LED Driver Power Supply IC Packaging Structure and Its Preparation Method

Abstract

This application relates to an LED driver power supply IC packaging structure and a preparation method thereof. The packaging structure includes: a substrate, a chip select pin, a ground pin, a drain pin, a high-voltage power supply pin, an LED driver chip, a diode, a first base island, and a second base island disposed on the substrate; the LED driver chip is disposed on the surface of the first base island; the diode is disposed on the surface of the second base island; the high-voltage input pin of the LED driver chip is electrically connected to the high-voltage power supply pin, the chip select pin of the LED driver chip is electrically connected to the chip select pin, the drain pin of the LED driver chip is electrically connected to the drain pin, and the ground pin of the LED driver chip is electrically connected to the ground pin; the anode terminal of the diode is electrically connected to the drain pin, and the cathode terminal of the diode is electrically connected to the high-voltage power supply pin. While improving the integration and performance of the LED driver power supply IC packaging structure, this application ensures that the product has a small form factor.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor devices, and particularly to an LED driving power supply IC packaging structure and a preparation method thereof. Background Art

[0002] With the development trend of the LED market, the demands of end customers tend to be diversified, and at the same time, the peripheral application circuits are becoming simpler. Therefore, designers need to design LED driving power supply integrated circuits (ICs) with better performance, smaller form factors, and higher integration levels.

[0003] Currently, when designing LED driving power supplies, end customers generally select different packaging forms and different power LED driving circuits according to the power and current output to the load. If circuit components are added, it will not only lead to an increase in the structure of the printed circuit board (PCB) or the driver on board (DOB) during terminal design and an increase in the chip mounting process, but also increase the material cost and the corresponding labor cost. In order to adapt to the development of LED driving power supplies and improve market competitiveness, the existing LED driving chips are improved in terms of structure and performance to provide a new type of LED driving power supply IC with better performance, smaller form factors, and higher integration levels. Summary of the Invention

[0004] Based on this, it is necessary to provide a new type of LED driving power supply IC packaging structure and a preparation method thereof for the technical problems in the above background art, which have better performance, smaller form factors, and higher integration levels.

[0005] The first aspect of this application provides an LED driving power supply IC packaging structure, including:

[0006] A substrate, and a chip select pin, a ground pin, a drain pin, a high-voltage power supply pin, an LED driving chip, a diode, a first base island, and a second base island disposed on the substrate;

[0007] The LED driving chip is disposed on the first base island; the diode is disposed on the second base island;

[0008] The high-voltage input pin of the LED driving chip is electrically connected to the high-voltage power supply pin, the chip select pin of the LED driving chip is electrically connected to the chip select pin, the drain pin of the LED driving chip is electrically connected to the drain pin, and the ground pin of the LED driving chip is electrically connected to the ground pin;

[0009] The anode terminal of the diode is electrically connected to the drain pin, and the cathode terminal of the diode is electrically connected to the high-voltage power supply pin. Both the first base island and the second base island are located in the middle of the substrate, and the second base island is adjacent to the first base island, the high-voltage power supply pin, and the drain pin.

[0010] In the LED driver power IC packaging structure of the above embodiment, since a diode is integrated, and the anode terminal of the diode is electrically connected to the drain pin of the LED driver chip, and the cathode terminal of the diode is electrically connected to the high-voltage input pin of the LED driver chip, the driving circuit designed by using the LED driver chip is simpler, and the LED driver power IC packaging structure has the function of a freewheeling diode. Without adding a diode, the peripheral circuit has the function of freewheeling; while improving the integration and performance of the LED driver power IC packaging structure, the external dimension of the product is not increased.

[0011] In one embodiment, the diode is an N-type substrate, and the front surface of the diode includes an anode electrode.

[0012] In one embodiment, the front of the diode is the surface away from the second base island, so that the surface of the diode away from the substrate is the anode, in order to shorten the distance of the conductive channel between the anode terminal of the diode and the drain pin of the LED driver chip.

[0013] In one embodiment, the anode electrode includes an aluminum electrode or a silver electrode, so as to electrically connect the anode terminal on the front of the diode to the drain pin of the LED driver chip, and electrically connect the cathode terminal on the back of the diode to the high-voltage power supply pin, thereby ensuring that the LED driver power IC packaging structure integrated with the diode has a smaller external dimension while integrating the diode to improve the performance and integration of the LED driver power IC packaging structure.

