Display panel and display device

Abstract

Embodiments of the present invention disclose a display panel and a display device. The substrate of the display panel includes a display area and a non-display area surrounding the display area. The display area includes a plurality of signal lines arranged in a first direction and extending in a second direction. The non-display area includes a bonding area for arranging a driving chip. The driving chip includes a blank area located in an angular area between two adjacent sides of the driving chip. The bonding area is provided with a virtual pad group, and the virtual pad group includes at least one virtual pad. The orthographic projection of the virtual pad and the blank area on the display panel overlaps, and the side of the virtual pad facing the driving chip is a convex structure. Wherein, the orthographic projection of the virtual pad in the first direction is a first projection, and the orthographic projection of the virtual pad in the second direction is a second projection. The size of the first projection is larger than the size of the second projection. Embodiments of the present invention can improve the production qualification rate and are beneficial to the narrow border of the display panel.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Currently, various types of display panels have been developed on the market, such as liquid crystal display panels, organic light emitting display panels, etc. The display panel includes a display area provided with a pixel unit array, and a non-display area provided with a driving chip for driving the pixel unit array.

[0003] In a common process, the driver chip is manufactured separately in the form of a chip, and the driver chip is welded to the pads in the display panel to achieve the binding of the driver chip. This method of binding the driver chip is in the form of COG (chip on glass). Usually, the display panel that uses the COG form to bind the driver chip will be provided with input pads and output pads, and the input pads are welded to the input terminals in the driver chip, and the output pads are welded to the output terminals in the driver chip. However, when binding the driver chip, due to reasons such as the setting method of the input pads and the output pads, the corners of the driver chip are prone to warping or breaking, etc., thereby affecting the pass rate of the display panel and increasing the preparation cost of the display panel. Summary of the invention

[0004] In view of this, embodiments of the present invention provide a display panel and a display device to improve the yield of the display panel and thereby reduce the manufacturing cost of the display panel.

[0005] In a first aspect, an embodiment of the present invention provides a display panel, comprising: a base substrate; the base substrate comprises a display area and a non-display area surrounding the display area, the display area comprises a plurality of signal lines arranged along a first direction and extending along a second direction, wherein the first direction is perpendicular to the second direction;

[0006] The non-display area includes a binding area, the binding area is used to set a driving chip, the driving chip includes a blank area, and the blank area is located in the angle area between two adjacent side edges of the driving chip;

[0007] The binding area is provided with a virtual pad group, the virtual pad group includes at least one virtual pad; the virtual pad overlaps with the positive projection of the blank area on the display panel, and the side of the virtual pad facing the driving chip is a convex structure;

[0008] The orthographic projection of the virtual pad in the first direction is a first projection, and the orthographic projection of the virtual pad in the second direction is a second projection; and the size of the first projection is greater than the size of the second projection.

[0009] In a second aspect, an embodiment of the present invention further provides a display device, including the above-mentioned display panel.

[0010] For the display panel and the display device provided by the embodiments of the present invention, by setting a virtual pad group in the bonding area, and the positive projection of the virtual pads in the virtual pad group and the blank area of the driving chip on the display panel overlaps, so that when bonding the driving chip, the virtual pads can support the blank area within the included angle area between the two sides of the driving chip, thereby preventing warping or breaking when bonding the driving chip, further improving the electrical contact performance between the display panel and the driving chip, improving the display effect of the display panel, and improving the production qualification rate of the display panel, and further reducing the preparation cost of the display panel; at the same time, by setting the projection size of the virtual pads in the bonding area in the first direction to be larger than the projection size in the second direction, it is possible to ensure that the virtual pads have sufficient supporting effect, which is beneficial to reducing the size of the non-display area in the second direction, and further beneficial to the narrow border of the display panel, and further improving the screen-to-body ratio of the display panel. Description of the Drawings

[0011] Figure 1 is a schematic structural diagram of a driving chip bonded to a display panel in the prior art;

[0012] Figure 2 is a top view structural diagram of a display panel provided by an embodiment of the present invention;

[0013] Figure 3 is another top view structural diagram of a display panel provided by an embodiment of the present invention;

[0014] Figure 4 is a structural diagram of a driving chip provided by an embodiment of the present invention;

[0015] Figure 5 is another structural diagram of a driving chip provided by an embodiment of the present invention;

[0016] Figure 6 is Figure 2 an enlarged structural diagram of the virtual pads in area B in ;

[0017] Figure 7 is a top view structural diagram of a virtual pad provided by an embodiment of the present invention;

[0018] Figure 8 is Figure 2 a film layer structural diagram of a display panel of a cross-section A-A' in ;

[0019] Figure 9 is another top view structural diagram of a display panel provided by an embodiment of the present invention;

[0020] Figure 10 is a top - view structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0021] Figure 11 is Figure 10 a film - layer structural schematic diagram of a display panel of the C - C' cross - section in [[ ]];

[0022] Figure 12 is Figure 10 an enlarged structural schematic diagram of the fan - out lines in the M region in [[ ]];

[0023] Figure 13 is a film - layer structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0024] Figure 14 is a partial top - view structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0025] Figure 15 is a partially enlarged structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0026] Figure 16 is a partially enlarged structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0027] Figure 17 is another partially enlarged structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0028] Figure 18 is another partial top - view structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0029] Figure 19 is along Figure 18 a film - layer structural schematic diagram of a display panel of the D - D' cross - section in [[ ]];

[0030] Figure 20 is another partially enlarged structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0031] Figure 21 is another partially enlarged structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0032] Figure 22 is another partially enlarged structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0033] Figure 23 is a partial top - view structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0034] Figure 24It is a schematic structural diagram of a display device provided by an embodiment of the present invention. Detailed implementation manners

[0035] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the convenience of description, only the parts related to the present invention rather than all the structures are shown in the drawings.

[0036] As described in the background art, when binding a display panel in the form of COG (chip on glass), that is, directly binding a driving chip to the display panel, input pads and output pads will be provided on the display panel, so that the input terminals of the driving chip are welded corresponding to the input pads of the display panel, and the output terminals of the driving chip are welded corresponding to the output pads of the display panel. Figure 1 It is a schematic structural diagram of a prior art driving chip bound to a display panel. As Figure 1 shown, the input pads 011 and output pads 012 on the display panel 001 are respectively welded corresponding to the input terminals 021 and output terminals 022 of the driving chip 002. However, since there are no corresponding terminals at the corner positions of the driving chip 002, and there are no corresponding pads on the display panel 001 corresponding to the corner positions of the driving chip 002, the driving chip 002 tilts towards its corner side, that is, the driving chip 002 warps, and when the driving chip 002 is subjected to a large force, it will also break, so that the input terminals 021 of the driving chip 002 are in poor contact with the input pads 011 on the display panel 001, affecting the signal transmission between the driving chip 002 and the display panel 001, further affecting the display effect of the display panel 001, while reducing the production qualification rate of the display panel 001 and increasing the preparation cost of the display panel 001.

[0037] To solve the above technical problems, an embodiment of the present invention provides a display panel, which includes a substrate; the substrate includes a display area and a non-display area surrounding the display area, the display area includes a plurality of signal lines arranged along a first direction and extending along a second direction, wherein the first direction and the second direction are perpendicular; the non-display area includes a binding area for setting a driving chip, the driving chip includes a blank area located in the angular area between two adjacent sides of the driving chip; the binding area is provided with a virtual pad group, the virtual pad group includes at least one virtual pad; the virtual pad and the blank area have an overlap in the orthographic projection on the display panel, and the side of the virtual pad facing the driving chip is a convex structure; wherein, the orthographic projection of the virtual pad in the first direction is a first projection, and the orthographic projection of the virtual pad in the second direction is a second projection; the size of the first projection is larger than the size of the second projection.

[0038] With the above technical solution, by setting a virtual pad group in the bonding area, and the positive projection of the virtual pads in the virtual pad group and the blank area of the driving chip on the display panel overlaps, so that when bonding the driving chip, the virtual pads can support the blank area within the included angle area between the two sides of the driving chip, thereby preventing the driving chip from warping or breaking during bonding, further improving the electrical contact performance between the bonding area of the display panel and the driving chip, improving the display efficiency of the display panel, and improving the production qualification rate of the display panel, thereby reducing the preparation cost of the display panel; at the same time, by making the projection size of the virtual pads arranged in the bonding area in the first direction larger than the projection size in the second direction, it is possible to ensure that the virtual pads have sufficient supporting effect, which is beneficial to reducing the size of the non-display area in the second direction, and further beneficial to the narrow border of the display panel, and further improving the screen-to-body ratio of the display panel.

[0039] The above is the core idea of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention. Hereinafter, the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention.

[0040] In the following description, many specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention may be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0041] Secondly, the present invention will be described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for the convenience of description, the schematic diagrams showing the structures of the device components are not enlarged locally according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention here. In addition, in actual production, three-dimensional spatial dimensions including length, width, and height should be included.

[0042] Figure 2 is a top view structural schematic diagram of a display panel provided by an embodiment of the present invention, Figure 4 is a structural schematic diagram of a driving chip provided by an embodiment of the present invention, Figure 6 is Figure 2 an enlarged structural schematic diagram of the virtual pads in area B in Figure 2As shown, the substrate 10 of the display panel 100 has a display area 110 and a non-display area 120 surrounding the display area 110. The display area 110 is provided with signal lines 14 arranged along a first direction X and extending along a second direction Y, where the first direction X and the second direction Y are perpendicular. Exemplarily, the signal lines 14 may include data signal lines for transmitting data signals, or may include other signal lines known in the prior art, such as touch signals, etc. The embodiments of the present invention do not make specific limitations in this regard.

