Antenna radiator including multiple layers and electronic device including the same

Abstract

The present disclosure relates to an antenna radiator including multiple layers and an electronic device including the antenna radiator. Disclosed is an electronic device including: a housing; a first plate located on a front surface of the housing; a second plate located on a rear surface of the housing; an antenna radiator interposed between the first and second plates; and wireless communication circuitry connected to the antenna radiator and processing signals in a specific frequency band. The antenna radiator includes at least one conductive fabric layer having a resistive characteristic suitable for transmitting or receiving signals in the specific frequency band, and the at least one conductive fabric layer includes fabric plated with at least one metal.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2019-0050482 filed on April 30, 2019, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments of the present disclosure are generally directed to an antenna radiator in the form of a thin film including a plurality of layers. Background Art

[0004] With the development of mobile communication technology, electronic devices can now be configured to be freely connected to wireless / wired networks and configured to be easy to carry. For example, because portable electronic devices such as smart phones and tablet PCs include antennas for sending and receiving wireless signals, these portable electronic devices can be connected to wireless communication networks.

[0005] Electronic devices may include antennas for transmitting and receiving signals in various frequency bands. With the advancement of wireless communication technology, the frequencies used in wireless communications and the corresponding frequency bandwidth ranges have increased, and the number of antennas in devices has also increased to correspond to the increased frequency band range. However, since electronic devices are generally expected to be as small and lightweight as possible to make them more portable, the space available for installing antennas is decreasing.

[0006] The above information is provided as background information only to assist in understanding the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above content may be applicable as prior art with respect to the present disclosure. Summary of the Invention

[0007] In electronic devices, antennas in the form of flexible printed circuit boards (FPCBs) can be installed to accommodate limited antenna mounting spaces. In this case, the FPCB antenna may not use the entire attachment area as antenna pattern space. Furthermore, since the attachment of the curved portion of the FPCB antenna may degrade over time, the performance of the FPCB antenna may degrade over time.

[0008] According to one aspect of the present disclosure, an electronic device may include: a housing; a first board located on a front surface of the housing; a second board located on a rear surface of the housing; an antenna radiator interposed between the first and second boards; and wireless communication circuitry connected to the antenna radiator and processing signals in a specific frequency band. The antenna radiator includes at least one conductive fabric layer having a resistive characteristic suitable for transmitting or receiving signals in the specific frequency band, and the at least one conductive fabric layer includes fabric plated with at least one metal.

[0009] According to another aspect of the present disclosure, an antenna radiator may include: at least one conductive fabric layer, the at least one conductive fabric layer including a fabric plated with at least one metal; and a conductive coating stacked on the at least one conductive fabric layer and configured to prevent corrosion of the at least one conductive fabric layer and transmit electrical signals outside the antenna radiator to the at least one conductive fabric layer.

[0010] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a block diagram illustrating an electronic device in a network environment according to various embodiments;

[0013] Figure 2 is a front perspective view of a mobile electronic device according to an embodiment;

[0014] Figure 3 yes Figure 2 A rear perspective view of an electronic device;

[0015] Figure 4 yes Figure 2 An exploded perspective view of an electronic device;

[0016] Figure 5A is an exploded perspective view showing an antenna radiator located in an electronic device according to an embodiment;

[0017] Figure 5B It is along Figure 5A A cross-sectional view of the electronic device taken along line AA';

[0018] Figure 6Ais an exploded perspective view showing an antenna radiator located in an electronic device according to an embodiment;

[0019] Figure 6B It is along Figure 6A A cross-sectional view of the electronic device taken along line BB' in FIG.

[0020] Figure 7 is a diagram showing an example of an antenna radiator element before being placed in an electronic device;

[0021] Figure 8A is a diagram showing the configuration of an antenna radiator according to an embodiment, and is a diagram showing a configuration of an antenna radiator according to an embodiment Figure 7 A sectional view taken along line CC' in FIG.

[0022] Figure 8B is a diagram showing the configuration of an antenna radiator according to an embodiment, and is a diagram showing a configuration of an antenna radiator according to an embodiment Figure 7 A sectional view taken along line CC' in FIG.

[0023] Figure 9A is a diagram showing the configuration of an antenna radiator according to an embodiment, and is a diagram showing a configuration of an antenna radiator according to an embodiment Figure 7 A sectional view taken along line CC' in FIG.

[0024] Figure 9B is a diagram showing the configuration of an antenna radiator according to an embodiment, and is a diagram showing a configuration of an antenna radiator according to an embodiment Figure 7 A sectional view taken along line CC' in FIG.

[0025] Figure 10A is a diagram showing the configuration of an antenna radiator according to an embodiment, and is a diagram showing a configuration of an antenna radiator according to an embodiment Figure 7 A sectional view taken along line CC' in FIG.

[0026] Figure 10B is a diagram showing the configuration of an antenna radiator according to an embodiment, and is a diagram showing a configuration of an antenna radiator according to an embodiment Figure 7 A sectional view taken along line CC' in FIG.

[0027] Figure 11A is a diagram showing the configuration of an antenna radiator according to an embodiment, and is a diagram showing a configuration of an antenna radiator according to an embodiment Figure 7 A sectional view taken along line CC' in FIG.

[0028] Figure 11B is a diagram showing the configuration of an antenna radiator according to an embodiment, and is a diagram showing a configuration of an antenna radiator according to an embodiment Figure 7 A sectional view taken along line CC' in FIG.

[0029] Figure 12A is a view showing an antenna radiator attached to a support member according to an embodiment;

[0030] Figure 12BIt is along Figure 12A A cross-sectional view taken along line D-D';

[0031] Figure 12C It is through magnification Figure 12B A sectional view obtained from part "E". DETAILED DESCRIPTION

[0032] Hereinafter, various embodiments of the present disclosure may be described with reference to the accompanying drawings. Therefore, those skilled in the art will recognize that various modifications, equivalents and / or substitutions may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure.

[0033] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 can communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented as embedded in the display device 160 (eg, a display).

[0034] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Depending on the embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121 .

