Heat dissipation performance testing device

Abstract

The present invention provides a heat dissipation performance testing device, comprising a chassis, a movable frame mounted on the chassis, an integrated heat source capable of changing height suspended on the movable frame, a heat dissipation component placed on the chassis for insulation, a first temperature sensor detachably fixed to the surface of the heat dissipation component, and a second temperature sensor provided on the portion of the integrated heat source in contact with the heat dissipation component. The heat dissipation performance testing device provided by the present invention has the advantages of being applicable to heat dissipation components of different types and specifications by suspending the integrated heat source on the chassis and placing the heat dissipation component on the chassis, and ensuring effective contact between the heat source and the heat dissipation component; the temperatures of the heat dissipation component and the heat source of the heat dissipation component are respectively collected by the first temperature sensor and the second temperature sensor; the temperature of the integrated heat source can be adjusted to a test temperature as needed, and a result of whether the temperature of the surface of the heat dissipation component exceeds a preset value can be directly obtained, thereby eliminating the intermediate calculation link and making the result more intuitive.

Description

Technical Field

[0001] The present invention relates to the technical field of performance testing of heat dissipation components, and in particular to a heat dissipation performance testing device. Background Art

[0002] Currently, domestic evaluation of thermal control methods for electronic devices relies primarily on theoretical calculations and simulation techniques. With the advancement of electronic technology, the number of high-power electronic devices has increased. Furthermore, current chassis generally utilize standard modules, resulting in high heat flux and limited heat dissipation space. This leads to increasingly stringent requirements for the thermal performance of electronic devices. The increasing diversity and integration of thermal control methods and the complexity of heat transfer paths, coupled with these complex boundary conditions, place greater demands on the accuracy of simulation model establishment, meshing, and the setting of empirical parameters during the simulation process. Therefore, the accuracy of thermal control simulation results requires verification through thermal control testing. However, the production of a prototype electronic device is not only time-consuming but also prohibitively expensive. Therefore, a universal thermal performance testing platform is urgently needed to quantitatively test thermal control methods, accumulate engineering data, and simultaneously verify theoretical simulation results. This platform plays a crucial role in guiding the accurate setting of empirical parameters during the simulation process, providing designers with a valuable data basis for better thermal control work and significantly improving the thermal control design capabilities of electronic devices.

[0003] The invention patent application with publication number CN110672659A discloses a double-sided water-cooled plate heat dissipation performance test device, which sets a temperature measuring component and matching electric heating rods, thermal resistors and other devices on both sides of the water-cooled plate, measures the temperature of the thermal resistor according to the temperature measuring component, and obtains the water outlet temperature of the water outlet plate to test the heat dissipation performance of the water-cooled plate. However, this test device can only test water-cooled plates of specific specifications, and requires threaded holes or other assembly components for installing temperature measuring components on the water-cooled plate, which has poor applicability. In addition, measuring the water outlet temperature requires some calculations to know whether the heat dissipation performance of the water-cooled plate is qualified, and the structure is not intuitive enough. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a heat dissipation performance testing device suitable for different heat dissipation components.

[0005] The present invention solves the above-mentioned technical problems through the following technical solutions: a heat dissipation performance testing device, comprising a chassis, a movable frame is mounted on the chassis, an integrated heat source capable of changing height is suspended on the movable frame, a heat dissipation component is placed on the chassis for insulation, a first temperature sensor is detachably fixed on the surface of the heat dissipation component, and a second temperature sensor is provided on the part where the integrated heat source contacts the heat dissipation component.

[0006] The present invention suspends the integrated heat source on the chassis and places the heat dissipation component on the chassis, so that it can be applicable to heat dissipation components of different types and specifications, and ensures effective contact between the heat source and the heat dissipation component. The first temperature sensor and the second temperature sensor respectively collect the temperature of any position on the surface of the heat dissipation component and the surface of the heat source. The heating value of the integrated heat source can be adjusted as needed to simulate the working conditions of actual electronic devices, and the result of whether the surface temperature of the heat dissipation component exceeds the preset value can be directly obtained, which eliminates the intermediate calculation link and the result is more intuitive.

[0007] Preferably, the heat dissipation component includes at least a cold plate, and two liquid cooling platforms are provided on the chassis. The liquid cooling platforms are hollow structures, and a liquid connector is provided at one end of the two liquid cooling platforms along the length direction, and the other ends are connected to each other through a pipe.

[0008] Preferably, a heat-insulating slider that cooperates with the chassis is fixedly provided below the liquid-cooling platform, and the heat-insulating slider can slide on the chassis in a direction perpendicular to the liquid-cooling platform.

