Flexible circuit film bonding device and method for bonding flexible circuit film using the same

Abstract

The present application provides a flexible circuit film bonding device and a method for bonding a flexible circuit film using the same. The flexible circuit film bonding device includes a platform, an extrusion head, a pad, and a heating control unit, wherein the platform is configured to support a TFT substrate; the extrusion head is configured to extrude and heat a flexible circuit film, which is attached to the TFT substrate with an anisotropic conductive film interposed therebetween; the pad is configured to support and heat the TFT substrate located below the flexible circuit film; and the heating control unit is configured to control the temperature of the lower surface of the extrusion head and the upper surface of the pad, wherein the temperature of the upper surface of the pad is less than 170 degrees Celsius.

Description

Technical Field

[0001] Exemplary embodiments of the present invention generally relate to a flexible circuit film bonding device and a method of bonding a flexible circuit film using the flexible circuit film bonding device. More specifically, exemplary embodiments of the present invention generally relate to a flexible circuit film bonding device for manufacturing a display device and a method of bonding a flexible circuit film using the flexible circuit film bonding device. Background Art

[0002] Recently, display devices with light weight and small size have been manufactured. Cathode ray tube (CRT) display devices are used due to their performance and competitive price. However, the large size and reduced portability of CRT display devices cause problems. Therefore, display devices such as plasma display devices, liquid crystal display devices, and organic light emitting display devices are highly valued because they are small in size, light in weight, and have low power consumption.

[0003] The flexible circuit film bonding apparatus is a device for attaching a flexible film on a substrate using an anisotropic conductive film and providing heat and pressure to connect a conductive pattern on the substrate to a conductive pattern of a chip connected to the flexible film.

[0004] When the flexible circuit film is bonded to the substrate using the flexible circuit film bonding device, the process may be delayed and excessive heat transfer may occur to cause failure.

[0005] The above information disclosed in this Background section is only for understanding the background of the inventive concept and therefore it may contain information that does not constitute the prior art. Summary of the invention

[0006] The apparatus constructed according to the exemplary embodiment of the present invention can provide a flexible circuit film bonding device capable of preventing or reducing defects. The method according to the exemplary embodiment of the present invention also provides a method of bonding a flexible circuit film using the flexible circuit film bonding device.

[0007] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0008] According to one or more exemplary embodiments of the present invention, a flexible circuit film bonding device includes a platform, an extrusion head, a pad and a heating control unit, wherein the platform is configured to support a TFT substrate; the extrusion head is configured to extrude and heat the flexible circuit film, which is attached to the TFT substrate with an anisotropic conductive film inserted therebetween; the pad is configured to support and heat the TFT substrate located below the flexible circuit film; and the heating control unit is configured to control the temperature of the lower surface of the extrusion head and the upper surface of the pad, wherein the temperature of the upper surface of the pad is less than 170 degrees Celsius.

[0009] The temperature of the lower surface of the extrusion head may be controlled to be higher than the temperature of the upper surface of the backing plate.

[0010] The temperature of the upper surface of the pad may be controlled to be equal to or greater than 150 degrees Celsius and less than 170 degrees Celsius.

[0011] The temperature of the lower surface of the extrusion head may be controlled to be equal to or greater than 150 degrees Celsius and less than 200 degrees Celsius.

[0012] The flexible circuit film bonding device may also include a head driving unit and a platform driving unit, wherein the head driving unit is configured to move the extrusion head in a vertical direction; the platform driving unit is configured to move the platform along the vertical direction and a horizontal direction perpendicular to the vertical direction, and the pad may be set at a fixed position spaced apart from the platform.

[0013] One side of a lower surface of the extrusion head and one side of an upper surface of the backing plate may be arranged to be aligned in a vertical direction.

[0014] The pressing head may be configured to press the flexible circuit film while being spaced apart from an optical component disposed on the TFT substrate, wherein the flexible circuit film bonding device may further include an air supply unit configured to supply air between the optical component and the pressing head to block heat generated by the pressing head from being transmitted to the optical component.

[0015] The head driving unit may be configured to move the extrusion head at one of a first speed and a second speed, wherein the second speed is slower than the first speed, and the platform driving unit may be configured to move the platform in a vertical direction at a third speed, wherein the third speed is slower than the second speed.

