Device heat dissipation device

Abstract

The present invention relates to the field of device heat dissipation technology, and specifically to a device heat dissipation device. The heat dissipation device includes a heat dissipation body, on which a positioning structure and a water injection groove are provided, wherein the positioning structure is used to place the device; the water injection groove and the end face of the device form a water injection channel, and heat dissipation liquid is injected to take away the heat of the device. The present invention sets a heat dissipation body, and sets a positioning structure and a water injection groove for placing the device on the heat dissipation body, and the water injection groove and the end face of the device form a water injection channel, and heat dissipation liquid is injected through the water injection groove, and the heat dissipation liquid diffuses and flows to the water injection channel through the capillary effect, so that a liquid film is formed between the positioning structure and the device. After the device is welded by high-frequency induction heating, the liquid film changes from liquid phase to gas phase, and quickly absorbs a large amount of heat. At the same time, the heat dissipation body dissipates the remaining heat, and the heat dissipation effect is good, thereby preventing the problem of excessive temperature or overheating damage in the non-welding area of ​​the device, and playing a role in protecting the device.

Description

Technical Field

[0001] The present invention relates to the technical field of device heat dissipation, and in particular to a device heat dissipation device. Background Art

[0002] During the welding process, a variety of heating methods can be used to heat the device for welding. High-frequency induction heating is currently the ideal heating method for low-temperature glass solder or tin solder welding, especially for small devices that require non-contact, but the large amount of heat generated quickly can easily damage other non-welding areas of the device.

[0003] The existing heat dissipation method for device welding is to dissipate excess heat by adding a large heat dissipation copper plate or condensation plate around the device. However, these methods cannot dissipate the large amount of heat generated in a short time in a very short time. Especially for small devices or devices with heat-sensitive components near the welding area, the heat dissipation effect is poor and it is easy to cause damage to the device. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a device heat dissipation device in view of the above-mentioned defects of the prior art, so as to solve the problem that the heat dissipation effect is poor and the device is easily damaged when the device adopts high-frequency induction heating.

[0005] The technical solution adopted by the present invention to solve the technical problem is: to provide a device heat dissipation device, including a heat dissipation body, on which a positioning structure and a water injection groove are provided, wherein:

[0006] A positioning structure for placing a device;

[0007] The water injection groove forms a water injection channel with the end face of the device, and injects heat dissipation liquid to take away the heat of the device.

[0008] A further preferred solution of the present invention is that: the heat dissipation body is provided with a plurality of inclined surfaces arranged along the path of the water injection groove, and the plurality of inclined surfaces are enclosed to form a liquid storage portion.

[0009] A further preferred solution of the present invention is that: the heat dissipation body is further provided with a groove connected to the water injection groove, and the groove is provided on one of the inclined surfaces.

[0010] A further preferred solution of the present invention is that the positioning structure includes a positioning groove provided on the heat dissipation body for placing the device.

[0011] A further preferred embodiment of the present invention is that the water injection trough comprises a first trough section arranged along the horizontal direction of the positioning trough and a second trough section and a third trough section arranged along the depth direction of the positioning trough, and the second trough section, the first trough section and the third trough section are connected in sequence.

[0012] A further preferred solution of the present invention is that the cross section of the second slot segment and / or the third slot segment is in an arc-shaped structure.

[0013] A further preferred solution of the present invention is that the heat dissipation body is further provided with an end surface extending from each of the inclined surfaces to the water injection groove.

[0014] A further preferred solution of the present invention is that a limiting portion for limiting the position of the device is provided in the positioning groove.

[0015] A further preferred solution of the present invention is that the heat dissipation body is made of brass.