[0043] It should be noted that Figure 2 This is only an exemplary illustration of the embodiments of the present invention, Figure 2 and only a part of the signal lines 14 located in the display area 110 are exemplarily shown, and the omitted signal lines are indicated by “…”. That is, in the embodiments of the present invention, multiple signal lines are provided in the display area of the substrate. For the sake of clear illustration, only part of the signal lines are exemplarily shown in the drawings of the embodiments of the present invention, but this is not a limitation to the embodiments of the present invention.

[0044] In addition, Figure 2 in [reference] the signal line 14 is a straight line extending along the second direction Y, while in the embodiments of the present invention, the signal line 14 may also be in the form of a broken line (as Figure 3 shown). And on the premise that the overall extension direction of the signal line is the second direction Y, the embodiments of the present invention do not make specific limitations on the shape of the signal line 14. For the convenience of description and drawing, the embodiments of the present invention exemplarily illustrate the technical solutions of the embodiments of the present invention with the signal line 14 being a straight line.

[0045] With reference to Figure 2 and Figure 4 It should be noted that the reference in line 12 is not clear in the original text. You may need to check and provide more accurate information if possible., in the non-display area 120 of the substrate 10 in the display panel 100, the bonding area 121 is included. The bonding area 121 is used to set the driving chip 20. The driving chip 20 includes blank areas (211 and 212), and the blank areas (211 and 212) are located in the angular area between two adjacent sides of the driving chip 20. Correspondingly, a virtual pad group is provided in the bonding area 121 of the substrate 10 in the display panel 100. The virtual pad group includes at least one virtual pad 11; the positive projection of the virtual pad 11 on the display panel 100 and the blank areas (211 and / or 212) of the driving chip 20 overlap, and the side of the virtual pad 11 facing the driving chip 20 is a convex structure. When the driving chip 20 is installed on the bonding area 121 of the substrate 10 in the display panel 100, the virtual pad 11 can play a certain supporting role for the blank areas (211 and / or 212) located in the corner area of the driving chip 20, reducing the gap between the blank areas (211, 212) of the driving chip 20 and the bonding area 121 of the substrate 10 in the display panel 100, so as to prevent the driving chip from tilting to the side of its blank area due to a large gap between the blank area of the driving chip and the bonding area of the display panel, resulting in warping or breaking. Furthermore, it can improve the point contact performance between the bonding area of the substrate 10 in the display panel 100 and the driving chip 20, which is beneficial to improving the display effect of the display panel 100; at the same time, it is also beneficial to improve the production qualification rate of the display panel 100 and reduce the preparation cost of the display panel 100.

[0046] It should be noted that Figure 2 and Figure 4 are only exemplary drawings of the embodiments of the present invention. Figure 2 All the virtual pads 11 in Figure 4 can be located within the positive projection of the blank areas (211 and / or 212) of the driving chip 20 on the display panel 100; in the embodiments of the present invention, it is also possible that some virtual pads or a part of a virtual pad are located within the positive projection of the blank area of the driving chip on the display panel, and the rest are located outside the positive projection of the blank area of the driving chip on the display panel. In the process of installing the driving chip on the bonding area of the display panel, even in the case of alignment deviation, as long as the virtual pad can still play a certain supporting role for the driving chip, the embodiments of the present invention do not make specific limitations on this.

[0047] Meanwhile, Figure 4The structure of the driving chip 20 shown is only an exemplary drawing of an embodiment of the present invention. In FIG. 4, the outer contour of the driving chip 20 is a rectangular structure. The angular regions between the first side 201 and the fourth side 204 and between the first side 201 and the second side 202 of the rectangular-structured driving chip 20 are blank areas (211 and 212) of the driving chip 20. In other embodiments of the present invention, as Figure 5 shown, the driving chip 20 may also have an irregular shape. There is a fifth side 205 between the first side 201 and the fourth side 204 of the irregular-shaped driving chip 20, and a sixth side 206 between the first side 201 and the second side 202; at this time, the blank area 211 may be located within the angular region formed by the extension lines of the first side 201 and the fourth side 204, and the blank area 212 may be located within the angular region formed by the extension lines of the first side 201 and the second side 202; at the same time, the blank area 211 may also partially overlap with the blank area 212; thus, as long as there are no bonding terminals ( Figure 4 and Figure 5 the input terminal 22 and the output terminal 23 in) that meet the position within the angular region between two adjacent sides of the driving chip, and the direction in which the output terminal 23 on the driving chip points to the display area can be the blank area of the driving chip. On the basis of meeting the above conditions, the outer contour of the driving chip and the position of the blank area in the driving chip are not specifically limited in the embodiments of the present invention. For the convenience of description, in the case where the outer contour of the driving chip is not specified, the embodiments of the present invention will take the outer contour of the driving chip as a rectangle as an example to exemplarily illustrate the technical solutions of the embodiments of the present invention.

[0048] In addition, continuing to combine Figure 2 and Figure 4As shown, an input pad 12 and an output pad 13 are further provided in the bonding area 121. The driving chip can receive an input signal transmitted by an external structure (such as an FPC) through the input pad 12, and the output pad 13 can transmit the signal output by the driving chip 20 to the corresponding signal line. That is, the output pad 13 can be electrically connected to the signal line 14 correspondingly through the fan-out line 15. The signal output by the driving chip can be transmitted to the corresponding signal line 14 through the output pad 13 and the fan-out line 15 in sequence. At this time, the fan-out line 15 needs to extend into the bonding area 121, so that part of the fan-out line 15 overlaps with the virtual pad 11 provided in the bonding area 121, and / or the virtual pad 11 is located between two adjacent fan-out lines 15. Thus, compared with the solution without the virtual pad 11 in the bonding area 121, when the virtual pad 11 is provided in the bonding area, the fan-out line 15 for electrically connecting the signal line 14 and the output pad 13 needs to make room for the virtual pad 11, thereby increasing the area of the region where the fan-out line 15 is located (the fan-out area 122), that is, the size of the fan-out area 122 can be increased in the first direction X, and / or the size of the fan-out area 122 can be increased in the second direction Y.

[0049] Combined with Figure 2 and Figure 6As shown, the long side extension direction of the input pad 12 and the output pad 13 is parallel to the second direction Y, while the short side extension direction thereof is parallel to the first direction X, that is, the dimension of the input pad 12 and the output pad 13 in the second direction Y is greater than their dimension in the first direction X. In the embodiment of the present invention, the virtual pad 11 is arranged differently from the input pad 12 and the output pad 13. The first projection 1101 of the virtual pad 11 in the first direction X is the orthographic projection of the virtual pad 11 in the first direction X, and the second projection 1102 of the virtual pad 11 in the second direction Y is the orthographic projection of the virtual pad 11 in the second direction Y, and the dimension a of the first projection 1101 is greater than the dimension b of the second projection 1102. At this time, when the dimension of the virtual pad 11 is fixed, the space that the fan-out line 15 needs to avoid is fixed, that is, the increase amount of the area of the fan-out region 122 is fixed. The area S of the fan-out region 122 can be, for example, x*y, where x is the dimension of the fan-out region 122 in the first direction X, and y is the dimension of the fan-out region 122 in the second direction Y. When the dimension of the first projection 1101 of the virtual pad 11 in the first direction X is greater than the dimension of the second projection 1102 of the virtual pad 11 in the second direction Y, the avoidance space of the fan-out line 15 in the first direction X should be greater than its avoidance space in the second direction Y, so that the increase amount of the dimension of the fan-out region 122 in the first direction X is greater than the increase amount of its dimension in the second direction Y. When the area S of the fan-out region 122 is fixed, the larger the dimension x of the fan-out region 122 in the first direction X, the smaller the dimension y of the fan-out region 122 in the second direction Y. Thus, by setting the virtual pad 11 such that the dimension a of the first projection 1101 of the virtual pad 11 in the first direction X is greater than the dimension b of the second projection 1102 of the virtual pad 11 in the second direction Y, on the premise that the virtual pad 11 has a certain supporting effect on the corner region of the driving chip, the increase amount of the fan-out region 122 in the second direction Y can be minimized as much as possible. Therefore, after the virtual pad 11 is set, the dimension of the lower border of the display panel 100 in the second direction Y is not increased as much as possible, which is beneficial to the narrow border of the display panel 100 and beneficial to improving the screen-to-body ratio of the display panel 100.

[0050] It should be noted that Figure 6 These are only exemplary drawings of the embodiments of the present invention. Figure 6 The long side of the virtual pad 11 in the figure has a certain angle with the first direction X, that is, the virtual pad 11 is inclined; in the embodiment of the present invention, the setting methods of the virtual pads can be the same (as Figure 2 shown) or different (as Figure 3 shown). On the premise that the dimension of the first projection of the virtual pad is greater than the dimension of the second projection, the present invention does not specifically limit the setting method and specific structure of the virtual pad.

[0051] Optionally, continue to refer to Figure 6As shown, the value range of the size a of the first projection of the virtual pad 11 can be 40μm ≤ a ≤ 200μm; the value range of the size b of the second projection of the virtual pad 11 can be 5μm ≤ b ≤ 40μm. In this way, by setting the sizes of the first projection and the second projection of the virtual pad within the corresponding ranges, the virtual pad 11 can have sufficient contact area with the blank area of the driving chip to ensure that the virtual pad 11 has sufficient supporting ability for the blank area of the driving chip; at the same time, when the sizes of the first projection and the second projection of the virtual pad are set within the corresponding ranges, it can prevent the virtual pad from having too large a size and having a greater impact on the border size of the display panel, which is beneficial to the narrow border of the display panel.