[0016] According to one or more exemplary embodiments of the present invention, a method for bonding a flexible circuit film is provided, the method comprising: horizontally moving a platform, a TFT substrate being disposed on the platform in a vertical direction to position the flexible circuit film between a pressing head and a pad, the flexible circuit film being attached to the TFT substrate with an anisotropic conductive film interposed therebetween; engaging the pressing head and the pad, comprising: vertically moving one of the pad and the platform and the pressing head in a vertical direction so that a lower surface of the pressing head contacts the flexible circuit film and an upper surface of the pad contacts the TFT substrate; heating and pressing the anisotropic conductive film interposed between the flexible circuit film and the TFT substrate by using the pressing head contacting the flexible circuit film and the pad contacting the TFT substrate, wherein a temperature of an upper surface of the pad is controlled to be less than 170 degrees Celsius; and separating the pressing head and the pad, comprising: vertically moving one of the pad and the platform and the pressing head in a vertical direction so that the pressing head and the pad are detached from the flexible circuit film and the TFT substrate.

[0017] Heating and pressing the anisotropic conductive film may include controlling a temperature of a lower surface of the pressing head to be higher than a temperature of an upper surface of the pad.

[0018] Heating and pressing the anisotropic conductive film may further include controlling a temperature of an upper surface of the pad to be equal to or greater than 150 degrees Celsius and less than 170 degrees Celsius.

[0019] Heating and pressing the anisotropic conductive film may further include controlling a temperature of a lower surface of the pressing head to be equal to or greater than 150 degrees Celsius and less than 200 degrees Celsius.

[0020] Engaging the extrusion head and the backing plate may also include: vertically moving the extrusion head at a first speed; and after vertically moving the extrusion head at the first speed, simultaneously vertically moving the extrusion head at a second speed slower than the first speed and moving the platform at a third speed slower than the second speed.

[0021] The first speed may be approximately 5 to 20 times faster than the second speed.

[0022] Separating the extrusion head and the backing plate may further include: vertically moving the extrusion head at a fourth speed and vertically moving the platform at a fifth speed slower than the fourth speed; and vertically moving the extrusion head at a sixth speed faster than the fourth speed after vertically moving the extrusion head at the fourth speed.

[0023] Moving the platform horizontally may include: setting the platform so that the distance between the lower surface of the extrusion head and the flexible circuit film can be equal to or greater than 1.5 times the distance between the upper surface of the pad and the TFT substrate, and wherein moving the extrusion head vertically at a first speed may include: moving the extrusion head vertically at a first speed so that the distance between the lower surface of the extrusion head and the flexible circuit film can be greater than the distance between the upper surface of the pad and the TFT substrate.

[0024] Separating the pressing head and the pad may further include vertically moving one of the pad and the stage and the pressing head in a vertical direction so that a lower surface of the pressing head contacts the flexible circuit film after an upper surface of the pad contacts the TFT substrate.

[0025] Engaging the extrusion head and the pad may also include: vertically moving one of the pad and the platform and the extrusion head in a vertical direction so that the extrusion head extrudes the flexible circuit film while being spaced apart from an optical component disposed on the TFT substrate, and wherein heating and extruding the anisotropic conductive film may include: providing air between the optical component and the extrusion head to block heat generated by the extrusion head from being transmitted to the optical component.

[0026] One side of a lower surface of the extrusion head and one side of an upper surface of the backing plate may be arranged to be aligned in a vertical direction, and wherein the backing plate may be provided at a fixed position spaced apart from the platform.

[0027] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0029] Figure 1 is a side view schematically illustrating a flexible circuit film bonding device according to an exemplary embodiment.

[0030] Figure 2A Shown includes the use of Figure 1 The flexible circuit film adhesive device attaches the flexible circuit film of the display device to the substrate of the display device.

[0031] Figure 2B It is along Figure 2A A cross-sectional view of a display device taken along the width direction of a connecting line of a flexible circuit film.

[0032] Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E and Figure 3F is a cross-sectional view illustrating a method of manufacturing a display device using a flexible circuit film bonding device according to an exemplary embodiment.

[0033] Figure 4 is a flowchart illustrating a method of bonding a flexible circuit film using a flexible circuit film bonding apparatus according to an exemplary embodiment. DETAILED DESCRIPTION

[0034] In the following description, for the purpose of explanation, many specific details are set forth for a thorough understanding of each exemplary embodiment or embodiment of the present invention. As used herein, "embodiment" and "embodiment" are interchangeable words, which are non-limiting examples of one or more devices or methods to which the inventive concepts disclosed herein are applied. However, it is apparent that each exemplary embodiment may be implemented without these specific details or with one or more equivalent arrangements. In other cases, in order to avoid unnecessary confusion of each exemplary embodiment, known structures and devices are shown in block diagram form. In addition, each exemplary embodiment may be different, but need not be exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or performed in another exemplary embodiment.