[0009] Preferably, a fixing plate is fixedly provided at both ends of the chassis perpendicular to the liquid cooling platform, the upper end of the fixing plate exceeds the upper surface of the chassis, a slide groove is provided on the fixing plate along the length direction and is located above the upper surface of the chassis, and a threaded hole is provided on the end face of the insulation slider at the same height as the slide groove.

[0010] Preferably, the chassis is provided with at least one limiting groove at each end of the vertical liquid cooling platform; the bottom of the heat-insulating slider has a protrusion that slides in cooperation with the limiting groove.

[0011] Preferably, a corner plate is fixedly provided on both sides of the chassis, and the liquid cooling platform is located between the two corner plates and parallel to the corner plates; at least two of the mobile racks are provided on the chassis, and the mobile rack includes two vertical plates that cooperate with the corner plates on both sides and a mobile plate that is fixedly cooperated with the two vertical plates, and an adjustment groove is opened on the mobile plate along the length direction, and the integrated heat source is suspended under the mobile rack by a fixed rod that is fixedly cooperated with the adjustment groove.

[0012] Preferably, a plurality of adjustment slots are arranged in parallel on the same movable plate, the vertical plate cooperates with the vertical surface of the angle plate, and the vertical surface of the angle plate is provided with a strip slot fixedly matched with the vertical plate along the length direction.

[0013] Preferably, the rod body of the fixing rod is screwed with two adjustment nuts respectively placed above and below the movable plate, the fixing rod freely passes through the adjustment slot, and the lower end of the fixing rod is screwed and fixed with a connecting plate fixedly connected to the integrated heat source.

[0014] Preferably, the integrated heat source includes a heat insulation plate fixedly matched with the connecting plate and a heat conduction plate fixedly matched with the heat insulation plate, the upper surface of the heat conduction plate is fixedly connected to a heating element, the lower surface of the heat conduction plate is provided with a temperature measuring groove connected to the side, and the second temperature sensor is accommodated in the temperature measuring groove and connected to the heat conduction plate.

[0015] Preferably, a heat conducting block is fixed on the lower surface of the heat conducting plate, and the temperature measuring groove is opened on the lower surface of the heat conducting block.

[0016] The advantages of the heat dissipation performance testing device provided by the present invention are that: the integrated heat source is suspended on the chassis, and the heat dissipation component is placed on the chassis, so that it can be applicable to heat dissipation components of different types and specifications, and effective contact between the heat source and the heat dissipation component is guaranteed. The first temperature sensor and the second temperature sensor respectively collect the temperature of any position on the surface of the heat dissipation component and the heat source, and the calorific value of the integrated heat source can be adjusted as needed to simulate the working conditions of the actual electronic device, and the result of whether the surface temperature of the heat dissipation component exceeds the preset value can be directly obtained, which eliminates the intermediate calculation link and the result is more intuitive; by setting up a liquid cooling platform, different types of heat dissipation components can be simulated, and the interval of the liquid cooling platform can be adjusted according to the specifications of the cold plate, and the adaptability range is wide; through the cooperation of the movable frame and the angle plate, and the cooperation of the fixed rod and the movable frame, the integrated heat source can heat any position on the surface of the cold plate to meet different test requirements; the second temperature sensor is set at a position close to the cold plate, which can more accurately obtain the real heat source temperature of the cold plate and improve the accuracy of the result. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 An exploded diagram of a heat dissipation performance testing device provided by an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of a heat dissipation performance testing device provided by an embodiment of the present invention;

[0019] Figure 3 An exploded view of an integrated heat source of a heat dissipation performance testing device provided by an embodiment of the present invention;

[0020] Figure 4 A schematic diagram of the heat dissipation performance testing device provided by an embodiment of the present invention in use. DETAILED DESCRIPTION

[0021] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0022] like Figure 1As shown, this embodiment provides a heat dissipation performance testing device for a heat dissipation component, including a chassis 1, a movable frame 2 is mounted on the chassis 1, an integrated heat source 3 that can change its height is suspended on the movable frame 2, a heat dissipation component (not shown) is placed on the chassis 1 insulated, a first temperature sensor (not shown) is detachably fixed to the surface of the heat dissipation component, and a second temperature sensor 31 is provided at the portion where the integrated heat source 3 contacts the heat dissipation component; wherein the first temperature sensor can be a patch-type temperature sensor, so that it can be adhered to the surface of the heat dissipation component, which is convenient for replacing the heat dissipation component and does not require adaptive design of the structure of the heat dissipation component.

