welded to a circuit board. [Summary of the invention]

[0004] The object of the present invention is to provide a method for manufacturing a conductive terminal which has both anti-corrosion performance and can be well welded with a circuit board.

[0005] To achieve the above-mentioned purpose, the present invention can be implemented by the following technical scheme: a method for manufacturing a conductive terminal, comprising the following steps: providing a first substrate, the first substrate is made of copper and has a contact portion; providing a second substrate, the second substrate is made of copper and has a welding portion; electroplating at least the contact portion of the first substrate to form a first metal composite layer having an outer layer of a rhodium alloy plating layer; electroplating at least the welding portion of the second substrate to form a second metal composite layer having an outer layer of a third gold plating layer; assembling the first substrate and the second substrate into one by laser so that the contact portion and the welding portion are located on two opposite surfaces of the conductive terminal.

[0006] Furthermore, the contact portion is located on the top surface of the first substrate, and the welding portion is located on the bottom surface of the second substrate. In the step of assembling the first substrate and the second substrate, the bottom surface of the first substrate and the top surface of the second substrate are combined by laser.

[0007] Furthermore, the first substrate and the second substrate are both cylindrical structures, the second substrate has a second outer diameter that is larger than the first outer diameter of the first substrate, the top surface of the second substrate is concavely provided with a groove to accommodate the bottom surface of the first substrate, and the third outer diameter of the groove is not less than the first outer diameter.

[0008] Furthermore, the rhodium alloy is a rhodium-palladium alloy.

[0009] Furthermore, the first metal composite layer is a first nickel plating layer, a first gold plating layer, a palladium nickel plating layer, a second gold plating layer and the rhodium alloy plating layer formed by electroplating from the inside to the outside of the surface of the first substrate.

[0010] Furthermore, the rhodium alloy is a rhodium-palladium alloy, and the corresponding thicknesses of the first nickel plating layer, the first gold plating layer, the palladium-nickel plating layer, the second gold plating layer and the rhodium alloy plating layer are 80-200u", 3u", 30u", 3u" and 20u", respectively.

[0011] Furthermore, the second metal composite layer is a second nickel plating layer and a third gold plating layer formed by electroplating from the inside to the outside of the surface of the second substrate.

[0012] Furthermore, the thickness of the second nickel plating layer is 80-200u", and the thickness of the third gold plating layer is 3u".

[0013] Furthermore, all surfaces of the first substrate are electroplated with a first metal composite layer, and the bottom surface of the second substrate is electroplated with a second metal composite layer.

[0014] Furthermore, the first metal composite layer is formed by roller plating, and the second metal composite layer is formed by brush plating.

[0015] Compared with the prior art, the present invention first roll-plates the first substrate of the separate copper column as a whole, and electroplates the first metal composite layer whose outer surface is a rhodium alloy plating layer to play an anti-corrosion role, and then at least the welding surface of the second substrate is brush-plated with nickel and gold to make it have good welding function, and finally the first substrate and the second substrate are laser assembled into one, thereby achieving both anti-corrosion and welding functions.

Brief Description of the Drawings

[0016] Figure 1 It is a three-dimensional diagram of the conductive terminal of the present invention.

[0017] Figure 2 yes Figure 1 A stereogram viewed from another direction.

[0018] Figure 3 It is a three-dimensional exploded view of the conductive terminal of the present invention.

[0019] Figure 4 yes Figure 3 Exploded perspective view from another direction.

[0020] Figure 5 yes Figure 1 Sectional view along line AA.

[0021] Figure 6 yes Figure 5 A partial enlarged view of the .

[0022] Figure 7 yes Figure 5 Another enlarged view of the part.

[0023] Figure 8 It is a schematic flow chart of the manufacturing method of the conductive terminal of the present invention.

[0024]

Main component symbol description

[0025] Conductive terminal 100 First substrate 1

[0026] Contact portion 10 Bottom surface 11

[0027] Second substrate 2 welding surface 20

[0028] Top surface 21 Groove 211

[0029] Side surface 22 First metal composite layer 3

[0030] First nickel plating layer 31 First gold plating layer 32

[0031] Palladium nickel plating layer 33 Second gold plating layer 34

[0032] Rhodium alloy plating layer 35 Second metal composite layer 4

[0033] Second nickel plating layer 41 Third gold plating layer 42

[0034] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. [Specific implementation method]

[0035] The following will be combined Figures 1 to 8 The specific implementation of the conductive terminal 100 of the present invention is introduced. The dimension unit u" refers to microinch.

[0036] Please refer to Figures 1 to 8 The conductive terminal 100 is applied to a wearable device and acts as a charging contact. The conductive terminal is a separate copper column, which includes a first substrate 1 and a second substrate 2.