[0052] Among them, on the premise that the size of the first projection of the virtual pad 11 is larger than the size of the second projection, the embodiments of the present invention do not specifically limit the shape of the virtual pad 11. Exemplarily, Figure 7 is a top view structural schematic diagram of a virtual pad provided by an embodiment of the present invention. As Figure 7 shown, the structure of the orthographic projection of the virtual pad 11 on the substrate is one of a quadrilateral ( Figure 7 (a)), a rounded quadrilateral ( Figure 7 (b)), a polygon ( Figure 7 (c)), and an ellipse ( Figure 7 (d)). Among them, when the structure of the orthographic projection of the virtual pad 11 on the substrate is a polygon, the polygon can be, for example, a triangle, a pentagon, a hexagon, or an octagon, etc., and the embodiments of the present invention do not specifically limit this. For the convenience of description, in the embodiments of the present invention, the virtual pad is taken as a quadrilateral as an example to exemplarily illustrate the technical solutions of the embodiments of the present invention.

[0053] Optionally, continuing to refer to Figure 2 shown, the bonding area 121 of the substrate 10 in the display panel 100 includes an output pad area 1201 and an input pad area 1202, and a plurality of output pads 13 are provided in the output pad area 1202, and a plurality of input pads 12 are provided in the input pad area 1201; the output pad area 1202 includes a first area 1211, a second area 1212, and a third area 1213 arranged in sequence along the first direction X; the output pads 13 include a first pad 131 and a second pad 132, and the first pad 131 is located in the second area 1212, and the second pad 132 is located in the first area 1211 and / or the third area 1213, and a plurality of second pads 132 are arranged obliquely from one side of the second area 1212 to the side away from the display area 110.

[0054] Among them, when the first region 1211 and the third region 1213 can both be provided with the second pad 132, and the second pad 132 located in the first region 1211 and the second pad 132 located in the third region 1213 are arranged obliquely away from the display region 110 from both sides of the second region 1212, the multiple output pads 13 of the output pad region 1202 are arranged in a sunken manner. Such a setting method enables the driving chip to be bonded to the display panel 100 in the form of COG, the fan-out line 15 in the display panel 100 can extend to the bonding region 121, and the bending region of the fan-out line 15 can be set in the bonding region 121, thereby reducing the width of the border where the fan-out region 122 in the display panel is located, and further facilitating the narrow border of the display panel 100.

[0055] It should be noted that Figure 2 the setting method of the output pads in [the above text] is only an exemplary setting method in the embodiments of the present invention. In other embodiments of the present invention, the output pads are arranged in sequence along the first direction, and there is a small distance between the output pads and the input pads. At this time, the virtual pad can be set on the side of the output pad close to the display region. In this way, the fan-out line can also extend to the bonding region, and the bending region of the fan-out line can be set in the bonding region to reduce the width of the border where the fan-out region in the display panel is located. And as long as the positive projection of the virtual pad and the blank region of the driving chip on the substrate has an overlap, the virtual pad can also play a certain supporting role for the blank region of the driving chip; or, the arrangement of the output pads can also be as Figure 3 shown. The second pad 132 is only located in the first region 1211, and the second pad 132 located in the first region 1211 is arranged obliquely away from the display region 110 from one side of the second region 1212, while the third pad 133 in the third region 1213 is arranged in the same way as the first pad 131 in the second region 1212. At this time, when the output pad 13 is arranged close to the input pad 12, the virtual pad 11 can also be located on the side of the output pad 13 close to the display region 110. In this way, the fan-out line 15 can also extend to the bonding region 121, and the bending region of the fan-out line 15 can be set in the bonding region 121 to reduce the width of the border where the fan-out region 122 in the display panel 100 is located. And as long as the positive projection of the virtual pad 11 and the blank region of the driving chip on the substrate 10 has an overlap, the virtual pad 11 can also play a certain supporting role for the blank region of the driving chip. The above is only an exemplary description of the setting method of the output pads in the embodiments of the present invention. The setting method of the output pads in the embodiments of the present invention includes but is not limited to the above setting methods.

[0056] Optionally, Figure 8 is Figure 2 a schematic diagram of the film layer structure of a display panel of the A-A' cross-section in [the above text]. Combining Figure 2 and Figure 8As shown, the thickness T1 of the display panel 100 at the position where the virtual pad 11 is located is greater than or equal to the thickness of the display panel 100 at the position where the input pad 12 is located; and / or, the thickness T1 of the display panel 100 at the position where the virtual pad 11 is located is greater than or equal to the thickness of the display panel 100 at the position where the output pad 13 is located.

[0057] In this way, when the thickness T1 of the display panel 100 at the position where the virtual pad 11 is located is greater than or equal to the thickness at the position where the input pad 12 is located, the virtual pad 11 can play a certain supporting role in the blank area of the driving chip, so as to prevent the driving chip from warping at the position corresponding to the input pad 12 when the driving chip is bonded to the bonding area 121 of the display panel 100, thereby ensuring the contact performance between the driving chip and the input pad 12, ensuring the accuracy of signal transmission between the driving chip and the display panel 100, and further improving the display effect of the display panel 100 and the production qualified rate of the display panel 100. Correspondingly, when the thickness T1 of the display panel 100 at the position where the virtual pad 11 is located is set to be greater than or equal to the thickness at the position where the output pad 13 is located, the virtual pad 11 can also ensure a certain supporting role in the blank area of the driving chip to achieve the above technical effects, which will not be elaborated here one by one.

[0058] It should be noted that Figure 2 These are only exemplary drawings of the embodiments of the present invention. Figure 2 In [[the figure]], the orthographic projection shapes of the output pad 13, the input pad 12, and the virtual pad 11 on the substrate 10 are all rectangles; while in the embodiments of the present invention, the orthographic projection shapes of the output pad, the input pad, and the virtual pad on the substrate can also be other shapes, such as rounded rectangles, polygons, or ellipses, etc., and the output pad, the input pad, and the virtual pad can be the same or different, and the embodiments of the present invention do not make specific limitations in this regard.

[0059] Optionally, with reference to Figure 2 、 Figure 4 and Figure 8 As shown, multiple output terminals 23 and multiple input terminals 22 can be correspondingly arranged in the driving chip 20, and the output terminal 23 includes a first terminal 231 and a second terminal 232. The first terminal 231 is welded to the first pad 131 correspondingly, the second terminal 232 is welded to the second pad 132 correspondingly, and the input terminal 22 is welded to the input pad 12 correspondingly; at this time, the multiple output terminals 23 in the driving chip 20 will also be arranged in a sunken manner so that the output terminals 23 in the driving chip 20 can be welded to the output pads 13 in the bonding area 121 one by one.

[0060] Meanwhile, the driving chip 20 is also provided with a plurality of virtual terminals 21. The virtual terminals 21 are located in the blank areas (211, 212), and the virtual terminals 21 are correspondingly welded to the virtual pads 11 located in the bonding area 121. At this time, when the driving chip 20 is bonded to the bonding area 121 of the display panel 100 in the form of COG, the blank areas (211, 212) of the driving chip 20 have protruding virtual terminals 21 facing one side of the display panel 100, and virtual pads 11 are provided at positions corresponding to the blank areas (211, 212) of the bonding area 121 of the display panel 100. When the input terminals 22 of the driving chip 20 are correspondingly welded to the input pads 12 of the bonding area 121 and the output terminals 23 of the driving chip are correspondingly welded to the output pads 13 of the bonding area 121, the virtual pads 11 of the driving chip 20 can be correspondingly welded to the virtual pads 11 of the bonding area 121, avoiding a gap between the blank area of the driving chip 20 and the bonding area 121 after the driving chip 20 is aligned with the bonding area 121. Thus, during the bonding process, the force on the driving chip can be made more uniform, thereby improving the production yield of the display panel 100 and reducing the manufacturing cost of the display panel 100.

[0061] In the embodiment of the present invention, a plurality of output pads 13 in the bonding area 121 of the display panel 100 are arranged in one row or multiple rows, and a plurality of input pads 12 are arranged in one row or multiple rows. When the input pads 12 and the output pads 13 are arranged in multiple rows, the adjacent two rows of input pads 12 and / or the adjacent two rows of output pads 13 can be arranged in a staggered manner to facilitate the electrical connection between the input pads 12 and the output pads 13 and the corresponding traces (such as fan-out lines 15, connection lines, etc.). The specific arrangement manner of the plurality of output pads 13 and the plurality of input pads 12 in this embodiment is not limited. Any arrangement manner that satisfies the second pads 132 located in the first area 1211 and / or the third area 1213 being arranged obliquely away from the display area 110 along one side of the second area 1212 is within the protection scope of the embodiment of the present invention. Correspondingly, a plurality of output terminals 23 in the driving chip 20 are also arranged in one row or multiple rows, and a plurality of input terminals 22 are also arranged in one row or multiple rows. The arrangement manner of the plurality of output terminals 23 is similar to the arrangement manner of the plurality of output pads 13, and the arrangement manner of the plurality of input terminals 22 is similar to the arrangement manner of the plurality of input pads 12. The embodiment of the present invention does not make specific limitations on this.

