High-temperature gas rapid cooling device

Abstract

The present invention discloses a high-temperature gas rapid cooling device, belonging to the technical field of coal gasification. Among them, the high-temperature gas rapid cooling device includes a collector and a plurality of atomizers for spraying a cooling medium. The collector has at least one collection chamber, and a plurality of mounting holes are provided on the collector. The plurality of atomizers are installed in the at least one collection chamber, and at least one of the plurality of mounting holes is communicated with at least one of the plurality of atomizers. The high-temperature gas rapid cooling device provided by the present invention can atomize the cooling medium through the atomizer to form misty droplets, and the misty droplets can rapidly cool the high-temperature raw syngas and slag, thereby greatly shortening the length of the high-temperature section, achieving the purpose of strengthening heat and mass transfer, enabling the cold ring and the downcomer to work at a relatively safe temperature, reducing the amount of quench water, and improving the problems of water and ash carryover.

Description

Technical Field

[0001] The present invention relates to the technical field of coal gasification, and particularly to a high-temperature gas rapid cooling device. Background Art

[0002] Coal gasification technology is a technology for the efficient and clean utilization of coal. The gasifier is a key device in coal gasification technology. In coal gasification technology, pulverized coal / water coal slurry and oxidant are prone to incomplete combustion in the gasification chamber of the gasifier, generating high-temperature raw syngas at about 1500°C and molten slag. The high-temperature raw syngas and molten slag need to enter the quench chamber for cooling and gas-slag separation.

[0003] The quench ring is a key component in the quench chamber. The function of the quench ring is to rapidly cool the high-temperature raw syngas and molten slag and protect the downcomer from erosion and corrosion. Since the quench water in the gasifier is recycled, and at the same time, due to the poor quality of the quench water, the quench water is prone to scaling and other problems at the quench ring with a higher temperature, which is also extremely likely to cause local blockage of the quench water pipeline and the quench ring, resulting in ablation of the internal components in the quench chamber, thus bringing potential safety hazards and direct economic losses, and at the same time, it also affects the annual operating rate of the device.

[0004] To reduce the risk of quench ring ablation, the utility model patent with the patent number ZL01226117.3 discloses a gasifier quench ring, which adopts a streamline flow channel to reduce the flow resistance of the coolant and make the distribution of the coolant in it more uniform, effectively extending the service life of the quench ring and reducing the annual maintenance times. The utility model patent with the patent number ZL200620072850.3 discloses a rotating water spraying enhanced cooling device for a coal gasification furnace quench ring, which adopts a number of inclined water spraying holes evenly arranged circumferentially in a ring pipe to spray water columns, and forms water droplets by impact to increase the contact surface between the syngas and the water droplets to reduce the temperature of the syngas, thereby improving the temperature environment of the quench ring. However, the above two patents still cause scaling of the quench ring with a higher temperature, and then lead to problems such as local blockage of the quench water pipeline and the quench ring.

[0005] In view of this, it is indeed necessary to provide a high-temperature gas rapid cooling device that can solve problems such as quench ring scaling and local blockage of the quench water pipeline and the quench ring. Summary of the Invention

[0006] In order to solve at least one of the above problems and defects existing in the prior art, the present invention provides a high-temperature gas rapid cooling device. The technical solution is as follows:

[0007] An object of the present invention is to provide a high-temperature gas rapid cooling device.

[0008] According to one aspect of the present invention, there is provided a high-temperature gas rapid cooling device, wherein,

[0009] the high-temperature gas rapid cooling device includes a collector and a plurality of atomizers for injecting a cooling medium. The collector has at least one collection chamber, and a plurality of mounting holes are provided on the collector. The plurality of atomizers are installed in the at least one collection chamber, and at least one of the plurality of mounting holes communicates with at least one of the plurality of atomizers.

