A substrate heating component

Abstract

The present invention relates to the technical field of integrated circuit chip manufacturing, and discloses a substrate heating component. The heating component includes a heating plate, a wiring seat and a wiring probe, wherein the lower surface of the heating plate is provided with a plurality of wire outlet holes; the wiring seat is provided below the heating plate, and there is a gap between the wiring seat and the heating plate; the wiring probe is elastically installed in the wiring seat, and one end of the wiring probe is elastically abutted against the wire outlet hole of the heating plate. Since the present invention does not have a power line or a sensor line fixed to the back of the heating plate, it is very convenient to disassemble and assemble; and the wiring probe is fixed to the wire outlet hole on the heating plate in a manner that the elastic force of the elastic member is in close contact, and there is no risk of wire breakage; during transportation, the heating plate can be packaged and transported separately without affecting the assembly of the overall circuit; at the same time, this fixing method avoids the situation where the heating plate is broken, and effectively protects the heating plate.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit chip manufacturing, and in particular to a substrate heating component. Background Art

[0002] Currently, semiconductor substrate processing requires frequent use of substrate baking units. During this process, the industry is increasingly using ceramic heating plates as substrate heating elements. While ceramic heating plates offer advantages such as good thermal conductivity, thinness, and rapid temperature ramping, they also suffer from fragility, difficulty securing, and inconveniently securing the leads of resistance heating wires and temperature sensors. These shortcomings complicate installation and securing of ceramic heating plates, significantly limiting their application.

[0003] Therefore, there is an urgent need for a substrate heating assembly that can safely and conveniently realize the installation and removal of the heating plate to solve the above problems. Summary of the Invention

[0004] The object of the present invention is to provide a substrate heating assembly that can safely, conveniently and quickly realize the installation and removal of a heating plate.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A substrate heating assembly comprises a heating plate, a wiring seat and a wiring probe, wherein the lower surface of the heating plate is provided with a plurality of wire outlet holes; the wiring seat is arranged below the heating plate, with a gap between the wiring seat and the heating plate; the wiring probe is elastically mounted in the wiring seat, with one end of the wiring probe elastically abutting against the wire outlet hole of the heating plate.

[0007] As a preferred solution of the substrate heating assembly, it also includes a support ring, the heating plate is fixed to the upper end of the support ring, a groove is provided on the support ring, an insulation ring is fixed in the groove, the height of the insulation ring is higher than the groove, and the upper end of the insulation ring is in contact with the lower surface of the heating plate to form a gap between the heating plate and the support ring.

[0008] As a preferred solution of a substrate heating assembly, it also includes an air inlet plate and an air outlet plate fixed on the support ring, the air outlet plate is located below the heating plate, the air inlet plate is located below the air outlet plate, and the terminal block is fixed on the air outlet plate.

[0009] As a preferred solution of a substrate heating assembly, a groove is provided on the upper end of the air inlet plate for introducing cooling gas; an air outlet is provided on the air outlet plate for discharging cooling gas, and the groove is connected to the air outlet.

[0010] As a preferred solution of a substrate heating assembly, the wiring probe is fixed in a probe sleeve, a countersunk hole is provided on the wiring seat, and the probe sleeve is inserted into the countersunk hole.

[0011] As a preferred solution of the substrate heating assembly, a positioning boss having a diameter larger than that of the countersunk hole is provided on the outside of the probe sleeve, and the probe sleeve is installed in the countersunk hole through the positioning boss.

[0012] As a preferred solution of the substrate heating assembly, it further includes a lower sealing plate, which is fixed to the lower end of the support ring, and one end of the probe sleeve passes through the lower sealing plate.

[0013] As a preferred solution of the substrate heating assembly, it also includes an upper cover heating element. The periphery of the support ring is provided with an annular protrusion with a diameter larger than that of the heating plate. The annular protrusion is used to cooperate with the upper cover heating element to form a sealed heating cavity.

[0014] As a preferred solution of the substrate heating assembly, the heating plate is a ceramic heating plate, and the heating plate is fixed to the support ring by non-metallic screws.

[0015] As a preferred solution of a substrate heating assembly, the materials of the wiring seat and the thermal insulation ring are both high-temperature resistant non-metallic materials.