[0062] Optionally, continue to refer to Figure 2 and Figure 4As shown in the figure, the driving chip 20 may include two relatively arranged long sides (201, 203) and two short sides (202, 204); among them, the two long sides include the first side 201 and the third side 203, and the two short sides include the second side 202 and the fourth side 204; the blank area includes the first blank area 211 and the second blank area 212; the first blank area 211 is located in the included angle area between the first side 201 and the fourth side 204, and the second blank area 212 is located in the included angle area between the first side 201 and the second side 202; correspondingly, two virtual pad groups are arranged in the bonding area 121; one virtual pad group overlaps with the positive projection of the first blank area 211 on the display panel 100, and the other virtual pad group overlaps with the positive projection of the second blank area 212 on the display panel 100, and the two virtual pad groups are symmetrically arranged along the second direction Y. In this way, the virtual pads 11 in the virtual pad group that overlaps with the positive projection of the first blank area 211 on the display panel 100 can support the first blank area 211 of the driving chip 20, and the virtual pads 11 in the virtual pad group that overlaps with the positive projection of the second blank area 212 on the display panel 100 can support the second blank area 212 of the driving chip 20. Thus, when the driving chip 20 is bonded to the bonding area 121 of the display panel 100, the driving chip 20 can be more evenly stressed, preventing the driving chip 20 from warping or being damaged due to the lack of support in the corner area of the driving chip 20, thereby improving the production yield of the display panel 100 and reducing the preparation cost of the display panel 100.

[0063] It should be noted that Figure 4 These are only exemplary drawings of the embodiments of the present invention. Figure 4 In the figure, the driving chip 20 is rectangular. At this time, the first side 201, the second side 202, the third side 203, and the fourth side 204 of the driving chip 20 can be sequentially connected; in the embodiments of the present invention, the driving chip can also be quasi-rectangular or other polygons. At this time, other sides can also be provided between the first side and the second side of the driving chip, and the included angle area between the first side and the second side is the included angle area between the extension line of the first side and the extension line of the second side of the driving chip; correspondingly, other sides can also be provided between the first side and the fourth side (such as Figure 5 shown), and the included angle area between the first side and the fourth side can also be located within the included angle area between the extension line of the first side and the extension line of the fourth side of the driving chip. The embodiments of the present invention do not make specific limitations on this.

[0064] Optionally, Figure 9 This is a schematic top view structure diagram of another display panel provided by the embodiments of the present invention. As Figure 9As described above, the non-display area 120 of the display panel 100 further includes a fan-out area 122; the fan-out area 122 is located between the bonding area 121 and the display area 110; the fan-out area 122 is provided with a plurality of fan-out lines 15, one end of the fan-out line 15 is electrically connected to the signal line 14, the other end of the fan-out line 15 extends into the bonding area 121 and is electrically connected to the output pad 13, and at least part of the fan-out lines 15 extend into the orthographic projections (2101, 2102) on the display panel 100 of the blank area of the driving chip.

[0065] Among them, since the multiple output pads 13 in the output pad area 1202 are arranged in a sunken manner, when the driving chip is bonded to the display panel 100 in the form of COG, the fan-out lines 15 in the fan-out area 122 can extend into the orthographic projections (2101, 2102) on the display panel 100 of the blank area of the driving chip, and the bent portions of the fan-out lines 15 can be arranged in the orthographic projections (2101, 2102) on the display panel 100 of the blank area of the driving chip, so as to be able to reduce the size of the fan-out area 122 in the Y direction in the display panel 100, which is beneficial to the narrow bezel of the display panel 100.

[0066] In the embodiment of the present invention, when the fan-out line extends into the orthographic projection on the display panel of the blank area of the driving chip, the orthographic projection on the substrate of the virtual pad overlapping with the orthographic projection on the display panel of the blank area of the driving chip may overlap or not overlap with the orthographic projection on the substrate of the fan-out line. The following respectively describes the cases where the projection of the virtual pad on the substrate overlaps and does not overlap with the orthographic projection of the fan-out line on the substrate.

[0067] Optionally, Figure 10 is a schematic top view structure diagram of another display panel provided by the embodiment of the present invention. Figure 11 is Figure 10 a schematic diagram of the film layer structure of a display panel of a cross-section C-C' in. Combining Figure 10 with FIG. 11, the orthographic projection of the virtual pad 11 on the substrate 10 overlaps with the orthographic projection of at least one fan-out line 15 on the substrate 10, and the thickness T1 of the display panel 100 at the position where the virtual pad 11 is located is greater than the thickness T4 of the display panel 100 at the position where the fan-out lines 15 in the fan-out area 122 are located. At this time, the virtual pad 11 can have corresponding supporting ability for the driving chip arranged in the bonding area 121, preventing the driving chip from warping or breaking when bonding the driving chip; at the same time, there is no need to set the virtual pad 11 in an additional space, so that on the premise of being able to improve the production yield of the display panel 100, the lower bezel size of the display panel 100 can be further reduced, which is beneficial to the narrow bezel of the display panel 100, and further improves the screen-to-body ratio of the display panel 100.

[0068] It should be noted that in the embodiments of the present invention, the orthographic projection of the virtual pad 11 on the substrate 10 overlaps with the orthographic projection of at least one fan-out line 15 on the substrate 10, that is, the orthographic projection of the virtual pad 11 on the substrate 10 overlaps with the orthographic projection of one, two or more fan-out lines 15 on the substrate, and the embodiments of the present invention do not make specific limitations on this; correspondingly, the orthographic projection of each fan-out line on the substrate may overlap with one, two or more virtual pads, and the embodiments of the present invention also do not make specific limitations on this. For the convenience of description, the embodiments of the present invention will take the orthographic projection of each virtual pad on the substrate overlapping with the orthographic projection of one fan-out line on the substrate as an example to exemplarily describe the embodiments of the present invention.

[0069] Optionally, Figure 12 Yes Figure 10 is an enlarged schematic structural diagram of the fan-out lines in the M region in. With reference to Figure 10 and Figure 12 , the part of the orthographic projection of the fan-out line 15 on the substrate 10 that is located within the orthographic projection of the virtual pad 11 on the substrate 10 is the first part 1051; the part of the fan-out line 15 that is located in the fan-out area 122 is the second part 1052; wherein, the width W1 of the first part 1051 is greater than the width W2 of the second part 1052. At this time, the first part 1051 of the fan-out line 15 can serve as a part of the virtual pad 11, so that the thickness of the display panel in the area where the virtual pad 11 is located is greater than the thickness of the display panel in the area where the second part 1052 of the fan-out line 15 in the fan-out area is located; at the same time, when the width of the first part 1051 of the fan-out line 15 is increased, it is beneficial to reduce the overall resistance of the fan-out line 15, thereby reducing the loss of the signal transmitted on the fan-out line 15, preventing signal distortion, and further improving the display effect of the display panel 100. Among them, the width W1 of the first part 1051 and the width W2 of the second part 1052 of the fan-out line 15 can both be the dimensions in the direction perpendicular to the extending direction of the fan-out line 15, or the dimensions along the first direction X, and the embodiments of the present invention do not make specific limitations on this

[0070] Exemplarily, Figure 13 is a schematic diagram of the film layer structure of a display panel provided by an embodiment of the present invention. Combining Figure 10 and Figure 13As shown, taking the example where each virtual pad 11 overlaps with a fan-out line 15, the display panel 100 may further include a first metal layer 30 and a second metal layer 40 that are sequentially and spaced apart on one side of the substrate 10, that is, the first metal layer 30 is located between the second metal layer 40 and the substrate 10, and a corresponding insulating layer is provided between the first metal layer 30 and the second metal layer 40 to insulate the first metal layer 30 and the second metal layer 40 from each other. The insulating layer may be composed of an organic insulating film layer or an inorganic insulating film layer; at this time, the virtual pad 11 may include a first virtual pad structure 1101 located on the first metal layer 30 and a second virtual pad structure 1102 located on the second metal layer 40. Correspondingly, the fan-out line 15 that overlaps with the virtual pad 11 may be located on the first metal layer 30 or on the second metal layer 40, and the fan-out line 15 that overlaps with the virtual pad 11 may also be formed by being connected in parallel through the first metal layer 30 and the second metal layer 40. An organic insulating film layer or an inorganic insulating film layer may also be provided above the second metal layer 40. The organic insulating film layer may be a photoresist material, and the inorganic insulating layer may be SiNx or SiOx; it should be noted that it is also possible for the virtual pad 11 and the fan-out line 15 that overlaps with it to be electrically connected, as long as the virtual terminals corresponding to the welding on the driving chip do not receive signals and are in a floating state, which will not affect the data transmission of the fan-out line of the display panel and will not cause abnormal display. The fan-out line 15 may include a first portion 1051 that overlaps with the orthographic projection of the virtual pad 11 on the substrate and a second portion 1052 located in the fan-out area 122. At this time, the width W1 of the first portion 1051 of the fan-out line 15 should be greater than the width W2 of its second portion 1052, and the height of the first portion 1051 of the fan-out line 15 should be greater than the height of its second portion 1052, so that the width W1 of the first portion 1051 of the fan-out line 15 that is multiplexed as the first virtual pad structure 1101 of the virtual pad 11 can meet the width requirement of the virtual pad 11, enabling the virtual pad 11 to have sufficient support capacity. At the same time, when the first portion 1051 of the fan-out line 15 has a relatively wide width W1, the overall resistance of the fan-out line 15 can be reduced, thereby reducing the loss of the signal transmitted on the fan-out line 15, preventing signal distortion, and further improving the display effect of the display panel 100. Among them, in the embodiment of the present invention, the widths of the first portion 1051 and the second portion 1052 of the fan-out line 15 may be the dimensions in the direction perpendicular to the extending direction of the fan-out line 15, or may be the dimensions in the first direction X. The embodiment of the present invention does not make specific limitations on this.