[0010] Specifically, the plurality of mounting holes are provided on the inner pipe wall of the collector, and all of the plurality of atomizers are provided in the same collection chamber of the at least one collection chamber, and the plurality of atomizers and the plurality of mounting holes are arranged in a one-to-one correspondence with each other.

[0011] Further, the collector includes a first connecting flange, a second connecting flange and a ring pipe. The ring pipe is provided between the first connecting flange and the second connecting flange. The ring pipe has the at least one collection chamber, and the plurality of mounting holes are provided on the inner pipe wall of the ring pipe.

[0012] Specifically, the plurality of mounting holes are arranged circumferentially on the inner pipe wall of the ring pipe, and the plurality of mounting holes are all provided on the lower half arc of the ring pipe. The included angle range between the center line of each of the plurality of mounting holes and the horizontal plane is 25° to 60°.

[0013] Specifically, the nozzle of each of the plurality of atomizers faces the corresponding mounting hole among the plurality of mounting holes, and the included angle between the center line of each atomizer and the horizontal plane is equal to the included angle between the center line of each mounting hole and the horizontal plane.

[0014] Specifically, the atomization angle range of the atomizer is 60° to 150°, and the atomization particle size range of the atomizer is 0 to 1000 μm.

[0015] Preferably, the atomization angle range of the atomizer is preferably 60° to 120°, and the atomization particle size range of the atomizer is preferably 50 to 500 μm.

[0016] Further, an atomizer mounting seat is provided at each of the plurality of mounting holes,

[0017] the high-temperature gas rapid cooling device further includes a plurality of delivery pipes. The plurality of delivery pipes are all communicated with the at least one collection chamber of the ring pipe, and each of the plurality of delivery pipes is perpendicular or tangent to the outer pipe wall of the ring pipe between the first connecting flange and the second connecting flange.

[0018] Specifically, the aggregator further includes an annular plate, which is the outer pipe wall of the annular pipe. At least one collection cavity of the annular pipe is formed by the pipe wall of the annular pipe and the annular plate surrounding it.

[0019] Specifically, the annular pipe includes an inner semi-annular pipe and an outer semi-annular pipe sleeved outside the inner semi-annular pipe. The collection cavity of the annular pipe includes an inner collection cavity of the inner semi-annular pipe and an outer collection cavity of the outer semi-annular pipe. The inner collection cavity is formed by the inner side of the pipe wall of the inner semi-annular pipe and the annular plate surrounding it. The outer collection cavity is formed by the pipe wall of the outer semi-annular pipe, the outer side of the pipe wall of the inner semi-annular pipe, and the annular plate surrounding each other.

[0020] Further, the inner collection cavity of the inner semi-annular pipe is communicated with the plurality of delivery pipes, and the outer collection cavity of the outer semi-annular pipe is communicated with the plurality of mounting holes, and the plurality of atomizers are all arranged in the outer collection cavity.

[0021] A plurality of injection holes are provided on the pipe wall of the inner semi-annular pipe accommodated in the outer collection cavity, and the plurality of injection holes are arranged along the circumferential direction of the inner semi-annular pipe.

[0022] Further, the high-temperature gas rapid cooling device further includes a plurality of support rib plates. The plurality of support rib plates are arranged closely against the outer pipe wall of the annular pipe between the first connection flange and the second connection flange, and the plurality of support rib plates are arranged along the circumferential direction of the annular pipe.

[0023] The cooling medium is desalted water, fresh water or reclaimed water after scale inhibition treatment.

[0024] The high-temperature gas rapid cooling device according to the present invention has at least one of the following advantages:

[0025] (1) The high-temperature gas rapid cooling device provided by the present invention can atomize the cooling medium through the atomizer to form misty droplets, and the misty droplets can rapidly cool the high-temperature raw syngas and molten slag, thereby greatly shortening the length of the high-temperature section, achieving the purpose of strengthening heat and mass transfer, and realizing efficient gas-slag separation.