[0035] Unless otherwise noted, the exemplary embodiments shown are interpreted as exemplary features that provide different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise noted, the features, components, modules, layers, films, panels, regions and / or aspects of each embodiment (hereinafter individually or collectively referred to as "elements") may be combined, separated, exchanged and / or rearranged without departing from the inventive concept.

[0036] In addition, in the accompanying drawings, the size and relative size of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments may be performed differently, the specific process order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0037] When an element or layer is referred to as being on another element or layer, being connected to or being coupled to another element or layer, it may be directly on the another element or layer, being connected to or being coupled to the another element or layer, or there may be an intervening element or layer. However, when an element or layer is referred to as being directly on another element or layer, being directly connected to or being directly coupled to another element or layer, there is no intervening element or layer. For this reason, the term "connection" may represent physical connection, electrical connection and / or fluid connection with or without an intermediate element. In addition, the D1 axis and the D2 axis are not limited to the axis of a rectangular coordinate system, such as an x-axis, a y-axis and a z-axis, and can be interpreted in a broader sense. For example, the D1 axis and the D2 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0038] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0039] Spatially relative terms, such as "beneath," "below," "under," "lower," "above," "upper," "over," "higher," "side" (e.g., as in "sidewall"), and the like, may be used herein for descriptive purposes, and thus may be used to describe the relationship of one element to another element as shown in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the drawings. For example, if the device in the drawings is flipped, elements described as being "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" may encompass both the above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and as such, the spatially relative descriptors used herein may be interpreted accordingly.

[0040] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, the singular forms "a", "an", and "said" are intended to also include the plural meaning unless the context clearly indicates otherwise. In addition, the terms "comprises", "comprising", "includes", and / or "including" when used in this specification indicate the presence of the features, wholes, steps, operations, elements, components, and / or combinations thereof described, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or combinations thereof. It is also worth noting that, as used herein, the terms "substantially", "about", and other similar terms are used as approximate terms rather than as terms of degree, and as such, are used to allow for inherent deviations in measured values, calculated values, and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0041] As is customary in the art, some exemplary embodiments are described and shown in the accompanying drawings for functional blocks, units and / or modules. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by electrical (or optical) circuits that can be formed using semiconductor-based manufacturing technology or other manufacturing technology, such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connectors, etc. In the case where blocks, units and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled by software (e.g., microcode) to perform various functions discussed herein, and they can be selectively driven by firmware and / or software. It is also contemplated that each block, unit and / or module can be implemented by dedicated hardware, or can be implemented as a combination of dedicated hardware for performing some functions and processors (e.g., one or more programmed microprocessors and associated circuits) for performing other functions. In addition, without departing from the scope of the inventive concept, each block, unit and / or module of some exemplary embodiments can be physically separated into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the inventive concept.

[0042] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0043] Hereinafter, the inventive concept will be explained in detail with reference to the accompanying drawings.

[0044] Figure 1 is a side view schematically illustrating a flexible circuit film bonding device according to an exemplary embodiment. Figure 2A Shown includes the use of Figure 1 The flexible circuit film adhesive device attaches the flexible circuit film of the display device to the substrate of the display device. Figure 2B It is along Figure 2A A cross-sectional view of a display device taken along the width direction of a connecting line of a flexible circuit film.

[0045] refer to Figure 1 , the flexible circuit film bonding device may include a pressing head 100, a pad 200, a platform 300, an air supply unit 400, a head driving unit CC, a heating control unit HC, and a platform driving unit SC.

[0046] The extrusion head 100 may be configured to press and heat the anisotropic conductive film between the TFT substrate and the flexible circuit film to electrically connect the TFT substrate to the flexible circuit film. The extrusion head 100 may be formed using an alloy having a relatively low thermal expansion coefficient. For example, the extrusion head 100 may be formed using a hard metal made by firing metal carbide powder, stainless steel, etc.

