A chip testing pipeline and a chip testing method

Abstract

The present invention discloses a chip testing pipeline and a chip testing method. The pipeline sequentially includes an automatic loading machine, a material turnover device, an auxiliary loading machine, a testing machine, and an automatic unloading device, and each component is connected by a transmission line; the automatic loading machine grabs chips; the testing machine detects the chips; the automatic unloading device sorts the chips. The chip testing pipeline and the chip testing method of the present invention perform fully automated testing and have a modular structure that can be flexibly combined, enabling the entire testing line to always operate at the highest efficiency; it has the ability to quickly switch between high and low temperature broad temperature ranges and can replace traditional aging equipment for the aging process in the chip testing link; it makes full use of the advantage of the test module being replaceable and upgradable to achieve multi-task input, with the significant feature of flexible manufacturing; in view of the frequent replacement of IC testing, a modularized solution for the test structure body is adopted, providing continuous availability of the equipment for rapid product iteration.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a chip testing pipeline and a chip testing method. Background Art

[0002] With the change of production technology, more and more automated devices are put into production line operations to replace manual labor for simple and repetitive pipeline operations, thereby reducing labor costs, improving productivity and enterprise competitiveness. Currently, chip automatic testing pipelines have been widely used. However, in other links, such as chip loading, unloading, and transfer, further manual processing work is required, which increases the workload, reduces production efficiency, affects production capacity, and also increases production costs.

[0003] Most parts of the current chip testing pipeline are rigidly matched, and the response to different chip testing requirements is relatively weak. For example, in maintaining the production efficiency of the testing line, adapting to the conversion and replacement of tested chips, etc., the existing pipeline cannot meet the above requirements and cannot be quickly adjusted according to the changes in chip testing conditions. Summary of the Invention

[0004] The main technical problem to be solved by the present invention is: to provide a chip testing pipeline and a chip testing method, which solve the problems of low automation degree, inability to always ensure high production efficiency of the testing pipeline, and inability to better adapt to the change of testing requirements caused by the replacement of tested chips in the current chip testing pipeline.

[0005] To solve the above technical problem, a technical solution adopted by the present invention is: to provide a chip testing pipeline, which sequentially includes an automatic loader, a material turnover device, an auxiliary loader, a tester, and an automatic unloader. The automatic loader, the material turnover device, the auxiliary loader, and the automatic unloader are connected by a transmission line. The tester is arranged on the back of the auxiliary loader; the automatic loader is used to grab the chips to be detected and transfer the chips to be detected to the transmission line; the material turnover device is used to provide chip testing modules for the automatic loader; the auxiliary loader is used to receive the chips to be detected transmitted by the automatic loader, transfer the chips to be detected to the tester, and transfer the detected chips tested by the tester to the transmission line; the tester is used to detect the chips to be detected; the automatic unloader is used to receive the detected chips and is used to sort and collect the detected chips.

[0006] To solve the technical problems, the present invention also provides a chip testing method, which includes the following steps: The chip is transferred into an empty chip testing module by an automatic loading machine; The chip testing module carrying the chip to be tested is transferred to a testing machine via a transmission line, and the testing machine tests the chip to be tested; The chip testing module carrying the tested chip is transferred from the testing machine to the transmission line, flows through the transmission line to an automatic unloading device, and the automatic unloading device transfers the tested chip from the chip testing module to the outside.

[0007] Compared with the prior art, the beneficial effects achieved by the chip testing pipeline and the chip testing method of the present invention are as follows: From the loading, testing to unloading of the chip, the entire process of chip testing is fully automated, solving the problem of low automation degree existing in the current chip testing pipeline, reducing the manual workload, improving the production efficiency and production capacity, and at the same time reducing the production cost; The chip testing pipeline of the present invention is a combined structure, which can be flexibly combined according to different chip testing methods, increasing or decreasing the number of testing machines, so that the entire testing line is always in the highest efficiency state; The chip testing pipeline of the present invention has the ability to quickly switch between high and low temperature wide temperature ranges, and can replace traditional aging equipment in problems such as aging (BURN IN) in the chip testing link; The chip testing pipeline of the present invention makes full use of the advantage of the test module being replaceable and upgradeable, realizes the multi-tasking, and has the remarkable characteristics of flexible manufacturing; The chip testing pipeline of the present invention adopts a modularized solution for the test structure in view of the characteristics of frequent updates and replacements of IC testing, providing continuous availability of the equipment for rapid product iteration. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a schematic structural diagram of the chip testing pipeline of the present invention;

[0009] Figure 2 is a schematic structural diagram of the transmission line of the chip testing pipeline of the present invention;

[0010] Figure 3 is a schematic structural diagram of the automatic loading machine of the chip testing pipeline of the present invention;

[0011] Figure 4 is a top view of the workbench of the automatic loading machine;

[0012] Figure 5 is a schematic structural diagram of the mounting frame of the automatic loading machine;

[0013] Figure 6 is a bottom view of the mounting frame of the automatic loading machine;

[0014] Figure 7 is another perspective schematic diagram of the grasping mechanism of the automatic loading machine;

[0015] Figure 8 It is a schematic diagram of the bottom structure of the workbench of the automatic loading machine;

[0016] Figure 9 It is a schematic diagram of the structure of the chip testing module in the present invention;

[0017] Figure 10 It is the present invention Figure 9 Schematic diagram of the structure after removing the chip positioning mechanism in the present invention;

[0018] Figure 11 It is a schematic diagram of the structure of the chip positioning mechanism of the chip testing module in the present invention;

[0019] Figure 12 It is a schematic diagram of the chip cavity of the chip positioning mechanism in the present invention;

[0020] Figure 13 It is a schematic diagram of the cover plate of the chip positioning mechanism in the present invention;

[0021] Figure 14 It is a schematic diagram of the positioning block of the chip positioning mechanism in the present invention;

[0022] Figure 15 It is a schematic diagram of the structure of the material turnover device of the chip testing pipeline in the present invention;

[0023] Figure 16 It is a side perspective view of the material turnover device of the chip testing pipeline in the present invention;

[0024] Figure 17 It is the present invention Figure 15 Schematic diagram of the structure of the turnover cart in the present invention;

[0025] Figure 18 It is the present invention Figure 15 Internal structure perspective view of the rewinder in the present invention;

[0026] Figure 19 It is a schematic diagram of one side of the lateral movement mechanism of the rewinder in the present invention;

[0027] Figure 20 It is a schematic diagram of the other side of the lateral movement mechanism of the rewinder in the present invention;

[0028] Figure 21 It is a schematic diagram of the first embodiment of the auxiliary loading machine in the present invention;

[0029] Figure 22 It is a side view of the auxiliary loading machine in the present invention;

[0030] Figure 23 It is a schematic diagram of the jaw assembly of the auxiliary loading machine in the present invention;

[0031] Figure 24 It is a schematic structural diagram of the second embodiment of the auxiliary feeding machine in the present invention;

[0032] Figure 25 It is a schematic structural diagram of the testing machine in the present invention;

[0033] Figure 26 It is a schematic structural diagram of the testing module in the present invention;

[0034] Figure 27 It is a bottom view of the testing module in the present invention after removing the protective cover;

[0035] Figure 28 It is a schematic structural diagram of the testing indenter in the present invention;

[0036] Figure 29 It is a perspective view of the testing indenter in the present invention;

[0037] Figure 30 It is a schematic structural diagram of the automatic blanking device in the present invention;

[0038] Figure 31 It is a schematic structural diagram of the sorting and arranging machine of the automatic blanking device in the present invention;

[0039] Figure 32 It is a bottom view of the arranging and transporting mechanism in the present invention;

[0040] Figure 33 It is an assembly drawing of the sorting telescopic cylinder and the sorting lead screw module in the arranging and transporting mechanism of the present invention;

[0041] Figure 34 It is a schematic diagram of the transfer mechanism of the arranging and transporting mechanism in the present invention;

[0042] Figure 35 It is a schematic structural diagram of the blanking machine of the automatic blanking device in the present invention;

[0043] Figure 36 It is a bottom view of the first displacement mechanism of the automatic blanking device in the present invention;

[0044] Figure 37 It is an assembly drawing of the blanking telescopic cylinder and the blanking lead screw module in the first displacement mechanism of the present invention;

[0045] Figure 38 It is a schematic structural diagram of the unlocking device of the chip testing module in the present invention;

[0046] Figure 39 It is an assembly schematic diagram of the unlocking device of the chip testing module and the chip testing module in the present invention;

[0047] Figure 40 It is a flowchart of the chip testing method in the present invention. Detailed implementation mode

[0048] Please refer to Figure 1 , Figure 1 , which is a schematic diagram of the chip testing pipeline of the present invention. The chip testing pipeline sequentially includes an automatic loading machine 1, a material turnover device 2, an auxiliary loading machine 3, a testing machine 4, and an automatic unloading device 5. The automatic loading machine 1, the material turnover device 2, the auxiliary loading machine 3, and the automatic unloading device 5 are connected by a transmission line 6. The testing machine 4 is arranged on the back of the auxiliary loading machine 3;

[0049] The automatic loading machine 1 is used to grab the chips to be detected and transfer the chips to be detected onto the transmission line 6. Specifically, the chips to be detected are placed in a containing utensil before detection, such as a tray. During detection, the chips need to be placed in the following dedicated chip testing module 7. After the chips to be detected are detected, they are transferred from the chip testing module 7 to the tray. The function of the automatic loading machine 1 is to transfer the chips to be detected from the tray to the chip testing module 7 and flow into the next process.

[0050] The material turnover device 2 is used to provide the chip testing module 7 for the automatic loading machine 1 and transfer the chip testing module 7.

[0051] The auxiliary loading machine 3 is used to receive the chips to be detected transmitted by the automatic loading machine 1, transfer the chips to be detected to the testing machine 4, and transfer the detected chips tested by the testing machine 4 onto the transmission line 6. Specifically, the auxiliary loading machine 3 is used to load and unload the testing machine 4.

[0052] The testing machine 4 is used to detect the chips to be detected.

[0053] The automatic unloading device 5 is used to receive the detected chips and is used to sort and collect the detected chips. Specifically, the automatic unloading device 5 is used to sort the detected chips, remove the chips with abnormal tests, wait for further detection or manual processing, and transfer the chips with normal tests from the chip testing module 7 to the tray.

[0054] The transmission line 6 in the present invention at least includes a to-be-tested module transmission line 61, a tested module transmission line 62, and an empty module transmission line 63. Please refer to Figure 2 , Figure 2Schematic diagram of the transmission line of the chip test pipeline of the present invention. The transmission line 61 for modules to be tested and the transmission line 62 for tested modules are arranged side by side in the horizontal direction, and the transmission line 61 for modules to be tested and the transmission line 63 for empty modules are arranged side by side in the vertical direction. The transmission line 6 is used to transmit the chip test module 7. It can be understood that the chip test module 7 placed with the chip to be tested is transmitted on the transmission line 61 for modules to be tested, the chip test module 7 placed with the chip after being detected by the tester 4 is transmitted on the transmission line 62 for tested modules, and the chip test module 7 without a chip placed thereon is transmitted on the transmission line 63 for empty modules. Different chip test modules 7 are transmitted through different transmission lines to avoid material mixing.