[0016] The beneficial effects of the present invention are:

[0017] 1) Because there are no power cords or sensor wires fixed to the back of the heating plate, the heating plate is very easy to assemble and disassemble. The wiring probe is fixed to the outlet terminal in the outlet hole of the heating plate through elastic force, eliminating the risk of wire breakage. During transportation, the heating plate can be packaged and transported separately without affecting the assembly of the entire circuit. At the same time, this fixing method prevents the heating plate from breaking, effectively protecting the heating plate. This heating assembly has played a significant role in increasing the production capacity of semiconductor equipment, improving the safety and reliability of the heated substrate, and reducing the workload of maintenance personnel.

[0018] 2) During the process of heating and baking the substrate, the heat insulating ring of the heating plate of the present invention can effectively isolate the heating plate from the surrounding metal structure, thereby ensuring temperature uniformity during the heating process and reducing heat dissipation.

[0019] 3) The air outlet plate of the present invention is provided with air outlet holes for fixing the terminal block, which can quickly cool down the heating plate when cooling is required; the grooves arranged inside the air inlet plate can allow the cooling gas to enter the back of the heating plate more evenly, so that the heating plate is cooled evenly and the risk of use is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without any creative work.

[0021] Figure 1 is a top view of a substrate heating assembly provided by an embodiment of the present invention;

[0022] Figure 2 yes Figure 1 A cross-sectional view of the middle baseplate heating assembly along the AA direction;

[0023] Figure 3 yes Figure 2 A partial enlarged view of point B in the middle;

[0024] Figure 4 yes Figure 2 A partial enlarged view of point C in the middle;

[0025] Figure 5 is a three-dimensional diagram of a substrate heating assembly provided by an embodiment of the present invention without a heating plate;

[0026] Figure 6 This is a three-dimensional diagram of a substrate heating assembly provided by an embodiment of the present invention without the heating plate and the gas outlet plate;

[0027] Figure 7 It is a bottom view of the substrate heating assembly provided by an embodiment of the present invention.

[0028] In the picture:

[0029] 1-heating plate; 2-terminal block; 21-counterbore; 3-terminal probe; 4-probe sleeve; 41-positioning boss; 5-support ring; 51-annular protrusion; 6-insulation ring; 7-air inlet plate; 71-groove; 8-air outlet plate; 81-air outlet hole; 9-lower sealing plate. DETAILED DESCRIPTION

[0030] To make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present invention more clearly understood, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It is apparent that the described embodiments are only some of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0031] like Figure 1-Figure 7As shown, this embodiment provides a substrate heating assembly to solve the problems that the heating plate in the substrate baking unit is difficult to fix, inconvenient to assemble and disassemble, and prone to breakage.

[0032] Figure 1 is a top view of a substrate heating assembly provided by an embodiment of the present invention, Figure 2 yes Figure 1 Cross-sectional view along AA direction. Figure 1-Figure 2 As shown, the substrate heating assembly includes a heating plate 1, a terminal block 2, a terminal probe 3, and a support ring 5. The heating plate 1 is internally provided with heating elements such as resistance wires for heating the substrate. The lower end surface of the heating plate 1 is provided with several wire outlet holes, each containing a terminal for connecting to a power source. The heating plate 1 is preferably a ceramic heating plate to improve its thermal conductivity and achieve efficient heating of the substrate. The support ring 5 is an annular structure, with the heating plate 1 fixed to the upper end of the support ring 5. Preferably, the heating plate 1 is fixed to the support ring 5 via non-metallic screws to reduce heat loss and improve heating efficiency. The terminal block 2 is located within the support ring 5 and is made of a high-temperature resistant non-metallic material. A large gap is provided between the upper end of the terminal block 2 and the lower end of the heating plate 1 to facilitate assembly and disassembly. The terminal probe 3 is mounted within the terminal block 2. An elastic member is provided within the terminal probe 3, and one end of the terminal probe 3 is in close contact with the terminal in the wire outlet hole of the heating plate 1 due to the elastic force of the elastic member. Preferably, the elastic member here is a spring, and the wiring probe 3 is pressed against the wire outlet hole on the heating plate 1 by the elastic force generated by the deformation of the spring, thereby achieving circuit conduction.