[0047] The extrusion head 100 may be configured to move along the second direction D2, which is a direction perpendicular to the ground, by the head driving unit CC. In other words, the head driving unit CC may move the extrusion head 100 along the second direction D2, which is a direction perpendicular to the ground. For example, the head driving unit CC may be a cylinder connected to the extrusion head 100 and a structure for controlling the cylinder.

[0048] The head driving unit CC may move the extrusion head 100 at a first speed or a second speed slower than the first speed. The first speed may be about 5 to 20 times faster than the second speed. For example, the first speed may be 100 mm / s, and the second speed may be 10 mm / s.

[0049] The backing plate 200 may be configured to support the TFT substrate and heat the anisotropic conductive film, and may be formed using an alloy having a relatively low thermal expansion coefficient. For example, the backing plate 200 may be formed using a hard metal made by firing metal carbide powder, stainless steel, or the like.

[0050] The backing plate 200 may be disposed at a fixed position. Here, one side of the lower surface 100a of the extrusion head 100 and one side of the upper surface 200a of the backing plate 200 may be disposed to be aligned in the vertical direction, that is, the second direction D2 (see Figure 1 The two axes overlap on the dotted line in FIG.

[0051] The heating control unit HC can control the temperature of the lower surface 100a of the extrusion head 100 and the upper surface 200a of the pad 200. Specifically, the heating control unit HC can control the upper surface 200a of the pad 200 to be heated to a temperature less than 170 degrees (°C). The temperature of the lower surface 100a of the extrusion head 100 can be controlled to be higher than the temperature of the upper surface 200a of the pad 200. The temperature of the upper surface 200a of the pad 200 can be controlled to be greater than or equal to 150 degrees and less than 170 degrees. The temperature of the lower surface 100a of the extrusion head 100 can be controlled to be a temperature of 150 to 200 degrees.

[0052] When the temperature of the backing plate 200 and the extrusion head 100 is higher than an appropriate level, the anisotropic conductive film can be cured in a short time (refer to Figure 2A When excessive heat is transferred to the TFT substrate or components on the TFT substrate (reference Figure 2A 40), for example, heat-sensitive optical components such as polarizers may be damaged.

[0053] The heating of the extrusion head 100 or the pad 200 may be performed by a constant heating method or a pulse heating method. The constant heating method is a method of changing the temperature of the anisotropic conductive film by applying pressure to the flexible circuit film for a predetermined time while keeping the temperature of the extrusion head 100 or the pad 200 constant. The pulse heating method is a method of generating heat using pulses and has a high degree of freedom in temperature control, making it easy to select an optimal temperature.

[0054] The platform 300 may support the TFT substrate. The platform driving unit SC may move the platform 300 along the second direction D2 and the first direction D1 as a horizontal direction perpendicular to the second direction D2. The platform driving unit SC may move the platform 300 along the second direction D2 at a third speed slower than the second speed. For example, the third speed may be 4.5 mm / s.

[0055] The air supply unit 400 may supply air between the optical member on the TFT substrate and the extrusion head 100 to block heat from the extrusion head 100 from being transferred to the optical member.

[0056] According to this embodiment, the position of the backing plate 200 is fixed, and the platform 300 and the extrusion head 100 are configured to move, but are not limited thereto. For example, the backing plate 200 may be configured to move.

[0057] refer to Figure 2A , the display device may include a TFT substrate 10 , a light emitting member 20 , a sealing member 30 , an optical member 40 , an anisotropic conductive film 50 , and a flexible circuit film 60 .

[0058] The TFT substrate 10 may be a substrate including a thin film transistor. For example, the TFT substrate 10 may include a base substrate, a plurality of insulating layers formed on the base substrate, and thin film transistors and circuit wiring formed between the insulating layers. For example, the TFT substrate 10 may be an LTPS substrate including a low temperature polysilicon thin film transistor.

[0059] The light emitting member 20 may be disposed on the TFT substrate 10. The sealing member 30 may be formed on the TFT substrate 10 on which the light emitting member 20 is disposed to seal the light emitting member 20. The optical member 40 may be disposed on the sealing member 30. For example, the optical member 40 may be a polarizer.

[0060] The contact electrode 12 may be formed on one side of the TFT substrate 10. The contact electrode 12 may have a width along a third direction D3 perpendicular to the first direction D1 on a plane, and a plurality of contact electrodes 12 may be arranged at a second interval w2 in the third direction D3.