[0035] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

[0036] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0037] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0038] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0039] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] The display device 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit adapted to measure the strength of the force caused by the touch (e.g., a pressure sensor).

[0041] The audio module 170 can convert sound into an electrical signal, and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0042] The sensor module 176 can detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0043] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0044] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0046] The camera module 180 may capture still images or moving images. Depending on the embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0048] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0050] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., an external electronic device). Depending on the embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). Depending on the embodiment, antenna module 197 may include multiple antennas. In this case, at least one antenna suitable for the communication scheme used in a communication network (such as first network 198 or second network 199) may be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. Depending on the embodiment, additional components other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0051] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general-purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0052] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial response to the request, either by further processing the result or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0053] Various aspects of the present disclosure are intended to at least address the above-mentioned problems and / or disadvantages and to provide at least the advantages described below. Therefore, one aspect of the present disclosure is to provide an antenna structure that maintains consistent performance within a limited antenna space. This antenna includes an antenna element (e.g., a film-type radiator) formed using a fabric and a conductive member.

[0054] Figure 2 is a front perspective view of a mobile electronic device according to an embodiment. Figure 3 yes Figure 2 A rear perspective view of an electronic device.

[0055] Reference Figure 2 and Figure 3The electronic device 200 according to the embodiment may include a housing 210 including a first surface (or front surface) 210A, a second surface 210B (or rear surface) and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing may refer to a housing forming a first surface (or front surface) 210A, a second surface 210B (or rear surface) and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. Figure 2 The structure of part or all of the first surface 210A, the second surface 210B and the side surface 210C. According to an embodiment, the first surface 210A can be implemented by a front plate 202 (for example, a glass plate or a polymer plate including various coatings) at least a portion of which is substantially transparent. The second surface 210B can be implemented by a substantially opaque back plate 211. For example, the back plate 211 can be implemented by coated glass or colored glass, ceramic, polymer, metal (for example, aluminum, stainless steel (STS) or magnesium) or a combination of at least two materials. The side surface 210C can be coupled to the front plate 202 or the back plate 211 and can be implemented by a side frame structure (or "side member") 218 ​​including metal and / or polymer. For example, a portion of the side frame structure 218 can first be made of a polymer, and the metal portion can be partially bonded to the polymer. In an embodiment, the back plate 211 and the side frame structure 218 can be formed integrally and can include the same material.

[0056] In the illustrated embodiment, the front plate 202 may include two first regions 210D that are bent toward the rear plate 211 and seamlessly extend from opposite long sides of the first surface 210A. Figure 3 In the illustrated embodiment, the back panel 211 may include two second regions 210E that are curved toward the front panel 202 and extend seamlessly from opposite long sides of the second surface 210B. In an embodiment, the front panel 202 (or the back panel 211) may include only one first region 210D (or second region 210E). In another embodiment, a portion of the first region 210D or the second region 210E may not be included. Therefore, in this embodiment, when viewed from the side, the side frame structure 218 may have a first thickness (or width) on a portion that does not include the first region 210D or the second region 210E, and may have a second thickness that is less than the first thickness on another portion that includes the first region 210D or the second region 210E.

[0057] According to an embodiment, the electronic device 200 may include at least one or more of the display 201, audio modules 203, 207, 214, sensor modules 204, 216, 219, camera modules 205, 212, 213, a key input device 217, a light emitting device 206, and connector holes 208, 209. In an embodiment, the electronic device 200 may not include at least one of these components, such as the key input device 217 or the light emitting device 206, or may further include some other components not listed above.

[0058] For example, the display 201 may be exposed through a majority of the front panel 202. In an embodiment, at least a portion of the display 201 may be exposed through the first surface 210A and the first area 210D of the front panel 202. In an embodiment, the shape of a corner of the display 201 may be substantially the same as the shape of an adjacent outer corner of the front panel 202. In another embodiment (not shown), to increase the exposed area of ​​the display 201, the border between the outer edge of the display 201 and the outer edge of the front panel 202 may be minimized.

[0059] In another embodiment (not shown), a recess or opening may be formed in a portion of the screen display area of ​​the display 201, and at least one or more of the audio module 214, sensor module 204, camera module 205, and light emitting device 206 may be disposed in the recess or opening. In another embodiment (not shown), at least one or more of the audio module 214, sensor module 204, camera module 205, fingerprint sensor 216, and light emitting device 206 may be disposed behind the screen display area of ​​the display 201. In yet another embodiment (not shown), the display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (or pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus. In an embodiment, at least a portion of the sensor modules 204, 219 and / or at least a portion of the key input device 217 may be disposed in the first area 210D and / or the second area 210E.

[0060] The audio modules 203, 207, 214 may include a microphone hole 203 and speaker holes 207, 214. A microphone for recording external sounds may be provided in the microphone hole 203. In an embodiment, a plurality of microphones may be arranged to detect the direction of the sound. The speaker holes 207, 214 may include an external speaker hole 207 and a receiver hole 214, wherein the receiver hole 214 corresponds to a receiver used in a phone. In an embodiment, the speaker holes 207, 214 and the microphone hole 203 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without a corresponding speaker hole.

[0061] The sensor modules 204, 216, and 219 can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device 200 or some external environmental state. The sensor modules 204, 216, and 219 can include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., a hearing monitor (HRM) sensor) and / or a fourth sensor module 216 disposed on the second surface 210B of the housing 210. The fingerprint sensor can be located on both the second surface 210B and the first surface 210A (e.g., the display 201) of the housing 210. The electronic device 200 may also include other sensor modules (not shown), such as a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0062] The camera modules 205, 212, and 213 may include a first camera device 205 located on a first surface 210A of the electronic device 200, and a second camera module 212 and / or a flash 213 located on a second surface 210B. The camera devices 205 and 212 may include one or more lenses, image sensors, and / or image signal processors. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, two or more lenses (e.g., an infrared camera and wide-angle and telephoto lenses) and image sensors may be provided on one surface of the electronic device 200.