[0071] In addition, the virtual pad 11 may further include a transparent conductive layer 50 on a side of the second metal layer 40 facing away from the substrate 10 to form a third virtual pad structure 1103. An insulating layer is also provided between the transparent conductive layer 50 and the second metal layer 40. The material of the transparent conductive layer 50 may include indium tin oxide, etc. The transparent conductive layer 50 has a higher film hardness than the insulating layer. By disposing the transparent conductive layer on the outermost surface of the virtual pad 11 (the surface away from the substrate), it can not only resist scratches but also improve the support strength of the virtual pad 11, so as to provide a sufficient large support force and protection when bonding the driving chip.

[0072] In addition, continuing to refer to Figure 10 and Figure 13 , when the display panel 100 includes a first metal layer 30 and a second metal layer 40 which are spaced apart on a side of the substrate 10, any two adjacent fan-out lines may be respectively located on the first metal layer 30 and the second metal layer 30. When the fan-out lines 15 are located on the same layer, the fan-out lines 15 in the fan-out region 122 are arranged densely, resulting in signal crosstalk. Therefore, the accuracy of signal transmission can be further ensured, and the display effect of the display panel 100 can be improved. At this time, when the fan-out line 15 that overlaps with the orthographic projection of the virtual pad 11 on the substrate 10 is the first fan-out line, if the first fan-out line is located on the first metal layer 30, the first virtual pad structure 1101 of the virtual pad 11 will include part of the first fan-out line; when the first fan-out line is located on the second metal layer 40, the second virtual pad structure 1102 of the virtual pad 11 will include part of the first fan-out line; when the orthographic projection of the virtual pad 11 on the substrate may include at least two adjacent first fan-out lines, each first fan-out line that overlaps with the same virtual pad 11 may be respectively located on the first metal layer and the second metal layer, and both the first virtual pad structure 1101 and the second virtual pad structure 1102 of the virtual pad 11 will include part of the first fan-out line.

[0073] It should be noted that Figure 10 is only an exemplary drawing of the embodiment of the present invention. Figure 10 The extending direction of the long side of the virtual pad 11 in the figure is consistent with the first direction X; in the embodiment of the present invention, on the premise that the orthographic projection of the virtual pad in the first direction is greater than the orthographic projection of the virtual pad in the second direction, the extending direction of the long side of the virtual pad in the embodiment of the present invention is not specifically limited. The long side of the virtual pad is defined as: the longest side among the sides of the virtual pad, or when the virtual pad is oval, the long axis of the virtual pad can be used as the long side of the virtual pad.

[0074] Optionally, Figure 14 is a partial top view structural schematic diagram of a display panel provided by an embodiment of the present invention. As Figure 14As shown, the portion of the fan-out line 15 whose orthographic projection on the substrate 10 lies within the orthographic projection of the virtual pad 11 on the substrate 10 is the first portion 1051; the extending direction of the long side of the virtual pad 11 and the extending direction of the first portion 1501 of the fan-out line 15 have a first included angle θ; wherein, 0° ≤ θ ≤ 10°.

[0075] Thus, when the value range of the first included angle θ between the extending direction of the long side of the virtual pad 11 and the extending direction of the first portion 1051 of the fan-out line 15 is 0° ≤ θ ≤ 10°, the extending direction of the first portion 1051 of the fan-out line 15 and the extending direction of the long side of the virtual pad 11 have a relatively small included angle, so that the first portion 1051 of the fan-out line 15 can be reused as the virtual pad 11, that is, by increasing the width and thickness at the overlapping position of the first portion 1051 of the fan-out line 15 and the virtual pad 11, thereby simplifying the manufacturing process of the display panel and reducing the manufacturing cost of the display panel.

[0076] Correspondingly, as Figure 15 shown, when the extending direction of the long side of the virtual pad 11 and the extending direction of the first portion 1051 of the fan-out line 151 are kept consistent (within a relatively small angular range), on the premise that the size of the first projection of the virtual pad 11 in the first direction X is larger than the size of the second projection of the virtual pad 11 in the second direction Y, the extending direction of the first portion 1051 of the fan-out line 151 can be the same as the extending direction of other portions of the fan-out line 151 (such as Figure 15 (b)), or the extending direction of the first portion 1051 of the fan-out line 151 can also be different from the extending direction of other portions of the fan-out line 151 (such as Figure 15 (a)).

[0077] As Figure 15 (a) shows, when the extending direction of the first portion 1051 of the fan-out line 151 is different from the extending direction of other portions of the fan-out line 151, there is a corresponding included angle θ' between the first portion 1051 of the fan-out line 151 and other portions on both sides of the first portion. The existence of this included angle θ' causes the other fan-out lines 152 and 153 on both sides of the fan-out line 151 to move away from the fan-out line 151 to ensure that there is enough space to set the virtual pad 11 that intersects with the first portion 1051 of the fan-out line 151, and the distance L1 between the fan-out line 152 and the fan-out line 153 should be at least greater than the size of the orthographic projection of the virtual pad 11 in the direction perpendicular to the fan-out line 152 and / or 153.

[0078] As Figure 15(b), when the extending direction of the first part 1051 of the fan-out line 151 is the same as that of the other parts of the fan-out line 151, it is not necessary to set corresponding corners between the other parts on both sides of the first part 1051 of the fan-out line 151, so that the distance L2 between the fan-out line 152 and the fan-out line 153 only needs to meet the short side dimension of the virtual pad 11.

[0079] In this way, Figure 15 Obviously, the distance L1 between the fan-out line 152 and the fan-out line 153 in (a) is greater than the distance L2 between the fan-out line 152 and the fan-out line 153 in FIG. 15(b). Since the greater the distance between the fan-out lines, the larger the area of the required fan-out area, and the dimensions of the fan-out area in the first direction X and in the second direction Y can both have larger dimensions. Therefore, Figure 15 the size of the fan-out area for setting the fan-out lines (151, 152, 153) in (a) is larger than Figure 15 the size of the fan-out area for setting the fan-out lines (151, 152, 153) in (b). That is, when the extending direction of the first part 1051 of the fan-out line 151 is consistent with or has a smaller included angle with the extending direction of the other parts of the fan-out line 151, the size of the fan-out area can be further reduced, so that the size of the fan-out area in the second direction Y can be further reduced, which is conducive to the narrow border of the display panel and improves the screen-to-body ratio of the display panel.

[0080] Optionally, Figure 16 is a partially enlarged structural schematic diagram of a display panel provided by an embodiment of the present invention. Combining Figure 14 and Figure 16As shown, in the direction pointing from the fan-out region 122 to the bonding region 121, at least a part of the fan-out line 15 includes a first line segment (1511, 1521, 1531), a second line segment (1512, 1522, 1532), and a third line segment (1513, 1523, 1533) connected in sequence. When the orthographic projection on the substrate 10 of a fan-out line that overlaps with the orthographic projection of the virtual pad 11 on the substrate 11 is the first fan-out line 151, and the fan-out lines on both sides of the first fan-out line 151 are the second fan-out line 152 and the third fan-out line 153 respectively, the orthographic projection of the virtual pad 11 on the substrate 11 overlaps with the orthographic projection of the second line segment 1512 of the first fan-out line 151 on the substrate 10, and does not overlap with the orthographic projections of the first line segment 1511 and the third line segment 1513 of the first fan-out line 151 on the substrate 10; meanwhile, the virtual pad 11 can be located between the third line segment 1523 of the second fan-out line 152 and the first line segment 1531 of the third fan-out line 153, and between the second line segment 1521 of the second fan-out line 152 and the second line segment 1532 of the third fan-out line 153; wherein, the included angle between the extension direction of the first line segment 1521 of the second fan-out line 152 and the extension direction of the second line segment 1522 of the second fan-out line 152, the included angle between the extension direction of the second line segment 1522 of the second fan-out line 152 and the extension direction of the third line segment 1523 of the second fan-out line 152, the included angle between the extension direction of the first line segment 1531 of the third fan-out line 153 and the extension direction of the second line segment 1532 of the third fan-out line 153, and the included angle between the extension direction of the second line segment 1532 of the third fan-out line 153 and the extension direction of the third line segment 1533 of the third fan-out line 153 are all greater than 0°.

[0081] In this way, the third line segment 1523 of the second fan-out line 152, the second line segment 1522 of the second fan-out line 152, the first line segment 1531 of the third fan-out line 153, and the second line segment 1513 of the third fan-out line 153 will form corresponding accommodation spaces for setting the virtual pad 11, which can prevent the need to increase the distance between the first fan-out line 151 and other fan-out lines due to the setting of the virtual pad 11, and increase the size of the fan-out region 122 in the second direction Y. Thus, on the premise that the virtual pad 11 can support the blank area of the driving chip, it is beneficial to reduce the size of the fan-out region 122 in the second direction Y and further reduce the border size of the display panel.

[0082] Optionally, continue to refer to Figure 16, the included angle between the extending directions of the first line segment 1511 and the second line segment 1512 of the same first fan-out line 151, and the included angle between the extending directions of the second line segment 1512 and the third line segment 1513 of the same first fan-out line 151 are both the second included angle α; wherein, 0° ≤ α ≤ 5°; the included angle between the extending directions of the first line segment 1531 and the third line segment 1533 of the same third fan-out line 153, and the included angle between the extending directions of the first line segment 1521 and the third line segment 1523 of the same second fan-out line 152 are both the third included angle β; wherein, 0° ≤ β ≤ 5°.