[0061] An anisotropic conductive film (ACF) 50 may be provided on the contact electrode 12. The anisotropic conductive film 50 may be, for example, an adhesive film in which conductive particles of several um (micrometers) are dispersed in epoxy resin and acrylic resin. When the anisotropic conductive film 50 is pressed and heated by a flexible circuit film bonding device, the anisotropic conductive film 50 is heat-pressed and cured, and the conductive particles in the anisotropic conductive film 50 may electrically connect the contact electrode 12 to the connection electrode 64 of the flexible circuit film 60.

[0062] The flexible circuit film 60 may be attached to the anisotropic conductive film 50. The flexible circuit film 60 may include a base film 62, a connection electrode 64 disposed on the base film 62, and a protective layer 66 covering a portion of the connection electrode 64. An exposed portion of the connection electrode 64 may be disposed corresponding to the contact electrode 12, and a plurality of connection electrodes 64 may be arranged at a first interval w1 in the third direction D3.

[0063] At this time, in the process of thermocompression bonding the anisotropic conductive film 50, if excessive heat is transferred to the base film 62 of the flexible circuit film 60, the base film 62 may thermally expand. As a result, the first interval w1 becomes larger than the second interval w2, and thus, the plurality of connection electrodes 64 and the plurality of contact electrodes 12 may not be aligned, and defects may occur.

[0064] According to the embodiment, in the process of thermocompression bonding the anisotropic conductive film 50 between the flexible circuit film 60 and the TFT substrate 10 , an appropriate temperature can be controlled so that defects due to thermal expansion can be prevented or reduced.

[0065] Specifically, even when the interval (second interval w2) between the contact electrodes 12 becomes narrower due to a higher resolution of the display device, a reduction in the peripheral area as a non-display area where the contact electrodes are provided, or a NoMux structure (a NoMux structure refers to a structure without a multiplexer) due to a lack of SOT (scan on time) according to an increase in the aspect ratio, the occurrence of defects can be prevented or reduced by attaching the flexible circuit film 60 at an appropriate position.

[0066] Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E and Figure 3F is a cross-sectional view illustrating a method of manufacturing a display device using a flexible circuit film bonding device according to an exemplary embodiment.

[0067] refer to Figure 3A , in a state where the flexible circuit film 60 is attached (pre-attached) to the contact electrode 12 of the TFT substrate 10 through the anisotropic conductive film 50, the TFT substrate 10 set on the platform 300 can be moved in the first direction D1 which is a horizontal direction, so that the flexible circuit film 60 can be located between the extrusion head 100 and the pad 200.

[0068] At this time, the flexible circuit film 60 and the lower surface of the extrusion head 100 may be separated by a first upper distance DU1, and the upper surface of the TFT substrate 10 and the backing plate 200 may be separated by a first lower distance DN1. The first upper distance DU1 may be at least 1.5 times greater than the first lower distance DN1. For example, the first upper distance DU1 may be 16 mm (millimeters) and the first lower distance DN1 may be 8 mm.

[0069] On the other hand, by supplying air between the optical member 40 and the pressing head 100 above the TFT substrate 10 using the air supply unit 400 , the optical member 40 may be protected from damage due to heat being transferred from the pressing head 100 to the optical member 40 .

[0070] refer to Figure 3B , the extrusion head 100 may move in the second direction D2 at a first speed. For example, the first speed may be 100 mm / s. Therefore, the lower surface of the extrusion head 100 and the flexible circuit film 60 may be separated by a second upper distance DU2. For example, the second upper distance DU2 may be 10 mm.

[0071] refer to Figure 3C, the extrusion head 100 may move in the second direction D2 at a second speed slower than the first speed, and at the same time, the platform 300 may move in the second direction D2 at a third speed slower than the second speed. For example, the second speed may be 10 mm / s, and the third speed may be 4.5 mm / s.

[0072] Therefore, the upper surface of the pad 200 may first contact the TFT substrate 10 , and within a short time, the lower surface of the pressing head 100 may contact the flexible circuit film 60 .

[0073] refer to Figure 3D , the pressing head 100 and the pad 200 may press and heat the anisotropic conductive film 50 between the flexible circuit film 60 and the TFT substrate 10 .

[0074] On the other hand, the position of the backing plate 200 may be fixed and arranged to be spaced apart from the platform 300. One side of the lower surface of the pressing head 100 and one side of the upper surface of the backing plate 200 may be arranged to overlap in the second direction D2. The pressing head 100 may press the flexible circuit film 60 while being spaced apart from the optical member 40 provided on the TFT substrate 10. Therefore, the optical member 40, which is not resistant to thermal shock, may be protected from damage caused by heat.