[0055] The transmission line 61 for modules to be tested, the transmission line 62 for tested modules, and the transmission line 63 for empty modules in the present invention are all belt-driven, and the chip test module 7 is transmitted on the belt.

[0056] For the automatic loading machine in this embodiment, please refer to Figure 3 , Figure 3 is the schematic structural diagram of the automatic loading machine 1 of the present invention. The automatic loading machine 1 includes a loading control system, a frame 11, a carrier 12, a grasping mechanism 13, and a detection device 14; the loading control system is used to control the operation of the grasping mechanism 13 and the detection device 14; the frame 11 is used to carry the carrier 12, the grasping mechanism 13, and the detection device 14; the carrier 12 is used to place materials; the grasping mechanism 13 is used to grasp the materials in the carrier 12 and displace the materials; the detection device 14 is used to detect the position of the carrier 12 and the materials. By setting the grasping mechanism 13 and the detection device 14, the detection device 14 detects the position of the carrier 12 and the materials, and the grasping mechanism is controlled by the loading control system to grasp the materials in the carrier 12, so that the materials are automatically and accurately displaced, achieving the effect of automatic loading, with a higher degree of automation and effectively improving the loading efficiency. The following will specifically describe the above components.

[0057] In this application, the material to be loaded is taken as an example of a chip for illustration. After the chip is produced, it needs to be detected on the detection production line. Before loading on the detection production line, the chip is placed in the production carrier 12. When loading, the chip needs to be grasped from the original carrier 12 and transferred to the test carrier. Therefore, the automatic loading machine 1 in this application is provided with a grasping mechanism 13 to automatically grasp the chip, and then the detection device 14 detects the position of the carrier 12 and the state of the chip during displacement, so as to realize automatically grasping the chip in the carrier 12, and through the detection by the detection device 14, monitor the displacement process of the chip, so that the loading of the chip meets the preset requirements.

[0058] Please refer to Figure 3 and Figure 4 , Figure 3 is the schematic structural diagram of the automatic loading machine of the present invention.Figure 4 This is a top view of the workbench of the automatic loading machine of the present invention. Specifically, in this embodiment, the frame 11 includes a workbench 111 and a mounting frame 112, and the mounting frame 112 is fixed to the top of the workbench 111; one side of the top of the workbench 111 is the first area 1111, and the other side opposite to the first area 1111 is the second area 1112, and the area between the first area 1111 and the second area 1112 is the third area 1113; the carrier 12 is arranged in the first area 1111 and the second area 1112; the detection device 14 is arranged in the third area 1113; the grasping mechanism 13 is arranged on the mounting frame 112. As shown in the figure, both the workbench 111 and the mounting frame 112 are in the form of having a working surface at the top and support columns at the four corners. The workbench 111 is installed or placed on the ground, and the support columns of the mounting frame 112 are installed and fixed on the working surface of the workbench 111. In this embodiment, the working surface of the workbench 111 is rectangular. The first area 1111 is located on one side of the working surface, the second area 1112 is located on the other side opposite to the first area 1111, and the middle part of the two, that is, the part located at the center of the square, is the third area 1113. There are at least two types of carriers 12 for chips, which are respectively arranged at the first area 1111 and the second area 1112. Since the movement of the carrier 12 requires a certain space, different carriers 12 are arranged in different areas to avoid conflicts in space during loading. The chip loading process is to move from the first area 1111 to the second area 1112. Therefore, a detection device 14 is arranged at the middle area between the first area 1111 and the second area 1112, that is, the third area 1113, for detecting the chips during the loading process. The grasping mechanism 13 is arranged on the mounting frame 112. Specifically, it is arranged at the bottom of the working surface of the mounting frame 112, so that the grasping mechanism 13 is located directly above the working surface of the workbench 111, facilitating the grasping and movement of the lower chips by the grasping mechanism 13.

[0059] Still referring to Figure 3 , Figure 3This is a schematic structural diagram of the automatic loading machine of the present invention. In this embodiment, the carrier 12 includes a incoming material carrier 121 and a chip testing module 7. The incoming material carrier 121 contains materials, and the grasping mechanism 13 is used to transfer the materials to the chip testing module 7 through the third area 1113; the incoming material carrier 121 is fixed in the first area 1111, and the chip testing module 7 is fixed in the second area 1112. The incoming material carrier 121 in this application is the original carrier before chip loading, and a relatively large number of chips can be placed in one incoming material carrier 121. The incoming material carrier 121 can be a tray. The chip testing module 7 is the new carrier after the chip is moved. Since the chip needs to be placed in a specific chip testing module 7 for matching with the subsequent testing machine, and the number of chips that can be loaded in the chip testing module 7 is also different from that of the incoming material carrier 121, the chips need to be transferred from the incoming material carrier 121 to the chip testing module 7 during the loading process. The incoming material carrier 121 and the chip testing module 7 are respectively arranged in the first area 1111 and the second area 1112 to distinguish the two and avoid confusion and misuse of different carriers 12.

[0060] Please refer to Figures 5 to 7 , Figure 5 This is a schematic structural diagram of the mounting frame of the automatic loading machine of the present invention. Figure 6 This is a bottom view of the mounting frame of the automatic loading machine of the present invention. Figure 7 This is another perspective schematic diagram of the grasping mechanism of the automatic loading machine of the present invention. The grasping mechanism 13 in this application includes a first grasping mechanism 131 and a second grasping mechanism 132; the first grasping mechanism 131 is used to grasp the materials located in the incoming material carrier 121 and move the materials to the third area 1113; the second grasping mechanism 132 is used to grasp the materials located in the third area 1113 and move the materials to the chip testing module 7 located in the second area 1112. The grasping process in this embodiment is divided into the following steps, that is, first use the first grasping mechanism 131 to transfer the chips in the incoming material carrier 121 from the first area 1111 to the third area 1113, and after being detected by the detection device 14, then use the second grasping mechanism 132 to transfer the chips located in the third area 1113 to the chip testing module 7 in the second area 1112. The functions of the first grasping mechanism 131 and the second grasping mechanism 132 are different, and using them separately can improve production efficiency.

[0061] Specifically, both the first grasping mechanism 131 and the second grasping mechanism 132 include a first guide rail 1311, a first motor 1312, a variable pitch suction cup module 1313, a telescopic cylinder 1314, and a lead screw module 1315. The first guide rail 1311 is fixed to the mounting frame 112, and the variable pitch suction cup module 1313 can slide along the first guide rail 1311. The first motor 1312 is used to drive the telescopic cylinder 1314 to move, and the telescopic cylinder 1314 can drive the variable pitch suction cup module 1313 to move up and down along the lead screw module 1315.

[0062] In this embodiment, the up-down direction is taken as the z-axis, the length direction of the first guide rail 321 is taken as the y-axis, and the direction perpendicular to the length direction of the first guide rail 321 is taken as the x-axis for illustration. The direction of the first guide rail 1311 is parallel to the connection direction between the first area 1111 and the third area 1113, that is, both are along the y-axis direction. Since the first grasping mechanism 131 is only used to drive the chip to move from the first area 1111 to the third area 1113, and the second grasping mechanism 132 is only used to drive the chip to move from the third area 1113 to the second area 1112, the length of the first guide rail 1311 is slightly greater than half of the distance between the first area 1111 and the third area 1113. At the same time, to avoid interference, a height difference is formed between the first grasping mechanism 131 and the second grasping mechanism 132, so that the two first guide rails 1311 can be located on the same straight line.

[0063] In this embodiment, the first motor 1312 is used to drive the variable pitch suction cup module 1313 to slide along the first guide rail 1311, that is, to slide in the y-axis direction, and the telescopic cylinder 1314 is used to drive the variable pitch suction cup module 1313 to move up and down, that is, to move in the z-axis direction, to grasp the chip from the carrier 12.

[0064] The variable pitch suction cup module 1313 of the present application includes a variable pitch mechanism and a suction cup. The variable pitch mechanism is applicable to packaging and material handling, and is used to ensure that the distance changes between each moving block are consistent. After batch sorting and variable pitch of the products, they are placed into the carrier 12. In this embodiment, they are placed into the chip testing module 7. The suction cup is arranged at the bottom of the variable pitch mechanism and is used to suck the chip. The chip testing module 7 contains several chip placement positions, which are evenly arranged. After the chips are sucked out from the incoming carrier 121, the distance between each chip is adjusted by the variable pitch mechanism to match the spacing of the chip placement positions, so that multiple chips can be placed into the chip testing module 7 at the same time.

[0065] The grasping mechanism 13 in this embodiment further includes a second guide rail 133 and a second motor 134. The second motor 134 drives the first grasping mechanism 131 to slide along the second guide rail 133. The first guide rail 321 is perpendicular to the second guide rail 133. The second guide rail 133 is also fixed to the bottom surface of the mounting frame 112 and is perpendicular to the first guide rail 1311, and is arranged along the x-axis direction. The entire first grasping mechanism 131 can slide along the second guide rail 133, that is, slide along the x-axis direction. The variable pitch suction cup module 1313 in the first grasping mechanism 131 can slide along the first guide rail 1311, that is, slide along the y-axis direction. The above settings can enable the variable pitch suction cup module 323 to move in both the x-axis and y-axis directions. As described above, when the chip is on the first grasping mechanism 131, it moves along the y-axis direction. When multiple incoming material carriers 121 are set during feeding and the multiple incoming material carriers 121 are arranged in parallel along the x-axis, the first grasping mechanism 131 can move on the x-axis to grasp the chips in different incoming material carriers 121, and then adjust the position to transfer the chips along the y-axis direction.

[0066] In addition to grasping the chips located in the incoming material carrier 121, the first grasping mechanism 131 in this embodiment is also used to move the chips that do not meet the requirements after being detected by the detection device 14 to the NG area 1114. The NG area 1114 is located on one side of the third area 1113 and is used to store the chips that do not meet the requirements detected during the feeding process. The chips that do not meet the requirements are moved to the NG area 1114 along the x-axis direction by the first grasping mechanism 131, and then are removed from the feeding machine by the suction cup module, achieving the effect of full automation.

[0067] Of course, more clamps can also be set on the first grasping mechanism 131. After the chips in the incoming material carrier 121 are grasped, the empty incoming material carrier 121 is removed from the first area 1111 by the clamps, and the first grasping mechanism 131 continues to grasp the chips in the incoming material carrier 121 located below, making the entire feeding machine more automated and improving production efficiency.

[0068] The detection device 14 in this embodiment includes a first detection device 141 and a second detection device 142. The first detection device 141 is arranged in the third area 1113 and is used to detect the materials entering the third area 1113. Specifically, it detects whether the chips entering the third area 1113 meet the preset requirements, such as whether they meet the preset position and angle requirements, or detects whether there are quality problems with the chips, screens the chips, and eliminates the chips that do not meet the requirements for the next step of transfer to the chip test module 7.