[0083] In this way, setting the value ranges of the second included angle α and the third included angle β within relatively small ranges is beneficial to the wiring design of the fan-out lines, preventing the fan-out lines from overlapping with each other after the first fan-out line, the second fan-out line, and the third fan-out line are bent to form a space for accommodating the virtual pad, which affects the transmission of the corresponding signals on the fan-out lines. Thus, the accuracy of the signals transmitted by each fan-out line can be ensured, and further, it is beneficial to improve the display effect of the display panel.

[0084] Optionally, Figure 17 is a partially enlarged structural schematic diagram of another display panel provided by an embodiment of the present invention. Figure 17 Same as Figure 16 can be referred to the above description of Figure 16 and will not be elaborated here. Only the differences between Figure 17 and Figure 16 will be exemplarily described. As shown in combination with Figure 14 and Figure 17 , each first fan-out line 151 further includes a fourth line segment 1514 and a fifth line segment 1515; the fourth line segment 1514 of the first fan-out line 151 is used to connect the first line segment 1511 and the second line segment 1512 of the first fan-out line 151; the fifth line segment 1515 of the first fan-out line 151 is used to connect the second line segment 1512 and the third line segment 1513 of the first fan-out line 151; wherein, the extending direction of the fourth line segment 1514 of the first fan-out line 151 is the same as the extending direction of the second line segment 1522 of the second fan-out line 152; the extending direction of the fifth line segment 1515 of the first fan-out line 151 is the same as the extending direction of the second line segment 1532 of the third fan-out line 153. In this way, after the first fan-out line 151 is bent multiple times, a space for setting the virtual pad 11 can be avoided, preventing the setting of the virtual pad 11 from increasing the size of the fan-out area 122 in the second direction Y. Thus, on the premise that the virtual pad 11 can support the blank area of the driving chip, it is beneficial to improve the screen-to-body ratio of the display panel.

[0085] The above is the case where the orthographic projection of the virtual pad on the substrate overlaps with the orthographic projection of the fan-out line on the substrate; hereinafter, in conjunction with the accompanying drawings, an exemplary description will be given of the case where the orthographic projection of the virtual pad on the substrate does not overlap with the orthographic projection of the fan-out line on the substrate.

[0086] Optionally, Figure 18 is a partial top view structural schematic diagram of another display panel provided by an embodiment of the present invention, Figure 19 is a schematic diagram of the film layer structure of a display panel along the Figure 18 D-D' cross-section in Figure 18 and Figure 19 As shown, the orthographic projection of the virtual pad 11 on the substrate 10 is located between the orthographic projections of two adjacent fan-out lines 15 on the substrate 10; wherein, the thickness T1 of the display panel at the position where the virtual pad 11 is located is greater than the thickness of the display panel at the position where the fan-out line 15 of the fan-out area 122 is located.

[0087] Specifically, the thickness of the display panel at the position where the fan-out line 15 of the fan-out area 122 is located is the thickness T4 of the display panel at the position where the fan-out line 15 extending to the bonding area 121 is located. When the thickness T1 of the display panel at the position where the virtual pad 11 is located is greater than the thickness T4 of the display panel at the position where the fan-out line 15 of the fan-out area 122 is located, the virtual pad 11 can play a certain supporting role for the blank area of the driving chip to improve the production qualification rate of the display panel; at the same time, when the driving chip is bonded to the bonding area 121, it can prevent the driving chip from contacting the fan-out line 15 extending to the bonding area 121 and interfering with the signal lines transmitted by the fan-out line 15, thereby improving the accuracy of the signals transmitted by the fan-out line 15 and further improving the display effect of the display panel.

[0088] Correspondingly, since the orthographic projection of the virtual pad 11 on the substrate is located between two adjacent fan-out lines 15, the virtual pad 11 will affect the setting manner of the fan-out lines 15 on both sides of the virtual pad 11. That is, the fan-out lines 15 on both sides of the virtual pad 11 need to set aside a certain space to set the virtual pad 11. At this time, when the size of the virtual pad 11 is fixed, the space to be set aside by the fan-out lines 15 is fixed, that is, the increase in the area S of the fan-out region 122 is fixed. By setting the size of the first projection 1101 of the virtual pad 11 in the first direction X to be greater than the size of the second projection 1102 of the virtual pad 11 in the second direction Y, it is possible to make the increase in the size of the fan-out region 122 in the first direction X greater than the increase in its size in the second direction Y. In this way, the larger the size x of the fan-out region 122 in the first direction X, the smaller the size y of the fan-out region 122 in the second direction Y. Thus, on the premise that the virtual pad 11 has a certain supporting effect on the corner region of the driving chip, the increase in the fan-out region 122 in the second direction Y can be minimized as much as possible. Therefore, after the virtual pad 11 is set, the size of the lower border of the display panel in the second direction Y is not increased as much as possible, which is beneficial to the narrow border of the display panel and beneficial to improving the screen-to-body ratio of the display panel.

[0089] Exemplarily, the display panel 100 may include a first metal layer 30 and a second metal layer 40 which are sequentially and spaced apart on one side of the substrate 10. That is, the first metal layer 30 is located between the second metal layer 40 and the substrate 10, and a corresponding insulating layer is provided between the first metal layer 30 and the second metal layer 40 to insulate the first metal layer 30 and the second metal layer 40 from each other. At this time, the virtual pad 11 may include a first virtual pad structure 1101 located on the first metal layer 30 and a second virtual pad structure 1102 located on the second metal layer 40. Correspondingly, the fan-out lines 15 may be located on the first metal layer 30 and / or the second metal layer 40. In an embodiment of the present invention, optionally, any two adjacent fan-out lines 15 may be respectively located on the first metal layer 30 and the second metal layer 40 to prevent signal crosstalk from occurring when all the fan-out lines 15 are located in the same film layer and the fan-out lines 15 in the fan-out region 122 are arranged densely, thereby further ensuring the accuracy of signal transmission and further improving the display effect of the display panel 100.

[0090] In addition, the dummy pad 11 may further include a transparent conductive layer 50 on the side of the second metal layer 40 away from the substrate 10 to form a third dummy pad structure 1103. An insulating layer is also provided between the transparent conductive layer 50 and the second metal layer 40. The material of the transparent conductive layer 50 may include indium tin oxide, etc. The transparent conductive layer 50 has a higher film hardness than the insulating layer. Setting the transparent conductive layer on the outermost surface of the dummy pad 11 (the surface away from the substrate) can not only resist scratches but also improve the support strength of the dummy pad 11, so as to provide a sufficient support force and protection when bonding the driving chip.

[0091] Optionally, Figure 20 is a partial enlarged structural schematic diagram of another display panel provided by an embodiment of the present invention. Combining Figure 18 and Figure 20 As described above, when the orthographic projection of the dummy pad 11 on the substrate 10 is located between the orthographic projections of two adjacent fan-out lines 15 on the substrate 10, at least a part of the fan-out line 15 includes a first line segment (1541, 1551), a second line segment (1542, 1552), and a third line segment (1543, 1553) connected in sequence in the direction from the fan-out area 122 to the bonding area 121; at this time, the fan-out line 15 may include a fourth fan-out line 154 and a fifth fan-out line 155, and the orthographic projection of the dummy pad 11 on the substrate 10 is located between the orthographic projection of the first line segment 1541 of the fourth fan-out line 154 on the substrate 10 and the orthographic projection of the third line segment 1553 of the fifth fan-out line 155 on the substrate 10; the orthographic projection of the dummy pad 11 on the substrate 10 is also located between the orthographic projection of the second line segment 1542 of the fourth fan-out line 154 on the substrate 10 and the orthographic projection of the second line segment 1552 of the fifth fan-out line 155 on the substrate 10; wherein, the included angle between the extension direction of the first line segment (1541 or 1551) and the extension direction of the second line segment (1542 or 1552) of the same fan-out line 15, and the included angle between the extension direction of the second line segment (1542 or 1552) and the extension direction of the third line segment (1543 or 1553) of the same fan-out line 15 are both greater than 0°.

[0092] Thus, the third segment 1543 of the fourth fan-out line 154, the second segment 1542 of the fourth fan-out line 154, the first segment 1551 of the fifth fan-out line 155, and the second segment 1553 of the fifth fan-out line 155 will form corresponding accommodating spaces for arranging the dummy pad 11, which can prevent the need to increase the distance between two adjacent fan-out lines due to the arrangement of the dummy pad 11, and increase the size of the fan-out area 122 in the second direction Y. Thus, on the premise that the dummy pad 11 can support the blank area of the driving chip, it is beneficial to reduce the size of the fan-out area 122 in the second direction Y, and further reduce the frame size of the display panel.

[0093] It should be noted that Figure 20 are only exemplary drawings of the embodiments of the present invention. Figure 20 In the drawings, the extension direction of the long side of the dummy pad 11 is consistent with the first direction X; while in the embodiments of the present invention, when the orthographic projection of the dummy pad in the first direction is greater than the orthographic projection of the dummy pad in the second direction, the present invention does not specifically limit the extension direction of the long side of the dummy pad. Wherein, the long side of the dummy pad is defined as: the longest side among the sides of the dummy pad, or when the dummy pad is oval, the long axis of the dummy pad can be used as the long side of the dummy pad.

[0094] Optionally, Figure 21 is a partially enlarged structural schematic diagram of another display panel provided by the embodiments of the present invention. Combining Figure 18 and Figure 21 as shown, the included angle between the extension direction of the long side of the dummy pad 11 and the extension direction of the third segment 1543 of the fourth fan-out line 154, and the included angle between the extension direction of the long side of the dummy pad 11 and the extension direction of the first segment 1551 of the fifth fan-out line 155 are the fourth included angle γ; wherein, 0°≤γ≤10°.