[0014] In one embodiment, the LED driver chip is electrically connected to the first base island through a dielectric or eutectic; and / or

[0015] The diode is electrically connected to the second base island through a dielectric or eutectic.

[0016] In one embodiment, the drain pin is electrically connected to the anode terminal of the diode through a conductive wire; and / or

[0017] The chip select pin is electrically connected to the chip select pin through a conductive wire.

[0018] In one embodiment, the conductive metal in the conductive wire is copper.

[0019] In one embodiment, the diameter of the conductive wire is 0.0014 mm - 0.0026 mm.

[0020] In one embodiment, the high-voltage power supply pin of the LED driving chip is directly connected to the first base island to improve the heat dissipation performance.

[0021] The second aspect of the present application provides an LED driving power supply chip, including:

[0022] The LED driving power supply IC packaging structure according to any embodiment of the present application; and

[0023] An insulating housing for sealing the LED driving power supply IC packaging structure.

[0024] In one embodiment, the insulating housing includes epoxy resin and silicon dioxide.

[0025] In one embodiment, the insulating housing is rectangular, and the side length of the rectangle is 2.5 mm - 2.7 mm.

[0026] The third aspect of the present application provides a method for manufacturing an LED driving power supply IC packaging structure, including:

[0027] Provide a substrate;

[0028] Form a first base island and a second base island in the middle of the first surface of the substrate, and the second base island is adjacent to the first base island;

[0029] Fix the LED driving chip on the surface of the first base island away from the substrate by using a die bonding process, and fix the diode on the surface of the second base island away from the substrate to form a first semi-finished product;

[0030] Place the first semi-finished product in an environment protected by vacuum and nitrogen, and bake it at a preset temperature for a preset time to form a second semi-finished product;

[0031] Form a chip select pin, a ground pin, a drain pin and a high-voltage power supply pin at the edge of the first surface of the substrate;

[0032] Use a bonding process to electrically connect the chip select pin of the LED driving chip to the chip select pin, electrically connect the ground pin of the LED driving chip to the ground pin, electrically connect the cathode terminal of the diode to the high-voltage input pin of the LED driving chip, and electrically connect the anode terminal of the diode to the drain pin of the LED driving chip.

[0033] In the method for preparing the LED driving power supply IC packaging structure in the above embodiments, a diode is integrated in the fabricated LED driving power supply IC packaging structure. The anode terminal of the diode is electrically connected to the drain pin of the LED driving chip, and the cathode terminal of the diode is electrically connected to the high-voltage input pin of the LED driving chip, so that the driving circuit designed by using the LED driving chip is simpler. Moreover, the LED driving power supply IC packaging structure has the function of a freewheeling diode, enabling the peripheral circuit to have the freewheeling function without adding a diode. While improving the integration and performance of the LED driving power supply IC packaging structure, the external dimensions of the product are not increased.

[0034] A fourth aspect of the present application provides a method for preparing an LED driving power supply chip, including:

[0035] Preparing an LED driving power supply IC packaging structure based on the method for preparing the LED driving power supply IC packaging structure as described in any one of the embodiments of the present application; and

[0036] Forming a plastic housing on the outside of the LED driving power supply IC packaging structure by using a plastic encapsulation process to seal the LED driving power supply IC packaging structure.

[0037] In one embodiment, during the process of forming a plastic housing on the outside of the LED driving power supply IC packaging structure by using a plastic encapsulation process, the surface temperature of the mold is controlled at 175 ± 10 °C, the surface temperature of the preheating table is controlled at 160 ± 10 °C, the clamping pressure is controlled at 9 MPa - 16 MPa, the injection pressure is controlled at 5 MPa - 8 MPa, the actual injection time is controlled at 10 s - 15 s, and the curing time is controlled at 110 s / mold - 120 s / mold.

[0038] In the method for preparing the LED driving power supply chip in the above embodiments, the LED driving power supply IC packaging structure is sealed by the plastic housing, avoiding adverse effects on the circuit elements in the LED driving power supply chip caused by dust, waste gas, water vapor, etc. on the outside, and effectively improving the working stability and service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0040] Figure 1 FIG. is a schematic structural diagram of an LED driving power supply IC packaging structure provided in the first embodiment of the present application.

