Automatic board turning device for flexible circuit board printer

Abstract

The present invention discloses an automatic flipping device for a flexible circuit board printer, comprising a flipping mechanism bracket arranged on one side of the flexible circuit board printer, a rotating shaft driven by a flipping motor to rotate on the flipping mechanism bracket, a positioning plate fixed on the rotating shaft, and an adsorption platform arranged at the bottom of the positioning plate through a buffer component; wherein the buffer component comprises a guide sleeve fixed on the upper surface of the adsorption platform and a spring guide column moving up and down in the cavity of the guide sleeve; wherein the top end of the spring guide column is fixed on the positioning plate, an upper limit piece is fixed on the upper outer edge of the spring guide column to form support for the guide sleeve in the flipping state, a lower limit piece is fixed on the lower outer edge of the spring guide column, and a spring is installed between the lower limit piece and the constriction at the top end of the guide sleeve. The buffer adsorption table can be used as a bearing table.

Description

Technical Field

[0001] The invention relates to the technical field of flexible circuit board printing, in particular to an automatic plate turning device for a flexible circuit board printing machine. Background Art

[0002] Printed circuit boards need to be printed on both sides. After printing one side, they need to be turned over to print the other side. However, due to the relatively soft nature of flexible circuit boards, it is currently not possible to use methods such as clamping a hard board to achieve flipping the circuit board, and it can only be done manually. Manual board flipping is inefficient and the positioning is inaccurate. In addition, due to the improvement of printing efficiency, personnel are prone to fatigue from long-term and high-frequency operations. Summary of the invention

[0003] The purpose of the present invention is to provide an automatic board turning device for a flexible circuit board inkjet printer to solve the problems of low positioning accuracy, time-consuming and labor-intensive manual turning in the prior art.

[0004] The technical solution adopted to achieve the purpose of the present invention is:

[0005] An automatic plate turning device for a flexible circuit board inkjet printer, comprising a plate turning mechanism bracket arranged on one side of the flexible circuit board inkjet printer, a rotating shaft driven by a plate turning motor to rotate on the plate turning mechanism bracket, a positioning plate fixed on the rotating shaft, and an adsorption platform arranged at the bottom of the positioning plate through a buffer component;

[0006] Wherein, the buffer assembly includes a guide sleeve fixed on the upper surface of the adsorption platform and a spring guide column moving up and down in the cavity of the guide sleeve; wherein the top end of the spring guide column is fixed on the positioning plate, an upper limit piece is fixed on the upper outer edge of the spring guide column to support the guide sleeve in the flipped state, a lower limit piece is fixed on the lower outer edge of the spring guide column, and a spring is assembled between the lower limit piece and the constriction at the top end of the guide sleeve.

[0007] In the above technical solution, the positioning plate is a rectangular plate, and the top end of the spring guide column is fastened to the positioning plate by screws.

[0008] In the above technical solution, four buffer components are provided, which are symmetrically arranged at the four corners of the bottom of the positioning plate.

[0009] In the above technical solution, the upper limit member and the lower limit member are limit rings fixed to the upper and lower ends of the outer wall of the spring guide column respectively.

[0010] In the above technical solution, the adsorption platform includes a microporous plate forming an adsorption surface, a boss fixed on the top of the microporous plate and an adsorption base plate supported by the boss, wherein a pipe joint is assembled on the upper part of the adsorption base plate, and the pipe joint, the groove formed between the boss and the micropores formed on the microporous plate are combined to form an air flow channel.

[0011] In the above technical solution, there is a gap between the lower surface of the middle portion of the adsorption bottom plate and the upper surface of the boss, so that an air cavity is formed between the adsorption bottom plate and the boss.

[0012] In the above technical solution, a notch is formed on the positioning plate for the pipe joint to pass through.

[0013] In the above technical solution, a constriction is formed on the upper portion of the guide sleeve for the spring guide column to pass through, and a positioning edge is formed on the lower portion, and the positioning edge is fastened to the adsorption base plate by screws.

[0014] In the above technical solution, a positioning outer edge is formed at the lower end of the pipe joint, and the positioning outer edge is fixed to the outer periphery of the opening of the adsorption bottom plate by screws.

[0015] In the above technical solution, a reducing port is formed at the upper end of the pipe joint.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The flipping action is simple, and the conversion of the AB surface is completed directly. It can also be used for flipping of soft-rigid combined boards and thinner hard boards. It is simpler, more flexible and occupies less area than the flipping devices such as sun wheels currently used for hard boards.

[0018] 2. After the flipping is completed, the buffer adsorption table itself can be used as a bearing table to directly carry out the subsequent operations, eliminating the trouble of conversion and positioning and simplifying the process flow.

[0019] 3. Since the adsorption platform is surface adsorption, it is suitable for circuit boards of various sizes. And the requirements for alignment are low, and the position repetition accuracy is high after flipping. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a side view of the flap device located above the printer.

[0021] Figure 2 It is a top view of the flap device located above the printer.

[0022] Figure 3 is Figure 1 Schematic diagram of the flip device after flipping 180°.