[0023] In this embodiment, the integrated heat source 3 is suspended on the chassis 1, and the heat dissipation component is placed on the chassis 1, so that it can be applicable to heat dissipation components of different types and specifications, and ensures effective contact between the heat source and the heat dissipation component. The first temperature sensor and the second temperature sensor 31 respectively collect the temperature of any position on the surface of the heat dissipation component and the heat source. The heating value of the integrated heat source 3 can be adjusted as needed to simulate the working conditions of the actual electronic device, and the result of whether the surface temperature of the heat dissipation component exceeds the preset value can be directly obtained, which eliminates the intermediate calculation link and the result is more intuitive.

[0024] The heat dissipation component includes at least a cold plate 4, and two liquid cooling platforms 5 are provided on the chassis 1. The liquid cooling platforms 5 are hollow structures; Figure 1 and Figure 2 A liquid connector 51 is provided at one end of the length direction of the two liquid cooling platforms 5, and the other ends are connected to each other through a pipe 52. The external liquid cooling source is connected to the liquid connector 51, so that the two liquid cooling platforms 5 form a circulating liquid cooling system. Of course, more liquid cooling platforms 5 can also be set up, and each liquid cooling platform 5 is connected to an external cooling source for cooling. Alternatively, multiple liquid cooling platforms 5 can be connected to each other, and only one inlet and one outlet are retained to connect to the external cooling source to form a liquid cooling system. The specific setting can be made according to the application scenario of the heat dissipation component.

[0025] The upper surface of the liquid cooling platform 5 is detachably provided with a thermal insulation pad (not shown). Based on the cooperation of the cold plate 4, the liquid cooling platform 5 and the thermal insulation pad, a heat dissipation component with only a cold plate 4 and using air heat dissipation, a heat dissipation component with the cold plate 4 itself having a coolant inlet and outlet, and a heat dissipation component with the cold plate 4 plus a liquid cooling system for heat dissipation can be simulated; the thermal insulation pad can be fixedly connected to the upper surface of the liquid cooling platform 5 by bolts, which is convenient for disassembly. At the same time, it should be noted that the upper end of the bolt should be sunk below the upper surface of the thermal insulation pad to prevent damage to the cold plate 4.

[0026] refer to Figure 1, an insulation slider 53 cooperating with the chassis 1 is fixedly provided under the liquid cooling platform 5. The insulation slider 53 can slide on the chassis 1 in a direction perpendicular to the liquid cooling platform 5, so as to adjust the position and spacing of the liquid cooling platform 5 according to the heat dissipation component to be tested; the chassis 1 is fixed with fixed plates 11 at both ends perpendicular to the liquid cooling platform 5, and the fixed plates 11 can be fixed to the chassis by screwing, welding, etc. The upper end of the fixed plate 11 exceeds the upper surface of the chassis 1, and a slide groove 12 is provided on the fixed plate 11 along the length direction and is located above the upper surface of the chassis 1. The end face of the insulation slider 53 is provided with a threaded hole (not shown) at the same height as the slide groove 12. By arranging a bolt (not shown) passing through the slide groove 12 on the threaded hole, the insulation slider 53 can be fixed or the position of the insulation slider 53 can be adjusted by adjusting the tightness of the bolt.

[0027] At least one limiting groove 13 is provided on the chassis 1 at both ends of the vertical liquid cooling platform 5. The bottom of the thermal insulation slider 53 has a protrusion 54 that slides with the limiting groove 13, thereby assisting in fixing and guiding the thermal insulation slider 53; the liquid cooling platform 5 can be fixed on the thermal insulation slider 53 by screwing, welding, gluing, etc.

[0028] The bottom plate 14 is fixed with an angle plate 14 on each side of the chassis 1, and the horizontal surface of the angle plate 14 is screwed and fixed to the chassis 1. The vertical surface of the angle plate 14 is parallel to the liquid cooling platform 5, and the liquid cooling platform 5 is located between the two angle plates 14. At least two movable racks 2 are provided on the chassis 1. The movable rack 2 includes two vertical plates 21 fixedly matched with the angle plates 14 on both sides and a horizontal movable plate 22 fixedly matched with the two vertical plates. An adjustment slot 23 is opened on the movable plate 22 along the length direction, and the integrated heat source 3 is suspended below the movable plate 22 by a fixed rod 6 fixedly matched with the adjustment slot 23; specifically, two adjusting nuts 61 are screwed on the rod body of the fixed rod 6, which are respectively placed above and below the movable plate 22. The fixed rod 6 can pass through the adjustment slot 23 freely. By adjusting the position of the upper and lower adjusting nuts 61, the height of the fixed rod 6 and the matching position with the adjustment slot 23 can be changed; since the integrated heat source 3 only needs to be placed on the cold plate 4 in this application, only one adjusting nut 61 is provided above the movable plate 22 to meet the heating requirements of the cold plate 4.