[0026] (2) The high-temperature gas rapid cooling device provided by the present invention can rapidly cool the high-temperature raw syngas produced by the gasification chamber, enable the quench ring and the downcomer to work at a relatively safe temperature, and at the same time can also reduce the amount of quench water and improve the problems of water and ash carryover.

[0027] (3) The high-temperature gas rapid cooling device provided by the present invention is connected to the quench ring and the slag outlet respectively by connection flanges, making disassembly convenient.

[0028] (4) The atomizer in the high-temperature gas rapid cooling device provided by the present invention is installed on the atomizer mounting seat by threads, which is convenient for inspection, replacement and maintenance.

[0029] (5) The high-temperature gas rapid cooling device provided by the present invention can avoid the blockage of the atomizer by selecting the type, composition and pressure regulation of the atomizing medium, thereby avoiding the uneven distribution of the cooling medium, and further effectively improving the cooling efficiency of the high-temperature raw syngas and slag. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] These and / or other aspects and advantages of the present invention will become apparent and readily understood from the following description of the preferred embodiments in conjunction with the accompanying drawings, in which:

[0031] Figure 1 is a schematic structural diagram of a high-temperature gas rapid cooling device according to an embodiment of the present invention;

[0032] Figure 2 is Figure 1 a cross-sectional view of the high-temperature gas rapid cooling device of the first embodiment shown;

[0033] Figure 3 is Figure 1 a cross-sectional view of the high-temperature gas rapid cooling device of the second embodiment shown;

[0034] Figure 4 is Figure 1 a cross-sectional view of the high-temperature gas rapid cooling device of the third embodiment shown. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] The technical solutions of the present invention will be further specifically described below through embodiments in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as a limitation of the present invention.

[0036] Referring to Figure 1 , which shows a high-temperature gas rapid cooling device 100 according to an embodiment of the present invention. The high-temperature gas rapid cooling device 100 includes a collector and a plurality of atomizers for spraying a cooling medium. The collector has at least one collecting chamber, and a plurality of mounting holes 41 are provided on the collector. The plurality of atomizers 6 are installed in the at least one collecting chamber, and at least one of the plurality of mounting holes 41 communicates with at least one of the plurality of atomizers 6. By providing the atomizers, the cooling medium can be atomized to form mist-like droplets, which can rapidly cool the high-temperature raw syngas and slag, thereby greatly shortening the length of the high-temperature section, achieving the purpose of strengthening heat and mass transfer, and realizing efficient gas-slag separation; at the same time, since the temperature is reduced before the high-temperature raw syngas enters the quench ring, the quench water at the quench ring is no longer likely to form scale to cause the quench ring to scale.

[0037] In one example, the cooling medium is demineralized water, fresh water or reclaimed water after scale inhibition treatment. This example is only an illustrative example, and those skilled in the art can replace it with existing cooling media according to needs, as long as the fluid passing through the high-temperature gas rapid cooling device 100 can be cooled.

[0038] See Figure 2 , which shows a high-temperature gas rapid cooling device 110 according to a first embodiment of the present invention. The high-temperature gas rapid cooling device 110 includes a collector, a plurality of support rib plates 2 and a delivery pipe 7. In one example, the collector includes a first connecting flange 1, a second connecting flange 3 and an annular pipe 4, and the annular pipe 4 is arranged between the first connecting flange 1 and the second connecting flange 3. In one example, the high-temperature gas rapid cooling device 110 is bolt-connected to the corresponding quench ring (i.e., the chill ring) and the slag notch through the first connecting flange 1 and the second connecting flange 3. In one example, the temperature range of the high-temperature gas is approximately 1100 °C to 1500 °C.