[0063] The key input device 217 may be provided on the side surface 210C of the housing 210. In another embodiment, the electronic device 200 may not include physical keys, and the key input devices not included may be implemented as soft keys on the display 201.

[0064] The light emitting device 206 may be provided, for example, on the first surface 210A of the housing 210. The light emitting device 206 may provide status information of the electronic device 200 by, for example, emitting light in a certain pattern. In another embodiment, the light emitting device 206 may function as a flash, for example, in conjunction with the operation of the camera module 205. The light emitting device 206 may include, for example, a light emitting diode (LED), an IR LED, and a xenon lamp.

[0065] The connector holes 208, 209 may include a first connector hole 208 and / or a second connector hole (or headphone jack) 209, wherein the first connector hole 208 is capable of accommodating a connector (e.g., a USB connector) for sending power and / or data and / or receiving power and / or data to / from an external electronic device, and the second connector hole (or headphone jack) 209 is capable of accommodating a connector for sending / receiving audio signals to / from an external electronic device.

[0066] Figure 4 yes Figure 2 An exploded perspective view of an electronic device.

[0067] Reference Figure 4 , the electronic device 400 (e.g., the electronic device 200) may include a front panel 410, a display 420, a first support member 430 (e.g., a bracket), a battery 440, a printed circuit board 450, an antenna radiator 460 (e.g., an antenna element) in the form of a sheet or film, a side frame structure 470, a second support member 471 (e.g., a rear case) and / or a rear panel 480. In an embodiment, the electronic device 400 may not include at least one of these components, such as the first support member 430 or the second support member 471, or may further include some other components not shown. At least one component of the electronic device 400 may be connected to Figure 2 or Figure 3 At least one component of the electronic device 200 in FIG. 1 is the same or similar, so additional description will be omitted to avoid repetition.

[0068] The display 420 may be coupled to one surface of the first support member 430, and the printed circuit board 450 may be coupled to the other surface of the first support member 430. A second support member 471 may be disposed within the electronic device 400, and the second support member 471 may be connected to the side frame structure 470, or may be integrally formed with the side frame structure 470. For example, the first support member 430 or the second support member 471 may be made of a non-metallic (e.g., polymer) material, or may be made of metal.

[0069] A processor, memory, interface, etc. may be mounted on the printed circuit board 450. For example, the processor may include a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, or a communication processor.

[0070] The memory may include, for example, volatile memory or non-volatile memory.

[0071] The interface may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, and / or an audio interface. The interface may allow for electrical or physical connection between the electronic device 400 and an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0072] The battery 440 provides power to at least one component of the electronic device 400 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell. For example, at least a portion of the battery 440 may be disposed on substantially the same plane as the printed circuit board (PCB) 450. The battery 440 may be integrally disposed within the electronic device 400 or may be disposed so as to be removable from the electronic device 400 by an end user of the electronic device 400.

[0073] The antenna radiator 460 may be disposed between the second support member 471 and the first support member 430. The antenna radiator 460 may be formed as a sheet or film comprising multiple layers. For example, the antenna radiator 460 may be included in a near field communication (NFC) antenna, an antenna for wireless charging, and / or a magnetic secure transmission (MST) antenna. In these examples, the antenna radiator 460 may perform short-range communication with an external device, or may wirelessly send / receive power to charge the battery 440. In another embodiment, the antenna structure may be implemented with a portion of the side frame structure 470 and / or the second support member 471, or a combination thereof. In yet another embodiment, the antenna radiator 460 may be between the back plate 480 and the second support member 471. Depending on the embodiment, the antenna radiator 460 may be included in an antenna as an antenna element together with a feed portion and a ground portion.

[0074] Figure 5A is an exploded perspective view illustrating an antenna radiator in an electronic device according to an embodiment. Figure 5B It is along Figure 5A A cross-sectional view of the electronic device taken along line AA' in FIG.

[0075] Reference Figure 5A and Figure 5B, the antenna radiator 560 (eg, the antenna radiator 460 ) may be interposed between the second support member 571 (eg, the second support member 471 ) and the first support member 530 (eg, the first support member 430 ).

[0076] According to an embodiment, the antenna radiator 560 may be attached to one side of the second support member 571 (eg, an inner side surface of the second support member 571 facing the first support member 530 ).

[0077] According to an embodiment, the antenna radiator 560 may be attached in a manner that is bent to conform to the surface shape of the object to which it is attached. Figure 5B As shown, the antenna radiator 560 may conform to the curve of the connection portion between the second support member 571 and the side frame structure 570 (e.g., the side frame structure 470). At least a portion of the antenna radiator 560 may be attached to a side of the side frame structure 570 (e.g., the inner surface of the side frame structure 570 facing the first support member 530). At least a portion of the antenna radiator 560 may be attached facing the printed circuit board 550 (e.g., the printed circuit board 450).

[0078] Figure 6A is an exploded perspective view illustrating an antenna radiator in an electronic device according to an embodiment. Figure 6B It is along Figure 6A A cross-sectional view of the electronic device taken along line BB' in FIG.

[0079] Reference Figure 6A and Figure 6B The antenna radiator 660 (eg, the antenna radiator 460 ) may be disposed between the rear plate 680 (eg, the rear plate 480 ) and the second support member 671 (eg, Figure 4 between the second support members 471).

[0080] According to an embodiment, the antenna radiator 660 may be attached to one side of the second support member 671 (eg, an outer side surface of the second support member 671 facing the rear plate 680 ).

[0081] According to an embodiment, the antenna radiator 660 may be attached in a manner that is bent to conform to the surface shape of the object to which it is attached. Figure 6B As shown, the antenna radiator 660 may conform to the curve of the second support member 671. At least a portion of the antenna radiator 660 may be arranged to face the printed circuit board 650 (eg, printed circuit board 450) with the second support member 671 arranged therebetween.