[0033] During disassembly and installation, the heating plate 1 of the present invention is very convenient because no power cord or sensor wire is fixed to the back of the heating plate 1. The wiring probe 3 is fixed to the outlet terminal in the outlet hole of the heating plate 1 by the elastic force of an elastic member, eliminating the risk of wire breakage. During transportation, the heating plate 1 can be packaged and transported separately without affecting the assembly of the entire circuit. At the same time, this fixing method prevents the heating plate 1 from breaking, effectively protecting the heating plate 1. This heating assembly has played a significant role in increasing the production capacity of semiconductor equipment, improving the safety and reliability of substrate heating, and reducing the workload of maintenance personnel.

[0034] It should be noted that the wire outlet of the present invention can be set in the central area of the lower end of the heating plate 1, or in the surrounding area or edge area near the center of the heating plate 1. Accordingly, the installation position of the wiring seat 2 is determined by the position of the wire outlet, so as to achieve the purpose of tightly connecting the wiring probe 3 to the wire outlet. Preferably, in this embodiment, a plurality of wire outlet holes arranged in an annular pattern are evenly arranged in the central area of the heating plate 1, and the wiring seat 2 is installed below the wire outlet holes. The wiring seat 2 is installed with a plurality of wiring probes 3 arranged in an annular pattern.

[0035] Figure 3 yes Figure 2 The local enlarged view of point B in the middle is as follows: Figure 3 As shown, the support ring 5 is also provided with a groove, in which a heat-insulating ring 6 is fixed. The height of the heat-insulating ring 6 is higher than the groove, and the upper end of the heat-insulating ring 6 contacts the lower surface of the heating plate 1, so that a gap is formed between the heating plate 1 and the support ring 5. The height of the gap is preferably 0.5 mm. In this embodiment, the heat-insulating ring 6 is made of a high-temperature resistant non-metallic material. The heat-insulating ring 6 is fixed to the support ring 5 by non-metallic screws, so that the heating plate 1 does not contact the metal, which can effectively reduce the heat dissipation and uneven heating of the substrate during the heating process.

[0036] Continue to refer to Figure 2 , an air inlet plate 7 and an air outlet plate 8 are also provided in the support ring 5, which are used to air-cool the heating plate 1. The air outlet plate 8 is located below the heating plate 1, and the air inlet plate 7 is located below the air outlet plate 8. The air inlet plate 7 and the air outlet plate 8 are both fastened to the support ring 5 by screws. Furthermore, the terminal block 2 is fixed on the air outlet plate 8, and a large gap is formed between the upper end of the terminal block 2 and the lower end of the heating plate 1, which facilitates the rapid disassembly and assembly of the heating plate 1. Similarly, the terminal block 2 here can be set at the center position of the air outlet plate 8, or it can be set in the surrounding area of the air outlet plate 8, as long as the wiring probe 3 is tightly docked with the wire outlet hole on the heating plate 1.

[0037] Figure 5 This is a three-dimensional diagram of the substrate heating assembly provided by an embodiment of the present invention without the heating plate 1. Figure 6 This is a three-dimensional diagram of the substrate heating assembly provided by the embodiment of the present invention without the heating plate 1 and the gas outlet plate 8. Figure 5 and Figure 6 The upper end of the air inlet plate 7 is provided with a plurality of grooves 71 for introducing cooling gas; the air outlet plate 8 is provided with a plurality of air outlet holes 81, which are connected to the grooves 71 for discharging the cooling gas. When the air inlet plate 7 contacts the air outlet plate 8, the grooves 71 are in a sealed state, and the cooling gas can be sprayed from the air outlet holes 81 on the air outlet plate 8 to the heating plate 1, thereby cooling the heating plate 1. Here, the grooves 71 are preferably annular grooves. This setting can achieve rapid cooling of the heating plate 1 when cooling is required; at the same time, it can make the cooling gas blown into the lower end surface of the heating plate 1 more evenly, so that the heating plate 1 is cooled evenly and the use risk is reduced.