[0069] Please refer to Figure 4 , Figure 4This is a top view of the workbench of the automatic loading machine of the present invention. At the top of the workbench 111, there are a first entrance / exit 1115 and a second entrance / exit 1116. The incoming material carrier 121 moves between the top and bottom surfaces of the workbench 111 through the first entrance / exit 1114, and the chip testing module 7 moves between the top and bottom surfaces of the workbench 111 through the second entrance / exit 1116. The incoming material carrier 121 carries the chips and rises from the bottom of the workbench 111 to the top of the workbench 111, and the chip testing module 7 carries the tested chips and descends from the top of the workbench 111 to the bottom of the workbench 111, and then flows out through the transmission line to the subsequent testing machine. The second detection device 142 is arranged on one side of the second entrance / exit 1116 and is used to detect the position of the chip testing module 7, so as to facilitate the second grasping mechanism 132 to move the chip testing module 7 to the second entrance / exit 1116 and then descend through the second entrance / exit 1116.

[0070] The first detection device 141 and the second detection device 142 in this embodiment are any one of a CCD sensor, a Hall sensor, or a travel switch. Preferably, a CCD sensor is used in this embodiment to take a picture of the bottom of the chip and detect whether the bottom surface of the chip matches the preset image data, so as to avoid the chip being unable to be correctly placed in the chip testing module 7 and affecting the subsequent detection.

[0071] Please refer to Figure 8 , Figure 8 This is a schematic diagram of the bottom structure of the workbench of the automatic loading machine of the present invention. The automatic loading machine 1 in this embodiment further includes a transmission mechanism 15, and the transmission mechanism 15 includes a lifting device 151; a loading box 153 is provided at the bottom of the workbench 111 opposite to the first entrance / exit 1115, and the incoming material carrier 121 is placed in the loading box 153 and is driven by the lifting device 151; the lifting device 151 includes a third motor and a cylinder assembly, the third motor drives the cylinder assembly to move, and the cylinder assembly pushes the loading box 153 upward to make the incoming material carrier 121 rise to the first area 1111 through the first entrance / exit 1115. The loading box 153 is used to store the incoming material carrier 121, and the incoming material carrier 121 with chips can be put in by manual, and multiple layers of incoming material carriers 121 can be placed at one time. The lifting device 151 drives the incoming material carrier 121 to rise to the working surface of the workbench 111.

[0072] The transfer mechanism 15 in this embodiment further includes a chip test module handling module 152; the chip test module handling module 152 is disposed at the bottom of the workbench 111 and is opposite to the second entrance and exit 1116; the chip test module handling module 152 includes a third motor (not shown in the figure), a third guide rail 1521, a slider 1522, and a handling platform 1523. The third motor drives the slider 1522 to slide along the third guide rail 1521, and the handling platform 1523 is fixed integrally with the slider 1522. The handling platform 1523 carries the chip test module 7 to rise or fall through the second entrance and exit 1116. The chip test module handling module 152 is used to transfer the chip test module 7 with chips from the working surface of the workbench 111 to the lower part of the workbench 111 and then flow out through the transmission line. The direction of the third guide rail 1521 is along the z-axis direction, the handling platform 1523 is horizontally arranged, and the chip test module 7 is placed on the handling platform 1523 and slides down along the third guide rail 1521 to flow to the next process for chip detection. When the handling platform 1523 rises, the empty chip test module 7 can be transmitted on the handling platform 1523 through the lower assembly line for loading the next batch of chips, and the chip loading is repeated in this way.

[0073] The automatic loader 1 in this embodiment further includes a carrier positioning mechanism; the carrier positioning mechanism includes a driving member and a fixture. The driving member drives the fixture to displace, and both ends of the fixture are respectively abutted against two adjacent sides of the carrier 12, so as to fix the carrier 12 on the workbench 111. Specifically, the carrier positioning mechanism can be respectively arranged in the first area 1111 and the third area 1113. When the chips are being transferred, both the incoming carrier 121 and the chip test module 7 are fixed on the workbench 111 by the carrier positioning mechanism, which is convenient for the picking and placing and positioning of the chips.

[0074] The automatic loader 1 in this embodiment further includes a chip test module unlocking device 8, which is used to unlock the chip test module 7 so as to place the chip in the chip test module 7. The specific structure of the chip test module unlocking device 8 will be described in the following content.

[0075] Please refer to Figures 9 to 11 , Figure 9 which is a schematic structural diagram of the chip test module in the present invention, Figure 10 which is Figure 9 a schematic structural diagram of the present invention after removing the chip positioning mechanism, Figure 11 and which is a schematic structural diagram of the chip positioning mechanism of the chip test module in the present invention. The chip test module 7 in this application includes a chip mounting plate 71 and a chip positioning mechanism 72, and the chip mounting plate 71 and the chip positioning mechanism 72 are detachably connected. The function of the chip test module 7 is to fix and carry the chip, and enter the tester 4 together with the chip for testing.

[0076] The chip mounting board 71 in the present application is fixed with a chip pin carrier board 73, which is the substrate of the chip test module 7 and is used to carry components. The chip pin carrier board 73 mainly protects the chip and serves as an interface between the integrated circuit chip and the outside world. The chip is mounted on the chip pin carrier board 73.

[0077] The chip positioning mechanism 72 in the present application is used to fix the chip on the chip test module 7. In the present embodiment, the chip positioning mechanism 72 includes a chip cavity 721, a positioning block 722 and a chip locking mechanism. The chip cavity 721 is used to cooperate with the chip needle carrier 73 to form a groove so that the chip is fixed in the groove. The positioning block 722 is used to fix the chip, and the chip locking mechanism is used to lock the positioning block 722 to hold the chip. To facilitate installation and disassembly, the chip positioning mechanism 72 in the present embodiment is detachably connected to the chip mounting plate 71.

[0078] The chip locking mechanism of the present application only needs to apply force to the positioning block 722 so that the positioning block 722 abuts against the chip to achieve the function of limiting the chip. In this embodiment, the chip locking mechanism at least includes an elastic member 723, which is arranged at the other end of the positioning block 722 and is used to apply elastic force to the positioning block 722 to push the positioning block 722 to abut against the chip.

[0079] See also Figure 12 , Figure 12 Schematic diagram of the chip cavity of the chip positioning mechanism in the present invention. The chip cavity 721 in the present application is provided with a chip mounting groove 724, and the chip pin carrier 73 is sleeved in the chip mounting groove 724; one end of the positioning block 722 extends into the chip mounting groove 724 and abuts against the chip; the elastic member 723 is provided at the other end of the positioning block 722 to apply elastic force to the positioning block 722.

[0080] In the present application, a first magnetic component 74 is also provided on the chip mounting plate 71, and a second magnetic component is buried in the chip cavity 721. The chip cavity 721 and the chip mounting plate 71 are magnetically attracted to each other through the first magnetic component 74 and the second magnetic component, so that the chip cavity 721 and the chip mounting plate 71 are movably connected to each other for easy installation and disassembly.

[0081] In the present application, a guide member 75 is further provided on the chip mounting board 71, and a guide hole 725 is provided on the chip cavity 721. The guide member 75 passes through the guide hole 725, so that the chip cavity 721 is mounted on the chip mounting board 71. In order to facilitate the installation of the chip cavity 721 to a preset position on the chip mounting board 71, the guide member 75 and the guide hole 725 are provided in the present embodiment, so that the chip cavity 721 is installed in the correct position, and at the same time, the chip cavity 721 is movably mounted on the chip mounting board 71 through the above-mentioned first magnetic member 74 and the second magnetic member.

[0082] In this application, the chip cavity 721 further includes a positioning member mounting platform 726, and the positioning block 722 is disposed on the positioning member mounting platform 726. A notch is formed on one side of the chip mounting groove 724 opposite to the positioning member mounting platform 726. One end of the positioning block 722 extends into the chip mounting groove 724 through the notch, and the chip located in the chip mounting groove 724 is abutted by one end of the positioning block 722, so as to fix the chip in the chip test module 7.

[0083] In this application, the notch is located on the connection line between the center of the chip mounting groove 724 and the center of the positioning member mounting platform 726, and the length center line of the positioning block 722 coincides with the connection line. The connection line between the center of the chip mounting groove 724 and the center of the positioning member mounting platform 726 forms a 45-degree angle with the length and width ends of the chip mounting board 71, and the length direction of the positioning block 722 is parallel to the above connection line, so that the direction of the force exerted by the positioning block 722 on the chip faces the center of the chip, and the chip is more evenly stressed.

[0084] Please refer to Figure 14 , Figure 14 which is a schematic structural diagram of the positioning block of the chip positioning mechanism in the present invention. In this application, one end of the positioning block 722 close to the notch includes a bifurcated first side 7221 and a second side 7222, and the first side 7221 and the second side 7222 are respectively abutted against two adjacent sides of the chip; an avoidance groove 7223 is further provided at the intersection of the first side 7221 and the second side 7222; the other end of the positioning block 722 forms a protrusion 7224 upwards. In this embodiment, the chip is square or rectangular, and the four corners of the chip are right angles. In order to form a uniform force on the chip when fixing the chip, the positioning block 722 forms a bifurcated first side 7221 and a second side 7222, and the included angle between the first side 7221 and the second side 7222 is 90 degrees, and they are respectively abutted against two adjacent sides of the chip. The avoidance groove 7223 is used to avoid the four corners of the chip, and the opposite side of the chip receiving the thrust of the positioning block 722 abuts against the inner wall of the chip cavity 721, so as to fix the chip in the chip test module 7.

[0085] Please refer to Figure 13 , Figure 13 which is a schematic structural diagram of the cover plate of the chip positioning mechanism in the present invention. In this application, the chip locking mechanism further includes a cover plate 76, and the cover plate 76 is covered on the positioning member mounting platform 725. A through groove 761 is provided on the cover plate 76, and the protrusion 7224 passes through the through groove 761, so that the positioning block 722 can reciprocate under the limit of the cover plate 76.

[0086] In this application, the chip test module 7 further includes a module housing 77, and a hollow hole 771 is formed on the module housing 77; the chip mounting board 71 and the chip positioning mechanism 72 are accommodated in the module housing 77, and the chip positioning mechanism 72 is exposed from the hollow hole 771.

[0087] One end of the elastic member 723 in this application is fixed to the inner wall of the hollow hole 771, and the other end abuts against the positioning block 722, thereby applying an elastic force to the positioning block 722 to push the positioning block 722 to squeeze the chip, and the chip is thus fixed.

[0088] In this application, a transfer board 78 is further provided on the module housing 77 for introducing or leading out signals to facilitate connecting a test instrument or providing a signal source, so as to perform debugging and maintenance.

[0089] Please refer to Figure 15 and Figure 16 , Figure 15 which is a schematic structural diagram of the material turnover device of the chip test pipeline of the present invention, Figure 16 and which is a side perspective view of the material turnover device of the chip test pipeline of the present invention. The material turnover device 2 in this embodiment includes a turnover cart 21 and a loading and unloading machine 22, and the turnover cart 21 and the loading and unloading machine 22 are movably matched. The turnover cart 21 can be pushed, and materials can be loaded or unloaded manually or by the loading and unloading machine 22. The loading and unloading machine 22 can take materials from the turnover cart 21, or transfer the materials stored by itself to the turnover cart 21. The above-mentioned materials can be chip test modules 7.

[0090] Please refer to Figure 17 , Figure 17 which is a schematic structural diagram of the turnover cart in the present invention Figure 15 . The turnover cart 21 is provided with a storage rack 211 for placing the chip test module 7.