[0075] At this time, as described above, by supplying air between the optical member 40 and the pressing head 100 , it is possible to block the transfer of heat from the pressing head 100 to the optical member 40 .

[0076] In addition, the temperature of the upper surface of the backing plate 200 is controlled to be less than 170 degrees Celsius. The temperature of the lower surface of the extrusion head 100 may be controlled to be higher than the temperature of the upper surface of the backing plate 200. For example, the temperature of the upper surface of the backing plate 200 may be controlled to be equal to or greater than 150 degrees Celsius and less than 170 degrees Celsius, and the temperature of the lower surface of the extrusion head 100 may be controlled to be equal to or greater than 150 degrees Celsius and less than 200 degrees Celsius.

[0077] Therefore, the temperature of the anisotropic conductive film 50 can be increased to the melting temperature, and thermocompression bonding and curing can occur while reducing the working time, and the optical member 40 of the display device including a structure vulnerable to thermal shock (such as a polarizing plate) can be protected from damage.

[0078] refer to Figure 3E , the extrusion head 100 may move at a fourth speed in a direction opposite to the second direction D2, and the platform 300 may move at a fifth speed slower than the fourth speed in a direction opposite to the second direction D2. For example, the fourth speed may be equal in magnitude and opposite in direction to the second speed, and the fifth speed may be equal in magnitude and opposite in direction to the third speed.

[0079] Therefore, the lower surface of the extrusion head 100 and the flexible circuit film 60 may be separated by the second upper distance DU2, and the upper surface of the TFT substrate 10 and the pad 200 may be separated by the first lower distance DN1. For example, the second upper distance DU2 may be 10 mm, and the first lower distance DN1 may be 8 mm.

[0080] refer to Figure 3F , the extrusion head 100 may move in a direction opposite to the second direction D2 at a sixth speed faster than the fourth speed. The sixth speed may be equal in magnitude and opposite in direction to the first speed. Therefore, the lower surface of the extrusion head 100 and the flexible circuit film 60 may be separated by a first upper distance DU1. For example, the first upper distance DU1 may be 16 mm.

[0081] Therefore, a processing time of the thermocompression bonding process of the anisotropic conductive film 50 may be shortened, and thus, damage to the structure of the display device due to thermal shock may be reduced.

[0082] Figure 4 is a flowchart illustrating a method of bonding a flexible circuit film using a flexible circuit film bonding apparatus according to an exemplary embodiment.

[0083] refer to Figure 4 , the method for bonding the flexible circuit film may include: a horizontal movement step (S100); a step of joining the extrusion head and the pad, which includes a first vertical movement step (S200) and a second vertical movement step (S300); a heating and extrusion step (S400); and a step of separating the extrusion head and the pad, which includes a third vertical movement step (S500) and a fourth vertical movement step (S600).

[0084] In the horizontal movement step ( S100 ), the TFT substrate disposed on the stage may be moved in a horizontal direction to position the flexible circuit film between the pressing head and the pad using the flexible circuit film attached to the TFT substrate through the anisotropic conductive film.

[0085] In the step of engaging the pressing head and the backing plate, the pressing head and the backing plate or the platform may be moved in a vertical direction so that a lower surface of the pressing head contacts the flexible circuit film and an upper surface of the backing plate contacts the TFT substrate.

[0086] In the first vertical movement step (S200), the extrusion head may move at a first speed.

[0087] In the second vertical movement step ( S300 ), the pressing head may move at a second speed slower than the first speed, and at the same time, the platform may move at a third speed slower than the second speed.

[0088] At this time, the lower surface of the pressing head may contact the flexible circuit film after the upper surface of the pad contacts the TFT substrate.

[0089] In the heating and pressing step (S400), the anisotropic conductive film between the flexible circuit film and the TFT substrate may be pressed and heated by using a pressing head and a pad, wherein the upper surface of the pad may be controlled to be heated to less than 170 degrees Celsius.