[0039] In one example, the annular pipe 4 has a collecting cavity 9, that is, the inner cavity of the annular pipe 4, and the cross-sectional shape of the annular pipe 4 is circular. The annular pipe 4 can withstand high pressure. To meet the requirement of evenly distributing the high-pressure (higher than the operating environment pressure by 0.8 - 8 Mpa) cooling medium, the cross-sectional area of the annular pipe 4 is 5 to 100 times the total cross-sectional area of the nozzles of the atomizer 6. In one example, the first connecting flange 1, the annular pipe 4 and the second connecting flange 3 are welded and connected in sequence. During use, the high-temperature gas and molten slag flow through the cavity 11 formed by the first connecting flange 1, the annular pipe 4 and the second connecting flange 3 surrounding each other to achieve cooling.

[0040] In one example, a plurality of support rib plates 2 are welded to the outer wall of the annular pipe 4 between the first connecting flange 1 and the second connecting flange 2, and the plurality of support rib plates 2 are evenly distributed along the circumferential direction of the annular pipe 4 to enhance the overall strength of the high-temperature gas rapid cooling device 110.

[0041] Combined with Figure 1 and Figure 2 As shown, a plurality of delivery pipes 7 are evenly arranged along the circumferential direction of the outer wall of the annular pipe 4 (i.e., the outer wall of the annular pipe between the first connecting flange and the second connecting flange). The plurality of delivery pipes 7 are communicated with the inner cavity of the annular pipe 4 to be used for delivering the cooling medium into the inner cavity of the annular pipe 4. The inlet direction of the cooling medium (i.e., the direction of the delivery pipe 7) is perpendicular or tangent to the outer wall of the annular pipe 4. In one example, the number of the plurality of delivery pipes 7 is set in the range of 1 to 6, and those skilled in the art can make corresponding selections according to needs. For example, the delivery pipe 7 can be set to 1, 2, 4 or more.

[0042] As Figure 1-2As shown, a plurality of mounting holes 41 are provided on the inner wall of the annular pipe 4. The plurality of mounting holes 41 are located on the lower half arc of the annular pipe and are evenly distributed along the circumferential direction of the annular pipe 4. In one example, the number of the mounting holes is set in the range of 20 to 80, and the range of the angle α between the center line of each mounting hole 41 and the horizontal plane is 25° to 60°. A nebulizer mounting seat 5 is welded in each mounting hole 41, and threaded holes (not shown) for mounting and fixing the nebulizer 6 are arranged on the nebulizer mounting seat 5 to facilitate the maintenance and replacement of the nebulizer 6. The aperture diameter of each mounting seat 5 needs to meet the requirement that the atomized water ejected from the nebulizer 6 does not adhere to the wall and leaves a dimensional space of 110% to 120%. Those skilled in the art can understand that the nebulizer 6 can be installed in each mounting hole, or only in some mounting holes according to needs.

[0043] In one example, the nozzle of each nebulizer 6 faces the corresponding mounting hole 41, and the angle between the center line of each nebulizer and the horizontal plane is equal to the angle α between the center line of each mounting hole and the horizontal plane, that is, the center line of the nebulizer coincides with the center line of the corresponding mounting hole.

[0044] In one example, the pressure in the inner cavity of the annular pipe can be adjusted by adjusting the flow rate of the input coolant as needed, and then the spray amount and spray speed of the nebulizer can be adjusted. In one example, the atomization angle range of the nebulizer 6 is 60 to 150°, and the preferred range is 60 to 120°. In one example, the atomization particle size range of the nebulizer is 0 to 1000 μm, the preferred range is 50 to 500 μm, and the more preferred range is 100 to 350 μm. This example is only an illustrative example, and those skilled in the art can select the atomization angle of the nebulizer according to needs, such as 60°, 75°, 105° or other suitable angles. Those skilled in the art select a suitable nebulizer type and a suitable atomization particle size according to needs.