[0095] Thus, the fourth included angle γ has a relatively small value range, and the extension direction of the long side of the dummy pad 11 can be consistent with the extension directions of the third segment 1543 of the fourth fan-out line 154 and the first segment 1551 of the fifth fan-out line 155, so as to minimize the distance between the adjacent fourth fan-out line 154 and the fifth fan-out line 155 as much as possible, which is beneficial to reducing the size of the fan-out area 122, and further beneficial to the narrow frame of the display panel; at the same time, when the extension direction of the long side of the dummy pad 11 is consistent with the extension directions of the third segment 1543 of the fourth fan-out line 154 and the first segment 1551 of the fifth fan-out line 155, it is beneficial to simplify the design of the fan-out line 15, thereby simplifying the process of the display panel and reducing the manufacturing cost of the display panel.

[0096] Optionally, Figure 22It is a schematic diagram of a partial enlargement of another display panel provided by an embodiment of the present invention. Combining Figure 18 and Figure 22 As shown, the virtual pad group may include at least one row of virtual pads, and each row of virtual pads includes at least one virtual pad 11; there are n fan-out lines 15 spaced between two adjacent virtual pads 11 in the same row; the distance between the second segment 1542 of the fourth fan-out line and the second segment 1552 of the fifth fan-out line, which are adjacent and on opposite sides of the virtual pad 11, is a first distance d1; the distance between two adjacent signal lines 14 is a second distance d2; wherein, d2 ≤ d1 ≤ n*d2, and n is a positive integer.

[0097] Exemplarily, when there are 2 fan-out lines 15 spaced between two adjacent virtual pads 11 in the same row, the value range of the distance d1 between the second segment 1542 of the adjacent fourth fan-out line and the second segment 1552 of the fifth fan-out line can be d2 ≤ d1 ≤ 2*d2. In this way, on the premise of having enough space to place the virtual pads 11, the size of the bonding area 121 in the first direction X will not be increased, so as to ensure that the driving chip can be bonded to the bonding area 121, and the size of the driving chip in the first direction X will not be increased, which is beneficial to reducing the cost of the display panel and increasing the screen-to-body ratio of the display panel.

[0098] It should be noted that there may be n fan-out lines spaced between two adjacent virtual pads in the same row, that is, there may be 1, 2 or more fan-out lines spaced between two adjacent virtual pads in a row. The embodiments of the present invention do not make specific limitations on this as long as it can support the blank area of the driving chip with virtual pads and does not increase the border size of the display panel.

[0099] In addition, in the embodiments of the present invention, each virtual pad group may include at least one row of virtual pads, that is, each virtual pad group may include one row of virtual pads, two rows of virtual pads or multiple rows of virtual pads, and the number of virtual pads included in each row of virtual pads may be the same or different. The embodiments of the present invention do not make specific limitations on this.

[0100] Optionally, Figure 23 It is a schematic diagram of a partial top view of a display panel provided by an embodiment of the present invention. Figure 23 As shown, the virtual pad group located in the bonding area 121 may include multiple rows of virtual pads; and along the direction from the display area 110 to the bonding area 121, the number of virtual pads 11 in each row of virtual pads gradually decreases.

[0101] Among them, since the blank area of the driving chip is located in the angular area between two adjacent sides of the driving chip, the blank area of the driving chip can be a triangular area; and the virtual pad group setting area corresponding to the blank area of the driving chip can also be a triangular area; at this time, when the number of virtual pads 11 in each row of virtual pads gradually decreases along the direction from the display area 110 to the bonding area 121, the space of the triangular area can be fully utilized, so that enough virtual pads can be set. When the driving chip is bonded to the bonding area 121 of the display panel, the virtual pads of the virtual pad group can provide a sufficient supporting effect on the blank area of the driving chip, thereby improving the production yield of the display panel and reducing the manufacturing cost of the display panel.

[0102] An embodiment of the present invention further provides a display device. The display device includes the display panel provided by the embodiment of the present invention. Therefore, the display device provided by the embodiment of the present invention includes the technical features of the display panel provided by the embodiment of the present invention, and has the beneficial effects of the display panel provided by the embodiment of the present invention. The same parts can refer to the description of the display panel provided by the embodiment of the present invention above, and will not be repeated here.

[0103] Exemplarily, Figure 24 is a schematic structural diagram of a display device provided by an embodiment of the present invention. As shown in FIG. 24, the display device includes the display panel provided by the embodiment of the present invention. The display panel includes, but is not limited to, a liquid crystal display panel, an OLED display panel, etc. The display device includes, but is not limited to, a mobile phone, a tablet computer, a television, a digital camera, etc.

[0104] Note that the above is only the preferred embodiment of the present invention and the applied technical principle. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here. Various obvious changes, re-adjustments, combinations with each other, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, Comprising: A substrate; The substrate includes a display area and a non-display area surrounding the display area. The display area includes a plurality of signal lines arranged along a first direction and extending along a second direction, wherein the first direction and the second direction are perpendicular; the substrate is a glass substrate; The non-display area includes a bonding area for arranging a driving chip. The driving chip includes a blank area located in an angular area between two adjacent sides of the driving chip; The bonding area is provided with a virtual pad group, and the virtual pad group includes at least one virtual pad; the virtual pad and the blank area have an overlap in the orthographic projection on the display panel, and the side of the virtual pad facing the driving chip is a convex structure; Wherein, the orthographic projection of the virtual pad in the first direction is a first projection, and the orthographic projection of the virtual pad in the second direction is a second projection; the size of the first projection is larger than the size of the second projection; The bonding area further includes an output pad area and an input pad area; the output pad area is provided with a plurality of output pads; the input pad area is provided with a plurality of input pads; The output pad area includes a first area, a second area, and a third area arranged in sequence along the first direction; The output pads include a first pad and a second pad. The first pad is located in the second area, and the second pad is located in the first area and / or the third area. A plurality of the second pads are arranged obliquely from one side of the second area away from the display area; The thickness of the display panel at the position where the virtual pad is located is greater than the thickness of the display panel at the position where the input pad is located; and / or, the thickness of the display panel at the position where the virtual pad is located is greater than the thickness of the display panel at the position where the output pad is located.

2. A display panel, characterized in that, Comprising: A substrate; The substrate includes a display area and a non-display area surrounding the display area. The display area includes a plurality of signal lines arranged along a first direction and extending along a second direction, wherein the first direction and the second direction are perpendicular; the substrate is a glass substrate; The non-display area includes a bonding area for arranging a driving chip. The driving chip includes a blank area located in an angular area between two adjacent sides of the driving chip; The bonding area is provided with a virtual pad group, and the virtual pad group includes at least one virtual pad; the virtual pad and the blank area have an overlap in the orthographic projection on the display panel, and the side of the virtual pad facing the driving chip is a convex structure; Wherein, the orthographic projection of the virtual pad in the first direction is a first projection, and the orthographic projection of the virtual pad in the second direction is a second projection; the size of the first projection is larger than the size of the second projection; The bonding area further includes an output pad area and an input pad area; the output pad area is provided with a plurality of output pads; the input pad area is provided with a plurality of input pads; The output pad area includes a first area, a second area, and a third area arranged in sequence along the first direction; The output pad includes a first pad and a second pad. The first pad is located in the second region, and the second pad is located in the first region and / or the third region. A plurality of the second pads are arranged obliquely from one side of the second region away from the display region; The non-display region further includes a fan-out region; the fan-out region is located between the bonding region and the display region; the fan-out region is provided with a plurality of fan-out lines, one end of the fan-out line is electrically connected to the signal line, the other end of the fan-out line extends into the bonding region and is electrically connected to the output pad, and at least a part of the fan-out line extends into the orthographic projection of the blank region on the display panel; The orthographic projection of the dummy pad on the substrate has an overlap with the orthographic projection of at least one of the fan-out lines on the substrate; wherein, the thickness of the display panel at the position where the dummy pad is located is greater than the thickness of the display panel at the position where the fan-out lines of the fan-out region are located.

3. A display panel, characterized in that, Comprising: A substrate; The substrate includes a display region and a non-display region surrounding the display region. The display region includes a plurality of signal lines arranged along a first direction and extending along a second direction, wherein the first direction and the second direction are perpendicular; The non-display region includes a bonding region for arranging a driving chip. The driving chip includes a blank region located in an angular region between two adjacent sides of the driving chip; The bonding region is provided with a dummy pad group, and the dummy pad group includes at least one dummy pad; the dummy pad has an overlap with the orthographic projection of the blank region on the display panel, and one side of the dummy pad facing the driving chip is a convex structure; Wherein, the orthographic projection of the dummy pad in the first direction is a first projection, and the orthographic projection of the dummy pad in the second direction is a second projection; the size of the first projection is greater than the size of the second projection; The bonding region further includes an output pad region and an input pad region; the output pad region is provided with a plurality of output pads; the input pad region is provided with a plurality of input pads; The output pad region includes a first region, a second region, and a third region arranged in sequence along the first direction; The output pad includes a first pad and a second pad. The first pad is located in the second region, and the second pad is located in the first region and / or the third region. A plurality of the second pads are arranged obliquely from one side of the second region away from the display region; The non-display region further includes a fan-out region; the fan-out region is located between the bonding region and the display region; the fan-out region is provided with a plurality of fan-out lines, one end of the fan-out line is electrically connected to the signal line, the other end of the fan-out line extends into the bonding region and is electrically connected to the output pad, and at least a part of the fan-out line extends into the orthographic projection of the blank region on the display panel; The orthographic projection of the virtual pad on the substrate is located between the orthographic projections of two adjacent fan-out lines on the substrate; wherein, the thickness of the display panel at the position where the virtual pad is located is greater than the thickness of the display panel at the position where the fan-out lines of the fan-out area are located. The display panel further includes a first metal layer, a second metal layer, and a transparent conductive layer that are sequentially and spaced apart on one side of the substrate; the virtual pad at least includes a first virtual pad structure located in the first metal layer, a second virtual pad structure located in the second metal layer, and a third virtual pad structure formed by the transparent conductive layer.