[0091] Please refer to Figures 18 to 20 , Figure 18 which is a perspective view of the internal structure of the loading and unloading machine in the present invention Figure 15 , Figure 19 which is a schematic structural diagram of one side of the lateral movement mechanism of the loading and unloading machine in the present invention Figure 20 and which is a schematic structural diagram of the other side of the lateral movement mechanism of the loading and unloading machine in the present invention. The loading and unloading machine 22 is provided with a frame 221, a lifting mechanism 222 and a lateral movement mechanism 223.

[0092] The lifting mechanism 222 is installed on the frame 221 and is used to drive the lateral movement mechanism 223 to lift along the frame 221, so that the lateral movement mechanism 223 corresponds to the height of the storage rack 211, facilitating the lateral movement mechanism 223 to pick up and place the chip test module 7.

[0093] The lateral movement mechanism 223 expands and contracts along the horizontal direction perpendicular to the lifting direction and is used to drive the material to horizontally displace between the storage rack 211 and the loading and unloading machine 22, that is, the chip test module 7 can be driven by the lateral movement mechanism 223 to change positions between the storage rack 211 and the loading and unloading machine 22.

[0094] Specifically, taking the above-mentioned material, i.e., the chip test module 7, as an example for illustration, the material turnover device 2 is arranged behind the automatic loading machine 1 and provides empty chip test modules 7 to the automatic loading machine 1. The empty chip test modules 7 are placed on the turnover cart 21 and transferred to the storage and release machine 22. The empty chip test modules 7 flow back to the automatic loading machine 1 through the empty module transmission line 63, and after placing the chips to be detected on the automatic loading machine 1, they flow out through the module to be tested transmission line 61. The storage and release machine 22 can store the chip test modules 7 to prevent the chip test modules 7 from piling up on the empty module transmission line 63. The turnover cart 21 can also transfer the chip test modules 7 stored on the storage and release machine 22 to the outside, provide different types of chip test modules 7 to the storage and release machine 22, and convert the types of the chip test modules 7 on the transmission line 6 to meet the test requirements of different chips.

[0095] In this embodiment, the frame 221 includes a horizontal rod 2211 and a vertical rod 2212 connected as a whole. A plurality of vertical rods 2212 are vertically fixed, and the head and tail of a plurality of horizontal rods 2211 are respectively fixedly connected to adjacent vertical rods 2212 to form a rectangular frame for installing the lifting mechanism 222 and the horizontal movement mechanism 223.

[0096] In this embodiment, the lifting mechanism 222 includes a guide rail 2221, a bearing plate 2222, and a synchronous belt 2223. The guide rail 2221 is arranged along the length direction of the vertical rod 2212, that is, along the vertical direction. Both ends of the bearing plate 2222 are slidably connected to the guide rail 2221, and the synchronous belt 2223 is used to drive the bearing plate 2222 to move linearly along the guide rail 2221, so that the bearing plate 2222 can rise and fall.

[0097] In this embodiment, the lifting mechanism 222 further includes a movable transmission line 2224. One side of the movable transmission line 2224 is fixedly connected to the bearing plate 2222. The material is placed on the movable transmission line 2224. The movable transmission line 2224 is parallel to the module to be tested transmission line 61 and is a part of the module to be tested transmission line 61. The movable transmission line 2224 can be driven by the bearing plate 2222 to rise or fall.

[0098] In this embodiment, the horizontal movement mechanism 223 includes a cylinder 2231, a push-pull plate 2232, and a guide shaft 2233. The cylinder 2231 is arranged on the bearing plate 2222 and is matched with the height of the movable transmission line 2224. The push-pull plate 2232 is arranged above the movable transmission line 2224 and is driven by the cylinder 231 to expand and contract, and the expansion and contraction direction is the horizontal direction. One end of the guide shaft 2233 is fixedly connected to the push-pull plate 2232, and the other end passes through the bearing plate 2222. The bearing plate 2222 is provided with a guide installation hole, and the guide shaft 2233 passes through the guide installation hole, so that the guide shaft 2233 can only move in the horizontal direction to limit the movement direction of the push-pull plate 2232.

[0099] In this application, the push-pull plate 2232 has multiple embodiments, as long as it can achieve the function of pushing and pulling the chip test module 7. In one embodiment, the push-pull plate 2232 includes a flat plate, and the opposite sides of the flat plate are bent to form a first bent plate and a second bent plate. Hook claws or clamping mechanisms are provided on the inner sides of the first bent plate and the second bent plate, and hook grooves or clamping mechanisms are also correspondingly provided on the side of the chip test module 7, so that the push-pull plate 2232 can be relatively fixed to the chip test module 7, and the chip test module 7 moves together with the push-pull plate 2232. In another embodiment, the push-pull plate 2232 includes a first surface, and a second surface and a third surface respectively located on both sides of the first surface. The second surface and the third surface are both telescopically connected to the first surface. The distance between the second surface and the third surface is adjustable to form a clamping mechanism. When driving the chip test module 7 to move, the second surface and the third surface respectively contact the opposite sides of the chip test module 7, and clamp the chip test module 7 to move.

[0100] In this embodiment, the number of storage racks 211 is multiple, and the multi-layer storage racks 211 are vertically and evenly distributed on the turnover cart 21. The width of the storage rack 211 is at least twice the width of the material, and a partition plate 212 is also provided in the middle of the storage rack 211, so that at least two rows of chip test modules 7 can be placed on one layer of the storage rack 211. When one side of the turnover cart 21 is full, the turnover cart 21 is manually pushed out and then rotated 18 degrees and pushed into the loading and unloading machine 22. Chip test modules 7 are continuously placed on the other side of the turnover cart 21. After both sides of the turnover cart 21 are full, it is manually pushed away, and more chip test modules 7 can be transported at one time, reducing labor consumption and having higher work efficiency. Universal wheels 213 are also provided at the bottom of the turnover cart 21 to facilitate the movement of the turnover cart 21.

[0101] In this embodiment, a baffle and a plug are also provided on the side of the turnover cart 21. The plug includes a socket and a plug head; one side of the baffle is hinged to the turnover cart, and the plug head is provided on the opposite side of the baffle; the socket is fixed on the storage rack and corresponds to the position of the plug head. The baffle and the plug are used to protect the chip test module 7 placed on the storage rack 211 from falling and being damaged when pushing the turnover cart 21 to move. When the turnover cart 21 transfers materials with the loading and unloading machine 22, the baffle is opened.

[0102] In this embodiment, the radio cassette player 22 further includes a housing 224 for covering and protecting other components of the radio cassette player 22. An activity door 225 is provided on the housing 224. The activity door 225 is hinged to the housing 224 and will only open when the turnover cart 21 transfers materials to and from the radio cassette player 22. A notch 227 for accommodating the turnover cart 21 is provided on the bottom plate 226 of the turnover cart 21, and the width of the notch 227 is the same as the width of the turnover cart 21. When the turnover cart 21 and the radio cassette player 22 are used in cooperation, the activity door 225 is opened, and the turnover cart 21 is pushed to the notch 227. Since the width of the notch 227 is the same as that of the turnover cart 21, the turnover cart 21 is stuck, so that when the chip test module 7 is transferred between the turnover cart 21 and the radio cassette player 22, the turnover cart 21 and the radio cassette player 22 remain relatively fixed.

[0103] Please refer to Figure 21 and Figure 22 , Figure 21 which is a schematic structural view of the first embodiment of the auxiliary loading machine in the present invention, Figure 22 and which is a side view of the auxiliary loading machine in the present invention. The auxiliary loading machine 3 in this application includes an auxiliary loading control system, a driving device 31, and a handling mechanism 32; the auxiliary loading control system is used to control the operation of the handling mechanism 32; the driving device 31 drives the handling mechanism 32 to move; the handling mechanism 32 includes a transfer track and a jaw assembly 321; the transfer track includes a z-axis track 322, an x-axis track 323, and a y-axis track 324. The z-axis track 322 can slide along the x-axis 3212 track, and the y-axis track 324 is slidably connected to the z-axis track 322; the jaw assembly 321 is slidably connected to the y-axis track 324.

[0104] The function of the auxiliary loading machine 3 is to receive the chip test module 7 containing the chips to be tested transmitted by the automatic loading machine 1, transfer the chips to be tested to the testing machine 4, and then transfer the tested chips after being tested by the testing machine 4 back to the transmission line 6. By setting the three-axis track, the clamping jaw assembly 321 can move in three-axis directions, and the clamping jaw assembly 321 is used to clamp the chip test module 7 for movement. Specifically, the x-axis track 323 is along the length direction of the auxiliary loading machine 3, the y-axis track 324 is along the width direction of the auxiliary loading machine 3, and the z-axis track 322 is along the height direction of the auxiliary loading machine 3. The clamping jaw assembly 321 can slide along the y-axis track 324, and the y-axis track 324 can slide up and down along the z-axis track 322 together with the clamping jaw assembly 321, and the z-axis track 322 can move transversely along the x-axis track 323. The auxiliary loading machine 3 and the testing machine 4 are arranged parallel to each other along the y-axis. It can be understood that when the clamping jaw assembly 321 moves on the y-axis track 324, it drives the chip test module 7 to switch positions between the auxiliary loading machine 3 and the testing machine 4. Specifically, it transports the chip test module 7 with untested chips from the auxiliary loading machine 3 to the testing machine 4 for testing, and transports the chip test module 7 with tested chips in the testing machine 4 back to the auxiliary loading machine 3, so as to realize the functions of feeding and discharging the testing machine 4. When the clamping jaw assembly 321 moves on the x-axis track 323 and the z-axis track 322, the left-right position and the up-down position of the clamping jaw assembly 321 can be adjusted respectively, so that the position of the clamping jaw assembly 321 is consistent with the chip test module 7 to be clamped.

[0105] In this embodiment, the driving device 31 is arranged on the z-axis track 322 and can move along with the z-axis track 322. The circuits of the driving device 31 are all arranged on the z-axis track 322 to avoid interference with the transmission line 6 or the chip test module 7 during movement. The driving device 31 is any one of a stepping motor, a servo motor or a linear motor. Preferably, the driving device 31 is a stepping motor, which synchronously controls the three tracks and accurately controls the moving position of the clamping jaw assembly 321.

[0106] In this embodiment, the auxiliary loading machine 3 further includes a support frame 33 and a base 34, and the support frame 33 is fixed on the base 34. The base 34 is used to carry the support frame 33 and the handling mechanism 32. At the same time, the transmission line 6 passes through the auxiliary loading machine 3 and is fixed on the base 34. The clamping jaw assembly 321 clamps the chip test module 7 with untested chips from the to-be-tested module transmission line 61, puts it into the testing machine 4 for testing, and then takes it out from the testing machine 4 and places it on the tested module transmission line 62.

[0107] In this embodiment, the x-axis rail 323 is fixed to the base 34 and is arranged along the length direction of the base 34. The top of the support frame 33 is provided with an upper rail 331. One end of the z-axis rail 322 is slidably connected to the x-axis rail 323, and the other end is slidably connected to the upper rail 331, so that the z-axis rail 322 can slide left and right along the x-axis direction.