[0037] Please refer to Figures 1 to 4 and Figure 6The first substrate 1 is a cylinder with a first outer diameter D1, which includes a contact portion 10 located on the top surface and a bottom surface 11 arranged opposite to the contact portion 10. A first metal composite layer 3 is electroplated on at least the contact portion 10. In this embodiment, all outer surfaces of the first substrate 1 are roll-plated with the first metal composite layer 3. The first metal composite layer 3 is a five-layer plating. The five layers of plating are, from the inside to the outside of the surface of the first substrate 1, a first nickel plating layer 31, a first gold plating layer 32, a palladium nickel plating layer 33, a second gold plating layer 34 and a rhodium alloy plating layer 35. The thickness of the first nickel plating layer 31 is 80~20u". The thickness of the first gold plating layer 32 is 3u". The thickness of the palladium nickel alloy plating layer 33 is 30u". The thickness of the second gold plating layer 34 is 3u". The coating of the rhodium alloy 35 is 20u". In this embodiment, the rhodium alloy coating is a rhodium-palladium alloy coating. Since the metal property of rhodium has an anti-corrosion effect, other rhodium alloys such as rhodium-ruthenium alloy can also be used in other embodiments.

[0038] Since the conductive terminal 100 is applied to a wearable device, when the rhodium alloy 35 is located on the outermost surface of the contact portion 10, it helps to prevent corrosion by sweat or other objects when the contact portion 10 contacts the docking component. In order to enable the other end of the terminal, i.e., the second substrate 2, to be well welded, the structure of the second substrate is set as follows.

[0039] Please refer to Figures 1 to 4 and Figure 7 , the second substrate is a cylinder having a second outer diameter D2 larger than the first outer diameter. The second substrate 2 includes a top surface 21, a welding surface 20 arranged opposite to the top surface, and a side surface 22 connecting the top surface and the welding surface. The top surface 21 is concavely provided with a groove 211. The groove 211 has a third outer diameter D3, and the third outer diameter D3 is not less than the first outer diameter D1. The provision of this groove 211 is to enable the first substrate 1 and the second substrate 2 to be better laser assembled. The welding surface 20 is located on the bottom surface of the second substrate 2. Since the welding surface plays a welding role in the second substrate 2, in this embodiment, the welding surface 20 is electroplated with a second metal composite layer 4, and the other surfaces are not electroplated with the second metal composite layer. In other embodiments, the other surfaces of the welding surface 20 may also be electroplated with the second metal composite layer 4. Since in the finished product, the surface of the second substrate 2 except the welding surface is finally sealed with glue, the top surface 21 and the side surface 22 of the second substrate 2 do not need to be electroplated with the first metal composite layer 3 or the second metal composite layer 4. The second metal is a two-layer plating. The two layers of plating are respectively a second nickel plating layer 41 and a third gold plating layer 42 from the inside to the outside of the surface of the second substrate 2, and the corresponding thicknesses are 80-200u" and 3u".

[0040] The method for manufacturing the conductive terminal 100 is as follows: Figure 8 As shown, there are the following steps:

[0041] S1 , providing a first base body 1 made of copper and having a contact portion 10 .

[0042] S2, providing a second copper substrate 2 having a welding portion 20.

[0043] S3, electroplating at least the contact portion 10 of the first substrate 1 to form a first metal composite layer 3 having an outer surface layer of a rhodium alloy plating layer.

[0044] S4, electroplating at least the welding portion 20 of the second substrate 2 to form a second metal composite layer 4 whose outer surface layer is a third gold plating layer.

[0045] S5, assembling the first substrate 1 and the second substrate 2 into one by laser so that the contact portion 10 and the welding portion 20 are located on two opposite surfaces of the conductive terminal, so that the contact portion 10 is connected to the docking connector and the welding portion 20 is welded to the welding plate.

[0046] There is no order between step S1 and step S2, and there is no order between step S3 and step S4.

[0047] In this embodiment, in S3, the first metal composite layer 3 is electroplated on all the outer layers of the first substrate 1. The electroplating method at this time is roller plating. In S4, the second metal composite layer 4 is electroplated on the welding portion 20 of the second substrate 2. The electroplating method at this time is brush plating. In other embodiments, only the welding portion 20 of the second substrate 2 may be electroplated with the second metal composite layer 4.