[0082] Figure 7 is a diagram showing an example of an antenna radiator unit before being placed in an electronic device. Figure 7According to an embodiment, the antenna radiator 760 (e.g., the antenna radiator 460) may include an antenna pattern portion 760a and a guide film 760b. For example, the antenna pattern portion 760a may be a portion attached to an electronic device (e.g., the electronic device 400). When the antenna pattern portion 760a is attached to the electronic device, the guide film 760b may provide guidance. The area of ​​the guide film 760b may be larger than the area of ​​the antenna pattern portion 760a. The guide film 760b may further include one or more guide holes 760c. The guide holes 760c may be formed to correspond to one or more guide members included in the electronic device, and thus may guide the installation and / or positioning of the antenna pattern portion 760a when the antenna pattern portion 760a is attached to a designated position in the electronic device. The guide film 760b may be removed after the antenna pattern portion 760a is attached. In another example, the guide film 760b may be omitted.

[0083] Figures 8A to 11B is a diagram showing one or more configurations of an antenna radiator according to various embodiments, and is a diagram showing a configuration of an antenna radiator according to various embodiments. Figure 7 A cross-sectional view taken along line C-C' in FIG. Figures 8A to 11B In the drawings, the same reference numerals may refer to the same components. Figures 8A to 11B , the antenna radiator 760 may be illustrated as an antenna radiator unit as it exists before being attached to an electronic device (e.g., the electronic device 400). The thicknesses of various components included in the antenna radiator 760 (e.g., the first adhesive layer 761, the second adhesive layer 765, the third adhesive layer 766, the first conductive fabric layer 762, the primer coating 768, the second conductive fabric layer 767, or the polymer compound layer 764) are not limited to the illustrated embodiment.

[0084] Reference Figure 8A and 8B , the antenna radiator 760 may include a conductive fabric layer.

[0085] According to an embodiment, Figure 8AIn the embodiment, the antenna radiator 760 (e.g., the antenna radiator 460) may include a first adhesive layer 761 (e.g., a pressure-sensitive adhesive (PSA)), a first conductive fabric layer 762 (e.g., plated nanofiber), and a conductive coating 763 (e.g., anti-tarnish polyurethane (ATU)). The first conductive fabric layer 762 may be interposed between the conductive coating 763 and the first adhesive layer 761. According to an embodiment, the antenna radiator 760 may include an adhesive protective film 769 that protects the first adhesive layer 761 and a guide film 760b that may guide the antenna radiator 760 to be attached to the correct position within the electronic device. The conductive coating 763 may be interposed between the first conductive fabric layer 762 and the guide film 760b. The first adhesive layer 761 may be interposed between the first conductive fabric layer 762 and the adhesive protective film 769. In an embodiment, when the antenna radiator 760 is attached to the electronic device (e.g., the electronic device 400), the adhesive protective film 769 and / or the guide film 760b may be removed. In another example, the guide film 760b may be omitted.

[0086] According to an embodiment, in the design of the first conductive fabric layer 762, the resistance characteristics required for the antenna radiator 760 used in the antenna can be taken into account. For example, the first conductive fabric layer 762 includes a fabric (e.g., nanofiber) and can be formed by plating the fabric with at least one metal. In a more specific example, the thread included in the fabric included in the first conductive fabric layer 762 can be plated with copper. In another embodiment, the thread included in the fabric included in the first conductive fabric layer 762 can be plated with multiple metals (e.g., nickel-copper-nickel) alternately. The first conductive fabric layer 762 can have a resistance characteristic so that the antenna radiator 760 can be used in an antenna of a specific frequency band (e.g., a frequency band of about 1 GHz or greater). In order to perform metal plating that meets the required resistance characteristics, the fabric can include an air gap of a specified size or larger or be plated with a metal of a specific thickness or larger.

[0087] According to an embodiment, in contrast to a flexible printed circuit board (FPCB), the fabric does not degrade over time. For example, in contrast to an FPCB, the first conductive fabric layer 762 does not degrade over time.

[0088] According to an embodiment, the first adhesive layer 761 may attach the antenna radiator 760 to the mounting target (e.g., the second support member 471). In an embodiment, the thickness of the first adhesive layer 761 (e.g., about 30 μm) may be greater than the thickness of the first conductive fabric layer 762 (e.g., about 15 μm).

[0089] According to an embodiment, the conductive coating 763 can prevent the first conductive fabric layer 762 from being corroded. In another example, because the conductive coating 763 is conductive, the antenna radiator 760 may not require a specific contact pad, and multiple contacts for feeding or grounding can be established at any point of the antenna radiator 760.

[0090] According to an embodiment, the guide film 760b may include one or more guide holes 760c for guiding the antenna radiator 760 to be attached to the electronic device. For example, the guide hole 760c may be formed to correspond to the position of one or more guide members included in the installation target (e.g., the second support member 471). The guide film 760b may be removed after the antenna radiator 760 is attached. Therefore, compared to the FPCB antenna that retains the guide hole after installation, the antenna radiator 760 can maintain the same or similar performance while occupying less area. In this way, the area utilization of the antenna radiator 760 can be higher than that of the FPCB antenna.

[0091] According to an embodiment, after stacking the first adhesive layer 761, the first conductive fabric layer 762, and the conductive coating 763, the antenna radiator 760 can be manufactured into the shape of a specified radiator by using a stamping process. Therefore, the entire attachment area of ​​the antenna radiator 760 (for example, 100% of the attachment area) can be used for the radiator. Alternatively, the antenna radiator 760 can be manufactured by a molding process or a patterning process. According to an embodiment, the antenna radiator 760 can be manufactured into the shape of a specified radiator by a punching process using a laser. In this case, refer to Figure 8A or Figure 9A At least one of the first adhesive layer 761, the first conductive fabric layer 762, or the polymer compound layer 764 can be manufactured in a designated color. For example, the designated color can be distributed throughout the area to be perforated. The area to be perforated can be displayed in the designated color. Alternatively, the designated color can be a non-transparent color that responds well to laser light. The closer the designated color is to black, the better the designated color responds to laser light.