[0045] In one example, install as shown between the HT-L furnace quench ring and the slag notch Figure 2The high-temperature gas rapid cooling device 110 shown sprays a certain amount of water mist at the slag discharge port, enabling the rapid evaporation and heat exchange of the tiny water mist particles. When the input temperature of the high-temperature syngas is 1350 °C, the pressure is 4.0 MPa, and the velocity is 12 m / s, a high-temperature gas rapid cooling device 110 with a total of 30 atomizers installed in one circle is selected. The atomizing flow rate of the nozzle of the atomizer 6 in each installation hole is 1 t / h, the atomizing particle size is 250 μm, the atomizing angle is 60°, and the angle α (i.e., the spraying angle) between the center line of the atomizer and the horizontal plane is 45°. After the syngas enters the high-temperature gas rapid cooling device 110, it is quickly cooled by the cooling medium ejected by the atomizer 6. The water atomizing particles are completely evaporated at a position about 2 m from the inlet of the quench ring (i.e., the chill ring), reducing the temperature of the syngas to 800 °C. At this temperature, even in case of some abnormal situations, the safe use of the quench ring can still be ensured, greatly reducing the risk of ablation of the quench ring.

[0046] See Figure 3 , which shows the high-temperature gas rapid cooling device 120 according to the second embodiment of the present invention. The setting methods and working principles of the first connection flange 1, the support rib plate 2, the second connection flange 3, the annular pipe 4, the atomizer mounting seat 5, the atomizer 6, and the input pipe 7 in the high-temperature gas rapid cooling device 120 are exactly the same and will not be elaborated here. The difference between the high-temperature gas rapid cooling device 120 and the high-temperature gas rapid cooling device 110 is only that: the cross-sectional shape of the annular pipe 4 is set to be semi-circular, that is, the annular pipe 4 is a semi-annular pipe, and the outer pipe wall of the annular pipe 4 is replaced by the annular plate 8, so that the collection cavity 9 of the annular pipe 4 is formed by the inner cavity of the semi-annular pipe 4 and the surrounding annular plate 8. The input pipe 7 is inserted into the collection cavity 9 of the annular pipe 4 through the annular plate 8.

[0047] During use, the cooling medium enters the collection cavity 9 through the delivery pipe 7. The cooling medium is pressurized by the delivery pump and transported to the collection cavity 9 through the inlet delivery pipe 7. Under a certain pressure, the cooling medium is atomized into atomizing particles of a size corresponding to the pressure by the atomizer 6 to rapidly cool the high-temperature syngas and molten slag in the channel. The same as the first embodiment, the high-temperature gas rapid cooling device 120 is installed between the slag outlet of the HT-L furnace and the quench ring. By selecting atomizers and the number with appropriate parameters, the syngas at 1350 °C can be rapidly cooled to below 800 °C within the effective stroke, effectively ensuring the safe and effective operation of the quench ring.

[0048] See Figure 4, which shows a high-temperature gas rapid cooling device 130 according to the third embodiment of the present invention. The setting methods and working principles of the first connection flange 1, the support rib plate 2, the second connection flange 3, the atomizer mounting seat 5, the atomizer 6, the input pipe 7, and the ring plate 8 in the high-temperature gas rapid cooling device 120 are exactly the same, and will not be elaborated here. The difference between this high-temperature gas rapid cooling device 130 and the high-temperature gas rapid cooling device 120 is only that: the annular pipe 4 includes an inner half-annular pipe 42 and an outer half-annular pipe 43 sleeved outside the inner half-annular pipe, and the cross-sectional shapes of the inner half-annular pipe 42 and the outer half-annular pipe 43 are both semi-circular. The collecting cavity of the annular pipe 4 includes an inner collecting cavity 92 of the inner half-annular pipe and an outer collecting cavity 91 of the outer half-annular pipe. The inner collecting cavity 92 is formed by the inner side of the pipe wall of the inner half-annular pipe 42 and the ring plate 8 surrounding each other, and the outer collecting cavity 91 is formed by the pipe wall of the outer half-annular pipe 43, the outer side of the pipe wall of the inner half-annular pipe 42, and the ring plate 8 surrounding each other.