[0108] Please refer to Figure 23 , Figure 23 which is a schematic structural diagram of the jaw assembly of the auxiliary loader in the present invention. The jaw assembly 321 in this application can have various forms as long as it can grasp and move the chip test module 7. In one embodiment, the jaw assembly 321 includes jaws 3211 and a sliding member 3212; the sliding member 3212 is slidably connected to the y-axis rail 324; the jaws 3211 are fixedly connected to the sliding member 3212, and the arrangement direction of the jaws 3211 is the same as the length direction of the y-axis rail 324. The jaws 3211 include two clamping plates and a top plate. The two clamping plates are telescopically connected to the top plate, and the distance between the two clamping plates is adjustable, so as to apply forces to both ends of the chip test module 7 and drive the chip test module 7 to move.

[0109] In this embodiment, the number of the jaws 3211 is multiple, and the multiple jaws 3211 form at least two layers. Preferably, the number of the jaws 3211 is 4, and they are divided into two layers, with two in each layer. During use, the jaws 3211 in each layer move synchronously. Such an arrangement enables one layer of the jaws 3211 to transport the untested chip test modules 7 into the testing machine 4, and the other layer of the jaws 3211 to transport the tested chip test modules 7 out of the testing machine, resulting in higher production efficiency.

[0110] In this embodiment, a position detection sensor is further provided on the jaws 3211 for detecting the moving position of the jaws 3211, so as to make the displacement of the jaws 3211 more accurate.

[0111] Please refer to Figure 24 , Figure 24 which is a schematic diagram of the second embodiment of the auxiliary loader 3 in this application. In this embodiment, the auxiliary loader 3 further includes a stacking mechanism 35 and an outer cover (not shown). The stacking mechanism 35 is arranged on one side of the x-axis rail 323 and is fixed to the base 34 for stacking the chip test modules 7. When the chip test modules 7 being detected in the testing machine 4 are full, the jaw assembly 321 can first store the chip test modules 7 conveyed on the module transmission line 61 to be tested into the stacking mechanism 35. After the testing machine 4 finishes the test, the tested chip test modules 7 are taken out, and the untested chip test modules 7 are clamped from the stacking mechanism 35 and moved into the testing machine 4. The outer cover covers the support frame 33 and the base 34 to protect the driving device 31 and the handling mechanism 32.

[0112] In this embodiment, the length of the auxiliary loading machine 3 is more than three times the length of the testing machine 4. One auxiliary loading machine 3 can correspond to three testing machines 4, and can load and unload materials for the three testing machines 4, achieving one-to-many operation, with high efficiency and low cost.

[0113] Please refer to Figure 25 , Figure 25 which is a schematic structural diagram of the testing machine in the present invention. The testing machine 4 in this application includes a testing frame 41 and a testing module 42. The testing module 42 is installed on the testing frame 41, and the testing module 42 is used to detect the chip.

[0114] Specifically, please refer to Figure 26 and Figure 27 , Figure 26 which is a schematic structural diagram of the testing module in the present invention, Figure 27 and

[0115] is a bottom view of the testing module in the present invention after removing the protective cover. The testing module 42 includes testing probes 421, testing press heads 422, a mounting plate 423, a testing board 424, and a telescopic mechanism 425. The testing probes 421 and the testing press heads 422 are fixed on the mounting plate 423; the testing probes 421 are used to pick up signals and provide them to the corresponding ICT or testing system to analyze the on-off and quality of the signals, and the testing probes 421 are electrically connected to the adapter board 78 of the chip testing module 7. The mounting plate 423 is used to mount and fix the testing probes 421 and the testing press heads 422.

[0116] The testing board 424 faces the mounting plate 423 and is used to place the chip testing module 7. A positioning mechanism 426 is provided on the testing board 424 to position the chip testing module 7 and prevent the chip testing module 7 from shifting during the detection process. Preferably, the number of the positioning mechanisms 426 is at least two, and the multiple positioning mechanisms 426 are respectively distributed in different orientations. The positioning mechanism 426 is an L-shaped positioning block that positions the chip testing module 7 from the opposite side, so that the chip testing module 7 cannot move.

[0117] In this application, the testing press head 422 is used to press the chip, and at the same time, it is equipped with a temperature conversion module to provide a high-temperature or low-temperature environment for chip testing, meeting the environmental requirements during chip testing.

[0118] Specifically, please refer to Figures 28 to 29 ,Figure 28 This is a schematic structural view of the test indenter in the present invention. Figure 29 This is a perspective view of the test indenter in the present invention. The test indenter 422 includes an upper housing 4221, a lower housing 4222, a sliding mechanism (not shown), an elastic mechanism 4223, an indenter 4224, and a temperature conversion module 4225. The top of the upper housing 4221 is for fixed assembly and is fixed to the lower bottom surface of the mounting plate 423. The top of the lower housing 4222 faces the bottom of the upper housing 4221. The indenter 4224 is provided at the bottom of the lower housing 4222, and the temperature conversion module 4225 is provided inside the lower housing 4222. The sliding mechanism connects the upper housing 4221 and the lower housing 4222, enabling relative sliding between the upper housing 4221 and the lower housing 4222. The elastic mechanism 4223 is provided between the upper housing 4221 and the lower housing 4222. The test indenter 422 is used to contact the chip during the chip testing process. Specifically, the lower housing 4222 of the test indenter 422 abuts against the chip. The test indenter 422 is driven by the mounting plate 423. After the indenter 4224 on the lower housing 4222 abuts against the chip, due to the provision of the sliding mechanism and the elastic mechanism 4223, the upper housing 4221 can continue to move downward for a certain distance, so that the indenter 4224 at the bottom is in close contact with the chip and presses the chip tightly. The sliding mechanism is used to move the upper housing 4221 in a direction parallel to the lower housing 4222, and the elastic mechanism 4223 is used for buffering during downward pressing. The temperature conversion module 4225 is used to provide heat to or absorb heat from the indenter 4224, thereby creating a high-temperature or low-temperature test environment, so that the test indenter 422 can meet the environmental conditions during the detection of different chips.

[0119] Preferably, the temperature conversion module 4225 is a thermoelectric cooler. The thermoelectric cooler utilizes the Peltier effect of semiconductor materials. When direct current passes through an electric couple formed by two different semiconductor materials connected in series, heat can be absorbed and released at both ends of the electric couple respectively, which can achieve the purposes of refrigeration and heating, and provide high-temperature and low-temperature environments for chip testing.

[0120] Of course, in the case where high-temperature and low-temperature test environments are not required, such as when only high-temperature testing is performed, the thermoelectric cooler can be replaced with a low-cost thermocouple to reduce the product cost.

[0121] In this application, the sliding mechanism includes a plurality of connecting columns 4226 and ball bushings 4227. Both ends of the connecting column 4226 are fixedly connected to the upper housing 4221 and the lower housing 4222 respectively. The ball bushing 4227 is arranged inside the upper housing 4222, so that the upper housing 4221 can slide along the connecting column 4226 with the ball bushing 4227. The connecting column 4226 is used to connect the upper housing 4221 and the lower housing 4222. The ball bushing 4227 is sleeved outside the connecting column 4226, enabling the upper housing 4221 to slide relative to the lower housing 4222, thereby adjusting the distance between the upper housing 4221 and the lower housing 4222. The upper housing 4221 presses the elastic mechanism 4223, applying a downward force to the lower housing 4222, so that the lower housing 4222 presses the chip below.

[0122] The sliding mechanism in this application further includes a plurality of equal-height screws 4228. One end of the equal-height screw 4228 is fixedly connected to the lower housing 4222, and the other end is movably connected to the upper housing 4221. The equal-height screw 4228 in this embodiment is used as a push rod screw. The equal-height screw 4228 can ensure that the upper housing 4221 can move parallelly, and will not break due to uneven force on the push rod caused by tilting.

[0123] In this application, the numbers of the connecting columns 4226 and the equal-height screws 4228 are both two, and they are evenly distributed at the four corners of the upper housing 4221 and the lower housing 4222. And the two connecting columns 4226 are distributed on two diagonals of the upper housing 4221 and the lower housing 4222, and the two equal-height screws 4228 are distributed on the other two diagonals. The connecting columns 4226 and the equal-height screws 4228 are arranged at intervals to avoid the situation where the upper housing 4221 moves downward with uneven force and tilts when the two equal-height screws 4228 are arranged on the same side.

[0124] In this application, the elastic mechanism 4223 is a plurality of springs, and the plurality of springs are symmetrically distributed with respect to the centers of the upper housing 4221 and the lower housing 4222. In this application, the elastic mechanism 4223 is a buffer mechanism. The upper housing 4221 applies a force to the lower housing 4222 through the elastic mechanism 4223. The elastic mechanism 4223 can also be an elastic colloid with a relatively large elasticity, as long as it can transfer the pressure of the upper housing 4221 well.

[0125] In this application, the shape of the indenter 4224 is square, and both the length and width are 15 mm. The chip to be detected in this application is square or rectangular, and the maximum width does not exceed 15 mm. The above setting of the indenter 4224 meets the maximum compatible size and is applicable to all chips, and there is no need to replace the indenter when detecting different chips. The material of the indenter 4224 in this application is copper, which is convenient for quickly transferring the heat generated by the temperature conversion module 4225 when the chip test environment requires a high-temperature environment.

[0126] In this application, the test indenter 422 further includes a cooling pipe 4229. The cooling pipe 4229 penetrates through the lower housing 4222 and is in contact with the temperature conversion module 4225. The cooling pipe 4229 is used for the coolant to flow through to cool down the test indenter 422.

[0127] In this application, the test indenter 422 further includes a temperature sensor. The temperature sensor is arranged inside the lower housing 4222 and is used to detect the temperature of the temperature conversion module 4225. When the internal temperature exceeds the preset temperature, it can be adjusted in time to avoid damaging the chip.

[0128] In this embodiment, the telescopic mechanism 425 is a test indenter cylinder. The mounting plate 423 is fixedly connected to the piston rod of the test indenter cylinder, so that the test indenter cylinder drives the mounting plate 423 to expand and contract. The test plate 424 passes through the piston rod and is arranged between the mounting plate 423 and the test indenter cylinder.

[0129] In this embodiment, the test module 42 further includes a sealing device. The sealing device includes a protective cover 427 and a motion mechanism. One end of the protective cover 427 is open, and the opening direction faces the test plate 424. The mounting plate 423 is located between the protective cover 427 and the test plate 424. The protective cover 427 is used to fit with the test plate 424 to form a sealed space, seal the chip test module 7 in the sealed space, and then create a low-temperature or high-temperature environment in the sealed space. The motion mechanism is used to drive the protective cover 427 to move.

[0130] In this embodiment, the motion mechanism includes a protective cover cylinder 428, a shaft 429, and a bearing 4210. The protective cover cylinder 428 passes through the test plate 424 and is fixedly connected to the protective cover 427. One end of the shaft 429 is fixed on the test plate 424, and the length direction of the shaft 429 is perpendicular to the mounting plate 423 and the test plate 424. The bearing 4210 is sleeved on the shaft 429 and is fixedly connected to the side of the protective cover 427. The protective cover cylinder 428 drives the protective cover 427 to move up and down along the shaft 429, so that the protective cover 427 approaches or moves away from the test plate 424.