[0023] Figure 4 Shown is a schematic diagram of the structure used as a flexible adsorption platform in Example 1.

[0024] Figure 5 It is a schematic diagram of the structure used as a rigid carrier in Example 1.

[0025] Figure 6 This is a schematic diagram of the structure of Example 3.

[0026] Figure 7 for Figure 6 Cross-section view of the AA surface in the middle.

[0027] Figure 8 Schematic diagram of the adsorption platform structure.

[0028] Fig. 9 Schematic diagram of the connection structure of the pipe joint.

[0029] In the figure: 1-positioning plate, 2-guide sleeve, 3-spring guide column, 4-upper limit member, 5-lower limit member, 6-spring, 7-microporous plate, 8-boss, 9-adsorption bottom plate, 10-pipe joint, 11-notch, 12-adsorption platform, 13-air cavity, 14-airway, 15-positioning edge, 16-positioning outer edge, 17-opening, 18-reducing port, 19-shrinking port, 20-flip mechanism bracket, 21-rotating shaft, 22-flip motor, 23-jet printer, 24-suction port, 25-clamping, 26-connecting piece, 27-A surface, 28-B surface, 29-adsorption transplanting device, 30-buffer assembly. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0031] Example 1

[0032] An automatic flipping device for a flexible circuit board printer, comprising a flipping mechanism bracket 20 arranged on one side of the flexible circuit board printer 23, a rotating shaft 21 driven by a flipping motor 22 to rotate on the flipping mechanism bracket 20, a positioning plate 1 fixed to the rotating shaft 21 through a connecting member 26, and an adsorption platform 12 arranged at the bottom of the positioning plate 1 through a buffer component 30;

[0033] Wherein, the buffer assembly includes a guide sleeve 2 fixed on the upper surface of the adsorption platform and a spring guide column 3 that moves up and down in the cavity of the guide sleeve 2; wherein the top end of the spring guide column 3 is fixed on the positioning plate 1, and the upper outer edge of the spring guide column 3 is fixedly provided with an upper limit member 4 to support the guide sleeve 2 in the flipped state, and the lower outer edge of the spring guide column 3 is fixedly provided with a lower limit member 5, and a spring 6 is installed between the lower limit member 5 and the constriction 19 at the top end of the guide sleeve 2.

[0034] Working method:

[0035] After the flexible circuit board on the workbench of the printer 23 is printed on side A (side A 27 facing upward, side B 28 facing downward), the workbench of the printer moves away from the clamps 25 on the four sides, the automatic flipping device flips to the workbench position, and is pressed down for a distance under the action of the buffer component, so that the adsorption surface of the flipping adsorption platform 12 and the flexible circuit board after printing are completely attached, the suction port 24 of the printer 23 is closed, and then the soft board flipping device turns on the suction, so that the flexible circuit board is separated from the original workbench and adsorbed on the adsorption platform 12 position, and then the flipping motor 22 is started, flipped 180 degrees, so that the B side of the flexible circuit board faces upward. The adsorption transfer device 29 can be used to absorb the flexible circuit board to continue printing on the B side or collecting the material, and then proceed to the next step.

[0036] The constriction and the lower limit member 5 limit the two ends of the spring 6.

[0037] When the adsorption platform adsorbs the flexible circuit board, the state is as follows Figure 4 As shown (flexible adsorption platform), due to the deadweight of the adsorption platform, the spring 6 is compressed, and when it is close to the adsorbed object (such as a flexible circuit board), it can rebound with interference, so that the adsorption surface of the adsorption platform and the adsorbed object are completely in contact with each other without being stuck. At this time, turning on the fan may generate negative pressure through the exhaust system, so that the object is adsorbed on the adsorption surface.

[0038] When the positioning plate 1 is driven by the flipping mechanism to flip, the state is as follows Figure 5 As shown (rigid platform), due to the gravity of the adsorption platform itself, the guide sleeve 2 will directly hit the hard limit position formed by the upper limit member 4, and the spring is in a free state or slightly compressed. At this time, the adsorption platform becomes a rigid platform, which can be used as a work surface to form a separate work station.

[0039] Example 2

[0040] This embodiment optimizes the shape and number of each component based on the embodiment 1.

[0041] As a preferred embodiment, the positioning plate 1 is a rectangular plate, and the top end of the spring guide column 3 is fastened to the positioning plate 1 by screws. The structure is simple and easy to assemble.

[0042] As a preferred embodiment, four buffer components are provided, which are symmetrically arranged at four corners of the bottom of the positioning plate 1. The symmetrically arranged structure makes the force between the adsorption platform and the flip plate more uniform.

[0043] As a preferred embodiment, the upper limit member 4 and the lower limit member 5 are limit rings fixed to the upper and lower ends of the outer wall of the spring guide column 3. The annular structure has a large force-bearing surface.

[0044] Example 3

[0045] This embodiment further improves the adsorption platform 12 based on the embodiment 1.