[0092] According to the embodiment, referring to Figure 8B , antenna radiator 760 except Figure 8A In addition to the structure of the back plate 680, the back plate 680 and the second support member 671 may further include a primer coating 768 (e.g., a conductive silicon coating or a conductive primer). For example, the primer coating 768 may be interposed between the conductive coating 763 and the guide film 760b. When the antenna radiator 760 is interposed between the back plate 680 and the second support member 671, as shown in FIG. Figure 6A and Figure 6BAs shown, primer coating 768 can prevent damage to antenna radiator 760 by back plate 680, which may occur during assembly of the AS and the electronic device when back plate 680 is removed from the electronic device. According to an embodiment, primer coating 768 can include conductive powder to conduct electricity.

[0093] Reference Figure 9A or Figure 9B ,Apart from Figure 8A or Figure 8B In addition to the illustrated configuration, the antenna radiator 760 may further include a polymer compound layer 764 (eg, polyethylene terephthalate (PET) or polyimide (PI)).

[0094] According to an embodiment, Figure 9A , the antenna radiator 760 may include at least one of an adhesive protective film 769, a first adhesive layer 761, a polymer compound layer 764, a second adhesive layer 765 (e.g., PSA), a first conductive fabric layer 762, a conductive coating 763, and a guide film 760b. For example, the first adhesive layer 761 may be interposed between the adhesive protective film 769 and the polymer compound layer 764. The polymer compound layer 764 may be interposed between the first adhesive layer 761 and the second adhesive layer 765. The second adhesive layer 765 may be interposed between the polymer compound layer 764 and the first conductive fabric layer 762. The first conductive fabric layer 762 may be interposed between the second adhesive layer 765 and the conductive coating 763. The conductive coating 763 may be interposed between the first conductive fabric layer 762 and the guide film 760b.

[0095] According to an embodiment, the polymer compound layer 764 can protect the antenna radiator 760 from heat damage. For example, when the polymer compound layer 764 is not present, the first conductive fabric layer 762 may repeatedly expand and contract due to changes in temperature, and thus wrinkles may occur. When wrinkles occur in the first conductive fabric layer 762, the resonant frequency of the antenna radiator 760 may change, and the changed frequency may be different from the specified resonant frequency designed for the antenna radiator 760. When the resonant frequency of the antenna radiator 760 changes, the performance of the antenna including the antenna radiator 760 may deteriorate. The polymer compound layer 764 can prevent deformation of the first conductive fabric layer 762 caused by repeated temperature changes, thereby maintaining the performance of the antenna radiator 760.

[0096] According to an embodiment, the polymer compound layer 764 can improve the flexibility of the antenna radiator 760. For example, the antenna radiator 760 can be bent into a desired shape and maintain the bent shape through the polymer compound layer 764. Therefore, using the polymer compound layer 764, the antenna radiator 760 can be more easily attached to a curved surface of an installation target (e.g., the second support member 471).

[0097] According to an embodiment, the polymer compound layer 764 may prevent the antenna radiator 760 from being deformed over time. In another embodiment, the polymer compound layer 764 may increase the tensile strength of the antenna radiator 760.

[0098] According to an embodiment, the antenna radiator 760 may include a plurality of adhesive layers (e.g., a first adhesive layer 761 and a second adhesive layer 765). For example, the first adhesive layer 761 may attach the antenna radiator 760 to the installation target. The second adhesive layer 765 may attach the polymer compound layer 764 to the first conductive fabric layer 762. In an embodiment, the thickness of the first adhesive layer 761 (e.g., approximately 30 μm) may be greater than the thickness of the first conductive fabric layer 762 (e.g., approximately 15 μm). The thickness of the first conductive fabric layer 762 (e.g., approximately 15 μm) may be greater than the thickness of the polymer compound layer 764 (e.g., approximately 12 μm). The thickness of the polymer compound layer 764 (e.g., approximately 12 μm) may be greater than the thickness of the second adhesive layer 765 (e.g., approximately 10 μm).

[0099] According to the embodiment, referring to Figure 9B ,Apart from Figure 9A In addition to the structure of the antenna radiator 760, the antenna radiator 760 may further include a primer coating 768 (eg, a conductive silicon coating or a conductive primer). For example, the primer coating 768 may be interposed between the conductive coating 763 and the guide film 760b. The primer coating 768 may be interposed between the conductive coating 763 and the guide film 760b. Figure 8B The primer coating 768 is the same or similar.

[0100] Reference Figure 10A or Figure 10B , the antenna radiator 760 may include a plurality of conductive fabric layers (eg, a first conductive fabric layer 762 and a second conductive fabric layer 767 ).

[0101] According to an embodiment, Figure 10A , the antenna radiator 760 may include at least one of an adhesive protective film 769, a first adhesive layer 761, a first conductive fabric layer 762, a third adhesive layer 766 (e.g., a conductive PSA), a second conductive fabric layer 767, a conductive coating 763, and a guide film 760b. For example, the first adhesive layer 761 may be interposed between the adhesive protective film 769 and the first conductive fabric layer 762. The first conductive fabric layer 762 may be interposed between the first adhesive layer 761 and the third adhesive layer 766. The third adhesive layer 766 may be interposed between the first conductive fabric layer 762 and the second conductive fabric layer 767. The second conductive fabric layer 767 may be interposed between the third adhesive layer 766 and the conductive coating 763. The conductive coating 763 may be interposed between the second conductive fabric layer 767 and the guide film 760b.

[0102] According to an embodiment, the antenna radiator 760 may include a plurality of adhesive layers (e.g., a first adhesive layer 761 and a third adhesive layer 766). For example, the first adhesive layer 761 may attach the antenna radiator 760 to the mounting target. The third adhesive layer 766 may attach the first conductive fabric layer 762 to the second conductive fabric layer 767. In an embodiment, the thickness of the first adhesive layer 761 (e.g., approximately 30 μm) may be greater than the thickness of the first conductive fabric layer 762 or the second conductive fabric layer 767 (e.g., approximately 15 μm). The thickness of the first conductive fabric layer 762 or the second conductive fabric layer 767 (e.g., approximately 15 μm) may be greater than the thickness of the third adhesive layer 766 (e.g., approximately 10 μm).