[0090] The temperature of the lower surface of the extrusion head may be controlled to be higher than the temperature of the upper surface of the pad. The temperature of the upper surface of the pad may be controlled to be equal to or greater than 150 degrees Celsius and less than 170 degrees Celsius. The temperature of the lower surface of the extrusion head may be controlled to be equal to or greater than 150 degrees Celsius and less than 200 degrees Celsius. The extrusion head may extrude the flexible circuit film while being spaced apart from the optical member disposed on the TFT substrate. Air may be disposed between the optical member and the extrusion head to block heat from being transmitted from the extrusion head to the optical member.

[0091] One side of the lower surface of the extrusion head and one side of the upper surface of the backing plate may be arranged to overlap in the vertical direction. The position of the backing plate may be fixed and spaced apart from the platform.

[0092] In the step of separating the pressing head and the backing plate, the pressing head and the backing plate or the platform may be moved in a vertical direction so that the head and the backing plate are spaced apart from the flexible circuit film and the TFT substrate.

[0093] In the third vertical movement step (S500), the extrusion head may move at a fourth speed, and the platform may move at a fifth speed slower than the fourth speed. For example, the fourth speed may be equal in magnitude and opposite in direction to the second speed. The fifth speed may be the same in magnitude and opposite in direction to the third speed.

[0094] In the fourth vertical movement step (S600), the extrusion head may move at a sixth speed faster than the fourth speed. For example, the sixth speed may be the same as the first speed and opposite in direction.

[0095] According to an exemplary embodiment of the inventive concept, a flexible circuit film bonding device includes a platform, a pressing head, a pad, and a heating control unit, wherein the platform is configured to support a TFT substrate, the pressing head is configured to press and heat a flexible circuit film attached to the TFT substrate through an anisotropic conductive film, the pad is configured to support and heat the TFT substrate located below the flexible circuit film, and the heating control unit is configured to control the temperature of the lower surface of the pressing head and the upper surface of the pad, wherein the temperature of the upper surface of the pad is heated to less than 170 degrees Celsius. The method of bonding a flexible circuit film using the flexible circuit film bonding device includes: a horizontal moving step, a step of engaging the pressing head and the pad, a heating and pressing step, and a step of separating the pressing head and the pad.

[0096] In the process of thermocompression bonding the anisotropic conductive film between the flexible circuit film and the TFT substrate, an appropriate temperature can be controlled so that defects due to thermal expansion can be prevented or reduced.

[0097] Specifically, even when the interval between the contact electrodes becomes narrower due to the higher resolution of the display device, the reduction of the peripheral area as the non-display area where the contact electrodes are provided, or the adoption of the NoMux structure due to the lack of SOT according to the increase in aspect ratio, the occurrence of defects can be prevented or reduced by attaching the flexible circuit film at an appropriate position.

[0098] Therefore, the temperature of the anisotropic conductive film can be increased to the melting temperature, and thermocompression bonding and curing may occur while reducing working time, and optical members of the display device including structures vulnerable to thermal shock such as polarizers can be protected from damage.

[0099] Although certain exemplary embodiments and examples have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather lies in the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. A flexible circuit film bonding device, comprising: a platform configured to support a TFT substrate; a pressing head configured to press and heat a flexible circuit film attached to the TFT substrate with an anisotropic conductive film interposed therebetween; a pad configured to support and heat the TFT substrate located below the flexible circuit film; a heating control unit configured to control the temperature of the lower surface of the extrusion head and the temperature of the upper surface of the backing plate; a platform driving unit configured to move the platform along a vertical direction and a horizontal direction perpendicular to the vertical direction; as well as a head driving unit configured to move the extrusion head in the vertical direction, and Wherein the temperature of the upper surface of the pad is less than 170 degrees Celsius.

2. The flexible circuit film bonding device according to claim 1, wherein: The temperature of the lower surface of the extrusion head is controlled to be higher than the temperature of the upper surface of the backing plate.

3. The flexible circuit film bonding device according to claim 2, wherein: The temperature of the upper surface of the pad is controlled to be equal to or greater than 150 degrees Celsius and less than 170 degrees Celsius.

4. The flexible circuit film bonding device according to claim 3, wherein: The temperature of the lower surface of the extrusion head is controlled to be equal to or greater than 150 degrees Celsius and less than 200 degrees Celsius.

5. The flexible circuit film bonding device according to claim 1, wherein: The pad is disposed at a fixed position spaced apart from the platform.

6. The flexible circuit film bonding device according to claim 5, wherein: One side of the lower surface of the extrusion head and one side of the upper surface of the backing plate are arranged to be aligned in the vertical direction.