[0046] The adsorption platform 12 includes a microporous plate 7 forming an adsorption surface, a boss 8 fixed on the top of the microporous plate 7 and an adsorption base plate 9 supported by the boss 8, wherein a pipe joint 10 is assembled on the upper part of the adsorption base plate 9, and the pipe joint 10, the groove formed between the boss 8 and the micropores formed on the microporous plate 7 are combined to form an air flow channel.

[0047] Working method:

[0048] The suction fan is connected to the pipe joint 10 through a pipeline, and negative pressure is generated through the air flow channel. Since the microporous plate is densely covered with micropores, even if the object to be sucked (such as a flexible circuit board) does not cover the entire microporous surface, the loss of negative pressure is still small, and sufficient negative pressure can be generated to adsorb the object to be sucked.

[0049] As a preferred embodiment, there is a gap between the lower surface of the middle part of the adsorption bottom plate 9 and the upper surface of the boss 8, so that an air cavity 13 is formed between the adsorption bottom plate 9 and the boss 8. The air cavity 13 forms an air flow channel in conjunction with the air channel 14 formed by the groove and the micropores formed on the microporous plate. In this way, negative pressure is generated through the air cavity, the air channel and the micropores on the microporous plate, and the air pressure distribution is more uniform.

[0050] As a preferred embodiment, a notch 11 is formed on the positioning plate 1 for the pipe joint 10 to pass through, so as to facilitate the insertion of the pipe to connect the suction fan, so that the components do not interfere with each other.

[0051] As a preferred embodiment, the guide sleeve 2 has a constriction 19 formed on the upper portion thereof for the spring guide column 3 to pass through, and a positioning edge 15 formed on the lower portion thereof, and the positioning edge 15 is fastened to the adsorption bottom plate 9 by screws, so as to facilitate assembly.

[0052] As a preferred embodiment, a positioning outer edge 16 is formed at the lower end of the pipe joint 10, and the positioning outer edge 16 is fixed to the outer periphery of the opening 17 of the adsorption bottom plate 9 by screws. The screw fixing facilitates commercial production and application.

[0053] As a preferred embodiment, a reducing port 18 is formed at the upper end of the pipe joint 10, so as to facilitate plugging and connecting the pipe of the suction fan and provide good sealing performance.

[0054] For ease of explanation, spatial relative terms such as "upper", "lower", "left", "right" and the like are used in the embodiments to illustrate the relationship of one element or feature shown in the figure relative to another element or feature. It should be understood that, in addition to the orientation shown in the figure, the spatial terms are intended to include different orientations of the device in use or operation. For example, if the device in the figure is inverted, the element described as being "under" other elements or features will be positioned "on" other elements or features. Therefore, the exemplary term "under" can include both upper and lower orientations. The device can be positioned in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used here can be interpreted accordingly.

[0055] Furthermore, relational terms such as “first” and “second” and the like are merely used to distinguish one component from another having the same name, but do not necessarily require or imply any such actual relationship or order between these components.

[0056] The above is only a preferred embodiment of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An automatic plate turning device for a flexible circuit board printer, characterized in that: It includes a flipping mechanism bracket arranged on one side of the flexible circuit board inkjet printer, a rotating shaft driven by a flipping motor to rotate on the flipping mechanism bracket, a positioning plate fixed on the rotating shaft, and an adsorption platform arranged at the bottom of the positioning plate through a buffer component; Wherein, the buffer assembly comprises a guide sleeve fixed on the upper surface of the adsorption platform and a spring guide column moving up and down in the inner cavity of the guide sleeve; wherein the top end of the spring guide column is fixed on the positioning plate, an upper limit piece is fixedly arranged on the upper outer edge of the spring guide column to support the guide sleeve in the flipped state, a lower limit piece is fixedly arranged on the lower outer edge of the spring guide column, and a spring is installed between the lower limit piece and the constriction of the top end of the guide sleeve; The positioning plate is a rectangular plate, and the top end of the spring guide column is fastened to the positioning plate by screws; The buffer components are provided with four, which are symmetrically arranged at the four corners of the bottom of the positioning plate; The upper limit member and the lower limit member are limit rings fixed at the upper and lower ends of the outer wall of the spring guide column respectively; The adsorption platform comprises a microporous plate forming an adsorption surface, a boss fixed on the top of the microporous plate and an adsorption bottom plate supported by the boss, wherein a pipe joint is assembled on the upper part of the adsorption bottom plate, and the pipe joint, the groove formed between the boss and the micropores formed on the microporous plate form an air flow channel in combination; There is a gap between the lower surface of the middle part of the adsorption bottom plate and the upper surface of the boss, so that an air cavity is formed between the adsorption bottom plate and the boss; The positioning plate is formed with a notch for the pipe joint to pass through; The guide sleeve has a constriction formed on its upper portion for the spring guide post to pass through, and a positioning edge formed on its lower portion, and the positioning edge is fastened to the adsorption bottom plate by screws; The lower end of the pipe joint is formed with a positioning outer edge, and the positioning outer edge is fixed to the outer periphery of the opening of the adsorption bottom plate by screws; The upper end of the pipe joint is formed with a reducing port.

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