[0103] According to some embodiments, the thickness of the first conductive fabric layer 762 and the second conductive fabric layer 767 may be the same or different.

[0104] According to an embodiment, the third adhesive layer 766 may have conductive properties. For example, the third adhesive layer 766 may be formed by mixing conductive powder (e.g., metal powder) with an adhesive member (e.g., PSA). The third adhesive layer 766 may electrically connect the first conductive fabric layer 762 to the second conductive fabric layer 767.

[0105] According to an embodiment, the antenna radiator 760 includes a plurality of conductive fabric layers, thereby improving the resistance characteristics of the antenna radiator 760. For example, the antenna radiator 760 may include a first conductive fabric layer 762 and a second conductive fabric layer 767. The first conductive fabric layer 762 and the second conductive fabric layer 767 may be electrically connected via a third adhesive layer 766. Figures 8A to 9B As shown, the antenna radiator 760 using multiple conductive fabric layers (e.g., the first conductive fabric layer 762 and the second conductive fabric layer 767) can have improved resistance characteristics (e.g., reduced resistance) compared to the case of using a single conductive fabric layer (e.g., the first conductive fabric layer 762). For example, when the first conductive fabric layer 762 and the second conductive fabric layer 767 are used together, the antenna radiator 760 can have sufficient resistance characteristics so that it can be used at a temperature below 100°C. Figures 8A to 9B The antenna radiator 760 is used in a frequency band of about 500 MHz to about 1 GHz.

[0106] According to the embodiment, referring to Figure 10B ,Apart from Figure 10A In addition to the structure of the antenna radiator 760, the antenna radiator 760 may further include a primer coating 768 (eg, a conductive silicon coating or a conductive primer). For example, the primer coating 768 may be interposed between the conductive coating 763 and the guide film 760b. The primer coating 768 may be interposed between the conductive coating 763 and the guide film 760b. Figure 8B The primer coating 768 is the same or similar.

[0107] Reference Figure 11A or Figure 11B , the antenna radiator 760 may include 8A to 10B All components described in .

[0108] According to an embodiment, Figure 11A In the embodiment, the antenna radiator 760 may include at least one of an adhesive protective film 769, a first adhesive layer 761, a polymer compound layer 764, a second adhesive layer 765, a first conductive fabric layer 762, a third adhesive layer 766, a second conductive fabric layer 767, a conductive coating 763, and a guide film 760b. For example, the first adhesive layer 761 may be interposed between the adhesive protective film 769 and the polymer compound layer 764. The polymer compound layer 764 may be interposed between the first adhesive layer 761 and the second adhesive layer 765. The second adhesive layer 765 may be interposed between the polymer compound layer 764 and the first conductive fabric layer 762. The first conductive fabric layer 762 may be interposed between the second adhesive layer 765 and the third adhesive layer 766. The third adhesive layer 766 may be interposed between the first conductive fabric layer 762 and the second conductive fabric layer 767. The second conductive fabric layer 767 may be interposed between the third adhesive layer 766 and the conductive coating 763. The conductive coating 763 may be interposed between the second conductive fabric layer 767 and the guide film 760b.

[0109] According to the embodiment, referring to Figure 11B , the antenna radiator 760 may further be Figure 11A The structure includes a primer coating 768 (eg, a conductive silicon coating or a conductive primer). For example, the primer coating 768 can be interposed between the conductive coating 763 and the guide film 760b.

[0110] According to an embodiment, Figure 11A or Figure 11B The characteristics of the adhesive protective film 769, the first adhesive layer 761, the polymer compound layer 764, the second adhesive layer 765, the first conductive fabric layer 762, the third adhesive layer 766, the second conductive fabric layer 767, the conductive coating layer 763, the primer coating layer 768 or the guide film 760b shown in FIG. 8A to 10B The characteristics of the adhesive protective film 769, the first adhesive layer 761, the polymer compound layer 764, the second adhesive layer 765, the first conductive fabric layer 762, the third adhesive layer 766, the second conductive fabric layer 767, the conductive coating 763, the primer coating 768 or the guide film 760b shown in the figure are the same or similar, so additional description will be omitted to avoid repetition.

[0111] According to an embodiment, Figures 8A to 11BIn the embodiment, the antenna radiator 760 can be formed by a stamping process after stacking at least one of the first adhesive layer 761, the polymer compound layer 764, the second adhesive layer 765, the first conductive fabric layer 762, the third adhesive layer 766, the second conductive fabric layer 767, the conductive coating layer 763, or the primer coating layer 768. For example, after punching, the first adhesive layer 761, the polymer compound layer 764, the second adhesive layer 765, the first conductive fabric layer 762, the third adhesive layer 766, the second conductive fabric layer 767, the conductive coating layer 763, and the primer coating layer 768 in a single antenna radiator 760 can have substantially the same shape and / or size. According to embodiments, at least the shape and / or size of the polymer compound layer 764, the first conductive fabric layer 762, and the second conductive fabric layer 767 can be the same as the shape of the outline of the antenna radiator 760.

[0112] Figure 12A is a view illustrating an antenna radiator attached to a support member according to an embodiment. Figure 12B It is along Figure 12A Cross-sectional view taken along line D-D'. Figure 12B Contact points for power feed or ground are shown. Figure 12C It is through magnification Figure 12B A sectional view obtained by taking part "E" of FIG.

[0113] Reference 12A to 12C , the antenna radiator 760 (e.g., antenna radiator 460) can be attached to the second support member 771 (e.g., second support member 471) via the first adhesive layer 761. In another example, the antenna radiator 760 can be attached to the side frame structure 770 (e.g., side frame structure 470) through the first adhesive layer 761. The feeding portion or the grounding portion of the printed circuit board 730 (e.g., printed circuit board 450) can be connected to the connecting member 731 (e.g., a C-clip). A portion of the connecting member 731 can be connected to the contact point "E" of the antenna radiator 760. In Figure 12C , an exemplary embodiment in which the antenna radiator 760 includes a polymer compound layer 764 and a plurality of conductive fabric layers 762 and 767 is shown. However, the present disclosure is not limited to this particular embodiment. Figures 8A to 11B Any one of the described antenna radiators 760 may be connected to a feeding portion or a ground portion via a connecting member 731 .