[0049] In one example, the inner collecting cavity 92 of the inner half-annular pipe is communicated with the plurality of conveying pipes 7, and the outer collecting cavity 91 of the outer half-annular pipe is communicated with the plurality of mounting holes 41, and the plurality of atomizers are all arranged in the outer collecting cavity. Those skilled in the art can understand that a plurality of mounting holes 41 can also be provided on the pipe wall of the inner half-annular pipe 42 accommodated in the outer collecting cavity 91, and the atomizer 6 is also provided in the mounting holes 41. This example is only an illustrative example, and those skilled in the art should not understand it as a limitation to the present invention.

[0050] In one example, a plurality of injection holes (not shown) are provided on the pipe wall of the inner half-annular pipe accommodated in the outer collecting cavity, and the plurality of injection holes are uniformly arranged along the circumferential direction of the inner half-annular pipe. In one example, the number of the plurality of injection holes is set in the range of 4 to 8, preferably 5 injection holes.

[0051] During use, the cooling medium is pressurized by a delivery pump and enters the inner collecting cavity 92 through the inlet delivery pipe 7, and then is sprayed into the outer collecting cavity 91 through 5 injection holes provided on the inner half-annular pipe. In this way, to a certain extent, the inner wall of the outer collecting cavity 91 is washed. The upper part of the inner wall of the outer collecting cavity 91 is a high-temperature area. With such a structure, the flow rate of the medium in the collecting cavity 9 is increased, scale formation is not easy to occur, and the situation that the upper part of the outer collecting cavity 91 is ablated due to the formation of bubbles in the upper corner of the outer collecting cavity 91 resulting in a dead zone can be effectively avoided.

[0052] Under a certain pressure, the cooling medium is atomized by the atomizer 6 into atomized particles with a particle size corresponding to the pressure, and the high-temperature synthesis gas and slag in the rapid cooling channel are quickly cooled. Similar to the first embodiment, the high-temperature gas rapid cooling device 130 is installed between the slag outlet of the HT-L furnace and the quench ring. By selecting atomizers with appropriate parameters and the number of atomizers, the synthesis gas at 1350 °C can be quickly cooled to below 800 °C within the effective stroke, effectively ensuring the safe and effective operation of the quench ring.

[0053] The high-temperature gas rapid cooling device according to the present invention has at least one of the following advantages:

[0054] (1) The high-temperature gas rapid cooling device provided by the present invention enables the cooling medium to be atomized by the atomizer to form mist-like droplets, which can quickly cool the high-temperature raw synthesis gas and slag, thereby greatly shortening the length of the high-temperature section, achieving the purpose of strengthening heat and mass transfer, and realizing efficient gas-slag separation;

[0055] (2) The high-temperature gas rapid cooling device provided by the present invention can rapidly cool the high-temperature raw synthesis gas produced in the gasification chamber, enabling the quench ring and the downcomer to work at a relatively safe temperature. At the same time, it can also reduce the amount of quench water and improve the problems of water and ash carryover;

[0056] (3) The high-temperature gas rapid cooling device provided by the present invention is connected to the quench ring and the slag outlet respectively by connecting flanges, making disassembly convenient;

[0057] (4) The atomizer in the high-temperature gas rapid cooling device provided by the present invention is installed on the atomizer mounting seat by threads, which is convenient for inspection, replacement and maintenance;

[0058] (5) By selecting the type, composition and pressure regulation of the atomizing medium, the high-temperature gas rapid cooling device provided by the present invention can avoid blockage of the atomizer, thereby avoiding uneven distribution of the cooling medium, and effectively improving the cooling efficiency of the high-temperature raw synthesis gas and slag.