[0029] The vertical surface of the angle plate 14 is provided with a strip groove 15 along its length, which is fixedly matched with the vertical plate 21, so that the position of the vertical plate 21 relative to the angle plate 14 can be adjusted as needed. By changing the position of the movable frame 2 and the position of the fixed rod 6 relative to the adjustment groove 23, the integrated heat source 3 can be placed at any position on the surface of the cold plate 4. In this embodiment, multiple adjustment grooves 23 are also provided in parallel on the movable plate 22, which can also facilitate the adjustment of the position of the integrated heat source 3. Based on this arrangement, those skilled in the art can provide a movable plate 22 covering the area between the two angle plates 14, and provide multiple adjustment grooves 23 in parallel on its surface, so that the integrated heat source 3 can be placed at a specific position on the cold plate 4 according to the matching of the fixed rod 6 with different adjustment grooves 23 at different positions. The number and specific positions of the integrated heat sources 3 can be determined as needed.

[0030] The lower end of the fixing rod 6 is fixed with a connecting plate 62 by screw connection, and the connecting plate 62 is fixedly connected to the integrated heat source 3; Figure 3 The integrated heat source 3 includes a heat insulating plate 32 screwed to the connecting plate 62, and a heat conducting plate 33 screwed to the heat insulating plate 32. The upper surface of the heat conducting plate 33 is fixedly connected to a heating element 34. Figure 3 In order to facilitate the display of the structure, the integrated heat source 3 is placed upside down. Figure 3 The lower part of the figure is the upper part of the integrated heat source 3 when in use. The heating element 34 is connected to the power supply via a wire 35 to generate heat. The current of the heating element 34 can be adjusted to change the temperature according to the set temperature. The lower surface of the heat insulation plate 33 is provided with a slot for accommodating the heating element 34 and the wire 35. In a specific setting, this slot can also be provided on the upper surface of the heat conducting plate 33. In order to approach the temperature of the actual heat source of the cold plate 4, the second temperature sensor 31 is provided on the lower surface of the heat conducting plate 33 facing the cold plate 4. The lower surface of the heat conducting plate 33 is provided with a temperature measuring groove 36 connected to the side. The second temperature sensor 31 is accommodated in the temperature measuring groove 36 and connected to the heat conducting plate 33. The measured temperature is close to the temperature of the lower surface of the heat conducting plate 33, and is used as the heat source temperature of the cold plate 4.

[0031] In the preferred embodiment, a heat conducting block 37 is fixedly mounted on the lower surface of the heat conducting plate 33. The temperature measuring slot 36 is provided on the lower surface of the heat conducting block 37, and the second temperature sensor 31 measures the temperature of the heat conducting block 37. The shape of the heat conducting block 37 can be manufactured based on the shape of the actual heating element of the component to be tested, which is more consistent with the actual simulation effect. Furthermore, the heat conducting block 37 can be conveniently provided with the temperature measuring slot 36 to accommodate the second temperature sensor 31, while the heating element 34 cannot be slotted. The provision of the heat conducting block 37 prevents damage to the heating element 34 due to external factors. Furthermore, since the heating element 34 is an electrically charged device, using the heat conducting block 37 to transfer heat can prevent electric shock.

[0032] In this embodiment, the heat conducting plate 33 is made of a material with good thermal conductivity and a certain strength, such as a metal block or a high thermal conductivity composite material; the heat insulating plate 32 and the heat insulating slider 53 are made of a material with poor thermal conductivity and a certain strength, such as fiberglass, wood, polymer materials and honeycomb insulation devices; the heat insulating pad can also use the above materials, or use flexible materials such as rubber.

[0033] During the test, if liquid cooling is required, first connect the liquid cooling device to the heat dissipation component and adjust the coolant temperature to the corresponding operating temperature. If liquid cooling is not required, skip this step and adjust the integrated heat source 3 to a suitable position to contact the cold plate 4. Adjust the current of the integrated heat source 3 according to the test requirements so that the value of the second temperature sensor 31 reaches the preset value, and then read the value of the first temperature sensor to determine whether the temperature on the surface of the cold plate 4 meets the performance requirements.