[0131] In this embodiment, on the bottom surface of the protective cover 427 opposite to the opening, there are a vacuum pumping pipe orifice 4211, a sealed wire passing hole 4212, and a coolant inlet 4213. The vacuum pumping pipe orifice 4211 is connected to a vacuum pumping device and is used to pump vacuum inside the protective cover 427 to prevent the generation of condensed water during low-temperature testing. The sealed wire passing hole 4212 is used for the electrical connection wires of the test probe 421 and the test indenter 422 to pass through. The coolant inlet 4213 is used to inject coolant into the test indenter 422. One end of the above-mentioned cooling pipe 4229 is arranged at the coolant inlet 4213 to receive coolant from the outside.

[0132] In this embodiment, a sealing ring 4214 is provided on one side of the test board 424 facing the protective cover 427. The sealing ring 4214 has the same shape as the protective cover 427 and is used to seal when the protective cover 427 is attached to the test board 424, forming a sealed space. The test board 424 is also provided with a plurality of cylinder holes for the test indenter cylinder and the protective cover cylinder 428 to pass through from the test board 424. The telescopic mechanism 425 and the protective cover cylinder 428 and the protective cover 427 and the mounting plate 423 are respectively located on both sides of the test board 424. A cylinder sealing ring 4215 is provided in the cylinder hole. The cylinder sealing ring 4215 cooperates with the sealing ring 4214 to seal the piston rod of the cylinder, so that a sealed space is formed when the protective cover 427 is attached to the test board 424.

[0133] In this embodiment, the test rack 41 includes multiple layers, and each layer of the test rack 41 is provided with a plurality of test module installation positions. In this embodiment, each layer of the test rack 41 includes four test module installation positions. The test racks 41 of each layer are detachably connected, which is convenient for handling and installation. At least one exhaust port 43 is also provided at the top of the test rack 41 for dissipating heat from the test rack 41.

[0134] In this embodiment, the testing machine 4 is provided with a plurality of test positions, and each test position is integrated with a chip test module unlocking device 8 for unlocking the chip test module 7; each test position is respectively a working station for fixing the chip test module 7 and testing the chip. The specific structure of the chip test module unlocking device 8 is described in the following part.

[0135] In this embodiment, a power interface and a communication interface are also integrated at each test position; the power interface is used to supply power to the chip test module 7 for testing. The communication interface is electrically connected to the chip test module 7 and is used to communicate with the chip test module 7, so that the outside world can obtain the test process and test results of the chip test module 7. The communication interface includes but is not limited to: network interface, USB interface, 232 serial port, etc.

[0136] In this embodiment, the testing machine 4 is integrated with a processor, and a database is provided in the processor. The processor is used to collect the test information of the chip test module 7 and upload it to the information center. The database is used to collect the above test information. The processor collects, sorts, and uploads the test data of the chip test module 7 to the data information center, which can be used for technicians to intuitively analyze the test results. The working process of the testing machine of this application is as follows:

[0137] Receive and fix the chip test module 7 conveyed by the auxiliary loading machine 3. The positioning mechanism 426 fixes the chip test module 7 on the test board 424. The telescopic mechanism 425 drives the test probe 421 and the test pressure head 422 to descend until they are electrically connected to the chip test module 7. When performing a high-temperature test on the chip, the temperature conversion module on the test pressure head 422 heats the chip. When performing a low-temperature test on the chip, the temperature conversion module on the test pressure head 422 cools down, the protective cover 427 descends to form a sealed space with the test board 424, and an external vacuum pumping device pumps the sealed space through the vacuum pumping pipe orifice 4211 to create a low-temperature environment for the chip to be tested in the low-temperature environment. After the test is completed, the auxiliary loading machine 3 transports the tested chip test module 7 to the tested module transmission line 62.

[0138] Please refer to Figure 30 , Figure 30 which is a schematic structural diagram of the automatic blanking device in the present invention. The automatic blanking device 5 in this application includes a blanking control system, a sorting and arranging machine 51, a blanking machine 52, and a transfer mechanism 53; the blanking control system is used to control the operation of the sorting and arranging machine 51, the blanking machine 52, and the transfer mechanism 53; the sorting and arranging machine 51 includes a sorting mechanism 511 and an arranging and transporting mechanism 512. The sorting mechanism 511 is used to sort materials, and the arranging and transporting mechanism is used to transport the materials to the transfer mechanism 53; the transfer mechanism 53 straddles the sorting and arranging machine 51 and the blanking machine 52, and is used to receive the materials from the sorting and arranging machine and transfer the materials to the blanking machine 52; the blanking machine 52 includes a blanking carrier 521, a first displacement mechanism 522, and a blanking carrier 523; the first displacement mechanism 522 is arranged on the blanking carrier 521 and is used to grab the materials from the transfer mechanism 53 and move the materials into the blanking carrier 523. The automatic blanking device 5 is used to receive the chip test module 7 with the tested chips from the tested module transmission line 62, then grab the chips from the chip test module 7, move the chips into the blanking carrier 523, and transport the blanking carrier 523 containing the chips out for storage manually. In the automatic blanking device 5 of this application, a blanking control system, a sorting and arranging machine 51, and a blanking machine 52 are provided. The blanking control system receives the results after the test by the tester 4 and distinguishes the chips with abnormal tests and normal tests. The sorting and arranging machine 51 automatically sorts the tested chips, eliminates the chips with abnormal tests, and transfers the chips with normal tests to the blanking machine 52. The transfer mechanism 53 is arranged between the sorting and arranging machine 51 and the blanking machine 52 and is used to transfer the chips. The blanking machine 52 places the received different chips into different blanking carriers 523 according to categories and stores the chips classifiedly. Thus, fully automatic blanking is realized, the manpower is reduced, and the production efficiency is improved. The automatic blanking device 5 will be described in detail below.

[0139] Please refer to Figure 31 , Figure 31It is a schematic structural diagram of the sorting and arranging machine of the automatic blanking device in the present invention. In this application, the sorting and arranging machine 51 includes a sorting mechanism 511 and an arranging and transporting mechanism 512. The sorting mechanism 511 is controlled by a blanking control system to sort the detected chips. The chip sorting mechanism 511 includes a scanning gun 5111 and a rejection placement box 5112. The scanning gun 5111 is arranged on one side of the chip test module unlocking device 8 described below and is used to scan the chip test module 7. The rejection placement box 5112 is arranged at the lower part of the sorting and arranging rack 5122. When the chip test module 7 contains a chip with abnormal test, the chip test module 7 is automatically rejected, and then the chip with abnormal test can be retested according to the detection situation.

[0140] Please refer to Figures 32 to 33 , Figure 32 which is the bottom view of the arranging and transporting mechanism in the present invention, Figure 33 and is the assembly drawing of the sorting telescopic cylinder and the sorting lead screw module in the arranging and transporting mechanism of the present invention. In this application, the arranging and transporting mechanism 512 includes a second displacement mechanism, a sorting and arranging rack 5121, a chip test module unlocking device 8, and a chip test module lifting mechanism 5122. The second displacement mechanism is arranged on the sorting and arranging rack 5121 and is used to move the material to the transfer mechanism 53. The chip test module unlocking device 8 corresponds to the position of the chip test module lifting mechanism 5122 and is used to unlock the chip test module 7 in the chip test module lifting mechanism 5122 so as to take out the chips in the chip test module 7. The chip test module lifting mechanism 5122 is arranged at the lower part of the sorting and arranging rack 5121 and is used to carry the chip test module 7 to lift. Specifically, the chip test module lifting mechanism 5122 can be a guide rail slider combination or a cylinder, as long as it can drive the chip test module 7 to move up and down.

[0141] Specifically, the second displacement mechanism includes a sorting guide rail 5123, a sorting motor 5124, a sorting variable pitch suction cup module 5125, a sorting telescopic cylinder 5126, and a sorting lead screw module 5127. The sorting guide rail 5123 is fixed to the sorting and arranging rack 5121, and the sorting variable pitch suction cup module 5125 can slide along the sorting guide rail 5123. The sorting motor 5124 is used to drive the sorting telescopic cylinder 5126 to move, and the sorting telescopic cylinder 5126 can drive the sorting variable pitch suction cup module 5125 to move up and down along the sorting lead screw module 5127. The sorting variable pitch suction cup module 5125 can slide along the sorting guide rail 5123, the length direction of the sorting guide rail 5123 is perpendicular to the length direction of the transfer mechanism 53, and the sorting telescopic cylinder 5126 can drive the sorting variable pitch suction cup module 5125 to move up and down along the sorting lead screw module 5127. The process of the sorting variable pitch suction cup module 5125 grasping the chip is as follows: grasping the chip from the chip testing module 7 on one side of the sorting and arranging rack 5121, driving the up and down movement through the sorting telescopic cylinder 5126 during the grasping process, and after grasping, the sorting variable pitch suction cup module 5125 vertically moves to the transfer mechanism 53 located in the middle and then descends again to transfer the chip to the transfer mechanism 53.

[0142] Please refer to Figure 34 , Figure 34 is a schematic diagram of the transfer mechanism of the arranging and transporting mechanism in the present invention. In this application, the transfer mechanism 53 includes a material placement box 531 and a material transfer guide rail 532. The material transfer guide rail 532 straddles the sorting and arranging machine 51 and the blanking machine 52. The material placement box 531 is slidably connected to the material transfer guide rail 532. During the process of the chip being transported between the sorting and arranging machine 51 and the blanking machine 52, the chip is located in the material placement box 531 and moves horizontally through the material transfer guide rail 532. The chips are placed in the material placement box 531 according to the chip type. For example, chips of the same type are placed vertically in the preset columns of the material placement box 531, so as to facilitate the subsequent blanking machine 52 to centrally process chips of the same type. In this embodiment, the material placement box 531 includes two. One of them transports the chips to the blanking machine 52, and at the same time, the other loads the chips on the sorting and arranging machine 51, improving the production efficiency. The heights of the two material placement boxes 531 are different, which can avoid collision and position conflict.

[0143] The sorting and arranging machine 51 of this application can not only distinguish between abnormal and normal chips after being tested by the testing machine 4, but also distinguish different types of chips, place chips of the same type together, and the subsequent blanking machine 52 does not need to identify and judge, which is convenient for quick grasping and improves the production efficiency.

[0144] Please refer to Figure 35 , Figure 35It is a schematic structural diagram of the blanking machine of the automatic blanking device in the present invention. The blanking machine 52 in this application includes a blanking carrier 521, a first displacement mechanism, and a blanking carrier 522. The blanking carrier 521 includes a bottom frame 5211 and a top frame 5212, and the top frame 5212 is fixed to the upper part of the bottom frame 5211; the blanking carrier 522 is arranged at the upper end of the bottom frame 5211; the first displacement mechanism is arranged on the top frame 5212. The blanking carrier 521 is used to carry the first displacement mechanism and the blanking carrier 522, and the blanking carrier 522 is used to hold and collect the chips that pass the test. Preferably, the blanking carrier 522 is a tray.