[0038] Figure 4 yes Figure 2 The enlarged view of the part at C in the middle, see Figure 2 、 Figure 4 and Figure 5A probe sleeve 4 is provided on the outside of the wiring probe 3, and the wiring probe 3 is fixed in the probe sleeve 4. A plurality of countersunk holes 21 arranged in a ring are evenly provided in the central area of the wiring base 2, and the lower end of the probe sleeve 4 is inserted and fixed in the corresponding countersunk holes 21. Specifically, a positioning boss 41 with a diameter larger than the above-mentioned countersunk hole 21 is provided on the outer edge of the upper end of the probe sleeve 4. The probe sleeve 4 is installed in the countersunk hole 21 through the positioning boss 41. This structure can prevent the probe sleeve 4 from falling off from the countersunk hole 21 of the wiring base 2, thereby improving the reliability of the heating component.

[0039] Figure 7 FIG. 1 is a bottom view of a substrate heating assembly provided by an embodiment of the present invention. Figure 2 and Figure 7 As shown, the heating assembly also includes a lower sealing plate 9, which is fixed to the lower end of the support ring 5, and one end of the probe sleeve 4 passes through the lower sealing plate 9. By setting the lower sealing plate 9, this embodiment can seal the heating plate 1, the terminal block 2, the air inlet plate 7, the air outlet plate 8 and other structures in the heating assembly, effectively reducing heat loss. Furthermore, the heating assembly also includes an upper cover heating element. Figure 2 and Figure 3 As shown, the outermost circle of the upper end of the support ring 5 is also provided with a ring-shaped protrusion 51 with a diameter larger than that of the heating plate 1. When the substrate baking unit is working, the ring-shaped protrusion 51 can cooperate with the upper cover heating element to form a sealed heating cavity, effectively improving the heating efficiency of the substrate and the uniformity of the heating temperature, while reducing the outward diffusion of organic solvents.

[0040] The present invention effectively improves the convenience of installation and replacement of ceramic heating plates, improves the temperature uniformity of substrate heating, and increases the heating and cooling rates of the substrate.

[0041] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A substrate heating assembly, characterized in that: include: A heating plate (1), wherein a plurality of wire outlet holes are provided on the lower surface of the heating plate (1); A wiring seat (2) is provided below the heating plate (1), with a gap between the wiring seat (2) and the heating plate (1); A wiring probe (3) is elastically mounted in the wiring seat (2), and one end of the wiring probe (3) elastically abuts against the wire outlet hole of the heating plate (1); It also includes a support ring (5), the heating plate (1) is fixed to the upper end of the support ring (5), the support ring (5) is provided with a groove, an insulation ring (6) is fixed in the groove, the height of the insulation ring (6) is higher than the groove, and the upper end of the insulation ring (6) is in contact with the lower surface of the heating plate (1), so that a gap is formed between the heating plate (1) and the support ring (5); It also includes an air inlet plate (7) and an air outlet plate (8) fixed on the support ring (5), the air outlet plate (8) is located below the heating plate (1), the air inlet plate (7) is located below the air outlet plate (8), and the terminal block (2) is fixed on the air outlet plate (8); The upper end of the air inlet plate (7) is provided with a groove (71) for introducing cooling gas; the air outlet plate (8) is provided with an air outlet hole (81) for discharging cooling gas, and the groove (71) is communicated with the air outlet hole (81); It also includes an upper cover heating element, and the periphery of the support ring (5) is provided with an annular protrusion (51) with a diameter larger than that of the heating plate (1), and the annular protrusion (51) is used to cooperate with the upper cover heating element to form a sealed heating cavity; The heating plate (1) is a ceramic heating plate, and the heating plate (1) is fixed to the support ring (5) by non-metallic screws.

2. The substrate heating assembly according to claim 1, wherein: The wiring probe (3) is fixed in the probe sleeve (4); a countersunk hole (21) is provided on the wiring seat (2); and the probe sleeve (4) is inserted into the countersunk hole (21).

3. The substrate heating assembly according to claim 2, wherein: The outside of the probe sleeve (4) is provided with a positioning boss (41) having a diameter larger than that of the countersunk hole (21), and the probe sleeve (4) is installed in the countersunk hole (21) via the positioning boss (41).

4. The substrate heating assembly according to claim 3, wherein: It also includes a lower sealing plate (9), which is fixed to the lower end of the support ring (5), and one end of the probe sleeve (4) passes through the lower sealing plate (9).

5. The substrate heating assembly according to claim 1, wherein: The materials of the wiring seat (2) and the heat insulation ring (6) are both high-temperature resistant non-metallic materials.

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