[0041] Figure 2 This is a schematic structural diagram of an LED driver power supply IC packaging structure provided in the second embodiment of the present application.

[0042] Figure 3 This is a front view schematic diagram of an LED driver power supply chip provided in the third embodiment of the present application.

[0043] Figure 4 It is Figure 3 a top view schematic diagram of the LED driver power supply chip schematically shown in

[0044] Figure 5 It is Figure 3 a left view schematic diagram of the LED driver power supply chip schematically shown in

[0045] Figure 6 This is a schematic diagram of the principle of a driving circuit of an LED driver power supply chip provided in the fourth embodiment of the present application.

[0046] Figure 7 This is a schematic flow chart of a method for manufacturing an LED driver power supply IC packaging structure provided in the fifth embodiment of the present application.

[0047] Figure 8 This is a schematic flow chart of a method for manufacturing an LED driver power supply chip provided in the sixth embodiment of the present application. Detailed implementation manners

[0048] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0050] When using "including", "having", and "comprising" described herein, unless a clear limiting term is used, such as "only", "consisting of", etc., another component can also be added. Unless otherwise mentioned, terms in the singular form can include the plural form and should not be construed as having a quantity of one.

[0051] In this application, unless otherwise clearly specified and defined, terms such as "installed", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] It should be understood that although terms such as "first" and "second" can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present invention, the first element can be called the second element, and similarly, the second element can be called the first element.

[0053] As Figure 1 shown, in an LED driver power supply IC packaging structure provided in an embodiment of the present application, in a first aspect of the present application, an LED driver power supply IC packaging structure is provided, including a substrate 100 and a high-voltage power supply pin 10, a drain pin 20, a ground pin 30, a chip select pin 40, a first base island 50, a second base island 60, an LED driver chip 70, and a diode 80 disposed on the substrate 100; the LED driver chip 70 is disposed on the surface of the first base island 50 away from the substrate 100; the diode 80 is disposed on the surface of the second base island 60 away from the substrate 100; the high-voltage input pin 71 of the LED driver chip 70 is electrically connected to the high-voltage power supply pin 10, the drain pin 72 of the LED driver chip 70 is electrically connected to the drain pin 20, the ground pin 73 of the LED driver chip 70 is electrically connected to the ground pin 30, and the chip select pin 74 of the LED driver chip 70 is electrically connected to the chip select pin ;the anode terminal 81 of the diode 80 is electrically connected to the drain pin 20, and the cathode terminal of the diode 80 ( Figure 1 not shown in the figure) is electrically connected to the high-voltage power supply pin 10; both the first base island 50 and the second base island 60 are located in the middle of the substrate 100, and the second base island 60 is adjacent to the first base island 50, the high-voltage power supply pin 10, and the drain pin 20.

[0054] Specifically, in the LED driver power supply IC packaging structure of the above embodiments, since the diode 80 is integrated, and the anode terminal 81 of the diode 80 is electrically connected to the drain pin 72 of the LED driver chip 70, and the cathode terminal of the diode 80 is electrically connected to the high-voltage input pin 71 of the LED driver chip 70, the diode 80 is connected in parallel between the voltage input port and the voltage output port of the LED driver power supply IC packaging structure, which can avoid the situation that the LED driver chip 70 in the LED driver power supply IC packaging structure is reversely broken down due to the reverse input voltage, and can also play a role in freewheeling, significantly improving the integration and performance of the LED driver power supply IC packaging structure. Since the first base island 50 and the second base island 60 are both located in the middle of the substrate 100, and the second base island 60 is arranged adjacent to the first base island 50, the high-voltage power supply pin 10 and the drain pin 20, the conductive path between the LED driver chip 70 and the diode 80 can be reduced, so as to reduce the parasitic capacitance of the conductive line and improve the stability of signal transmission, and avoid a large increase in the external dimension of the LED driver power supply IC packaging structure due to the addition of the diode. Without adding a diode to the driving circuit using the LED driver power supply IC packaging structure of the present application, the driving circuit has the function of freewheeling, while improving the integration and performance of the LED driver power supply IC packaging structure, without increasing the external dimension of the product.