[0145] Please refer to Figures 36 to 37 , Figure 36 It is a bottom view of the first displacement mechanism of the automatic blanking device in the present invention. Figure 37 It is an assembly diagram of the blanking telescopic cylinder and the blanking lead screw module in the first displacement mechanism of the present invention. The first displacement mechanism in this application includes a first blanking guide rail 523, a first blanking motor 524, a blanking variable pitch suction cup module 525, a blanking telescopic cylinder 526, and a blanking lead screw module 527; the first blanking guide rail 523 is fixed to the top frame 5212, and the blanking variable pitch suction cup module 525 can slide along the first blanking guide rail 523; the first blanking motor 524 is used to drive the blanking telescopic cylinder 526 to move, and the blanking telescopic cylinder 526 can drive the blanking variable pitch suction cup module 525 to move up and down along the blanking lead screw module 527. The structure and function of the first displacement mechanism are similar to those of the above-mentioned second displacement mechanism. The first blanking motor 524 drives the blanking variable pitch suction cup module 525 to slide on the first blanking guide rail 523, that is, to move on the horizontal plane, and the blanking telescopic cylinder 526 drives it to move in the vertical direction along the blanking lead screw module 527, so as to grab the chips and transfer the chips from the material placement box 531 into the blanking carrier 522, and then manually move the full blanking carrier 522 to the storage area.

[0146] In this application, the first displacement mechanism further includes a second blanking guide rail 528 and a second blanking motor 529. The second blanking guide rail 529 is perpendicular to the first blanking guide rail 523. The second blanking motor 529 is used to drive the first displacement mechanism to move along the second blanking guide rail 528. Taking the length direction of the first blanking guide rail 523 as the x-axis for example, the length direction of the second blanking guide rail 528 is the y-axis direction. The blanking variable pitch suction cup module 525 in the first displacement mechanism can slide along the first blanking guide rail 523, that is, slide along the x-axis direction, and the entire first displacement mechanism can also slide along the second blanking guide rail 528, that is, slide along the y-axis direction. The above settings can enable the blanking variable pitch suction cup module 525 to move in both the x-axis and y-axis directions. The material transfer guide rail 532 in this application is arranged along the x-axis direction. The blanking carriers 522 are distributed at the upper and lower ends of the blanking machine 52 and are arranged in two rows. When blanking, the first displacement mechanism can move on the x-axis, grab the chips transferred through the material placement box 531, and then adjust the position to transfer the chips to the blanking carrier 522 along the y-axis direction.

[0147] The number of the blanking carriers 522 in this embodiment is multiple. When in use, the first displacement mechanism places different types of chips in different blanking carriers 522, so as to distinguish the chip categories.

[0148] In this application, a blanking box 5210 and a blanking box lifting device are further provided at the lower part of the blanking machine 52; the bottom of the blanking box 5210 abuts against the blanking box lifting device, and the blanking carrier 522 is placed in the blanking box 5210; the blanking box lifting device includes a lifting motor and a blanking cylinder assembly. The lifting motor is used to drive the blanking cylinder assembly to move, and the blanking cylinder assembly pushes the blanking box 5210 to rise or fall. The blanking box 5210 is used to carry the blanking carrier 522, and the blanking carrier 522 can be placed in multiple layers in the blanking box 5210. The blanking box lifting device drives the multiple layers of blanking carriers 522 to be used to the upper part of the blanking carrier 521 for the first displacement mechanism to drive the chips into the blanking carrier 522.

[0149] In this application, the number of blanking carriers 522 and blanking boxes 5210 is multiple, and they are arranged in sequence on the blanking machine 52. The chips are placed in the blanking carriers 522, and the blanking carriers 522 are stacked in the blanking boxes 5210. The multiple blanking carriers 522 are arranged in two rows and multiple columns, and each blanking carrier 522 is used to hold different types of chips. A manipulator 5213 is also provided on the blanking machine 52, and the manipulator 5213 is used to pick up the blanking carrier 522 and place it into the blanking box 5210. At least one of the multiple blanking carriers 522 is a blank blanking carrier 522. When the blanking carrier 522 is filled with chips, the manipulator 5213 grabs a blank blanking carrier 522 from there and stacks it on the blanking carrier 522 that is already filled with chips. The blanking box 5210 moves down by the height of one blanking carrier 522, so that the blank blanking carrier 522 is flush with the plane of the blanking machine 52. After multiple layers of blanking carriers 522 are placed in the blanking box 5210, the multiple layers of blanking carriers 522 are manually moved to external storage.

[0150] The automatic blanking device 5 in this application further includes a chip test module unlocking device 8. The chip test module unlocking device 8 is provided on the sorting and arranging machine and is used to unlock the chip test module 7. The specific structure of the chip test module unlocking device 8 will be described in detail below.

[0151] The automatic blanking device 5 in this application further includes an abnormal module lifting mechanism. The abnormal module lifting mechanism places the abnormal materials scanned by the scanning gun 5111 in the area to be tested, so as to separate the chip test module 7 containing the chips with test abnormalities from the chip test module 7 with normal test results, and lift the chip test module 7 containing the chips with test abnormalities to the area to be tested. Subsequently, the chip test module 7 located in the area to be tested is processed manually.

[0152] Please refer to Figure 38 and Figure 39 , Figure 38 is the structural schematic diagram of the chip test module unlocking device of the present invention, Figure 39It is an assembly schematic diagram of the unlocking device of the chip test module and the chip test module of the present invention. In the chip test pipeline of the present application, there is an unlocking device 8 for the chip test module. The unlocking device 8 for the chip test module includes a driving device 81, a transmission member 82, and a pull rod 83. One end of the pull rod 83 is fixed to the transmission member 82, and the other end abuts against the positioning block 722 of the chip test module 7. The driving device 81 is used to drive the transmission member 82 to move. The moving direction of the transmission member 82 is the direction in which the pull rod 83 moves away from the chip test module 7. The foregoing content has been described accordingly. When the chip is carried on the chip test module 7, it is limited by the chip positioning mechanism 72 and cannot move. Before the chip is placed in or taken out of the chip test module 7, the chip positioning mechanism 72 needs to be opened first so that the chip can move freely. The unlocking device 8 for the test module is used to open the chip positioning mechanism 72.

[0153] In the chip test pipeline of the present application, the automatic loader 1, the tester 4, and the automatic unloading device 5 are all provided with an unlocking device 8 for the chip test module, which is used to unlock the chip test module 7. The unlocking device 8 for the chip test module is provided on the automatic loader 1 and is used to open the chip positioning mechanism 72 and then place the chip. The unlocking device 8 for the chip test module is provided on the tester 4 and is used to test the chip. The unlocking device 8 for the chip test module is provided on the automatic unloading device 5 and is used to open the chip positioning mechanism 72 and then take out the chip.

[0154] Specifically, the driving device 81 is used to drive the pull rod 83 to move through the transmission member 82. When unlocking, the insertion part 831 at one end of the pull rod 83 is inserted into the through groove 761 of the middle cover plate 76 of the chip positioning mechanism 72, so that the side part of the insertion part 831 abuts against the protrusion 7224 of the positioning block 821. When the pull rod 83 moves, it pushes the positioning block 821 to move, and the moving direction is the direction away from the chip, so that the positioning block 722 is separated from the chip, and the chip can be grabbed.

[0155] In the present application, the transmission member 82 includes a positioning plate 821, and the positioning plate 821 is provided with a first mounting hole 822. The driving device 81 is arranged in the first mounting hole 822. In this embodiment, the first mounting hole 822 is arranged at the center of the positioning plate 821, and the driving device 81 is also installed at the center position of the positioning plate 821, which is convenient for the transmission member 82 to move under force.

[0156] Preferably, the driving device 81 is a cylinder, and the included angle between the telescopic direction of the cylinder and the length direction of the positioning plate 821 is 45 degrees. As described above, the length direction of the positioning block 722 forms a 45-degree angle with the length and width directions of the chip, which is convenient for one end of the positioning block 722 to limit the two side surfaces of the chip, and at the same time, the applied force is relatively balanced. The positioning plate 821 is parallel to the chip. To drive the positioning block 722 to move, the telescopic direction of the cylinder is also set to 45 degrees, which is the same as the length direction of the positioning block 722. When the cylinder expands and contracts, it drives the positioning plate 821 and the pull rod 83 to move linearly along the 45-degree angle direction, pushing the positioning block 722 away from the chip to unlock the chip positioning mechanism 72.

[0157] In the unlocking device 8 of the chip test module of the present application, there is also an unlocking guide rail 84. The unlocking guide rail 84 is arranged below the positioning plate 821. The positioning plate 821 can slide along the unlocking guide rail 84. The included angle between the length direction of the unlocking guide rail 84 and the length direction of the positioning plate 821 is 45 degrees. The positioning plate 821 is pushed by the driving device 81 and slides along the unlocking guide rail 84, and the sliding direction is at a 45-degree angle, which is the same as the movement direction of the positioning block 722.

[0158] In the unlocking device 8 of the chip test module of the present application, there is also an elastic device 85. The elastic device 85 abuts against the transmission member 82; the length direction of the elastic device 85 is the same as the length direction of the unlocking guide rail 84. In this embodiment, the elastic device 85 is provided to facilitate the rebound of the transmission member 82 and automatic reset. When the transmission member 82 pushes the positioning block 722 to unlock, the elastic device 85 is compressed. When the unlocking is completed, the elastic device 85 releases the elastic force to push the transmission member 82 to reset, which is convenient for unlocking another chip positioning mechanism 72.

[0159] In the present application, a second mounting hole 823 is provided on the positioning plate 821, and the elastic device 85 is arranged in the second mounting hole 823, which is convenient for the elastic device 85 to directly apply an elastic force to the positioning plate 821. The length direction of the elastic device 85 forms a 45-degree angle with the length direction of the positioning plate 821, so that the elastic force direction of the elastic device 85 is the same as the movement direction of the positioning plate 821.

[0160] Preferably, in the present application, the elastic device 85 is a spring. Of course, the elastic device 85 can also be an elastic colloid, which can also apply a return elastic force to the positioning plate 821 to drive the positioning plate 821 to move.

[0161] In this application, the number of the drawbars 83 is multiple, and the distance between the multiple drawbars 83 is equal to the distance between the multiple positioning blocks 722. The unlocking device 8 of the chip test module in this application is provided with multiple drawbars 83, and the distance between the drawbars 83 is the same as the distance between the positioning blocks 722 on the chip test module 7, so that the multiple drawbars 83 unlock the multiple chip test modules 7 simultaneously. Preferably, in this embodiment, the chip test module 7 is provided with four chip positioning mechanisms 72, and eight drawbars 83 are arranged on the positioning plate 821, so that all the chips on two chip test modules 7 can be unlocked simultaneously.

[0162] The working process of the unlocking device 8 of the chip test module in this application is as follows:

[0163] Fix the chip test module 7, insert the lower end of the drawbar 83 into the through groove 761 of the chip test module 7, the driving device 81 drives the drawbar 83 to move through the transmission member 82, the drawbar 83 pushes the positioning block 722 to slide away from the chip, and the chip can be placed into the chip test module 7 or grabbed from the chip test module 7 to the outside. The elastic device 85 is compressed during the above process. Then the drawbar 83 is disengaged from the chip test module 7, and the elastic device 85 applies an elastic force to the transmission member 82 to drive the transmission member 82 and the drawbar 83 to reset.

[0164] When using the unlocking device of the chip test module of the present invention, by setting the driving device, the transmission member and the drawbar, the drawbar corresponds to the positioning block on the chip test module, and the driving device pushes the positioning block to move through the transmission member, so as to unlock the chip test module, meeting the unlocking requirements when the chip test module places and takes out the chip.