[0034] refer to Figure 4 When in use, the heat dissipation performance testing device provided in this embodiment can be connected to the liquid cooling device 16, the power supply 17 is used to power the heating element 34, and the temperature values ​​of the first temperature sensor and the second temperature sensor 31 are collected by the temperature acquisition module 18 and transmitted to the computer 19 for judgment and processing. The data measured in the test are compared with the data of the theoretical calculation or simulation results. By analyzing the data, relevant parameters and conclusions can be obtained, thereby providing theoretical guidance for the setting of simulation parameters.

Claims

1. A method for testing a heat dissipation performance test device, characterized in that: The heat dissipation performance testing device includes a chassis, a movable frame is mounted on the chassis, an integrated heat source capable of changing height is suspended on the movable frame, a heat dissipation component is placed on the chassis for insulation, a first temperature sensor is detachably fixed to the surface of the heat dissipation component, and a second temperature sensor is provided at the portion where the integrated heat source contacts the heat dissipation component; The two sides of the chassis are respectively fixed with a corner plate; the mobile frame includes two vertical plates that cooperate with the corner plates on both sides and a mobile plate that is fixedly cooperated with the two vertical plates. The mobile plate is provided with an adjustment slot in the length direction, and the integrated heat source is suspended under the mobile frame by a fixing rod that is fixedly cooperated with the adjustment slot; the vertical plate cooperates with the vertical surface of the angle plate, and the vertical surface of the angle plate is provided with a strip slot that is fixedly cooperated with the vertical plate along the length direction; the rod body of the fixing rod is screwed with two adjustment nuts that are respectively placed above and below the moving plate, and the fixing rod is free to pass through the adjustment slot, and the lower end of the fixing rod is screwed and fixed with a connecting plate that is fixedly connected to the integrated heat source; The heat dissipation assembly includes at least a cold plate, and two liquid cooling platforms are provided on the chassis. The liquid cooling platforms are hollow structures, and a liquid connector is provided at one end of the two liquid cooling platforms along the length direction, and the other end is connected to each other through a pipe. By changing the position of the movable frame and the position of the fixed rod relative to the adjustment slot, the integrated heat source can be placed at any position on the surface of the cold plate; The testing method includes: during the test, if liquid cooling is required, first connecting the heat dissipation component to the liquid cooling device and adjusting the coolant temperature to the corresponding operating temperature; if liquid cooling is not required, skipping this step and adjusting the integrated heat source to a suitable position to contact the cold plate, adjusting the current of the integrated heat source according to the test requirements so that the value of the second temperature sensor reaches a preset value, and then reading the value of the first temperature sensor to determine whether the temperature of the cold plate surface meets the performance requirements.

2. The testing method according to claim 1, wherein: A heat-insulating slider that cooperates with the chassis is fixedly provided below the liquid cooling platform, and the heat-insulating slider can slide on the chassis in a direction perpendicular to the liquid cooling platform.

3. The testing method according to claim 2, wherein: A fixing plate is fixedly provided at both ends of the chassis perpendicular to the liquid cooling platform, the upper end of the fixing plate exceeds the upper surface of the chassis, a slide groove is provided on the fixing plate along the length direction and is located above the upper surface of the chassis, and a threaded hole is provided on the end face of the heat-insulating slider at the same height as the slide groove.

4. The testing method according to claim 2 or 3, characterized in that: The chassis is provided with at least one limiting groove at both ends of the vertical liquid cooling platform; the bottom of the heat-insulating sliding block is provided with a protrusion that slides in cooperation with the limiting groove.

5. The testing method according to claim 1, wherein: The liquid cooling platform is located between the two angle plates and is parallel to the angle plates; at least two of the movable racks are provided on the chassis.

6. The testing method according to claim 5, wherein: A plurality of adjustment slots are arranged in parallel on the same movable plate.

7. The testing method according to claim 5, wherein: The integrated heat source includes a heat insulation plate fixedly matched with the connecting plate and a heat conduction plate fixedly matched with the heat insulation plate. A heating element is fixedly connected to the upper surface of the heat conduction plate. A temperature measuring groove connected to the side is opened on the lower surface of the heat conduction plate. The second temperature sensor is accommodated in the temperature measuring groove and connected to the heat conduction plate.

8. The testing method according to claim 7, wherein: A heat conducting block is fixed on the lower surface of the heat conducting plate, and the temperature measuring groove is opened on the lower surface of the heat conducting block.

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