7. The flexible circuit film bonding device according to claim 6, in, The pressing head is configured to press the flexible circuit film while being spaced apart from an optical member disposed on the TFT substrate. The flexible circuit film bonding device further includes an air supply unit configured to supply air between the optical member and the pressing head to block heat generated by the pressing head from being transmitted to the optical member.

8. The flexible circuit film bonding device according to claim 5, wherein: The head driving unit is configured to move the extrusion head at one of a first speed and a second speed, the second speed being slower than the first speed, and The platform driving unit is configured to move the platform in the vertical direction at a third speed, the third speed being slower than the second speed.

9. A method for bonding a flexible circuit film, the method comprising: horizontally moving a platform on which a TFT substrate is disposed in a vertical direction to position a flexible circuit film between an extrusion head and a pad, wherein the flexible circuit film is attached to the TFT substrate with an anisotropic conductive film interposed therebetween; Engaging the extrusion head and the backing plate, comprising: vertically moving one of the pad and the platform and the pressing head in the vertical direction so that a lower surface of the pressing head contacts the flexible circuit film and an upper surface of the pad contacts the TFT substrate; heating and pressing the anisotropic conductive film interposed between the flexible circuit film and the TFT substrate by using the pressing head contacting the flexible circuit film and the pad contacting the TFT substrate, wherein the temperature of the upper surface of the pad is controlled to be less than 170 degrees Celsius; and Separating the extrusion head and the backing plate, comprising: The pressing head is vertically moved in the vertical direction along one of the backing plate and the platform so that the pressing head and the backing plate are detached from the flexible circuit film and the TFT substrate.

10. The method of claim 9, wherein: The heating and pressing the anisotropic conductive film comprises: The temperature of the lower surface of the extrusion head is controlled to be higher than the temperature of the upper surface of the backing plate.

11. The method of claim 10, wherein: The heating and pressing of the anisotropic conductive film further comprises: The temperature of the upper surface of the pad is controlled to be equal to or greater than 150 degrees Celsius and less than 170 degrees Celsius.

12. The method of claim 11, wherein: The heating and pressing of the anisotropic conductive film further comprises: The temperature of the lower surface of the extrusion head is controlled to be equal to or greater than 150 degrees Celsius and less than 200 degrees Celsius.

13. The method of claim 9, wherein: The engaging the extrusion head and the backing plate further comprises: vertically moving the extrusion head at a first speed; and After the extrusion head is vertically moved at the first speed, the extrusion head is simultaneously vertically moved at a second speed slower than the first speed and the platform is simultaneously moved at a third speed slower than the second speed.

14. The method of claim 13, wherein: The first speed is 5 to 20 times faster than the second speed.

15. The method of claim 13, wherein: The separation of the extrusion head and the backing plate further comprises: vertically moving the extrusion head at a fourth speed, and vertically moving the platform at a fifth speed that is slower than the fourth speed; and After vertically moving the extrusion head at the fourth speed, the extrusion head is vertically moved at a sixth speed faster than the fourth speed.

16. The method of claim 13, in, The horizontally moving the platform includes: setting the platform so that the distance between the lower surface of the extrusion head and the flexible circuit film is equal to or greater than 1.5 times the distance between the upper surface of the pad and the TFT substrate, and Wherein, vertically moving the extrusion head at the first speed includes: vertically moving the extrusion head at the first speed so that the distance between the lower surface of the extrusion head and the flexible circuit film is greater than the distance between the upper surface of the pad and the TFT substrate.

17. The method of claim 9, wherein: The separating the pressing head and the pad further comprises: vertically moving the pressing head and one of the pad and the platform in the vertical direction so that the lower surface of the pressing head contacts the flexible circuit film after the upper surface of the pad contacts the TFT substrate.

18. The method of claim 9, in, The engaging the pressing head and the backing plate further comprises: vertically moving one of the backing plate and the platform and the pressing head in the vertical direction so that the pressing head presses the flexible circuit film while being spaced apart from an optical member disposed on the TFT substrate, and The heating and pressing of the anisotropic conductive film includes providing air between the optical member and the pressing head to block heat generated by the pressing head from being transmitted to the optical member.

19. The method of claim 18, in, One side of the lower surface of the extrusion head and one side of the upper surface of the backing plate are arranged to be aligned in the vertical direction, and Wherein, the pad is arranged at a fixed position spaced apart from the platform.

Images