[0114] Depending on the embodiment, the contact point "E" of the antenna radiator 760 can be located at any point (or all points) on the antenna radiator 760. For example, the entire conductive coating 763 can transmit the electrical signal to the second conductive fabric layer 767 (or at Figures 8A to 9BIn the case of the first conductive fabric layer 762, the second conductive fabric layer 767 can transmit the electrical signal to the first conductive fabric layer 762 via the third adhesive layer 766.

[0115] According to an embodiment, the second conductive fabric layer 767 (or Figures 8A to 9B The second conductive fabric layer 767 (or the first conductive fabric layer 762 in the case of the second conductive fabric layer 767) can prevent the antenna radiator 760 from corroding (e.g., galvanic corrosion) at the contact point "E". For example, the connecting member 731 can include a metal portion 731a and a plated portion 731b. Figures 8A to 9B The first conductive fabric layer 762 in the case of the first conductive fabric layer 762 may be plated with nickel. The plated portion 731b and the second conductive fabric layer 767 (or the second conductive fabric layer 767 in the case of the second conductive fabric layer 762) may be plated with nickel. Figures 8A to 9B In the case of the first conductive fabric layer 762), the potential difference between the conductive fabric layer and the first conductive fabric layer is reduced, thereby preventing corrosion of the antenna radiator 760.

[0116] According to an embodiment, an electronic device (e.g., electronic device (101, 200, 400)) may include: a housing (e.g., housing 210); a first plate (e.g., front plate (202, 410)) located on the front surface of the housing; a second plate (e.g., rear plate (211, 480)) located on the rear surface of the housing; an antenna radiator (e.g., antenna radiator (460, 560, 660, 760)) interposed between the first plate and the second plate; and a wireless communication circuit (e.g., wireless communication module 192) connected to the antenna radiator and processing signals in a specific frequency band. The antenna radiator may include at least one conductive fabric layer (e.g., first conductive fabric layer 762 or second conductive fabric layer 767) having a resistance characteristic in a specific frequency band suitable for transmitting or receiving signals, and the at least one conductive fabric layer may include a fabric (e.g., nanofiber) plated with at least one metal (e.g., copper or nickel).

[0117] According to an embodiment, the threads comprised in the fabric may be plated with copper and nickel alternately.

[0118] According to an embodiment, the antenna radiator may include: a conductive coating (e.g., conductive coating 763) configured to prevent corrosion of at least one conductive fabric layer and transmit signals from the wireless communication circuit to the at least one conductive fabric layer; and a first adhesive layer (e.g., first adhesive layer 761) configured to attach the antenna radiator to a mounting target within the housing. The at least one conductive fabric layer may be interposed between the conductive coating and the first adhesive layer.

[0119] In accordance with an embodiment, the antenna radiator may further include a primer coating (e.g., primer coating 768) configured to prevent damage to the antenna radiator when an object in contact with the top surface of the antenna radiator detaches, and the conductive coating may be interposed between the primer coating and at least one conductive fabric layer.

[0120] According to an embodiment, the primer coating may include conductive powder so as to conduct electricity to transmit signals from the wireless communication circuit to the conductive coating.

[0121] According to an embodiment, the antenna radiator may further include: a second adhesive layer (e.g., second adhesive layer 765) between the first adhesive layer and the conductive fabric layer; and a polymer compound layer (e.g., polymer compound layer 764) between the first adhesive layer and the second adhesive layer.

[0122] According to an embodiment, the at least one conductive fabric layer may include a first conductive fabric layer (e.g., first conductive fabric layer 762) and a second conductive fabric layer (e.g., second conductive fabric layer 767). The antenna radiator may further include: a first adhesive layer configured to attach the antenna radiator to a mounting target within the housing; a conductive coating configured to transmit signals from the wireless communication circuit to the at least one conductive fabric layer; and a second adhesive layer interposed between the first and second conductive fabric layers. The second conductive fabric layer may be interposed between the conductive coating and the second adhesive layer.

[0123] According to an embodiment, the antenna radiator may further include a primer coating configured to prevent damage to the antenna radiator when an object in contact with the top surface of the antenna radiator detaches, and the conductive coating may be interposed between the primer coating and the second conductive fabric layer.

[0124] According to an embodiment, the antenna radiator may further include: a third adhesive layer interposed between the first conductive fabric layer and the first adhesive layer; and a polymer compound layer interposed between the first adhesive layer and the third adhesive layer.

[0125] According to an embodiment, the second adhesive layer may include conductive powder.

[0126] According to an embodiment, the shape of the first conductive textile layer and / or the shape of the second conductive textile layer may be the same as the shape of the outline of the antenna radiator.

[0127] According to an embodiment, the electronic device may further include: a bracket (e.g., first support member 430) interposed between the first and second boards; and a rear case (e.g., second support member 471) interposed between the bracket and the second board. The antenna radiator may be attached to a side of the rear case facing the bracket.

[0128] According to an embodiment, the electronic device may further include: a bracket interposed between the first board and the second board; and a rear case interposed between the bracket and the second board. The antenna radiator may be attached to a side of the rear case facing the second board.

[0129] According to an embodiment, the electronic device may further include: a printed circuit board (e.g., printed circuit board 450) on which a wireless communication circuit is mounted; a feeding portion that is provided on the printed circuit board and connected to the wireless communication circuit; a grounding portion that is connected to a grounding area included in the printed circuit board; and at least one connecting member (e.g., connecting member 731 or a C-clip) that connects a point on the antenna radiator to the feeding portion or the grounding portion.

[0130] According to an embodiment, an antenna radiator may include: at least one conductive fabric layer comprising a fabric plated with at least one metal; and a conductive coating stacked on the at least one conductive fabric layer and configured to prevent corrosion of the at least one conductive fabric layer and transmit electrical signals outside the antenna radiator to the at least one conductive fabric layer.