[0059] Although some embodiments of the general inventive concept have been shown and described, those of ordinary skill in the art will understand that changes can be made to these embodiments without departing from the principles and spirit of the general inventive concept. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A high-temperature gas rapid cooling device, characterized in that the high-temperature gas rapid cooling device includes a collector and a plurality of atomizers for spraying a cooling medium. The collector has at least one collecting chamber, and a plurality of mounting holes are provided on the collector. The plurality of atomizers are installed in the at least one collecting chamber, and at least one of the plurality of mounting holes communicates with at least one of the plurality of atomizers; the collector includes a first connecting flange, a second connecting flange and a ring pipe. The ring pipe is arranged between the first connecting flange and the second connecting flange. The ring pipe has the at least one collecting chamber, and the plurality of mounting holes are provided on the inner pipe wall of the ring pipe; the high-temperature gas rapid cooling device is connected to a corresponding quench ring and a slag notch through the first connecting flange and the second connecting flange. The high-temperature gas and the molten slag flow through the cavity formed by the first connecting flange, the ring pipe and the second connecting flange surrounding each other to achieve cooling.

2. The high-temperature gas rapid cooling device according to claim 1, characterized in that the plurality of mounting holes are provided on the inner pipe wall of the collector, and all of the plurality of atomizers are arranged in the same collecting chamber of the at least one collecting chamber, and the plurality of atomizers and the plurality of mounting holes are arranged in a one-to-one correspondence; an atomizer mounting seat is provided at each of the plurality of mounting holes.

3. The high-temperature gas rapid cooling device according to claim 1, characterized in that the plurality of mounting holes are arranged circumferentially on the inner pipe wall of the ring pipe, and the plurality of mounting holes are all arranged on the lower half arc of the ring pipe. The included angle range between the center line of each of the plurality of mounting holes and the horizontal plane is 25° to 60°.

4. The high-temperature gas rapid cooling device according to claim 3, characterized in that the nozzle of each of the plurality of atomizers faces the corresponding mounting hole among the plurality of mounting holes, and the included angle between the center line of each atomizer and the horizontal plane is equal to the included angle between the center line of each mounting hole and the horizontal plane.

5. The high-temperature gas rapid cooling device according to claim 4, characterized in that the atomization angle range of the atomizer is 60° to 150°, and the atomization particle size range of the atomizer is 0 to 1000 μm.

6. The high-temperature gas rapid cooling device according to claim 5, characterized in that the atomization angle range of the atomizer is 60° to 120°, and the atomization particle size range of the atomizer is 50 to 500 μm.

7. The high-temperature gas rapid cooling device according to any one of claims 1 or 3-6, characterized in that the high-temperature gas rapid cooling device further includes a plurality of delivery pipes. The plurality of delivery pipes are all communicated with at least one collecting chamber of the ring pipe, and each of the plurality of delivery pipes is perpendicular or tangent to the outer pipe wall of the ring pipe between the first connecting flange and the second connecting flange.

8. The high-temperature gas rapid cooling device according to claim 7, characterized in that The collector further includes an annular plate, and the annular plate is the outer pipe wall of the annular pipe.

9. The high-temperature gas rapid cooling device according to claim 8, characterized in that The annular pipe includes an inner half-annular pipe and an outer half-annular pipe sleeved outside the inner half-annular pipe. The collecting cavity of the annular pipe includes an inner collecting cavity of the inner half-annular pipe and an outer collecting cavity of the outer half-annular pipe. The inner collecting cavity is formed by the inner side of the pipe wall of the inner half-annular pipe and the annular plate surrounding it. The outer collecting cavity is formed by the pipe wall of the outer half-annular pipe, the outer side of the pipe wall of the inner half-annular pipe and the annular plate surrounding each other.

10. The high-temperature gas rapid cooling device according to claim 9, characterized in that The inner collecting cavity of the inner half-annular pipe is communicated with the plurality of conveying pipes, and the outer collecting cavity of the outer half-annular pipe is communicated with the plurality of mounting holes, and the plurality of atomizers are all arranged in the outer collecting cavity. A plurality of injection holes are arranged on the pipe wall of the inner half-annular pipe accommodated in the outer collecting cavity, and the plurality of injection holes are arranged along the circumferential direction of the inner half-annular pipe.

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