[0055] Further, in an LED driver power supply IC packaging structure provided in an embodiment of the present application, please continue to refer to Figure 1 , the diode 80 is an N-type substrate, and the front surface of the diode includes an aluminum electrode or a silver electrode, so as to electrically connect the anode terminal 81 on the front of the diode 80 to the drain pin 72 of the LED driver chip 70, and electrically connect the cathode terminal on the back of the diode 80 to the high-voltage power supply pin 10, so as to ensure that the LED driver power supply IC packaging structure integrated with the diode has a small external dimension while integrating the diode 80 to improve the performance and integration of the LED driver power supply IC packaging structure.

[0056] Further, in an LED driver power supply IC packaging structure provided in an embodiment of the present application, please continue to refer to Figure 1 , the front of the diode 80 is the surface away from the second base island 60, so that the surface of the diode 80 away from the substrate 100 is the anode, so as to shorten the distance of the conductive channel between the anode terminal 81 of the diode 80 and the drain pin 72 of the LED driver chip 70.

[0057] Specifically, in the preparation Figure 1In the LED driving power supply IC packaging structure shown in the figure, the fabricated LED driving chip can be attached to the substrate by eutectic bonding or dielectric bonding, i.e., the die bonding process. The die bonding process is carried out at room temperature without the need for heating or protective gas. However, after die bonding, baking is required at a temperature of 175 ± 5 °C for 2 hours, while evacuating and filling with nitrogen for protection. This can effectively reduce the area of the PCB or DOB board, and at the same time reduce the chip mounting process, achieving the purpose of reducing material and labor costs.

[0058] Preferably, in an LED driving power supply IC packaging structure provided in an embodiment of the present application, the LED driving chip is electrically connected to the first base island through a dielectric or eutectic bonding; and / or the diode is electrically connected to the second base island through a dielectric or eutectic bonding.

[0059] Preferably, in an LED driving power supply IC packaging structure provided in an embodiment of the present application, the dielectric can be a conductive adhesive, such as conductive silver adhesive.

[0060] Further, in an LED driving power supply IC packaging structure provided in an embodiment of the present application, the drain pin of the LED driving chip is electrically connected to the anode terminal of the diode through a conducting wire; and / or the chip select pin is electrically connected to the chip select pin through a conducting wire.

[0061] Further, in an LED driving power supply IC packaging structure provided in an embodiment of the present application, please refer to Figure 2 , the drain pin 72 of the LED driving chip 70 is electrically connected to the anode terminal 81 of the diode 80 through a conducting wire ( Figure 2 not shown in the figure); the chip select pin 74 of the LED driving chip 70 is electrically connected to the chip select pin 40 through a conducting wire. Bonding wires can be used to connect the corresponding electrode windows in the LED driving chip to the corresponding functional pins on the substrate. The bonding wires are preferably copper wires. In this embodiment, the conductive metal in the conducting wire can be copper.

[0062] Preferably, in an embodiment of the present application, the diameter of the conducting wire is 0.0014 mm - 0.0026 mm.

[0063] An LED driving power supply chip is provided in an embodiment of the present application, including the LED driving power supply IC packaging structure according to any embodiment of the present application, and an insulating housing for sealing the LED driving power supply IC packaging structure.

[0064] Specifically, please refer to Figure 3 、 Figure 4 and Figure 5, the insulating housing 200 includes epoxy resin and silica, and the encapsulation structure is sealed by a plastic housing 200. The high-voltage power supply pin 10, drain pin 20, ground pin 30, and chip select pin 40 disposed on the substrate all extend to the outside of the insulating housing 200.

[0065] Preferably, since the heat dissipation of the LED driving chip mainly depends on the contact area between the exposed pins and the PCB or DOB board during application, in order to improve its heat dissipation effect, the high-voltage power supply pin HV of the LED driving chip can be designed to be directly connected to the first base island. At the same time, each pin can be widened and the area of the substrate can be increased to improve the heat dissipation effect of the chip.

[0066] Preferably, in an embodiment of the present application, please continue to refer to Figure 3 , the insulating housing 200 is rectangular, and the side length l of the rectangle is 2.5 mm - 2.7 mm. For example, the side length l of the insulating housing 200 of the LED driving power supply chip can be 2.6 mm; the maximum length h of the LED driving power supply chip is 3.9 mm - 4.1 mm. For example, the maximum length h of the LED driving power supply chip can be 4.0 mm; the maximum height w of the LED driving power supply chip is 0.9 mm - 1.0 mm. For example, the maximum height w of the LED driving power supply chip can be 0.95 mm; the diameter of the conducting wire is 0.0014 mm - 0.0026 mm. For example, the diameter d of the conducting wire can be 0.0025 mm or 0.0015 mm.