4. The display panel according to any one of claims 1-3, characterized in that, The driving chip includes a plurality of output terminals and a plurality of input terminals. The output terminals include a first terminal and a second terminal. The first terminal is correspondingly welded to the first pad, the second terminal is correspondingly welded to the second pad, and the input terminals are correspondingly welded to the input pads. The driving chip further includes a plurality of virtual terminals. The virtual terminals are located in the blank area, and the virtual terminals are correspondingly welded to the virtual pads.

5. The display panel according to any one of claims 1-3, characterized in that, The driving chip includes two long sides and two short sides that are oppositely arranged. The two long sides include a first side and a third side, and the two short sides include a second side and a fourth side; the blank area includes a first blank area and a second blank area; the first blank area is located in the angular area between the first side and the fourth side, and the second blank area is located in the angular area between the first side and the second side. Two virtual pad groups are provided in the bonding area; the orthographic projection of one virtual pad group on the display panel overlaps with the first blank area, and the orthographic projection of the other virtual pad group on the display panel overlaps with the second blank area, and the two virtual pad groups are symmetrically arranged along the second direction.

6. The display panel according to any one of claims 2-3, characterized in that, The thickness of the display panel at the position where the virtual pad is located is greater than or equal to the thickness of the display panel at the position where the input pad is located; and / or, the thickness of the display panel at the position where the virtual pad is located is greater than or equal to the thickness of the display panel at the position where the output pad is located.

7. The display panel according to claim 1, characterized in that, The non-display area further includes a fan-out area; the fan-out area is located between the bonding area and the display area; the fan-out area is provided with a plurality of fan-out lines. One end of the fan-out line is electrically connected to the signal line, the other end of the fan-out line extends into the bonding area and is electrically connected to the output pad, and at least part of the fan-out line extends into the orthographic projection of the blank area on the display panel.

8. The display panel according to claim 7, wherein The orthographic projection of the virtual pad on the substrate overlaps with the orthographic projection of at least one of the fan-out lines on the substrate. Wherein, the thickness of the display panel at the position where the virtual pad is located is greater than the thickness of the display panel at the position where the fan-out lines of the fan-out area are located.

9. The display panel according to claim 2 or 8, characterized in that, The part of the fan-out line whose orthographic projection on the substrate is located within the orthographic projection of the virtual pad on the substrate is the first part; the part of the fan-out line located in the fan-out area is the second part; the width of the first part is greater than the width of the second part.

10. The display panel according to claim 2 or 8, characterized in that, The part of the fan-out line whose orthographic projection on the substrate is located within the orthographic projection of the virtual pad on the substrate is the first part; The long side extension direction of the virtual pad and the extension direction of the first part of the fan-out line have a first included angle θ; where 0° ≤ θ ≤ 10°.

11. The display panel according to claim 2 or 8, characterized in that In the direction from the fan-out area to the bonding area, at least part of the fan-out line includes a first line segment, a second line segment, and a third line segment connected in sequence; The fan-out line whose orthographic projection on the substrate overlaps with the orthographic projection of the virtual pad on the substrate is the first fan-out line; the orthographic projection of the virtual pad on the substrate overlaps with the orthographic projection of the second line segment of the first fan-out line on the substrate, and does not overlap with the orthographic projections of the first line segment and the third line segment of the first fan-out line on the substrate; The fan-out line further includes a second fan-out line and a third fan-out line on both sides of the first fan-out line; the virtual pad is located between the third line segment of the second fan-out line and the first line segment of the third fan-out line, and between the second line segment of the second fan-out line and the second line segment of the third fan-out line; Wherein, the included angle between the extension direction of the first line segment and the extension direction of the second line segment of the second fan-out line, the included angle between the extension direction of the second line segment and the extension direction of the third line segment of the second fan-out line, the included angle between the extension direction of the first line segment and the extension direction of the second line segment of the third fan-out line, and the included angle between the extension direction of the second line segment and the extension direction of the third line segment of the third fan-out line are all greater than 0.

12. The display panel according to claim 11, wherein Each of the first fan-out lines further includes a fourth line segment and a fifth line segment; The fourth line segment of the first fan-out line is used to connect the first line segment and the second line segment of the first fan-out line; the fifth line segment of the first fan-out line is used to connect the second line segment and the third line segment of the first fan-out line; The extension direction of the fourth line segment of the first fan-out line is the same as the extension direction of the second line segment of the second fan-out line; the extension direction of the fifth line segment of the first fan-out line is the same as the extension direction of the second line segment of the third fan-out line.

13. The display panel according to claim 11, wherein, The included angle between the extension direction of the first line segment and the extension direction of the second line segment of the same first fan-out line, and the included angle between the extension direction of the second line segment and the extension direction of the third line segment of the same first fan-out line are both the second included angle α; where 0° ≤ α ≤ 5°; The included angle between the extension direction of the first line segment and the extension direction of the third line segment of the same three fan-out lines, and the included angle between the extension direction of the first line segment and the extension direction of the third line segment of the same second fan-out line are both the third included angle β; where 0° ≤ β ≤ 5°.

14. The display panel according to claim 7, wherein The orthographic projection of the virtual pad on the substrate is located between the orthographic projections of two adjacent fan-out lines on the substrate; Wherein, the thickness of the display panel at the position of the virtual pad is greater than the thickness of the display panel at the position of the fan-out lines in the fan-out area.

15. The display panel according to claim 3 or 14, characterized in that, In a direction from the fan-out area to the binding area, at least part of the fan-out line includes a first line segment, a second line segment and a third line segment connected in sequence; The fan-out line includes a fourth fan-out line and a fifth fan-out line; the orthographic projection of the virtual pad on the substrate substrate is located between the orthographic projection of the first line segment of the fourth fan-out line on the substrate substrate and the orthographic projection of the third line segment of the fifth fan-out line on the substrate substrate; the orthographic projection of the virtual pad on the substrate substrate is also located between the orthographic projection of the second line segment of the fourth fan-out line on the substrate substrate and the orthographic projection of the second line segment of the fifth fan-out line on the substrate substrate; The angle between the extension direction of the first line segment and the extension direction of the second line segment of the same fan-out line, and the angle between the extension direction of the second line segment and the extension direction of the third line segment of the same fan-out line are both greater than 0.

16. The display panel according to claim 15, characterized in that, The angle between the long side extension direction of the virtual pad and the extension direction of the third line segment of the fourth fan-out line, and the angle between the long side extension direction of the virtual pad and the extension direction of the first line segment of the fifth fan-out line have a fourth angle γ, wherein 0°≤γ≤10°.

17. The display panel according to claim 15, wherein, The virtual pad group includes at least one row of virtual pads, and each row of virtual pads includes at least one virtual pad; There are n fan-out lines between two adjacent virtual pads located in the same row; the spacing between the second line segment of the fourth fan-out line and the second line segment of the fifth fan-out line that are adjacent and located on two opposite sides of the virtual pads is a first spacing d1; the spacing between two adjacent signal lines is a second spacing d2; wherein d2≤d1≤n*d2, and n is a positive integer.

18. The display panel according to claim 8 or 13, wherein The display panel further includes a first metal layer and a second metal layer which are sequentially spaced apart and located on one side of the base substrate; The virtual pad at least includes a first virtual pad structure located at the first metal layer and a second virtual pad structure located at the second metal layer.

19. The display panel according to claim 18, wherein The virtual pad further includes a third virtual pad structure formed by a transparent conductive layer, and the transparent conductive layer is located on a side of the second metal layer away from the base substrate.

20. The display panel according to claim 18, characterized in that, Any two adjacent fan-out lines are located in the first metal layer and the second metal layer respectively; When the orthographic projection of the virtual pad on the substrate overlaps with the orthographic projection of at least one of the fan-out lines on the substrate, the fan-out line that overlaps with the orthographic projection of the virtual pad on the substrate is a first fan-out line; the first virtual pad structure and / or the second virtual pad structure of the virtual pad include part of the first fan-out line.

21. The display panel according to claim 3, wherein Any two adjacent fan-out lines are located in the first metal layer and the second metal layer respectively; When the orthographic projection of the virtual pad on the substrate overlaps with the orthographic projection of at least one of the fan-out lines on the substrate, the fan-out line that overlaps with the orthographic projection of the virtual pad on the substrate is a first fan-out line; the first virtual pad structure and / or the second virtual pad structure of the virtual pad include part of the first fan-out line.

22. The display panel according to any one of claims 1-3, characterized in that, The structure of the orthographic projection of the virtual pad on the substrate is one of a quadrilateral, a rounded quadrilateral, a polygon, and an ellipse.

23. The display panel according to any one of claims 1-3, characterized in that, The value range of the size a of the first projection is: 40 μm ≤ a ≤ 200 μm; the value range of the size b of the second projection is: 5 μm ≤ b ≤ 40 μm.

24. The display panel according to any one of claims 1-3, characterized in that, The virtual pad group includes multiple rows of virtual pads; Along the direction from the display area to the bonding area, the number of virtual pads in each row of virtual pads gradually decreases.

25. A display device, characterized in that, It includes the display panel according to any one of claims 1 to 24.

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