[0131] According to an embodiment, the antenna radiator may further include a polymer compound layer stacked under the at least one conductive fabric layer.

[0132] According to an embodiment, the antenna radiator may further include a primer coating layer stacked on the conductive coating layer and configured to prevent damage to the antenna radiator when an object in contact with the top surface of the antenna radiator is detached. The primer coating layer may include a conductive powder to conduct electricity to transmit an electrical signal to the conductive coating layer.

[0133] According to an embodiment, the at least one conductive fabric layer may include a first conductive fabric layer and a second conductive fabric layer stacked on the first conductive fabric layer. The antenna radiator may further include: a first adhesive layer stacked below the polymer compound layer; a second adhesive layer interposed between the polymer compound layer and the first conductive fabric layer; and a third adhesive layer interposed between the first conductive fabric layer and the second conductive fabric layer. The third adhesive layer may include conductive powder to conduct electricity and electrically connect the first conductive fabric layer to the second conductive fabric layer.

[0134] According to an embodiment, the first conductive fabric layer and the second conductive fabric layer may have the same thickness.

[0135] According to an embodiment, the first conductive fabric layer and the second conductive fabric layer may have different thicknesses.

[0136] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0137] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish corresponding components from another component, and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., a second element)”, “combined to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0138] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, depending on an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0139] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to be operable to perform at least one function according to the called at least one instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0140] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0141] According to various embodiments, each component (for example, module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (for example, module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0142] According to one or more embodiments disclosed herein, it is possible to maintain performance and prevent degradation over time of an antenna attached to a curved portion of an electronic device. This can be accomplished by using fabric.

[0143] According to one or more embodiments disclosed in the specification, when an antenna radiator is made of fabric, the entire antenna attachment area may be used as an antenna pattern.

[0144] Furthermore, various effects and advantages directly or indirectly understood through the present disclosure can be provided.

[0145] While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, comprising: case; a first plate located on a front surface of the housing; a second plate located on a rear surface of the housing; an antenna radiator, the antenna radiator being interposed between the first plate and the second plate; as well as a wireless communication circuit connected to the antenna radiator and configured to process signals in a specific frequency band, wherein the antenna radiator comprises at least one conductive fabric layer, a conductive coating and a primer coating, wherein the at least one conductive fabric layer comprises a fabric plated with at least one metal, so that the at least one conductive fabric layer has a resistance characteristic suitable for transmitting or receiving signals in the specific frequency band; wherein the conductive coating is configured to prevent the at least one conductive fabric layer from being corroded and transmit the signal in the specific frequency band to the at least one conductive fabric layer, and the conductive coating is interposed between the primer coating and the at least one conductive fabric layer, wherein the primer coating is configured to prevent damage to the antenna radiator when an object in contact with the top surface of the antenna radiator is detached, and The primer coating includes conductive powder to conduct electricity, so as to transmit the signal in the specific frequency band to the conductive coating.

2. The electronic device according to claim 1, wherein The threads included in the fabric are alternately plated with copper and nickel.

3. The electronic device according to claim 1, wherein The antenna radiator further comprises: a first adhesive layer configured to attach the antenna radiator to a mounting target within the housing, Wherein, the at least one conductive fabric layer is located between the conductive coating and the first adhesive layer.

4. The electronic device according to claim 3, wherein The antenna radiator further comprises: a second adhesive layer interposed between the first adhesive layer and the conductive fabric layer; and A polymer compound layer is interposed between the first adhesive layer and the second adhesive layer.

5. The electronic device according to claim 1, wherein The at least one conductive fabric layer further comprises a first conductive fabric layer and a second conductive fabric layer, Wherein, the antenna radiator further includes: a first adhesive layer configured to attach the antenna radiator to a mounting target within the housing; and a second adhesive layer, the second adhesive layer being interposed between the first conductive fabric layer and the second conductive fabric layer; The second conductive fabric layer is located between the conductive coating and the second adhesive layer. The electronic device according to claim 5 , wherein: The conductive coating is interposed between the primer coating and the second conductive fabric layer.

7. The electronic device according to claim 5, wherein: The antenna radiator further comprises: a third adhesive layer, the third adhesive layer being interposed between the first conductive fabric layer and the first adhesive layer; and A polymer compound layer is interposed between the first adhesive layer and the third adhesive layer.

8. The electronic device according to claim 5, wherein: The second adhesive layer further includes conductive powder.

9. The electronic device according to claim 5, wherein: The shape of the first conductive textile layer and / or the shape of the second conductive textile layer is the same as the shape of the outline of the antenna radiator.

10. The electronic device according to claim 1, further comprising: a bracket, the bracket being interposed between the first plate and the second plate; as well as a rear shell, the rear shell being interposed between the bracket and the second plate, The antenna radiator is attached to a side of the rear cover facing the bracket.

11. The electronic device according to claim 1, further comprising: a bracket, the bracket being interposed between the first plate and the second plate; as well as a rear shell, the rear shell being interposed between the bracket and the second plate, The antenna radiator is attached to a side of the rear case facing the second board.

12. The electronic device according to claim 1, further comprising: a printed circuit board, on which the wireless communication circuit is mounted; a feeding portion, the feeding portion being provided on the printed circuit board and connected to the wireless communication circuit; a ground portion connected to a ground area included in the printed circuit board; as well as At least one connecting member connects one point on the antenna radiator to the feeding portion or the ground portion.

13. An antenna radiator, comprising: at least one conductive textile layer, the at least one conductive textile layer comprising textile plated with at least one metal; a conductive coating layer stacked on the at least one conductive fabric layer and configured to prevent the at least one conductive fabric layer from being corroded and to transmit an electrical signal external to the antenna radiator to the at least one conductive fabric layer; as well as a primer coating configured to prevent damage to the antenna radiator when an object in contact with a top surface of the antenna radiator is released, wherein the conductive coating is between the primer coating and the at least one conductive fabric layer, and The primer coating includes conductive powder to conduct electricity, so as to transmit signals in a specific frequency band to the conductive coating.

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