[0067] Specifically, in an embodiment of the present application, the LED driving power supply chip is prepared by a plastic encapsulation process. In the plastic encapsulation process, the surface temperature of the mold is controlled at 175 ± 10°C, the surface temperature of the preheating table is controlled at 160 ± 10°C, the clamping pressure is controlled at 9 MPa - 16 MPa, the injection pressure is controlled at 5 MPa - 8 MPa, the actual injection time is controlled at 10 s - 15 s, and the curing time is controlled at 110 s / mold - 120 s / mold. After subsequent electroplating process, trimming process, and finished product testing process, the preparation of the finished LED driving power supply chip is realized, and finally the manufactured LED driving power supply chip is stored in the warehouse.

[0068] Please refer to Figure 6 , when designing an LED driving circuit using the LED driving power supply chip U provided in the embodiment of the present application, when voltage is input to the LED driving circuit via the voltage input ports Uin+ and Uin-, the inductor L1 and the capacitor C2 start to store energy. When the input voltage is zero, the inductor L1 supplies power to the load via the LED driving power supply chip U, playing a freewheeling role. Since the cathode end of the diode inside the LED driving power supply chip U is connected to the voltage input port, the situation where the driving chip in the LED driving power supply chip U is reversely broken down due to the reverse input voltage can be avoided.

[0069] Furthermore, the LED driving circuit shown in Figure 6 can be used to drive an LED lamp with a rated power of 7W, a rated voltage of 120V, and a rated current of 58.3mA. When conducting test measurements using the unimproved LED driving chip and the LED driving power supply chip in the embodiments of the present application respectively, with an input voltage of 220V, a test time of 60 minutes, and an ambient temperature of 25 degrees Celsius during the test, the test results are as shown in the following table.

[0070]

[0071] As can be seen from the above table, the LED driving power supply chip provided in the present application is the improved chip. Under the same working conditions, it can significantly improve the working efficiency of the circuit and effectively reduce the temperature on the surface of the chip. Therefore, the LED driving power supply chip provided in the present application improves the reliability of the chip and the circuit while enhancing the working efficiency of the circuit.

[0072] In a method for manufacturing an LED driving power supply IC packaging structure provided in an embodiment of the present application, as shown in Figure 7 the following steps are included:

[0073] Step 202: Provide a substrate;

[0074] Step 204: Form a first base island and a second base island in the middle of the first surface of the substrate, with the second base island adjacent to the first base island;

[0075] Step 206: Fix the LED driving chip on the surface of the first base island away from the substrate using a die bonding process, and fix the diode on the surface of the second base island away from the substrate to form a first semi-finished product;

[0076] Step 208: Place the first semi-finished product in an environment protected by vacuum and nitrogen, and bake it at a preset temperature for a preset time to form a second semi-finished product;

[0077] Step 2010: Form a chip select pin, a ground pin, a drain pin, and a high-voltage power supply pin at the edge of the first surface of the substrate;

[0078] Step 2012: Electrically connect the chip select pin of the LED driving chip to the chip select pin using a wire bonding process, electrically connect the ground pin of the LED driving chip to the ground pin, electrically connect the cathode terminal of the diode to the high-voltage input pin of the LED driving chip, and electrically connect the anode terminal of the diode to the drain pin of the LED driving chip.

[0079] Specifically, in the method for preparing the LED driving power supply IC packaging structure in the above embodiments, a diode is integrated in the manufactured LED driving power supply IC packaging structure. The anode terminal of the diode is electrically connected to the drain pin of the LED driving chip, and the cathode terminal of the diode is electrically connected to the high-voltage input pin of the LED driving chip, making the driving circuit designed by the LED driving chip simpler. And this LED driving power supply IC packaging structure has the function of a freewheeling diode, enabling the peripheral circuit to have the freewheeling function without adding a diode; while improving the integration and performance of the LED driving power supply IC packaging structure, the external dimension of the product is not increased.

[0080] Preferably, in the method for preparing the LED driving power supply IC packaging structure in the above embodiments, the manufactured chip is soldered to the frame by eutectic or dielectric, that is, the die bonding process. The die bonding process is in a normal temperature state, without the need for heating and protective gas, but baking is required after die bonding. The baking temperature is 175 ± 5 °C, the baking time is 2 hours, and at the same time, vacuum is pumped and nitrogen is added for protection. After baking, the second semi-finished product is made.