[0016] The beneficial effect of the present invention lies in that, compared with the prior art, a heat dissipation body is provided, a positioning structure and a water injection groove for placing a device are provided on the heat dissipation body, the water injection groove and the end face of the device form a water injection channel, and the heat dissipation liquid is injected through the water injection groove. The heat dissipation liquid diffuses and flows to the water injection channel through the capillary effect, so that a liquid film is formed between the positioning structure and the device. After the device is welded by high-frequency induction heating, the liquid film changes from liquid phase to gas phase, and quickly absorbs a large amount of heat. At the same time, the heat dissipation body dissipates the remaining heat, and the heat dissipation effect is good, thereby preventing the non-welding area of ​​the device from being overheated or overheated and damaged, thereby protecting the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the device heat dissipation device of the present invention;

[0019] Figure 2 It is a schematic diagram of the planar structure of the device heat dissipation device of the present invention;

[0020] Figure 3 It is a three-dimensional structural schematic diagram of the device heat dissipation device (with the device placed therein) of the present invention;

[0021] Figure 4 It is a schematic cross-sectional structural diagram of the device heat dissipation apparatus (with a device placed therein) of the present invention. DETAILED DESCRIPTION

[0022] Now, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0023] like Figure 1 and Figure 2 As shown, the present invention provides a preferred embodiment of a device heat dissipation device.

[0024] Combination Figures 1 to 4The device heat dissipation device comprises a heat dissipation body 10, on which a positioning structure and a water injection groove 11 are provided, wherein the positioning structure is used to place the device A; the water injection groove 11 and the device end surface form a water injection channel, and heat dissipation liquid is injected to take away the heat of the device. By setting the heat dissipation body 10, a positioning structure and a water injection groove 11 for placing the device A are provided on the heat dissipation body 10, and heat dissipation liquid is injected through the water injection groove 11. The heat dissipation liquid diffuses and flows to the water injection channel through the capillary effect, so that a liquid film B is formed between the positioning structure and the device A. When the high-frequency induction starts to heat the device welding area A1, the rapidly generated heat is conducted from the welding area A1 to the non-welding area through the device A shell, and the liquid film B in the non-welding area is directly transformed from the liquid phase to the gas phase by the heat, and a large amount of heat is quickly absorbed from the device A; at the same time, the remaining heat is dissipated through the heat dissipation body 10, and the heat dissipation effect is good, thereby preventing the non-welding area from being overheated or overheated and damaged, and playing a role in protecting the device A.

[0025] The heat dissipation body 10 in this embodiment can be made of brass, which has low cost and good heat dissipation effect. In other embodiments, materials such as bronze, copper, aluminum and alloys thereof that can dissipate heat for device A can also be used. In addition, the heat dissipation liquid can be liquid water, which forms a thin water film between device A and the positioning structure. When device A is heated and welded, the liquid water film needs to absorb a large amount of heat when it changes from liquid phase to gas phase, and the excess heat generated during welding is quickly taken away from device A, thereby preventing the internal or key parts of device A from overheating and causing functional failure.

[0026] Further, refer to Figure 1 and Figure 2 The heat dissipation body 10 is also provided with a liquid storage part 12 for storing heat dissipation liquid, and the liquid storage part 12 is connected to the water injection tank 11. The liquid storage part 12 can be injected and stored with heat dissipation liquid, and the heat dissipation liquid is continuously injected into the water injection tank 11 through the capillary effect, and then diffused between the positioning structure and the device A through the capillary effect to dissipate heat for the device A. Specifically, the heat dissipation body 10 is provided with a plurality of inclined surfaces 121 arranged along the path of the water injection tank 11, and the plurality of inclined surfaces 121 enclose the liquid storage part 12. The heat dissipation liquid is injected into the space enclosed by the plurality of inclined surfaces 121 to store the heat dissipation liquid, and the structure is simple.

[0027] A slot 13 connected to the water injection slot 11 may be provided on the heat dissipation body 10, and the slot 13 may be provided on one of the inclined surfaces 121. The heat dissipation liquid may be injected into the water injection slot 11 through the slot 13, and the heat dissipation liquid may be stored in a storage portion formed by a plurality of inclined surfaces 121. The slot 13 accelerates the injection of the heat dissipation liquid into the water injection slot 11 and facilitates the injection of the heat dissipation liquid.

[0028] Further, refer to Figure 1 The heat dissipation body 10 is also provided with an end surface 14 extending from each of the inclined surfaces 121 to the water injection groove 11, and the end surface 14 increases the contact area between the heat dissipation body 10 and the device A. The heat dissipation liquid forms a liquid film B between the end surface 14 and the device A, and dissipates heat to the device A when the device A is subjected to high-frequency induction heating.