[0165] To solve the technical problem, the present invention also provides a chip testing method. Please refer to Figure 40 , Figure 40 which is the flowchart of the chip testing method. The testing method includes the following steps:

[0166] S100: Loading. The chip is transferred to an empty chip test module through an automatic loading machine. Specifically, the chip is grabbed from the incoming carrier and then moved into the empty chip test module.

[0167] S200: Testing. The chip test module carrying the chip to be tested is transferred to the testing machine through the transmission line, and the testing machine tests the chip to be tested. Specifically, the chip is transferred to the testing machine in the chip test module, and the testing machine provides a testing environment matching the testing parameters to test the chip.

[0168] S300: Unloading. The chip test module carrying the tested chips is transferred from the tester to the transmission line, flows through the transmission line to the automatic unloading device, and the automatic unloading device transfers the tested chips from inside the chip test module to the outside. Specifically, after the chips are tested on the tester, they flow to the automatic unloading device, and the chips are transferred from inside the chip test module to the unloading carrier, and the chip testing is completed.

[0169] Before the chips in this application are transferred into the chip test module by the automatic loading machine, it includes:

[0170] The empty chip test module is transferred to the transmission line through the material turnover device and flows through the transmission line to the automatic loading machine. The chip test module in this application is also automatically loaded and is transferred from the outside to the automatic loading machine through the material turnover device to carry the chips to be tested.

[0171] In this application, the chip test module carrying the chips to be tested is transferred to the tester through the transmission line, including:

[0172] Transfer the chip test module carrying the chips to be tested to the tester through the auxiliary loading machine;

[0173] The chip test module carrying the tested chips is transferred from the tester to the transmission line, including:

[0174] Transfer the chip test module carrying the tested chips from the tester to the transmission line through the auxiliary loading machine. In this application, an auxiliary loading machine is set up to load and unload the tester, transfer the chip test module to the tester for testing, and then transfer it to the transmission line after testing and transfer it to the automatic unloading machine.

[0175] In this application, the number of testers is an integer multiple of the number of auxiliary loading machines, and the test parameters of each tester can be the same or different. One auxiliary loading machine can serve multiple testers, and the test parameters of the testers can be the same or different, so that the testers can test different chips at the same time or test the chips under different parameter environments. The tester is a combined structure and can be flexibly combined according to different chip test methods, increasing or decreasing the number of testers, so that the entire test line is always in the most efficient state.

[0176] In this application, the automatic unloading device transfers the tested chips from inside the chip test module to the outside, including: The automatic unloading device sorts the tested chips with normal test results and abnormal test results, and transfers the tested chips with normal test results from inside the chip test module to the outside. The automatic unloading device not only undertakes the unloading process, but also has a sorting function, eliminates the chips with abnormal test results and waits for manual follow-up processing, and only unloads and collects the chips with normal test results.

[0177] Using the chip test pipeline and chip test method of the present invention, from the loading, testing to unloading of the chip, the entire process of chip testing is fully automated, solving the problem of low automation degree existing in the current chip test pipeline, reducing the manual workload, improving the production efficiency and production capacity, and at the same time reducing the production cost; the chip test pipeline of the present invention is of a combined structure, which can be flexibly combined according to different chip test methods, increasing or decreasing the number of test machines, so that the whole test line is always in the highest efficiency state; the chip test pipeline of the present invention has the ability to quickly switch between high and low temperature wide temperature ranges, and can replace traditional aging equipment in problems such as aging (BURN IN) in the chip test link; the chip test pipeline of the present invention makes full use of the advantage of the test module being replaceable and upgradeable, realizes multi-tasking, and has the remarkable characteristics of flexible manufacturing; the chip test pipeline of the present invention adopts a modularized test structure module solution for the characteristics of frequent IC test updates and replacements, providing continuous availability of the equipment for rapid product iteration.

[0178] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present invention.

Claims

1. A chip testing pipeline, characterized in that, the chip testing pipeline successively includes an automatic loading machine, a material turnover device, an auxiliary loading machine, a testing machine and an automatic unloading device. The automatic loading machine, the material turnover device, the auxiliary loading machine and the automatic unloading device are connected by a transmission line. The testing machine is arranged on the back of the auxiliary loading machine; the automatic loading machine is used to grab the chips to be detected and transfer the chips to be detected to the transmission line; the material turnover device is used to provide a chip testing module for the automatic loading machine so that the automatic loading machine transfers the chips to be detected into the chip testing module; the auxiliary loading machine is used to receive the chip testing module carrying the chips to be detected transmitted by the automatic loading machine, transfer the chip testing module carrying the chips to be detected to the testing machine, and transfer the chip testing module carrying the detected chips after being tested by the testing machine to the transmission line; the testing machine is used to cooperate with the chip testing module carrying the chips to be detected to detect the chips to be detected; the automatic unloading device is used to receive the chip testing module carrying the detected chips and transfer the detected chips from the chip testing module to the outside for sorting and collection; wherein, the chip testing module includes a chip mounting board and a chip positioning mechanism, and the chip mounting board and the chip positioning mechanism are detachably connected; a chip pin carrier board is fixed on the chip mounting board; the chip positioning mechanism includes a chip cavity, a positioning block and an elastic member; the chip cavity is provided with a chip mounting groove, and the chip pin carrier board is sleeved in the chip mounting groove; one end of the positioning block extends into the chip mounting groove and abuts against the chip; the elastic member is arranged at the other end of the positioning block and is used to apply an elastic force to the positioning block; wherein, testing module unlocking devices are arranged on the automatic loading machine, the testing machine and the unloading machine respectively, and are used to unlock the chip testing module; the testing module unlocking device includes a driving device, a transmission member and a pull rod; one end of the pull rod is fixed on the transmission member, and the other end abuts against the positioning block of the chip testing module; the driving device is used to drive the transmission member to move; the moving direction of the transmission member is the direction in which the pull rod is away from the chip testing module.

2. The chip testing pipeline according to claim 1, characterized in that, the automatic loading machine includes a control system, a frame, a grabbing mechanism and a detection device; the control system is used to control the operation of the grabbing mechanism and the detection device; the frame is used to carry the grabbing mechanism and the detection device; the grabbing mechanism is used to grab materials and displace the materials; the detection device is used to detect the materials during the displacement of the materials.

3. The chip testing pipeline according to claim 1, characterized in that, the material turnover device includes a turnover cart and a retractor, and the turnover cart and the retractor are movably matched; the turnover cart is provided with a storage rack; The reel has a frame, a lifting mechanism, and a lateral movement mechanism; The lifting mechanism is installed on the frame and is used to drive the lateral movement mechanism to move up and down along the frame; The lateral movement mechanism expands and contracts in a horizontal direction perpendicular to the lifting direction and is used to drive the material to horizontally displace between the storage rack and the reel.

4. According to the chip testing pipeline of claim 2, wherein, The auxiliary loading machine includes an auxiliary loading control system, a driving device, and a handling mechanism; The auxiliary loading control system is used to control the operation of the handling mechanism; The driving device drives the handling mechanism to move; The handling mechanism includes a transfer track and a gripper assembly; the transfer track includes a z-axis track, an x-axis track, and a y-axis track. The z-axis track can slide along the x-axis track, and the y-axis track is slidably connected to the z-axis track; The gripper assembly is slidably connected to the y-axis track.

5. According to the chip testing pipeline of claim 1, wherein, The testing machine includes a testing rack and a testing module, and the testing module is installed on the testing rack; The testing module includes testing probes, a testing press head, a mounting plate, a testing board, and a telescopic mechanism; The testing probes and the testing press head are fixed on the mounting plate; The testing board is opposite to the mounting plate and is used to place the testing module; The telescopic mechanism is used to drive the mounting plate to approach or move away from the testing board; The testing press head is provided with a temperature conversion module.

6. According to the chip testing pipeline of claim 5, wherein, The testing press head includes an upper housing, a lower housing, a sliding mechanism, an elastic mechanism, a press head, and a temperature conversion module; The top of the upper housing is used for fixed assembly; The top of the lower housing is opposite to the bottom of the upper housing. The press head is arranged at the bottom of the lower housing, and the temperature conversion module is arranged inside the lower housing; The sliding mechanism connects the upper housing and the lower housing, so that the upper housing and the lower housing can slide relative to each other; The elastic mechanism is arranged between the upper housing and the lower housing.

7. According to the chip testing pipeline of claim 1, wherein, The automatic unloading device includes an unloading control system, a sorting and arranging machine, an unloading machine, and a transfer mechanism; The unloading control system is used to control the operation of the sorting and arranging machine, the unloading machine, and the transfer mechanism; The sorting and arranging machine includes a sorting mechanism and an arranging and transporting mechanism. The sorting mechanism is used to sort the materials, and the arranging and transporting mechanism is used to transport the materials to the transfer mechanism; The transfer mechanism straddles the sorting and arranging machine and the unloading machine and is used to receive the materials from the sorting and arranging machine and transfer the materials to the unloading machine; The unloading machine includes an unloading carrier, a first displacement mechanism, and an unloading carrier; The first displacement mechanism is arranged on the unloading carrier and is used to grab the materials from the transfer mechanism and move the materials into the unloading carrier.

8. According to the chip testing pipeline of claim 1, wherein, The transmission line at least includes a transmission line for a module to be tested, a transmission line for a tested module, and a transmission line for an empty module; The transmission line for the module to be tested and the transmission line for the tested module are arranged side by side in the horizontal direction, and the transmission line for the module to be tested and the transmission line for the empty module are arranged side by side in the vertical direction.

9. A chip testing method, characterized in that, the chip testing method is applied to the chip testing pipeline according to any one of claims 1-8, and the method includes the following steps: The chip is transferred into an empty chip testing module through an automatic loading machine; The chip testing module carrying the chip to be tested is transferred to a testing machine through a transmission line, and the testing machine tests the chip to be tested; The chip testing module carrying the tested chip is transferred from the testing machine to the transmission line, flows through the transmission line to an automatic unloading device, and the automatic unloading device transfers the tested chip from the chip testing module to the outside.

10. The chip testing method according to claim 9, characterized in that, before the chip is transferred into the chip testing module through the automatic loading machine, it includes: The empty chip testing module is transferred to the transmission line through a material turnover device and flows through the transmission line to the automatic loading machine.

11. The chip testing method according to claim 9, characterized in that, the transfer of the chip testing module carrying the chip to be tested to the testing machine through the transmission line includes: transferring the chip testing module carrying the chip to be tested to the testing machine through an auxiliary loading machine; the transfer of the chip testing module carrying the tested chip from the testing machine to the transmission line includes: transferring the chip testing module carrying the tested chip from the testing machine to the transmission line through an auxiliary loading machine.

12. The chip testing method according to claim 11, characterized in that, the number of the testing machines is an integer multiple of the number of the auxiliary loading machines, and the testing parameters of each testing machine are the same or different.

13. The chip testing method according to claim 9, characterized in that, the transfer of the tested chip from the chip testing module to the outside by the automatic unloading device includes: The automatic unloading device sorts the tested chips with normal test results and abnormal test results, and transfers the tested chips with normal test results from the chip testing module to the outside.

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