[0081] Preferably, in the method for preparing the LED driving power supply IC packaging structure in the above embodiments, bonding wires are used to connect the corresponding electrode windows in the chip to the corresponding functional pins on the frame, that is, the bonding process. The bonding process is used to electrically connect the chip select pin of the LED driving chip to the chip select pin, the ground pin of the LED driving chip to the ground pin, the cathode terminal of the diode to the high-voltage input pin of the LED driving chip, and the anode terminal of the diode to the drain pin of the LED driving chip.

[0082] In an embodiment of the present application, the bonding wire can be a copper wire.

[0083] In a method for preparing an LED driving power supply chip provided in an embodiment of the present application, as Figure 8 shown, the following steps are included:

[0084] Step 302: Provide a substrate;

[0085] Step 304: Form a first base island and a second base island in the middle of the first surface of the substrate, and the second base island is adjacent to the first base island;

[0086] Step 306: Fix the LED driving chip on the surface of the first base island away from the substrate by die bonding process, and fix the diode on the surface of the second base island away from the substrate to make the first semi-finished product;

[0087] Step 308: Place the first semi-finished product in an environment protected by vacuum and nitrogen, and bake it at a preset temperature for a preset time to form a second semi-finished product;

[0088] Step 3010: Form chip select pins, ground pins, drain pins, and high-voltage supply pins at the edge of the first surface of the substrate;

[0089] Step 3012: Use a bonding process to electrically connect the chip select pin of the LED driver chip to the chip select pin, electrically connect the ground pin of the LED driver chip to the ground pin, electrically connect the cathode of the diode to the high-voltage input pin of the LED driver chip, and electrically connect the anode of the diode to the drain pin of the LED driver chip to form an LED driver power IC package structure;

[0090] Step 3014: Use a plastic encapsulation process to form a plastic housing on the outside of the LED driver power IC package structure to seal the LED driver power IC package structure.

[0091] Specifically, in the preparation method of the LED driver power chip in the above embodiment, the LED driver power IC package structure is sealed by a plastic housing, which can prevent dust, waste gas, water vapor, etc. on the outside from having an adverse effect on the circuit elements in the LED driver power chip, and avoid the problem of large product volume caused by the introduction of the plastic housing, which can effectively improve the working stability and service life of the product.

[0092] Preferably, in the preparation method of the LED driver power chip in the above embodiment, during the process of using the plastic encapsulation process to form a plastic housing on the outside of the LED driver power IC package structure, the surface temperature of the mold is controlled at 175 ± 10 °C, the surface temperature of the preheating table is controlled at 160 ± 10 °C, the clamping pressure is controlled at 9 MPa - 16 MPa, the injection pressure is controlled at 5 MPa - 8 MPa, the actual injection time is controlled at 10 s - 15 s, and the curing time is controlled at 110 s / mold - 120 s / mold. After subsequent electroplating, trimming, and finished product testing, the finished products are warehoused.

[0093] For the specific limitations on the preparation method of the LED driver power IC package structure in the above embodiment, reference can be made to the limitations on the LED driver power IC package structure in the above text, which will not be elaborated here.

[0094] For the specific limitations on the preparation method of the LED driver power chip in the above embodiment, reference can be made to the limitations on the LED driver power chip in the above text, which will not be elaborated here.

[0095] It should be understood that although Figure 7 or Figure 8The steps in the flowchart are shown in sequence according to the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 7 or Figure 8 At least some of the steps in Figure 8 may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least some of the steps or stages in other steps or other steps.

[0096] Those of ordinary skill in the art can understand that all or part of the processes in the above-described method embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the above-described method embodiments. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in this application can include non-volatile and / or volatile memories.

[0097] Please note that the above embodiments are for illustrative purposes only and do not imply any limitation to the present invention.

[0098] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0099] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as within the scope described in this specification.