[0048] Among them, in step S3, the first substrate 1 is electroplated with the first metal as a whole by roller plating, so that the outermost layer of the first substrate is a rhodium alloy plating layer 35, and the plating layers formed on the surface of the first substrate 3 from the inside to the outside after roller plating are: a first nickel plating layer 31, a first gold plating layer 32, a palladium nickel plating layer 33, a second gold plating layer 34 and a rhodium palladium alloy plating layer 35. In other embodiments, other metal plating layers or alloy plating layers can also be added between any two plating layers in the first metal composite layer.

[0049] In step S4, the welding surface 20 of the second substrate 2 is brush plated with a second metal composite layer 4. The second metal composite layer 4 is a second nickel plating layer 41 and the third gold plating layer 42 from the inside to the outside of the surface of the second substrate 2.

[0050] Since the conductive terminal 100 as a whole needs to be corrosion-resistant, the surface of the first substrate 1 is plated with the first metal 3, so that the rhodium alloy plating layer 35 is located at the outermost layer, which can play an anti-corrosion role. The surface of the second substrate 2 is plated with the second metal composite layer 4, and the outer layer is a gold plating layer. Since the outer surface of the second substrate 2 is sealed with glue in the finished product and will not be corroded by liquids such as sweat, it is not necessary to plate the surface of the second substrate 2 except the welding surface 20 with rhodium-palladium alloy for corrosion resistance.

[0051] When the second base of the conductive terminal needs to be welded, the welding surface 20 is exposed, so that the third gold plating layer 42 and the second nickel plating layer 41 on the surface of the welding surface can be well welded under the action of high temperature.

[0052] Among them, the rhodium-palladium alloy can also be replaced by other alloys with better anti-corrosion effects, and the coating on the welding surface can also be replaced by alloys or metals with better welding performance.

[0053] The conductive terminal manufactured in this way not only has relatively good corrosion resistance, but also can be welded well.

[0054] The above descriptions are only some embodiments of the present invention, not all embodiments. Any equivalent changes made to the technical solution of the present invention by ordinary technicians in this field after reading the specification of the present invention are covered by the claims of the present invention.

Claims

1. A method for manufacturing a conductive terminal, comprising the following steps: Providing a first substrate, the first substrate being made of copper and having a contact portion; providing a second substrate, the second substrate being made of copper and having a welding portion; Electroplating at least the contact portion of the first substrate to form a first metal composite layer having an outer surface layer of a rhodium alloy plating layer; Electroplating at least the welding portion of the second substrate to form a second metal composite layer having an outer surface layer of a third gold plating layer; The contact portion is located on the top surface of the first substrate, and the welding portion is located on the bottom surface of the second substrate. The first substrate and the second substrate are assembled into one by laser so that the contact portion and the welding portion are located on two opposite surfaces of the conductive terminal.

2. The method for manufacturing a conductive terminal according to claim 1, wherein: In the step of assembling the first substrate and the second substrate, the bottom surface of the first substrate and the top surface of the second substrate are combined by laser.

3. The method for manufacturing a conductive terminal according to claim 2, wherein: The first substrate and the second substrate are both cylindrical structures. The second substrate has a second outer diameter that is larger than the first outer diameter of the first substrate. The top surface of the second substrate is concavely provided with a groove to accommodate the bottom surface of the first substrate, and the third outer diameter of the groove is not less than the first outer diameter.

4. The method for manufacturing a conductive terminal according to claim 1, wherein: The rhodium alloy is a rhodium-palladium alloy.

5. The method for manufacturing a conductive terminal according to claim 1, wherein: The first metal composite layer is a first nickel plating layer, a first gold plating layer, a palladium nickel plating layer, a second gold plating layer and the rhodium alloy plating layer formed by electroplating from the inside to the outside of the surface of the first substrate.

6. The method for manufacturing a conductive terminal according to claim 5, wherein: The rhodium alloy is a rhodium-palladium alloy, and the corresponding thicknesses of the first nickel plating layer, the first gold plating layer, the palladium-nickel plating layer, the second gold plating layer and the rhodium alloy plating layer are 80-200u", 3u", 30u", 3u" and 20u" respectively.

7. The method for manufacturing a conductive terminal according to claim 1, wherein: The second metal composite layer is a second nickel plating layer and a third gold plating layer formed by electroplating from the inside to the outside of the second substrate surface.

8. The method for manufacturing a conductive terminal according to claim 7, wherein: The thickness of the second nickel plating layer is 80-200u", and the thickness of the third gold plating layer is 3u".

9. The method for manufacturing a conductive terminal according to claim 1, wherein: All surfaces of the first substrate are electroplated with a first metal composite layer, and the bottom surface of the second substrate is electroplated with a second metal composite layer.

10. The method for manufacturing a conductive terminal according to claim 1, wherein: The first metal composite layer is formed by roller plating, and the second metal composite layer is formed by brush plating.

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