[0029] refer to Figure 1 In this embodiment, the positioning structure includes a positioning groove 15 provided on the heat dissipation body 10 for placing the device. The device is placed in the positioning groove 15, the device fits with the heat dissipation body 10, and the end face of the device and the water injection groove 11 form a water injection channel. Of course, in other embodiments, the positioning structure can also be a snap-fit ​​member provided on the heat dissipation body 10, the device is positioned on the heat dissipation body 10, so that it fits with the heat dissipation body 10, and the end face of the device and the water injection groove 11 form a water injection channel. Furthermore, a limiting portion 151 for limiting the device A is provided in the positioning groove 15. Specifically, two protrusions for limiting the device A are provided in the positioning groove 15, and the two protrusions form the limiting portion 151.

[0030] Furthermore, the water injection groove 11 in this embodiment includes a first groove section 111 arranged along the horizontal direction of the positioning groove 15, and a second groove section 112 and a third groove section 113 arranged along the depth direction of the positioning groove 15, and the second groove section 112, the first groove section 111 and the third groove section 113 are sequentially connected. The heat dissipation liquid is injected into the second groove section 112, the first groove section 111 and the third groove section 113 that are sequentially connected, enclosing the horizontal direction and the depth direction of the device A, and can fully form a liquid film B between each end face 14 of the device A and the positioning groove 15, so as to fully dissipate the heat of the device A and prevent the device A from being damaged by high-frequency induction heating.

[0031] Furthermore, the cross section of one or both of the second slot section 112 and the third slot section 113 is in an arc-shaped structure. The arc-shaped structure can better diffuse the heat dissipation liquid through the capillary effect.

[0032] In this embodiment, a relief groove 16 for evading the pins of the device A may be further provided on the heat dissipation body 10 . The operator places the device A in the positioning groove 15 , and the pins of the device A are located in the relief groove 16 .

[0033] In the present invention, liquid water can be used as a heat dissipation liquid to take away the heat of the device. When using the device heat dissipation device of the present invention, the device A can be placed and positioned in the positioning groove 15 of the heat dissipation body 10, and the heat dissipation body 10 and the device A as a whole can be placed against a plane, and liquid water can be injected through the slot 13 on the heat dissipation body 10, and the liquid water flows into the water injection groove 11, and the liquid water diffuses between the positioning groove 15 and the device A through the capillary effect to form a water film, and the liquid water can accumulate in the liquid storage part 12 formed by multiple inclined surfaces 121. After the water film is transformed from the liquid phase to the gas phase, the liquid water flows from the liquid storage part 12 through the end face 14 and the slot 13 to the water injection groove 11, and diffuses again between the positioning groove 15 and the device A through the capillary effect from the water injection groove 11, and continuously dissipates heat from the device.

[0034] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A device heat dissipation device, characterized in that: It includes a heat dissipation body, on which a positioning structure and a water injection groove are provided, wherein: A positioning structure, the positioning structure comprising a positioning groove provided on the heat dissipation body for placing the device; A water injection groove forms a water injection channel with the end face of the device, and injects heat dissipation liquid to take away the heat of the device. The water injection groove includes a first groove section arranged along the horizontal direction of the positioning groove and a second groove section and a third groove section arranged along the depth direction of the positioning groove. The second groove section, the first groove section and the third groove section are connected in sequence; the heat dissipation body is also provided with a liquid storage part for storing the heat dissipation liquid, and the liquid storage part is connected to the water injection groove.

2. The device heat dissipation device according to claim 1, characterized in that: The heat dissipation body is provided with a plurality of inclined surfaces arranged along the path of the water injection groove, and the plurality of inclined surfaces are surrounded to form a liquid storage portion.

3. The device heat dissipation device according to claim 2, characterized in that: The heat dissipation body is also provided with a slot connected to the water injection slot, and the slot is arranged on one of the inclined surfaces.

4. The device heat dissipation device according to claim 1, characterized in that: The cross section of the second slot segment and / or the third slot segment is in an arc-shaped structure.

5. The device heat dissipation device according to claim 2, characterized in that: The heat dissipation body is also provided with an end surface extending from each of the inclined surfaces to the water injection groove.

6. The device heat dissipation device according to claim 1, characterized in that: A limiting portion for limiting the position of the device is arranged in the positioning groove.

7. The device heat dissipation device according to any one of claims 1 to 6, characterized in that: The material of the heat dissipation body includes brass.

Images