[0100] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation to the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. An LED driving power supply IC packaging structure, characterized in that, Comprising: a substrate, and a chip select pin, a ground pin, a drain pin, a high-voltage power supply pin, an LED driving chip, a diode, a first base island and a second base island arranged in a first direction provided on the substrate; the LED driving chip is provided on the first base island; the diode is provided on the second base island; the high-voltage input pin of the LED driving chip is electrically connected to the high-voltage power supply pin, the chip select pin of the LED driving chip is electrically connected to the chip select pin, the drain pin of the LED driving chip is electrically connected to the drain pin, and the ground pin of the LED driving chip is electrically connected to the ground pin; the anode terminal of the diode is electrically connected to the drain pin, and the cathode terminal of the diode is electrically connected to the high-voltage power supply pin, for freewheeling and preventing the LED driving chip from being reversely broken down due to reverse input voltage; both the first base island and the second base island are located in the middle of the substrate, and the second base island is adjacent to the first base island, the high-voltage power supply pin and the drain pin; the high-voltage power supply pin and the drain pin are located on the same first side of the first base island and the second base island; the chip select pin and the ground pin are located on the second side of the first base island and the second base island along a second direction away from the first side, and the second direction intersects with the first direction; the ground pin, the ground pin, the drain pin, and the drain pin are arranged in sequence along the second direction; the second base island, the high-voltage input pin, the ground pin, and the chip select pin are arranged in sequence along the first direction.

2. The LED driving power supply IC package structure according to claim 1, wherein, The diode is an N-type substrate, and the front surface of the diode includes an anode electrode.

3. The LED driving power supply IC package structure according to claim 2, wherein The front surface of the diode is the surface away from the second base island.

4. The LED driving power supply IC package structure according to claim 3, wherein, The anode electrode includes an aluminum electrode or a silver electrode.

5. The LED driving power supply IC package structure according to any one of claims 1-4, characterized in that, The LED driving chip is electrically connected to the first base island through a medium or eutectic; and / or The diode is electrically connected to the second base island through a medium or eutectic.

6. The LED driving power supply IC package structure according to any one of claims 1-4, characterized in that the drain pin is electrically connected to the anode terminal of the diode through a conducting wire; and / or the chip select pin is electrically connected to the chip select pin through a conducting wire.

7. The LED driving power supply IC packaging structure according to any one of claims 1-4, characterized in that, The high-voltage power supply pin of the LED driving chip is directly connected to the first base island.

8. An LED driving power supply chip, characterized in that, Comprising: The LED driving power supply IC package structure according to any one of claims 1-6; and an insulating housing for sealing the LED driving power supply IC package structure.

9. The LED driving power supply chip according to claim 8, wherein The insulating housing includes epoxy resin and silicon dioxide.

10. A method for preparing an LED driving power supply IC packaging structure, characterized in that, For preparing the LED driving power supply IC package structure according to any one of claims 1-7, the method for preparing the LED driving power supply IC package structure includes: providing a substrate; forming a first base island and a second base island in the middle of the first surface of the substrate, and the second base island is adjacent to the first base island; using a die bonding process to fix the LED driving chip on the surface of the first base island away from the substrate, and fixing the diode on the surface of the second base island away from the substrate to form a first semi-finished product; Place the first semi-finished product in an environment protected by vacuum and nitrogen, and bake it at a preset temperature for a preset time to form a second semi-finished product; Form a chip select pin, a ground pin, a drain pin, and a high-voltage power supply pin at the edge of the first surface of the substrate; and Adopt a bonding process to electrically connect the chip select pin of the LED driver chip to the chip select pin, electrically connect the ground pin of the LED driver chip to the ground pin, electrically connect the cathode end of the diode to the high-voltage input pin of the LED driver chip, and electrically connect the anode end of the diode to the drain pin of the LED driver chip.

11. A preparation method of an LED driving power supply chip, characterized in that, Comprising: Prepare an LED driver power supply IC package structure based on the method according to claim 10; And Adopt a plastic encapsulation process to form a plastic housing on the outside of the LED driver power supply IC package structure to seal the LED driver power supply IC package structure.

12. The manufacturing method of the LED driving power chip according to claim 11, wherein, During the process of forming a plastic housing on the outside of the LED driver power supply IC package structure by using the plastic encapsulation process, the surface temperature of the mold is controlled at 175±10°C, the surface temperature of the preheating table is controlled at 160±10°C, the clamping pressure is controlled at 9 MPa - 16 MPa, the injection pressure is controlled at 5 MPa - 8 MPa, the actual injection time is controlled at 10 s - 15 s, and the curing time is controlled at 110 s / mold - 120 s / mold.

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